DS1649/DS3649/DS1679/DS3679 Hex TRI-STATEÉ TTL to MOS Drivers General Description The DS1649/DS3649 and DS1679/DS3679 are Hex TRI-STATE MOS drivers with outputs designed to drive large capacitive loads up to 500 pF associated with MOS memory systems. PNP input transistors are employed to reduce input currents allowing the large fan-out to these drivers needed in memory systems. The circuit has Schottkyclamped transistor logic for minimum propagation delay, and TRI-STATE outputs for bus operation. The DS1649/DS3649 has a 15X resistor in series with the outputs to dampen transients caused by the fast-switching output. The DS1679/DS3679 has a direct low impedance output for use with or without an external resistor. Features Y Y Y Y High speed capabilities # Typ 9 ns driving 50 pF # Typ 30 ns driving 500 pF TRI-STATE outputs for data bussing Built-in 15X damping resistor (DS1649/DS3649) Same pin-out as DM8096 and DM74366 TRI-STATEÉ is a registered trademark of National Semiconductor Corp. Schematic Diagram Truth Table Disable Input DIS 1 DIS 2 0 0 0 1 1 0 0 1 0 1 Input Output 0 1 X X X 1 0 Hi-Z Hi-Z Hi-Z X e Don’t care Hi-Z e TRI-STATE mode *DS1649/DS3649 only TL/F/7515 – 1 Connection Diagram Typical Application Dual-In-Line Package TL/F/7515 – 2 Top View Order Number DS1649J, DS3649J, DS1679J, DS3679J, DS3649N or DS3679N See NS Package Number J16A or N16A C1995 National Semiconductor Corporation TL/F/7515 TL/F/7515 – 3 RRD-B30M105/Printed in U. S. A. DS1649/DS3649/DS1679/DS3679 Hex TRI-STATE TTL to MOS Drivers March 1986 Absolute Maximum Ratings (Note 1) Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage Logical ‘‘1’’ Input Voltage Logical ‘‘0’’ Input Voltage Storage Temperature Range Maximum Power Dissipation* at 25§ C Cavity Package Molded Package Lead Temperature (Soldering, 10 sec.) Supply Voltage (VCC Temperature (TA) DS1649, DS1679 DS3649, DS3679 7.0V 7.0V Min 4.5 Max 5.5 Units V b 55 a 125 a 70 §C §C 0 *Derate cavity package 9.1 mW/§ C above 25§ C; derate molded package 10.2 mW/§ C above 25§ C. b 1.5V b 65§ C to a 150§ C 1371 mW 1280 mW 300§ C Electrical Characteristics (Note 2 and 3) Symbol Parameter Conditions Min Typ Max Units 0.8 V VIN(1) Logical ‘‘1’’ Input Voltage VIN(0) Logical ‘‘0’’ Input Voltage IIN(1) Logical ‘‘1’’ Input Current VCC e 5.5V, VIN e 5.5V 0.1 40 mA IIN(0) Logical ‘‘0’’ Input Current VCC e 5.5V, VIN e 0.5V b 50 b 250 mA VCLAMP Input Clamp Voltage VCC e 4.5V, IIN e b18 mA b 0.75 b 1.2 V VOH Logical ‘‘1’’ Output Voltage (No Load) VCC e 4.5V, IOH e b10 mA VOL Logical ‘‘0’’ Output Voltage (No Load) VCC e 4.5V, IOL e 10 mA DS1649/DS1679 VOH Logical ‘‘1’’ Output Voltage (With Load) VCC e 4.5V, IOH e b1.0 mA DS1649 VOL Logical ‘‘0’’ Output Voltage (With Load) 2.0 DS1649/DS1679 2.7 3.6 DS3649/DS3679 2.8 3.6 DS3649/DS3679 VCC e 4.5V, IOL e 20 mA V 2.4 V 0.25 0.4 0.25 0.35 3.5 V V V DS1679 2.5 3.5 V DS3649 2.6 3.5 V DS3679 2.7 3.5 V DS1649 0.6 1.1 V DS1679 0.4 0.5 V DS3649 0.6 1.0 V DS3679 0.4 0.5 V I1D Logical ‘‘1’’ Drive Current VCC e 4.5V, VOUT e 0V (Note 4) I0D Logical ‘‘0’’ Drive Current VCC e 4.5V, VOUT e 4.5V (Note 4) Hi-Z TRI-STATE Output Current VOUT e 0.4V to 2.4V, DIS1 or DIS2 e 2.0V ICC Power Supply Current VCC e 5.5V b 250 mA 150 b 40 mA 40 mA One DIS Input e 3.0V All Other Inputs e X 42 75 mA All Inputs e 0V 11 20 mA 2 Switching Characteristics (VCC e 5V, TA e 25§ C) (Note 4) Symbol tS g tS g tF tR Parameter Conditions (Figure 1 ) Storage Delay Negative Edge (Figure 1 ) Storage Delay Positive Edge (Figure 1 ) Fall Time (Figure 1 ) Rise Time Typ Max Units CL e 50 pF Min 4.5 7 ns CL e 500 pF 7.5 12 ns CL e 50 pF 5 8 ns CL e 500 pF 8 13 ns CL e 50 pF 5 8 ns CL e 500 pF 22 35 ns CL e 50 pF 6 9 ns CL e 500 pF 21 35 ns tZL Delay from Disable Input to Logical ‘‘0’’ Level (from High Impedance State) CL e 50 pF RL e 2 kX to VCC (Figure 2 ) 10 15 ns tZH Delay from Disable Input to Logical ‘‘1’’ Level (from High Impedance State) CL e 50 pF RL e 2 kX to GND (Figure 2 ) 8 15 ns tLZ Delay from Disable Input to High Impedance State (from Logical ‘‘0’’ Level) CL e 50 pF RL e 400X to VCC (Figure 3 ) 15 25 ns tHZ Delay from Disable Input to High Impedance State (from Logical ‘‘1’’ Level) CL e 50 pF RL e 400X to GND (Figure 3 ) 10 25 ns Note 1: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. Except for ‘‘Operating Temperature Range’’ they are not meant to imply that the devices should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device operation. Note 2: Unless otherwise specified min/max limits apply across the b 55§ C to a 125§ C temperature range for the DS1649 and DS1679 and across the 0§ C to a 70§ C range for the DS3649 and DS3679. All typical values are for TA e 25§ C and VCC e 5V. Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown as max or min on absolute value basis. Note 4: When measuring output drive current and switching response for the DS1679 and DS3679 a 15X resistor should be placed in series with each output. This resistor is internal to the DS1649/DS3649 and need not be added. AC Test Circuits and Switching Time Waveforms tS g , tS ’ , tR, tF TL/F/7515 – 5 TL/F/7515 – 4 FIGURE 1 3 AC Test Circuits and Switching Time Waveforms (Continued) tZH tZL TL/F/7515 – 6 TL/F/7515 – 7 TL/F/7515 – 8 FIGURE 2 tLZ tHZ TL/F/7515 – 9 TL/F/7515 – 10 *Internal on DS1649 and DS3649 TL/F/7515 – 11 FIGURE 3 Note 1: The pulse generator has the following characteristics: ZOUT e 50X and PRR s 1 MHz. Rise and fall times between 10% and 90% points s 5 ns. Note 2: CL includes probe and jig capacitance. 4 Physical Dimensions inches (millimeters) Ceramic Dual-In-Line Package (J) Order Number DS1649J, DS3649J, DS1679J or DS3679J NS Package Number J16A 5 DS1649/DS3649/DS1679/DS3679 Hex TRI-STATE TTL to MOS Drivers Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number DS3649N or DS3679N NS Package Number N16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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