Material Content Data Sheet Sales Product Name IDH16G65C5 MA# MA000989360 Package PG-TO220-2-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material inorganic material non noble metal non noble metal < 10% siliconcarbide gold tin iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus phosphorus iron copper 409-21-2 7440-57-5 7440-31-5 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7723-14-0 7439-89-6 7440-50-8 leadframe wire encapsulation leadfinish plating heatspreader *deviation 29. August 2013 Weight [mg] 1966.40 mg Average Mass [%] 1.094 0.06 0.083 0.00 0.021 0.00 0.753 0.04 Sum [%] Average Mass [ppm] 556 42 0.06 11 2. 3. 609 383 0.226 0.01 751.797 38.23 38.28 382321 115 382820 0.932 0.05 0.05 474 474 9.099 0.46 4627 100.086 5.09 497.395 25.29 30.84 252946 308471 14.487 0.74 0.74 7367 7367 0.198 0.01 0.000 0.00 0.177 0.01 0.590 0.03 589.466 29.98 50898 101 0.01 1 300 30.02 299768 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 101 90 Important Remarks: 1. Sum [ppm] 300158 1000000