MCP6V61/1U/2/4 80 µA, 1 MHz Zero-Drift Op Amps Features General Description • High DC Precision: - VOS Drift: ±15 nV/°C (maximum, VDD = 5.5V) - VOS: ±8 µV (maximum) - AOL: 125 dB (minimum, VDD = 5.5V) - PSRR: 117 dB (minimum, VDD = 5.5V) - CMRR: 120 dB (minimum, VDD = 5.5V) - Eni: 0.54 µVP-P (typical), f = 0.1 Hz to 10 Hz - Eni: 0.17 µVP-P (typical), f = 0.01 Hz to 1 Hz • Enhanced EMI Protection: - Electromagnetic Interference Rejection Ratio (EMIRR) at 1.8 GHz: 101 dB • Low Power and Supply Voltages: - IQ: 80 µA/amplifier (typical) - Wide Supply Voltage Range: 1.8V to 5.5V • Small Packages: - Singles in SC70, SOT-23 - Duals in MSOP-8, 2x3 TDFN - Quads in TSSOP-14 • Easy to Use: - Rail-to-Rail Input/Output - Gain Bandwidth Product: 1 MHz (typical) - Unity Gain Stable • Extended Temperature Range: -40°C to +125°C The Microchip Technology Inc. MCP6V61/1U/2/4 family of operational amplifiers provides input offset voltage correction for very low offset and offset drift. These devices have a gain bandwidth product of 1 MHz (typical). They are unity-gain stable, have virtually no 1/f noise and have good Power Supply Rejection Ratio (PSRR) and Common Mode Rejection Ratio (CMRR). These products operate with a single supply voltage as low as 1.8V, while drawing 80 µA/amplifier (typical) of quiescent current. Typical Applications • • • • • Portable Instrumentation Sensor Conditioning Temperature Measurement DC Offset Correction Medical Instrumentation The Microchip Technology Inc. MCP6V61/1U/2/4 op amps are offered in single (MCP6V61 and MCP6V61U), dual (MCP6V62) and quad (MCP6V64) packages. They were designed using an advanced CMOS process. Package Types MCP6V61 SOT-23 VOUT 1 VSS 2 VIN+ 3 5 VDD VOUTA VINA– 4 VIN– VINA+ VSS MCP6V61U SC70, SOT-23 SPICE Macro Models FilterLab® Software Microchip Advanced Part Selector (MAPS) Analog Demonstration and Evaluation Boards Application Notes Related Parts • • • • • MCP6V11/1U/2/4: Zero-Drift, Low Power MCP6V31/1U/2/4: Zero-Drift, Low Power MCP6V71/1U/2/4: Zero-Drift, 2 MHz MCP6V81/1U: Zero-Drift, 5 MHz MCP6V91/1U: Zero-Drift, 10 MHz 2014-2015 Microchip Technology Inc. 1 2 3 4 8 7 6 5 VDD VOUTB VINB– VINB+ MCP6V62 2×3 TDFN * 8 VDD VOUTA 1 VIN+ 1 5 VDD VSS 2 VIN– 3 VINA– 2 4 VOUT VINA+ 3 VSS 4 Design Aids • • • • • MCP6V62 MSOP EP 9 7 VOUTB 6 VINB– 5 VINB+ MCP6V64 TSSOP 1 2 3 4 VINB+ 5 VINB– 6 VOUTB 7 VOUTA VINA– VINA+ VDD 14 VOUTD 13 VIND– 12 VIND+ 11 VSS 10 VINC+ 9 VINC– 8 VOUTC * Includes Exposed Thermal Pad (EP); see Table 3-1. DS20005367B-page 1 MCP6V61/1U/2/4 Figures 1 and 2 show input offset voltage versus ambient temperature for different power supply voltages. Typical Application Circuit R1 R3 R2 R4 C2 + R2 VDD/2 + R5 U2 VOUT - U1 MCP6XXX VDD/2 MCP6V61 Offset Voltage Correction for Power Driver 8 Input Offset Voltage (µV) VIN 28 Samples VDD = 1.8V 6 4 2 0 -2 -4 -6 -8 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 1: Input Offset Voltage vs. Ambient Temperature with VDD = 1.8V. Input Offset Voltage (µV) 8 28 Samples VDD = 5.5V 6 4 2 0 -2 -4 -6 -8 -50 -25 0 25 50 75 Temperature (°C) 100 125 FIGURE 2: Input Offset Voltage vs. Ambient Temperature with VDD = 5.5V. As seen in Figures 1 and 2, the MCP6V61/1U/2/4 op amps have excellent performance across temperature. The input offset voltage temperature drift (TC1) shown is well within the specified maximum values of 15 nV/°C at VDD = 5.5V and 30 nV/°C at VDD = 1.8V. This performance supports applications with stringent DC precision requirements. In many cases, it will not be necessary to correct for temperature effects (i.e., calibrate) in a design. In the other cases, the correction will be small. DS20005367B-page 2 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † VDD – VSS .................................................................................................................................................................6.5V Current at Input Pins ..............................................................................................................................................±2 mA Analog Inputs (VIN+ and VIN-) (Note 1).....................................................................................VSS – 1.0V to VDD + 1.0V All Other Inputs and Outputs ....................................................................................................VSS – 0.3V to VDD + 0.3V Difference Input Voltage .................................................................................................................................|VDD – VSS| Output Short Circuit Current ........................................................................................................................... Continuous Current at Output and Supply Pins ...................................................................................................................... ±30 mA Storage Temperature .............................................................................................................................-65°C to +150°C Maximum Junction Temperature .......................................................................................................................... +150°C ESD protection on all pins (HBM, CDM, MM) MCP6V61/1U 4 kV, 1.5 kV, 400V MCP6V62/4 4 kV, 1.5 kV, 300V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: See Section 4.2.1 “Rail-to-Rail Inputs”. 1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figures 1-4 and 1-5). Parameters Sym. Min. Typ. Max. Units Conditions Input Offset Input Offset Voltage VOS -8 — +8 µV Input Offset Voltage Drift with Temperature (Linear Temp. Co.) TC1 -30 — +30 nV/°C TA = -40 to +125°C, VDD = 1.8V (Note 1) TC1 -15 — +15 nV/°C TA = -40 to +125°C, VDD = 5.5V (Note 1) TC2 — -30 — pV/°C2 TA = -40 to +125°C VDD = 1.8V TC2 — -6 — pV/°C2 TA = -40 to +125°C VDD = 5.5V Input Offset Voltage Aging ∆VOS — ±0.45 — µV Power Supply Rejection Ratio PSRR 117 134 — dB Input Offset Voltage Quadratic Temp. Co. Note 1: 2: 3: 4: TA = +25°C 408 hours Life Test at +150°, measured at +25°C. For design guidance only; not tested. Figure 2-19 shows how VCML and VCMH changed across temperature for the first production lot. Parts with date codes prior to September 2015 (week code 27) were screened to a +5 nA maximum limit. Parts with date codes prior to September 2015 (week code 27) were screened to ±2 nA minimum/maximum limits. 2014-2015 Microchip Technology Inc. DS20005367B-page 3 MCP6V61/1U/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figures 1-4 and 1-5). Parameters Sym. Min. Typ. Max. Units Conditions Input Bias Current IB -50 ±1 +50 pA Input Bias Current across Temperature IB — +20 — pA TA = +85°C IB 0 +0.2 +1.5 nA TA = +125°C (Note 3) Input Offset Current IOS -200 ±60 +200 pA Input Offset Current across Temperature IOS — ±50 — pA TA = +85°C IOS -800 ±50 +800 pA TA = +125°C (Note 4) Common Mode Input Impedance ZCM — 1013||8 — Ω||pF ZDIFF — 13 10 ||8 — Ω||pF Common Mode Input Voltage Range Low VCML — — VSS-0.2 V Note 2 Common Mode Input Voltage Range High VCMH VDD+0.3 — — V Note 2 Common Mode Rejection Ratio CMRR 111 128 — dB VDD = 1.8V, VCM = -0.2V to 2.1V (Note 2) CMRR 120 134 — dB VDD = 5.5V, VCM = -0.2V to 5.8V (Note 2) AOL 114 146 — dB VDD = 1.8V, VOUT = 0.3V to 1.6V AOL 125 158 — dB VDD = 5.5V, VOUT = 0.3V to 5.3V VOL VSS VSS+35 VSS+121 mV RL = 2 kΩ, G = +2, 0.5V input overdrive VOL — VSS+3.5 — mV RL = 20 kΩ, G = +2, 0.5V input overdrive VOH VDD-121 VDD–35 VDD mV RL = 2 kΩ, G = +2, 0.5V input overdrive VOH — VDD–3.5 — mV RL = 20 kΩ, G = +2, 0.5V input overdrive ISC — ±7 — mA VDD = 1.8V ISC — ±23 — mA VDD = 5.5V VDD 1.8 — 5.5 V IQ 40 80 130 µA VPOR 0.9 — 1.6 V Input Bias Current and Impedance Differential Input Impedance Common Mode Open-Loop Gain DC Open-Loop Gain (Large Signal) Output Minimum Output Voltage Swing Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current per Amplifier Power-on Reset (POR) Trip Voltage Note 1: 2: 3: 4: IO = 0 For design guidance only; not tested. Figure 2-19 shows how VCML and VCMH changed across temperature for the first production lot. Parts with date codes prior to September 2015 (week code 27) were screened to a +5 nA maximum limit. Parts with date codes prior to September 2015 (week code 27) were screened to ±2 nA minimum/maximum limits. DS20005367B-page 4 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figures 1-4 and 1-5). Parameters Sym. Min. Typ. Max. Units GBWP — 1 — MHz Conditions Amplifier AC Response Gain Bandwidth Product Slew Rate SR — 0.45 — V/µs Phase Margin PM — 60 — °C Eni — 0.17 — µVP-P f = 0.01 Hz to 1 Hz µVP-P f = 0.1 Hz to 10 Hz G = +1 Amplifier Noise Response Input Noise Voltage Eni — 0.54 — Input Noise Voltage Density eni — 26 — nV/√Hz f < 2 kHz Input Noise Current Density ini — 5 — fA/√Hz IMD — 48 — µVPK Start-Up Time tSTR — 250 — µs G = +1, 0.1% VOUT settling (Note 2) Offset Correction Settling Time tSTL — 30 — µs G = +1, VIN step of 2V, VOS within 100 µV of its final value Output Overdrive Recovery Time tODR — 60 — µs G = -10, ±0.5V input overdrive to VDD/2, VIN 50% point to VOUT 90% point (Note 3) EMIRR — 80 — dB VIN = 0.1 VPK, f = 400 MHz — 96 — VIN = 0.1 VPK, f = 900 MHz — 101 — VIN = 0.1 VPK, f = 1800 MHz — 102 — VIN = 0.1 VPK, f = 2400 MHz Amplifier Distortion (Note 1) Intermodulation Distortion (AC) VCM tone = 50 mVPK at 1 kHz, GN = 11, RTI Amplifier Step Response EMI Protection EMI Rejection Ratio Note 1: 2: 3: These parameters were characterized using the circuit in Figure 1-6. In Figures 2-40 and 2-41, there is an IMD tone at DC, a residual tone at 1 kHz and other IMD tones and clock tones. IMD is Referred to Input (RTI). High gains behave differently; see Section 4.3.3 “Offset at Power-Up”. tSTL and tODR include some uncertainty due to clock edge timing. TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +1.8V to +5.5V, VSS = GND Parameters Sym. Min. Typ. Max. Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5LD-SC70 JA — 209 — °C/W Thermal Resistance, 5LD-SOT-23 JA — 201 — °C/W Thermal Resistance, 8L-2x3 TDFN JA — 53 — °C/W Thermal Resistance, 8L-MSOP JA — 211 — °C/W Thermal Resistance, 14L-TSSOP JA — 100 — °C/W Conditions Temperature Ranges Note 1 Thermal Package Resistances Note 1: Operation must not cause TJ to exceed the Maximum Junction Temperature specification (+150°C). 2014-2015 Microchip Technology Inc. DS20005367B-page 5 MCP6V61/1U/2/4 1.3 Timing Diagrams 1.4 1.8V to 5.5V 1.8V VDD 0V tSTR 1.001(VDD/3) VOUT Test Circuits The circuits used for most DC and AC tests are shown in Figures 1-4 and 1-5. Lay the bypass capacitors out as discussed in Section 4.3.10 “Supply Bypassing and Filtering”. RN is equal to the parallel combination of RF and RG to minimize bias current effects. 0.999(VDD/3) FIGURE 1-1: Amplifier Start-Up. VDD VIN VIN VOS + 100 µV FIGURE 1-2: Time. 100 nF RG RL VL RF FIGURE 1-4: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. VDD VDD/3 RN MCP6V6X tODR RISO 100 nF RG tODR VDD/2 VSS Output Overdrive Recovery. 1 µF + VIN VDD FIGURE 1-3: CL VOUT Offset Correction Settling VIN VOUT - VDD/3 VOS VOS – 100 µV RISO + MCP6V6X tSTL 1 µF RN CL VOUT RL VL RF FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. The circuit in Figure 1-6 tests the input’s dynamic behavior (i.e., IMD, tSTR, tSTL and tODR). The potentiometer balances the resistor network (VOUT should equal VREF at DC). The op amp’s Common Mode Input Voltage is VCM = VIN/2. The error at the input (VERR) appears at VOUT with a noise gain of 10 V/V. 11.0 kΩ 100 kΩ 500Ω 0.1% 0.1% 25 turn VREF = VDD/3 VDD 1 µF VIN 100 nF MCP6V6X 11.0 kΩ 100 kΩ 249Ω 1% 0.1% 0.1% FIGURE 1-6: Input Behavior. DS20005367B-page 6 RISO 0Ω VOUT RL open CL 30 pF VL Test Circuit for Dynamic 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 2.0 TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. DC Input Precision 8 FIGURE 2-1: Input Offset Voltage. Input Offset Voltage (µV) VDD = 5.5V VDD = 1.8V 20% 10% Representative Part VCM = VCMH 6 TA = -40°C TA = +25°C TA = +85°C TA = +125°C 4 2 0 -2 -4 -6 FIGURE 2-2: Input Offset Voltage Drift. 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 0.0 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 Input Offset Voltage Drift; TC1 (nV/°C) 2.0 -8 0% 1.5 Percentage of Occurrences 6.5 8 30% Power Supply Voltage (V) FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. 8 28 Samples TA = -40°C to +125°C Input Offset Voltage (µV) Percentage of Occurrences 2.5 FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. 28 Samples TA = -40°C to +125°C 40% 40% 2.0 Power Supply Voltage (V) 60% 45% 1.5 0.0 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 Input Offset Voltage (µV) 1.0 -8 0% 50% TA = -40°C TA = +25°C TA = +85°C TA = +125°C -6 6.0 5% -4 5.5 10% -2 5.0 15% 4.5 20% 0 4.0 25% 2 3.5 VDD = 1.8V 4 3.0 VDD = 5.5V 35% 30% Representative Part VCM = VCML 6 0.5 40% 28 Samples TA = 25ºC 1.0 45% Input Offset Voltage (µV) Percentage of Occurences 50% 0.5 2.1 35% 30% VDD = 5.5V 25% 20% VDD = 1.8V 15% 10% 5% Representative Part VDD = 1.8V 6 4 2 0 -2 TA = - 40°C TA = +25°C TA = +85°C TA = +125°C -4 -6 0% -80 -60 -40 -20 0 20 40 60 Input Offset Voltage Quadratric Temp Co; TC2 (pV/°C2) FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co. 2014-2015 Microchip Technology Inc. 80 -8 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Output Voltage (V) 1.4 1.6 1.8 FIGURE 2-6: Input Offset Voltage vs. Output Voltage with VDD = 1.8V. DS20005367B-page 7 MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 90% Representative Part VDD = 5.5V 6 4 Percentage of Occurrences Input Offset Voltage (µV) 8 TA = - 40°C TA = +25°C TA = +85°C TA = +125°C 2 0 -2 -4 -6 80% 70% 60% 40% 30% VDD = 1.8V 20% 10% -1.6 -1.2 -0.8 -0.4 0 0.4 1/CMRR (µV/V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-7: Input Offset Voltage vs. Output Voltage with VDD = 5.5V. FIGURE 2-10: Ratio. 0.8 1.2 1.6 Common Mode Rejection 80% Percentage of Occurrences 8 Input Offset Voltage (µV) VDD = 5.5V 50% 0% -8 6 4 TA = +125°C TA = +85°C TA = +25°C TA = - 40°C 2 0 -2 -4 Representative Part VDD = 1.8V -6 70% 60% 0.0 0.5 1.0 1.5 2.0 Common Mode Input Voltage (V) 50% 40% 30% 20% 10% -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1/PSRR (µV/V) 2.5 FIGURE 2-11: Ratio. FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 1.8V. 8 Percentage of Occurrences 70% 6 4 TA = +125°C TA = +85°C TA = +25°C TA = - 40°C 2 0 -2 -4 -6 Representative Part VDD = 5.5V DS20005367B-page 8 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Common Mode Input Voltage (V) FIGURE 2-9: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. 60% 50% 1 Power Supply Rejection Tester Data 617 Samples TA = +25°C VDD = 5.5V 40% 30% 20% 10% VDD = 1.8V 0% -8 -0.5 Tester Data 617 Samples TA = +25ºC 0% -8 -0.5 Input Offset Voltage (µV) Tester Data 617 Samples TA = +25°C -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 1/AOL (µV/V) FIGURE 2-12: DC Open-Loop Gain. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 170 Input Bias, Offset Currents (A) 6.0 5.5 5.0 1p FIGURE 2-14: DC Open-Loop Gain vs. Ambient Temperature. 125 125 115 100 105 0 25 50 75 Ambient Temperature (°C) 95 0.1p 110 85 120 Input Bias Current 75 VDD=1.8V 130 Input Offset Current 10p 65 140 100p 55 150 VDD = 5.5 V 25 DC Open-Loop Gain (dB) 160 Ambient Temperature (°C) FIGURE 2-17: Input Bias and Offset Currents vs. Ambient Temperature with VDD = 5.5V. 10000 1m 500 400 300 200 100 0 -100 -200 -300 -400 -500 Input Current Magnitude (A) VDD = 5.5 V TA = +85 ºC Input Offset Current 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Input Bias Current -0.5 Input Bias and Offset Currents (pA) 4.5 1n VDD= 5.5V -25 4.0 Input Common Mode Voltage (V) FIGURE 2-16: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C. FIGURE 2-13: CMRR and PSRR vs. Ambient Temperature. -50 3.5 125 3.0 0 25 50 75 100 Ambient Temperature (°C) 45 -25 35 -50 2.5 110 2.0 CMRR @ VDD = 5.5V @ VDD = 1.8V 1.5 PSRR 120 Input Offset Current 1.0 130 Input Bias Current 0.5 140 VDD = 5.5 V TA = +125 ºC 0.0 150 500 400 300 200 100 0 -100 -200 -300 -400 -500 -0.5 Input Bias and Offset Currents (pA) CMRR, PSRR (dB) 160 Input Common Mode Voltage (V) FIGURE 2-15: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. 2014-2015 Microchip Technology Inc. 1000 100µ 100 10µ 10 1µ 1 100n 0.1 10n 0.01 1n TA = +125°C TA = +85°C TA = +25°C TA = -40°C 0.001 100p -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Voltage (V) FIGURE 2-18: Input Bias Current vs. Input Voltage (Below VSS). DS20005367B-page 9 MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Other DC Voltages and Currents 40 Input Common Mode Voltage Headroom (V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 1 Wafer Lot Output Short Circuit Current (mA) 2.2 Upper (VCMH – VDD) Lower (VCML – VSS) -50 -25 0 25 50 75 100 Ambient Temperature (°C) 0 Representative Part -10 TA = +125°C TA = +85°C TA = +25°C TA = -40°C -20 -30 -40 FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. 120 Representative Part 100 VDD = 1.8V Quiescent Current (µA/Amplifier) Output Voltage Headroom (mV) 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 Power Supply Voltage (V) 1000 VDD – VOH 100 VDD = 5.5V 10 VOL – VSS 80 60 TA = +125°C TA = +85°C TA = +25°C TA = -40°C 40 20 1 0 0.1 1 Output Current Magnitude (mA) 10 FIGURE 2-20: Output Voltage Headroom vs. Output Current. VDD – VOH 70 50 FIGURE 2-23: Supply Voltage. Percentage of Occurrences RL = 2 kΩ 80 60 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 Power Supply Voltage (V) Supply Current vs. Power 100% 90 Output Headroom (mV) 20 125 FIGURE 2-19: Input Common Mode Voltage Headroom (Range) vs. Ambient Temperature. TA = +125°C TA = +85°C TA = +25°C TA = -40°C 30 VDD = 5.5V VOL – VSS 40 30 20 VDD = 1.8V 10 VDD – VOH 0 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 2-21: Output Voltage Headroom vs. Ambient Temperature. DS20005367B-page 10 615 Samples 1 Wafer Lot TA = +25°C 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.9 1.0 FIGURE 2-24: Voltage. 1.1 1.2 1.3 1.4 POR Trip Voltage (V) 1.5 1.6 Power-On Reset Trip 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. POR Trip Voltage (V) 1.6 1.5 1.4 1.3 1.2 1.1 1 615 Samples 1 Wafer Lot 0.9 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 2-25: Power-On Reset Voltage vs. Ambient Temperature. 2014-2015 Microchip Technology Inc. DS20005367B-page 11 MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Frequency Response 140 130 120 110 100 90 80 70 60 50 40 30 20 10 4.0 80 Representative Part CMRR PSRR- PSRR+ 3.5 70 PM 3.0 60 2.5 50 VDD = 5.5V 2.0 40 VDD = 1.8V GBWP 1.5 30 1.0 20 0.5 10 0.0 10 10 100 100 FIGURE 2-26: Frequency. 1000 1k Frequency (Hz) 10000 100k -25 0 25 50 75 100 Ambient Temperature (°C) 125 FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. CMRR and PSRR vs. 40 0 -50 100000 10k Phase Margin (°) Gain Bandwidth Product (MHz) CMRR, PSRR (dB) 2.3 -60 1.4 100 10 -150 Open-Loop Gain 0 -180 -10 -210 -20 VDD = 1.8V CL = 30 pF -30 1.E+04 10k -240 1.E+05 100k f (Hz) 1.E+06 1M -270 1.E+07 10M -90 20 -120 10 -150 Open-Loop Gain 0 -180 -10 -210 -20 VDD = 5.5V CL = 30 pF -30 10k 1.E+04 -240 100k 1.E+05 f (Hz) 1M 1.E+06 -270 10M 1.E+07 FIGURE 2-28: Open-Loop Gain vs. Frequency with VDD = 5.5V. DS20005367B-page 12 Open-Loop Phase (°) Open-Loop Gain (dB) Open-Loop Phase 0.8 70 GBWP 0.6 60 VDD = 5.5V VDD = 1.8V 0.4 50 0.2 40 0 30 0 1 2 3 4 5 6 Common Mode Input Voltage (V) 7 FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. -60 30 80 -1 FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 1.8V. 40 90 1 Phase Margin (°) -120 1.2 3 80 2.5 70 2 60 VDD = 5.5V 1.5 GBWP 1 50 PM 40 VDD = 1.8V 0.5 Phase Margin (°) 20 -90 Gain Bandwith Product (MHz) Open-Loop Phase Gain Bandwidth Product (MHz) 30 Open-Loop Phase (°) Open-Loop Gain (dB) PM 30 0 20 0 1 2 3 4 Output Voltage (V) 5 6 FIGURE 2-31: Gain Bandwidth Product and Phase Margin vs. Output Voltage. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 100000 100k VDD = 1.8V 1000 1k GN = 101 V/V GN = 11 V/V GN = 1 V/V 100 10 1.0E+03 1k 1.0E+04 10k 1.0E+05 100k Frequency (Hz) 1.0E+06 1.0E+07 1M Closed-Loop Output Impedance (Ω) VIN = 100 mVPK VDD = 5.5V 10 10M 10M FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 1.8V. 100000 100k EMIRR (dB) Closed-Loop Output Impedance (Ω) 10000 10k 120 110 100 90 80 70 60 50 40 30 20 10 0 FIGURE 2-35: 100 1000 100M 1G Frequency (Hz) 10000 10G EMIRR vs. Frequency. 120 VDD = 5.5V VDD = 5.5V 100 EMIRR (dB) 10000 10k 1000 1k GN = 101 V/V GN = 11 V/V GN = 1 V/V 100 10 1.0E+03 1k 1.0E+04 10k 1.0E+05 100k Frequency (Hz) 1.0E+06 1M 1.0E+07 10M EMIRR @ 2400 MHz EMIRR @ 1800 MHz EMIRR @ 900 MHz EMIRR @ 400 MHz 40 20 0 0.01 0.1 1 Input Voltage (VPK) 10 EMIRR vs. Input Voltage. 130 Channel-to-Channel Separation; RTI (dB) 10 Output Voltage Swing (VP-P) 60 FIGURE 2-36: FIGURE 2-33: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. VDD = 5.5V VDD = 1.8V 1 0.1 80 1000 1k 10000 100000 10k 100k Frequency (Hz) 1000000 1M FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency. 2014-2015 Microchip Technology Inc. 120 110 VDD = 5.5V 100 90 VDD = 1.8V 80 70 60 10k 1.E+04 100k 1.E+05 Frequency (Hz) 1M 1.E+06 FIGURE 2-37: Channel-to-Channel Separation vs. Frequency. DS20005367B-page 13 MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Input Noise and Distortion 1000 VDD 1.8V VDD==1.8V VDD 5.5V VDD == 5.5V 100 100 eni 10 10 E (0 Hz to f) ni 1 1 1.E+0 1.E+1 1.E+2 1.E+4 1 10 100 1.E+3 1k 10k 1.E+5 100k Frequency (Hz) 1.E-3 1m IMD Spectrum, RTI (VPK) Input Noise Voltage Density; eni (nV/√Hz) 1000 Integrated Input Noise Voltage; Eni (µVP-P) 2.4 G = 11 V/V VDD tone = 100 mVPK, f = 1 kHz 1.E-4 100µ 1.E-5 10µ Residual 1 kHz tone DC tone 1.E-6 1µ Δf = 2 Hz 1.E-7 100n 1.E-8 10n 1 1.E+0 FIGURE 2-38: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. VDD = 1.8V VDD = 5.5V Δf = 64 Hz 10 1.E+1 100 1k 1.E+2 1.E+3 Frequency (Hz) 10k 1.E+4 100k 1.E+5 FIGURE 2-41: Inter-Modulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). f < 2 kHz VDD = 1.8V 30 25 VDD = 5.5V 20 15 10 5 ,QSXW1RLVH9ROWDJHHQL W 9GLY Input Noise Voltage Density Q9¥+] 35 9'' 9 13%: +] 13%: +] 0 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Common Mode Input Voltage (V) IMD Spectrum, RTI (VPK) 1.E-3 1m G = 11 V/V VCM tone = 100 mVPK, f = 1 kHz VDD = 1.8V VDD = 5.5V 1.E-4 100µ 1.E-5 10µ Residual 1 kHz tone (due to resistor mismatch) DC tone 1.E-6 1µ Δf = 2 Hz 1.E-7 100n 1.E-8 10n 1 1.E+0 7LPH V FIGURE 2-42: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 1.8V. VDD = 5.5V Input Noise Voltage; eni(t) (0.2 µV/div) FIGURE 2-39: Input Noise Voltage Density vs. Input Common Mode Voltage. NPBW = 10 Hz NPBW = 1 Hz Δf = 64 Hz 10 1.E+1 100 1k 1.E+2 1.E+3 Frequency (Hz) 10k 1.E+4 100k 1.E+5 FIGURE 2-40: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). DS20005367B-page 14 0 10 20 30 40 50 60 Time (s) 70 80 90 100 FIGURE 2-43: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Time Response 80 60 TPCB 30 40 25 20 0 20 VDD = 1.8V 15 10 -20 -40 VDD = 5.5V 5 -60 VOS 0 -80 -5 -100 0 6 20 4 15 3 VDD Bypass = 1 µF VDD = 5.5V G = 1 V/V 10 2 5 1 VOS 0 0 -5 -1 POR Trip Point -10 0 1 2 3 4 5 6 Time (ms) 8 9 4 5 Time (µs) 6 7 8 9 10 Non-Inverting Small Signal VDD = 5.5 V G = +1 V/V 4 3 2 1 0 0 10 FIGURE 2-45: Input Offset Voltage vs. Time at Power-Up. 3 5 -2 7 2 6 Output Voltage (V) 5 VDD Power Supply Voltage (V) Input Offset Voltage (mV) 30 1 FIGURE 2-47: Step Response. FIGURE 2-44: Input Offset Voltage vs. Time with Temperature Change. 25 VDD = 5.5V G = +1 V/V -120 120 110 90 Time (s) 100 80 70 60 30 20 0 10 -10 50 Temperature increased by using heat gun for 5 seconds. 40 Input Offset Voltage (µV) 35 Output Voltage (50 mV/div) 40 PCB Temperature (ºC) 2.5 5 10 15 FIGURE 2-48: Step Response. 20 25 30 Time (µs) 35 40 45 50 Non-Inverting Large Signal VDD = 5.5 V G = 1 V/V 5 VIN 4 VOUT 3 2 1 0 -1 Time (0.1 ms/div) FIGURE 2-46: The MCP6V61/1U/2/4 Family Shows No Input Phase Reversal with Overdrive. 2014-2015 Microchip Technology Inc. Output Voltage (20 mV/div) Input/Output Voltages (V) 6 VDD = 5.5 V G = -1 V/V 0 0.5 1 FIGURE 2-49: Response. 1.5 2 2.5 3 Time (µs) 3.5 4 4.5 5 Inverting Small Signal Step DS20005367B-page 15 MCP6V61/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 10m Overdrive Recovery Time (s) 6 Output Voltage (V) 5 4 3 2 1 VDD = 5.5 V G = -1 V/V 0 0 5 10 15 FIGURE 2-50: Response. 20 25 30 Time (μs) 35 40 45 50 Inverting Large Signal Step 0.5V Input Overdrive VDD = 1.8V 1m tODR, high 100µ tODR, low 10µ VDD = 5.5V 1µ 1 10 100 Inverting Gain Magnitude (V/V) 1000 FIGURE 2-53: Output Overdrive Recovery Time vs. Inverting Gain. 1.0 Falling Edge, VDD = 5.5V 0.9 Slew Rate (V/µs) 0.8 Rising Edge, VDD = 5.5V 0.7 0.6 Falling Edge, VDD = 1.8V 0.5 0.4 Rising Edge, VDD = 1.8V 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-51: Temperature. 100 125 Slew Rate vs. Ambient Input and Output Voltages (V) 6 5 GVIN 4 VDD = 5.5V G = -10 V/V 0.5V Overdrive VOUT 3 2 1 GVIN VOUT 0 -1 Time (50 µs/div) FIGURE 2-52: Output Overdrive Recovery vs. Time with G = -10 V/V. DS20005367B-page 16 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6V61 MCP6V61U SOT-23 SOT-23, SC-70 2×3 TDFN MSOP TSSOP 1 4 1 1 1 2 2 4 4 11 VSS 3 1 3 3 3 VIN+, VINA+ 4 3 2 2 2 VIN-, VINA- 5 5 8 8 4 VDD — — 5 5 5 VINB+ Non-inverting Input (Op Amp B) — — 6 6 6 VINB- Inverting Input (Op Amp B) — — 7 7 7 VOUTB Output (Op Amp B) — — — — 8 VOUTC Output (Op Amp C) 3.1 MCP6V62 MCP6V64 VOUT, VOUTA Output (Op Amp A) Negative Power Supply Non-inverting Input (Op Amp A) Inverting Input (Op Amp A) Positive Power Supply — — — — 9 VINC- Inverting Input (Op Amp C) — — — 10 VINC+ Non-inverting Input (Op Amp C) — — — — 12 VIND+ Non-inverting Input (Op Amp D) — — — — 13 VIND- Inverting Input (Op Amp D) — — — — 14 VOUTD — — 9 — — EP Analog Outputs Analog Inputs The non-inverting and inverting inputs (VIN+, VIN-, …) are high-impedance CMOS inputs with low bias currents. 3.3 Description — The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Symbol 3.4 Output (Op Amp D) Exposed Thermal Pad (EP); must be connected to VSS Exposed Thermal Pad (EP) There is an internal connection between the exposed thermal pad (EP) and the VSS pin; they must be connected to the same potential on the printed circuit board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance (θJA). Power Supply Pins The positive power supply (VDD) is 1.8V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 2014-2015 Microchip Technology Inc. DS20005367B-page 17 MCP6V61/1U/2/4 4.0 APPLICATIONS The MCP6V61/1U/2/4 family of zero-drift op amps is manufactured using Microchip’s state-of-the-art CMOS process. It is designed for precision applications with requirements for small packages and low power. Its low supply voltage and low quiescent current make the MCP6V61/1U/2/4 devices ideal for battery-powered applications. 4.1 Overview of Zero-Drift Operation Figure 4-1 shows a simplified diagram of the MCP6V61/1U/2/4 zero-drift op amps. This diagram will be used to explain how slow voltage errors are reduced in this architecture (much better VOS, VOS/TA (TC1), CMRR, PSRR, AOL and 1/f noise). VREF Output Buffer VOUT + - VIN– + - + - Main Amp. The Output Buffer drives external loads at the VOUT pin (VREF is an internal reference voltage). The Oscillator runs at fOSC1 = 200 kHz. Its output is divided by two to produce the chopping clock rate of fCHOP = 100 kHz. The internal Power-on Reset (POR) starts the part in a known good state, protecting against power supply brown-outs. The Digital Control block controls switching and POR events. 4.1.2 VIN– NC CHOPPING ACTION Figure 4-2 shows the amplifier connections for the first phase of the chopping clock, and Figure 4-3 shows the connections for the second phase. Its slow voltage errors alternate in polarity, making the average error small. VIN+ + VIN+ The Low-Pass Filter reduces high-frequency content, including harmonics of the chopping clock. + + - + - Main Amp. Low-Pass Filter Low-Pass Filter Chopper Input Switches + Aux. - Amp. + - NC + Aux. - Amp. Chopper Output Switches + - FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. Oscillator Digital Control POR FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. 4.1.1 BUILDING BLOCKS The Main Amplifier is designed for high gain and bandwidth, with a differential topology. Its main input pair (+ and - pins at the top left) is used for the higher frequency portion of the input signal. Its auxiliary input pair (+ and - pins at the bottom left) is used for the low-frequency portion of the input signal, and corrects the op amp’s input offset voltage. Both inputs are added together internally. The Auxiliary Amplifier, Chopper Input Switches and Chopper Output Switches provide a high DC gain to the input signal. DC errors are modulated to higher frequencies, while white noise is modulated to low frequency. DS20005367B-page 18 VIN+ VIN– + + - + - Main Amp. NC Low-Pass Filter + Aux. - Amp. + - FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 4.1.3 INTERMODULATION DISTORTION (IMD) These op amps will show intermodulation distortion (IMD) products when an AC signal is present. The signal and clock can be decomposed into sine wave tones (Fourier series components). These tones interact with the zero-drift circuitry’s nonlinear response to produce IMD tones at sum and difference frequencies. Each of the square wave clock’s harmonics has a series of IMD tones centered on it. See Figures 2-40 and 2-41. 4.2 4.2.1 Other Functional Blocks RAIL-TO-RAIL INPUTS The input stage of the MCP6V61/1U/2/4 op amps uses two differential CMOS input stages in parallel. One operates at low Common Mode Input Voltage (VCM, which is approximately equal to VIN+ and VIN- in normal operation) and the other at high VCM. With this topology, the input operates with VCM up to VDD + 0.3V and down to VSS – 0.2V, at +25°C (see Figure 2-19). The input offset voltage (VOS) is measured at VCM = VSS – 0.2V and VDD + 0.3V to ensure proper operation. 4.2.1.1 Phase Reversal The input devices are designed to not exhibit phase inversion when the input pins exceed the supply voltages. Figure 2-46 shows an input voltage exceeding both supplies with no phase inversion. 4.2.1.2 VDD Bond Pad VIN+ Bond Pad VSS Bond Pad FIGURE 4-4: Structures. Simplified Analog Input ESD The input ESD diodes clamp the inputs when they try to go more than one diode drop below VSS. They also clamp any voltages well above VDD; their breakdown voltage is high enough to allow normal operation but not low enough to protect against slow overvoltage (beyond VDD) events. Very fast ESD events (that meet the specification) are limited so that damage does not occur. In some applications, it may be necessary to prevent excessive voltages from reaching the op amp inputs; Figure 4-5 shows one approach to protecting these inputs. D1 and D2 may be small signal silicon diodes, Schottky diodes for lower clamping voltages or diode-connected FETs for low leakage. VDD Input Voltage Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the voltages at the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the current limits discussed later on. The ESD protection on the inputs can be depicted as shown in Figure 4-4. This structure was chosen to protect the input transistors against many (but not all) overvoltage conditions and to minimize input bias current (IB). 2014-2015 Microchip Technology Inc. Bond V – IN Pad Input Stage U1 D1 MCP6V6X V1 + D2 V2 - VOUT FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. DS20005367B-page 19 MCP6V61/1U/2/4 4.2.1.3 Input Current Limits 4.3 In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the currents into the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the voltage limits discussed previously. Figure 4-6 shows one approach to protecting these inputs. The R1 and R2 resistors limit the possible current in or out of the input pins (and into D1 and D2). The diode currents will dump onto VDD. V1 V2 R1 MCP6V6X D2 Table 1-1 gives both the linear and quadratic temperature coefficients (TC1 and TC2) of input offset voltage. The input offset voltage, at any temperature in the specified range, can be calculated as follows: EQUATION 4-1: 2 T = TA – 25°C VOS(TA) = Input offset voltage at TA VOS = Input offset voltage at +25°C TC1 = Linear temperature coefficient TC2 = Quadratic temperature coefficient VOUT - R2 VSS – min(V1, V2) 2 mA max(V1, V2) – VDD min(R1, R2) > 2 mA min(R1, R2) > FIGURE 4-6: Protecting the Analog Inputs Against High Currents. It is also possible to connect the diodes to the left of the R1 and R2 resistors. In this case, the currents through the D1 and D2 diodes need to be limited by some other mechanism. The resistors then serve as in-rush current limiters; the DC current into the input pins (VIN+ and VIN-) should be very small. A significant amount of current can flow out of the inputs (through the ESD diodes) when the Common Mode Voltage (VCM) is below ground (VSS) (see Figure 2-18). 4.2.2 INPUT OFFSET VOLTAGE OVER TEMPERATURE Where: U1 + 4.3.1 V OS T A = VOS + TC 1 T + TC2 T VDD D1 Application Tips RAIL-TO-RAIL OUTPUT The Output Voltage Range of the MCP6V61/1U/2/4 zero-drift op amps is VDD – 5.9 mV (typical) and VSS + 4.7 mV (typical) when RL = 20 kΩ is connected to VDD/2 and VDD = 5.5V. Refer to Figures 2-20 and 2-21 for more information. This op amp is designed to drive light loads; use another amplifier to buffer the output from heavy loads. 4.3.2 DC GAIN PLOTS Figures 2-10 to 2-12 are histograms of the reciprocals (in units of µV/V) of CMRR, PSRR and AOL, respectively. They represent the change in Input Offset Voltage (VOS) with a change in Common Mode Input Voltage (VCM), Power Supply Voltage (VDD) and Output Voltage (VOUT). The histograms are based on data taken with the production test equipment and the results reflect the trade-off between accuracy and test time. The actual performance of the devices is typically higher than shown in Figures 2-10 to 2-12. The 1/AOL histogram is centered near 0 µV/V because the measurements are dominated by the op amp’s input noise. The negative values shown represent noise and tester limitations, not unstable behavior. Production tests make multiple VOS measurements, which validates an op amp's stability; an unstable part would show greater VOS variability or the output would stick at one of the supply rails. 4.3.3 OFFSET AT POWER-UP When these parts power up, the input offset (VOS) starts at its uncorrected value (usually less than ±5 mV). Circuits with high DC gain can cause the output to reach one of the two rails. In this case, the time to a valid output is delayed by an output overdrive time (like tODR) in addition to the start-up time (like tSTR). It can be simple to avoid this extra start-up time. Reducing the gain is one method. Adding a capacitor across the feedback resistor (RF) is another method. DS20005367B-page 20 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 SOURCE RESISTANCES The input bias currents have two significant components: switching glitches that dominate at room temperature and below and input ESD diode leakage currents that dominate at +85°C and above. Make the resistances seen by the inputs small and equal. This minimizes the output offset caused by the input bias currents. The inputs should see a resistance on the order of 10Ω to 1 kΩ at high frequencies (i.e., above 1 MHz). This helps minimize the impact of switching glitches, which are very fast, on overall performance. In some cases it may be necessary to add resistors in series with the inputs to achieve this improvement in performance. Small input resistances may be needed for high gains. Without them, parasitic capacitances might cause positive feedback and instability. 4.3.5 SOURCE CAPACITANCE The capacitances seen by the two inputs should be small. Large input capacitances and source resistances, together with high gain, can lead to positive feedback and instability. 4.3.6 CAPACITIVE LOADS Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. These zero-drift op amps have a different output impedance than most op amps, due to their unique topology. When driving a capacitive load with these op amps, a series resistor at the output (RISO in Figure 4-7) improves the feedback loop’s phase margin (stability) by making the output load resistive at higher frequencies. The bandwidth will be generally lower than the bandwidth with no capacitive load. GN is the circuit’s noise gain. For non-inverting gains, GN and the Signal Gain are equal. For inverting gains, GN is 1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V). 10000 Recommended R ISO (ȍ) 4.3.4 VDD = 5.5V RL = 20 kȍ 1000 100 GN : 1 V/V 10 V/V 100 V/V 10 1 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06 100p 1n 10n 100n 1µ Normalized Load Capacitance; CL/ GN (F) FIGURE 4-8: Recommended RISO values for Capacitive Loads. After selecting RISO for your circuit, double check the resulting frequency response peaking and step response overshoot. Modify the RISO value until the response is reasonable. Bench evaluation is helpful. 4.3.7 STABILIZING OUTPUT LOADS This family of zero-drift op amps has an output impedance (Figures 2-32 and 2-33) that has a double zero when the gain is low. This can cause a large phase shift in feedback networks that have low-impedance near the part’s bandwidth. This large phase shift can cause stability problems. Figure 4-9 shows that the load on the output is (RL + RISO)||(RF + RG), where RISO is before the load (like Figure 4-7). This load needs to be large enough to maintain stability; it should be at least 10 kΩ. RG + CL RISO VOUT - RL CL + U1 RISO VOUT RF MCP6V6X FIGURE 4-9: Output Load. U1 MCP6V6X FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. Figure 4-8 gives recommended RISO values for different capacitive loads and gains. The x-axis is the load capacitance (CL). The y-axis is the resistance (RISO). 2014-2015 Microchip Technology Inc. DS20005367B-page 21 MCP6V61/1U/2/4 4.3.8 GAIN PEAKING 4.3.9 Figure 4-10 shows an op amp circuit that represents non-inverting amplifiers (VM is a DC voltage and VP is the input) or inverting amplifiers (VP is a DC voltage and VM is the input). The CN and CG capacitances represent the total capacitance at the input pins; they include the op amp’s Common Mode Input Capacitance (CCM), board parasitic capacitance and any capacitor placed in parallel. The CFP capacitance represents the parasitic capacitance coupling the output and non-inverting input pins. RN VP CN CFP U1 + MCP6V6X - VM RG FIGURE 4-10: Capacitance. CG RF Amplifier with Parasitic CG acts in parallel with RG (except for a gain of +1 V/V), which causes an increase in gain at high frequencies. CG also reduces the phase margin of the feedback loop, which becomes less stable. This effect can be reduced by either reducing CG or RF||RG. CN and RN form a low-pass filter that affects the signal at VP. This filter has a single real pole at 1/(2πRNCN). The largest value of RF that should be used depends on noise gain (see GN in Section 4.3.6 “Capacitive Loads”), CG and the open-loop gain’s phase shift. An approximate limit for RF is: EQUATION 4-2: 3.5 pF R F 10 k --------------- G N2 CG Some applications may modify these values to reduce either output loading or gain peaking (step-response overshoot). At high gains, RN needs to be small in order to prevent positive feedback and oscillations. Large CN values can also help. DS20005367B-page 22 Reduce undesired noise and signals with: • Low bandwidth signal filters: - Minimize random analog noise - Reduce interfering signals • Good PCB layout techniques: - Minimize crosstalk - Minimize parasitic capacitances and inductances that interact with fast switching edges • Good power supply design: - Isolation from other parts - Filtering of interference on supply line(s) 4.3.10 VOUT REDUCING UNDESIRED NOISE AND SIGNALS SUPPLY BYPASSING AND FILTERING With this family of operational amplifiers, the power supply pin (VDD for single supply) should have a local bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm of the pin for good high-frequency performance. These parts also need a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other low-noise analog parts. In some cases, high-frequency power supply noise (e.g., switched mode power supplies) may cause undue intermodulation distortion with a DC offset shift; this noise needs to be filtered. Adding a small resistor into the supply connection can be helpful. 4.3.11 PCB DESIGN FOR DC PRECISION In order to achieve DC precision on the order of ±1 µV, many physical errors need to be minimized. The design of the Printed Circuit Board (PCB), the wiring and the thermal environment have a strong impact on the precision achieved. A poor PCB design can easily be more than 100 times worse than the MCP6V61/1U/2/4 op amps’ minimum and maximum specifications. 4.3.11.1 PCB Layout Any time two dissimilar metals are joined together, a temperature-dependent voltage appears across the junction (the Seebeck or thermojunction effect). This effect is used in thermocouples to measure temperature. The following are examples of thermojunctions on a PCB: • Components (resistors, op amps, …) soldered to a copper pad • Wires mechanically attached to the PCB • Jumpers • Solder joints • PCB vias 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Typical thermojunctions have temperature-to-voltage conversion coefficients of 1 to 100 µV/°C (sometimes higher). 4.4 Microchip’s AN1258 (“Op Amp Precision Design: PCB Layout Techniques”) contains in-depth information on PCB layout techniques that minimize thermojunction effects. It also discusses other effects, such as crosstalk, impedances, mechanical stresses and humidity. Many sensors are configured as Wheatstone bridges. Strain gauges and pressure sensors are two common examples. These signals can be small and the Common mode noise large. Amplifier designs with high differential gain are desirable. 4.3.11.2 Crosstalk DC crosstalk causes offsets that appear as a larger input offset voltage. Common causes include: Typical Applications 4.4.1 WHEATSTONE BRIDGE Figure 4-11 shows how to interface to a Wheatstone bridge with a minimum of components. Because the circuit is not symmetric, the ADC input is single-ended and there is a minimum of filtering; the CMRR is good enough for moderate Common mode noise. • Common mode noise (remote sensors) • Ground loops (current return paths) • Power supply coupling 0.01C VDD R R Interference from the mains (usually 50 Hz or 60 Hz) and other AC sources can also affect the DC performance. Nonlinear distortion can convert these signals to multiple tones, including a DC shift in voltage. When the signal is sampled by an ADC, these AC signals can also be aliased to DC, causing an apparent shift in offset. FIGURE 4-11: To reduce interference: 4.4.2 - Keep traces and wires as short as possible Use shielding Use ground plane (at least a star ground) Place the input signal source near the DUT Use good PCB layout techniques Use a separate power supply filter (bypass capacitors) for these zero-drift op amps 4.3.11.3 Miscellaneous Effects Keep the resistances seen by the input pins as small and as near to equal as possible to minimize bias current-related offsets. Make the (trace) capacitances seen by the input pins small and equal. This is helpful in minimizing switching glitch-induced offset voltages. Bending a coax cable with a radius that is too small causes a small voltage drop to appear on the center conductor (the triboelectric effect). Make sure the bending radius is large enough to keep the conductors and insulation in full contact. Mechanical stresses can make some capacitor types (such as some ceramics) output small voltages. Use more appropriate capacitor types in the signal path and minimize mechanical stresses and vibration. Humidity can cause electrochemical potential voltages to appear in a circuit. Proper PCB cleaning helps, as does the use of encapsulants. 2014-2015 Microchip Technology Inc. 0.2R R R 1 kΩ + - ADC 100R 0.2R VDD U1 + MCP6V61 Simple Design. RTD SENSOR The ratiometric circuit in Figure 4-12 conditions a two-wire RTD for applications with a limited temperature range. U1 acts as a difference amplifier with a low-frequency pole. The sensor’s wiring resistance (RW) is corrected in firmware. Failure (open) of the RTD is detected by an out-of-range voltage. VDD RT RN 34.8 kΩ 10.0 kΩ RW RRTD 100Ω RW 10 nF RF 2.00 MΩ U1 + MCP6V61 RG RF 10.0 kΩ 2.00 MΩ 1.00 kΩ 100 nF RB 4.99 kΩ 1.0 µF 10 nF VDD + - ADC FIGURE 4-12: RTD Sensor. DS20005367B-page 23 MCP6V61/1U/2/4 4.4.3 OFFSET VOLTAGE CORRECTION Figure 4-13 shows MCP6V61 (U2) correcting the input offset voltage of another op amp (U1). R2 and C2 integrate the offset error seen at U1’s input; the integration needs to be slow enough to be stable (with the feedback provided by R1 and R3). R4 and R5 attenuate the integrator’s output; this shifts the integrator pole down in frequency. R1 VIN R3 R2 R2 - + R5 + VDD/2 R4 C2 VOUT U1 MCP6XXX U2 VDD/2 MCP6V61 FIGURE 4-13: 4.4.4 Offset Correction. PRECISION COMPARATOR Use high gain before a comparator to improve the latter’s performance. Do not use MCP6V61/1U/2/4 as a comparator by itself; the VOS correction circuitry does not operate properly without a feedback loop. U1 VIN + R1 MCP6V61 - R2 VDD/2 R3 R4 R5 VOUT + - U2 MCP6541 FIGURE 4-14: DS20005367B-page 24 Precision Comparator. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 5.0 DESIGN AIDS Microchip provides the basic design aids needed for the MCP6V61/1U/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6V61/1U/2/4 op amps is available on the Microchip web site at www.microchip.com. This model is intended to be an initial design tool that works well in the op amp’s linear region of operation over the temperature range. See the model file for information on its capabilities. Bench testing is a very important part of any design and cannot be replaced with simulations. Also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristics curves. 5.2 FilterLab® Software Microchip’s FilterLab® software is an innovative software tool that simplifies analog active filter (using op amps) design. Available at no cost from the Microchip web site at www.microchip.com/filterlab, the FilterLab design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. 5.3 Microchip Advanced Part Selector (MAPS) MAPS is a software tool that helps efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip web site at www.microchip.com/maps, MAPS is an overall selection tool for Microchip’s product portfolio that includes Analog, Memory, MCUs and DSCs. Using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-by-side technical comparison reports. Helpful links are also provided for data sheets, purchase and sampling of Microchip parts. 5.4 Analog Demonstration and Evaluation Boards Microchip offers a broad spectrum of Analog Demonstration and Evaluation Boards that are designed to help customers achieve faster time to market. For a complete listing of these boards and their corresponding user’s guides and technical information, visit the Microchip web site at www.microchip.com/analog tools. Some boards that are especially useful are: • MCP6V01 Thermocouple Auto-Zeroed Reference Design (P/N MCP6V01RD-TCPL) • MCP6XXX Amplifier Evaluation Board 1 (P/N DS51667) • MCP6XXX Amplifier Evaluation Board 2 (P/N DS51668) • MCP6XXX Amplifier Evaluation Board 3 (P/N DS51673) • MCP6XXX Amplifier Evaluation Board 4 (P/N DS51681) • Active Filter Demo Board Kit (P/N DS51614) • 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board (P/N SOIC8EV) • 14-Pin SOIC/TSSOP/DIP Evaluation Board (P/N SOIC14EV) 5.5 Application Notes The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. ADN003: “Select the Right Operational Amplifier for your Filtering Circuits”, DS21821 AN722: “Operational Amplifier Topologies and DC Specifications”, DS00722 AN723: “Operational Amplifier AC Specifications and Applications”, DS00723 AN884: “Driving Capacitive Loads With Op Amps”, DS00884 AN990: “Analog Sensor Conditioning Circuits – An Overview”, DS00990 AN1177: “Op Amp Precision Design: DC Errors”, DS01177 AN1228: “Op Amp Precision Design: Random Noise”, DS01228 AN1258: “Op Amp Precision Design: PCB Layout Techniques”, DS01258 These Application Notes and others are listed in the design guide: “Signal Chain Design Guide”, DS21825 2014-2015 Microchip Technology Inc. DS20005367B-page 25 MCP6V61/1U/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SC70 (MCP6V61U) Example Device MCP6V61UT-E/LTY Code DTNN 5-Lead SOT-23 (MCP6V61, MCP6V61U) Device Example Code MCP6V61T-E/OT AAAWY MCP6V61UT-E/OT AAAXY 8-Lead MSOP (3x3 mm) (MCP6V62) DT56 AAAW4 42256 Example 6V62E 542256 Legend: XX...X Y YY WW NNN e3 * Note: DS20005367B-page 26 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 8-Lead TDFN (2x3x0.75 mm) (MCP6V62) Device MCP6V62T-E/MNY Note: 14-Lead TSSOP (4.4 mm) (MCP6V64) XXXXXXXX YYWW NNN 2014-2015 Microchip Technology Inc. Example Code ACS Applies to 8-Lead 2x3 TDFN. ACS 542 25 Example 6V64E/ST 1542 256 DS20005367B-page 27 MCP6V61/1U/2/4 5-Lead Plastic Small Outine Transistor (LTY) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D b 3 1 2 E1 E 4 5 e A e A2 c A1 L + /2 3 - ,--,&. ,/ /0 / 1 " 3 0( 5 6 7 3 8 &8 6 7 7 ! 4" #$ 0( 9 6 3 8 9 " " :" 0( - 6 " ; !4 - - &8 - 6 7 4 - 9 2 " 7 ! !" #$% # & ' ( * * Drawing C04-083B Microchip &Technology ' * $!<4# DS20005367B-page 28 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 5-Lead Plastic Small Outine Transistor (LTY) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005367B-page 29 MCP6V61/1U/2/4 ! ; 8 * > %??*** ? 8 3 8 b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 + /2 3 - ,--,&. ,/ /0 1 / " - 3 =" #$ 0 - 3 0( 5 = 7 3 8 &8 6= 7 : 7 " 0( 9 7 : 3 8 9 : 7 6 0( - 7 : = #$ !" ; - - 7 4 ; - :" 7 6 ; @ 7 :@ - &8 6 7 4 7 " - 9 2 !" #$% # & ' ( * * & DS20005367B-page 30 ' * $!<=# 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005367B-page 31 MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005367B-page 32 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005367B-page 33 MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005367B-page 34 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005367B-page 35 MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005367B-page 36 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 " #$% &'()* *+,- ./#$! ; 8 * > %??*** ? 8 2014-2015 Microchip Technology Inc. 3 8 DS20005367B-page 37 MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005367B-page 38 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005367B-page 39 MCP6V61/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005367B-page 40 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 APPENDIX A: REVISION HISTORY Revision B (September 2015) The following is the list of modifications: 1. 2. 3. 4. 5. Added new devices to the family: MCP6V62 and MCP6V64, and related information throughout the document. Added Figure 2-37. Updated Table 3-1 in Section 3.0 “Pin Descriptions”. Added markings and specification drawings for the new packages in Section 6.0 “Packaging Information”. Updated the Product Identification System section with the new packages. Revision A (December 2014) • Original Release of this Document. 2014-2015 Microchip Technology Inc. DS20005367B-page 41 MCP6V61/1U/2/4 NOTES: DS20005367B-page 42 2014-2015 Microchip Technology Inc. MCP6V61/1U/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) –X Device Tape and Reel Temperature Range Device: /XX Package MCP6V61T: Single Op Amp (Tape and Reel) (SOT-23 only) MCP6V61UT: Single Op Amp (Tape and Reel) (SC70, SOT-23) MCP6V62: Dual Op Amp (MSOP, 2x3 TDFN) MCP6V62T: Dual Op Amp (Tape and Reel) (MSOP, 2x3 TDFN) MCP6V64: Quad Op Amp (TSSOP) MCP6V64T: Quad Op Amp (Tape and Reel) (TSSOP) Temperature Range: E Package: LTY* = Plastic Small Outline Transistor, 5-lead SC70 OT = Plastic Small Outline Transistor, 5-lead SOT-23 MNY* = Plastic Dual Flat, No-Lead - 2×3×0.75 mm Body, 8-lead MS = Plastic Micro Small Outline, 8-lead ST = Plastic Thin Shrink Small Outline - 4.4 mm Body, 14-lead Examples: a) MCP6V61T-E/OT: a) MCP6V61UT-E/LTY: Tape and Reel Extended temperature, 5LD SC70 package MCP6V61UT-E/OT: Tape and Reel, Extended temperature, 5LD SOT-23 package b) a) MCP6V62-E/MS: b) MCP6V62T-E/MS: = -40°C to +125°C (Extended) c) *Y Extended temperature, 8LD MSOP package Tape and Reel, Extended temperature, 8LD MSOP package MCP6V62T-E/MNY: Tape and Reel, Extended temperature, 8LD 2x3 TDFN package a) MCP6V64-E/ST: b) MCP6V64T-E/ST: = Nickel palladium gold manufacturing designator. Only available on the SC70 and TDFN package. Note 1: 2014-2015 Microchip Technology Inc. Tape and Reel, Extended temperature, 5LD SOT-23 package Extended temperature, 14LD TSSOP package Tape and Reel Extended temperature, 14LD TSSOP package Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005367B-page 43 MCP6V61/1U/2/4 NOTES: DS20005367B-page 44 2014-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-850-5 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2014-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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