Ceramic Resonators, Chip Type Ceramic Resonators, Chip Type (3 Array Type) Type: EFOS Type: EFOB Type: EFOSS Type: EFOSM Type: EFOBM Type: EFOJM ■ Recommended Applications ■ Features ● Clock generator for microprocessors ● Carrier circuit between telecommunication equipment (Telephone to telephone, personal computer to printer) ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the number of circuit parts ● RoHS compliant ■ Handling Precautions (See Page 175 to 176) ■ Packaging Specifications See Page 169 to 177 ■ Explanation of Part Numbers 1 2 3 E F O 4 5 6 7 8 3 5 8 4 9 10 11 12 Design No. Product Code Ceramic EFO Resonators Type Built-In Capacitors Type with 3-terminals 2 to 13 MHz S 13.1 to 20 MHz B 1 2 3 E F O 4 5 Nominal Oscillation Frequency 3584 3.58 MHz 1695 16.93 MHz (Example) Frequency Tolerance ±1.0 % 0 ±0.3 % 3 ±0.5 % 5 Packaging Style B Bulk Pack Embossed E Taping 6 7 8 9 4 0 0 4 10 11 12 Design No. Product Code Ceramic EFO Resonators Part Number EFOS EFOB EFOSS EFOSM EFOBM EFOJM Type Built-In Capacitors Type with 3-terminals 4 to 13 MHz SS 4 to 13 MHz SM 12 to 20 MHz BM 16 to 20 MHz JM 30 to 50 MHz Frequency range (MHz) 2.00 to 8.39 8.40 to 13.0 13.1 to 20.0 4.00 to 8.39 8.40 to 13.0 4.00 to 8.39 8.40 to 13.0 12.0 to 20.0 16.0 to 20.0 30.0 to 50.0 Nominal Oscillation Frequency 4004 4.00 MHz 1695 16.93 MHz 2005 20.00 MHz 4005 40.00 MHz Packaging Style B Bulk Pack Embossed E Taping Frequency Tolerance ±1.0 % 0 ±0.3 % 3 ±0.5 % 5 (Example) Frequency Temperature Characteristics (–20 to +80 °C) ±0.2 % ±1.0 % ±0.5 % ±0.2 % ±0.3 % ±0.2 % ±1.0 % ±0.3 % ±0.5 % ±0.2 % Built-in Capacitors (Reference) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC166 – 33 pF 33 pF 21 pF 33 pF 18 pF 10 pF 01 Feb. 2009 Ceramic Resonators, Chip Type ■ Dimensions in mm (not to scale) Recommended Land Dimensions [Type EFOS, EFOSM] [Type EFOS]·····2.0 to 13.0 MHz Oscillating Frequency Serial No. 1.60±0.20 2.5 (2.70) 4.2 (7.30) Terminal Electrodes 2.5 7.80 +0.50 –0.20 6-(1.30) 3.20 +0.30 –0.20 3-0.9 to 1.2 6–R(0.20) 6-(1.00) 2.50±0.20 2.50±0.20 [Type EFOSM]·····4.0 to 13.0 MHz Oscillating Frequency 1.20 max. Serial No. (7.30) Terminal Electrodes (2.70) +0.30 3.20 –0.20 +0.50 7.80 –0.20 6–R(0.20) 3–(1.00) 2.50±0.20 [Type EFOSS]·····4.0 to 13.0 MHz [Type EFOSS] (0.15) Terminal Electrodes 1.5 1.5 (1.60) 1.6 1.20 max. Oscillating Frequency Serial No. 2.6 2.50±0.20 2.00±0.30 4.50±0.20 3-0.55 3–(0.55) 2–1.50±0.20 6–(0.60) [Type EFOB]·····13.1 to 20.0 MHz 3-0.8 [Type EFOB] (5.00) 1.9 1.9 (2.70) 6–(1.20) 4.2 Terminal Electrodes 1.60±0.20 Oscillating Frequency Serial No. +0.50 5.50 –0.20 +0.25 3.20 –0.15 6–R(0.20) 3-1.2 6–(1.20) 1.90±0.20 1.90±0.20 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC167 – 01 Feb. 2009 Ceramic Resonators, Chip Type ■ Dimensions in mm (not to scale) Recommended Land Dimensions [Type EFOBM] [Type EFOBM]·····12.0 to 20.0 MHz Oscillating Frequency 1.20 max. Serial No. (2.40) 3.9 (3.70) Terminal Electrodes 1.351.35 2.90±0.30 4.10±0.20 6–R(0.20) 3–(0.80) 2–1.35±0.20 3-0.8 [Type EFOJM]·····16.0 to 20.0, 30.0 to 50.0 MHz [Type EFOJM] Oscillating Frequency (3.90) 1.6 1.6 (3.10) 4.6 Terminal Electrodes 1.20 max. Serial No. +0.30 4.40 +0.50 –0.20 3.60 –0.20 6–R(0.20) 3-0.7 to 1.0 3–(0.80) 2–1.60±0.20 ■ Test Circuits Diagram For Oscillation Circuit For Loop Gain +5 V +5 V IC 14 13 1 2 3 11 4 IC 9 5 7 0.01 IN 1 M V1 14 13 1 2 3 11 4 9 7 Frequency IC G=20 log (V0/ V1) 2.00 to 8.39 MHz OUT FET probe 10 M min. 2 pF max. µPD4069UBC, TC4069UBP or similar 8.40 to 50.0 MHz µPD74HCU, TC74 HCU04AP or similar 5 1 M Frequency Counter T.G. Output =–20dBm Ceramic Resonator V0 Ceramic Resonator Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC168 – 01 Feb. 2009 Ceramic Resonators, Chip Type ■ Typical Characteristics ····· Temperature Characteristics 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 2.0 to 8.39 MHz 8.4 to 13 MHz –20 0 20 40 60 80 Temperature (°C) –20 0 20 40 60 80 Temperature (°C) Type EFOBM 2.0 to 8.39 MHz 8.4 to 13 MHz –20 0 20 40 60 80 Temperature (°C) 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 4.0 to 8.39 MHz 8.4 to 13 MHz –20 0 20 40 60 80 Temperature (°C) Type EFOJM Oscillation Frequency Drift(%) 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 Oscillation Frequency Drift(%) Oscillation Frequency Drift(%) Type EFOSM Oscillation Frequency Drift(%) Type EFOSS 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 Oscillation Frequency Drift(%) Type EFOB 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 Oscillation Frequency Drift(%) Type EFOS –20 0 20 40 60 80 Temperature (°C) 0.8 0.6 0.4 0.2 0.0 –0.2 –0.4 –0.6 –0.8 30 to 50 MHz 16 to 20 MHz –20 0 20 40 60 80 Temperature (°C) ■ Packaging Specifications ● Standard Packing Quantity Type Embossed Taping EFOS, EFOSM 2500 pcs./reel EFOSS 2000 pcs./reel EFOB , EFOBM, EFOJM 1000 pcs./reel Bulk 500 pcs./bag ● Dimensions for Reel in mm (not to scale) [Type EFOS, EFOSM] T E φA φB C D E 330±5 80 min. 13.0±0.5 21.0±0.8 2.0±0.5 Dim. (mm) W T t r 16.4+2.0 0 22.4 max. 3 max. 1.0 φB C Dim. (mm) D r [Type EFOSS, EFOB, EFOBM, EFOJM] φA W Dim. (mm) φA φB C D E 180±5 60 min. 13.0±0.5 21.0±0.8 2.0±0.5 Dim. (mm) W T t r 12.4+2.0 0 18.4 max. 3 max. 1.0 t Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC169 – 01 Feb. 2009 Ceramic Resonators, Chip Type Chip pocket F E P1 P0 P2 Feeding hole P0 φD0 Chip pocket P2 B A Tape running direction Chip Componen A 7.80 W B A t2 t1 3.20 B W F t2 E P1 Dim. (mm) 3.7±0.2 Dim. (mm) P2 P0 φD 0 t1 t2 2.0±0.1 4.0±0.1 1.5+0.1 0 0.3 3.5 max. 8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1 2.00 P1 Tape running direction Chip Component A 4.50 t1 Feeding hole φD0 [Type EFOSS] F E W [Type EFOS, EFOSM] B W Dim. (mm) 2.6±0.2 Dim. (mm) P2 P0 φD 0 2.0±0.1 4.0±0.1 1.5+0.1 0 F E P1 5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1 t1 t2 0.6 max. 3.0 max. [Type EFOB, EFOBM, EFOJM] Feeding hole φD0 t1 Chip pocket A P0 P1 t2 4.40 B F E W 3.60 Type EFOJM (Example) P2 Chip Component Tape running direction Dim. (mm) A B 1 2 W Dim. (mm) P2 P0 φD 0 2.0±0.1 4.0±0.1 1.5+0.1 0 F E P1 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1 t1 t2 0.6 max. 3.0 max. Dim. (mm) A B 1 2 Type EFOB 3.7±0.2 6.0±0.2 Type EFOBM 3.4±0.2 4.6±0.2 Type EFOJM 4.1±0.2 4.9±0.2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC170 – 01 Feb. 2009