Hi-Flow® 225U September 2008 PRODUCT DESCRIPTION Non-Reinforced Phase Change Thermal Interface Material TYPICAL PROPERTIES OF HI-FLOW 225U IMPERIAL VALUE Black METRIC VALUE Black Reinforcement Carrier None None — Thickness (inch) / (mm) 0.0015 0.036 ASTM D374 Continuous Use Temp (°F) / (°C) 302 150 — Phase Change Temp (°F) / (°C) 131 55 ASTM D3418 • Thermally conductive 55°C phase change compound ELECTRICAL Flame Rating V-O V-O U.L. 94 • Available in roll form with kiss-cut parts THERMAL Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470 FEATURES AND BENEFITS • Thermal impedance: 0.07°C-in2/W (@25 psi) • Hi-Flow® coating will resist dripping PROPERTY Color THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TEST METHOD Visual 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 0.53 0.47 0.39 0.34 0.32 Thermal Impedance (°C-in2/W) (2) 0.08 0.07 0.06 0.05 0.04 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Hi-Flow® 225U is designed for use as a thermal interface material between a computer processor and a heat sink.The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, Hi-Flow® 225U wets-out the thermal interface surfaces and flows to produce low thermal impedance. Hi-Flow® 225U requires pressure of the assembly to cause flow. TYPICAL APPLICATIONS INCLUDE • Computer and peripherals Application Method: 1. Hand-apply to 35°- 45°C heat sink.The heat sink is heated in an oven or via heat gun to between 35°- 45°C.The Hi-Flow® 225U part is then applied like an adhesive pad.The heat sink is cooled to room temperature and packaged. A protective tab liner remains in place until the unit is ready for final assembly. The protective tab can be readily removed from the applied Hi-Flow® 225U pad at a maximum temperature of 28°C. 2. Automated equipment with 30-psi pressure. A pick-and-place automated dispensing unit can be used to apply the Hi-Flow® 225U pad to a room-temperature heat sink.The placement head should have a silicone rubber pad, and should apply approximately 30 psi pressure to the pad on transfer to the 25° – 35°C heat sink. Once applied, the protective tab can be readily removed from the Hi-Flow® 225U pad at a maximum temperature of 28°C. • High performance computer processors • Graphic cards • Power modules CONFIGURATIONS AVAILABLE • Roll form with tabs and kiss-cut parts – no holes Hi-Flow® 225U is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm). Note: To build a part number, visit our website at www.bergquistcompany.com. PDS_HF_225U_September 2008 TDS Hi-Flow® 225U, September 2008 Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 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