ESDAVLC6-1V2 Single line low capacitance Transil™ for ESD protection Datasheet − production data Description The ESDAVLC6-1V2 is a single line unidirectional Transil diode designed specially for the protection of integrated circuits into portable equipment and miniaturized electronics devices subject to ESD transient overvoltage. The device is ideal for applications where both reduced printed circuit board space and high ESD protection level are required. ST01005 ESDAVLC6-1V2 Complies with following standards: • IEC 61000-4-2 level 4: – ±8 kV contact discharge – ±15 kV air discharge Features • Ultra small PCB area = 0.09 mm² • Unidirectional device Figure 1. Functional diagram • Very low diode capacitance • Low leakage current • RoHS compliant Pin1 Applications Where transient over voltage protection in ESD sensitive equipment is required, such as: • Smart phones and accessories Pin 2 • Portable multimedia devices and accessories • Tablets TM: Transil is a trademark of STMicroelectronics June 2014 This is information on a product in full production. DocID025241 Rev 1 1/8 www.st.com Characteristics 1 ESDAVLC6-1V2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Value Unit ±8 ±15 kV Operating temperature range -40 to +125 °C Tstg Storage temperature range - 55 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C VPP Tj Parameter IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Peak pulse voltage Figure 2. Electrical characteristics (definitions) I IF Symbol VBR VRM VCL IRM IPP = = = = = RD = CLINE = Parameter Breakdown voltage Stand-off voltage Clamping voltage Leakage current @ VRM Peak pulse current Dynamic resistance Line capacitance VF VCL VBR VRM V IRM Slope: 1/Rd IPP Table 2. Electrical characteristics (values, Tamb = 25 °C) Value Symbol Parameter Min. 2/8 Unit Test conditions VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V Cline Line capacitance, I/O to GND VR = 0 V, F = 1 MHz, Vosc = 30 mV DocID025241 Rev 1 Typ. Max. 6 V 5 50 nA 7 pF ESDAVLC6-1V2 Characteristics Figure 3. ESD response to IEC 61000-4-2 (typical values, +8 kV contact discharge) Figure 4. ESD response to IEC 61000-4-2 (typical values, -8 kV contact discharge) 20 V/div 20 V/div 88 V 1 2 3 4 1 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns -6 V 55 V 2 32 V -33 V 3 18 V 4 -73 V 2 -18 V 4 3 1 1 2 3 4 20 ns/div VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 20 ns/div Figure 5. S21 attenuation measurement L 0 S21 (dB) -3 -6 -9 -12 -15 -18 -21 10M F (Hz) 30M 100M 300M 1G 3G 10G ESDAVLC6 -1V2 DocID025241 Rev 1 3/8 8 Package information 2 ESDAVLC6-1V2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 205 µm ± 20 Figure 6. Package dimensions 25 µm ± 10 75 µm 50 µm 75 µm 200 µm 450 µm ± 20 50 µm 200 µm ± 20 50 µm 50 µm Figure 7. Footprint recommendation A B H I F J E D C G A = 225 µm B = 225 µm C = 50 µm E = 180 µm G = 530 µm I = 112.5 µm D = 180 µm F = 100 µm H = 40 µm J = 270 µm Solder pad PCB opening 4/8 DocID025241 Rev 1 ESDAVLC6-1V2 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design Stencil opening thickness: 80 µm Figure 8. Recommended stencil window position K M N L K = 180 µm L = 180 µm M = 150 µm N = 30 µm Solder pad PCBopening Stencil aperture (thickness stencil: 80 µm) 3.2 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Solder paste with fine particles: type 4 (powder particle size 20-38 µm per IPC J-STD005). DocID025241 Rev 1 5/8 8 Recommendation on PCB assembly 3.3 3.4 3.5 ESDAVLC6-1V2 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Tolerance of ± 0.02 mm is recommended. 4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 9. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 6/8 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. DocID025241 Rev 1 ESDAVLC6-1V2 4 Ordering information Ordering information Figure 10. Ordering information scheme ESDA VLC 6 - 1 V2 ESD array Very low capacitance Breakdown voltage 6 = 6 V min. Directional 1 = Unidirectional Package V = ST01005 package 2 = 2 pads Table 3. Ordering information 5 Order code Marking Weight Base qty Delivery mode ESDAVLC6-1V2 L 0.041 mg 20 000 Tape and reel Revision history Table 4. Document revision history Date Revision 05-Jun-2014 1 Changes First issue DocID025241 Rev 1 7/8 8 ESDAVLC6-1V2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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