MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 MC9S12XEP100RMV1 Rev. 1.22 05/2010 freescale.com To provide the most up-to-date information, the document revision on the World Wide Web is the most current. A printed copy may be an earlier revision. To verif, refer to: http://freescale.com/ This document contains information for the complete S12XE-Family and thus includes a set of separate FTM module sections to cover the whole family. A full list of family members and options is included in the appendices. This document contains information for all constituent modules, with the exception of the S12X CPU. For S12X CPU information please refer to CPU12XV2 in the CPU12/CPU12X Reference Manual. Revision History Date Revision Description 1.16 Figure B-3 Θ1 value corrected. Added LVR minimum assert level Enhanced RESET pin description. IIC register name corrected Corrected D-Flash size reference for XEG128 Changed module revision history tables to a unified format Corrected corrupted formats 1.17 Added Module Run Idd Values Added 3.3V expansion bus timing Corrected NVM timing parameters Changed IIC SCL Divider note 1.18 Updated NVM timing parameter section for brownout case Specified time delay from RESET to start of CPU code execution Added NVM patch Part IDs Enhanced ECT GPIO / timer function transitioning description Dec, 2008 1.19 Updated 208MAPBGA thermal parameters Revised TIM flag clearing procedure Corrected CRG register address Added maskset identifier suffix for ATMC fab Fixed typos Aug, 2009 1.20 Added 208MAPBGA disclaimer Added VREAPI to PT5. Added LVR Note to electricals. Updates to TIM/ECT/XGATE/SCI/MSCAN (see embedded rev. history) Apr, 2010 1.21 FTM section (see FTM revision history) PIM section (see PIM revision history) May, 2010 1.22 ECT and TIM sections (see ECT, TIM revision history tables) BDM Alternate clock source defined in device overview May,2008 Jul, 2008 Sep, 2008 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family. . . . . . . . . . . . . . . . . . . . . 27 Chapter 2 Port Integration Module (S12XEP100PIMV1) . . . . . . . . . . . . . . 89 Chapter 3 Memory Mapping Control (S12XMMCV4) . . . . . . . . . . . . . . . . 187 Chapter 4 Memory Protection Unit (S12XMPUV1) . . . . . . . . . . . . . . . . . 227 Chapter 5 External Bus Interface (S12XEBIV4) . . . . . . . . . . . . . . . . . . . . 241 Chapter 6 Interrupt (S12XINTV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 Chapter 7 Background Debug Module (S12XBDMV2) . . . . . . . . . . . . . . 277 Chapter 8 S12X Debug (S12XDBGV3) Module . . . . . . . . . . . . . . . . . . . . 303 Chapter 9 Security (S12XE9SECV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 Chapter 10 XGATE (S12XGATEV3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) . . . . . . 467 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) . . . . . . . . . . . . . . . . . . . . 497 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) . . . . . . . . . . . . 501 Chapter 14 Enhanced Capture Timer (ECT16B8CV3). . . . . . . . . . . . . . . . 525 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description. . . . . . . . . 577 Chapter 16 Scalable Controller Area Network (S12MSCANV3) . . . . . . . . 603 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) . . . . . . . . . . . . . . 657 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) . . . . . . . . . . . . . . 675 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) . . . . . . . . . . . . . . 689 Chapter 20 Serial Communication Interface (S12SCIV5) . . . . . . . . . . . . . 721 Chapter 21 Serial Peripheral Interface (S12SPIV5) . . . . . . . . . . . . . . . . . . 759 Chapter 22 Timer Module (TIM16B8CV2) Block Description . . . . . . . . . . 785 Chapter 23 Voltage Regulator (S12VREGL3V3V1) . . . . . . . . . . . . . . . . . . 813 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) . . . . . . . . . . . . 829 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) . . . . . . . . . . . . 889 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 3 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) . . . . . . . . . . . . 951 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) . . . . . . . . . . . 1013 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) . . . . . . . . . . . 1075 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) . . . . . . . . . 1137 Appendix A Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 Appendix B Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1255 Appendix C PCB Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1260 Appendix D Derivative Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1265 Appendix E Detailed Register Address Map. . . . . . . . . . . . . . . . . . . . . . . 1268 Appendix F Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1319 MC9S12XE-Family Reference Manual , Rev. 1.21 4 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Blank Page MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 5 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Blank Page MC9S12XE-Family Reference Manual , Rev. 1.21 6 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 1.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 1.1.4 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 1.1.5 Address Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 1.1.6 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.1.7 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.2.1 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 1.2.2 Pin Assignment Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.2.3 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 1.2.4 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.4.1 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 1.4.3 Freeze Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 1.4.4 System States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.1 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.2 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.3 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 ADC0 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 1.7.1 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 1.7.2 ADC0 Channel[17] Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 ADC1 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 MPU Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 VREG Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 1.10.1 Temperature Sensor Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 BDM Clock Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 S12XEPIM Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Oscillator Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Chapter 2 Port Integration Module (S12XEPIMV1) 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 7 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.2 2.3 2.1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 2.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 2.3.1 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 2.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 2.3.3 Port A Data Register (PORTA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 2.3.4 Port B Data Register (PORTB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 2.3.5 Port A Data Direction Register (DDRA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.3.6 Port B Data Direction Register (DDRB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.3.7 Port C Data Register (PORTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 2.3.8 Port D Data Register (PORTD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 2.3.9 Port C Data Direction Register (DDRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 2.3.10 Port D Data Direction Register (DDRD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 2.3.11 Port E Data Register (PORTE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 2.3.12 Port E Data Direction Register (DDRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 2.3.13 S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) . . . . . . . . . . . . . . . . . . 114 2.3.14 S12X_EBI ports Reduced Drive Register (RDRIV) . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 2.3.15 ECLK Control Register (ECLKCTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 2.3.16 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 2.3.17 IRQ Control Register (IRQCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 2.3.18 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 2.3.19 Port K Data Register (PORTK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 2.3.20 Port K Data Direction Register (DDRK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 2.3.21 Port T Data Register (PTT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 2.3.22 Port T Input Register (PTIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 2.3.23 Port T Data Direction Register (DDRT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 2.3.24 Port T Reduced Drive Register (RDRT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 2.3.25 Port T Pull Device Enable Register (PERT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 2.3.26 Port T Polarity Select Register (PPST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.27 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.28 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.29 Port S Data Register (PTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 2.3.30 Port S Input Register (PTIS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.3.31 Port S Data Direction Register (DDRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.3.32 Port S Reduced Drive Register (RDRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 2.3.33 Port S Pull Device Enable Register (PERS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 2.3.34 Port S Polarity Select Register (PPSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 2.3.35 Port S Wired-Or Mode Register (WOMS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 2.3.36 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 2.3.37 Port M Data Register (PTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 2.3.38 Port M Input Register (PTIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 2.3.39 Port M Data Direction Register (DDRM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 2.3.40 Port M Reduced Drive Register (RDRM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 2.3.41 Port M Pull Device Enable Register (PERM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 MC9S12XE-Family Reference Manual , Rev. 1.21 8 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.3.42 2.3.43 2.3.44 2.3.45 2.3.46 2.3.47 2.3.48 2.3.49 2.3.50 2.3.51 2.3.52 2.3.53 2.3.54 2.3.55 2.3.56 2.3.57 2.3.58 2.3.59 2.3.60 2.3.61 2.3.62 2.3.63 2.3.64 2.3.65 2.3.66 2.3.67 2.3.68 2.3.69 2.3.70 2.3.71 2.3.72 2.3.73 2.3.74 2.3.75 2.3.76 2.3.77 2.3.78 2.3.79 2.3.80 2.3.81 2.3.82 2.3.83 2.3.84 2.3.85 2.3.86 Port M Polarity Select Register (PPSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Port M Wired-Or Mode Register (WOMM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Module Routing Register (MODRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 Port P Data Register (PTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 Port P Input Register (PTIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 Port P Data Direction Register (DDRP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 Port P Reduced Drive Register (RDRP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 Port P Pull Device Enable Register (PERP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 Port P Polarity Select Register (PPSP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Port P Interrupt Enable Register (PIEP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Port P Interrupt Flag Register (PIFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Port H Data Register (PTH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Port H Input Register (PTIH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Port H Data Direction Register (DDRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Port H Reduced Drive Register (RDRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 Port H Pull Device Enable Register (PERH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Port H Polarity Select Register (PPSH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Port H Interrupt Enable Register (PIEH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 Port H Interrupt Flag Register (PIFH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 Port J Data Register (PTJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 Port J Input Register (PTIJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Port J Data Direction Register (DDRJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Port J Reduced Drive Register (RDRJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 Port J Pull Device Enable Register (PERJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Port J Polarity Select Register (PPSJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Port J Interrupt Enable Register (PIEJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Port J Interrupt Flag Register (PIFJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Port AD0 Data Register 0 (PT0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Port AD0 Data Register 1 (PT1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Port AD0 Data Direction Register 0 (DDR0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Port AD0 Data Direction Register 1 (DDR1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Port AD0 Reduced Drive Register 0 (RDR0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 Port AD0 Reduced Drive Register 1 (RDR1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Port AD0 Pull Up Enable Register 0 (PER0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Port AD0 Pull Up Enable Register 1 (PER1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 Port AD1 Data Register 0 (PT0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 Port AD1 Data Register 1 (PT1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Port AD1 Data Direction Register 0 (DDR0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Port AD1 Data Direction Register 1 (DDR1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Port AD1 Reduced Drive Register 0 (RDR0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Port AD1 Reduced Drive Register 1 (RDR1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Port AD1 Pull Up Enable Register 0 (PER0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Port AD1 Pull Up Enable Register 1 (PER1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Port R Data Register (PTR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 Port R Input Register (PTIR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 9 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.4 2.5 2.3.87 Port R Data Direction Register (DDRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 2.3.88 Port R Reduced Drive Register (RDRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 2.3.89 Port R Pull Device Enable Register (PERR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 2.3.90 Port R Polarity Select Register (PPSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 2.3.91 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 2.3.92 Port R Routing Register (PTRRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 2.3.93 Port L Data Register (PTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 2.3.94 Port L Input Register (PTIL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 2.3.95 Port L Data Direction Register (DDRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 2.3.96 Port L Reduced Drive Register (RDRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 2.3.97 Port L Pull Device Enable Register (PERL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 2.3.98 Port L Polarity Select Register (PPSL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 2.3.99 Port L Wired-Or Mode Register (WOML) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 2.3.100Port L Routing Register (PTLRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 2.3.101Port F Data Register (PTF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 2.3.102Port F Input Register (PTIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 2.3.103Port F Data Direction Register (DDRF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 2.3.104Port F Reduced Drive Register (RDRF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 2.3.105Port F Pull Device Enable Register (PERF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 2.3.106Port F Polarity Select Register (PPSF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 2.3.107PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 2.3.108Port F Routing Register (PTFRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.3 Pins and Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 2.4.4 Pin interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 2.5.1 Port Data and Data Direction Register writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.1 3.2 3.3 3.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 3.1.1 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 3.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 3.1.3 S12X Memory Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 3.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 3.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 3.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 3.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 3.4.1 MCU Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 3.4.2 Memory Map Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 MC9S12XE-Family Reference Manual , Rev. 1.21 10 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 3.5 3.4.3 Chip Access Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 3.4.4 Chip Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 3.5.1 CALL and RTC Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 3.5.2 Port Replacement Registers (PRRs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 3.5.3 On-Chip ROM Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.1 4.2 4.3 4.4 4.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.1 Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 4.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 4.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 4.4.1 Protection Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 4.4.2 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 4.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Chapter 5 External Bus Interface (S12XEBIV4) 5.1 5.2 5.3 5.4 5.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 5.1.1 Glossary or Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 5.4.1 Operating Modes and External Bus Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 5.4.2 Internal Visibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 5.4.3 Accesses to Port Replacement Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 5.4.4 Stretched External Bus Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 5.4.5 Data Select and Data Direction Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254 5.4.6 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 5.5.1 Normal Expanded Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 5.5.2 Emulation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 11 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1 6.2 6.3 6.4 6.5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 6.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 6.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 6.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 6.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 6.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 6.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 6.4.1 S12X Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 6.4.2 Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 6.4.3 XGATE Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 6.4.4 Priority Decoders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 6.4.5 Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 6.4.6 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.2 Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.3 Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 Chapter 7 Background Debug Module (S12XBDMV2) 7.1 7.2 7.3 7.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.3 Family ID Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 7.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286 7.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286 7.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 7.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 7.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 7.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 7.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 7.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 7.4.9 SYNC — Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 MC9S12XE-Family Reference Manual , Rev. 1.21 12 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 7.4.10 Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 7.4.11 Serial Communication Time Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Chapter 8 S12X Debug (S12XDBGV3) Module 8.1 8.2 8.3 8.4 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 8.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 8.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 8.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 8.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 8.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 8.4.1 S12XDBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 8.4.2 Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 8.4.3 Trigger Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 329 8.4.4 State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 8.4.5 Trace Buffer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 8.4.6 Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339 8.4.7 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340 Chapter 9 Security (S12XE9SECV2) 9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 9.1.3 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 9.1.4 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347 9.1.5 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 9.1.6 Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 9.1.7 Complete Memory Erase (Special Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 Chapter 10 XGATE (S12XGATEV3) 10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352 10.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 10.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 10.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 10.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 13 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 10.4 10.5 10.6 10.7 10.8 10.9 10.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371 10.4.1 XGATE RISC Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372 10.4.2 Programmer’s Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372 10.4.3 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373 10.4.4 Semaphores . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374 10.4.5 Software Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.5.1 Incoming Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.5.2 Outgoing Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.6.1 Debug Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.6.2 Leaving Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380 10.8.1 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380 10.8.2 Instruction Summary and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 10.8.3 Cycle Notation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 10.8.4 Thread Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 10.8.5 Instruction Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 10.8.6 Instruction Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459 Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.2 Code Example (Transmit "Hello World!" on SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.3 Stack Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467 11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467 11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468 11.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468 11.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.2.1 VDDPLL, VSSPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.2.2 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471 11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484 11.4.1 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484 11.4.2 Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 489 11.4.3 Low Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 490 11.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 492 11.5.1 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493 11.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495 MC9S12XE-Family Reference Manual , Rev. 1.21 14 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 11.6.1 Description of Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.2.1 VDDPLL and VSSPLL — Operating and Ground Voltage Pins . . . . . . . . . . . . . . . . . . . . 498 12.2.2 EXTAL and XTAL — Input and Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.1 Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.2 Clock Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.3 Wait Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.4 Stop Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502 13.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503 13.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506 13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 13.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 13.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522 13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523 13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 14.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 14.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 526 14.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2.1 IOC7 — Input Capture and Output Compare Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2.2 IOC6 — Input Capture and Output Compare Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . 527 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 15 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 14.2.3 IOC5 — Input Capture and Output Compare Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.4 IOC4 — Input Capture and Output Compare Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.5 IOC3 — Input Capture and Output Compare Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.6 IOC2 — Input Capture and Output Compare Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.7 IOC1 — Input Capture and Output Compare Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.8 IOC0 — Input Capture and Output Compare Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564 14.4.1 Enhanced Capture Timer Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 571 14.4.2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575 14.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577 15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577 15.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2.1 IIC_SCL — Serial Clock Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2.2 IIC_SDA — Serial Data Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579 15.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579 15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591 15.4.1 I-Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591 15.4.2 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.4.3 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.4.4 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.7 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597 15.7.1 IIC Programming Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597 Chapter 16 Freescale’s Scalable Controller Area Network (S12MSCANV3) 16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603 16.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 16.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 16.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 16.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.2.1 RXCAN — CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 MC9S12XE-Family Reference Manual , Rev. 1.21 16 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 16.2.2 TXCAN — CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607 16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607 16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 16.3.3 Programmer’s Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 628 16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 642 16.4.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 648 16.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 650 16.4.6 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 654 16.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 654 16.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 16.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 16.5.2 Bus-Off Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658 17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658 17.3 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 659 17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 669 17.4.1 Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 670 17.4.2 Interrupt Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671 17.4.3 Hardware Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671 17.5 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.2 Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.3 Flag Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.6 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 17 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 18.3 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 685 18.4.1 Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 685 18.4.2 Interrupt Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.4.3 Hardware Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.2 Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.3 Flag Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.6 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 688 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689 19.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689 19.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.2.1 PWM7 — PWM Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.2 PWM6 — PWM Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.3 PWM5 — PWM Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.4 PWM4 — PWM Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.5 PWM3 — PWM Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.6 PWM3 — PWM Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.7 PWM3 — PWM Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.8 PWM3 — PWM Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692 19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707 19.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707 19.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 710 19.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 718 19.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 719 Chapter 20 Serial Communication Interface (S12SCIV5) 20.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721 20.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721 20.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 722 20.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 722 20.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 723 20.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 MC9S12XE-Family Reference Manual , Rev. 1.21 18 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 20.2.1 TXD — Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.2.2 RXD — Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3.1 Module Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 725 20.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 737 20.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738 20.4.2 LIN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738 20.4.3 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739 20.4.4 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 740 20.4.5 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 741 20.4.6 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 746 20.4.7 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 754 20.4.8 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.3 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 756 20.5.4 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 758 20.5.5 Recovery from Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 758 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760 21.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.1 MOSI — Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.2 MISO — Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.3 SS — Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.2.4 SCK — Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763 21.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 771 21.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 772 21.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773 21.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774 21.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 779 21.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 780 21.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 781 21.4.7 Low Power Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 782 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 19 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 785 22.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786 22.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786 22.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787 22.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 789 22.2.1 IOC7 — Input Capture and Output Compare Channel 7 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.2 IOC6 — Input Capture and Output Compare Channel 6 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.3 IOC5 — Input Capture and Output Compare Channel 5 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.4 IOC4 — Input Capture and Output Compare Channel 4 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.5 IOC3 — Input Capture and Output Compare Channel 3 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.6 IOC2 — Input Capture and Output Compare Channel 2 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.7 IOC1 — Input Capture and Output Compare Channel 1 Pin . . . . . . . . . . . . . . . . . . . . 790 22.2.8 IOC0 — Input Capture and Output Compare Channel 0 Pin . . . . . . . . . . . . . . . . . . . . 790 22.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 807 22.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808 22.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 809 22.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 809 22.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 810 22.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 810 22.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.6.1 Channel [7:0] Interrupt (C[7:0]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 814 23.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.1 VDDR — Regulator Power Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.2 VDDA, VSSA — Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.3 VDD, VSS — Regulator Output1 (Core Logic) Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.4 VDDF — Regulator Output2 (NVM Logic) Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.5 VDDPLL, VSSPLL — Regulator Output3 (PLL) Pins . . . . . . . . . . . . . . . . . . . . . . . . . 817 MC9S12XE-Family Reference Manual , Rev. 1.21 20 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 23.2.6 VDDX — Power Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.7 VREGEN — Optional Regulator Enable Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.8 VREG_API — Optional Autonomous Periodical Interrupt Output Pin . . . . . . . . . . . . . . 817 23.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818 23.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818 23.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.2 Regulator Core (REG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.3 Low-Voltage Detect (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.4 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.5 Low-Voltage Reset (LVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.6 HTD - High Temperature Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.7 Regulator Control (CTRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.8 Autonomous Periodical Interrupt (API) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.9 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 23.4.10Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 23.4.11Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 830 24.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 830 24.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 831 24.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 832 24.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833 24.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 834 24.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 834 24.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 839 24.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 860 24.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 860 24.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 865 24.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 885 24.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 887 24.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 888 24.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 888 24.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 888 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 889 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 21 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 25.2 25.3 25.4 25.5 25.6 25.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 890 25.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 891 25.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 892 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 893 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 894 25.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 894 25.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 899 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 920 25.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 920 25.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 925 25.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 946 25.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 25.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 25.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 948 25.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 949 25.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 949 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 949 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 951 26.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 952 26.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 953 26.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 954 26.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 955 26.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 956 26.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 956 26.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 961 26.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 982 26.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 982 26.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 987 26.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1009 26.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1011 26.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1012 26.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1012 26.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1012 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014 MC9S12XE-Family Reference Manual , Rev. 1.21 22 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 27.2 27.3 27.4 27.5 27.6 27.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014 27.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1015 27.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1016 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1017 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1018 27.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1018 27.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1023 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1044 27.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1044 27.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1049 27.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1070 27.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 27.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 27.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1072 27.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1073 27.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1073 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1075 28.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1076 28.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1077 28.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1078 28.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1079 28.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1080 28.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1080 28.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1085 28.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106 28.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106 28.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1111 28.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1133 28.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1135 28.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1136 28.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1136 28.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1136 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1138 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 23 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 29.2 29.3 29.4 29.5 29.6 29.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1138 29.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1139 29.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1140 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1141 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142 29.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142 29.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1148 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1169 29.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1169 29.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1174 29.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1195 29.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 29.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 29.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1197 29.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1198 29.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1198 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1198 Appendix A Electrical Characteristics A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1200 A.1.4 Current Injection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1201 A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1201 A.1.6 ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1202 A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1204 A.1.8 Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1205 A.1.9 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1207 A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1212 A.2 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.1 ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.2 Factors Influencing Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.3 ATD Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1219 A.3 NVM, Flash and Emulated EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1222 A.3.1 Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1222 A.3.2 NVM Reliability Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1229 A.4 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1231 A.5 Output Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1231 A.5.1 Resistive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.5.2 Capacitive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.5.3 Chip Power-up and Voltage Drops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.6 Reset, Oscillator and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1233 MC9S12XE-Family Reference Manual , Rev. 1.21 24 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 A.6.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1233 A.6.2 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1235 A.6.3 Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1236 A.7 External Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.1 MSCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.2 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.3 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1244 Appendix B Package Information B.1 B.2 B.3 B.4 208 MAPBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1256 144-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1256 112-Pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1258 80-Pin QFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1259 Appendix C PCB Layout Guidelines Appendix D Derivative Differences D.1 Memory Sizes and Package Options S12XE - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1265 D.2 Pinout explanations: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1267 Appendix E Detailed Register Address Map Appendix F Ordering Information MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 25 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 MC9S12XE-Family Reference Manual , Rev. 1.21 26 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1 Introduction The MC9S12XE-Family of micro controllers is a further development of the S12XD-Family including new features for enhanced system integrity and greater functionality. These new features include a Memory Protection Unit (MPU) and Error Correction Code (ECC) on the Flash memory together with enhanced EEPROM functionality (EEE), an enhanced XGATE, an Internally filtered, frequency modulated Phase Locked Loop (IPLL) and an enhanced ATD. The E-Family extends the S12X product range up to 1MB of Flash memory with increased I/O capability in the 208-pin version of the flagship MC9S12XE100. The MC9S12XE-Family delivers 32-bit performance with all the advantages and efficiencies of a 16 bit MCU. It retains the low cost, power consumption, EMC and code-size efficiency advantages currently enjoyed by users of Freescale’s existing 16-Bit MC9S12 and S12X MCU families. There is a high level of compatibility between the S12XE and S12XD families. The MC9S12XE-Family features an enhanced version of the performance-boosting XGATE co-processor which is programmable in “C” language and runs at twice the bus frequency of the S12X with an instruction set optimized for data movement, logic and bit manipulation instructions and which can service any peripheral module on the device. The new enhanced version has improved interrupt handling capability and is fully compatible with the existing XGATE module. The MC9S12XE-Family is composed of standard on-chip peripherals including up to 64Kbytes of RAM, eight asynchronous serial communications interfaces (SCI), three serial peripheral interfaces (SPI), an 8channel IC/OC enhanced capture timer (ECT), two 16-channel, 12-bit analog-to-digital converters, an 8channel pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two inter-IC bus blocks (IIC), an 8-channel 24-bit periodic interrupt timer (PIT) and an 8-channel 16-bit standard timer module (TIM). The MC9S12XE-Family uses 16-bit wide accesses without wait states for all peripherals and memories. The non-multiplexed expanded bus interface available on the 144/208-Pin versions allows an easy interface to external memories. In addition to the I/O ports available in each module, up to 26 further I/O ports are available with interrupt capability allowing Wake-Up from STOP or WAIT modes. The MC9S12XE-Family is available in 208Pin MAPBGA, 144-Pin LQFP, 112-Pin LQFP or 80-Pin QFP options. 1.1.1 Features Features of the MC9S12XE-Family are listed here. Please see Table D-2.for memory options and Table D2. for the peripheral features that are available on the different family members. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 27 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family • • • • • • • • • • 16-Bit CPU12X — Upward compatible with MC9S12 instruction set with the exception of five Fuzzy instructions (MEM, WAV, WAVR, REV, REVW) which have been removed — Enhanced indexed addressing — Access to large data segments independent of PPAGE INT (interrupt module) — Eight levels of nested interrupts — Flexible assignment of interrupt sources to each interrupt level. — External non-maskable high priority interrupt (XIRQ) — Internal non-maskable high priority Memory Protection Unit interrupt — Up to 24 pins on ports J, H and P configurable as rising or falling edge sensitive interrupts EBI (external bus interface)(available in 208-Pin and 144-Pin packages only) — Up to four chip select outputs to select 16K, 1M, 2M and up to 4MByte address spaces — Each chip select output can be configured to complete transaction on either the time-out of one of the two wait state generators or the deassertion of EWAIT signal MMC (module mapping control) DBG (debug module) — Monitoring of CPU and/or XGATE busses with tag-type or force-type breakpoint requests — 64 x 64-bit circular trace buffer captures change-of-flow or memory access information BDM (background debug mode) MPU (memory protection unit) — 8 address regions definable per active program task — Address range granularity as low as 8-bytes — No write / No execute Protection Attributes — Non-maskable interrupt on access violation XGATE — Programmable, high performance I/O coprocessor module — Transfers data to or from all peripherals and RAM without CPU intervention or CPU wait states — Performs logical, shifts, arithmetic, and bit operations on data — Can interrupt the HCS12X CPU signalling transfer completion — Triggers from any hardware module as well as from the CPU possible — Two interrupt levels to service high priority tasks — Hardware support for stack pointer initialisation OSC_LCP (oscillator) — Low power loop control Pierce oscillator utilizing a 4MHz to 16MHz crystal — Good noise immunity — Full-swing Pierce option utilizing a 2MHz to 40MHz crystal — Transconductance sized for optimum start-up margin for typical crystals IPLL (Internally filtered, frequency modulated phase-locked-loop clock generation) MC9S12XE-Family Reference Manual , Rev. 1.21 28 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family • • • • • • • — No external components required — Configurable option to spread spectrum for reduced EMC radiation (frequency modulation) CRG (clock and reset generation) — COP watchdog — Real time interrupt — Clock monitor — Fast wake up from STOP in self clock mode Memory Options — 128K, 256k, 384K, 512K, 768K and 1M byte Flash — 2K, 4K byte emulated EEPROM — 12K, 16K, 24K, 32K, 48K and 64K Byte RAM Flash General Features — 64 data bits plus 8 syndrome ECC (Error Correction Code) bits allow single bit failure correction and double fault detection — Erase sector size 1024 bytes — Automated program and erase algorithm D-Flash Features — Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access. — Dedicated commands to control access to the D-Flash memory over EEE operation. — Single bit fault correction and double bit fault detection within a word during read operations. — Automated program and erase algorithm with verify and generation of ECC parity bits. — Fast sector erase and word program operation. — Ability to program up to four words in a burst sequence Emulated EEPROM Features — Automatic EEE file handling using an internal Memory Controller. — Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset. — Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory. — Ability to disable EEE operation and allow priority access to the D-Flash memory. — Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory. Two 16-channel, 12-bit Analog-to-Digital Converters — 8/10/12 Bit resolution — 3µs, 10-bit single conversion time — Left/right, signed/unsigned result data — External and internal conversion trigger capability — Internal oscillator for conversion in Stop modes — Wake from low power modes on analog comparison > or <= match Five MSCAN (1 M bit per second, CAN 2.0 A, B software compatible modules) — Five receive and three transmit buffers MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 29 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family • • • • • • • • — Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit — Four separate interrupt channels for Rx, Tx, error, and wake-up — Low-pass filter wake-up function — Loop-back for self-test operation ECT (enhanced capture timer) — 8 x 16-bit channels for input capture or output compare — 16-bit free-running counter with 8-bit precision prescaler — 16-bit modulus down counter with 8-bit precision prescaler — Four 8-bit or two 16-bit pulse accumulators TIM (standard timer module) — 8 x 16-bit channels for input capture or output compare — 16-bit free-running counter with 8-bit precision prescaler — 1 x 16-bit pulse accumulator PIT (periodic interrupt timer) — Up to eight timers with independent time-out periods — Time-out periods selectable between 1 and 224 bus clock cycles — Time-out interrupt and peripheral triggers 8 PWM (pulse-width modulator) channels — 8 channel x 8-bit or 4 channel x 16-bit Pulse Width Modulator — programmable period and duty cycle per channel — Center- or left-aligned outputs — Programmable clock select logic with a wide range of frequencies — Fast emergency shutdown input Three Serial Peripheral Interface Modules (SPI) — Configurable for 8 or 16-bit data size Eight Serial Communication Interfaces (SCI) — Standard mark/space non-return-to-zero (NRZ) format — Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths Two Inter-IC bus (IIC) Modules — Multi-master operation — Software programmable for one of 256 different serial clock frequencies — Broadcast mode support — 10-bit address support On-Chip Voltage Regulator — Two parallel, linear voltage regulators with bandgap reference — Low-voltage detect (LVD) with low-voltage interrupt (LVI) — Power-on reset (POR) circuit — 3.3V and 5V range operation — Low-voltage reset (LVR) MC9S12XE-Family Reference Manual , Rev. 1.21 30 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family • • • • 1.1.2 Low-power wake-up timer (API) — Available in all modes including Full Stop Mode — Trimmable to +-5% accuracy — Time-out periods range from 0.2ms to ~13s with a 0.2ms resolution Input/Output — Up to 152 general-purpose input/output (I/O) pins plus 2 input-only pins — Hysteresis and configurable pull up/pull down device on all input pins — Configurable drive strength on all output pins Package Options — 208-pin MAPBGA — 144-pin low-profile quad flat-pack (LQFP) — 112-pin low-profile quad flat-pack (LQFP) — 80-pin quad flat-pack (QFP) 50MHz maximum CPU bus frequency, 100MHz maximum XGATE bus frequency Modes of Operation Memory map and bus interface modes: • Normal and emulation operating modes — Normal single-chip mode — Normal expanded mode — Emulation of single-chip mode — Emulation of expanded mode • Special Operating Modes — Special single-chip mode with active background debug mode — Special test mode (Freescale use only) Low-power modes: • System stop modes — Pseudo stop mode — Full stop mode with fast wake-up option • System wait mode Operating system states • Supervisor state • User state MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 31 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.3 Block Diagram Reset Generation and Test Entry EWAIT PA[7:0] PTA ADDR[15:8] PB[7:0] PTB ADDR[7:0] PC[7:0] PTC ADDR[22:16] DATA[15:8] PD[7:0] DATA[7:0] PTF CS0 CS1 CS2 CS3 SDA SCL RXD TXD PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 INT Enhanced Multilevel Interrupt Module MPU XIRQ IRQ RW/WE LSTRB/LDS ECLK MODA/TAGLO/RE MODB/TAGHI XCLKS/ECLKX2 PTD PK[7:0] PTK PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PTE TEST Memory Protection 8 regions Non-Multiplexed External Bus Interface RESET PWM PIT PWM[7:0] 8-bit 8 channel Pulse Width Modulator RXD SCI0 TXD Asynchronous Serial IF RXD SCI1 TXD Asynchronous Serial IF SPI0 MISO Synchronous Serial IF CAN0 msCAN 2.0B CAN1 msCAN 2.0B CAN2 msCAN 2.0B CAN3 msCAN 2.0B SCI4 Asynchronous Serial IF SCI5 Asynchronous Serial IF SCI6 Asynchronous Serial IF SCI7 Asynchronous Serial IF SCI2 Asynchronous Serial IF MOSI SCK SS MISO MOSI SCK SS MISO MOSI SCK SS RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXD TXD RXD TXD RXD TXD RXD TXD RXD TXD IIC1 Inter IC Module CAN4 msCAN 2.0B SDA SCL RXCAN TXCAN Synchronous Serial IF SPI1 Synchronous Serial IF SPI2 8ch 16-bit Timer IIC0 Inter IC Module SCI3 Asynchronous Serial IF Figure 1-1. MC9S12XE-Family PTAD0 IPLL with Frequency Modulation option Clock Monitor COP Watchdog Periodic Interrupt Async. Periodic Int. IOC[7:0] PTAD1 XTAL Amplitude Controlled Low Power Pierce or Full drive Pierce Oscillator X EXTAL 16-bit 8 channel Timer XGATE BKGD Debug Module Single-wire Background 4 address breakpoints Debug Module 2 data breakpoints 512 Byte Trace Buffer PTT CPU12X PT[7:0] PTR IOC[7:0] 16-bit 8 channel Enhanced Capture Timer TIM PR[7:0] PP[7:0] PTS Voltage Regulator PAD[31:16] PTH (Wake-up Int) 8/10/12-bit 16-channel AN[15:0] Analog-Digital Converter ECT PTM 2K … 4K bytes EEPROM VDDR VDD VDDF VDDPLL PAD[15:0] PTL 8/10/12-bit 16-channel AN[15:0] Analog-Digital Converter ATD1 12K … 64K bytes RAM PTJ (Wake-up Int.) ATD0 128K … 1M bytes Flash PTP (Int) Figure 1-1 shows a block diagram of the MC9S12XE-Family devices PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 PH0 PH1 PH2 PH3 PH4 PH5 PH6 PH7 PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7 PL0 PL1 PL2 PL3 PL4 PL5 PL6 PL7 PJ0 PJ1 PJ2 PJ3 PJ4 PJ5 PJ6 PJ7 Block Diagram MC9S12XE-Family Reference Manual , Rev. 1.21 32 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.4 Device Memory Map Table 1-1 shows the device register memory map. Table 1-1. Device Register Memory Map Address Module Size (Bytes) 0x0000–0x0009 PIM (port integration module) 10 0x000A–0x000B MMC (memory map control) 2 0x000C–0x000D PIM (port integration module) 2 0x000E–0x000F EBI (external bus interface) 2 0x0010–0x0017 MMC (memory map control) 8 0x0018–0x0019 Reserved 2 0x001A–0x001B Device ID register 2 0x001C–0x001F PIM (port integration module) 4 0x0020–0x002F DBG (debug module) 16 0x0030–0x0031 Reserved 2 0x0032–0x0033 PIM (port integration module) 2 0x0034–0x003F ECRG (clock and reset generator) 12 0x0040–0x007F ECT (enhanced capture timer 16-bit 8-channel)s 64 0x0080–0x00AF ATD1 (analog-to-digital converter 12-bit 16-channel) 48 0x00B0–0x00B7 IIC1 (inter IC bus) 8 0x00B8–0x00BF SCI2 (serial communications interface) 8 0x00C0–0x00C7 SCI3 (serial communications interface) 8 0x00C8–0x00CF SCI0 (serial communications interface) 8 0x00D0–0x00D7 SCI1 (serial communications interface) 8 0x00D8–0x00DF SPI0 (serial peripheral interface) 8 0x00E0–0x00E7 IIC0 (inter IC bus) 8 0x00E8–0x00EF Reserved 8 0x00F0–0x00F7 SPI1 (serial peripheral interface) 8 0x00F8–0x00FF SPI2 (serial peripheral interface) 8 0x0100–0x0113 FTM control registers 20 0x0114–0x011F MPU (memory protection unit) 12 0x0120–0x012F INT (interrupt module) 16 0x0130–0x0137 SCI4 (serial communications interface) 8 0x0138–0x013F SCI5 (serial communications interface) 8 0x0140–0x017F CAN0 64 0x0180–0x01BF CAN1 64 0x01C0–0x01FF CAN2 64 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 33 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-1. Device Register Memory Map (continued) Address Module Size (Bytes) 0x0200–0x023F CAN3 64 0x0240–0x027F PIM (port integration module) 64 0x0280–0x02BF CAN4 64 0x02C0–0x02EF ATD0 (analog-to-digital converter 12 bit 16-channel) 48 0x02F0–0x02F7 Voltage regulator 8 0x02F8–0x02FF Reserved 8 0x0300–0x0327 PWM (pulse-width modulator 8 channels) 40 0x0328–0x032F Reserved 8 0x0330–0x0337 SCI6 (serial communications interface) 8 0x0338–0x033F SCI7 (serial communications interface) 8 0x0340–0x0367 PIT (periodic interrupt timer) 40 0x0368–0x037F PIM (port integration module) 24 0x0380–0x03BF XGATE 64 0x03C0–0x03CF Reserved 16 0x03D0–0x03FF TIM (timer module) 48 0x0400–0x07FF Reserved 1024 NOTE Reserved register space shown in Table 1-1 is not allocated to any module. This register space is reserved for future use. Writing to these locations have no effect. Read access to these locations returns zero. 1.1.5 Address Mapping Figure 1-2 shows S12XE CPU & BDM local address translation to the global memory map. It indicates also the location of the internal resources in the memory map. EEEPROM size is presented like a fixed 256 KByte in the memory map. MC9S12XE-Family Reference Manual , Rev. 1.21 34 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family CPU and BDM Local Memory Map Global Memory Map 0x00_0000 0x00_07FF 2K REGISTERS CS3 Unimplemented RAM 0x0000 0x0800 0x0C00 0x1000 RAM 2K REGISTERS 1K EEPROM window EPAGE RAMSIZE RAM_LOW 0x0F_FFFF 1K EEPROM 4K RAM window RPAGE 0x2000 256 K EEEPROM RESOURCES 8K RAM 0x4000 0x13_FFFF CS2 Unpaged 16K FLASH 0x1F_FFFF External Space CS1 0x8000 PPAGE 0x3F_FFFF 0xC000 CS0 16K FLASH window Unimplemented FLASH Unpaged 16K FLASH FLASH_LOW Reset Vectors FLASH NOTE: On smaller derivatives the flash memory map is split into 2 ranges separated by an unimplemeted range, as depicted by the dashed lines. For more information refer to tables below and MMC section. FLASHSIZE 0xFFFF 0x7F_FFFF Figure 1-2. MC9S12XE100 Global Memory Map MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 35 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Unimplemented RAM pages are mapped externally in expanded modes. Accessing unimplemented RAM pages in single chip modes causes an illegal address reset if the MPU is not configured to flag an MPU protection error in that range. Accessing unimplemented FLASH pages in single chip modes causes an illegal address reset if the MPU is not configured to flag an MPU protection error in that range. The PARTID value should be referenced regarding the specific memory map for any given device. For devices sharing the same part ID, the memory regions which are implemented on the larger device but not supported on the smaller device are implemented but untested on that smaller device. These regions do not appear as unimplemented in the memory map and do not result in an illegal address reset if erroneously accessed. Table 1-2. Unimplemented Range Mapping to Part ID Mask Set Number Part ID RAM_LOW EE_LOW Flash Blocks Registers xM22E $CC8x 0x0F_0000 0x13_F000 B3, B2, B1S, B1N, B0 2K xM48H $CC9x 0x0F_0000 0x13_F000 B3, B2, B1S, B1N, B0 2K xM25J $C48x 0x0F_8000 0x13_F000 B1N, B1S, B0 2K xM53J $C08x 0x0F_C000 0x13_F000 B1S, B0(128K) 2K From the above the following examples can be derived. The 9S12XEP768 is currently only available as a 9S12XEP100 die, thus the unimplemented FLASH pages are those of the 9S12XEP100 device map. The 9S12XEQ384, 9S12XEG384, 9S12XES384 are currently only available as a 9S12XEQ512 die, thus the unimplemented FLASH pages are those of the 9S12XEQ512 device map. The 9S12XEG128 is currently only available as a 9S12XET256 die, thus the unimplemented FLASH pages are those of the 9S12XET256 device map. The range between 0x10_0000 and 0x13_FFFF is mapped to EEPROM resources. The actual EEPROM and dataflash block sizes are listed in Table 1-4. Within EEPROM resource range an address range exists which is neither used by EEPROM resources nor remapped to external resources via chip selects (see the FTM/MMC descriptions for details). These ranges do not constitute unimplemented areas. Accessing reserved registers within the 2K register space does not generate an illegal address reset. The fixed 8K RAM default location in the global map is 0x0F_E000- 0x0F_FFFF. This is subject to remapping when configuring the local address map for a larger RAM access range. MC9S12XE-Family Reference Manual , Rev. 1.21 36 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Figure 1-3 shows XGATE local address translation to the global memory map. It indicates also the location of used internal resources in the memory map. Table 1-3. XGATE Resources Internal Resource Size /KByte $Address XGATE RAM 32K XGRAM_LOW = 0x0F_8000 (1) FLASH 30K XGFLASH_HIGH = 0x78_8000 1. This value is calculated by the following formula: (64K -2K- XGRAMSIZE) Table 1-4. Derivative Dependent Memory Parameters Device FLASH_LOW PPAGE (1) RAM_LOW RPAGE (2) EE_LOW EPAGE 9S12XEP100 0x70_0000 64 0x0F_0000 16 0x13_F000 4(3) + 32(4) 9S12XEP768 0x74_0000 48 0x0F_4000 12 0x13_F000 4 + 32 9S12XEQ512 0x78_0000 32 0x0F_8000 8 0x13_F000 4 + 32 9S12XEx384 0x78_0000(5) 24 0x0F_A000 6 0x13_F000 4 + 32 9S12XET256 9S12XEA256 0x78_0000(7) 16 0x0F_C000 4 0x13_F000 4 + 32 0x78_0000(8) 8 0x0F_D000 3 0x13_F800 2 + 32 (6) 9S12XEG128 9S12XEA1286 1. Number of 16K pages addressable via PPAGE register 2. Number of 4K pages addressing the RAM. RAM can also be mapped to 0x4000 - 0x7FFF 3. Number of 1K pages addressing the Cache RAM via the EPAGE register counting downwards from 0xFF 4. Number of 1K pages addressing the Data flash via the EPAGE register starting upwards from 0x00 5. The 384K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 256K block from 0x7C_0000 to 0x7F_FFFF 6. The 9S12XEA devices are a special bondout for access to extra ADC channels in 80QFP. Available in 80QFP only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. 7. The 256K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 128K block from 0x7E_0000 to 0x7F_FFFF 8. The 128K memory map is split into a 64K block from 0x78_0000 to 0x78_FFFF and a 64K block from 0x7F_0000 to 0x7F_FFFF Table 1-5. Derivative Dependent Flash Block Mapping Device 0x70_0000 0x74_0000 0x78_0000 0x7A_0000 0x7C_0000 0x7E_0000 9S12XEP100 B3 B2 B1S B1N B0 9S12XEP768 — B2 B1S B1N B0 9S12XEQ512 — — B1S B1N B0 9S12XEx384 — — B1S — B0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-5. Derivative Dependent Flash Block Mapping (continued) Device 0x70_0000 0x74_0000 9S12XET256 9S12XEA256 — — 0x78_0000 0x7A_0000 0x7C_0000 — — B1S 0x7E_0000 B0(128K) (1) 9S12XEG128 9S12XEA1281 — — B1S (64K) — — B0 (64K) 1. The 9S12XEA devices are special bondouts for access to extra ADC channels in 80QFP. Available in 80QFP only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. Block B1 is divided into two 128K blocks. The XGATE is always mapped to block B1S. On the 9S12XEG128 the flash is divided into two 64K blocks B0 and B1S, the B1S range extending from 0x78_0000 to 0x78_FFFF, the B0 range extending from 0x7F_0000 to 0x7F_FFFF. The block B0 is a reduced size 128K block on the 256K derivative. On the larger derivatives B0 is a 256K block. The block B0 is a reduced size 64K block on the 128K derivative. MC9S12XE-Family Reference Manual , Rev. 1.21 38 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family XGATE Local Memory Map Global Memory Map 0x00_0000 Registers 0x00_07FF XGRAM_LOW 0x0800 RAM 0x0F_FFFF RAMSIZE Registers XGRAMSIZE 0x0000 FLASH RAM 0x78_0800 0xFFFF FLASHSIZE FLASH XGFLASH_HIGH 0x7F_FFFF Figure 1-3. XGATE Global Address Mapping MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 39 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.6 Detailed Register Map The detailed register map is listed in Appendix A. 1.1.7 Part ID Assignments The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B). The read-only value is a unique part ID for each revision of the chip. Table 1-6 shows the assigned part ID number and Mask Set number. MC9S12XE-Family Reference Manual , Rev. 1.21 40 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The Version ID is a word located in a flash information row at 0x40_00E8. The version ID number indicates a specific version of internal NVM variables used to patch NVM errata. The default is no patch (0xFFFF). Table 1-6. Assigned Part ID Numbers Device Mask Set Number Part ID(1) Version ID MC9S12XEP100 0M22E 0xCC80 0xFFFF MC9S12XEP100 1M22E 0xCC80 0xFFFF MC9S12XEP100 2M22E 0xCC82 0xFFFF MC9S12XEP100 0M48H 0xCC90 0xFFFF MC9S12XEP100 1M48H 0xCC91 0xFFFF MC9S12XEP100 2M48H 0xCC92 0xFFFF MC9S12XEP100 3M48H 0xCC93 0xFFFF MC9S12XEP100 4M48H 0xCC94 0xFFFF MC9S12XEP100 5M48H 0xCC94 0x0004 MC9S12XEP768(2) 4M48H 0xCC94 0xFFFF MC9S12XEP7682 5M48H 0xCC94 0x0004 MC9S12XEQ512 0M25J 0xC480 0xFFFF MC9S12XEQ512 1M25J 0xC481 0xFFFF MC9S12XEQ512 2M25J 0xC482 0xFFFF MC9S12XEQ512 3M25J 0xC482 0x0004 0xFFFF (3) 2M25J 0xC482 MC9S12XEQ3843 3M25J 0xC482 0x0004 MC9S12XEG3843 2M25J 0xC482 0xFFFF MC9S12XEG3843 3M25J 0xC482 0x0004 3 2M25J 0xC482 0xFFFF 3 MC9S12XES384 3M25J 0xC482 0x0004 MC9S12XET256 0M53J 0xC080 0xFFFF MC9S12XET256 1M53J 0xC081 0xFFFF MC9S12XET256 2M53J 0xC081 0x0004 MC9S12XEA256 1M53J 0xC081 0xFFFF MC9S12XEA256 2M53J 0xC081 0x0004 (4) 1M53J 0xC081 0xFFFF 4 2M53J 0xC081 0x0004 4 1M53J 0xC081 0xFFFF MC9S12XEQ384 MC9S12XES384 MC9S12XEG128 MC9S12XEG128 MC9S12XEA128 2M53J 0xC081 MC9S12XEA1284 1. The coding is as follows: Bit 15-12: Major family identifier Bit 11-6: Minor family identifier Bit 5-4: Major mask set revision number including FAB transfers Bit 3-0: Minor — non full — mask set revision 2. Currently available as MC9S12XEP100 die only 3. Currently available as MC9S12XEQ512 die only 4. Currently available as MC9S12XET256 die only 1.2 0x0004 Signal Description MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 41 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. It is built from the signal description sections of the Block User Guides of the individual IP blocks on the device. 1.2.1 Device Pinout The MC9S12XE-Family offers pin-compatible packaged devices to assist with system development and accommodate expansion of the application. NOTE Smaller derivatives within the MC9S12XE-Family feature a subset of the listed modules. Refer to Appendix D Derivative Differences for more information about derivative device module subset and to Table 1-7. Port Availability by Package Option and Table 1-9. Pin-Out Summary for details of pins available in different package options. The MC9S12XE-Family devices are offered in the following package options: • 208-pin MAPBGA package with an external bus interface (address/data bus) • 144-pin LQFP package with an external bus interface (address/data bus) • 112-pin LQFP without external bus interface • 80-pin QFP without external bus interface MC9S12XE-Family Reference Manual , Rev. 1.21 42 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1 2 3 4 5 6 7 8 9 10 11 12 A N.C. N.C. PP7 PM0 PM1 PF5 PF3 PF1 PJ6 PS6 PS5 PS3 B N.C. PP2 PP6 PF7 PF6 PF4 PF2 PF0 C PJ2 PP1 PP4 PP5 PK7 PM2 PM4 PJ5 PS7 D PK1 PJ3 PP0 PP3 VDDX PM3 PM5 PJ4 PJ7 VDDX PS0 PAD22 VRH PAD17 PAD30 PAD29 E PK0 PK3 PK2 PK6 VSSA PAD15 PAD06 PAD28 F PR1 PR0 PT0 VDDX VDDA PAD05 PAD13 PAD27 G PT2 PT3 PR2 PT1 VSSX VSSX VSSX VSSX VDDA PAD12 PAD04 PAD11 H PR3 PR4 PT4 VDDF VSSX VSSX VSSX VSSX VSSA PAD26 PAD03 PAD10 J PT5 PR5 PT6 VSS1 VSSX VSSX VSSX VSSX VSS2 PAD09 PAD25 PAD02 K PR6 PT7 PK4 PR7 VSSX VSSX VSSX VSSX L PK5 PJ1 M PJ0 PC0 PB1 PC1 N PC2 PC3 PB2 PC7 PL1 PE6 P PB0 PB3 PB4 PC4 PL2 R N.C. PB5 PB6 PB7 T N.C. N.C. PC5 PL3 TEST PS4 PS2 14 15 PM6 PAD19 N.C. 16 N.C. PS1 PAD23 PAD21 PAD18 PAD31 N.C. PM7 PAD20 VRL PAD16 PAD07 PAD14 BKGD VDDX VDDX VDDR 13 VDD PD7 PAD24 PAD01 VDDX PD4 PAD00 PAD08 PA6 PA2 PD5 PD6 VSS3 PH3 PH1 VDDX PE1 PA1 PA5 PA7 PL0 PE4 RESET PL7 PL6 PH0 PE2 PE0 PA0 PA3 PA4 PC6 PH6 PH4 PE5 VSS PLL VDD PLL PH2 PL4 PD1 PD3 PE3 N.C. PH7 PH5 PE7 VSS EXTAL XTAL PLL VDD PLL PL5 PD0 PD2 N.C. N.C. Figure 1-4. - Pin Assignments, 208 MAPBGA Package MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 43 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KPW5/PWM5/MOSI2/TIMIOC5 PP6/KWP6/PWM6/SS2/TIMIOC6 PP7/KWP7/PWM7/SCK2/TIMIOC7 PK7/ROMCTL/EWAIT VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ4/KWJ4/SDA1/CS0 PJ5/KWJ5/SCL1/CS2 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXACAN0 TEST PS7/SS0 PS6/SCK0 PS5/MOSI0 PS4/MISO0 PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 PM6/RXCAN3/RXCAN4/RXD3 PM7/TXCAN3/TXCAN4/TXD3 PAD23/AN23 PAD22/AN22 PAD21/AN21 PAD20/AN20 PAD19/AN19 PAD18/AN18 VSSA1 VRL Chapter 1 Device Overview MC9S12XE-Family 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 MC9S12XE-Family 144 LQFP Pins shown in BOLD-ITALICS neither available on the 112 LQFP nor on the 80 QFP Package Option Pins shown in BOLD are not available on the 80 QFP package 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 VRH VDDA1 PAD17/AN17 PAD16/AN16 PAD15/AN15 PAD07/AN07 PAD14/AN14 PAD06/AN06 PAD13/AN13 PAD05/AN05 PAD12/AN12 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PD7/DATA7 PD6/DATA6 PD5/DATA5 PD4/DATA4 VDDX3 VSSX3 PA7/ADDR15 PA6/ADDR14 PA5/ADDR13 PA4/ADDR12 PA3/ADDR11 PA2/ADDR10 PA1/ADDR9 PA0/ADDR8 ADDR5/PB5 ADDR6/PB6 ADDR7/PB7 DATA12/PC4 DATA13/PC5 DATA14/PC6 DATA15/PC7 TXD5/SS2/KWH7/PH7 RXD5/SCK2/KWH6/PH6 TXD4/MOSI2/KWH5/PH5 RXD4/MISO2/KWH4/PH4 XCLKS/ECLK2X/PE7 TAGHI/MODB/PE6 RE/TAGLO/MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL TXD7/SS1/KWH3/PH3 RXD7/SCK1/KWH2/PH2 TXD6/MOSI1/KWH1/PH1 RXD6/MISO1/KWH0/PH0 DATA0/PD0 DATA1/PD1 DATA2/PD2 DATA3/PD3 EROMCTL/LDS/LSTRB/PE3 WE/RW/PE2 IRQ/PE1 XIRQ/PE0 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 CS1/KWJ2/PJ2 ACC/ADDR22/PK6 ADDR19/PK3 IQSTAT2/ADDR18/PK2 IQSTAT1/ADDR17/PK1 IQSTAT0/ADDR16/PK0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 ACC/ADDR21/PK5 ACC/ADDR20/PK4 TXD2/KWJ1/PJ1 RXD2/KWJ0/PJ0 MODC/BKGD VDDX4 VSSX4 DATA8/PC0 DATA9/PC1 DATA10/PC2 DATA11/PC3 UDS/ADDR0/PB0 ADDR1/PB1 ADDR2/PB2 ADDR3/PB3 ADDR4/PB4 Figure 1-5. MC9S12XE-Family Pin Assignments 144-pin LQFP Package MC9S12XE-Family Reference Manual , Rev. 1.21 44 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 Pins shown in BOLD are not available on the 80 QFP package 67 66 65 64 63 62 61 60 59 58 57 MC9S12XE-Family 112LQFP 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 VRH VDDA1 PAD15/AN15 PAD07/AN07 PAD14/AN14 PAD06/AN06 PAD13/AN13 PAD05/AN05 PAD12/AN12 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 PB5 PB6 PB7 TXD5/SS2/KWH7/PH7 RXD5/SCK2/KWH6/PH6 TXD4/MOSI2/KWH5/PH5 RXD4/MISO2/KWH4/PH4 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL TXD7/SS1/KWH3/PH3 RXD7/SCK1/KWH2/PH2 TXD6/MOSI1/KWH1/PH1 RXD6/MISO1/KWH0/PH0 PE3 PE2 IRQ/PE1 XIRQ/PE0 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 PK3 PK2 PK1 PK0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 PK5 PK4 TXD2/KWJ1/PJ1 RXD2/KWJ0/PJ0 MODC/BKGD PB0 PB1 PB2 PB3 PB4 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KPW5/PWM5/MOSI2/TIMIOC5 PP6/KWP6/PWM6/SS2/TIMIOC6 PP7/KWP7/PWM7/SCK2/TIMIOC7 PK7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS7/SS0 PS6/SCK0 PS5/MOSI0 PS4/MISO0 PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 PM6/RXCAN3/RXCAN4/RXD3 PM7/TXCAN3/TXCAN4/TXD3 VSSA1 VRL Chapter 1 Device Overview MC9S12XE-Family Figure 1-6. MC9S12XE-Family Pin Assignments 112-pin LQFP Package MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 45 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KWP5/PWM5/MOSI2/TIMIOC5 PP7/KWP7/PWM7/SCK2/TIMIOC7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 VSSA1 VRL Chapter 1 Device Overview MC9S12XE-Family 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 MC9S12XE-Family 80QFP VRH VDDA1 PAD07/AN07 PAD06/AN06 PAD05/AN05 PAD04/AN04 PAD03/AN03 PAD02/AN02 PAD01/AN01 PAD00/AN00 VSS2 VDD PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 XIRQ/PE0 IRQ/PE1 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PB5 PB6 PB7 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL PE3 PE2 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 MODC/BKGD PB0 PB1 PB2 PB3 PB4 Figure 1-7. MC9S12XE-Family Pin Assignments 80-pin QFP Package MC9S12XE-Family Reference Manual , Rev. 1.21 46 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KWP5/PWM5/MOSI2/TIMIOC5 PP7/KWP7/PWM7/SCK2/TIMIOC7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 VSSA1 VRL Chapter 1 Device Overview MC9S12XE-Family 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 MC9S12XEA256 MC9S12XEA128 80QFP VRH VDDA1 PAD07/AN07 PAD06/AN06 PAD05/AN05 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PA3 PA2 PA1 PA0 XIRQ/PE0 IRQ/PE1 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PB5 PB6 PB7 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL PE3 PE2 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 MODC/BKGD PB0 PB1 PB2 PB3 PB4 Figure 1-8. MC9S12XEA256/MC9S12XEA128 80-pin QFP Package Pin Assignment NOTE SPECIAL BOND-OUT TO PROVIDE ACCESS TO EXTRA ADC CHANNELS IN 80QFP. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. THE MC9S12XET256 AND MC9S12XEG128 USE THE STANDARD 80QFP BOND-OUT, COMPATIBLE WITH OTHER FAMILY MEMBERS. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 47 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.2 Pin Assignment Overview Table 1-7 provides a summary of which Ports are available for each package option. Routing of pin functions is summarized in Table 1-8. Table 1-9 provides a pin out summary listing the availability of individual pins for each package option. MC9S12XE-Family Reference Manual , Rev. 1.21 48 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10 provides a list of individual pin functionality Table 1-7. Port Availability by Package Option Port 208 MAPBGA 144 LQFP 112 LQFP Standard 80 QFP XEA256(1) 80 QFP Port AD/ADC Channels 32/32 24/24 16/16 8/8 12/12 Port A pins 8 8 8 8 4 Port B pins 8 8 8 8 8 Port C pins 8 8 0 0 0 Port D pins 8 8 0 0 0 Port E pins inc. IRQ/XIRQ input only 8 8 8 8 8 Port F 8 0 0 0 0 Port H 8 8 8 0 0 Port J 8 7 4 2 2 Port K 8 8 7 0 0 Port L 8 0 0 0 0 Port M 8 8 8 6 6 Port P 8 8 8 7 7 Port R 8 0 0 0 0 Port S 8 8 8 4 4 Port T 8 8 8 8 8 Sum of Ports 152 119 91 59 59 I/O Power Pairs VDDX/VSSX 7/7 4/4 2/2 2/2 2/2 1. The 9S12XEA256 is a special bondout for access to extra ADC channels in 80QFP. Available in 80QFP / 256K memory size only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. The 9S12XET256 is the standard 256K/80QFP bondout, compatible with other family members. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 49 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family PF[0] TIM CS3 CS2 CS1 CS0 IIC1 IIC0 SPI2 SPI1 SPI0 SCI7 SCI6 SCI5 SCI4 SCI3 SCI2 SCI1 SCI0 CAN4 CAN3 CAN2 CAN1 CAN0 Table 1-8. Peripheral - Port Routing Options(1) X PF[1] X PF[2] X PF[3] X PF[5:4] X PF[7:6] X PH[1:0] O PH[3:2] X O PH[5:4] X O PH[7:6] X O PJ[0] O PJ[1] O X O PJ[2] O PJ[3] PJ[4] O PJ[5] O PJ[7:6] X O X PL[3:2] X PL[5:4] X PL[7:6] X PM[1:0] O PM[3:2] X PM[5:4] X PP[3:0] O O PL[1:0] PM[7:6] O O X O X O X X O O PP[7:4] X O PR[7:0] X O MC9S12XE-Family Reference Manual , Rev. 1.21 50 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family PS[1:0] TIM CS3 CS2 CS1 CS0 IIC1 IIC0 SPI2 SPI1 SPI0 SCI7 SCI6 SCI5 SCI4 SCI3 SCI2 SCI1 SCI0 CAN4 CAN3 CAN2 CAN1 CAN0 Table 1-8. Peripheral - Port Routing Options(1) (continued) O PS[3:2] O PS[7:4] O 1. “O” denotes reset condition, “X” denotes a possible rerouting under software control Table 1-9. Pin-Out Summary (Sheet 1 of 7) LQFP 144 LQFP 112 QFP(1) 80 D4 1 1 1 PP3 KWP3 PWM3 SS1 TIMIOC3 B2 2 2 2 PP2 KWP2 PWM2 SCK1 TIMIOC2 C2 3 3 3 PP1 KWP1 PWM1 MOSI1 TIMIOC1 D3 4 4 4 PP0 KWP0 PWM0 MISO1 TIMIOC0 PJ3 KWJ3 208 MAPBGA D2 Pin 2nd Func. 3rd Func. C1 5 PJ2 KWJ2 CS1 E4 6 PK6 ADDR22 ACC2 E2 7 5 PK3 ADDR19 IQSTAT3 E3 8 6 PK2 ADDR18 IQSTAT2 D1 9 7 PK1 ADDR17 IQSTAT1 E1 10 8 PK0 ADDR16 IQSTAT0 VDDX VDDX7 VSSX VSSX7 F3 11 9 5 F2 G4 12 10 6 F1 G1 13 11 7 G3 G2 14 12 8 H1 H4 15 13 9 PT0 IOC0 PR0 TIMIOC0 PT1 IOC1 PR1 TIMIOC1 PT2 IOC2 PR2 TIMIOC2 PT3 IOC3 PR3 TIMIOC3 4th Func. 5th Func. VDDF MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 51 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 2 of 7) LQFP 144 LQFP 112 QFP(1) 80 J4 16 14 10 VSS1 H3 17 15 11 PT4 IOC4 PR4 TIMIOC4 PT5 IOC5 PR5 TIMIOC5 PT6 IOC6 PR6 TIMIOC6 PT7 IOC7 PR7 TIMIOC7 208 MAPBGA H2 J1 18 16 12 J2 J3 19 17 13 K1 K2 20 18 14 K4 Pin 2nd Func. 3rd Func. 4th Func. VREGAPI L1 21 19 PK5 ADDR21 ACC1 K3 22 20 PK4 ADDR20 ACC0 L2 23 21 PJ1 KWJ1 TXD2 M1 24 22 PJ0 KWJ0 RXD2 CS3 L3 25 23 BKGD MODC VDDX 26 VDDX4 VSSX 27 VSSX4 M2 28 PC0 DATA8 M4 29 PC1 DATA9 N1 30 PC2 DATA10 N2 31 PC3 DATA11 P1 32 24 16 PB0 ADDR0 IVD0 UDS M3 33 25 17 PB1 ADDR1 IVD1 N3 34 26 18 PB2 ADDR2 IVD2 P2 35 27 19 PB3 ADDR3 IVD3 P3 36 28 20 PB4 ADDR4 IVD4 R2 37 29 21 PB5 ADDR5 IVD5 R3 38 30 22 PB6 ADDR6 IVD6 R4 39 31 23 PB7 ADDR7 IVD7 P4 40 PC4 DATA12 15 5th Func. MC9S12XE-Family Reference Manual , Rev. 1.21 52 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 3 of 7) 208 MAPBGA LQFP 144 LQFP 112 QFP(1) 80 Pin 2nd Func. T3 41 PC5 DATA13 R5 42 PC6 DATA14 N4 43 PC7 DATA15 PL3 TXD5 PH7 KWH7 PL2 RXD5 PH6 KWH6 PL1 TXD4 PH5 KWH5 PL0 RXD4 PH4 T4 T5 44 32 P5 R6 45 33 N5 T6 46 34 P6 3rd Func. 4th Func. SS2 TXD5 SCK2 RXD5 MOSI2 TXD4 KWH4 MISO2 RXD4 R7 47 35 T7 48 36 24 PE7 XCLKS ECLKX2 N6 49 37 25 PE6 MODB TAGHI R8 50 38 26 PE5 MODA TAGLO RE P7 51 39 27 PE4 ECLK VSSX 52 40 28 VSSX2 VDDX 53 41 29 VDDX2 P8 54 42 30 RESET N8 55 43 31 VDDR N9 56 44 32 VSS3 R9/T8 57 45 33 VSSPLL T9 58 46 34 EXTAL T10 59 47 35 XTAL R10/T11 60 48 36 VDDPLL SS1 TXD7 SCK1 RXD7 P9 N10 61 49 P10 R11 62 T12 50 PL7 TXD7 PH3 KWH3 PL6 RXD7 PH2 KWH2 PL5 TXD6 5th Func. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 53 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 4 of 7) 208 MAPBGA N11 LQFP 144 LQFP 112 63 51 QFP(1) 80 R12 52 Pin 2nd Func. PH1 KWH1 PL4 RXD6 PH0 KWH0 P11 64 T13 65 PD0 DATA0 R13 66 PD1 DATA1 T14 67 PD2 DATA2 R14 68 PD3 DATA3 VDDX VDDX5 VSSX VSSX5 3rd Func. 4th Func. MOSI1 TXD6 MISO1 RXD6 EROMCTL R15 69 53 37 PE3 LSTRB LDS P12 70 54 38 PE2 RW WE N13 71 55 39 PE1 IRQ P13 72 56 40 PE0 XIRQ P14 73 57 41 PA0 ADDR8 IVD8 N14 74 58 42 PA1 ADDR9 IVD9 M14 75 59 43 PA2 ADDR10 IVD10 P15 76 60 44 PA3 ADDR11 IVD11 P16 77 61 45 PA4 ADDR12 IVD12 N15 78 62 46 PA5 ADDR13 IVD13 M13 79 63 47 PA6 ADDR14 IVD14 N16 80 64 48 PA7 ADDR15 IVD15 VSSX 81 VSSX3 VDDX 82 VDDX3 L14 83 PD4 DATA4 M15 84 PD5 DATA5 M16 85 PD6 DATA6 K14 86 PD7 DATA7 K13 87 65 49 VDD J13 88 66 50 VSS2 5th Func. MC9S12XE-Family Reference Manual , Rev. 1.21 54 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 5 of 7) LQFP 144 LQFP 112 QFP(1) 80 L15 89 67 51 L16 90 68 208 MAPBGA Pin 2nd Func. PAD00 AN00 PAD08 AN08 PAD24 AN24 PAD01 AN01 PAD09 AN09 PAD25 AN25 PAD02 AN02 PAD10 AN10 H14 PAD26 AN26 H13 VSSA2 G13 VDDA2 K15 K16 91 69 J14 92 70 52 J15 J16 93 71 H16 94 72 H15 95 73 G16 96 74 53 54 F16 G15 97 75 G14 98 76 55 E16 F14 99 77 F15 100 78 56 D16 E15 101 79 C16 102 80 57 D15 C15 103 81 E14 104 82 58 B15 PAD03 AN03 PAD11 AN11 PAD27 AN27 PAD04 AN04 PAD12 AN12 PAD28 AN28 PAD05 AN05 PAD13 AN13 PAD29 AN29 PAD06 AN06 PAD14 AN14 PAD30 AN30 PAD07 AN07 PAD15 AN15 PAD31 AN31 C14 105 PAD16 AN16 D14 106 PAD17 AN17 F13 107 83 59 3rd Func. 4th Func. 5th Func. VDDA1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 55 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 6 of 7) LQFP 144 LQFP 112 QFP(1) 80 D13 108 84 60 VRH C13 109 85 61 VRL E13 110 86 62 VSSA1 B14 111 PAD18 AN18 A14 112 PAD19 AN19 C12 113 PAD20 AN20 B13 114 PAD21 AN21 D12 115 PAD22 AN22 B12 116 PAD23 AN23 C11 117 87 PM7 TXCAN3 TXCAN4 TXD3 A13 118 88 PM6 RXCAN3 RXCAN4 RXD3 D11 119 89 63 PS0 RXD0 B11 120 90 64 PS1 TXD0 C10 121 91 65 PS2 RXD1 A12 122 92 66 PS3 TXD1 208 MAPBGA Pin VSSX VSSX6 VDDX VDDX6 2nd Func. 3rd Func. 4th Func. 5th Func. B10 123 93 PS4 MISO0 A11 124 94 PS5 MOSI0 A10 125 95 PS6 SCK0 C9 126 96 PS7 SS0 B9 127 97 67 TEST D9 128 98 68 PJ7 KWJ7 TXCAN4 SCL0 TXCAN0 A9 129 99 69 PJ6 KWJ6 RXCAN4 SDA0 RXCAN0 C8 130 PJ5 KWJ5 SCL1 CS2 PF0 CS0 PJ4 KWJ4 SDA1 CS0 PF1 CS1 PM5 TXCAN2 TXCAN0 TXCAN4 B8 D8 131 A8 D7 132 100 70 SCK0 MC9S12XE-Family Reference Manual , Rev. 1.21 56 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 7 of 7) 208 MAPBGA LQFP 144 LQFP 112 QFP(1) 80 B7 C7 133 101 71 A7 D6 134 102 72 B6 C6 135 103 73 A6 A5 136 104 74 B5 A4 137 105 75 B4 Pin 2nd Func. PF2 CS2 PM4 RXCAN2 PF3 CS3 PM3 TXCAN1 PF4 SDA0 PM2 RXCAN1 PF5 SCL0 PM1 TXCAN0 PF6 RXD3 PM0 RXCAN0 PF7 TXD3 VSSX 138 106 76 VSSX1 VDDX 139 107 77 VDDX1 C5 140 108 A3 141 109 B3 142 110 C4 143 111 C3 144 112 3rd Func. 4th Func. 5th Func. RXCAN0 RXCAN4 MOSI0 TXCAN0 SS0 RXCAN0 MISO0 PK7 ROMCTL EWAIT PP7 KWP7 PWM7 SCK2 TIMIOC7 PP6 KWP6 PWM6 SS2 TIMIOC6 79 PP5 KWP5 PWM5 MOSI2 TIMIOC5 80 PP4 KWP4 PWM4 MISO2 TIMIOC4 78 1. Standard 80QFP only. NOTE that XEA256 80QFP is not compatible MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 57 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 1 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 Internal Pull Resistor Description CTRL Reset State EXTAL — — — — VDDPLL NA NA NA NA Oscillator pins XTAL — — — — VDDPLL RESET — — — — VDDX TEST — — — — N.A. RESET pin BKGD MODC — — — VDDX Always on PAD[31:16] AN[31:16] — — — VDDA PER0AD1 PER1AD1 Disabled Port AD inputs of ATD1, analog inputs of ATD1 PAD[15:0] AN[15:0] — — — VDDA PER0AD0 PER1AD0 Disabled Port AD inputs of ATD0, analog inputs of ATD0 PULLUP External reset DOWN Test input Up Background debug PA[7:0] ADDR[15:8] IVD[15:8] — — VDDX PUCR Disabled Port A I/O, address bus, internal visibility data PB[7:1] ADDR[7:1] IVD[7:0] — — VDDX PUCR Disabled Port B I/O, address bus, internal visibility data PB0 ADDR0 UDS VDDX PUCR Disabled Port B I/O, address bus, upper data strobe PC[7:0] DATA[15:8] — — — VDDX PUCR Disabled Port C I/O, data bus PD[7:0] DATA[7:0] — — — VDDX PUCR Disabled Port D I/O, data bus PE7 ECLKX2 XCLKS — — VDDX PUCR PE6 TAGHI MODB — — VDDX While RESET pin is low: down Port E I/O, tag high, mode input PE5 RE MODA TAGLO — VDDX While RESET pin is low: down Port E I/O, read enable, mode input, tag low input PE4 ECLK — — — VDDX PUCR Up Port E I/O, bus clock output PE3 LSTRB LDS EROMCTL — VDDX PUCR Up Port E I/O, low byte data strobe, EROMON control PE2 R/W WE — — VDDX PUCR Up Port E I/O, read/write PE1 IRQ — — — VDDX PUCR Up Port E Input, maskable interrupt PE0 XIRQ — — — VDDX PUCR Up Port E input, non-maskable interrupt PF7 TXD3 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, TXD of SCI3 PF6 RXD3 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, RXD of SCI3 PF5 SCL0 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, SCL of IIC0 PF4 SDA0 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, SDA of IIC0 PF3 CS3 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, chip select 3 Up Port E I/O, system clock output, clock select MC9S12XE-Family Reference Manual , Rev. 1.21 58 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 2 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 Internal Pull Resistor Description Reset State CTRL PF2 CS2 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, chip select 2 PF1 CS1 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, chip select 1 PF0 CS0 — — — VDDX PERF/ PPSF Up Port F I/O, interrupt, chip select 0 PH7 KWH7 SS2 TXD5 — VDDX PERH/ PPSH Disabled Port H I/O, interrupt, SS of SPI2, TXD of SCI5 PH6 KWH6 SCK2 RXD5 — VDDX PERH/ PPSH Disabled Port H I/O, interrupt, SCK of SPI2, RXD of SCI5 PH5 KWH5 MOSI2 TXD4 — VDDX PERH/ PPSH Disabled Port H I/O, interrupt, MOSI of SPI2, TXD of SCI4 PH4 KWH4 MISO2 RXD4 — VDDX PERH/PPSH Disabled Port H I/O, interrupt, MISO of SPI2, RXD of SCI4 PH3 KWH3 SS1 TXD7 — VDDX PERH/PPSH Disabled Port H I/O, interrupt, SS of SPI1 PH2 KWH2 SCK1 RXD7 — VDDX PERH/PPSH Disabled Port H I/O, interrupt, SCK of SPI1 PH1 KWH1 MOSI1 TXD6 — VDDX PERH/PPSH Disabled Port H I/O, interrupt, MOSI of SPI1 PH0 KWH0 MISO1 RXD6 — VDDX PERH/PPSH Disabled Port H I/O, interrupt, MISO of SPI1 PJ7 KWJ7 TXCAN4 SCL0 TXCAN0 VDDX PERJ/ PPSJ Up Port J I/O, interrupt, TX of CAN4, SCL of IIC0, TX of CAN0 PJ6 KWJ6 RXCAN4 SDA0 RXCAN0 VDDX PERJ/ PPSJ Up Port J I/O, interrupt, RX of CAN4, SDA of IIC0, RX of CAN0 PJ5 KWJ5 SCL1 CS2 — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, SCL of IIC1, chip select 2 PJ4 KWJ4 SDA1 CS0 — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, SDA of IIC1, chip select 0 PJ3 KWJ3 — — — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, PJ2 KWJ2 CS1 — — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, chip select 1 PJ1 KWJ1 TXD2 — — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, TXD of SCI2 PJ0 KWJ0 RXD2 CS3 — VDDX PERJ/ PPSJ Up Port J I/O, interrupt, RXD of SCI2 PK7 EWAIT ROMCTL — — VDDX PUCR Up Port K I/O, EWAIT input, ROM on control MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 59 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 3 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 Internal Pull Resistor Description CTRL Reset State PK[6:4] ADDR [22:20] ACC[2:0] — — VDDX PUCR Up Port K I/O, extended addresses, access source for external access PK[3:0] ADDR [19:16] IQSTAT [3:0] — — VDDX PUCR Up Extended address, PIPE status PL7 TXD7 — — — VDDX PERL/ PPSL Up Port L I/O, TXD of SCI7 PL6 RXD7 — — — VDDX PERL/ PPSL Up Port LI/O, RXD of SCI7 PL5 TXD6 — — — VDDX PERL/ PPSL Up Port L I/O, TXD of SCI6 PL4 RXD6 — — — VDDX PERL/ PPSL Up Port LI/O, RXD of SCI6 PL3 TXD5 — — — VDDX PERL/ PPSL Up Port L I/O, TXD of SCI5 PL2 RXD5 — — — VDDX PERL/ PPSL Up Port LI/O, RXD of SCI5 PL1 TXD4 — — — VDDX PERL/ PPSL Up Port L I/O, TXD of SCI4 PL0 RXD4 — — — VDDX PERL/ PPSL Up Port LI/O, RXD of SCI4 PM7 TXCAN3 TXD3 TXCAN4 — VDDX PERM/ PPSM PM6 RXCAN3 RXD3 RXCAN4 — VDDX PERM/PPSM Disabled Port M I/O RX of CAN3 and CAN4, RXD of SCI3 PM5 TXCAN2 TXCAN0 TXCAN4 SCK0 VDDX PERM/PPSM Disabled Port M I/OCAN0, CAN2, CAN4, SCK of SPI0 PM4 RXCAN2 RXCAN0 RXCAN4 MOSI0 VDDX PERM/PPSM Disabled Port M I/O, CAN0, CAN2, CAN4, MOSI of SPI0 PM3 TXCAN1 TXCAN0 SS0 — VDDX PERM/PPSM Disabled Port M I/O TX of CAN1, CAN0, SS of SPI0 PM2 RXCAN1 RXCAN0 MISO0 — VDDX PERM/PPSM Disabled Port M I/O, RX of CAN1, CAN0, MISO of SPI0 Disabled Port M I/O, TX of CAN3 and CAN4, TXD of SCI3 PM1 TXCAN0 — — VDDX PERM/PPSM Disabled Port M I/O, TX of CAN0 PM0 RXCAN0 — — VDDX PERM/PPSM Disabled Port M I/O, RX of CAN0 PP7 KWP7 PWM7 SCK2 TIMIOC7 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 7 of PWM/TIM , SCK of SPI2 PP6 KWP6 PWM6 SS2 TIMIOC6 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 6 of PWM/TIM, SS of SPI2 PP5 KWP5 PWM5 MOSI2 TIMIOC5 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 5 of PWM/TIM, MOSI of SPI2 MC9S12XE-Family Reference Manual , Rev. 1.21 60 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 4 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 Internal Pull Resistor Description Reset State CTRL PP4 KWP4 PWM4 MISO2 TIMIOC4 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 4 of PWM/TIM, MISO2 of SPI2 PP3 KWP3 PWM3 SS1 TIMIOC3 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 3 of PWM/TIM, SS of SPI1 PP2 KWP2 PWM2 SCK1 TIMIOC2 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 2 of PWM/TIM, SCK of SPI1 PP1 KWP1 PWM1 MOSI1 TIMIOC1 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 1 of PWM/TIM, MOSI of SPI1 PP0 KWP0 PWM0 MISO1 TIMIOC0 VDDX PERP/ PPSP Disabled Port P I/O, interrupt, channel 0 of PWM/TIM, MISO2 of SPI1 PR[7:0] TIMIOC [7:0] — — — VDDX PERR/ PPSR Disabled Port RI/O, TIM channels PS7 SS0 — — — VDDX PERS/ PPSS Up Port S I/O, SS of SPI0 PS6 SCK0 — — — VDDX PERS/ PPSS Up Port S I/O, SCK of SPI0 PS5 MOSI0 — — — VDDX PERS/ PPSS Up Port S I/O, MOSI of SPI0 PS4 MISO0 — — — VDDX PERS/ PPSS Up Port S I/O, MISO of SPI0 PS3 TXD1 — — — VDDX PERS/ PPSS Up Port S I/O, TXD of SCI1 PS2 RXD1 — — — VDDX PERS/ PPSS Up Port S I/O, RXD of SCI1 PS1 TXD0 — — — VDDX PERS/ PPSS Up Port S I/O, TXD of SCI0 PS0 RXD0 — — — VDDX PERS/ PPSS Up Port S I/O, RXD of SCI0 PT[7:6] IOC[7:6] — — — VDDX PERT/ PPST Disabled Port T I/O, ECT channels PT[5] IOC[5] VREGAPI — — VDDX PERT/ PPST Disabled Port T I/O, ECT channels PT[4:0] IOC[4:0] — — — VDDX PERT/ PPST Disabled Port T I/O, ECT channels MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 61 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3 Detailed Signal Descriptions NOTE The pin list of the largest package version of each MC9S12XE-Family derivative gives the complete of interface signals that also exist on smaller package options, although some of them are not bonded out. For devices assembled in smaller packages all non-bonded out pins should be configured as outputs after reset in order to avoid current drawn from floating inputs. Refer to Table 1-10 for affected pins. Particular attention is drawn to Port R, which does not have enabled pull-up/pull-down devices coming out of reset. 1.2.3.1 EXTAL, XTAL — Oscillator Pins EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived from the EXTAL input frequency. XTAL is the oscillator output. 1.2.3.2 RESET — External Reset Pin The RESET pin is an active low bidirectional control signal. It acts as an input to initialize the MCU to a known start-up state. As an output it is driven low to indicate when any internal MCU reset source triggers. The RESET pin has an internal pull-up device. 1.2.3.3 TEST — Test Pin This input only pin is reserved for test. This pin has a pull-down device. NOTE The TEST pin must be tied to VSS in all applications. 1.2.3.4 BKGD / MODC — Background Debug and Mode Pin The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit at the rising edge of RESET. The BKGD pin has a pull-up device. 1.2.3.5 PAD[15:0] / AN[15:0] — Port AD Input Pins of ATD0 PAD[15:0] are general-purpose input or output pins and analog inputs AN[15:0] of the analog-to-digital converter ATD0. 1.2.3.6 PAD[31:16] / AN[31:16] — Port AD Input Pins of ATD1 PAD[31:16] are general-purpose input or output pins and analog inputs AN[31:16] of the analog-to-digital converter ATD1. MC9S12XE-Family Reference Manual , Rev. 1.21 62 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.7 PA[7:0] / ADDR[15:8] / IVD[15:8] — Port A I/O Pins PA[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external address bus. In MCU emulation modes of operation, these pins are used for external address bus and internal visibility read data. 1.2.3.8 PB[7:1] / ADDR[7:1] / IVD[7:1] — Port B I/O Pins PB[7:1] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external address bus. In MCU emulation modes of operation, these pins are used for external address bus and internal visibility read data. 1.2.3.9 PB0 / ADDR0 / UDS / IVD[0] — Port B I/O Pin 0 PB0 is a general-purpose input or output pin. In MCU expanded modes of operation, this pin is used for the external address bus ADDR0 or as upper data strobe signal. In MCU emulation modes of operation, this pin is used for external address bus ADDR0 and internal visibility read data IVD0. 1.2.3.10 PC[7:0] / DATA [15:8] — Port C I/O Pins PC[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external data bus. The input voltage thresholds for PC[7:0] can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for PC[7:0] are configured to reduced levels out of reset in expanded and emulation modes. The input voltage thresholds for PC[7:0] are configured to 5-V levels out of reset in normal modes. 1.2.3.11 PD[7:0] / DATA [7:0] — Port D I/O Pins PD[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external data bus. The input voltage thresholds for PD[7:0] can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for PD[7:0] are configured to reduced levels out of reset in expanded and emulation modes. The input voltage thresholds for PC[7:0] are configured to 5-V levels out of reset in normal modes. 1.2.3.12 PE7 / ECLKX2 / XCLKS — Port E I/O Pin 7 PE7 is a general-purpose input or output pin. ECLKX2 is a free running clock of twice the internal bus frequency, available by default in emulation modes and when enabled in other modes. The XCLKS is an input signal which controls whether a crystal in combination with the internal loop controlled Pierce oscillator is used or whether full swing Pierce oscillator/external clock circuitry is used (refer to Oscillator Configuration). An internal pullup is enabled during reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 63 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.13 PE6 / MODB / TAGHI — Port E I/O Pin 6 PE6 is a general-purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is an input with a pull-down device which is only active when RESET is low. TAGHI is used to tag the high half of the instruction word being read into the instruction queue. The input voltage threshold for PE6 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE6 is configured to reduced levels out of reset in expanded and emulation modes. 1.2.3.14 PE5 / MODA / TAGLO / RE — Port E I/O Pin 5 PE5 is a general-purpose input or output pin. It is used as an MCU operating mode select pin during reset. The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the read enable RE output. This pin is an input with a pull-down device which is only active when RESET is low. TAGLO is used to tag the low half of the instruction word being read into the instruction queue. The input voltage threshold for PE5 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE5 is configured to reduced levels out of reset in expanded and emulation modes. 1.2.3.15 PE4 / ECLK — Port E I/O Pin 4 PE4 is a general-purpose input or output pin. It can be configured to drive the internal bus clock ECLK. ECLK can be used as a timing reference. The ECLK output has a programmable prescaler. 1.2.3.16 PE3 / LSTRB / LDS / EROMCTL— Port E I/O Pin 3 PE3 is a general-purpose input or output pin. In MCU expanded modes of operation, LSTRB or LDS can be used for the low byte strobe function to indicate the type of bus access. At the rising edge of RESET the state of this pin is latched to the EROMON bit. 1.2.3.17 PE2 / R/W / WE— Port E I/O Pin 2 PE2 is a general-purpose input or output pin. In MCU expanded modes of operations, this pin drives the read/write output signal or write enable output signal for the external bus. It indicates the direction of data on the external bus. 1.2.3.18 PE1 / IRQ — Port E Input Pin 1 PE1 is a general-purpose input pin and the maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode. 1.2.3.19 PE0 / XIRQ — Port E Input Pin 0 PE0 is a general-purpose input pin and the non-maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode. The XIRQ MC9S12XE-Family Reference Manual , Rev. 1.21 64 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family interrupt is level sensitive and active low. As XIRQ is level sensitive, while this pin is low the MCU will not enter STOP mode. 1.2.3.20 PF7 / TXD3 — Port F I/O Pin 7 PF7 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 3 (SCI3). 1.2.3.21 PF6 / RXD3 — Port F I/O Pin 6 PF6 is a general-purpose input or output pin. It can be configured as the transmit pin RXD of serial communication interface 3 (SCI3). 1.2.3.22 PF5 / SCL0 — Port F I/O Pin 5 PF5 is a general-purpose input or output pin. It can be configured as the serial clock pin SCL of the IIC0 module. 1.2.3.23 PF4 / SDA0 — Port F I/O Pin 4 PF4 is a general-purpose input or output pin. It can be configured as the serial data pin SDA of the IIC0 module. 1.2.3.24 PF[3:0] / CS[3:0] — Port F I/O Pins 3 to 0 PF[3:0] are a general-purpose input or output pins. They can be configured as chip select outputs [3:0]. 1.2.3.25 PH7 / KWH7 / SS2 / TXD5 — Port H I/O Pin 7 PH7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as slave select pin SS of the serial peripheral interface 2 (SPI2). It can be configured as the transmit pin TXD of serial communication interface 5 (SCI5). 1.2.3.26 PH6 / KWH6 / SCK2 / RXD5 — Port H I/O Pin 6 PH6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as serial clock pin SCK of the serial peripheral interface 2 (SPI2). It can be configured as the receive pin (RXD) of serial communication interface 5 (SCI5). 1.2.3.27 PH5 / KWH5 / MOSI2 / TXD4 — Port H I/O Pin 5 PH5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 2 (SPI2). It can be configured as the transmit pin TXD of serial communication interface 4 (SCI4). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 65 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.28 PH4 / KWH4 / MISO2 / RXD4 — Port H I/O Pin 4 PH4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 2 (SPI2). It can be configured as the receive pin RXD of serial communication interface 4 (SCI4). 1.2.3.29 PH3 / KWH3 / SS1 — Port H I/O Pin 3 PH3 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as slave select pin SS of the serial peripheral interface 1 (SPI1). It can also be configured as the transmit pin TXD of serial communication interface 7 (SCI7). 1.2.3.30 PH2 / KWH2 / SCK1 — Port H I/O Pin 2 PH2 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as serial clock pin SCK of the serial peripheral interface 1 (SPI1). It can be configured as the receive pin RXD of serial communication interface 7 (SCI7). 1.2.3.31 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1 PH1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 1 (SPI1). It can also be configured as the transmit pin TXD of serial communication interface 6 (SCI6). 1.2.3.32 PH0 / KWH0 / MISO1 — Port H I/O Pin 0 PH0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 1 (SPI1). It can be configured as the receive pin RXD of serial communication interface 6 (SCI6). 1.2.3.33 PJ7 / KWJ7 / TXCAN4 / SCL0 / TXCAN0— PORT J I/O Pin 7 PJ7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the transmit pin TXCAN for the scalable controller area network controller 0 or 4 (CAN0 or CAN4) or as the serial clock pin SCL of the IIC0 module. 1.2.3.34 PJ6 / KWJ6 / RXCAN4 / SDA0 / RXCAN0 — PORT J I/O Pin 6 PJ6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the receive pin RXCAN for the scalable controller area network controller 0 or 4 (CAN0 or CAN4) or as the serial data pin SDA of the IIC0 module. MC9S12XE-Family Reference Manual , Rev. 1.21 66 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.35 PJ5 / KWJ5 / SCL1 / CS2 — PORT J I/O Pin 5 PJ5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the serial clock pin SCL of the IIC1 module. It can be also configured as chip-select output 2. 1.2.3.36 PJ4 / KWJ4 / SDA1 / CS0 — PORT J I/O Pin 4 PJ4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the serial data pin SDA of the IIC1 module. It can also be configured as chip-select output. 1.2.3.37 PJ3 / KWJ3 — PORT J I/O Pin 3 PJ3 is a general-purpose input or output pins. It can be configured as a keypad wakeup input. 1.2.3.38 PJ2 / KWJ2 / CS1 — PORT J I/O Pin 2 PJ2 is a general-purpose input or output pins. It can be configured as a keypad wakeup input. It can also be configured as chip-select output. 1.2.3.39 PJ1 / KWJ1 / TXD2 — PORT J I/O Pin 1 PJ1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the transmit pin TXD of the serial communication interface 2 (SCI2). 1.2.3.40 PJ0 / KWJ0 / RXD2 / CS3 — PORT J I/O Pin 0 PJ0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the receive pin RXD of the serial communication interface 2 (SCI2).It can also be configured as chip-select output 3. 1.2.3.41 PK7 / EWAIT / ROMCTL — Port K I/O Pin 7 PK7 is a general-purpose input or output pin. During MCU emulation modes and normal expanded modes of operation, this pin is used to enable the Flash EEPROM memory in the memory map (ROMCTL). At the rising edge of RESET, the state of this pin is latched to the ROMON bit. The EWAIT input signal maintains the external bus access until the external device is ready to capture data (write) or provide data (read). The input voltage threshold for PK7 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. 1.2.3.42 PK[6:4] / ADDR[22:20] / ACC[2:0] — Port K I/O Pin [6:4] PK[6:4] are general-purpose input or output pins. During MCU expanded modes of operation, the ACC[2:0] signals are used to indicate the access source of the bus cycle. These pins also provide the expanded addresses ADDR[22:20] for the external bus. In Emulation modes ACC[2:0] is available and is time multiplexed with the high addresses MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 67 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.43 PK[3:0] / ADDR[19:16] / IQSTAT[3:0] — Port K I/O Pins [3:0] PK3-PK0 are general-purpose input or output pins. In MCU expanded modes of operation, these pins provide the expanded address ADDR[19:16] for the external bus and carry instruction pipe information. 1.2.3.44 PL7 / TXD7 — Port L I/O Pin 7 PL7 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 7 (SCI7). 1.2.3.45 PL6 / RXD7 — Port L I/O Pin 6 PL6 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 7 (SCI7). 1.2.3.46 PL5 / TXD6 — Port L I/O Pin 5 PL5 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 6 (SCI6). 1.2.3.47 PL4 / RXD6 — Port L I/O Pin 4 PL4 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 6 (SCI6). 1.2.3.48 PL3 / TXD5 — Port L I/O Pin 3 PL3 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 5 (SCI5). 1.2.3.49 PL2 / RXD5 — Port L I/O Pin 2 PL2 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 5 (SCI5). 1.2.3.50 PL1 / TXD4 — Port L I/O Pin 1 PL1 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 4 (SCI4). 1.2.3.51 PL0 / RXD4 — Port L I/O Pin 0 PL0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 4 (SCI4). MC9S12XE-Family Reference Manual , Rev. 1.21 68 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.52 PM7 / TXCAN3 / TXCAN4 / TXD3 — Port M I/O Pin 7 PM7 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM7 can be configured as the transmit pin TXD3 of the serial communication interface 3 (SCI3). 1.2.3.53 PM6 / RXCAN3 / RXCAN4 / RXD3 — Port M I/O Pin 6 PM6 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM6 can be configured as the receive pin RXD3 of the serial communication interface 3 (SCI3). 1.2.3.54 PM5 / TXCAN0 / TXCAN2 / TXCAN4 / SCK0 — Port M I/O Pin 5 PM5 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controllers 0, 2 or 4 (CAN0, CAN2, or CAN4). It can be configured as the serial clock pin SCK of the serial peripheral interface 0 (SPI0). 1.2.3.55 PM4 / RXCAN0 / RXCAN2 / RXCAN4 / MOSI0 — Port M I/O Pin 4 PM4 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controllers 0, 2, or 4 (CAN0, CAN2, or CAN4). It can be configured as the master output (during master mode) or slave input pin (during slave mode) MOSI for the serial peripheral interface 0 (SPI0). 1.2.3.56 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3 PM3 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the slave select pin SS of the serial peripheral interface 0 (SPI0). 1.2.3.57 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2 PM2 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the master input (during master mode) or slave output pin (during slave mode) MISO for the serial peripheral interface 0 (SPI0). 1.2.3.58 PM1 / TXCAN0 — Port M I/O Pin 1 PM1 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controller 0 (CAN0). 1.2.3.59 PM0 / RXCAN0 — Port M I/O Pin 0 PM0 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controller 0 (CAN0). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 69 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.60 PP7 / KWP7 / PWM7 / SCK2 / TIMIOC7— Port P I/O Pin 7 PP7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 7 output, TIM channel 7, or as serial clock pin SCK of the serial peripheral interface 2 (SPI2). 1.2.3.61 PP6 / KWP6 / PWM6 / SS2 / TIMIOC6— Port P I/O Pin 6 PP6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 6 output, TIM channel 6 or as the slave select pin SS of the serial peripheral interface 2 (SPI2). 1.2.3.62 PP5 / KWP5 / PWM5 / MOSI2 / TIMIOC5— Port P I/O Pin 5 PP5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 5 output, TIM channel 5 or as the master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 2 (SPI2). 1.2.3.63 PP4 / KWP4 / PWM4 / MISO2 / TIMIOC4— Port P I/O Pin 4 PP4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 4 output, TIM channel 4 or as the master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 2 (SPI2). 1.2.3.64 PP3 / KWP3 / PWM3 / SS1 / TIMIOC3— Port P I/O Pin 3 PP3 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 3 output, TIM channel 3, or as the slave select pin SS of the serial peripheral interface 1 (SPI1). 1.2.3.65 PP2 / KWP2 / PWM2 / SCK1 / TIMIOC2— Port P I/O Pin 2 PP2 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 2 output, TIM channel 2, or as the serial clock pin SCK of the serial peripheral interface 1 (SPI1). 1.2.3.66 PP1 / KWP1 / PWM1 / MOSI1 / TIMIOC1— Port P I/O Pin 1 PP1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 1 output, TIM channel 1, or master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 1 (SPI1). MC9S12XE-Family Reference Manual , Rev. 1.21 70 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.67 PP0 / KWP0 / PWM0 / MISO1 / TIMIOC0— Port P I/O Pin 0 PP0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 0 output, TIM channel 0 or as the master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 1 (SPI1). 1.2.3.68 PR[7:0] / TIMIOC[7:0] — Port R I/O Pins [7:0] PR[7:0] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[7:0] of the standard timer (TIM). 1.2.3.69 PS7 / SS0 — Port S I/O Pin 7 PS7 is a general-purpose input or output pin. It can be configured as the slave select pin SS of the serial peripheral interface 0 (SPI0). 1.2.3.70 PS6 / SCK0 — Port S I/O Pin 6 PS6 is a general-purpose input or output pin. It can be configured as the serial clock pin SCK of the serial peripheral interface 0 (SPI0). 1.2.3.71 PS5 / MOSI0 — Port S I/O Pin 5 PS5 is a general-purpose input or output pin. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0). 1.2.3.72 PS4 / MISO0 — Port S I/O Pin 4 PS4 is a general-purpose input or output pin. It can be configured as master input (during master mode) or slave output pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0). 1.2.3.73 PS3 / TXD1 — Port S I/O Pin 3 PS3 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 1 (SCI1). 1.2.3.74 PS2 / RXD1 — Port S I/O Pin 2 PS2 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 1 (SCI1). 1.2.3.75 PS1 / TXD0 — Port S I/O Pin 1 PS1 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 0 (SCI0). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 71 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.76 PS0 / RXD0 — Port S I/O Pin 0 PS0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 0 (SCI0). 1.2.3.77 PT[7:6] / IOC[7:6] — Port T I/O Pins [7:6] PT[7:6] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[7:6] of the enhanced capture timer (ECT). 1.2.3.78 PT[5] / IOC[5] / VREG_API— Port T I/O Pins [5] PT[5] is a general-purpose input or output pin. It can be configured as input capture or output compare pin IOC[5] of the enhanced capture timer (ECT) or can be configured to output the VREG_API signal. 1.2.3.79 PT[4:0] / IOC[4:0] — Port T I/O Pins [4:0] PT[4:0] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[4:0] of the enhanced capture timer (ECT). 1.2.4 Power Supply Pins MC9S12XE-Family power and ground pins are described below. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. NOTE All VSS pins must be connected together in the application. 1.2.4.1 VDDX[7:1], VSSX[7:1] — Power and Ground Pins for I/O Drivers External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are loaded. All VDDX pins are connected together internally. All VSSX pins are connected together internally. 1.2.4.2 VDDR — Power Pin for Internal Voltage Regulator Input to the internal voltage regulator. The internal voltage regulator is turned off, if VDDR is tied to ground 1.2.4.3 VDD, VSS1,VSS2,VSS3 — Core Power Pins Power is supplied to the MCU core from the internal voltage regulator, whose load capacitor must be connected to VDD. The voltage supply of nominally 1.8V is derived from the internal voltage regulator. The return current path is through the VSS1,VSS2 and VSS3 pins. No static external loading of these pins is permitted. MC9S12XE-Family Reference Manual , Rev. 1.21 72 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.4.4 VDDF — NVM Power Pin Power is supplied to the MCU NVM through VDDF . The voltage supply of nominally 2.8V is derived from the internal voltage regulator. No static external loading of these pins is permitted. 1.2.4.5 VDDA2, VDDA1, VSSA2, VSSA1 — Power Supply Pins for ATD and Voltage Regulator These are the power supply and ground input pins for the analog-to-digital converters and the voltage regulator. Internally the VDDA pins are connected together. Internally the VSSA pins are connected together. 1.2.4.6 VRH, VRL — ATD Reference Voltage Input Pins VRH and VRL are the reference voltage input pins for the analog-to-digital converter. 1.2.4.7 VDDPLL, VSSPL — Power Supply Pins for PLL These pins provide operating voltage and ground for the oscillator and the phased-locked loop. The voltage supply of nominally 1.8V is derived from the internal voltage regulator. This allows the supply voltage to the oscillator and PLL to be bypassed independently. This voltage is generated by the internal voltage regulator. No static external loading of these pins is permitted. Table 1-11. Power and Ground Connection Summary Mnemonic Nominal Voltage VDDR 5.0 V External power supply to internal voltage regulator VDDX[7:1] 5.0 V VSSX[7:1] 0V External power and ground, supply to pin drivers VDDA2, VDDA1 5.0 V VSSA2, VSSA1 0V VRL 0V VRH 5.0 V VDD 1.8 V VSS1, VSS2, VSS3 0V VDDF 2.8 V Description Operating voltage and ground for the analog-to-digital converters and the reference for the internal voltage regulator, allows the supply voltage to the A/D to be bypassed independently. Reference voltages for the analog-to-digital converter. Internal power and ground generated by internal regulator for the internal core. Internal power and ground generated by internal regulator for the internal NVM. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 73 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-11. Power and Ground Connection Summary (continued) Mnemonic Nominal Voltage VDDPLL 1.8 V VSSPLL 0V Description Provides operating voltage and ground for the phased-locked loop. This allows the supply voltage to the PLL to be bypassed independently. Internal power and ground generated by internal regulator. MC9S12XE-Family Reference Manual , Rev. 1.21 74 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.3 System Clock Description The clock and reset generator module (CRG) provides the internal clock signals for the core and all peripheral modules. Figure 1-9 shows the clock connections from the CRG to all modules. Consult the CRG specification for details on clock generation. SCI0 . . SCI 7 CAN0 . . CAN4 SPI0 . . SPI2 IIC0 & IIC1 ATD0 & ATD1 Bus Clock PIT EXTAL Oscillator Clock ECT CRG PIM XTAL Core Clock PWM RAM S12X XGATE FLASH & EEE TIM Figure 1-9. Clock Connections The system clock can be supplied in several ways enabling a range of system operating frequencies to be supported: • The on-chip phase locked loop (PLL) • the PLL self clocking • the oscillator The clock generated by the PLL or oscillator provides the main system clock frequencies core clock and bus clock. As shown in Figure 1-9, these system clocks are used throughout the MCU to drive the core, the memories, and the peripherals. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 75 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The program Flash memory and the EEPROM are supplied by the bus clock and the oscillator clock. The oscillator clock is used as a time base to derive the program and erase times for the NVM’s. The CAN modules may be configured to have their clock sources derived either from the bus clock or directly from the oscillator clock. This allows the user to select its clock based on the required jitter performance. In order to ensure the presence of the clock the MCU includes an on-chip clock monitor connected to the output of the oscillator. The clock monitor can be configured to invoke the PLL self-clocking mode or to generate a system reset if it is allowed to time out as a result of no oscillator clock being present. In addition to the clock monitor, the MCU also provides a clock quality checker which performs a more accurate check of the clock. The clock quality checker counts a predetermined number of clock edges within a defined time window to insure that the clock is running. The checker can be invoked following specific events such as on wake-up or clock monitor failure. 1.4 Modes of Operation The MCU can operate in different modes associated with MCU resource mapping and bus interface configuration. These are described in 1.4.1 Chip Configuration Summary. The MCU can operate in different power modes to facilitate power saving when full system performance is not required. These are described in 1.4.2 Power Modes. Some modules feature a software programmable option to freeze the module status whilst the background debug module is active to facilitate debugging. This is described in 1.4.3 Freeze Mode. For system integrity support separate system states are featured as explained in 1.4.4 System States. 1.4.1 Chip Configuration Summary The MCU can operate in six different modes associated with resource configuration. The different modes, the state of ROMCTL and EROMCTL signal on rising edge of RESET and the security state of the MCU affect the following device characteristics: • External bus interface configuration • Flash in memory map, or not • Debug features enabled or disabled The operating mode out of reset is determined by the states of the MODC, MODB, and MODA signals during reset (see Table 1-12). The MODC, MODB, and MODA bits in the MODE register show the current operating mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA signals are latched into these bits on the rising edge of RESET. In normal expanded mode and in emulation modes the ROMON bit and the EROMON bit in the MMCCTL1 register defines if the on chip flash memory is the memory map, or not. (See Table 1-12.) For a detailed explanation of the ROMON and EROMON bits refer to the MMC description. MC9S12XE-Family Reference Manual , Rev. 1.21 76 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The state of the ROMCTL signal is latched into the ROMON bit in the MMCCTL1 register on the rising edge of RESET. The state of the EROMCTL signal is latched into the EROMON bit in the MMCCTL1 register on the rising edge of RESET. Table 1-12. Chip Modes and Data Sources Chip Modes Data Source(1) MODC MODB MODA ROMCTL EROMCTL Normal single chip 1 0 0 X X Internal Special single chip 0 0 0 Emulation single chip 0 0 1 X 0 Emulation memory X 1 Internal Flash Normal expanded Emulation expanded Special test 1 0 0 0 1 1 1 1 0 0 X External application 1 X Internal Flash 0 X External application 1 0 Emulation memory 1 1 Internal Flash 0 X External application 1 X Internal Flash 1. Internal means resources inside the MCU are read/written. Internal Flash means Flash resources inside the MCU are read/written. Emulation memory means resources inside the emulator are read/written (PRU registers, Flash replacement, RAM, EEPROM, and register space are always considered internal). External application means resources residing outside the MCU are read/written. 1.4.1.1 Normal Expanded Mode Ports K, A, and B are configured as a 23-bit address bus, ports C and D are configured as a 16-bit data bus, and port E provides bus control and status signals. This mode allows 16-bit external memory and peripheral devices to be interfaced to the system. The fastest external bus rate is divide by 2 from the internal bus rate. 1.4.1.2 Normal Single-Chip Mode There is no external bus in this mode. The processor program is executed from internal memory. Ports A, B,C,D, K, and most pins of port E are available as general-purpose I/O. 1.4.1.3 Special Single-Chip Mode This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The background debug module BDM is active in this mode. The CPU executes a monitor program located in an on-chip ROM. BDM firmware waits for additional serial commands through the BKGD pin. There is no external bus after reset in this mode. 1.4.1.4 Emulation of Expanded Mode Developers use this mode for emulation systems in which the users target application is normal expanded mode. Code is executed from external memory or from internal memory depending on the state of ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 77 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.4.1.5 Emulation of Single-Chip Mode Developers use this mode for emulation systems in which the user’s target application is normal singlechip mode. Code is executed from external memory or from internal memory depending on the state of ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface. 1.4.1.6 Special Test Mode This is for Freescale internal use only. 1.4.2 Power Modes The MCU features two main low-power modes. Consult the respective module description for module specific behavior in system stop, system pseudo stop, and system wait mode. An important source of information about the clock system is the Clock and Reset Generator description (CRG). 1.4.2.1 System Stop Modes The system stop modes are entered if the CPU executes the STOP instruction unless either the XGATE is active or an NVM command is active. The XGATE is active if it executes a thread or the XGFACT bit in the XGMCTL register is set. Depending on the state of the PSTP bit in the CLKSEL register the MCU goes into pseudo stop mode or full stop mode. Please refer to CRG description. Asserting RESET, XIRQ, IRQ or any other interrupt that is not masked exits system stop modes. System stop modes can be exited by XGATE or CPU activity independently, depending on the configuration of the interrupt request. If System-Stop is exited on an XGATE request then, as long as the XGATE does not set an interrupt flag on the CPU and the XGATE fake activity bit (FACT) remains cleared, once XGATE activity is completed System Stop mode will automatically be re-entered. If the CPU executes the STOP instruction whilst XGATE is active or an NVM command is being processed, then the system clocks continue running until XGATE/NVM activity is completed. If a nonmasked interrupt occurs within this time then the system does not effectively enter stop mode although the STOP instruction has been executed. 1.4.2.2 Full Stop Mode The oscillator is stopped in this mode. By default all clocks are switched off and all counters and dividers remain frozen. The Autonomous Periodic Interrupt (API) and ATD modules may be enabled to self wake the device. A Fast wake up mode is available to allow the device to wake from Full Stop mode immediately on the PLL internal clock without starting the oscillator clock. 1.4.2.3 Pseudo Stop Mode In this mode the system clocks are stopped but the oscillator is still running and the real time interrupt (RTI) and watchdog (COP), API and ATD modules may be enabled. Other peripherals are turned off. This mode consumes more current than system stop mode but, as the oscillator continues to run, the full speed wake up time from this mode is significantly shorter. MC9S12XE-Family Reference Manual , Rev. 1.21 78 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.4.2.4 XGATE Fake Activity Mode This mode is entered if the CPU executes the STOP instruction when the XGATE is not executing a thread and the XGFACT bit in the XGMCTL register is set. The oscillator remains active and any enabled peripherals continue to function. 1.4.2.5 Wait Mode This mode is entered when the CPU executes the WAI instruction. In this mode the CPU will not execute instructions. The internal CPU clock is switched off. All peripherals and the XGATE can be active in system wait mode. For further power consumption the peripherals can individually turn off their local clocks. Asserting RESET, XIRQ, IRQ or any other interrupt that is not masked and is not routed to XGATE ends system wait mode. 1.4.2.6 Run Mode Although this is not a low-power mode, unused peripheral modules should not be enabled in order to save power. 1.4.3 Freeze Mode The enhanced capture timer, pulse width modulator, analog-to-digital converters, and the periodic interrupt timer provide a software programmable option to freeze the module status when the background debug module is active. This is useful when debugging application software. For detailed description of the behavior of the ATD0, ATD1, ECT, PWM, and PIT when the background debug module is active consult the corresponding Block Guides. 1.4.4 System States To facilitate system integrity the MCU can run in Supervisor state or User state. The System States strategy is implemented by additional features on the S12X CPU and a Memory Protection Unit. This is designed to support restricted access for code modules executed by kernels or operating systems supporting access control to system resources. The current system state is indicated by the U bit in the CPU condition code register. In User state certain CPU instructions are restricted. See the CPU reference guide for details of the U bit and of those instructions affected by User state. In the case that software task accesses resources outside those defined for it in the MPU a non-maskable interrupt is generated. 1.4.4.1 Supervisor State This state is intended for configuring the MPU for different tasks that are then executed in User state, returning to Supervisor state on completion of each task. This is the default ’state’ following reset and can be re-entered from User state by an exception (interrupt). If the SVSEN bit in the MPUSEL register of the MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 79 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family MPU is set, access to system resources is only allowed if enabled by a memory range descriptor as defined in the Memory Protection Unit (MPU) description. 1.4.4.2 User State This state is intended for carrying out system tasks and is entered by setting the U bit of the condition codes register while in Supervisor state. Restrictions apply for the execution of several CPU instructions in User state and access to system resources is only allowed in if enabled by a memory range descriptor as defined in the Memory Protection Unit (MPU) description. 1.5 Security The MCU security feature allows the protection of the on chip Flash and emulated EEPROM memory. For a detailed description of the security features refer to the S12X9SEC description. 1.6 Resets and Interrupts Consult the S12XCPU manual and the S12XINT description for information on exception processing. 1.6.1 Resets Resets are explained in detail in the Clock Reset Generator (CRG) description. Table 1-13. Reset Sources and Vector Locations 1.6.2 Vector Address Reset Source CCR Mask Local Enable $FFFE Power-On Reset (POR) None None $FFFE Low Voltage Reset (LVR) None None $FFFE External pin RESET None None $FFFE Illegal Address Reset None None $FFFC Clock monitor reset None PLLCTL (CME, SCME) $FFFA COP watchdog reset None COP rate select Vectors Table 1-14 lists all interrupt sources and vectors in the default order of priority. The interrupt module (S12XINT) provides an interrupt vector base register (IVBR) to relocate the vectors. Associated with each I-bit maskable service request is a configuration register. It selects if the service request is enabled, the service request priority level and whether the service request is handled either by the S12X CPU or by the XGATE module. MC9S12XE-Family Reference Manual , Rev. 1.21 80 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 1 of 4) Vector Address(1) XGATE Channel ID(2) Interrupt Source CCR Mask Local Enable Vector base + $F8 — Unimplemented instruction trap None None — — Vector base+ $F6 — SWI None None — — Vector base+ $F4 — XIRQ X Bit None Yes Yes Vector base+ $F2 — IRQ I bit IRQCR (IRQEN) Yes Yes Vector base+ $F0 $78 Real time interrupt I bit CRGINT (RTIE) Vector base+ $EE $77 Enhanced capture timer channel 0 I bit TIE (C0I) No Yes Vector base + $EC $76 Enhanced capture timer channel 1 I bit TIE (C1I) No Yes Vector base+ $EA $75 Enhanced capture timer channel 2 I bit TIE (C2I) No Yes Vector base+ $E8 $74 Enhanced capture timer channel 3 I bit TIE (C3I) No Yes Vector base+ $E6 $73 Enhanced capture timer channel 4 I bit TIE (C4I) No Yes Vector base+ $E4 $72 Enhanced capture timer channel 5 I bit TIE (C5I) No Yes Vector base + $E2 $71 Enhanced capture timer channel 6 I bit TIE (C6I) No Yes Vector base+ $E0 $70 Enhanced capture timer channel 7 I bit TIE (C7I) No Yes Vector base+ $DE $6F Enhanced capture timer overflow I bit TSRC2 (TOF) No Yes Vector base+ $DC $6E Pulse accumulator A overflow I bit PACTL (PAOVI) No Yes Vector base + $DA $6D Pulse accumulator input edge I bit PACTL (PAI) No Yes Vector base + $D8 $6C SPI0 I bit SPI0CR1 (SPIE, SPTIE) No Yes Vector base+ $D6 $6B SCI0 I bit SCI0CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $D4 $6A SCI1 I bit SCI1CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $D2 $69 ATD0 I bit ATD0CTL2 (ASCIE) Yes Yes Vector base + $D0 $68 ATD1 I bit ATD1CTL2 (ASCIE) Yes Yes Vector base + $CE $67 Port J I bit PIEJ (PIEJ7-PIEJ0) Yes Yes Vector base + $CC $66 Port H I bit PIEH (PIEH7-PIEH0) Yes Yes Vector base + $CA $65 Modulus down counter underflow I bit MCCTL(MCZI) No Yes Vector base + $C8 $64 Pulse accumulator B overflow I bit PBCTL(PBOVI) No Yes Vector base + $C6 $63 CRG PLL lock I bit CRGINT(LOCKIE) Refer to CRG interrupt section Vector base + $C4 $62 CRG self-clock mode I bit CRGINT (SCMIE) Refer to CRG interrupt section Vector base + $C2 $61 SCI6 I bit SCI6CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $C0 $60 IIC0 bus I bit IBCR0 (IBIE) No Yes STOP WAIT Wake up Wake up Refer to CRG interrupt section MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 81 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 2 of 4) Vector Address(1) XGATE Channel ID(2) Interrupt Source CCR Mask Vector base + $BE $5F SPI1 I bit SPI1CR1 (SPIE, SPTIE) No Yes Vector base + $BC $5E SPI2 I bit SPI2CR1 (SPIE, SPTIE) No Yes Vector base + $BA $5D FLASH Fault Detect I bit FCNFG2 (FDIE) No No Vector base + $B8 $5C FLASH I bit FCNFG (CCIE, CBEIE) No Yes Vector base + $B6 $5B CAN0 wake-up I bit CAN0RIER (WUPIE) Yes Yes Vector base + $B4 $5A CAN0 errors I bit CAN0RIER (CSCIE, OVRIE) No Yes Vector base + $B2 $59 CAN0 receive I bit CAN0RIER (RXFIE) No Yes Vector base + $B0 $58 CAN0 transmit I bit CAN0TIER (TXEIE[2:0]) No Yes Vector base + $AE $57 CAN1 wake-up I bit CAN1RIER (WUPIE) Yes Yes Vector base + $AC $56 CAN1 errors I bit CAN1RIER (CSCIE, OVRIE) No Yes Vector base + $AA $55 CAN1 receive I bit CAN1RIER (RXFIE) No Yes Vector base + $A8 $54 CAN1 transmit I bit CAN1TIER (TXEIE[2:0]) No Yes Vector base + $A6 $53 CAN2 wake-up I bit CAN2RIER (WUPIE) Yes Yes Vector base + $A4 $52 CAN2 errors I bit CAN2RIER (CSCIE, OVRIE) No Yes Vector base + $A2 $51 CAN2 receive I bit CAN2RIER (RXFIE) No Yes Vector base + $A0 $50 CAN2 transmit I bit CAN2TIER (TXEIE[2:0]) No Yes Vector base + $9E $4F CAN3 wake-up I bit CAN3RIER (WUPIE) Yes Yes Vector base+ $9C $4E CAN3 errors I bit CAN3RIER (CSCIE, OVRIE) No Yes Vector base+ $9A $4D CAN3 receive I bit CAN3RIER (RXFIE) No Yes Vector base + $98 $4C CAN3 transmit I bit CAN3TIER (TXEIE[2:0]) No Yes Vector base + $96 $4B CAN4 wake-up I bit CAN4RIER (WUPIE) Yes Yes Vector base + $94 $4A CAN4 errors I bit CAN4RIER (CSCIE, OVRIE) No Yes Vector base + $92 $49 CAN4 receive I bit CAN4RIER (RXFIE) No Yes Vector base + $90 $48 CAN4 transmit I bit CAN4TIER (TXEIE[2:0]) No Yes Vector base + $8E $47 Port P Interrupt I bit PIEP (PIEP7-PIEP0) Yes Yes Vector base+ $8C $46 PWM emergency shutdown I bit PWMSDN (PWMIE) No Yes STOP WAIT Wake up Wake up Local Enable MC9S12XE-Family Reference Manual , Rev. 1.21 82 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 3 of 4) Vector Address(1) XGATE Channel ID(2) Interrupt Source CCR Mask Vector base + $8A $45 SCI2 I bit SCI2CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $88 $44 SCI3 I bit SCI3CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $86 $43 SCI4 I bit SCI4CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $84 $42 SCI5 I bit SCI5CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $82 $41 IIC1 Bus I bit IBCR (IBIE) No Yes Vector base + $80 $40 Low-voltage interrupt (LVI) I bit VREGCTRL (LVIE) No Yes Vector base + $7E $3F Autonomous periodical interrupt (API) I bit VREGAPICTRL (APIE) Yes Yes Vector base + $7C — High Temperature Interrupt I bit VREGHTCL (HTIE) No Yes Vector base + $7A $3D Periodic interrupt timer channel 0 I bit PITINTE (PINTE0) No Yes Vector base + $78 $3C Periodic interrupt timer channel 1 I bit PITINTE (PINTE1) No Yes Vector base + $76 $3B Periodic interrupt timer channel 2 I bit PITINTE (PINTE2) No Yes Vector base + $74 $3A Periodic interrupt timer channel 3 I bit PITINTE (PINTE3) No Yes Vector base + $72 $39 XGATE software trigger 0 I bit XGMCTL (XGIE) No Yes Vector base + $70 $38 XGATE software trigger 1 I bit XGMCTL (XGIE) No Yes Vector base + $6E $37 XGATE software trigger 2 I bit XGMCTL (XGIE) No Yes Vector base + $6C $36 XGATE software trigger 3 I bit XGMCTL (XGIE) No Yes Vector base + $6A $35 XGATE software trigger 4 I bit XGMCTL (XGIE) No Yes Vector base + $68 $34 XGATE software trigger 5 I bit XGMCTL (XGIE) No Yes Vector base + $66 $33 XGATE software trigger 6 I bit XGMCTL (XGIE) No Yes Vector base + $64 $32 XGATE software trigger 7 I bit XGMCTL (XGIE) No Yes Vector base + $62 Reserved Vector base + $60 Reserved Local Enable STOP WAIT Wake up Wake up Vector base + $5E $2F Periodic interrupt timer channel 4 I bit PITINTE (PINTE4) No Yes Vector base + $5C $2E Periodic interrupt timer channel 5 I bit PITINTE (PINTE5) No Yes Vector base + $5A $2D Periodic interrupt timer channel 6 I bit PITINTE (PINTE6) No Yes Vector base + $58 $2C Periodic interrupt timer channel 7 I bit PITINTE (PINTE7) No Yes Vector base + $56 $2B SCI7 I bit SCI7CR2 (TIE, TCIE, RIE, ILIE) Yes Yes Vector base + $54 $2A TIM timer channel 0 I bit TIE (C0I) No Yes Vector base + $52 $29 TIM timer channel 1 I bit TIE (C1I) No Yes Vector base + $50 $28 TIM timer channel 2 I bit TIE (C2I) No Yes MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 83 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 4 of 4) Vector Address(1) XGATE Channel ID(2) Interrupt Source CCR Mask Local Enable Vector base+ $4E $27 TIM timer channel 3 I bit TIE (C3I) No Yes Vector base + $4C $26 TIM timer channel 4 I bit TIE (C4I) No Yes Vector base+ $4A $25 TIM timer channel 5 I bit TIE (C5I) No Yes Vector base+ $48 $24 TIM timer channel 6 I bit TIE (C6I) No Yes Vector base+ $46 $23 TIM timer channel 7 I bit TIE (C7I) No Yes Vector base+ $44 $22 TIM timer overflow I bit TSRC2 (TOF) No Yes Vector base + $42 $21 TIM Pulse accumulator A overflow I bit PACTL (PAOVI) No Yes Vector base+ $40 $20 TIM Pulse accumulator input edge I bit PACTL (PAI) No Yes Vector base + $3E $1F ATD0 Compare Interrupt I bit ATD0CTL2 (ACMPIE) Yes Yes Vector base + $3C $1E ATD1 Compare Interrupt I bit ATD1CTL2 (ACMPIE) Yes Yes Vector base+ $18 to Vector base + $3A STOP WAIT Wake up Wake up Reserved Vector base + $16 — XGATE software error interrupt None None No Yes Vector base + $14 — MPU Access Error None None No No Vector base + $12 — System Call Interrupt (SYS) — None — — Vector base + $10 — Spurious interrupt — 1. 16 bits vector address based 2. For detailed description of XGATE channel ID refer to XGATE Block Guide None — — 1.6.3 Effects of Reset When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block descriptions for register reset states. On each reset, the Flash module executes a reset sequence to load Flash configuration registers and initialize the buffer RAM EEE partition, if required. 1.6.3.1 Flash Configuration Reset Sequence (Core Hold Phase) On each reset, the Flash module will hold CPU activity while loading Flash module registers and configuration from the Flash memory. The duration of this phase is given as tRST in the device electrical parameter specification. If double faults are detected in the reset phase, Flash module protection and security may be active on leaving reset. This is explained in more detail in the Flash module section. 1.6.3.2 EEE Reset Sequence Phase (Core Active Phase) During this phase of the reset sequence (following on from the core hold phase) the CPU can execute instructions while the FTM initialization completes and, if configured for EEE operation, the EEE RAM MC9S12XE-Family Reference Manual , Rev. 1.21 84 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family is loaded with valid data from the D-Flash EEE partition. Completion of this phase is indicated by the CCIF flag in the FTM FSTAT register becoming set. If the CPU accesses any EEE RAM location before the CCIF flag is set, the CPU is stalled until the FTM reset sequence is complete and the EEE RAM data is valid. Once the CCIF flag is set, indicating the end of this phase, the EEE RAM can be accessed without impacting the CPU and FTM commands can be executed. 1.6.3.3 Reset While Flash Command Active If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. 1.6.3.4 I/O Pins Refer to the PIM block description for reset configurations of all peripheral module ports. 1.6.3.5 Memory The RAM arrays are not initialized out of reset. 1.6.3.6 COP Configuration The COP timeout rate bits CR[2:0] and the WCOP bit in the COPCTL register are loaded on rising edge of RESET from the Flash register FOPT. See Table 1-15 and Table 1-16 for coding. The FOPT register is loaded from the Flash configuration field byte at global address $7FFF0E during the reset sequence. If the MCU is secured the COP timeout rate is always set to the longest period (CR[2:0] = 111) after COP reset. Table 1-15. Initial COP Rate Configuration NV[2:0] in FOPT Register CR[2:0] in COPCTL Register 000 111 001 110 010 101 011 100 100 011 101 010 110 001 111 000 Table 1-16. Initial WCOP Configuration NV[3] in FOPT Register WCOP in COPCTL Register 1 0 0 1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 85 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.7 1.7.1 ADC0 Configuration External Trigger Input Connection The ADC module includes four external trigger inputs ETRIG0, ETRIG1, ETRIG2, and ETRIG3. The external trigger allows the user to synchronize ADC conversion to external trigger events. Table 1-17 shows the connection of the external trigger inputs. Table 1-17. ATD0 External Trigger Sources External Trigger Input Connectivity ETRIG0 Pulse width modulator channel 1 ETRIG1 Pulse width modulator channel 3 ETRIG2 Periodic interrupt timer hardware trigger 0 ETRIG3 Periodic interrupt timer hardware trigger 1 Consult the ATD block description for information about the analog-to-digital converter module. ATD block description refererences to freeze mode are equivalent to active BDM mode. 1.7.2 ADC0 Channel[17] Connection Further to the 16 externally available channels, ADC0 features an extra channel[17] that is connected to the internal temperature sensor at device level. To access this channel ADC0 must use the channel encoding SC:CD:CC:CB:CA = 1:0:0:0:1 in ATDCTL5. For more temperature sensor information, please refer to 1.10.1 Temperature Sensor Configuration 1.8 ADC1 External Trigger Input Connection The ADC module includes four external trigger inputs ETRIG0, ETRIG1, ETRIG2, and ETRIG3. The external trigger feature allows the user to synchronize ADC conversion to external trigger events. Table 118 shows the connection of the external trigger inputs. Table 1-18. ATD1 External Trigger Sources External Trigger Input Connectivity ETRIG0 Pulse width modulator channel 1 ETRIG1 Pulse width modulator channel 3 ETRIG2 Periodic interrupt timer hardware trigger 0 ETRIG3 Periodic interrupt timer hardware trigger 1 Consult the ADC block description for information about the analog-to-digital converter module. ADC block description refererences to freeze mode are equivalent to active BDM mode. MC9S12XE-Family Reference Manual , Rev. 1.21 86 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.9 MPU Configuration The MPU has the option of a third bus master (CPU + XGATE + other) which is not present on this device family but may be on other parts. 1.10 VREG Configuration The VREGEN connection of the voltage regulator is tied internally to VDDR such that the voltage regulator is always enabled with VDDR connected to a positive supply voltage. The device must be configured with the internal voltage regulator enabled. Operation in conjunction with an external voltage regulator is not supported. The autonomous periodic interrupt clock output is mapped to PortT[5]. The API trimming register APITR is loaded on rising edge of RESET from the Flash IFR option field at global address 0x40_00F0 bits[5:0] during the reset sequence. Currently factory programming of this IFR range is not supported. 1.10.1 Temperature Sensor Configuration The VREG high temperature trimming register bits VREGHTTR[3:0] are loaded from the internal Flash during the reset sequence. To use the high temperature interrupt within the specified limits (THTIA and THTID) these bits must be loaded with 0x8. Currently factory programming is not supported. The device temperature can be monitored on ADC0 channel[17]. The internal bandgap reference voltage can also be mapped to ADC0 analog input channel[17]. The voltage regulator VSEL bit when set, maps the bandgap and, when clear, maps the temperature sensor to ADC0 channel[17]. Read access to reserved VREG register space returns “0”. Write accesses have no effect. This device does not support access abort of reserved VREG register space. 1.11 BDM Clock Configuration The BDM alternate clock source is the oscillator clock. 1.12 S12XEPIM Configuration On smaller derivatives the S12XEPIM module is a subset of the S12XEP100. The registers of the unavailable ports are unimplemented. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 87 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.13 Oscillator Configuration The XCLKS is an input signal which controls whether a crystal in combination with the internal loop controlled (low power) Pierce oscillator is used or whether full swing Pierce oscillator/external clock circuitry is used. For this device XCLKS is mapped to PE7. The XCLKS signal selects the oscillator configuration during reset low phase while a clock quality check is ongoing. This is the case for: • Power on reset or low-voltage reset • Clock monitor reset • Any reset while in self-clock mode or full stop mode The selected oscillator configuration is frozen with the rising edge of the RESET pin in any of these above described reset cases. EXTAL C1 MCU Crystal or Ceramic Resonator XTAL C2 VSSPLL Figure 1-10. Loop Controlled Pierce Oscillator Connections (XCLKS = 1) EXTAL C1 MCU RB RS Crystal or Ceramic Resonator XTAL C2 RB=1MΩ ; RS specified by crystal vendor VSSPLL Figure 1-11. Full Swing Pierce Oscillator Connections (XCLKS = 0) EXTAL CMOS-Compatible External Oscillator MCU XTAL Not Connected Figure 1-12. External Clock Connections (XCLKS = 0) MC9S12XE-Family Reference Manual , Rev. 1.21 88 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-1. Revision History Revision Number Revision Date V01.17 02 Apr 2008 V01.18 25 Nov 2008 V01.19 18 Dec 2009 2.1 2.1.1 Sections Affected Description of Changes • Corrected reduced drive strength to 1/5 • Separated PE1,0 bit descriptions from other PE GPIO 2.3.19/120 2.4.3.4/181 • Corrected alternative functions on Port K (ACC[2:0]) • Corrected functions on PE[5] (MODB) and PE[2] (WE) • Added function independency to reduced drive and wired-or bit descriptions • Minor corrections Introduction Overview The S12XE Family Port Integration Module establishes the interface between the peripheral modules including the non-multiplexed External Bus Interface module (S12X_EBI) and the I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and multiplexing on shared pins. This document covers: • Port A and B used as address output of the S12X_EBI • Port C and D used as data I/O of the S12X_EBI • Port E associated with the S12X_EBI control signals and the IRQ, XIRQ interrupt inputs • Port K associated with address output and control signals of the S12X_EBI • Port T associated with 1 ECT module • Port S associated with 2 SCI and 1 SPI modules • Port M associated with 4 MSCAN and 1 SCI module • Port P connected to the PWM and 2 SPI modules - inputs can be used as an external interrupt source • Port H associated with 4 SCI modules - inputs can be used as an external interrupt source • Port J associated with 1 MSCAN, 1 SCI, 2 IIC modules and chip select outputs - inputs can be used as an external interrupt source • Port AD0 and AD1 associated with two 16-channel ATD modules • Port R associated with 1 standard timer (TIM) module • Port L associated with 4 SCI modules MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 89 Chapter 2 Port Integration Module (S12XEPIMV1) • Port F associated with IIC, SCI and chip select outputs Most I/O pins can be configured by register bits to select data direction and drive strength, to enable and select pull-up or pull-down devices. NOTE This document assumes the availability of all features (208-pin package option). Some functions are not available on lower pin count package options. Refer to the pin-out summary in the SOC Guide. 2.1.2 Features The Port Integration Module includes these distinctive registers: • • • • • • • • • • Data and data direction registers for Ports A, B, C, D, E, K, T, S, M, P, H, J, AD0, AD1, R, L, and F when used as general-purpose I/O Control registers to enable/disable pull-device and select pull-ups/pull-downs on Ports T, S, M, P, H, J, R, L, and F on per-pin basis Control registers to enable/disable pull-up devices on Ports AD0 and AD1 on per-pin basis Single control register to enable/disable pull-ups on Ports A, B, C, D, E, and K on per-port basis and on BKGD pin Control registers to enable/disable reduced output drive on Ports T, S, M, P, H, J, AD0, AD1, R, L, and F on per-pin basis Single control register to enable/disable reduced output drive on Ports A, B, C, D, E, and K on perport basis Control registers to enable/disable open-drain (wired-or) mode on Ports S, M, and L Interrupt flag register for pin interrupts on Ports P, H, and J Control register to configure IRQ pin operation Free-running clock outputs A standard port pin has the following minimum features: • Input/output selection • 5V output drive with two selectable drive strengths • 5V digital and analog input • Input with selectable pull-up or pull-down device Optional features supported on dedicated pins: • Open drain for wired-or connections • Interrupt inputs with glitch filtering • Reduced input threshold to support low voltage applications 2.2 External Signal Description This section lists and describes the signals that do connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 90 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-2 shows all the pins and their functions that are controlled by the Port Integration Module. Refer to the SOC Guide for the availability of the individual pins in the different package options. NOTE If there is more than one function associated with a pin, the priority is indicated by the position in the table from top (highest priority) to bottom (lowest priority). Table 2-2. Pin Functions and Priorities Port Pin Name Pin Function & Priority(1) I/O - BKGD MODC (2) I BKGD A PA[7:0] ADDR[15:8] mux IVD[15:8] (3) GPIO B PB[7:1] ADDR[7:1] mux IVD[7:1] 3 GPIO PB[0] C PC[7:0] PD[7:0] MODC input during RESET O High-order external bus address output (multiplexed with IVIS data) O Low-order external bus address output (multiplexed with IVIS data) UDS O Upper data strobe GPIO I/O General-purpose I/O GPIO Mode dependent (4) Mode dependent 4 I/O General-purpose I/O Low-order external bus address output (multiplexed with IVIS data) DATA[7:0] BKGD I/O General-purpose I/O O DATA[15:8] Pin Function after Reset I/O S12X_BDM communication pin ADDR[0] mux IVD0 3 GPIO D Description I/O High-order bidirectional data input/output Configurable for reduced input threshold Mode dependent 4 I/O General-purpose I/O I/O Low-order bidirectional data input/output Configurable for reduced input threshold Mode dependent 4 I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 91 Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) I/O E PE[7] XCLKS 2 I External clock selection input during RESET ECLKX2 I Free-running clock output at Core Clock rate (ECLK x 2) GPIO PE[6] MODB GPIO PE[4] PE[2] Instruction tagging low pin Configurable for reduced input threshold I MODA input during RESET O Read enable signal TAGLO I Instruction tagging low pin Configurable for reduced input threshold GPIO I/O General-purpose I/O ECLK O Free-running clock output at the Bus Clock rate or programmable divided in normal modes I/O General-purpose I/O 2 I EROMON bit control input during RESET LSTRB O Low strobe bar output LDS O Lower data strobe GPIO I/O General-purpose I/O EROMCTL RW O Read/write output for external bus WE O Write enable signal GPIO I/O General-purpose I/O PE[1] IRQ I GPI I General-purpose input PE[0] XIRQ I Non-maskable level-sensitive interrupt input I General-purpose input I ROMON bit control input during RESET I External Wait signal Configurable for reduced input threshold GPI K MODB input during RESET I I/O General-purpose I/O 2 GPIO PE[3] I RE MODA PK[7] ROMCTL 2 EWAIT GPIO PK[6:4] ADDR[22:20] mux ACC[2:0] 3 GPIO PK[3:0] ADDR[19:16] mux IQSTAT[3:0] 3 GPIO Mode dependent 4 I/O General-purpose I/O 2 TAGHI PE[5] Pin Function after Reset Description Maskable level- or falling edge-sensitive interrupt input Mode dependent 3 I/O General-purpose I/O O Extended external bus address output (multiplexed with access master output) I/O General-purpose I/O O Extended external bus address output (multiplexed with instruction pipe status bits) I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 92 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) T PT[7] IOC[7] I/O Enhanced Capture Timer Channels 7 input/output GPIO I/O General-purpose I/O IOC[5] I/O Enhanced Capture Timer Channel 5 input/output PT[5] VREG_API GPIO PT[4:0] IOC[4:0] GPIO S PS7 SS0 I/O O Description VREG Autonomous Periodical Interrupt output I/O Enhanced Capture Timer Channels 4 - 0 input/output I/O General-purpose I/O I/O Serial Peripheral Interface 0 slave select output in master mode, input in slave mode or master mode. I/O General-purpose I/O PS6 SCK0 I/O Serial Peripheral Interface 0 serial clock pin GPIO I/O General-purpose I/O PS5 MOSI0 I/O General-purpose I/O MISO0 GPIO I/O General-purpose I/O PS3 TXD1 O GPIO I/O General-purpose I/O I/O Serial Peripheral Interface 0 master in/slave out pin RXD1 GPIO I/O General-purpose I/O PS1 TXD0 O GPIO I/O General-purpose I/O GPIO I Serial Communication Interface 1 transmit pin PS2 RXD0 GPIO I/O Serial Peripheral Interface 0 master out/slave in pin PS4 PS0 GPIO I/O General-purpose I/O GPIO GPIO Pin Function after Reset I Serial Communication Interface 1 receive pin Serial Communication Interface 0 transmit pin Serial Communication Interface 0 receive pin I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 93 Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) I/O M PM7 TXCAN3 O MSCAN3 transmit pin (TXCAN4) O MSCAN4 transmit pin TXD3 O Serial Communication Interface 3 transmit pin GPIO I/O General-purpose I/O PM6 RXCAN3 I MSCAN3 receive pin (RXCAN4) I MSCAN4 receive pin RXD3 I Serial Communication Interface 3 receive pin GPIO PM5 O MSCAN2 transmit pin (TXCAN0) O MSCAN0 transmit pin (TXCAN4) O MSCAN4 transmit pin GPIO PM4 I MSCAN2 receive pin I MSCAN0 receive pin (RXCAN4) I MSCAN4 receive pin TXCAN1 (TXCAN0) PM2 I/O General-purpose I/O O MSCAN1 transmit pin O MSCAN0 transmit pin I/O Serial Peripheral Interface 0 slave select output in master mode, input for slave mode or master mode. GPIO I/O General-purpose I/O RXCAN1 I MSCAN1 receive pin (RXCAN0) I MSCAN0 receive pin GPIO TXCAN0 GPIO PM0 I/O Serial Peripheral Interface 0 master out/slave in pin If CAN0 is routed to PM[3:2] the SPI0 can still be used in bidirectional master mode. (SS0) (MISO0) PM1 I/O General-purpose I/O RXCAN2 GPIO PM3 I/O Serial Peripheral Interface 0 serial clock pin If CAN0 is routed to PM[3:2] the SPI0 can still be used in bidirectional master mode. (RXCAN0) (MOSI0) GPIO I/O General-purpose I/O TXCAN2 (SCK0) Pin Function after Reset Description RXCAN0 GPIO I/O Serial Peripheral Interface 0 master in/slave out pin I/O General-purpose I/O O MSCAN0 transmit pin I/O General-purpose I/O I MSCAN0 receive pin I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 94 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) P PP7 PWM7 I/O Pulse Width Modulator input/output channel 7 SCK2 I/O Serial Peripheral Interface 2 serial clock pin (TIMIOC7) GPIO/KWP7 PP6 PWM6 SS2 (TIMIOC6) GPIO/KWP6 PP5 I/O Timer Channel 6 input/output I/O General-purpose I/O with interrupt Pulse Width Modulator output channel 5 I/O Timer Channel 5 input/output I/O General-purpose I/O with interrupt MISO2 I/O Serial Peripheral Interface 2 master in/slave out pin (TIMIOC3) GPIO/KWP3 Pulse Width Modulator output channel 4 I/O Timer Channel 4 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 3 I/O Serial Peripheral Interface 1 slave select output in master mode, input for slave mode or master mode. I/O Timer Channel 3 input/output I/O General-purpose I/O with interrupt PWM2 O SCK1 I/O Serial Peripheral Interface 1 serial clock pin (TIMIOC2) GPIO/KWP2 Pulse Width Modulator output channel 2 I/O Timer Channel 2 input/output I/O General-purpose I/O with interrupt PWM1 O MOSI1 I/O Serial Peripheral Interface 1 master out/slave in pin (TIMIOC1) GPIO/KWP1 PP0 I/O Serial Peripheral Interface 2 slave select output in master mode, input for slave mode or master mode. O SS1 PP1 Pulse Width Modulator output channel 6 PWM4 PWM3 PP2 O I/O Serial Peripheral Interface 2 master out/slave in pin (TIMIOC4) Pulse Width Modulator output channel 1 I/O Timer Channel 1 input/output I/O General-purpose I/O with interrupt PWM0 O MISO1 I/O Serial Peripheral Interface 1 master in/slave out pin (TIMIOC0) GPIO/KWP0 GPIO I/O General-purpose I/O with interrupt MOSI2 GPIO/KWP4 Pin Function after Reset I/O Timer Channel 7 input/output O (TIMIOC5) PP3 Description PWM5 GPIO/KWP5 PP4 I/O Pulse Width Modulator output channel 0 I/O Timer Channel 0 input/output I/O General-purpose I/O with interrupt MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 95 Chapter 2 Port Integration Module (S12XEPIMV1) Pin Function after Reset Port Pin Name Pin Function & Priority(1) H PH7 (SS2) I/O Serial Peripheral Interface 2 slave select output in master mode, input for slave mode or master mode TXD5 O GPIO/KWH7 PH6 (SCK2) RXD5 GPIO/KWH6 PH5 (MOSI2) TXD4 GPIO/KWH5 PH4 (MISO2) RXD4 GPIO/KWH4 PH3 (SS1) TXD7 GPIO/KWH3 PH2 (SCK1) RXD7 GPIO/KWH2 PH1 (MOSI1) TXD6 GPIO/KWH1 PH0 (MISO1) TXD6 GPIO/KWH0 I/O Description GPIO Serial Communication Interface 5 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 serial clock pin I Serial Communication Interface 5 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 master out/slave in pin O Serial Communication Interface 4 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 master in/slave out pin I Serial Communication Interface 4 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 slave select output in master mode, input for slave mode or master mode. O Serial Communication Interface 7 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 serial clock pin I Serial Communication Interface 7 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 master out/slave in pin O Serial Communication Interface 6 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 master in/slave out pin O Serial Communication Interface 6 transmit pin I/O General-purpose I/O with interrupt MC9S12XE-Family Reference Manual , Rev. 1.21 96 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) I/O J PJ7 TXCAN4 O MSCAN4 transmit pin SCL0 O Inter Integrated Circuit 0 serial clock line (TXCAN0) O MSCAN0 transmit pin GPIO/KWJ7 PJ6 RXCAN4 SDA0 (RXCAN0) GPIO/KWJ6 PJ5 I/O General-purpose I/O with interrupt O Chip select 2 I/O General-purpose I/O with interrupt I/O Inter Integrated Circuit 1 serial data line O Chip select 0 GPIO/KWJ3 I/O General-purpose I/O with interrupt CS1 TXD2 GPIO/KWJ1 PJ0 PAD[15:0] Chip select 1 O Serial Communication Interface 2 transmit pin I/O General-purpose I/O with interrupt I Serial Communication Interface 2 receive pin CS3 O Chip select 3 GPIO AN[15:0] AD1 PAD[31:16] O I/O General-purpose I/O with interrupt RXD2 GPIO/KWJ0 GPIO AN[15:0] PR[7:0] MSCAN0 receive pin I/O General-purpose I/O with interrupt PJ1 R I CS2 GPIO/KWJ2 AD0 I/O Inter Integrated Circuit 0 serial data line GPIO/KWJ4 PJ2 TIMIOC[7:0] GPIO GPIO MSCAN4 receive pin Inter Integrated Circuit 1 serial clock line CS0 PJ3 I O SDA1 Pin Function after Reset I/O General-purpose I/O with interrupt SCL1 GPIO/KWJ5 PJ4 Description I/O General-purpose I/O with interrupt I/O General-purpose I/O I ATD0 analog inputs I/O General-purpose I/O I GPIO GPIO ATD1 analog inputs I/O Timer Channels 7- 0 input/output GPIO I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 97 Chapter 2 Port Integration Module (S12XEPIMV1) Port Pin Name Pin Function & Priority(1) I/O L PL7 (TXD7) O GPIO PL6 (RXD7) PL5 (TXD6) GPIO GPIO PL4 (RXD6) PL3 (TXD5) GPIO GPIO PL2 (RXD5) PL1 (TXD4) GPIO GPIO PL0 (RXD4) PF7 (TXD3) GPIO F GPIO PF6 (RXD3) PF5 (SCL0) GPIO GPIO Description Serial Communication Interface 7 transmit pin GPIO I/O General-purpose I/O I Serial Communication Interface 7 receive pin I/O General-purpose I/O O Serial Communication Interface 6 transmit pin I/O General-purpose I/O I Serial Communication Interface 6 receive pin I/O General-purpose I/O O Serial Communication Interface 5 transmit pin I/O General-purpose I/O I Serial Communication Interface 5 receive pin I/O General-purpose I/O O Serial Communication Interface 4 transmit pin I/O General-purpose I/O I Serial Communication Interface 4 receive pin I/O General-purpose I/O O Serial Communication Interface 3 transmit pin GPIO I/O General-purpose I/O I Serial Communication Interface 3 receive pin I/O General-purpose I/O O Inter Integrated Circuit 0 serial clock line I/O General-purpose I/O PF4 (SDA0) GPIO I/O General-purpose I/O PF3 (CS3) O GPIO I/O General-purpose I/O PF2 (CS2) O GPIO I/O General-purpose I/O PF1 (CS1) O GPIO I/O General-purpose I/O (CS0) O PF0 Pin Function after Reset I/O Inter Integrated Circuit 0 serial data line Chip select 3 Chip select 2 Chip select 1 Chip select 0 GPIO I/O General-purpose I/O 1. Signals in brackets denote alternative module routing pins. 2. Function active when RESET asserted. 3. Only available in emulation modes or in Special Test Mode with IVIS on. 4. Refer to S12X_EBI section. 2.3 Memory Map and Register Definition This section provides a detailed description of all Port Integration Module registers. MC9S12XE-Family Reference Manual , Rev. 1.21 98 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.1 Memory Map Register Name 0x0000 PORTA R W 0x0001 PORTB W 0x0002 DDRA W 0x0003 DDRB R R R W 0x0004 PORTC W 0x0005 PORTD W 0x0006 DDRC R R R W 0x0007 DDRD W 0x0008 PORTE W 0x0009 DDRE R R R W Bit 7 6 5 4 3 2 1 Bit 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 DDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 DDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 DDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 DDRE7 DDRE6 DDRE5 DDRE4 DDRE3 DDRE2 0 0 0x000A R 0x000B W Non-PIM Address Range 0x000C PUCR 0x000D RDRIV R W R W Non-PIM Address Range PUPKE RDPK BKPUE 0 0 PUPEE PUPDE PUPCE PUPBE PUPAE RDPE RDPD RDPC RDPB RDPA 0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 99 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name Bit 7 6 5 0x000E– R 0x001B W Non-PIM Address Range 0x001C R ECLKCTL W 0x001D R Reserved W 0x001E IRQCR W 0x001F R Reserved R 0x0033 DDRK 0x0241 PTIT 2 1 Bit 0 NECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0 0 0 0 0 0 0 0 0 IRQE IRQEN 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W Non-PIM Address Range PK7 PK6 PK5 PK4 PK3 PK2 PK1 PK0 DDRK7 DDRK6 DDRK5 DDRK4 DDRK3 DDRK2 DDRK1 DDRK0 0x0034– R 0x023F W Non-PIM Address Range 0x0240 PTT 3 Non-PIM Address Range 0x0020– R 0x0031 W Non-PIM Address Range 0x0032 PORTK 4 R W R Non-PIM Address Range PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0 PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0 DDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 RDRT7 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0 W 0x0242 DDRT R W 0x0243 RDRT W R = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 100 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name Bit 7 6 5 4 3 2 1 Bit 0 PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0 PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 0x0246 R Reserved W 0 0 0 0 0 0 0 0 0x0247 R Reserved W 0 0 0 0 0 0 0 0 PTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0 PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0 DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 RDRS7 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0 PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0 0 0 0 0 0 0 0 0 PTM7 PTM6 PTM5 PTM4 PTM3 PTM2 PTM1 PTM0 PTIM7 PTIM6 PTIM5 PTIM4 PTIM3 PTIM2 PTIM1 PTIM0 DDRM7 DDRM6 DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0 0x0244 PERT W 0x0245 PPST W 0x0248 PTS R R R W 0x0249 PTIS W 0x024A DDRS W 0x024B RDRS R R R W 0x024C PERS W 0x024D PPSS W 0x024E WOMS R R R W 0x024F R Reserved W 0x0250 PTM 0x0251 PTIM 0x0252 DDRM R W R W R W = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 101 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0253 RDRM W 0x0254 PERM W 0x0255 PPSM R R R W 0x0256 WOMM W 0x0257 MODRR W 0x0258 PTP 0x0259 PTIP 0x025A DDRP 0x025B RDRP 0x025C PERP R R R W R R W R W R W W 0x025E PIEP W R R R W 0x0260 PTH W 0x0261 PTIH W 0x0262 DDRH 6 5 4 3 2 1 Bit 0 RDRM7 RDRM6 RDRM5 RDRM4 RDRM3 RDRM2 RDRM1 RDRM0 PERM7 PERM6 PERM5 PERM4 PERM3 PERM2 PERM1 PERM0 PPSM7 PPSM6 PPSM5 PPSM4 PPSM3 PPSM2 PPSM1 PPSM0 WOMM7 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0 MODRR6 MODRR5 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0 PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0 PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0 DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 RDRP7 RDRP6 RDRP5 RDRP4 RDRP3 RDRP2 RDRP1 RDRP0 PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 PTH7 PTH6 PTH5 PTH4 PTH3 PTH2 PTH1 PTH0 PTIH7 PTIH6 PTIH5 PTIH4 PTIH3 PTIH2 PTIH1 PTIH0 DDRH7 DDRH6 DDRH5 DDRH4 DDRH3 DDRH2 DDRH1 DDRH0 0 W 0x025D PPSP 0x025F PIFP Bit 7 R R R W = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 102 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0263 RDRH 0x0264 PERH 0x0265 PPSH 0x0266 PIEH R W R W R W R W 0x0267 PIFH W 0x0268 PTJ W 0x0269 PTIJ R R R W 0x026B RDRJ W 0x026D PPSJ 0x026E PIEJ 0x026F PIFJ 0x0270 PT0AD0 0x0271 PT1AD0 6 5 4 3 2 1 Bit 0 RDRH7 RDRH6 RDRH5 RDRH4 RDRH3 RDRH2 RDRH1 RDRH0 PERH7 PERH6 PERH5 PERH4 PERH3 PERH2 PERH1 PERH0 PPSH7 PPSH6 PPSH5 PPSH4 PPSH3 PPSH2 PPSH1 PPSH0 PIEH7 PIEH6 PIEH5 PIEH4 PIEH3 PIEH2 PIEH1 PIEH0 PIFH7 PIFH6 PIFH5 PIFH4 PIFH3 PIFH2 PIFH1 PIFH0 PTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0 PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0 DDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0 RDRJ7 RDRJ6 RDRJ5 RDRJ4 RDRJ3 RDRJ2 RDRJ1 RDRJ0 PERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0 PPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0 PIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0 PIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0 PT0AD07 PT0AD06 PT0AD05 PT0AD04 PT0AD03 PT0AD02 PT0AD01 PT0AD00 PT1AD07 PT1AD06 PT1AD05 PT1AD04 PT1AD03 PT1AD02 PT1AD01 PT1AD00 W 0x026A DDRJ 0x026C PERJ Bit 7 R R R W R W R W R W R W R W = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 103 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name Bit 7 6 5 4 3 2 1 Bit 0 0x0272 R DDR0AD0 W DDR0AD07 DDR0AD06 DDR0AD05 DDR0AD04 DDR0AD03 DDR0AD02 DDR0AD01 DDR0AD00 0x0273 R DDR1AD0 W DDR1AD07 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00 0x0274 R RDR0AD0 W RDR0AD07 RDR0AD06 RDR0AD05 RDR0AD04 RDR0AD03 RDR0AD02 RDR0AD01 RDR0AD00 0x0275 R RDR1AD0 W RDR1AD07 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00 0x0276 R PER0AD0 W PER0AD07 PER0AD06 PER0AD05 PER0AD04 PER0AD03 PER0AD02 PER0AD01 PER0AD00 0x0277 R PER1AD0 W PER1AD07 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00 PT0AD17 PT0AD16 PT0AD15 PT0AD14 PT0AD13 PT0AD12 PT0AD11 PT0AD10 PT1AD17 PT1AD16 PT1AD15 PT1AD14 PT1AD13 PT1AD12 PT1AD11 PT1AD10 0x0278 PT0AD1 0x0279 PT1AD1 R W R W 0x027A R DDR0AD1 W DDR0AD17 DDR0AD16 DDR0AD15 DDR0AD14 DDR0AD13 DDR0AD12 DDR0AD11 DDR0AD10 0x027B R DDR1AD1 W DDR1AD17 DDR1AD16 DDR1AD15 DDR1AD14 DDR1AD13 DDR1AD12 DDR1AD11 DDR1AD10 0x027C R RDR0AD1 W RDR0AD17 RDR0AD16 RDR0AD15 RDR0AD14 RDR0AD13 RDR0AD12 RDR0AD11 RDR0AD10 0x027D R RDR1AD1 W RDR1AD17 RDR1AD16 RDR1AD15 RDR1AD14 RDR1AD13 RDR1AD12 RDR1AD11 RDR1AD10 0x027E R PER0AD1 W PER0AD17 PER0AD16 PER0AD15 PER0AD14 PER0AD13 PER0AD12 PER0AD1‘ PER0AD10 0x027F R PER1AD1 W PER1AD17 PER1AD16 PER1AD15 PER1AD14 PER1AD13 PER1AD12 PER1AD11 PER1AD10 0x0280– R 0x0267 W Non-PIM Address Range Non-PIM Address Range = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 104 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0368 PTR W 0x0369 PTIR W 0x036A DDRR R R R W 0x036B RDRR W 0x036C PERR W 0x036D PPSR R R R W 0x036E R Reserved W 0x036F PTRRR 0x0370 PTL R W R W 0x0371 PTIL W 0x0372 DDRL W 0x0373 RDRL R R R W 0x0374 PERL W 0x0375 PPSL W 0x0376 WOML 0x0377 PTLRR R R R W R W Bit 7 6 5 4 3 2 1 Bit 0 PTR7 PTR6 PTR5 PTR4 PTR3 PTR2 PTR1 PTR0 PTIR7 PTIR6 PTIR5 PTIR4 PTIR3 PTIR2 PTIR1 PTIR0 DDRR7 DDRR6 DDRR5 DDRR4 DDRR3 DDRR2 DDRR1 DDRR0 RDRR7 RDRR6 RDRR5 RDRR4 RDRR3 RDRR2 RDRR1 RDRR0 PERR7 PERR6 PERR5 PERR4 PERR3 PERR2 PERR1 PERR0 PPSR7 PPSR6 PPSR5 PPSR4 PPSR3 PPSR2 PPSR1 PPSR0 0 0 0 0 0 0 0 0 PTRRR7 PTRRR6 PTRRR5 PTRRR4 PTRRR3 PTRRR2 PTRRR1 PTRRR0 PTL7 PTL6 PTL5 PTL4 PTL3 PTL2 PTL1 PTL0 PTIL7 PTIL6 PTIL5 PTIL4 PTIL3 PTIL2 PTIL1 PTIL0 DDRL7 DDRL6 DDRL5 DDRL4 DDRL3 DDRL2 DDRL1 DDRL0 RDRL7 RDRL6 RDRL5 RDRL4 RDRL3 RDRL2 RDRL1 RDRL0 PERL7 PERL6 PERL5 PERL4 PERL3 PERL2 PERL1 PERL0 PPSL7 PPSL6 PPSL5 PPSL4 PPSL3 PPSL2 PPSL1 PPSL0 WOML7 WOML6 WOML5 WOML4 WOML3 WOML2 WOML1 WOML0 PTLRR7 PTLRR6 PTLRR5 PTLRR4 0 0 0 0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 105 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0378 PTF 0x0379 PTIF 0x037A DDRF 0x037B RDRF R W R 6 5 4 3 2 1 Bit 0 PTF7 PTF6 PTF5 PTF4 PTF3 PTF2 PTF1 PTF0 PTIF7 PTIF6 PTIF5 PTIF4 PTIF3 PTIF2 PTIF1 PTIF0 DDRF7 DDRF6 DDRF5 DDRF4 DDRF3 DDRF2 DDRF1 DDRF0 RDRF7 RDRF6 RDRF5 RDRF4 RDRF3 RDRF2 RDRF1 RDRF0 PERF7 PERF6 PERF5 PERF4 PERF3 PERF2 PERF1 PERF0 PPSF7 PPSF6 PPSF5 PPSF4 PPSF3 PPSF2 PPSF1 PPSF0 0 0 0 0 0 0 0 0 0 0 PTFRR5 PTFRR4 PTFRR3 PTFRR2 PTFRR1 PTFRR0 W R W R W 0x037C PERF W 0x037D PPSF W R R 0x037E R Reserved W 0x037F PTFRR Bit 7 R W = Unimplemented or Reserved 2.3.2 Register Descriptions The following table summarizes the effect of the various configuration bits, i.e. data direction (DDR), output level (IO), reduced drive (RDR), pull enable (PE), pull select (PS) on the pin function and pull device activity. The configuration bit PS is used for two purposes: 1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled. 2. Select either a pull-up or pull-down device if PE is active. MC9S12XE-Family Reference Manual , Rev. 1.21 106 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-3. Pin Configuration Summary DDR IO RDR PE PS(1) IE(2) 0 x x 0 x 0 Input Disabled Disabled 0 x x 1 0 0 Input Pull Up Disabled 0 x x 1 1 0 Input Pull Down Disabled 0 x x 0 0 1 Input Disabled Falling edge 0 x x 0 1 1 Input Disabled Rising edge 0 x x 1 0 1 Input Pull Up Falling edge 0 x x 1 1 1 Input Pull Down Rising edge 1 0 0 x x 0 Output, full drive to 0 Disabled Disabled 1 1 0 x x 0 Output, full drive to 1 Disabled Disabled 1 0 1 x x 0 Output, reduced drive to 0 Disabled Disabled 1 1 1 x x 0 Output, reduced drive to 1 Disabled Disabled 1 0 0 x 0 1 Output, full drive to 0 Disabled Falling edge 1 1 0 x 1 1 Output, full drive to 1 Disabled Rising edge 1 0 1 x 0 1 Output, reduced drive to 0 Disabled Falling edge 1 Output, reduced drive to 1 Disabled Rising edge 1 1 1 x 1 1. Always “0” on Port A, B, C, D, E, K, AD0, and AD1. 2. Applicable only on Port P, H, and J. Function Pull Device Interrupt NOTE All register bits in this module are completely synchronous to internal clocks during a register read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 107 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.3 Port A Data Register (PORTA) Access: User read/write(1) Address 0x0000 (PRR) 7 6 5 4 3 2 1 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 ADDR15 mux IVD15 ADDR14 mux IVD14 ADDR13 mux IVD13 ADDR12 mux IVD12 ADDR11 mux IVD11 ADDR10 mux IVD10 ADDR9 mux IVD9 ADDR8 mux IVD8 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-1. Port A Data Register (PORTA) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-4. PORTA Register Field Descriptions Field Description 7-0 PA Port A general purpose input/output data—Data Register Port A pins 7 through 0 are associated with address outputs ADDR[15:8] respectively in expanded modes. In emulation modes the address is multiplexed with IVD[15:8]. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.4 Port B Data Register (PORTB) Access: User read/write(1) Address 0x0001 (PRR) 7 6 5 4 3 2 1 0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 ADDR0 mux IVD0 or UDS 0 R W Altern. Function Reset ADDR7 mux IVD7 ADDR6 mux IVD6 ADDR5 mux IVD5 ADDR4 mux IVD4 ADDR3 mux IVD3 ADDR2 mux IVD2 ADDR1 mux IVD1 0 0 0 0 0 0 0 Figure 2-2. Port B Data Register (PORTB) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 108 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-5. PORTB Register Field Descriptions Field Description 7-0 PB Port B general purpose input/output data—Data Register Port B pins 7 through 0 are associated with address outputs ADDR[7:0] respectively in expanded modes. In emulation modes the address is multiplexed with IVD[7:0]. In normal expanded mode pin 0 is related to the UDS input. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.5 Port A Data Direction Register (DDRA) Access: User read/write(1) Address 0x0002 (PRR) 7 6 5 4 3 2 1 0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 0 0 0 0 0 0 0 0 R W Reset Figure 2-3. Port A Data Direction Register (DDRA) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-6. DDRA Register Field Descriptions Field Description 7-0 DDRA Port A Data Direction— This register controls the data direction of pins 7 through 0. The external bus function forces the I/O state to be outputs for all associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.6 Port B Data Direction Register (DDRB) Access: User read/write(1) Address 0x0003 (PRR) 7 6 5 4 3 2 1 0 DDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0 0 0 0 0 0 0 0 0 R W Reset Figure 2-4. Port B Data Direction Register (DDRB) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 109 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-7. DDRB Register Field Descriptions Field Description 7-0 DDRB Port B Data Direction— This register controls the data direction of pins 7 through 0. The external bus function forces the I/O state to be outputs for all associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.7 Port C Data Register (PORTC) Access: User read/write(1) Address 0x0004 (PRR) 7 6 5 4 3 2 1 0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA9 DATA8 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-5. Port C Data Register (PORTC) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-8. PORTC Register Field Descriptions Field Description 7-0 PC Port C general purpose input/output data—Data Register Port C pins 7 through 0 are associated with data I/O lines DATA[15:8] respectively in expanded modes. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 110 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.8 Port D Data Register (PORTD) Access: User read/write(1) Address 0x0005 (PRR) 7 6 5 4 3 2 1 0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-6. Port D Data Register (PORTD) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-9. PORTD Register Field Descriptions Field Description 7-0 PD Port D general purpose input/output data—Data Register Port D pins 7 through 0 are associated with data I/O lines DATA[7:0] respectively in expanded modes. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.9 Port C Data Direction Register (DDRC) Access: User read/write(1) Address 0x0006 (PRR) 7 6 5 4 3 2 1 0 DDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 0 0 0 0 0 0 0 0 R W Reset Figure 2-7. Port C Data Direction Register (DDRC) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 111 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-10. DDRC Register Field Descriptions Field Description 7-0 DDRC Port C Data Direction— This register controls the data direction of pins 7 through 0. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.10 Port D Data Direction Register (DDRD) Access: User read/write(1) Address 0x0007 (PRR) 7 6 5 4 3 2 1 0 DDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0 0 0 0 0 0 0 0 0 R W Reset Figure 2-8. Port D Data Direction Register (DDRD) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-11. DDRD Register Field Descriptions Field Description 7-0 DDRD Port D Data Direction— This register controls the data direction of pins 7 through 0. When used with the external bus this function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. MC9S12XE-Family Reference Manual , Rev. 1.21 112 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.11 Port E Data Register (PORTE) Access: User read/write(1) Address 0x0008 (PRR) 7 6 5 4 3 2 1 0 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 XCLKS or ECLKX2 MODB or TAGHI MODA or RE or TAGLO ECLK EROMCTL or LSTRB or LDS RW or WE IRQ XIRQ 0 0 0 0 0 0 —(2) —2 R W Altern. Function Reset = Unimplemented or Reserved Figure 2-9. Port E Data Register (PORTE) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. 2. These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated pin values. Table 2-12. PORTE Register Field Descriptions Field Description 7-2 PE Port E general purpose input/output data—Data Register Port E bits 7 through 0 are associated with external bus control signals and interrupt inputs. These include mode select (MODB, MODA), E clock, double frequency E clock, Instruction Tagging High and Low (TAGHI, TAGLO), Read/Write (RW), Read Enable and Write Enable (RE, WE), Lower Data Select (LDS). When not used with the alternative functions, Port E pins 7-2 can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Pins 6 and 5 are inputs with enabled pull-down devices while RESET pin is low. Pins 7 and 3 are inputs with enabled pull-up devices while RESET pin is low. 1 PE Port E general purpose input data and interrupt—Data Register, IRQ input. This pin can be used as general purpose and IRQ input. 0 PE Port E general purpose input data and interrupt—Data Register, XIRQ input. This pin can be used as general purpose and XIRQ input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 113 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.12 Port E Data Direction Register (DDRE) Access: User read/write(1) Address 0x0009 (PRR) 7 6 5 4 3 2 DDRE7 DDRE6 DDRE5 DDRE4 DDRE3 DDRE2 0 0 0 0 0 0 R 1 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-10. Port E Data Direction Register (DDRE) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-13. DDRE Register Field Descriptions Field Description 7-2 DDRE Port E Data Direction— This register controls the data direction of pins 7 through 2. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 1-0 Reserved— Port E bit 1 (associated with IRQ) and bit 0 (associated with XIRQ) cannot be configured as outputs. Port E, bits 1 and 0, can be read regardless of whether the alternate interrupt function is enabled. 2.3.13 S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) Access: User read/write(1) Address 0x000C (PRR) 7 6 PUPKE BKPUE 1 1 R 5 4 3 2 1 0 PUPEE PUPDE PUPCE PUPBE PUPAE 1 0 0 0 0 0 W Reset 0 = Unimplemented or Reserved Figure 2-11. S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) 1. Read:Anytime in single-chip modes. Write:Anytime, except BKPUE which is writable in Special Test Mode only. MC9S12XE-Family Reference Manual , Rev. 1.21 114 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-14. PUCR Register Field Descriptions Field Description 7 PUPKE Pull-up Port K Enable—Enable pull-up devices on all Port K input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are enabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 6 BKPUE BKGD pin pull-up Enable—Enable pull-up devices on BKGD pin This bit configures whether a pull-up device is activated, if the pin is used as input. This bit has no effect if the pin is used as outputs. Out of reset the pull-up device is enabled. 1 Pull-up device enabled. 0 Pull-up device disabled. 5 Reserved— 4 PUPEE Pull-up Port E Enable—Enable pull-up devices on all Port E input pins except on pins 5 and 6 which have pull-down devices only enabled during reset. This bit has no effect on these pins. This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are enabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 3 PUPDE Pull-up Port D Enable—Enable pull-up devices on all Port D input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 2 PUPCE Pull-up Port C Enable—Enable pull-up devices on all Port C input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 1 PUPBE Pull-up Port B Enable—Enable pull-up devices on all Port B input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 0 PUPAE Pull-up Port A Enable—Enable pull-up devices on all Port A input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 115 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.14 S12X_EBI ports Reduced Drive Register (RDRIV) Access: User read/write(1) Address 0x000D (PRR) 7 R 6 5 0 0 RDPK 4 3 2 1 0 RDPE RDPD RDPC RDPB RDPA 0 0 0 0 0 W Reset 0 0 0 = Unimplemented or Reserved Figure 2-12. S12X_EBI ports Reduced Drive Register (RDRIV) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. This register is used to select reduced drive for the pins associated with the S12X_EBI ports A, B, C, D, E, and K. If enabled, the pins drive at approx. 1/5 of the full drive strength. The reduced drive functionality does not take effect on the pins in emulation modes. Table 2-15. RDRIV Register Field Descriptions Field 7 RDPK 6-5 Description Port K reduced drive—Select reduced drive for outputs This bit configures the drive strength of all Port K output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Reserved— 4 RDPE Port E reduced drive—Select reduced drive for outputs This bit configures the drive strength of all Port E output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 3 RDPD Port D reduced drive—Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2 RDPC Port C reduced drive—Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 116 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-15. RDRIV Register Field Descriptions (continued) Field Description 1 RDPB Port B reduced drive—Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 0 RDPA Port A reduced drive—Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.15 ECLK Control Register (ECLKCTL) Access: User read/write(1) Address 0x001C (PRR) 7 6 5 4 3 2 1 0 NECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0 Reset(2): Mode Dependent 1 0 0 0 0 0 0 SS 0 1 0 0 0 0 0 0 ES 1 1 0 0 0 0 0 0 ST 0 1 0 0 0 0 0 0 EX 0 1 0 0 0 0 0 0 NS 1 1 0 0 0 0 0 0 NX 0 1 0 0 0 0 0 0 R W = Unimplemented or Reserved Figure 2-13. ECLK Control Register (ECLKCTL) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. 2. Reset values in emulation modes are identical to those of the target mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 117 Chapter 2 Port Integration Module (S12XEPIMV1) The ECLKCTL register is used to control the availability of the free-running clocks and the free-running clock divider. Table 2-16. ECLKCTL Register Field Descriptions Field Description 7 NECLK No ECLK—Disable ECLK output This bit controls the availability of a free-running clock on the ECLK pin. Clock output is always active in emulation modes and if enabled in all other operating modes. 1 ECLK disabled 0 ECLK enabled 6 NCLKX2 No ECLKX2—Disable ECLKX2 output This bit controls the availability of a free-running clock on the ECLKX2 pin. This clock has a fixed rate of twice the internal Bus Clock. Clock output is always active in emulation modes and if enabled in all other operating modes. 1 ECLKX2 disabled 0 ECLKX2 enabled 5 DIV16 Free-running ECLK predivider—Divide by 16 This bit enables a divide-by-16 stage on the selected EDIV rate. 1 Divider enabled: ECLK rate = EDIV rate divided by 16 0 Divider disabled: ECLK rate = EDIV rate 4-0 EDIV Free-running ECLK Divider—Configure ECLK rate These bits determine the rate of the free-running clock on the ECLK pin. Divider is always disabled in emulation modes and active as programmed in all other operating modes. 00000 ECLK rate = Bus Clock rate 00001 ECLK rate = Bus Clock rate divided by 2 00010 ECLK rate = Bus Clock rate divided by 3, ... 11111 ECLK rate = Bus Clock rate divided by 32 2.3.16 PIM Reserved Register Access: User read(1) Address 0x001D (PRR) R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-14. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 118 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.17 IRQ Control Register (IRQCR) Access: User read/write(1) Address 0x001E 7 6 IRQE IRQEN 0 1 R 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-15. IRQ Control Register (IRQCR) 1. Read: See individual bit descriptions below. Write: See individual bit descriptions below. Table 2-17. IRQCR Register Field Descriptions Field Description 7 IRQE IRQ select edge sensitive only— Special modes: Read or write anytime. Normal & emulation modes: Read anytime, write once. 1 IRQ configured to respond only to falling edges. Falling edges on the IRQ pin will be detected anytime IRQE = 1 and will be cleared only upon a reset or the servicing of the IRQ interrupt. 0 IRQ configured for low level recognition. 6 IRQEN 5-0 External IRQ enable— Read or write anytime. 1 External IRQ pin is connected to interrupt logic. 0 External IRQ pin is disconnected from interrupt logic. Reserved— 2.3.18 PIM Reserved Register This register is reserved for factory testing of the PIM module and is not available in normal operation. Access: User read(1) Address 0x001F R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-16. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented NOTE Writing to this register when in special modes can alter the pin functionality. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 119 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.19 Port K Data Register (PORTK) Access: User read/write(1) Address 0x0032 (PRR) 7 6 5 4 3 2 1 0 PK7 PK6 PK5 PK4 PK3 PK2 PK1 PK0 ROMCTL or EWAIT ADDR22 mux ACC2 ADDR21 mux ACC1 ADDR20 mux ACC0 ADDR19 mux IQSTAT3 ADDR18 mux IQSTAT2 ADDR17 mux IQSTAT1 ADDR16 mux IQSTAT0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-17. Port K Data Register (PORTK) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-18. PORTK Register Field Descriptions Field Description 7-0 PK Port K general purpose input/output data—Data Register Port K pins 7 through 0 are associated with external bus control signals and internal memory expansion emulation pins. These include ADDR[22:16], Access Source (ACC[2:0]), External Wait (EWAIT) and instruction pipe signals IQSTAT[3:0]. Bits 6-0 carry the external addresses in all expanded modes. In emulation modes the address is multiplexed with the alternate functions ACC and IQSTAT on the respective pins. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.20 Port K Data Direction Register (DDRK) Access: User read/write(1) Address 0x0033 (PRR) 7 6 5 4 3 2 1 0 DDRK7 DDRK6 DDRK5 DDRK4 DDRK3 DDRK2 DDRK1 DDRK0 0 0 0 0 0 0 0 0 R W Reset Figure 2-18. Port K Data Direction Register (DDRK) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 120 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-19. DDRK Register Field Descriptions Field Description 7-0 DDRK Port K Data Direction— This register controls the data direction of pins 7 through 0. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.21 Port T Data Register (PTT) Access: User read/write(1) Address 0x0240 7 6 5 4 3 2 1 0 PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0 IOC7 IOC6 IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 — — VREG_API — — — — — 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-19. Port T Data Register (PTT) 1. Read: Anytime. Write: Anytime. Table 2-20. PTT Register Field Descriptions Field Description 7-6 PTT Port T general purpose input/output data—Data Register Port T pins 7 through 0 are associated with ECT channels IOC7 and IOC6. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTT Port T general purpose input/output data—Data Register Port T pins 5 is associated with ECT channel IOC5 and the VREG_API output. The ECT function takes precedence over the VREG_API and the general purpose I/O function if the related channel is enabled. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4-0 PTT Port T general purpose input/output data—Data Register Port T pins 4 through 0 are associated with ECT channels IOC4 through IOC0. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 121 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.22 Port T Input Register (PTIT) Access: User read(1) Address 0x0241 R 7 6 5 4 3 2 1 0 PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-20. Port T Input Register (PTIT) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-21. PTIT Register Field Descriptions Field Description 7-0 PTIT Port T input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.23 Port T Data Direction Register (DDRT) Access: User read/write(1) Address 0x0242 7 6 5 4 3 2 1 0 DDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 0 0 0 0 0 0 0 0 R W Reset Figure 2-21. Port T Data Direction Register (DDRT) 1. Read: Anytime. Write: Anytime. Table 2-22. DDRT Register Field Descriptions Field Description 7-0 DDRT Port T data direction— This register controls the data direction of pins 7 through 0. The ECT forces the I/O state to be an output for each timer port associated with an enabled output compare. In this case the data direction bits will not change. The data direction bits revert to controlling the I/O direction of a pin when the associated timer output compare is disabled. The timer Input Capture always monitors the state of the pin. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. MC9S12XE-Family Reference Manual , Rev. 1.21 122 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTT or PTIT registers, when changing the DDRT register. 2.3.24 Port T Reduced Drive Register (RDRT) Access: User read/write(1) Address 0x0243 7 6 5 4 3 2 1 0 RDRT7 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0 0 0 0 0 0 0 0 0 R W Reset Figure 2-22. Port T Reduced Drive Register (RDRT) 1. Read: Anytime. Write: Anytime. Table 2-23. RDRT Register Field Descriptions Field 7-0 RDRT 2.3.25 Description Port T reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port T Pull Device Enable Register (PERT) Access: User read/write(1) Address 0x0244 7 6 5 4 3 2 1 0 PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0 0 0 0 0 0 0 0 0 R W Reset Figure 2-23. Port T Pull Device Enable Register (PERT) 1. Read: Anytime. Write: Anytime. Table 2-24. PERT Register Field Descriptions Field Description 7-0 PERT Port T pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 123 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.26 Port T Polarity Select Register (PPST) Access: User read/write(1) Address 0x0245 7 6 5 4 3 2 1 0 PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 0 0 0 0 0 0 0 0 R W Reset Figure 2-24. Port T Polarity Select Register (PPST) 1. Read: Anytime. Write: Anytime. Table 2-25. PPST Register Field Descriptions Field 7-0 PPST 2.3.27 Description Port T pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. PIM Reserved Register Access: User read(1) Address 0x0246 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-25. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.28 PIM Reserved Register Access: User read(1) Address 0x0247 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-26. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 124 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.29 Port S Data Register (PTS) Access: User read/write(1) Address 0x0248 7 6 5 4 3 2 1 0 PTS7 PTST6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0 SS0 SCK0 MOSI0 MISO0 TXD1 RXD1 TXD0 RXD0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-27. Port S Data Register (PTS) 1. Read: Anytime. Write: Anytime. Table 2-26. PTS Register Field Descriptions Field Description 7 PTS Port S general purpose input/output data—Data Register Port S pin 7 is associated with the SS signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTS Port S general purpose input/output data—Data Register Port S pin 6 is associated with the SCK signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTS Port S general purpose input/output data—Data Register Port S pin 5 is associated with the MOSI signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4 PTS Port S general purpose input/output data—Data Register Port S pin 4 is associated with the MISO signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTS Port S general purpose input/output data—Data Register Port S pin 3 is associated with the TXD signal of the SCI1 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTS Port S general purpose input/output data—Data Register Port S bits 2 is associated with the RXD signal of the SCI1 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 125 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-26. PTS Register Field Descriptions (continued) Field Description 1 PTS Port S general purpose input/output data—Data Register Port S pin 3 is associated with the TXD signal of the SCI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTS Port S general purpose input/output data—Data Register Port S bits 2 is associated with the RXD signal of the SCI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.30 Port S Input Register (PTIS) Access: User read(1) Address 0x0249 R 7 6 5 4 3 2 1 0 PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-28. Port S Input Register (PTIS) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-27. PTIS Register Field Descriptions Field Description 7-0 PTIS Port S input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.31 Port S Data Direction Register (DDRS) Access: User read/write(1) Address 0x024A 7 6 5 4 3 2 1 0 DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 0 0 0 0 0 0 0 0 R W Reset Figure 2-29. Port S Data Direction Register (DDRS) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 126 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-28. DDRS Register Field Descriptions Field Description 7-0 DDRS Port S data direction— This register controls the data direction of pins 7 through 0.This register configures each Port S pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTS or PTIS registers, when changing the DDRS register. 2.3.32 Port S Reduced Drive Register (RDRS) Access: User read/write(1) Address 0x024B 7 6 5 4 3 2 1 0 RDRS7 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0 0 0 0 0 0 0 0 0 R W Reset Figure 2-30. Port S Reduced Drive Register (RDRS) 1. Read: Anytime. Write: Anytime. Table 2-29. RDRS Register Field Descriptions Field 7-0 RDRS Description Port S reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 127 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.33 Port S Pull Device Enable Register (PERS) Access: User read/write(1) Address 0x024C 7 6 5 4 3 2 1 0 PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 1 1 1 1 1 1 1 1 R W Reset Figure 2-31. Port S Pull Device Enable Register (PERS) 1. Read: Anytime. Write: Anytime. Table 2-30. PERS Register Field Descriptions Field Description 7-0 PERS Port S pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.34 Port S Polarity Select Register (PPSS) Access: User read/write(1) Address 0x024D 7 6 5 4 3 2 1 0 PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 0 0 0 0 0 0 0 0 R W Reset Figure 2-32. Port S Polarity Select Register (PPSS) 1. Read: Anytime. Write: Anytime. Table 2-31. PPSS Register Field Descriptions Field 7-0 PPSS Description Port S pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 128 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.35 Port S Wired-Or Mode Register (WOMS) Access: User read/write(1) Address 0x024E 7 6 5 4 3 2 1 0 WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0 0 0 0 0 0 0 0 0 R W Reset Figure 2-33. Port S Wired-Or Mode Register (WOMS) 1. Read: Anytime. Write: Anytime. Table 2-32. WOMS Register Field Descriptions Field Description 7-0 WOMS Port S wired-or mode—Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of “1” is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. 2.3.36 PIM Reserved Register Access: User read(1) Address 0x024F R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-34. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 129 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.37 Port M Data Register (PTM) Access: User read/write(1) Address 0x0250 7 6 5 4 3 2 1 0 PTM7 PTM6 PTM5 PTM4 PTM3 PTM2 PTM1 PTM0 TXCAN3 RXCAN3 TXCAN2 RXCAN2 TXCAN1 RXCAN1 TXCAN0 RXCAN0 — — (TXCAN0) (RXCAN0) (TXCAN0) (RXCAN0) — — (TXCAN4) (RXCAN4) (TXCAN4) (RXCAN4) — — — — — — (SCK0) (MOSI0) (SS0) (MISO0) — — TXD3 RXD3 — — — — — — 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-35. Port M Data Register (PTM) 1. Read: Anytime. Write: Anytime. Table 2-33. PTM Register Field Descriptions Field Description 7-6 PTM Port M general purpose input/output data—Data Register Port M pins 7 and 6 are associated with TXCAN and RXCAN signals of CAN3 and the routed CAN4, as well as with TXD and RXD signals of SCI3, respectively. The CAN3 function takes precedence over the CAN4, SCI3 and the general purpose I/O function if the CAN3 module is enabled. The CAN4 function takes precedence over the SCI3 and the general purpose I/O function if the CAN4 module is enabled. The SCI3 function takes precedence over the general purpose I/O function if the SCI3 module is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTM Port M general purpose input/output data—Data Register Port M pin 5 is associated with the TXCAN signal of CAN2 and the routed CAN4 and CAN0, as well as with SCK signals of SPI0. The CAN2 function takes precedence over the routed CAN0, routed CAN4, the routed SPI0 and the general purpose I/O function if the CAN2 module is enabled. The routed CAN0 function takes precedence over the routed CAN4, the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed CAN4 function takes precedence over the routed SPI0 and general purpose I/O function if the routed CAN4 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 130 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-33. PTM Register Field Descriptions (continued) Field Description 4 PTM Port M general purpose input/output data—Data Register Port M pin 4 is associated with the RXCAN signal of CAN2 and the routed CAN4 and CAN0, as well as with MOSI signals of SPI0. The CAN2 function takes precedence over the routed CAN0, routed CAN4, the routed SPI0 and the general purpose I/O function if the CAN2 module is enabled. The routed CAN0 function takes precedence over the routed CAN4, the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed CAN4 function takes precedence over the routed SPI0 and general purpose I/O function if the routed CAN4 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTM Port M general purpose input/output data—Data Register Port M pin 5 is associated with the TXCAN signal of CAN1 and the routed CAN0, as well as with SS0 signals of SPI0. The CAN1 function takes precedence over the routed CAN0, the routed SPI0 and the general purpose I/O function if the CAN1 module is enabled. The routed CAN0 function takes precedence over the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTM Port M general purpose input/output data—Data Register Port M pin 4 is associated with the RXCAN signal of CAN1 and the routed CAN0, as well as with MISO signals of SPI0. The CAN1 function takes precedence over the routed CAN0, the routed SPI0 and the general purpose I/O function if the CAN1 module is enabled. The routed CAN0 function takes precedence over the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 1-0 PTM Port M general purpose input/output data—Data Register Port M pins 1 and 0 are associated with TXCAN and RXCAN signals of CAN0, respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.38 Port M Input Register (PTIM) Access: User read(1) Address 0x0251 R 7 6 5 4 3 2 1 0 PTIM7 PTIM6 PTIM5 PTIM4 PTIM3 PTIM2 PTIM1 PTIM0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-36. Port M Input Register (PTIM) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 131 Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-34. PTIM Register Field Descriptions Field Description 7-0 PTIM Port M input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.39 Port M Data Direction Register (DDRM) Access: User read/write(1) Address 0x0252 7 6 5 4 3 2 1 0 DDRM7 DDRM6 DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0 0 0 0 0 0 0 0 0 R W Reset Figure 2-37. Port M Data Direction Register (DDRM) 1. Read: Anytime. Write: Anytime. Table 2-35. DDRM Register Field Descriptions Field Description 7 DDRM Port M data direction— This register controls the data direction of pin 7. The enabled CAN3, routed CAN4, or routed SCI3 forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRM Port M data direction— This register controls the data direction of pin 6. The enabled CAN3, routed CAN4, or routed SCI3 forces the I/O state to be an input. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 5 DDRM Port M data direction— This register controls the data direction of pin 5. The enabled CAN2, routed CAN0, or routed CAN4 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 132 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-35. DDRM Register Field Descriptions (continued) Field Description 4 DDRM Port M data direction— This register controls the data direction of pin 4. The enabled CAN2, routed CAN0, or routed CAN4 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output.In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 3 DDRM Port M data direction— This register controls the data direction of pin 3. The enabled CAN1 or routed CAN0 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 2 DDRM Port M data direction— This register controls the data direction of pin 2. The enabled CAN1 or routed CAN0 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output.In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 1 DDRM Port M data direction— This register controls the data direction of pin 1. The enabled CAN0 forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 0 DDRM Port M data direction— This register controls the data direction of pin 0. The enabled CAN0 forces the I/O state to be an input. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTM or PTIM registers, when changing the DDRM register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 133 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.40 Port M Reduced Drive Register (RDRM) Access: User read/write(1) Address 0x0253 7 6 5 4 3 2 1 0 RDRM7 RDRM6 RDRM5 RDRM4 RDRM3 RDRM2 RDRM1 RDRM0 0 0 0 0 0 0 0 0 R W Reset Figure 2-38. Port M Reduced Drive Register (RDRM) 1. Read: Anytime. Write: Anytime. Table 2-36. RDRM Register Field Descriptions Field Description 7-0 RDRM Port M reduced drive—Select reduced drive for outputs This register configures the drive strength of Port M output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.41 Port M Pull Device Enable Register (PERM) Access: User read/write(1) Address 0x0254 7 6 5 4 3 2 1 0 PERM7 PERM6 PERM5 PERM4 PERM3 PERM2 PERM1 PERM0 0 0 0 0 0 0 0 0 R W Reset Figure 2-39. Port M Pull Device Enable Register (PERM) 1. Read: Anytime. Write: Anytime. Table 2-37. PERM Register Field Descriptions Field Description 7-0 PERM Port M pull device enable—Enable pull-up devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input or wired-or output. This bit has no effect if the pin is used as push-pull output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 134 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.42 Port M Polarity Select Register (PPSM) Access: User read/write(1) Address 0x0255 7 6 5 4 3 2 1 0 PPSM7 PPSM6 PPSM5 PPSM4 PPSM3 PPSM2 PPSM1 PPSM0 0 0 0 0 0 0 0 0 R W Reset Figure 2-40. Port M Polarity Select Register (PPSM) 1. Read: Anytime. Write: Anytime. Table 2-38. PPSM Register Field Descriptions Field Description 7-0 PPSM Port M pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. If CAN is active a pull-up device can be activated on the RXCAN[3:0] inputs, but not a pull-down. 1 A pull-down device is connected to the associated Port M pin, if enabled by the associated bit in register PERM and if the port is used as a general purpose but not as RXCAN. 0 A pull-up device is connected to the associated Port M pin, if enabled by the associated bit in register PERM and if the port is used as general purpose or RXCAN input. 2.3.43 Port M Wired-Or Mode Register (WOMM) Access: User read/write(1) Address 0x0256 7 6 5 4 3 2 1 0 WOMM7 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0 0 0 0 0 0 0 0 0 R W Reset Figure 2-41. Port M Wired-Or Mode Register (WOMM) 1. Read: Anytime. Write: Anytime. Table 2-39. WOMM Register Field Descriptions Field Description 7-0 WOMM Port M wired-or mode—Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of “1” is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 135 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.44 Module Routing Register (MODRR) Access: User read/write(1) Address 0x0257 7 R 6 5 4 3 2 1 0 MODRR6 MODRR5 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0 0 0 0 0 0 0 0 0 W Reset 0 = Unimplemented or Reserved Figure 2-42. Module Routing Register (MODRR) 1. Read: Anytime. Write: Anytime. This register configures the re-routing of CAN0, CAN4, SPI0, SPI1, and SPI2 on alternative ports. Table 2-40. Module Routing Summary Module MODRR 6 CAN0 CAN4 5 4 3 Related Pins 2 1 0 RXCAN TXCAN x x x x x 0 0 PM0 PM1 x x x x x 0 1 PM2 PM3 x x x x x 1 0 PM4 PM5 x x x x x 1 1 PJ6 PJ7 x x x 0 0 x x PJ6 PJ7 x x x 0 1 x x PM4 PM5 x x x 1 0 x x PM6 PM7 x x x 1 1 x x Reserved MISO SPI0 SPI1 SPI2 MOSI SCK SS x x 0 x x x x PS4 PS5 PS6 PS7 x x 1 x x x x PM2 PM4 PM5 PM3 x 0 x x x x x PP0 PP1 PP2 PP3 x 1 x x x x x PH0 PH1 PH2 PH3 0 x x x x x x PP4 PP5 PP7 PP6 1 x x x x x x PH4 PH5 PH6 PH7 MC9S12XE-Family Reference Manual , Rev. 1.21 136 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.45 Port P Data Register (PTP) Access: User read/write(1) Address 0x0258 7 6 5 4 3 2 1 0 PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0 PWM7 PWM6 PWM5 PWM4 PWM3 PWM2 PWM1 PWM0 SCK2 SS2 MOSI2 MISO2 SS1 SCK1 MOSI1 MISO1 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-43. Port P Data Register (PTP) 1. Read: Anytime. Write: Anytime. Table 2-41. PTP Register Field Descriptions Field Description 7 PTP Port P general purpose input/output data—Data Register Port P pin 6 is associated with the PWM output channel 7 and the SCK signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 7 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTP Port P general purpose input/output data—Data Register Port P pin 6 is associated with the PWM output channel 6 and the SS signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 6 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTP Port P general purpose input/output data—Data Register Port P pin 5 is associated with the PWM output channel 5 and the MOSI signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 5 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4 PTP Port P general purpose input/output data—Data Register Port P pin 4 is associated with the PWM output channel 4 and the MISO signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 4 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 137 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-41. PTP Register Field Descriptions (continued) Field Description 3 PTP Port P general purpose input/output data—Data Register Port P pin 3 is associated with the PWM output channel 3 and the SS signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 3 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTP Port P general purpose input/output data—Data Register Port P pin 2 is associated with the PWM output channel 2 and the SCK signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 2 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 1 PTP Port P general purpose input/output data—Data Register Port P pin 1 is associated with the PWM output channel 1 and the MOSI signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 1 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTP Port P general purpose input/output data—Data Register Port P pin 0 is associated with the PWM output channel 0 and the MISO signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 0 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.46 Port P Input Register (PTIP) Access: User read(1) Address 0x0259 R 7 6 5 4 3 2 1 0 PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-44. Port P Input Register (PTIP) 1. Read: Anytime. Write:Never, writes to this register have no effect. MC9S12XE-Family Reference Manual , Rev. 1.21 138 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-42. PTIP Register Field Descriptions Field Description 7-0 PTIP Port P input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.47 Port P Data Direction Register (DDRP) Access: User read/write(1) Address 0x025A 7 6 5 4 3 2 1 0 DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-45. Port P Data Direction Register (DDRP) 1. Read: Anytime. Write: Anytime. Table 2-43. DDRP Register Field Descriptions Field Description 7 DDRP Port P data direction— This register controls the data direction of pin 7. The enabled PWM channel 7 forces the I/O state to be an output. If the PWM shutdown feature is enabled this pin is forced to be an input. In these cases the data direction bit will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6-0 DDRP Port P data direction— The PWM forces the I/O state to be an output for each port line associated with an enabled PWM6-0 channel. In this case the data direction bit will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTP or PTIP registers, when changing the DDRP register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 139 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.48 Port P Reduced Drive Register (RDRP) Access: User read/write(1) Address 0x025B 7 6 5 4 3 2 1 0 RDRP7 RDRP6 RDRP5 RDRP4 RDRP3 RDRP2 RDRP1 RDRP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-46. Port P Reduced Drive Register (RDRP) 1. Read: Anytime. Write: Anytime. Table 2-44. RDRP Register Field Descriptions Field 7-0 RDRP 2.3.49 Description Port P reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port P Pull Device Enable Register (PERP) Access: User read/write(1) Address 0x025C 7 6 5 4 3 2 1 0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-47. Port P Pull Device Enable Register (PERP) 1. Read: Anytime. Write: Anytime. Table 2-45. PERP Register Field Descriptions Field Description 7-0 PERP Port P pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 140 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.50 Port P Polarity Select Register (PPSP) Access: User read/write(1) Address 0x025D 7 6 5 4 3 2 1 0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-48. Port P Polarity Select Register (PPSP) 1. Read: Anytime. Write: Anytime. Table 2-46. PPSP Register Field Descriptions Field Description 7-0 PPSP Port P pull device select—Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port P pin sets the associated flag bit in the PIFP register. A pull-down device is connected to the associated Port P pin, if enabled by the associated bit in register PERP and if the port is used as input. 0 A falling edge on the associated Port P pin sets the associated flag bit in the PIFP register.A pull-up device is connected to the associated Port P pin, if enabled by the associated bit in register PERP and if the port is used as input. 2.3.51 Port P Interrupt Enable Register (PIEP) Read: Anytime. Access: User read/write(1) Address 0x025E 7 6 5 4 3 2 1 0 PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-49. Port P Interrupt Enable Register (PIEP) 1. Read: Anytime. Write: Anytime. Table 2-47. PPSP Register Field Descriptions Field 7-0 PIEP Description Port P interrupt enable— This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port P. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 141 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.52 Port P Interrupt Flag Register (PIFP) Access: User read/write(1) Address 0x025F 7 6 5 4 3 2 1 0 PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 0 0 0 0 0 0 0 0 R W Reset Figure 2-50. Port P Interrupt Flag Register (PIFP) 1. Read: Anytime. Write: Anytime. Table 2-48. PPSP Register Field Descriptions Field Description 7-0 PIFP Port P interrupt flag— Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSP register. To clear this flag, write logic level 1 to the corresponding bit in the PIFP register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. 2.3.53 Port H Data Register (PTH) Access: User read/write(1) Address 0x0260 7 6 5 4 3 2 1 0 PTH7 PTH6 PTH5 PTH4 PTH3 PTH2 PTH1 PTH0 SS2 SCK2 MOSI2 MISO2 SS1 SCK1 MOSI1 MISO1 TXD5 RXD5 TXD4 RXD4 TXD7 RXD7 TXD6 RXD6 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-51. Port H Data Register (PTH) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 142 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-49. PTH Register Field Descriptions Field Description 7 PTH Port H general purpose input/output data—Data Register Port H pin 7 is associated with the TXD signal of the SCI5 module and the SS signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI5 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI5 function takes precedence over the general purpose I/O function if the SCI5 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTH Port H general purpose input/output data—Data Register Port H pin 6 is associated with the RXD signal of the SCI5 module and the SCK signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI5 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI5 function takes precedence over the general purpose I/O function if the SCI5 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTH Port H general purpose input/output data—Data Register Port H pin 5 is associated with the TXD signal of the SCI4 module and the MOSI signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI4 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI4 function takes precedence over the general purpose I/O function if the SCI4 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4 PTH Port H general purpose input/output data—Data Register Port H pin 4 is associated with the RXD signal of the SCI4 module and the MISO signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI4 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI4 function takes precedence over the general purpose I/O function if the SCI4 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTH Port H general purpose input/output data—Data Register Port H pin 3 is associated with the TXD signal of the SCI7 module and the SS signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI7 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI7 function takes precedence over the general purpose I/O function if the SCI7 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTH Port H general purpose input/output data—Data Register Port H pin 2 is associated with the RXD signal of the SCI7 module and the SCK signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI7 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI7 function takes precedence over the general purpose I/O function if the SCI7 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 143 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-49. PTH Register Field Descriptions (continued) Field Description 1 PTH Port H general purpose input/output data—Data Register Port H pin 1 is associated with the TXD signal of the SCI6 module and the MOSI signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI6 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI6 function takes precedence over the general purpose I/O function if the SCI6 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTH Port H general purpose input/output data—Data Register Port H pin 0 is associated with the RXD signal of the SCI6 module and the MISO signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI6 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI6 function takes precedence over the general purpose I/O function if the SCI6 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.54 Port H Input Register (PTIH) Access: User read(1) Address 0x0261 R 7 6 5 4 3 2 1 0 PTIH7 PTIH6 PTIH5 PTIH4 PTIH3 PTIH2 PTIH1 PTIH0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-52. Port H Input Register (PTIH) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-50. PTIH Register Field Descriptions Field Description 7-0 PTIH Port H input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.55 Port H Data Direction Register (DDRH) Access: User read/write(1) Address 0x0262 7 6 5 4 3 2 1 0 DDRH7 DDRH6 DDRH5 DDRH4 DDRH3 DDRH2 DDRH1 DDRH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-53. Port H Data Direction Register (DDRH) MC9S12XE-Family Reference Manual , Rev. 1.21 144 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write: Anytime. Table 2-51. DDRH Register Field Descriptions Field Description 7 DDRH Port H data direction— This register controls the data direction of pin 7. The enabled SCI5 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRH Port H data direction— This register controls the data direction of pin 6. The enabled SCI5 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 5 DDRH Port H data direction— This register controls the data direction of pin 5. The enabled SCI4 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 4 DDRH Port H data direction— This register controls the data direction of pin 4. The enabled SCI4 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 3 DDRH Port H data direction— This register controls the data direction of pin 3. The enabled SCI7 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 2 DDRH Port H data direction— This register controls the data direction of pin 2. The enabled SCI7 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 145 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-51. DDRH Register Field Descriptions (continued) Field Description 1 DDRH Port H data direction— This register controls the data direction of pin 1. The enabled SCI6 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 0 DDRH Port H data direction— This register controls the data direction of pin 0. The enabled SCI6 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTH or PTIH registers, when changing the DDRH register. 2.3.56 Port H Reduced Drive Register (RDRH) Access: User read/write(1) Address 0x0263 7 6 5 4 3 2 1 0 RDRH7 RDRH6 RDRH5 RDRH4 RDRH3 RDRH2 RDRH1 RDRH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-54. Port H Reduced Drive Register (RDRH) 1. Read: Anytime. Write: Anytime. Table 2-52. RDRH Register Field Descriptions Field 7-0 RDRH Description Port H reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 146 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.57 Port H Pull Device Enable Register (PERH) Access: User read/write(1) Address 0x0264 7 6 5 4 3 2 1 0 PERH7 PERH6 PERH5 PERH4 PERH3 PERH2 PERH1 PERH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-55. Port H Pull Device Enable Register (PERH) 1. Read: Anytime. Write: Anytime. Table 2-53. PERH Register Field Descriptions Field Description 7-0 PERH Port H pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.58 Port H Polarity Select Register (PPSH) Access: User read/write(1) Address 0x0265 7 6 5 4 3 2 1 0 PPSH7 PPSH6 PPSH5 PPSH4 PPSH3 PPSH2 PPSH1 PPSH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-56. Port H Polarity Select Register (PPSH) 1. Read: Anytime. Write: Anytime. Table 2-54. PPSH Register Field Descriptions Field Description 7-0 PPSH Port H pull device select—Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port H pin sets the associated flag bit in the PIFH register. A pull-down device is connected to the associated Port H pin, if enabled by the associated bit in register PERH and if the port is used as input. 0 A falling edge on the associated Port H pin sets the associated flag bit in the PIFH register.A pull-up device is connected to the associated Port H pin, if enabled by the associated bit in register PERH and if the port is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 147 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.59 Port H Interrupt Enable Register (PIEH) Read: Anytime. Access: User read/write(1) Address 0x0266 7 6 5 4 3 2 1 0 PIEH7 PIEH6 PIEH5 PIEH4 PIEH3 PIEH2 PIEH1 PIEH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-57. Port H Interrupt Enable Register (PIEH) 1. Read: Anytime. Write: Anytime. Table 2-55. PPSP Register Field Descriptions Field 7-0 PIEH 2.3.60 Description Port H interrupt enable— This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port H. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). Port H Interrupt Flag Register (PIFH) Access: User read/write(1) Address 0x0267 7 6 5 4 3 2 1 0 PIFH7 PIFH6 PIFH5 PIFH4 PIFH3 PIFH2 PIFH1 PIFH0 0 0 0 0 0 0 0 0 R W Reset Figure 2-58. Port H Interrupt Flag Register (PIFH) 1. Read: Anytime. Write: Anytime. Table 2-56. PPSP Register Field Descriptions Field Description 7-0 PIFH Port H interrupt flag— Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSH register. To clear this flag, write logic level 1 to the corresponding bit in the PIFH register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. MC9S12XE-Family Reference Manual , Rev. 1.21 148 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.61 Port J Data Register (PTJ) Access: User read/write(1) Address 0x0268 7 6 5 4 3 2 1 0 PTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0 TXCAN4 RXCAN4 — — — — TXD2 RXD2 SCL0 SDA0 SCL1 SDA1 — — — — (TXCAN0) (RXCAN0) CS2 CS0 — CS1 — CS3 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-59. Port J Data Register (PTJ) 1. Read: Anytime. Write: Anytime. Table 2-57. PTJ Register Field Descriptions Field Description 7-6 PTJ Port J general purpose input/output data—Data Register Port J pins 7 and 6 are associated with TXCAN and RXCAN signals of CAN4 and the routed CAN0, as well as with SCL and SDA signals of IIC0, respectively. The CAN4 function takes precedence over the IIC0, the routed CAN0 and the general purpose I/O function if the CAN4 module is enabled. The IIC0 function takes precedence over the routed CAN0 and the general purpose I/O function if the IIC0 is enabled. If the IIC0 module takes precedence the SDA0 and SCL0 outputs are configured as open drain outputs. The routed CAN0 function takes precedence over the general purpose I/O function if the routed CAN0 module is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5-4 PTJ Port J general purpose input/output data—Data Register This pin is associated with the SCL and SDA signals of IIC1, and with chip select outputs CS2 and CS0, respectively. The IIC1 function takes precedence over the chip select and general purpose I/O function if the IIC1 is enabled. The chip selects take precedence over the general purpose I/O. If the IIC1 module takes precedence the SDA1 and SCL1 outputs are configured as open drain outputs. Refer to IIC section for details. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTJ Port J general purpose input/output data—Data Register This pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTJ Port J general purpose input/output data—Data Register This pin is associated with the chip select output signal CS2. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 149 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-57. PTJ Register Field Descriptions (continued) Field Description 1 PTJ Port J general purpose input/output data—Data Register This pin is associated with the TXD signal of SCI2. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTJ Port J general purpose input/output data—Data Register This pin is associated with the TXD signal of SCI2 and chip select output CS3. The SCI function takes precedence over the chip select and general purpose I/O function if the SCI2 is enabled. The chip select takes precedence over the general purpose I/O. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.62 Port J Input Register (PTIJ) Access: User read(1) Address 0x0269 R 7 6 5 4 3 2 1 0 PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-60. Port J Input Register (PTIJ) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-58. PTIJ Register Field Descriptions Field Description 7-0 PTIJ Port J input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.63 Port J Data Direction Register (DDRJ) Access: User read/write(1) Address 0x026A 7 6 5 4 3 2 1 0 DDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0 0 0 0 0 0 0 0 0 R W Reset Figure 2-61. Port J Data Direction Register (DDRJ) MC9S12XE-Family Reference Manual , Rev. 1.21 150 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write: Anytime. Table 2-59. DDRJ Register Field Descriptions Field Description 7 DDRJ Port J data direction— This register controls the data direction of pin 7. The enabled CAN4 or routed CAN0 forces the I/O state to be an output. The enabled IIC0 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRJ Port J data direction— This register controls the data direction of pin 6. The enabled CAN4 or routed CAN0 forces the I/O state to be an input. The enabled IIC0 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 5 DDRJ Port J data direction— This register controls the data direction of pin 5. The enabled CS2 signal forces the I/O state to be an output. The enabled IIC1 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 4 DDRJ Port J data direction— This register controls the data direction of pin 4. The enabled CS0 signal forces the I/O state to be an output. The enabled IIC1 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 3 DDRJ Port J data direction— This register controls the data direction of pin 3. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 2 DDRJ Port J data direction— This register controls the data direction of pin 2. The enabled CS1 signal forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 151 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-59. DDRJ Register Field Descriptions (continued) Field Description 1 DDRJ Port J data direction— This register controls the data direction of pin 1. The enabled SCI2 forces the I/O state to be an output. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 0 DDRJ Port J data direction— This register controls the data direction of pin 0. The enabled SCI3 or CS3 signal forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTH or PTIH registers, when changing the DDRH register. 2.3.64 Port J Reduced Drive Register (RDRJ) Access: User read/write(1) Address 0x026B 7 6 5 4 3 2 1 0 RDRJ7 RDRJ6 RDRJ5 RDRJ4 RDRJ3 RDRJ2 RDRJ1 RDRJ0 0 0 0 0 0 0 0 0 R W Reset Figure 2-62. Port J Reduced Drive Register (RDRJ) 1. Read: Anytime. Write: Anytime. Table 2-60. RDRJ Register Field Descriptions Field 7-0 RDRJ Description Port J reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 152 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.65 Port J Pull Device Enable Register (PERJ) Access: User read/write(1) Address 0x026C 7 6 5 4 3 2 1 0 PERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0 1 1 1 1 1 1 1 1 R W Reset Figure 2-63. Port J Pull Device Enable Register (PERJ) 1. Read: Anytime. Write: Anytime. Table 2-61. PERJ Register Field Descriptions Field Description 7-0 PERJ Port J pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull device are enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.66 Port J Polarity Select Register (PPSJ) Access: User read/write(1) Address 0x026D 7 6 5 4 3 2 1 0 PPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0 0 0 0 0 0 0 0 0 R W Reset Figure 2-64. Port J Polarity Select Register (PPSJ) 1. Read: Anytime. Write: Anytime. Table 2-62. PPSJ Register Field Descriptions Field Description 7-0 PPSJ Port J pull device select—Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port J pin sets the associated flag bit in the PIFJ register. A pull-down device is connected to the associated Port J pin, if enabled by the associated bit in register PERJ and if the port is used as input. 0 A falling edge on the associated Port J pin sets the associated flag bit in the PIFJ register.A pull-up device is connected to the associated Port J pin, if enabled by the associated bit in register PERJ and if the port is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 153 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.67 Port J Interrupt Enable Register (PIEJ) Read: Anytime. Access: User read/write(1) Address 0x026E 7 6 5 4 3 2 1 0 PIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0 0 0 0 0 0 0 0 0 R W Reset Figure 2-65. Port J Interrupt Enable Register (PIEJ) 1. Read: Anytime. Write: Anytime. Table 2-63. PPSP Register Field Descriptions Field 7-0 PIEJ 2.3.68 Description Port J interrupt enable— This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port J. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). Port J Interrupt Flag Register (PIFJ) Access: User read/write(1) Address 0x026F 7 6 5 4 3 2 1 0 PIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0 0 0 0 0 0 0 0 0 R W Reset Figure 2-66. Port J Interrupt Flag Register (PIFJ) 1. Read: Anytime. Write: Anytime. Table 2-64. PPSP Register Field Descriptions Field Description 7-0 PIFJ Port J interrupt flag— Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSJ register. To clear this flag, write logic level 1 to the corresponding bit in the PIFJ register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. MC9S12XE-Family Reference Manual , Rev. 1.21 154 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.69 Port AD0 Data Register 0 (PT0AD0) Access: User read/write(1) Address 0x0270 7 6 5 4 3 2 1 0 PT0AD07 PT0AD06 PT0AD05 PT0AD04 PT0AD03 PT0AD02 PT0AD01 PT0AD00 AN15 AN14 AN13 AN12 AN11 AN10 AN9 AN8 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-67. Port AD0 Data Register 0 (PT0AD0) 1. Read: Anytime. Write: Anytime. Table 2-65. PT0AD0 Register Field Descriptions Field Description 7-0 PT0AD0 Port AD0 general purpose input/output data—Data Register This register is associated with ATD0 analog inputs AN[15:8] on PAD[15:8], respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.70 Port AD0 Data Register 1 (PT1AD0) Access: User read/write(1) Address 0x0271 7 6 5 4 3 2 1 0 PT1AD07 PT1AD06 PT1AD05 PT1AD04 PT1AD03 PT1AD02 PT1AD01 PT1AD00 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-68. Port AD0 Data Register 1 (PT1AD0) 1. Read: Anytime. Write: Anytime. Table 2-66. PT1AD0 Register Field Descriptions Field Description 7-0 PT1AD0 Port AD0 general purpose input/output data—Data Register This register is associated with ATD0 analog inputs AN[7:0] on PAD[7:0], respectively. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 155 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.71 Port AD0 Data Direction Register 0 (DDR0AD0) Access: User read/write(1) Address 0x0272 7 6 5 4 3 2 1 0 DDR0AD07 DDR0AD06 DDR0AD05 DDR0AD04 DDR0AD03 DDR0AD02 DDR0AD01 DDR0AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-69. Port AD0 Data Direction Register 0 (DDR0AD0) 1. Read: Anytime. Write: Anytime. Table 2-67. DDR0AD0 Register Field Descriptions Field Description 7-0 Port AD0 data direction— DDR0AD0 This register controls the data direction of pins 15 through 8. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD0 registers, when changing the DDR0AD0 register. NOTE To use the digital input function on Port AD0 the ATD Digital Input Enable Register (ATD0DIEN1) has to be set to logic level “1”. 2.3.72 Port AD0 Data Direction Register 1 (DDR1AD0) Access: User read/write(1) Address 0x0273 7 6 5 4 3 2 1 0 DDR1AD07 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-70. Port AD0 Data Direction Register 1 (DDR1AD0) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 156 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-68. DDR1AD0 Register Field Descriptions Field Description 7-0 Port AD0 data direction— DDR1AD0 This register controls the data direction of pins 7 through 0. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD0 registers, when changing the DDR1AD0 register. NOTE To use the digital input function on Port AD0 the ATD Digital Input Enable Register (ATD0DIEN1) has to be set to logic level “1”. 2.3.73 Port AD0 Reduced Drive Register 0 (RDR0AD0) Access: User read/write(1) Address 0x0274 7 6 5 4 3 2 1 0 RDR0AD07 RDR0AD06 RDR0AD05 RDR0AD04 RDR0AD03 RDR0AD02 RDR0AD01 RDR0AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-71. Port AD0 Reduced Drive Register 0 (RDR0AD0) 1. Read: Anytime. Write: Anytime. Table 2-69. RDR0AD0 Register Field Descriptions Field Description 7-0 Port AD0 reduced drive—Select reduced drive for Port AD0 outputs RDR0AD0 This register configures the drive strength of Port AD0 output pins 15 through 8 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 157 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.74 Port AD0 Reduced Drive Register 1 (RDR1AD0) Access: User read/write(1) Address 0x0275 7 6 5 4 3 2 1 0 RDR1AD07 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-72. Port AD0 Reduced Drive Register 1 (RDR1AD0) 1. Read: Anytime. Write: Anytime. Table 2-70. RDR1AD0 Register Field Descriptions Field Description 7-0 Port AD0 reduced drive—Select reduced drive for Port AD0 outputs RDR1AD0 This register configures the drive strength of Port AD0 output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.75 Port AD0 Pull Up Enable Register 0 (PER0AD0) Access: User read/write(1) Address 0x0276 7 6 5 4 3 2 1 0 PER0AD07 PER0AD06 PER0AD05 PER0AD04 PER0AD03 PER0AD02 PER0AD01 PER0AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-73. Port AD0 Pull Device Up Register 0 (PER0AD0) 1. Read: Anytime. Write: Anytime. Table 2-71. PER0AD0 Register Field Descriptions Field Description 7-0 Port AD0 pull device enable—Enable pull devices on input pins PER0AD0 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 158 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.76 Port AD0 Pull Up Enable Register 1 (PER1AD0) Access: User read/write(1) Address 0x0277 7 6 5 4 3 2 1 0 PER1AD07 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00 0 0 0 0 0 0 0 0 R W Reset Figure 2-74. Port AD0 Pull Up Enable Register 1 (PER1AD0) 1. Read: Anytime. Write: Anytime. Table 2-72. PER1AD0 Register Field Descriptions Field Description 7-0 Port AD0 pull device enable—Enable pull devices on input pins PER1AD0 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.77 Port AD1 Data Register 0 (PT0AD1) Access: User read/write(1) Address 0x0278 7 6 5 4 3 2 1 0 PT0AD17 PT0AD16 PT0AD15 PT0AD14 PT0AD13 PT0AD12 PT0AD11 PT0AD10 AN15 AN14 AN13 AN12 AN11 AN10 AN9 AN8 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-75. Port AD1 Data Register 0 (PT0AD1) 1. Read: Anytime. Write: Anytime. Table 2-73. PT0AD1 Register Field Descriptions Field Description 7-0 PT0AD1 Port AD1 general purpose input/output data—Data Register This register is associated with ATD1 analog inputs AN[15:8] on PAD[31:24], respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 159 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.78 Port AD1 Data Register 1 (PT1AD1) Access: User read/write(1) Address 0x0279 7 6 5 4 3 2 1 0 PT1AD17 PT1AD16 PT1AD15 PT1AD14 PT1AD13 PT1AD12 PT1AD11 PT1AD10 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-76. Port AD1 Data Register 1 (PT1AD1) 1. Read: Anytime. Write: Anytime. Table 2-74. PT1AD1 Register Field Descriptions Field Description 7-0 PT1AD1 Port AD1 general purpose input/output data—Data Register This register is associated with ATD1 analog inputs AN[7:0] on PAD[23:16], respectively. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.79 Port AD1 Data Direction Register 0 (DDR0AD1) Access: User read/write(1) Address 0x027A 7 6 5 4 3 2 1 0 DDR0AD17 DDR0AD16 DDR0AD15 DDR0AD14 DDR0AD13 DDR0AD12 DDR0AD11 DDR0AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-77. Port AD1 Data Direction Register 0 (DDR0AD1) 1. Read: Anytime. Write: Anytime. Table 2-75. DDR0AD1 Register Field Descriptions Field Description 7-0 Port AD1 data direction— DDR0AD1 This register controls the data direction of pins 15 through 8. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 160 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD1 registers, when changing the DDR0AD1 register. NOTE To use the digital input function on Port AD1 the ATD Digital Input Enable Register (ATD1DIEN1) has to be set to logic level “1”. 2.3.80 Port AD1 Data Direction Register 1 (DDR1AD1) Access: User read/write(1) Address 0x027B 7 6 5 4 3 2 1 0 DDR1AD17 DDR1AD16 DDR1AD15 DDR1AD14 DDR1AD13 DDR1AD12 DDR1AD11 DDR1AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-78. Port AD1 Data Direction Register 1 (DDR1AD1) 1. Read: Anytime. Write: Anytime. Table 2-76. DDR1AD1 Register Field Descriptions Field Description 7-0 Port AD1 data direction— DDR1AD1 This register controls the data direction of pins 7 through 0. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD1 registers, when changing the DDR1AD1 register. NOTE To use the digital input function on Port AD1 the ATD Digital Input Enable Register (ATD1DIEN1) has to be set to logic level “1”. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 161 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.81 Port AD1 Reduced Drive Register 0 (RDR0AD1) Access: User read/write(1) Address 0x027C 7 6 5 4 3 2 1 0 RDR0AD17 RDR0AD16 RDR0AD15 RDR0AD14 RDR0AD13 RDR0AD12 RDR0AD11 RDR0AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-79. Port AD1 Reduced Drive Register 0 (RDR0AD1) 1. Read: Anytime. Write: Anytime. Table 2-77. RDR0AD1 Register Field Descriptions Field Description 7-0 Port AD1 reduced drive—Select reduced drive for Port AD1 outputs RDR0AD1 This register configures the drive strength of Port AD1 output pins 15 through 8 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.82 Port AD1 Reduced Drive Register 1 (RDR1AD1) Access: User read/write(1) Address 0x027D 7 6 5 4 3 2 1 0 RDR1AD17 RDR1AD16 RDR1AD15 RDR1AD14 RDR1AD13 RDR1AD12 RDR1AD11 RDR1AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-80. Port AD1 Reduced Drive Register 1 (RDR1AD1) 1. Read: Anytime. Write: Anytime. Table 2-78. RDR1AD1 Register Field Descriptions Field Description 7-0 Port AD1 reduced drive—Select reduced drive for Port AD1 outputs RDR1AD1 This register configures the drive strength of Port AD1 output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 162 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.83 Port AD1 Pull Up Enable Register 0 (PER0AD1) Access: User read/write(1) Address 0x027E 7 6 5 4 3 2 1 0 PER0AD17 PER0AD16 PER0AD15 PER0AD14 PER0AD13 PER0AD12 PER0AD11 PER0AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-81. Port AD1 Pull Device Up Register 0 (PER0AD1) 1. Read: Anytime. Write: Anytime. Table 2-79. PER0AD1 Register Field Descriptions Field Description 7-0 Port AD1 pull device enable—Enable pull devices on input pins PER0AD1 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.84 Port AD1 Pull Up Enable Register 1 (PER1AD1) Access: User read/write(1) Address 0x027F 7 6 5 4 3 2 1 0 PER1AD17 PER1AD16 PER1AD15 PER1AD14 PER1AD13 PER1AD12 PER1AD11 PER1AD10 0 0 0 0 0 0 0 0 R W Reset Figure 2-82. Port AD1 Pull Up Enable Register 1 (PER1AD1) 1. Read: Anytime. Write: Anytime. Table 2-80. PER1AD1 Register Field Descriptions Field Description 7-0 Port AD1 pull device enable—Enable pull devices on input pins PER1AD1 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 163 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.85 Port R Data Register (PTR) Access: User read/write(1) Address 0x0368 7 6 5 4 3 2 1 0 PTR7 PTR6 PTR5 PTR4 PTR3 PTR2 PTR1 PTR0 TIMIOC7 TIMIOC6 TIMIOC5 TIMIOC4 TIMIOC3 TIMIOC2 TIMIOC1 TIMIOC0 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-83. Port R Data Register (PTR) 1. Read: Anytime. Write: Anytime. Table 2-81. PTR Register Field Descriptions Field Description 7-0 PTR Port R general purpose input/output data—Data Register Port R pins 7 through 0 are associated with TIM channels TIMIOC7 through TIMIOC0. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.86 Port R Input Register (PTIR) Access: User read(1) Address 0x0369 R 7 6 5 4 3 2 1 0 PTIR7 PTIR6 PTIR5 PTIR4 PTIR3 PTIR2 PTIR1 PTIR0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-84. Port R Input Register (PTIR) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-82. PTIR Register Field Descriptions Field Description 7-0 PTIR Port R input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. MC9S12XE-Family Reference Manual , Rev. 1.21 164 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.87 Port R Data Direction Register (DDRR) Access: User read/write(1) Address 0x036A 7 6 5 4 3 2 1 0 DDRR7 DDRR6 DDRR5 DDRR4 DDRR3 DDRR2 DDRR1 DDRR0 0 0 0 0 0 0 0 0 R W Reset Figure 2-85. Port R Data Direction Register (DDRR) 1. Read: Anytime. Write: Anytime. Table 2-83. DDRR Register Field Descriptions Field Description 7-0 DDRR Port R data direction— This register controls the data direction of pins 7 through 0. The TIM forces the I/O state to be an output for each timer port associated with an enabled output compare. In this case the data direction bits will not change. The data direction bits revert to controlling the I/O direction of a pin when the associated timer output compare is disabled. The timer Input Capture always monitors the state of the pin. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTR or PTIR registers, when changing the DDRR register. 2.3.88 Port R Reduced Drive Register (RDRR) Access: User read/write(1) Address 0x036B 7 6 5 4 3 2 1 0 RDRR7 RDRR6 RDRR5 RDRR4 RDRR3 RDRR2 RDRR1 RDRR0 0 0 0 0 0 0 0 0 R W Reset Figure 2-86. Port R Reduced Drive Register (RDRR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 165 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-84. RDRR Register Field Descriptions Field 7-0 RDRR 2.3.89 Description Port R reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port R Pull Device Enable Register (PERR) Access: User read/write(1) Address 0x036C 7 6 5 4 3 2 1 0 PERR7 PERR6 PERR5 PERR4 PERR3 PERR2 PERR1 PERR0 0 0 0 0 0 0 0 0 R W Reset Figure 2-87. Port R Pull Device Enable Register (PERR) 1. Read: Anytime. Write: Anytime. Table 2-85. PERR Register Field Descriptions Field Description 7-0 PERR Port R pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.90 Port R Polarity Select Register (PPSR) Access: User read/write(1) Address 0x036D 7 6 5 4 3 2 1 0 PPSR7 PPSR6 PPSR5 PPSR4 PPSR3 PPSR2 PPSR1 PPSR0 0 0 0 0 0 0 0 0 R W Reset Figure 2-88. Port R Polarity Select Register (PPSR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 166 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-86. PPSR Register Field Descriptions Field 7-0 PPSR 2.3.91 Description Port R pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. PIM Reserved Register Access: User read(1) Address 0x036E R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-89. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.92 Port R Routing Register (PTRRR) Access: User read/write(1) Address 0x036F 7 6 5 4 3 2 1 0 PTRRR7 PTRRR6 PTRRR5 PTRRR4 PTRRR3 PTRRR2 PTRRR1 PTRRR0 0 0 0 0 0 0 0 0 R W Reset = Unimplemented or Reserved Figure 2-90. Port R Routing Register (PTRRR) 1. Read: Anytime. Write: Anytime. Table 2-87. PTR Routing Register Field Descriptions Field Description 7 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC7 is available on PP7 0 TIMIOC7 is available on PR7 6 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC6 is available on PP6 0 TIMIOC6 is available on PR6 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 167 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-87. PTR Routing Register Field Descriptions (continued) Field Description 5 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC5 is available on PP5 0 TIMIOC5 is available on PR5 4 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC4 is available on PP4 0 TIMIOC4 is available on PR4 3 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC3 is available on PP3 0 TIMIOC3 is available on PR3 2 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC2 is available on PP2 0 TIMIOC2 is available on PR2 1 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC1 is available on PP1 0 TIMIOC1 is available on PR1 0 PTRRR Port R routing— This register configures the re-routing of the associated TIM channel. 1 TIMIOC0 is available on PP0 0 TIMIOC0 is available on PR0 2.3.93 Port L Data Register (PTL) Access: User read/write(1) Address 0x0370 7 6 5 4 3 2 1 0 PTL7 PTLT6 PTL5 PTL4 PTL3 PTL2 PTL1 PTL0 (TXD7) (RXD7) (TXD6) (RXD6) (TXD5) (RXD5) (TXD4) (RXD4) 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-91. Port L Data Register (PTL) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 168 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-88. PTL Register Field Descriptions Field Description 7 PTL Port L general purpose input/output data—Data Register Port L pin 7 is associated with the TXD signal of the SCI7 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTL Port L general purpose input/output data—Data Register Port L pin 6 is associated with the RXD signal of the SCI7 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTL Port L general purpose input/output data—Data Register Port L pin 5 is associated with the TXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4 PTL Port L general purpose input/output data—Data Register Port L pin 4 is associated with the RXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTL Port L general purpose input/output data—Data Register Port L pin 3 is associated with the TXD signal of the SC5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTL Port L general purpose input/output data—Data Register Port L pin 2 is associated with the RXD signal of the SCI5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 1 PTL Port L general purpose input/output data—Data Register Port L pin 3 is associated with the TXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTL Port L general purpose input/output data—Data Register Port L pin 2 is associated with the RXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 169 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.94 Port L Input Register (PTIL) Access: User read(1) Address 0x0371 R 7 6 5 4 3 2 1 0 PTIL7 PTIL6 PTIL5 PTIL4 PTIL3 PTIL2 PTIL1 PTIL0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-92. Port L Input Register (PTIL) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-89. PTIL Register Field Descriptions Field Description 7-0 PTIL Port L input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.95 Port L Data Direction Register (DDRL) Access: User read/write(1) Address 0x0372 7 6 5 4 3 2 1 0 DDRL7 DDRL6 DDRL5 DDRL4 DDRL3 DDRL2 DDRL1 DDRL0 0 0 0 0 0 0 0 0 R W Reset Figure 2-93. Port L Data Direction Register (DDRL) 1. Read: Anytime. Write: Anytime. Table 2-90. DDRL Register Field Descriptions Field Description 7-0 DDRL Port L data direction— This register controls the data direction of pins 7 through 0.This register configures each Port L pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 170 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTL or PTIL registers, when changing the DDRL register. 2.3.96 Port L Reduced Drive Register (RDRL) Access: User read/write(1) Address 0x0373 7 6 5 4 3 2 1 0 RDRL7 RDRL6 RDRL5 RDRL4 RDRL3 RDRL2 RDRL1 RDRL0 0 0 0 0 0 0 0 0 R W Reset Figure 2-94. Port L Reduced Drive Register (RDRL) 1. Read: Anytime. Write: Anytime. Table 2-91. RDRL Register Field Descriptions Field 7-0 RDRL 2.3.97 Description Port L reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port L Pull Device Enable Register (PERL) Access: User read/write(1) Address 0x0374 7 6 5 4 3 2 1 0 PERL7 PERL6 PERL5 PERL4 PERL3 PERL2 PERL1 PERL0 1 1 1 1 1 1 1 1 R W Reset Figure 2-95. Port L Pull Device Enable Register (PERL) 1. Read: Anytime. Write: Anytime. Table 2-92. PERL Register Field Descriptions Field Description 7-0 PERL Port L pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 171 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.98 Port L Polarity Select Register (PPSL) Access: User read/write(1) Address 0x0375 7 6 5 4 3 2 1 0 PPSL7 PPSL6 PPSL5 PPSL4 PPSL3 PPSL2 PPSL1 PPSL0 0 0 0 0 0 0 0 0 R W Reset Figure 2-96. Port L Polarity Select Register (PPSL) 1. Read: Anytime. Write: Anytime. Table 2-93. PPSL Register Field Descriptions Field 7-0 PPSL 2.3.99 Description Port L pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. Port L Wired-Or Mode Register (WOML) Access: User read/write(1) Address 0x0376 7 6 5 4 3 2 1 0 WOML7 WOML6 WOML5 WOML4 WOML3 WOML2 WOML1 WOML0 0 0 0 0 0 0 0 0 R W Reset Figure 2-97. Port L Wired-Or Mode Register (WOML) 1. Read: Anytime. Write: Anytime. Table 2-94. WOML Register Field Descriptions Field Description 7-0 WOML Port L wired-or mode—Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of “1” is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 172 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.100 Port L Routing Register (PTLRR) Access: User read/write(1) Address 0x0377 7 6 5 4 PTLRR7 PTLRR6 PTLRR5 PTLRR4 0 0 0 0 R 3 2 1 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-98. Port L Routing Register (PTLRR) 1. Read: Anytime. Write: Anytime. This register configures the re-routing of SCI7, SCI6, SCI5, and SCI4 on alternative ports. Table 2-95. Port L Routing Summary Module PTLRR 7 SCI7 0 6 Related Pins 5 4 TXD RXD PH3 PH2 x x x 1 x x x PL7 PL6 x 0 x x PH1 PH0 x 1 x x PL5 PL4 x x 0 x PH7 PH6 x x 1 x PL3 PL2 x x x 0 PH5 PH4 x x x 1 PL1 PL0 SCI6 SCI5 SCI4 2.3.101 Port F Data Register (PTF) Access: User read/write(1) Address 0x0378 7 6 5 4 3 2 1 0 PTF7 PTFT6 PTF5 PTF4 PTF3 PTF2 PTF1 PTF0 (TXD3) (RXD3) (SCL0) (SDA0) (CS3) (CS2) (CS1) (CS0) 0 0 0 0 0 0 0 0 R W Altern. Function Reset Figure 2-99. Port F Data Register (PTF) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 173 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-96. PTF Register Field Descriptions Field Description 7 PTF Port F general purpose input/output data—Data Register Port F pin 7 is associated with the TXD signal of the SCI3 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTF Port F general purpose input/output data—Data Register Port F pin 6 is associated with the RXD signal of the SCI3 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTF Port F general purpose input/output data—Data Register Port F pin 5 is associated with the TXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 4 PTF Port F general purpose input/output data—Data Register Port F pin 4 is associated with the RXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTF Port F general purpose input/output data—Data Register Port F pin 3 is associated with the TXD signal of the SC5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTF Port F general purpose input/output data—Data Register Port F pin 2 is associated with the RXD signal of the SCI5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 1 PTF Port F general purpose input/output data—Data Register Port F pin 3 is associated with the TXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTF Port F general purpose input/output data—Data Register Port F pin 2 is associated with the RXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 174 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.102 Port F Input Register (PTIF) Access: User read(1) Address 0x0379 R 7 6 5 4 3 2 1 0 PTIF7 PTIF6 PTIF5 PTIF4 PTIF3 PTIF2 PTIF1 PTIF0 u u u u u u u u W Reset = Unimplemented or Reserved u = Unaffected by reset Figure 2-100. Port F Input Register (PTIF) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-97. PTIF Register Field Descriptions Field Description 7-0 PTIF Port F input data— This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.103 Port F Data Direction Register (DDRF) Access: User read/write(1) Address 0x037A 7 6 5 4 3 2 1 0 DDRF7 DDRF6 DDRF5 DDRF4 DDRF3 DDRF2 DDRF1 DDRF0 0 0 0 0 0 0 0 0 R W Reset Figure 2-101. Port F Data Direction Register (DDRF) 1. Read: Anytime. Write: Anytime. Table 2-98. DDRF Register Field Descriptions Field Description 7-0 DDRF Port F data direction— This register controls the data direction of pins 7 through 0.This register configures each Port F pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 175 Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTF or PTIF registers, when changing the DDRF register. 2.3.104 Port F Reduced Drive Register (RDRF) Access: User read/write(1) Address 0x037B 7 6 5 4 3 2 1 0 RDRF7 RDRF6 RDRF5 RDRF4 RDRF3 RDRF2 RDRF1 RDRF0 0 0 0 0 0 0 0 0 R W Reset Figure 2-102. Port F Reduced Drive Register (RDRF) 1. Read: Anytime. Write: Anytime. Table 2-99. RDRF Register Field Descriptions Field 7-0 RDRF Description Port F reduced drive—Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.105 Port F Pull Device Enable Register (PERF) Access: User read/write(1) Address 0x037C 7 6 5 4 3 2 1 0 PERF7 PERF6 PERF5 PERF4 PERF3 PERF2 PERF1 PERF0 1 1 1 1 1 1 1 1 R W Reset Figure 2-103. Port F Pull Device Enable Register (PERF) 1. Read: Anytime. Write: Anytime. Table 2-100. PERF Register Field Descriptions Field Description 7-0 PERF Port F pull device enable—Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 176 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.106 Port F Polarity Select Register (PPSF) Access: User read/write(1) Address 0x037D 7 6 5 4 3 2 1 0 PPSF7 PPSF6 PPSF5 PPSF4 PPSF3 PPSF2 PPSF1 PPSF0 0 0 0 0 0 0 0 0 R W Reset Figure 2-104. Port F Polarity Select Register (PPSF) 1. Read: Anytime. Write: Anytime. Table 2-101. PPSF Register Field Descriptions Field 7-0 PPSF Description Port F pull device select—Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. 2.3.107 PIM Reserved Register Access: User read(1) Address 0x037E R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 2-105. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.108 Port F Routing Register (PTFRR) Access: User read/write(1) Address 0x037F R 7 6 0 0 5 4 3 2 1 0 PTFRR5 PTFRR4 PTFRR3 PTFRR2 PTFRR1 PTFRR0 0 0 0 0 0 0 W Reset 0 0 = Unimplemented or Reserved Figure 2-106. Port F Routing Register (PTFRR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 177 Chapter 2 Port Integration Module (S12XEPIMV1) This register configures the re-routing of SCI3, IIC0, CS[3:0] on alternative ports. Table 2-102. Port F Routing Summary Module PTFRR 5 SCI3 IIC0 4 3 2 Related Pins 1 0 TXD RXD 0 x x x x x PM7 PM6 1 x x x x x PF7 PF6 SCL SDA x 0 x x x x PJ7 PJ6 x 1 x x x x PF5 PF4 CS CS3 CS2 CS1 CS0 2.4 2.4.1 x x 0 x x x PJ0 x x 1 x x x PF3 x x x 0 x x PJ5 x x x 1 x x PF2 x x x x 0 x PJ2 x x x x 1 x PF1 x x x x x 0 PJ4 x x x x x 1 PF0 Functional Description General Each pin except PE0, PE1, and BKGD can act as general purpose I/O. In addition each pin can act as an output from the external bus interface module or a peripheral module or an input to the external bus interface module or a peripheral module. 2.4.2 Registers A set of configuration registers is common to all ports with exceptions in the expanded bus interface and ATD ports (Table 2-103). All registers can be written at any time, however a specific configuration might not become active. Example 2-1. Selecting a pull-up device This device does not become active while the port is used as a push-pull output. MC9S12XE-Family Reference Manual , Rev. 1.21 178 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-103. Register availability per port(1) Data Reduced Direction Drive Pull Enable Polarity Select WiredOr Mode Interrupt Enable Interrupt Flag Routing yes - - - - - - - - - - yes - - - - - yes - - - - - - yes - - - - - - yes - - - - - Port Data Input A yes - yes B yes - yes C yes - D yes - E yes K yes yes T yes yes yes yes yes yes - - - - S yes yes yes yes yes yes yes - - yes M yes yes yes yes yes yes yes - - yes P yes yes yes yes yes yes - yes yes - H yes yes yes yes yes yes - yes yes - J yes yes yes yes yes yes - yes yes - AD0 yes - yes yes yes - - - - - AD1 yes - yes yes yes - - - - - R yes yes yes yes yes yes - - - - L yes yes yes yes yes yes yes - - yes yes - - - yes F yes yes yes yes yes 1. Each cell represents one register with individual configuration bits 2.4.2.1 Data register (PORTx, PTx) This register holds the value driven out to the pin if the pin is used as a general purpose I/O. Writing to this register has only an effect on the pin if the pin is used as general purpose output. When reading this address, the buffered state of the pin is returned if the associated data direction register bit is set to “0”. If the data direction register bits are set to logic level “1”, the contents of the data register is returned. This is independent of any other configuration (Figure 2-107). 2.4.2.2 Input register (PTIx) This is a read-only register and always returns the buffered state of the pin (Figure 2-107). 2.4.2.3 Data direction register (DDRx) This register defines whether the pin is used as an input or an output. If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 2-107). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 179 Chapter 2 Port Integration Module (S12XEPIMV1) PTI 0 1 PT 0 PIN 1 DDR 0 1 data out Module output enable module enable Figure 2-107. Illustration of I/O pin functionality 2.4.2.4 Reduced drive register (RDRx) If the pin is used as an output this register allows the configuration of the drive strength. 2.4.2.5 Pull device enable register (PERx) This register turns on a pull-up or pull-down device. It becomes active only if the pin is used as an input or as a wired-or output. 2.4.2.6 Polarity select register (PPSx) This register selects either a pull-up or pull-down device if enabled. It becomes only active if the pin is used as an input. A pull-up device can be activated if the pin is used as a wired-or output. 2.4.2.7 Wired-or mode register (WOMx) If the pin is used as an output this register turns off the active high drive. This allows wired-or type connections of outputs. 2.4.2.8 Interrupt enable register (PIEx) If the pin is used as an interrupt input this register serves as a mask to the interrupt flag to enable/disable the interrupt. MC9S12XE-Family Reference Manual , Rev. 1.21 180 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.4.2.9 Interrupt flag register (PIFx) If the pin is used as an interrupt input this register holds the interrupt flag after a valid pin event. 2.4.2.10 Module routing register (MODRR, PTRRR, PTLRR, PTFRR) This register supports the re-routing of the CAN0, CAN4, SPI2-0, SCI7-3, IIC0, TIM and CS[3:0] pins to alternative ports. This allows a software re-configuration of the pinouts of the different package options with respect to above peripherals. 2.4.3 Pins and Ports NOTE Please refer to the SOC Guide to determine the pin availability in the different package options. 2.4.3.1 BKGD pin The BKGD pin is associated with the S12X_BDM and S12X_EBI modules. During reset, the BKGD pin is used as MODC input. 2.4.3.2 Port A, B Port A pins PA[7:0] and Port B pins PB[7:0] can be used for either general-purpose I/O with the external bus interface. In this case Port A and Port B are associated with the external address bus outputs ADDR15ADDR8 and ADDR7-ADDR0, respectively. PB0 is the ADDR0 or UDS output. 2.4.3.3 Port C, D Port C pins PC[7:0] and Port D pins PD[7:0] can be used for either general-purpose I/O with the external bus interface. In this case Port C and Port D are associated with the external data bus inputs/outputs DATA15-DATA8 and DATA7-DATA0, respectively. These pins are configured for reduced input threshold in certain operating modes (refer to S12X_EBI section). 2.4.3.4 Port E Port E is associated with the external bus control outputs RW, LSTRB, LDS and RE, the free-running clock outputs ECLK and ECLK2X, as well as with the TAGHI, TAGLO, MODA and MODB and interrupt inputs IRQ and XIRQ. Port E pins PE[7:2] can be used for either general-purpose I/O or with the alternative functions. Port E pin PE[7] can be used for either general-purpose I/O or as the free-running clock ECLKX2 output running at the Core Clock rate. The clock output is always enabled in emulation modes. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 181 Chapter 2 Port Integration Module (S12XEPIMV1) Port E pin PE[6] can be used for either general-purpose I/O, as TAGHI input or as MODB input during reset. Port E pin PE[5] can be used for either general-purpose I/O, as TAGLO input, RE output or as MODA input during reset. Port E pin PE[4] can be used for either general-purpose I/O or as the free-running clock ECLK output running at the Bus Clock rate or at the programmed divided clock rate. The clock output is always enabled in emulation modes. Port E pin PE[3] can be used for either general-purpose I/O, as LSTRB or LDS output, or as EROMCTL input during reset. Port E pin PE[2] can be used for either general-purpose I/O, or as RW or WE output. Port E pin PE[1] can be used for either general-purpose input or as the level- or falling edge-sensitive IRQ interrupt input. IRQ will be enabled by setting the IRQEN configuration bit (2.3.17/119) and clearing the I-bit in the CPU condition code register. It is inhibited at reset so this pin is initially configured as a simple input with a pull-up. Port E pin PE[0] can be used for either general-purpose input or as the level-sensitive XIRQ interrupt input. XIRQ can be enabled by clearing the X-bit in the CPU condition code register. It is inhibited at reset so this pin is initially configured as a high-impedance input with a pull-up. Port E pins PE[5] and PE[6] are configured for reduced input threshold in certain modes (refer to S12X_EBI section). 2.4.3.5 Port K Port K pins PK[7:0] can be used for either general-purpose I/O, or with the external bus interface. In this case Port K pins PK[6:0] are associated with the external address bus outputs ADDR22-ADDR16 and PK7 is associated to the EWAIT input. Port K pin PE[7] is configured for reduced input threshold in certain modes (refer to S12X_EBI section). 2.4.3.6 Port T This port is associated with the ECT module. Port T pins PT[7:0] can be used for either general-purpose I/O, or with the channels of the Enhanced Capture Timer. 2.4.3.7 Port S This port is associated with SCI0, SCI1 and SPI0. Port S pins PS[7:4] can be used either for general-purpose I/O, or with the SPI0 subsystem. Port S pins PS[3:2] can be used either for general-purpose I/O, or with the SCI1 subsystem. Port S pins PS[1:0] can be used either for general-purpose I/O, or with the SCI0 subsystem. MC9S12XE-Family Reference Manual , Rev. 1.21 182 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) The SPI0 pins can be re-routed. 2.4.3.8 Port M This port is associated with the SCI3 CAN4-0 and SPI0. Port M pins PM[7:6] can be used for either general purpose I/O, or with the CAN3 subsystem. Port M pins PM[5:4] can be used for either general purpose I/O, or with the CAN2 subsystem. Port M pins PM[3:2] can be used for either general purpose I/O, or with the CAN1 subsystem. Port M pins PM[1:0] can be used for either general purpose I/O, or with the CAN0 subsystem. Port M pins PM[5:2] can be used for either general purpose I/O, or with the SPI0 subsystem. The CAN0, CAN4 and SPI0 pins can be re-routed. 2.4.3.9 Port P This port is associated with the PWM, SPI1, SPI2 and TIM. Port P pins PP[7:0] can be used for either general purpose I/O, or with the PWM or with the channels of the standard Timer.subsystem. Port P pins PP[7:4] can be used for either general purpose I/O, or with the SPI2 subsystem. Port P pins PP[3:0] can be used for either general purpose I/O, or with the SPI1 subsystem. 2.4.3.10 Port H This port is associated with the SPI1, SPI2, and SCI7-4. Port H pins PH[7:4] can be used for either general purpose I/O, or with the SPI2 subsystem. Port H pins PH[3:0] can be used for either general purpose I/O, or with the SPI1 subsystem. Port H pins PH[7:6] can be used for either general purpose I/O, or with the SCI5 subsystem. Port H pins PH[5:4] can be used for either general purpose I/O, or with the SCI4 subsystem. Port H pins PH[3:2] can be used for either general purpose I/O, or with the SCI7 subsystem. Port H pins PH[1:0] can be used for either general purpose I/O, or with the SCI6 subsystem. 2.4.3.11 Port J This port is associated with the chip selects CS[3:0] as well as with CAN4, CAN0, IIC1, IIC0, and SCI2. Port J pins PJ[7:6] can be used for either general purpose I/O, or with the CAN4, IIC0 or CAN0 subsystems. Port J pins PJ[5:4] can be used for either general purpose I/O, or with the IIC1 subsystem or as chip select outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 183 Chapter 2 Port Integration Module (S12XEPIMV1) Port J pin PJ[3] can be used for general purpose I/O. Port J pin PJ[2] can be used for either general purpose I/O or as chip select output. Port J pin PJ[1] can be used for either general purpose I/O, or with the SCI2 subsystem. Port J pin PJ[0] can be used for either general purpose I/O, or with the SCI2 subsystem or as chip select output. 2.4.3.12 Port AD0 This port is associated with the ATD0. Port AD0 pins PAD[15:0] can be used for either general purpose I/O, or with the ATD0 subsystem. 2.4.3.13 Port AD1 This port is associated with the ATD1. Port AD1 pins PAD[31:16] can be used for either general purpose I/O, or with the ATD1 subsystem. 2.4.3.14 Port R This port is associated with the TIM module. Port R pins PR[7:0] can be used for either general-purpose I/O, or with the channels of the standard Timer. The TIM channels can be re-routed. 2.4.3.15 Port L This port is associated with SCI7-4. Port L pins PL[7:6] can be used for either general purpose I/O, or with SCI7 subsystem. Port L pins PL[5:4] can be used for either general purpose I/O, or with SCI6 subsystem. Port L pins PL[3:2] can be used for either general purpose I/O, or with SCI5 subsystem. Port L pins PL[1:0] can be used for either general purpose I/O, or with SCI4 subsystem. 2.4.3.16 Port F This port is associated with SCI3, IIC0 and chip selects. Port L pins PL[7:6] can be used for either general purpose I/O, or with SCI3 subsystem. Port L pins PL[5:4] can be used for either general purpose I/O, or with IIC0 subsystem. Port L pins PL[3:0] can be used for either general purpose I/O, or with chip selects. MC9S12XE-Family Reference Manual , Rev. 1.21 184 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.4.4 Pin interrupts Ports P, H and J offer pin interrupt capability. The interrupt enable as well as the sensitivity to rising or falling edges can be individually configured on per-pin basis. All bits/pins in a port share the same interrupt vector. Interrupts can be used with the pins configured as inputs or outputs. An interrupt is generated when a bit in the port interrupt flag register and its corresponding port interrupt enable bit are both set. The pin interrupt feature is also capable to wake up the CPU when it is in STOP or WAIT mode. A digital filter on each pin prevents pulses (Figure 2-109) shorter than a specified time from generating an interrupt. The minimum time varies over process conditions, temperature and voltage (Figure 2-108 and Table 2-104). Glitch, filtered out, no interrupt flag set Valid pulse, interrupt flag set uncertain tpign tpval Figure 2-108. Interrupt Glitch Filter on Port P, H and J (PPS=0) Table 2-104. Pulse Detection Criteria Mode Pulse STOP(1) STOP Unit Ignored Uncertain Valid tpulse ≤ 3 bus clocks tpulse ≤ tpign 3 < tpulse < 4 bus clocks tpign < tpulse < tpval tpulse ≥ 4 bus clocks tpulse ≥ tpval 1. These values include the spread of the oscillator frequency over temperature, voltage and process. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 185 Chapter 2 Port Integration Module (S12XEPIMV1) tpulse Figure 2-109. Pulse Illustration A valid edge on an input is detected if 4 consecutive samples of a passive level are followed by 4 consecutive samples of an active level directly or indirectly. The filters are continuously clocked by the bus clock in RUN and WAIT mode. In STOP mode the clock is generated by an RC-oscillator in the Port Integration Module. To maximize current saving the RC oscillator runs only if the following condition is true on any pin individually: Sample count <= 4 and interrupt enabled (PIE=1) and interrupt flag not set (PIF=0) 2.5 2.5.1 Initialization Information Port Data and Data Direction Register writes It is not recommended to write PORTx/PTx and DDRx in a word access. When changing the register pins from inputs to outputs, the data may have extra transitions during the write access. Initialize the port data register before enabling the outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 186 Freescale Semiconductor Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-1. Revision History Revision Number Revision Date V04.04 26 Oct 2005 V04.05 26 Jul 2006 V04.06 15 Nov 2006 3.1 Sections Affected Description of Changes - Reorganization of MEMCTL0 register bits. 3.4.2.4/3-212 - Updated XGATE Memory Map - Adding AUTOSAR Compliance concerning illegal CPU accesses Introduction This section describes the functionality of the module mapping control (MMC) sub-block of the S12X platform. The block diagram of the MMC is shown in Figure 3-1. The MMC module controls the multi-master priority accesses, the selection of internal resources and external space. Internal buses, including internal memories and peripherals, are controlled in this module. The local address space for each master is translated to a global memory space. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 187 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.1.1 Terminology Table 3-2. Acronyms and Abbreviations Logic level “1” Voltage that corresponds to Boolean true state Logic level “0” Voltage that corresponds to Boolean false state 0x Represents hexadecimal number x Represents logic level ’don’t care’ byte 8-bit data word 16-bit data local address based on the 64 KBytes Memory Space (16-bit address) global address based on the 8 MBytes Memory Space (23-bit address) Aligned address Address on even boundary Mis-aligned address Address on odd boundary Bus Clock expanded modes single-chip modes Normal Single-Chip Mode Special Single-Chip Mode emulation modes Emulation Single-Chip Mode Emulation Expanded Mode normal modes Normal Single-Chip Mode Normal Expanded Mode special modes Special Single-Chip Mode Special Test Mode NS Normal Single-Chip Mode SS Special Single-Chip Mode NX Normal Expanded Mode ES Emulation Single-Chip Mode EX Emulation Expanded Mode ST Special Test Mode Unimplemented areas External Space external resource 3.1.2 System Clock. Refer to CRG Block Guide. Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode Areas which are accessible by the pages (RPAGE,PPAGE,EPAGE) and not implemented Area which is accessible in the global address range 14_0000 to 3F_FFFF Resources (Emulator, Application) connected to the MCU via the external bus on expanded modes (Unimplemented areas and External Space) PRR Port Replacement Registers PRU Port Replacement Unit located on the emulator side MCU MicroController Unit NVM Non-volatile Memory; Flash EEPROM or ROM Features The main features of this block are: • Paging capability to support a global 8 Mbytes memory address space • Bus arbitration between the masters CPU, BDM and XGATE MC9S12XE-Family Reference Manual , Rev. 1.21 188 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) • • • • • • • • Simultaneous accesses to different resources1 (internal, external, and peripherals) (see Figure 3-1 ) Resolution of target bus access collision MCU operation mode control MCU security control Separate memory map schemes for each master CPU, BDM and XGATE ROM control bits to enable the on-chip FLASH or ROM selection Port replacement registers access control Generation of system reset when CPU accesses an unimplemented address (i.e., an address which does not belong to any of the on-chip modules) in single-chip modes 3.1.3 S12X Memory Mapping The S12X architecture implements a number of memory mapping schemes including • a CPU 8 MByte global map, defined using a global page (GPAGE) register and dedicated 23-bit address load/store instructions. • a BDM 8 MByte global map, defined using a global page (BDMGPR) register and dedicated 23bit address load/store instructions. • a (CPU or BDM) 64 KByte local map, defined using specific resource page (RPAGE, EPAGE and PPAGE) registers and the default instruction set. The 64 KBytes visible at any instant can be considered as the local map accessed by the 16-bit (CPU or BDM) address. • The XGATE 64 Kbyte local map. The MMC module performs translation of the different memory mapping schemes to the specific global (physical) memory implementation. 3.1.4 Modes of Operation This subsection lists and briefly describes all operating modes supported by the MMC. 3.1.4.1 • • • Run mode MMC is functional during normal run mode. Wait mode MMC is functional during wait mode. Stop mode MMC is inactive during stop mode. 3.1.4.2 • Power Saving Modes Functional Modes Single chip modes In normal and special single chip mode the internal memory is used. External bus is not active. 1. Resources are also called targets. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 189 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) • Expanded modes Address, data, and control signals are activated in normal expanded and special test modes when accessing the external bus. Access to internal resources will not cause activity on the external bus. Emulation modes External bus is active to emulate, via an external tool, the normal expanded or the normal single chip mode.} • 3.1.5 Block Diagram Figure 3-11 shows a block diagram of the MMC. BDM CPU XGATE FLEXRAY EEEPROM MMC FLASH Address Decoder & Priority DBG Target Bus Controller EBI RAM Peripherals Figure 3-1. MMC Block Diagram 3.2 External Signal Description The user is advised to refer to the device overview for port configuration and location of external bus signals. Some pins may not be bonded out in all implementations. Table 3-3 and Table 3-4 outline the pin names and functions. It also provides a brief description of their operation. 1. Doted blocks and lines are optional. Please refer to the Device User Guide for their availlibilities. MC9S12XE-Family Reference Manual , Rev. 1.21 190 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-3. External Input Signals Associated with the MMC Signal I/O Description Availability MODC I Mode input Latched after RESET (active low) MODB I Mode input Latched after RESET (active low) MODA I Mode input Latched after RESET (active low) EROMCTL I EROM control input Latched after RESET (active low) ROMCTL I ROM control input Latched after RESET (active low) Table 3-4. External Output Signals Associated with the MMC Available in Modes Signal I/O Description NS CS0 O Chip select line 0 CS1 O Chip select line 1 CS2 O Chip select line 2 CS3 O Chip select line 3 SS NX ES EX ST (see Table 3-5) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 191 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3 3.3.1 Memory Map and Registers Module Memory Map A summary of the registers associated with the MMC block is shown in Figure 3-2. Detailed descriptions of the registers and bits are given in the subsections that follow. Address Register Name 0x000A MMCCTL0 R W 0x000B MODE R W 0x0010 GPAGE R Bit 7 6 5 4 3 2 1 Bit 0 CS3E1 CS3E0 CS2E1 CS2E0 CS1E1 CS1E0 CS0E1 CS0E0 MODC MODB MODA 0 0 0 0 0 GP6 GP5 GP4 GP3 GP2 GP1 GP0 DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8 0 0 0 0 0 0 0 0 0 W 0x0011 DIRECT R W 0x0012 Reserved R W 0x0013 MMCCTL1 R W 0x0014 Reserved R TGMRAMON 0 EEEIFRON PGMIFRON RAMHM EROMON ROMHM ROMON 0 0 0 0 0 0 0 0 PIX7 PIX6 PIX5 PIX4 PIX3 PIX2 PIX1 PIX0 RP7 RP6 RP5 RP4 RP3 RP2 RP1 RP0 EP7 EP6 EP5 EP4 EP3 EP2 EP1 EP0 W 0x0015 PPAGE R W 0x0016 RPAGE R W 0x0017 EPAGE R W = Unimplemented or Reserved Figure 3-2. MMC Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 192 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2 Register Descriptions 3.3.2.1 MMC Control Register (MMCCTL0) Address: 0x000A PRR R W Reset 7 6 5 4 3 2 1 0 CS3E1 CS3E0 CS2E1 CS2E0 CS1E1 CS1E0 CS0E1 CS0E0 0 0 0 0 0 0 0 ROMON1 1. ROMON is bit[0] of the register MMCTL1 (see Figure 3-10) = Unimplemented or Reserved Figure 3-3. MMC Control Register (MMCCTL0) Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other modes the data is read from this register. Write: Anytime. In emulation modes write operations will also be directed to the external bus. Table 3-5. Chip Selects Function Activity Chip Modes Register Bit NS Disabled(1) SS NX (2) CS0E[1:0], CS1E[1:0], Disabled Enabled CS2E[1:0], CS3E[1:0] 1. Disabled: feature always inactive. 2. Enabled: activity is controlled by the appropriate register bit value. ES EX ST Disabled Enabled Disabled The MMCCTL0 register is used to control external bus functions, like: • Availability of chip selects. (See Table 3-5 and Table 3-6) • Control of different external stretch mechanism. For more detail refer to the S12X_EBI BlockGuide. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 193 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-6. MMCCTL0 Field Descriptions Field Description 7–6 CS3E[1:0] Chip Select 3 Enables — These bits enable the external chip select CS3 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 3 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 3 is disabled 01,10,11 Chip select 3 is enabled 5–4 CS2E[1:0] Chip Select 2 Enables — These bits enable the external chip select CS2 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 2 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 2 is disabled 01,10,11 Chip select 2 is enabled 3–2 CS1E[1:0] Chip Select 1 Enables — These bits enable the external chip select CS1 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 1 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 1 is disabled 01,10,11 Chip select 1 is enabled 1–0 CS0E[1:0] Chip Select 0 Enables — These bits enable the external chip select CS0 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 0 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 0 is disabled 01,10,11 Chip select 0 is enabled Table 3-7 shows the address boundaries of each chip select and the relationship with the implemented resources (internal) parameters. Table 3-7. Global Chip Selects Memory Space Chip Selects Bottom Address Top Address CS3 0x00_0800 0x0F_FFFF minus RAMSIZE(1) CS2(2) 0x14_0000 0x1F_FFFF CS1 0x20_0000 0x3F_FFFF CS0(3) 0x40_0000 0x7F_FFFF minus FLASHSIZE(4) 1. External RPAGE accesses in (NX, EX) 2. When ROMHM is set (see ROMHM in Table 3-16) the CS2 is asserted in the space occupied by this onchip memory block. 3. When the internal NVM is enabled (see ROMON in Section 3.3.2.5, “MMC Control Register (MMCCTL1)) the CS0 is not asserted in the space occupied by this on-chip memory block. 4. External PPAGE accesses in (NX, EX) MC9S12XE-Family Reference Manual , Rev. 1.21 194 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.2 Mode Register (MODE) Address: 0x000B PRR 7 R W Reset 6 5 MODC MODB MODA MODC1 MODB1 MODA1 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 1. External signal (see Table 3-3). = Unimplemented or Reserved Figure 3-4. Mode Register (MODE) Read: Anytime. In emulation modes read operations will return the data read from the external bus. In all other modes the data are read from this register. Write: Only if a transition is allowed (see Figure 3-5). In emulation modes write operations will be also directed to the external bus. The MODE bits of the MODE register are used to establish the MCU operating mode. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Table 3-8. MODE Field Descriptions Field Description 7–5 MODC, MODB, MODA Mode Select Bits — These bits control the current operating mode during RESET high (inactive). The external mode pins MODC, MODB, and MODA determine the operating mode during RESET low (active). The state of the pins is latched into the respective register bits after the RESET signal goes inactive (see Figure 3-4). Write restrictions exist to disallow transitions between certain modes. Figure 3-5 illustrates all allowed mode changes. Attempting non authorized transitions will not change the MODE bits, but it will block further writes to these register bits except in special modes. Both transitions from normal single-chip mode to normal expanded mode and from emulation single-chip to emulation expanded mode are only executed by writing a value of 3’b101 (write once). Writing any other value will not change the MODE bits, but will block further writes to these register bits. Changes of operating modes are not allowed when the device is secured, but it will block further writes to these register bits except in special modes. In emulation modes reading this address returns data from the external bus which has to be driven by the emulator. It is therefore responsibility of the emulator hardware to provide the expected value (i.e. a value corresponding to normal single chip mode while the device is in emulation single-chip mode or a value corresponding to normal expanded mode while the device is in emulation expanded mode). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 195 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) RESET 010 Special Test (ST) 010 1 1 10 0 10 Normal Expanded (NX) 101 Emulation Single-Chip (ES) 001 Emulation Expanded (EX) 011 101 10 1 011 RESET 0 10 RESET RESET 000 001 101 101 010 110 111 Normal Single-Chip (NS) 100 1 00 01 RESET 100 1 01 1 00 Special Single-Chip (SS) 000 000 RESET Transition done by external pins (MODC, MODB, MODA) RESET Transition done by write access to the MODE register 110 111 Illegal (MODC, MODB, MODA) pin values. Do not use. (Reserved for future use). Figure 3-5. Mode Transition Diagram when MCU is Unsecured MC9S12XE-Family Reference Manual , Rev. 1.21 196 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.3 Global Page Index Register (GPAGE) Address: 0x0010 7 R 0 W Reset 0 6 5 4 3 2 1 0 GP6 GP5 GP4 GP3 GP2 GP1 GP0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 3-6. Global Page Index Register (GPAGE) Read: Anytime Write: Anytime The global page index register is used to construct a 23 bit address in the global map format. It is only used when the CPU is executing a global instruction (GLDAA, GLDAB, GLDD, GLDS, GLDX, GLDY,GSTAA, GSTAB, GSTD, GSTS, GSTX, GSTY) (see CPU Block Guide). The generated global address is the result of concatenation of the CPU local address [15:0] with the GPAGE register [22:16] (see Figure 3-7). CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] Bit22 Bit16 Bit15 GPAGE Register [6:0] Bit 0 CPU Address [15:0] Figure 3-7. GPAGE Address Mapping Table 3-9. GPAGE Field Descriptions Field Description 6–0 GP[6:0] Global Page Index Bits 6–0 — These page index bits are used to select which of the 128 64-kilobyte pages is to be accessed. Example 3-1. This example demonstrates usage of the GPAGE register LDX MOVB GLDAA #0x5000 #0x14, GPAGE X ;Set GPAGE offset to the value of 0x5000 ;Initialize GPAGE register with the value of 0x14 ;Load Accu A from the global address 0x14_5000 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 197 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.4 Direct Page Register (DIRECT) Address: 0x0011 R W 7 6 5 4 3 2 1 0 DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8 0 0 0 0 0 0 0 0 Reset Figure 3-8. Direct Register (DIRECT) Read: Anytime Write: anytime in special modes, one time only in other modes. This register determines the position of the 256 Byte direct page within the memory map.It is valid for both global and local mapping scheme. Table 3-10. DIRECT Field Descriptions Field Description 7–0 DP[15:8] Direct Page Index Bits 15–8 — These bits are used by the CPU when performing accesses using the direct addressing mode. The bits from this register form bits [15:8] of the address (see Figure 3-9). CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] Bit16 Bit15 Bit22 Bit8 Bit7 Bit0 DP [15:8] CPU Address [15:0] Figure 3-9. DIRECT Address Mapping Bits [22:16] of the global address will be formed by the GPAGE[6:0] bits in case the CPU executes a global instruction in direct addressing mode or by the appropriate local address to the global address expansion (refer to Section 3.4.2.1.1, “Expansion of the Local Address Map). Example 3-2. This example demonstrates usage of the Direct Addressing Mode MOVB #0x80,DIRECT ;Set DIRECT register to 0x80. Write once only. ;Global data accesses to the range 0xXX_80XX can be direct. ;Logical data accesses to the range 0x80XX are direct. LDY <00 ;Load the Y index register from 0x8000 (direct access). ;< operator forces direct access on some assemblers but in MC9S12XE-Family Reference Manual , Rev. 1.21 198 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) ;many cases assemblers are “direct page aware” and can ;automatically select direct mode. 3.3.2.5 MMC Control Register (MMCCTL1) Address: 0x0013 PRR 7 R W 6 0 TGMRAMON Reset 0 0 5 4 3 2 1 0 EEEIFRON PGMIFRON RAMHM EROMON ROMHM ROMON 0 0 0 EROMCTL 0 ROMCTL = Unimplemented or Reserved Figure 3-10. MMC Control Register (MMCCTL1) Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other modes the data are read from this register. Write: Refer to each bit description. In emulation modes write operations will also be directed to the external bus. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Table 3-11. MMCCTL1 Field Descriptions Field Description 7 EEE Tag RAM and FTM SCRATCH RAM visible in the memory map TGMRAMON Write: Anytime This bit is used to made the EEE Tag RAM nd FTM SCRATCH RAM visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 5 EEEIFRON EEE IFR visible in the memory map Write: Anytime This bit is used to made the IFR sector of EEE DATA FLASH visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 4 Program IFR visible in the memory map PGMIFRON Write: Anytime This bit is used to made the IFR sector of the Program Flash visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 3 RAMHM RAM only in higher Half of the memory map Write: Once in normal and emulation modes and anytime in special modes 0 Accesses to $4000–$7FFF will be mapped to $14_4000-$14_7FFF in the global memory space (external access). 1 Accesses to $4000–$7FFF will be mapped to $0F_C000-$0F_FFFF in the global memory space (RAM area). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 199 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-11. MMCCTL1 Field Descriptions (continued) Field 2 EROMON Description Enables emulated Flash or ROM memory in the memory map Write: Never This bit is used in some modes to define the placement of the Emulated Flash or ROM (Refer to Table 3-12) 0 Disables the emulated Flash or ROM in the memory map. 1 Enables the emulated Flash or ROM in the memory map. 1 ROMHM FLASH or ROM only in higher Half of Memory Map Write: Once in normal and emulation modes and anytime in special modes 0 The fixed page of Flash or ROM can be accessed in the lower half of the memory map. Accesses to 0x4000–0x7FFF will be mapped to 0x7F_4000-0x7F_7FFF in the global memory space. 1 Disables access to the Flash or ROM in the lower half of the memory map.These physical locations of the Flash or ROM can still be accessed through the program page window. Accesses to 0x4000–0x7FFF will be mapped to 0x14_4000-0x14_7FFF in the global memory space (external access). 0 ROMON Enable FLASH or ROM in the memory map Write: Once in normal and emulation modes and anytime in special modes. This bit is used in some modes to define the placement of the ROM (Refer to Table 3-12) 0 Disables the Flash or ROM from the memory map. 1 Enables the Flash or ROM in the memory map. EROMON and ROMON control the visibility of the Flash in the memory map for CPU or BDM (not for XGATE). Both local and global memory maps are affected. Table 3-12. Data Sources when CPU or BDM is Accessing Flash Area Chip Modes ROMON EROMON DATA SOURCE(1) Stretch(2) Normal Single Chip X X Internal Flash N X 0 Emulation Memory N X 1 Internal Flash 0 X External Application Y 1 X Internal Flash N 0 X External Application Y 1 0 Emulation Memory N 1 1 Internal Flash 0 X External Application Special Single Chip Emulation Single Chip Normal Expanded Emulation Expanded Special Test N 1 X Internal Flash 1. Internal Flash means Flash resources inside the MCU are read/written. Emulation memory means resources inside the emulator are read/written (PRU registers, flash replacement, RAM, EEPROM and register space are always considered internal). External application means resources residing outside the MCU are read/written. 2. The external access stretch mechanism is part of the EBI module (refer to EBI Block Guide for details). MC9S12XE-Family Reference Manual , Rev. 1.21 200 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.6 Program Page Index Register (PPAGE) Address: 0x0015 R W Reset 7 6 5 4 3 2 1 0 PIX7 PIX6 PIX5 PIX4 PIX3 PIX2 PIX1 PIX0 1 1 1 1 1 1 1 0 Figure 3-11. Program Page Index Register (PPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 16 KByte blocks into the Flash page window located in the local (CPU or BDM) memory map from address 0x8000 to address 0xBFFF (see Figure 3-12). This supports accessing up to 4 Mbytes of Flash (in the Global map) within the 64 KByte Local map. The PPAGE register is effectively used to construct paged Flash addresses in the Local map format. The CPU has special access to read and write this register directly during execution of CALL and RTC instructions.. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] 1 Bit21 Bit0 Bit14 Bit13 PPAGE Register [7:0] Address [13:0] Address: CPU Local Address or BDM Local Address Figure 3-12. PPAGE Address Mapping NOTE Writes to this register using the special access of the CALL and RTC instructions will be complete before the end of the instruction execution. Table 3-13. PPAGE Field Descriptions Field 7–0 PIX[7:0] Description Program Page Index Bits 7–0 — These page index bits are used to select which of the 256 FLASH or ROM array pages is to be accessed in the Program Page Window. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 201 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) The fixed 16K page from 0x4000–0x7FFF (when ROMHM = 0) is the page number 0xFD. The reset value of 0xFE ensures that there is linear Flash space available between addresses 0x4000 and 0xFFFF out of reset. The fixed 16K page from 0xC000-0xFFFF is the page number 0xFF. 3.3.2.7 RAM Page Index Register (RPAGE) Address: 0x0016 R W Reset 7 6 5 4 3 2 1 0 RP7 RP6 RP5 RP4 RP3 RP2 RP1 RP0 1 1 1 1 1 1 0 1 Figure 3-13. RAM Page Index Register (RPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 4 KByte blocks into the RAM page window located in the local (CPU or BDM) memory map from address 0x1000 to address 0x1FFF (see Figure 3-14). This supports accessing up to 1022 KByte of RAM (in the Global map) within the 64 KByte Local map. The RAM page index register is effectively used to construct paged RAM addresses in the Local map format. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] 0 0 0 Bit19 Bit18 RPAGE Register [7:0] Bit12 Bit11 Bit0 Address [11:0] Address: CPU Local Address or BDM Local Address Figure 3-14. RPAGE Address Mapping NOTE Because RAM page 0 has the same global address as the register space, it is possible to write to registers through the RAM space when RPAGE = 0x00. MC9S12XE-Family Reference Manual , Rev. 1.21 202 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-14. RPAGE Field Descriptions Field Description 7–0 RP[7:0] RAM Page Index Bits 7–0 — These page index bits are used to select which of the 256 RAM array pages is to be accessed in the RAM Page Window. The reset value of 0xFD ensures that there is a linear RAM space available between addresses 0x1000 and 0x3FFF out of reset. The fixed 4K page from 0x2000–0x2FFF of RAM is equivalent to page 254 (page number 0xFE). The fixed 4K page from 0x3000–0x3FFF of RAM is equivalent to page 255 (page number 0xFF). 3.3.2.8 EEPROM Page Index Register (EPAGE) Address: 0x0017 R W Reset 7 6 5 4 3 2 1 0 EP7 EP6 EP5 EP4 EP3 EP2 EP1 EP0 1 1 1 1 1 1 1 0 Figure 3-15. EEPROM Page Index Register (EPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 1 KByte blocks into the EEPROM page window located in the local (CPU or BDM) memory map from address 0x0800 to address 0x0BFF (see Figure 3-16). This supports accessing up to 256 KByte of EEPROM (in the Global map) within the 64 KByte Local map. The EEPROM page index register is effectively used to construct paged EEPROM addresses in the Local map format. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 203 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Global Address [22:0] 0 0 1 0 0 Bit17 Bit16 Bit10 Bit9 Bit0 Address [9:0] EPAGE Register [7:0] Address: CPU Local Address or BDM Local Address Figure 3-16. EPAGE Address Mapping Table 3-15. EPAGE Field Descriptions Field 7–0 EP[7:0] Description EEPROM Page Index Bits 7–0 — These page index bits are used to select which of the 256 EEPROM array pages is to be accessed in the EEPROM Page Window. The reset value of 0xFE ensures that there is a linear EEPROM space available between addresses 0x0800 and 0x0FFF out of reset. The fixed 1K page 0x0C00–0x0FFF of EEPROM is equivalent to page 255 (page number 0xFF). 3.4 Functional Description The MMC block performs several basic functions of the S12X sub-system operation: MCU operation modes, priority control, address mapping, select signal generation and access limitations for the system. Each aspect is described in the following subsections. 3.4.1 • • MCU Operating Mode Normal single-chip mode There is no external bus in this mode. The MCU program is executed from the internal memory and no external accesses are allowed. Special single-chip mode This mode is generally used for debugging single-chip operation, boot-strapping or security related operations. The active background debug mode is in control of the CPU code execution and the BDM firmware is waiting for serial commands sent through the BKGD pin. There is no external bus in this mode. MC9S12XE-Family Reference Manual , Rev. 1.21 204 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) • • • • Emulation single-chip mode Tool vendors use this mode for emulation systems in which the user’s target application is normal single-chip mode. Code is executed from external or internal memory depending on the set-up of the EROMON bit (see Section 3.3.2.5, “MMC Control Register (MMCCTL1)). The external bus is active in both cases to allow observation of internal operations (internal visibility). Normal expanded mode The external bus interface is configured as an up to 23-bit address bus, 8 or 16-bit data bus with dedicated bus control and status signals. This mode allows 8 or 16-bit external memory and peripheral devices to be interfaced to the system. The fastest external bus rate is half of the internal bus rate. An external signal can be used in this mode to cause the external bus to wait as desired by the external logic. Emulation expanded mode Tool vendors use this mode for emulation systems in which the user’s target application is normal expanded mode. Special test mode This mode is an expanded mode for factory test. 3.4.2 3.4.2.1 Memory Map Scheme CPU and BDM Memory Map Scheme The BDM firmware lookup tables and BDM register memory locations share addresses with other modules; however they are not visible in the memory map during user’s code execution. The BDM memory resources are enabled only during the READ_BD and WRITE_BD access cycles to distinguish between accesses to the BDM memory area and accesses to the other modules. (Refer to BDM Block Guide for further details). When the MCU enters active BDM mode, the BDM firmware lookup tables and the BDM registers become visible in the local memory map in the range 0xFF00-0xFFFF (global address 0x7F_FF00 0x7F_FFFF) and the CPU begins execution of firmware commands or the BDM begins execution of hardware commands. The resources which share memory space with the BDM module will not be visible in the memory map during active BDM mode. Please note that after the MCU enters active BDM mode the BDM firmware lookup tables and the BDM registers will also be visible between addresses 0xBF00 and 0xBFFF if the PPAGE register contains value of 0xFF. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 205 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map Global Memory Map 0x00_0000 2K REGISTERS 0x00_0800 2K RAM RAM 253*4K paged 0x0800 0x0C00 0x1000 0x0F_E000 2K REGISTERS 8K RAM 1K EEPROM window EPAGE 0x10_0000 1K EEPROM EEPROM 255*1K paged RPAGE 4K RAM window 0x2000 8K RAM 0x4000 0x13_FC00 256 Kilobytes 0x0000 1M minus 2 Kilobytes 0x00_1000 1K EEPROM 0x14_0000 2.75 Mbytes Unpaged 16K FLASH External Space 0x8000 16K FLASH window PPAGE 0x40_0000 0xC000 0xFFFF Reset Vectors 0x7F_4000 0x7F_8000 0x7F_C000 16K FLASH (PPAGE 0xFD) 4 Mbytes FLASH 253 *16K paged Unpaged 16K FLASH 16K FLASH (PPAGE 0xFE) 16K FLASH (PPAGE 0xFF) 0x7F_FFFF Figure 3-17. Expansion of the Local Address Map MC9S12XE-Family Reference Manual , Rev. 1.21 206 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.1.1 Expansion of the Local Address Map Expansion of the CPU Local Address Map The program page index register in MMC allows accessing up to 4 Mbyte of FLASH or ROM in the global memory map by using the eight page index bits to page 256 16 Kbyte blocks into the program page window located from address 0x8000 to address 0xBFFF in the local CPU memory map. The page value for the program page window is stored in the PPAGE register. The value of the PPAGE register can be read or written by normal memory accesses as well as by the CALL and RTC instructions (see Section 3.5.1, “CALL and RTC Instructions). Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the 64-kilobyte local CPU address space. The starting address of an interrupt service routine must be located in unpaged memory unless the user is certain that the PPAGE register will be set to the appropriate value when the service routine is called. However an interrupt service routine can call other routines that are in paged memory. The upper 16kilobyte block of the local CPU memory space (0xC000–0xFFFF) is unpaged. It is recommended that all reset and interrupt vectors point to locations in this area or to the other unpaged sections of the local CPU memory map. Table 3-16 summarizes mapping of the address bus in Flash/External space based on the address, the PPAGE register value and value of the ROMHM bit in the MMCCTL1 register. Table 3-16. Global FLASH/ROM Allocated Local CPU Address ROMHM External Access Global Address 0x4000–0x7FFF 0 No 0x7F_4000 –0x7F_7FFF 1 Yes 0x14_4000–0x14_7FFF N/A No(1) 0x40_0000–0x7F_FFFF N/A Yes1 0x8000–0xBFFF 0xC000–0xFFFF N/A No 0x7F_C000–0x7F_FFFF 1. The internal or the external bus is accessed based on the size of the memory resources implemented on-chip. Please refer to Figure 1-23 for further details. The RAM page index register allows accessing up to 1 Mbyte –2 Kbytes of RAM in the global memory map by using the eight RPAGE index bits to page 4 Kbyte blocks into the RAM page window located in the local CPU memory space from address 0x1000 to address 0x1FFF. The EEPROM page index register EPAGE allows accessing up to 256 Kbytes of EEPROM in the system by using the eight EPAGE index bits to page 1 Kbyte blocks into the EEPROM page window located in the local CPU memory space from address 0x0800 to address 0x0BFF. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 207 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Expansion of the BDM Local Address Map PPAGE, RPAGE, and EPAGE registers are also used for the expansion of the BDM local address to the global address. These registers can be read and written by the BDM. The BDM expansion scheme is the same as the CPU expansion scheme. 3.4.2.2 Global Addresses Based on the Global Page CPU Global Addresses Based on the Global Page The seven global page index bits allow access to the full 8 Mbyte address map that can be accessed with 23 address bits. This provides an alternative way to access all of the various pages of FLASH, RAM and EEE as well as additional external memory. The GPAGE Register is used only when the CPU is executing a global instruction (see Section 3.3.2.3, “Global Page Index Register (GPAGE)). The generated global address is the result of concatenation of the CPU local address [15:0] with the GPAGE register [22:16] (see Figure 3-7). BDM Global Addresses Based on the Global Page The seven BDMGPR Global Page index bits allow access to the full 8 Mbyte address map that can be accessed with 23 address bits. This provides an alternative way to access all of the various pages of FLASH, RAM and EEE as well as additional external memory. The BDM global page index register (BDMGPR) is used only in the case the CPU is executing a firmware command which uses a global instruction (like GLDD, GSTD) or by a BDM hardware command (like WRITE_W, WRITE_BYTE, READ_W, READ_BYTE). See the BDM Block Guide for further details. The generated global address is a result of concatenation of the BDM local address with the BDMGPR register [22:16] in the case of a hardware command or concatenation of the CPU local address and the BDMGPR register [22:16] in the case of a firmware command (see Figure 3-18). MC9S12XE-Family Reference Manual , Rev. 1.21 208 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) BDM HARDWARE COMMAND Global Address [22:0] Bit22 Bit16 Bit15 BDMGPR Register [6:0] Bit0 BDM Local Address BDM FIRMWARE COMMAND Global Address [22:0] Bit22 Bit16 Bit15 BDMGPR Register [6:0] Bit0 CPU Local Address Figure 3-18. BDMGPR Address Mapping 3.4.2.3 Implemented Memory Map The global memory spaces reserved for the internal resources (RAM, EEE, and FLASH) are not determined by the MMC module. Size of the individual internal resources are however fixed in the design of the device cannot be changed by the user. Please refer to the Device User Guide for further details. Figure 3-19 and Table 3-17 show the memory spaces occupied by the on-chip resources. Please note that the memory spaces have fixed top addresses. Table 3-17. Global Implemented Memory Space Internal Resource $Address RAM RAM_LOW = 0x10_0000 minus RAMSIZE(1) FLASH FLASH_LOW = 0x80_0000 minus FLASHSIZE(2) 1. RAMSIZE is the hexadecimal value of RAM SIZE in bytes 2. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes When the device is operating in expanded modes except emulation single-chip mode, accesses to global addresses which are not occupied by the on-chip resources (unimplemented areas or external memory space) result in accesses to the external bus (see Figure 3-19). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 209 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) In emulation single-chip mode, accesses to global addresses which are not occupied by the on-chip resources (unimplemented areas) result in accesses to the external bus. CPU accesses to global addresses which are occupied by external memory space result in an illegal access reset (system reset) in case of no MPU error. BDM accesses to the external space are performed but the data will be undefined. In single-chip modes accesses by the CPU (except for firmware commands) to any of the unimplemented areas (see Figure 3-19) will result in an illegal access reset (system reset) in case of no MPU error. BDM accesses to the unimplemented areas are allowed but the data will be undefined. No misaligned word access from the BDM module will occur; these accesses are blocked in the BDM module (Refer to BDM Block Guide). Misaligned word access to the last location of RAM is performed but the data will be undefined. Misaligned word access to the last location of any global page (64 Kbyte) by any global instruction, is performed by accessing the last byte of the page and the first byte of the same page, considering the above mentioned misaligned access cases. The non-internal resources (unimplemented areas or external space) are used to generate the chip selects (CS0,CS1,CS2 and CS3) (see Figure 3-19), which are only active in normal expanded, emulation expanded (see Section 3.3.2.1, “MMC Control Register (MMCCTL0)). MC9S12XE-Family Reference Manual , Rev. 1.21 210 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map Global Memory Map 0x00_0000 0x00_07FF 2K REGISTERS CS3 Unimplemented RAM 0x0000 0x0800 0x0C00 0x1000 RAM 2K REGISTERS 1K EEPROM window EPAGE RAMSIZE RAM_LOW 0x0F_FFFF 1K EEPROM 4K RAM window RPAGE 0x2000 256 K EEEPROM 8K RAM 0x4000 0x13_FFFF CS2 Unpaged 16K FLASH 0x1F_FFFF External Space CS1 0x8000 PPAGE 0x3F_FFFF 0xC000 CS0 16K FLASH window Unimplemented FLASH Unpaged 16K FLASH Reset Vectors FLASH_LOW FLASH FLASHSIZE 0xFFFF 0x7F_FFFF Figure 3-19. S12XE CPU & BDM Global Address Mapping MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 211 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.4 3.4.2.4.1 XGATE Memory Map Scheme Expansion of the XGATE Local Address Map The XGATE 64 Kbyte memory space allows access to internal resources only (Registers, RAM, and FLASH). The 2 Kilobyte register address range is the same register address range as for the CPU and the BDM module (see Table 3-18). XGATE can access the FLASH in single chip modes, even when the MCU is secured. In expanded modes, XGATE can not access the FLASH when MCU is secured. The local address of the XGATE RAM access is translated to the global RAM address range. The XGATE shares the RAM resource with the CPU and the BDM module (see Table 3-18). XGATE RAM size (XGRAMSIZE) may be lower or equal to the MCU RAM size (RAMSIZE).In case of XGATE RAM size less than 32 Kbytes (see Figure 3-20), the gap in the xgate local memory map will result in an illegal RAM access (see Section 3.4.3.1, “Illegal XGATE Accesses) The local address of the XGATE FLASH access is always translated to the global address 0x78_0800 0x78_7FFF. Example 3-3. is a general example of the XGATE memory map implementation. Table 3-18. XGATE Implemented Memory Space Internal Resource $Address XGATE RAM XGRAM_LOW = 0x0F_0000 plus (0x1_0000 minus XGRAMSIZE)(1) 1. XGRAMSIZE is the hexadecimal value of XGATE RAM SIZE in bytes. Example 3-3. The MCU FLASHSIZE is 64 Kbytes (0x10000) and MCU RAMSIZE is 32 Kbytes (0x8000). The XGATE RAMSIZE is 16 Kbytes (0x4000). The space occupied by the XGATE RAM in the global address space will be: Bottom address: (0x10_0000 minus 0x4000) = 0x0F_C000 Top address: 0x0F_FFFF XGATE accesses to local address range 0x0800–0x7FFF will result always in accesses to the following FLASH block in the global address space: Bottom address: 0x78_0800 Top address: 0x78_7FFF The gap range in the local memory map 0x8000–0xBFFF will be translated in the global address space: 0x0F_8000 - 0x0F_BFFF (illegal xgate access to system RAM). MC9S12XE-Family Reference Manual , Rev. 1.21 212 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) XGATE Local Memory Map Global Memory Map 0x00_0000 Registers 0x00_07FF XGRAM_LOW 0x0800 RAM 0x0F_FFFF RAMSIZE Registers XGRAMSIZE 0x0000 FLASH 0x7FFF XGRAMSIZE Unimplemented area RAM 0x78_0800 0xFFFF FLASHSIZE FLASH 0x78_7FFF 0x7F_FFFF Figure 3-20. XGATE Global Address Mapping MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 213 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.5 Memory Configuration Two bits in the MMCCTL1 register (ROMHM, RAMHM) configure the mapping of the local address (0x4000-0x7FFF) in the global memory map. ROMHM, RAMHM are write once in normal and emulation modes and anytime in special modes. Three areas are identified (See Figure 3-21): • Program FLASH (0x7F_4000-0x7F_7FFF) when ROMHM = 0. • External Space (0x14_4000-0x14_7FFF) when ROMHM = 1 and RAMHM = 0. • XSRAM Space (0x0F_C000-0x0F_FFFF) when ROMHM = 1 and RAMHM = 1. Table 3-19 shows the translation from the local memory map to the global memory map taking in consideration the different configurations of ROMHM and RAMHM. Table 3-19. ROMHM and RAMHM Address Location Local Address 0x4000 - 0x7FFF 0x2000 - 0x3FFF 0x2000 - 0x3FFF ROMHM RAMHM Global Address Location 0 X 0x7F_4000 - 0x7F_7FFF Internal Flash 1 0 0x14_4000 - 0x14_7FFF External Space 0x0F_C000 - 0x0F_FFFF Bottom of the Implemented RAM 1 1 0x0F_A000 - 0x0F_BFFF Fixed up to 8K RAM 1 0 0x0F_E000 - 0x0F_FFFF Fixed up to 8K RAM Table 3-20 describes the application note of the RAM configuration and its dedicated global address. Table 3-20. RAM Configuration phase RPAGE ROMHM RAMHM RAM AREA Global Address After reset RPAGE = 0xFD (Reset value) 0 0 12 Kilobytes 0x0F_D000 - 0x0F_FFFF During setup RPAGE = 0xFD (Reset value) 1 1 24 Kilobytes 0x0F_A000 - 0x0F_FFFF (0x00 <= RPAGE <= 0xF9) 1 1 28 Kilobytes 0x00_0000 - 0x0F_9FFF (0xFA <= RPAGE <= 0xFF) 1 1 24 Kilobytes 0x0F_A000 - 0x0F_FFFF Normal Operation MC9S12XE-Family Reference Manual , Rev. 1.21 214 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map Global Memory Map 0x00_0000 0x00_0800 2K REGISTERS 2K RAM RAM 251*4K paged 0x0F_A000 8K RAM 0x0800 0x0C00 0x1000 2K REGISTERS 1K EEPROM window 16K RAM 0x10_0000 1K EEPROM EEPROM 255*1K paged 4K RAM window 0x2000 8K RAM 0x4000 0x13_FC00 256 Kilobytes 0x0000 ROMHM RAMHM 0x0F_C000 1 1 1M minus 2 Kilobytes 0x00_1000 1K EEPROM 1 16K External 0 0x8000 External Space 2.75 Mbytes 0x14_0000 ROMHM RAMHM 0x14_4000 16K FLASH window 0x40_0000 0xC000 0xFFFF Reset Vectors ROMHM RAMHM 0x7F_4000 0 16K FLASH x 0x7F_8000 0x7F_C000 4 Mbytes FLASH 253 *16K paged Unpaged 16K FLASH 16K FLASH (PPAGE 0xFE) 16K FLASH (PPAGE 0xFF) 0x7F_FFFF Figure 3-21. ROMHM, RAMHM Memory Configuration MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 215 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.5.1 System XSRAM System XSRAM has two ways to be accessed by the CPU. One is by the programming of RPAGE and the fixed XSRAM areas configured by the values of ROMHM, RAMHM, or by the usage of the global instruction and the usage of GPAGE. Figure 3-22 shows the memory map for the implemented XSRAM. The size of the implemented XSRAM is done by the device definition and denoted by RAMSIZE. RAM Area in the Memory Map ROMHM = 1 RAMHM = 0 0x00_0000 0x00_07FF ROMHM = 0 RAMHM = X ROMHM = 1 RAMHM = 1 REG. Area 0x00_0800 0x00_0800 Unimplemented RAM RAM Area Unimplemented RAM 0x0F_FFFF 0x0F_A000 EEPROM Area RAMSIZE 8K RAM 0x13_FFFF 0x0F_C000 16K RAM 0x0F_E000 External Space Area 8K RAM 0x0F_FFFF 0x0F_FFFF 0x3F_FFFF FLASH Area 0x7F_FFFF Figure 3-22. S12XE System RAM in the Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 216 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.3 Chip Access Restrictions CPU and XGATE accesses are watched in the memory protection unit (See MPU Block Guide). In case of access violation, the suspect master is acknowledged with an indication of an error; the victim target will not be accessed. Other violations MPU is not handling are listed below. 3.4.3.1 Illegal XGATE Accesses A possible access error is flagged by the MMC and signalled to XGATE under the following conditions: • XGATE performs misaligned word (in case of load-store or opcode or vector fetch accesses). • XGATE accesses the register space (in case of opcode or vector fetch). • XGATE performs a write to Flash in any modes (in case of load-store access). • XGATE performs an access to a secured Flash in expanded modes (in case of load-store or opcode or vector fetch accesses). For further details refer to the XGATE Block Guide. 3.4.4 Chip Bus Control The MMC controls the address buses and the data buses that interface the S12X masters (CPU, BDM and XGATE) with the rest of the system (master buses). In addition the MMC handles all CPU read data bus swapping operations. All internal and external resources are connected to specific target buses (see Figure 3-231). 1. Doted blocks and lines are optional. Please refer to the Device User Guide for their availlibilities. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 217 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) BDM CPU DBG XGATE XGATE FLEXRAY S12X1 S12X0 S12X2 MMC “Crossbar Switch” EBI XBUS0 XBUS1 BLKX XBUS3 FTM FLASH EEE XRAM BDM resources XSRAM XBUS2 IPBI Figure 3-23. MMC Block Diagram 3.4.4.1 Master Bus Prioritization regarding access conflicts on Target Buses The arbitration scheme allows only one master to be connected to a target at any given time. The following rules apply when prioritizing accesses from different masters to the same target bus: • CPU always has priority over BDM and XGATE. • XGATE access to PRU registers constitutes a special case. It is always granted and stalls the CPU for its duration. • XGATE has priority over BDM. • BDM has priority over CPU and XGATE when its access is stalled for more than 128 cycles. In the later case the suspect master will be stalled after finishing the current operation and the BDM will gain access to the bus. • In emulation modes all internal accesses are visible on the external bus as well and the external bus is used during access to the PRU registers. 3.5 3.5.1 Initialization/Application Information CALL and RTC Instructions CALL and RTC instructions are uninterruptable CPU instructions that automate page switching in the program page window. The CALL instruction is similar to the JSR instruction, but the subroutine that is MC9S12XE-Family Reference Manual , Rev. 1.21 218 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) called can be located anywhere in the local address space or in any Flash or ROM page visible through the program page window. The CALL instruction calculates and stacks a return address, stacks the current PPAGE value and writes a new instruction-supplied value to the PPAGE register. The PPAGE value controls which of the 256 possible pages is visible through the 16 Kbyte program page window in the 64 Kbyte local CPU memory map. Execution then begins at the address of the called subroutine. During the execution of the CALL instruction, the CPU performs the following steps: 1. Writes the current PPAGE value into an internal temporary register and writes the new instructionsupplied PPAGE value into the PPAGE register 2. Calculates the address of the next instruction after the CALL instruction (the return address) and pushes this 16-bit value onto the stack 3. Pushes the temporarily stored PPAGE value onto the stack 4. Calculates the effective address of the subroutine, refills the queue and begins execution at the new address This sequence is uninterruptable. There is no need to inhibit interrupts during the CALL instruction execution. A CALL instruction can be performed from any address to any other address in the local CPU memory space. The PPAGE value supplied by the instruction is part of the effective address of the CPU. For all addressing mode variations (except indexed-indirect modes) the new page value is provided by an immediate operand in the instruction. In indexed-indirect variations of the CALL instruction a pointer specifies memory locations where the new page value and the address of the called subroutine are stored. Using indirect addressing for both the new page value and the address within the page allows usage of values calculated at run time rather than immediate values that must be known at the time of assembly. The RTC instruction terminates subroutines invoked by a CALL instruction. The RTC instruction unstacks the PPAGE value and the return address and refills the queue. Execution resumes with the next instruction after the CALL instruction. During the execution of an RTC instruction the CPU performs the following steps: 1. Pulls the previously stored PPAGE value from the stack 2. Pulls the 16-bit return address from the stack and loads it into the PC 3. Writes the PPAGE value into the PPAGE register 4. Refills the queue and resumes execution at the return address This sequence is uninterruptable. The RTC can be executed from anywhere in the local CPU memory space. The CALL and RTC instructions behave like JSR and RTS instruction, they however require more execution cycles. Usage of JSR/RTS instructions is therefore recommended when possible and CALL/RTC instructions should only be used when needed. The JSR and RTS instructions can be used to access subroutines that are already present in the local CPU memory map (i.e. in the same page in the program memory page window for example). However calling a function located in a different page requires usage of the CALL instruction. The function must be terminated by the RTC instruction. Because the RTC instruction restores contents of the PPAGE register from the stack, functions terminated with the RTC instruction must be called using the CALL instruction even when the correct page is already present MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 219 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) in the memory map. This is to make sure that the correct PPAGE value will be present on stack at the time of the RTC instruction execution. 3.5.2 Port Replacement Registers (PRRs) Registers used for emulation purposes must be rebuilt by the in-circuit emulator hardware to achieve full emulation of single chip mode operation. These registers are called port replacement registers (PRRs) (see Table 1-25). PRRs are accessible from CPU, BDM and XGATE using different access types (word aligned, word-misaligned and byte). Each access to PRRs will be extended to 2 bus cycles for write or read accesses independent of the operating mode. In emulation modes all write operations result in simultaneous writing to the internal registers (peripheral access) and to the emulated registers (external access) located in the PRU in the emulator. All read operations are performed from external registers (external access) in emulation modes. In all other modes the read operations are performed from the internal registers (peripheral access). Due to internal visibility of CPU accesses the CPU will be halted during XGATE or BDM access to any PRR. This rule applies also in normal modes to ensure that operation of the device is the same as in emulation modes. A summary of PRR accesses: • An aligned word access to a PRR will take 2 bus cycles. • A misaligned word access to a PRRs will take 4 cycles. If one of the two bytes accessed by the misaligned word access is not a PRR, the access will take only 3 cycles. • A byte access to a PRR will take 2 cycles. MC9S12XE-Family Reference Manual , Rev. 1.21 220 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-21. PRR Listing 3.5.3 PRR Name PRR Local Address PRR Location PORTA 0x0000 PIM PORTB 0x0001 PIM DDRA 0x0002 PIM DDRB 0x0003 PIM PORTC 0x0004 PIM PORTD 0x0005 PIM DDRC 0x0006 PIM DDRD 0x0007 PIM PORTE 0x0008 PIM DDRE 0x0009 PIM MMCCTL0 0x000A MMC MODE 0x000B MMC PUCR 0x000C PIM RDRIV 0x000D PIM EBICTL0 0x000E EBI EBICTL1 0x000F EBI Reserved 0x0012 MMC MMCCTL1 0x0013 MMC ECLKCTL 0x001C PIM Reserved 0x001D PIM PORTK 0x0032 PIM DDRK 0x0033 PIM On-Chip ROM Control The MCU offers two modes to support emulation. In the first mode (called generator) the emulator provides the data instead of the internal FLASH and traces the CPU actions. In the other mode (called observer) the internal FLASH provides the data and all internal actions are made visible to the emulator. 3.5.3.1 ROM Control in Single-Chip Modes In single-chip modes the MCU has no external bus. All memory accesses and program fetches are internal (see Figure 3-24). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 221 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) No External Bus MCU Flash Figure 3-24. ROM in Single Chip Modes 3.5.3.2 ROM Control in Emulation Single-Chip Mode In emulation single-chip mode the external bus is connected to the emulator. If the EROMON bit is set, the internal FLASH provides the data and the emulator can observe all internal CPU actions on the external bus. If the EROMON bit is cleared, the emulator provides the data (generator) and traces the all CPU actions (see Figure 3-25). Observer Emulator MCU Flash EROMON = 1 Generator MCU Emulator Flash EROMON = 0 Figure 3-25. ROM in Emulation Single-Chip Mode 3.5.3.3 ROM Control in Normal Expanded Mode In normal expanded mode the external bus will be connected to the application. If the ROMON bit is set, the internal FLASH provides the data. If the ROMON bit is cleared, the application memory provides the data (see Figure 3-26). MC9S12XE-Family Reference Manual , Rev. 1.21 222 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) MCU Application Memory Flash ROMON = 1 MCU Application Memory ROMON = 0 Figure 3-26. ROM in Normal Expanded Mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 223 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.5.3.4 ROM Control in Emulation Expanded Mode In emulation expanded mode the external bus will be connected to the emulator and to the application. If the ROMON bit is set, the internal FLASH provides the data. If the EROMON bit is set as well the emulator observes all CPU internal actions, otherwise the emulator provides the data and traces all CPU actions (see Figure 3-27). When the ROMON bit is cleared, the application memory provides the data and the emulator will observe the CPU internal actions (see Figure 3-28). Observer MCU Emulator Flash Application Memory EROMON = 1 Generator MCU Emulator Flash Application Memory EROMON = 0 Figure 3-27. ROMON = 1 in Emulation Expanded Mode MC9S12XE-Family Reference Manual , Rev. 1.21 224 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Observer MCU Emulator Application Memory Figure 3-28. ROMON = 0 in Emulation Expanded Mode 3.5.3.5 ROM Control in Special Test Mode In special test mode the external bus is connected to the application. If the ROMON bit is set, the internal FLASH provides the data, otherwise the application memory provides the data (see Figure 3-29). Application MCU Memory ROMON = 0 Application MCU Flash Memory ROMON = 1 Figure 3-29. ROM in Special Test Mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 225 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) MC9S12XE-Family Reference Manual , Rev. 1.21 226 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Table 4-1. Revision History Revision Number Revision Date Sections Affected V01.04 14 Sep 2005 4.3.1.1/4-231 4.4.1/4-237 - Added note to only use the CPU to clear the AE flag. - Added disclaimer to avoid changing descriptors while they are in use because of other bus-masters doing accesses. V01.05 14 Mar 2006 4.3.1.1/4-231 4.4/4-237 - Clarified that interrupt generation is independent of AEF bit state. - Corrected preliminary statement about execution of violating accesses. V01.06 09 Oct 2006 4.1 Description of Changes - Made Revision History entries public. Introduction The MPU module provides basic functionality required to protect memory mapped resources from undesired accesses. Multiple address range comparators compare memory accesses against eight memory protection descriptors located in the MPU module to determine if each access is valid or not. The comparison is sensitive to which bus master generates the access and the type of the access. The MPU module can be used to isolate memory ranges accessible by different bus masters. It can be also be used by an operating system or software kernel to isolate the regions of memory “legally” available to specific software tasks, with the kernel re-configuring the task specific memory protection descriptors in supervisor state during task-switching. 4.1.1 Preface The following terms and abbreviations are used in the document. Table 4-2. Terminology Term MCU MPU CPU XGATE supervisor state user state 4.1.2 Meaning Micro-Controller Unit Memory Protection Unit S12X Central Processing Unit (see S12XCPU Reference Manual) XGATE Co-processor (see XGATE chapter) refers to the supervisor state of the S12XCPU (see S12XCPU Reference Manual) refers to the user state of the S12XCPU (see S12XCPU Reference Manual) Overview The MPU module monitors the bus activity of each bus master. The data describing each access is fed into multiple address range comparators. The output of the comparators is used to determine if a particular MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 227 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) access is allowed or represents an access violation. If an access violation caused by the S12X CPU is detected, the MPU module raises an access violation interrupt. If the MPU module detects an access violation caused by a bus master other than the S12X CPU, it flags an access error condition to the respective master. In addition to the restrictions defined for memory ranges in the MPU descriptors, accesses to memory not covered by any MPU descriptor (even read accesses!) are considered access violations. Figure 4-1 shows a block diagram of the MPU module. MPU Bus Interface Access Validation Protection Descriptors Bus Interface Bus Interface Access Validation Comparators Bus Interface Access Validation Bus Interface Op-code Fetch MPU Monitoring Bus Interface Data Access CPU Protection Descriptors Op-code Fetch MPU Monitoring Comparators Data Access XGATE Data Access “Master3” Comparators MPU Monitoring Status Registers MMC Access Violation Interrupt Figure 4-1. Block Diagram 4.1.3 • • Features Protects memory from undesired accesses coming from up to 3 bus masters1 Eight memory protection descriptors — each descriptor can cover the full global memory map (8 MBytes) — each descriptor has a granularity of 8 Bytes 1. Master 3 can be implemented or left out depending the chip configuration. Please refer to the Device Reference Manual for information about the availability and function of Master 3. MC9S12XE-Family Reference Manual , Rev. 1.21 228 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) • • 4.1.4 Each descriptor can be configured to allow one of four types of access privilege for the defined memory region — Bus master has full access (read, write and execute enabled) — Bus master can read and execute (write illegal) — Bus master can read and write (execution illegal) — Bus master can only read (write and execution illegal) Accesses to memory not covered by any protection descriptor will cause an access violation Modes of Operation The MPU module can be used in all MCU modes. 4.2 External Signal Description The MPU module has no external signals. 4.3 Memory Map and Register Definition This section provides a detailed description of address space and registers used by the MPU module. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 229 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1 Register Descriptions This section describes in address order all the MPU module registers and their individual bits. Register Name 0x0000 MPUFLG Bit 7 R W 0x0001 MPUASTAT0 W 0x0002 MPUASTAT1 W 0x0003 MPUASTAT2 R W R R R W 0x0007 MPUDESC11 W 0x0008 MPUDESC21 W 0x000B MPUDESC51 3 2 1 Bit 0 WPF NEXF 0 0 0 0 SVSF 0 0 0 0 ADDR[22:16] ADDR[15:8] ADDR[7:0] W 0x0005 MPUSEL 0x000A MPUDESC41 4 R W 0x0009 MPUDESC31 5 R 0x0004 Reserved 0x0006 MPUDESC0(1) AEF 6 0 SVSEN MSTR0 0 0 0 0 0 0 0 0 MSTR1 MSTR2 MSTR3 R W R W R W LOW_ADDR[22:19] LOW_ADDR[18:11] R R SEL[2:0] LOW_ADDR[10:3] WP NEX 0 0 HIGH_ADDR[22:19] HIGH_ADDR[18:11] HIGH_ADDR[10:3] = Unimplemented or Reserved 1. The module addresses 0x0006−0x000B represent a window in the register map through which different descriptor registers are visible. Figure 4-2. MPU Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 230 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.1 MPU Flag Register (MPUFLG) Address: Module Base + 0x0000 7 R W Reset AEF 0 6 5 4 3 2 1 0 WPF NEXF 0 0 0 0 SVSF 0 0 0 0 0 0 0 Figure 4-3. MPU Flag Register (MPUFLG) Read: Anytime Write: Write of 1 clears flag, write of 0 ignored Table 4-3. MPUFLG Field Descriptions Field Description 7 AEF Access Error Flag — This bit is the CPU access error interrupt flag. It is set if a CPU access violation has occurred. At the same time this bit is set, all the other status flags in this register and the access violation address bits in the MPUASTATn registers are captured. Clear this flag by writing a one. Note: If a CPU access error is flagged and both the WPF bit and the NEXF bit are zero, the access violation was caused by an access to memory not covered by the MPU descriptors. Note: While this bit is set, the CPU in supervisor state (“Master 0”) can read from and write to the peripheral register space even if there is no memory protection descriptor explicitly allowing this. This is to prevent the case that the CPU cannot clear the AEF bit if the registers are write protected for the CPU in supervisor state. Note: This bit should only be cleared by an access from the S12X CPU. Otherwise, when using one of the other masters (such as the XGATE) to clear this bit, the status flags and the address status registers may not get updated correctly if a CPU access causes a violation in the same bus cycle. 6 WPF Write-Protect Violation Flag — This flag is set if the current CPU access violation has occurred because of an attempt to write to memory configured as read-only. The WPF bit is read-only; it will be automatically updated when the next access violation is flagged with the AEF bit. 5 NEXF No-Execute Violation Flag — This bit is set if the current CPU access violation has occurred because of an attempt to fetch code from memory configured as No-Execute. The NEXF bit is read-only; it will be automatically updated when the next access violation is flagged with the AEF bit. 0 SVSF Supervisor State Flag — This bit is set if the current CPU access violation occurred while the CPU was in supervisor state. This bit is cleared if the current CPU access violation occurred while the CPU was in user state. The supervisor state flag is read-only; it will be automatically updated when the next CPU access violation is flagged with the AEF bit. If the AEF bit is set further violations are not captured into the MPU status registers. The status of the AEF bit has no effect on the access restrictions, i.e. access restrictions for all masters are still enforced if the AEF bit is set. Also, the non-maskable hardware interrupt for violating accesses coming from the S12X CPU is generated regardless of the state of the AEF bit. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 231 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.2 MPU Address Status Register 0 (MPUASTAT0) Address: Module Base + 0x0001 7 R 6 5 4 0 3 2 1 0 0 0 0 ADDR[22:16] W Reset 0 0 0 0 0 Figure 4-4. MPU Address Status Register 0 (MPUASTAT0) Read: Anytime Write: Never Table 4-4. MPUASTAT0 Field Descriptions Field Description 6–0 Access violation address bits — The ADDR[22:16] bits contain bits [22:16] of the global address which ADDR[22:16] caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. 4.3.1.3 MPU Address Status Register 1 (MPUASTAT1) Address: Module Base + 0x0002 7 6 5 4 R 3 2 1 0 0 0 0 0 ADDR[15:8] W Reset 0 0 0 0 Figure 4-5. MPU Address Status Register 1 (MPUASTAT1) Read: Anytime Write: Never Table 4-5. MPUASTAT1 Field Descriptions Field Description 7–0 ADDR[15:8] Access violation address bits — The ADDR[15:8] bits contain bits [15:8] of the global address which caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. MC9S12XE-Family Reference Manual , Rev. 1.21 232 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.4 MPU Address Status Register 2 (MPUASTAT2) Address: Module Base + 0x0003 7 6 5 4 R 3 2 1 0 0 0 0 0 ADDR[7:0] W Reset 0 0 0 0 Figure 4-6. MPU Address Status Register (MPUASTAT2) Read: Anytime Write: Never Table 4-6. MPUASTAT2 Field Descriptions Field Description 7–0 ADDR[7:0] Access violation address bits — The ADDR[7:0] bits contain bits [7:0] of the global address which caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. 4.3.1.5 MPU Descriptor Select Register (MPUSEL) Address: Module Base + 0x0005 7 R W Reset SVSEN 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 SEL[2:0] 0 0 0 Figure 4-7. MPU Descriptor Select Register (MPUSEL) Read: Anytime Write: Anytime Table 4-7. MPUSEL Field Descriptions Field Description 7 SVSEN MPU supervisor state enable bit — This bit enables the memory protection for the CPU in supervisor state. If this bit is cleared, the MPU does not affect any accesses coming from the CPU in supervisor state. This is to prevent the CPU from locking out itself while configuring the protection descriptors (during initialization after a system reset and during the update of the protection descriptors for a task switch). The memory protection functionality for the other bus-masters is unaffected by this bit. 0 MPU is disabled for the CPU in supervisor state 1 MPU is enabled for the CPU in supervisor state 2–0 SEL[2:0] Descriptor select bits — The SEL[2:0] bits select which descriptor is visible in the MPU Descriptor Register window (MPUDESC0—MPUDESC5). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 233 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.6 MPU Descriptor Register 0 (MPUDESC0) Address: Module Base + 0x0006 R W 7 6 5 4 3 MSTR0 MSTR1 MSTR2 MSTR3 2 1 0 LOW_ADDR[22:19] 0 Reset 1(1) 11 1(2) 11 1. initialized as set for descriptor 0 only, cleared for all others 2. initialized as set for descriptor 0 only, if MSTR3 is implemented on the device 0 0 0 Figure 4-8. MPU Descriptor Register 0 (MPUDESC0) Read: Anytime Write: Anytime Table 4-8. MPUDESC0 Field Descriptions Field Description 7 MSTR0 Master 0 select bit — If this bit is set the descriptor is valid for bus master 0 (CPU in supervisor state). 6 MSTR1 Master 1 select bit — If this bit is set the descriptor is valid for bus master 1 (CPU in user state). 5 MSTR2 Master 2 select bit — If this bit is set the descriptor is valid for bus master 2 (XGATE). 4 MSTR3 Master 3 select bit — If this bit is set the descriptor is valid for bus master 3. 3–0 Memory range lower boundary address bits — The LOW_ADDR[22:19] bits represent bits [22:19] of the LOW_ADDR[ global memory address that is used as the lower boundary for the described memory range. 22:19] A descriptor can be configured as valid for more than one bus-master at the same time by setting multiple Master select bits to one. Setting all Master select bits of a descriptor to zero disables the descriptor. 4.3.1.7 MPU Descriptor Register 1 (MPUDESC1) Address: Module Base + 0x0007 7 6 5 R 3 2 1 0 0 0 0 LOW_ADDR[18:11] W Reset 4 0 0 0 0 0 Figure 4-9. MPU Descriptor Register 1 (MPUDESC1) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 234 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Table 4-9. MPUDESC1 Field Descriptions Field Description Memory range lower boundary address bits — The LOW_ADDR[18:11] bits represent bits [18:11] of the 7–0 LOW_ADDR[ global memory address that is used as the lower boundary for the described memory range. 18:11] 4.3.1.8 MPU Descriptor Register 2 (MPUDESC2) Address: Module Base + 0x0008 7 6 5 R 3 2 1 0 0 0 0 LOW_ADDR[10:3] W Reset 4 0 0 0 0 0 Figure 4-10. MPU Descriptor Register 2 (MPUDESC2) Read: Anytime Write: Anytime Table 4-10. MPUDESC2 Field Descriptions Field Description 7–0 Memory range lower boundary address bits — The LOW_ADDR[10:3] bits represent bits [10:3] of the global LOW_ADDR[ memory address that is used as the lower boundary for the described memory range. 10:3] 4.3.1.9 MPU Descriptor Register 3 (MPUDESC3) Address: Module Base + 0x0009 7 R W Reset 6 WP NEX 0 0 5 4 0 0 0 0 3 2 1 0 HIGH_ADDR[22:19] 1 1 1 1 Figure 4-11. MPU Descriptor Register 3 (MPUDESC3) Read: Anytime Write: Anytime Table 4-11. MPUDESC3 Field Descriptions Field Description 7 WP Write-Protect bit — The WP bit causes the described memory range to be treated as write-protected. If this bit is set every attempt to write in the described memory range causes an access violation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 235 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Field Description 6 NEX No-Execute bit — The NEX bit prevents the described memory range from being used as code memory. If this bit is set every Op-code fetch in this memory range causes an access violation. 3–0 Memory range upper boundary address bits — The HIGH_ADDR[22:19] bits represent bits [22:19] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 22:19] 4.3.1.10 MPU Descriptor Register 4 (MPUDESC4) Address: Module Base + 0x000A 7 6 5 R 3 2 1 0 1 1 1 HIGH_ADDR[18:11] W Reset 4 1 1 1 1 1 Figure 4-12. MPU Descriptor Register 4 (MPUDESC4) Read: Anytime Write: Anytime Table 4-12. MPUDESC4 Field Descriptions Field Description 7–0 Memory range upper boundary address bits — The HIGH_ADDR[18:11] bits represent bits [18:11] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 18:11] 4.3.1.11 MPU Descriptor Register 5 (MPUDESC5) Address: Module Base + 0x000B 7 6 5 R 3 2 1 0 1 1 1 HIGH_ADDR[10:3] W Reset 4 1 1 1 1 1 Figure 4-13. MPU Descriptor Register 5 (MPUDESC5) Read: Anytime Write: Anytime Table 4-13. MPUDESC5 Field Descriptions Field Description 7–0 Memory range upper boundary address bits — The HIGH_ADDR[10:3] bits represent bits [10:3] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 10:3] MC9S12XE-Family Reference Manual , Rev. 1.21 236 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.4 Functional Description The MPU module provides memory protection for accesses coming from multiple masters in the system. This is done by monitoring bus traffic of each master and compare this with the configuration information from a set of eight programmable descriptors located in the MPU module. If the MPU module detects an access violation caused by the S12X CPU, it will assert the CPU access violation interrupt signal. If the MPU module detects an access violation caused by a bus master other than the S12X CPU, it raises an access error signal. Please refer to the documentation chapter of the individual master modules (i.e. XGATE, etc.) for more information about the access error condition. Violating accesses are not executed. The return value of a violating read access is undefined for both 8 bit and 16 bit accesses. NOTE Accesses from BDM are not restricted. BDM hardware accesses always bypass the MPU module. During execution of BDM firmware code S12X CPU accesses are masked from the MPU module as well. 4.4.1 Protection Descriptors Each of the eight protection descriptors can be used to restrict the allowed types of memory accesses for a given memory range. Each of these memory ranges can cover up the entire 23 bits global memory range (8 MBytes). The descriptors are banked in the MPU module register map. Each descriptor can be selected for modifying using the SEL bits in the MPU Descriptor Select (MPUSEL) register. Table 4-14 gives an overview of the types of accesses that can be configured using the protection descriptors. Table 4-14. Access Types WP NEX Meaning 0 0 read, write and execute 0 1 read, write 1 0 read and execute 1 1 read only The granularity of each descriptor is 8 bytes. This means the protection comparators in the MPU module cover only address bits [22:3] of each access. The lower address bits [2:0] are ignored. NOTE A mis-aligned word access to the upper boundary address of a descriptor is always flagged as an access violation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 237 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) NOTE Configuring the lower boundary address of a descriptor to be higher than the upper boundary address of a descriptor causes this descriptor to be ignored by the comparator block. This effectively disables the descriptor. NOTE Avoid changing descriptors while they are in active use to validate accesses from bus-masters. This can be done by temporarily disabling the affected master during the update (XGATE, Master 3, switch S12X CPU states). Otherwise accesses from bus-masters affected by a descriptor which is updated concurrently could yield undefined results. 4.4.1.1 Overlapping Descriptors If the memory ranges of two protection descriptors defined for the same bus-master overlap, the access restrictions for the overlapped memory range are accumulated. For example: • a memory protection descriptor defines memory range 0x40_0000−0x41_FFFF as WP=1, NEX=0 (read and execute) • another descriptor defines memory range 0x41_0000−0x43_FFFF as WP=0, NEX=1 (read and write) • the resulting access rights for the overlapping range 0x41_0000−0x41_FFFF are WP=1, NEX=1 (read only) 4.4.1.2 Implicitly defined memory descriptors As mentioned in the bit description of the Access Error Flag (AEF) in the MPUFLG register (Table 4-3), there is an additional memory range implicitly defined only while the AEF bit is set: The CPU in supervisor state can read from and write to the peripheral register space even if there is no memory protection descriptor explicitly allowing this. This is to prevent the case that the CPU cannot clear the AEF bit if the registers are write protected for the CPU in supervisor state. The register address space containing the PAGE registers (EPAGE, RPAGE, GPAGE, PPAGE) at 0x0010− 0x0017 gets special treatment. It is defined like this: • The S12X CPU can always read and write these registers, regardless of the configuration in the descriptors. • XGATE or Master3 (if available) are never allowed to read or write these registers, even if the descriptor configuration allows accesses for other masters than the S12X CPU. 4.4.1.3 Op-code pre-fetch cycles and the NEX bit Some bus-masters (CPU, XGATE) do a pre-fetch of program-code past the current instruction. The S12XCPU pre-fetches two words past the current instruction, the XGATE pre-fetches one word, even if the pre-fetched code is not executed. The MPU module has no way of knowing this at the time when the pre-fetch cycles occur. Therefore this will result in an access violation if the op-code pre-fetch accesses a memory range marked as “No-Execute” (NEX=1). This must be taken into account when defining memory MC9S12XE-Family Reference Manual , Rev. 1.21 238 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) ranges with the NEX bit set adjacent to memory used for program code. The best way to do this would be to leave some fill-bytes between the memory ranges in this case, i.e. do not set the upper memory boundary to the address of the last op-code but to a following address which is at least two words (four bytes) away. 4.4.2 Interrupts This section describes all interrupts originated by the MPU module. 4.4.2.1 Description of Interrupt Operation The MPU module generates one interrupt request. It cannot be masked locally in the MPU module and is meant to be used as the source of a non-maskable hardware interrupt request for the S12X CPU Table 4-15. Interrupt vectors Interrupt Source S12X CPU access error interrupt (AEF) 4.4.2.2 CCR Mask Local Enable − − CPU Access Error Interrupt An S12X CPU access error interrupt request is generated if the MPU module has detected an illegal memory access originating from the S12X CPU. This is a non-maskable hardware interrupt. Due to the non-maskable nature of this interrupt, the de-assertion of this interrupt request is coupled to the S12X CPU interrupt vector fetch instead of the local access error flag (AEF). This means leaving the access error flag (AEF) in the MPUFLG register set will not cause the same interrupt to be serviced again after leaving the interrupt service routine with “RTI”. Instead, the interrupt request will be asserted again only when the next illegal S12X CPU access is detected. 4.5 4.5.1 Initialization/Application Information Initialization After reset the MPU module is in an unconfigured state, with all eight protection descriptors covering the whole memory map. The master bits are all set for descriptor “0” and cleared for all other descriptors. The S12XCPU in supervisor state can access everything because the SVSEN bit in the MPUSEL register is cleared by a system reset. After system reset every master has full access to the memory map because of descriptor “0”. In order to use the MPU module to protect memory ranges from undesired accesses, software needs to: • Initialize the protection descriptors. • Make sure there are meaningful interrupt service routines defined for the Access Violation interrupts because these are non-maskable (See S12XINT chapter for details). • Initialize peripherals and other masters for use (i.e. set-up XGATE, Master3 if applicable). • Enable the MPU protection for the S12X CPU in supervisor state, if desired. • Switch the S12X CPU to user state, if desired. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 239 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) MC9S12XE-Family Reference Manual , Rev. 1.21 240 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-1. Revision History Revision Number Revision Date V04.01 12 Sep 2005 - Added CSx stretch description. V04.02 23 May 2006 - Internal updates V04.03 24 Jul 2006 5.1 Sections Affected Description of Changes - Removed term IVIS Introduction This document describes the functionality of the XEBI block controlling the external bus interface. The XEBI controls the functionality of a non-multiplexed external bus (a.k.a. ‘expansion bus’) in relationship with the chip operation modes. Dependent on the mode, the external bus can be used for data exchange with external memory, peripherals or PRU, and provide visibility to the internal bus externally in combination with an emulator. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 241 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.1.1 Glossary or Terms bus clock expanded modes Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode single-chip modes Normal Single-Chip Mode Special Single-Chip Mode emulation modes Emulation Single-Chip Mode Emulation Expanded Mode normal modes Normal Single-Chip Mode Normal Expanded Mode special modes Special Single-Chip Mode Special Test Mode NS Normal Single-Chip Mode SS Special Single-Chip Mode NX Normal Expanded Mode ES Emulation Single-Chip Mode EX Emulation Expanded Mode ST Special Test Mode external resource Addresses outside MCU PRR Port Replacement Registers PRU Port Replacement Unit EMULMEM access source 5.1.2 System Clock. Refer to CRG Block Guide. External emulation memory CPU or BDM or XGATE Features The XEBI includes the following features: • Output of up to 23-bit address bus and control signals to be used with a non-muxed external bus • Bidirectional 16-bit external data bus with option to disable upper half • Visibility of internal bus activity 5.1.3 • • • Modes of Operation Single-chip modes The external bus interface is not available in these modes. Expanded modes Address, data, and control signals are activated on the external bus in normal expanded mode and special test mode. Emulation modes The external bus is activated to interface to an external tool for emulation of normal expanded mode or normal single-chip mode applications. MC9S12XE-Family Reference Manual , Rev. 1.21 242 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Refer to the S12X_MMC section for a detailed description of the MCU operating modes. 5.1.4 Block Diagram Figure 5-1 is a block diagram of the XEBI with all related I/O signals. ADDR[22:0] DATA[15:0] IVD[15:0] LSTRB RW EWAIT XEBI UDS LDS RE WE ACC[2:0] IQSTAT[3:0] CS[3:0] Figure 5-1. XEBI Block Diagram 5.2 External Signal Description The user is advised to refer to the SoC section for port configuration and location of external bus signals. NOTE The following external bus related signals are described in other sections: ECLK, ECLKX2 (free-running clocks) — PIM section TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section Table 5-2 outlines the pin names and gives a brief description of their function. Refer to the SoC section and PIM section for reset states of these pins and associated pull-ups or pull-downs. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 243 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-2. External System Signals Associated with XEBI Signal I(1)/O Available in Modes EBI Signal Multiplex (T)ime(2) (F)unction(3) Description NS SS NX ES EX ST RE O — — Read Enable, indicates external read access No No Yes No No No ADDR[22:20] O T — External address No No Yes Yes Yes Yes ACC[2:0] O — Access source No No No Yes Yes Yes ADDR[19:16] O — External address No No Yes Yes Yes Yes IQSTAT[3:0] O — Instruction Queue Status No No No Yes Yes Yes ADDR[15:1] O — External address No No Yes Yes Yes Yes IVD[15:1] O — Internal visibility read data No No No Yes Yes Yes ADDR0 O F External address No No No Yes Yes Yes IVD0 O Internal visibility read data No No No Yes Yes Yes UDS O — Upper Data Select, indicates external access to the high byte DATA[15:8] No No Yes No No No LSTRB O — Low Strobe, indicates valid data on DATA[7:0] No No No Yes Yes Yes LDS O — Lower Data Select, indicates external access to the low byte DATA[7:0] No No Yes No No No RW O — Read/Write, indicates the direction of internal data transfers No No No Yes Yes Yes WE O — Write Enable, indicates external write access No No Yes No No No CS[3:0] O — — Chip select No No Yes No Yes No DATA[15:8] I/O — — Bidirectional data (even address) No No Yes Yes Yes Yes DATA[7:0] I/O — — Bidirectional data (odd address) No No Yes Yes Yes Yes I — — EWAIT T T T F F External control for external bus access No No Yes No Yes No stretches (adding wait states) 1. All inputs are capable of reducing input threshold level 2. Time-multiplex means that the respective signals share the same pin on chip level and are active alternating in a dedicated time slot (in modes where applicable). 3. Function-multiplex means that one of the respective signals sharing the same pin on chip level continuously uses the pin depending on configuration and reset state. MC9S12XE-Family Reference Manual , Rev. 1.21 244 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the XEBI. 5.3.1 Module Memory Map The registers associated with the XEBI block are shown in Figure 5-2. Register Name 0x0E EBICTL0 0x0F EBICTL1 Bit 7 R W 6 4 3 2 1 Bit 0 HDBE ASIZ4 ASIZ3 ASIZ2 ASIZ1 ASIZ0 EXSTR11 EXSTR10 EXSTR02 EXSTR01 EXSTR00 0 ITHRS R 5 0 EXSTR12 W 0 = Unimplemented or Reserved Figure 5-2. XEBI Register Summary 5.3.2 Register Descriptions The following sub-sections provide a detailed description of each register and the individual register bits. All control bits can be written anytime, but this may have no effect on the related function in certain operating modes. This allows specific configurations to be set up before changing into the target operating mode. NOTE Depending on the operating mode an available function may be enabled, disabled or depend on the control register bit. Reading the register bits will reflect the status of related function only if the current operating mode allows user control. Please refer the individual bit descriptions. 5.3.2.1 External Bus Interface Control Register 0 (EBICTL0) Module Base +0x000E (PRR) 7 R W Reset 6 0 ITHRS 0 0 5 4 3 2 1 0 HDBE ASIZ4 ASIZ3 ASIZ2 ASIZ1 ASIZ0 1 1 1 1 1 1 = Unimplemented or Reserved Figure 5-3. External Bus Interface Control Register 0 (EBICTL0) Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes, the data is read from this register. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 245 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) This register controls input pin threshold level and determines the external address and data bus sizes in normal expanded mode. If not in use with the external bus interface, the related pins can be used for alternative functions. External bus is available as programmed in normal expanded mode and always full-sized in emulation modes and special test mode; function not available in single-chip modes. Table 5-3. EBICTL0 Field Descriptions Field Description 7 ITHRS Reduced Input Threshold — This bit selects reduced input threshold on external data bus pins and specific control input signals which are in use with the external bus interface in order to adapt to external devices with a 3.3 V, 5 V tolerant I/O. The reduced input threshold level takes effect depending on ITHRS, the operating mode and the related enable signals of the EBI pin function as summarized in Table 5-4. 0 Input threshold is at standard level on all pins 1 Reduced input threshold level enabled on pins in use with the external bus interface 5 HDBE High Data Byte Enable — This bit enables the higher half of the 16-bit data bus. If disabled, only the lower 8bit data bus can be used with the external bus interface. In this case the unused data pins and the data select signals (UDS and LDS) are free to be used for alternative functions. 0 DATA[15:8], UDS, and LDS disabled 1 DATA[15:8], UDS, and LDS enabled 4–0 ASIZ[4:0] External Address Bus Size — These bits allow scalability of the external address bus. The programmed value corresponds to the number of available low-aligned address lines (refer to Table 5-5). All address lines ADDR[22:0] start up as outputs after reset in expanded modes. This needs to be taken into consideration when using alternative functions on relevant pins in applications which utilize a reduced external address bus. Table 5-4. Input Threshold Levels on External Signals ITHRS External Signal NS SS NX Standard Standard Standard DATA[15:8] TAGHI, TAGLO 0 DATA[7:0] EWAIT 1 DATA[15:8] TAGHI, TAGLO Reduced if HDBE = 1 DATA[7:0] Reduced Standard Standard ES EX Reduced Reduced Standard Standard Reduced Reduced ST Standard Reduced Reduced Reduced if EWAIT if EWAIT Standard Standard (1) enabled1 enabled 1. EWAIT function is enabled if at least one CSx line is configured respectively in MMCCTL0. Refer to S12X_MMC section and Table 5-6. EWAIT Table 5-5. External Address Bus Size ASIZ[4:0] Available External Address Lines 00000 None 00001 UDS 00010 ADDR1, UDS MC9S12XE-Family Reference Manual , Rev. 1.21 246 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-5. External Address Bus Size 5.3.2.2 ASIZ[4:0] Available External Address Lines 00011 ADDR[2:1], UDS : : 10110 ADDR[21:1], UDS 10111 : 11111 ADDR[22:1], UDS External Bus Interface Control Register 1 (EBICTL1) Module Base +0x000F (PRR) 7 R 6 0 W Reset 5 4 EXSTR12 EXSTR11 EXSTR10 1 1 1 0 3 0 2 1 0 EXSTR02 EXSTR01 EXSTR00 1 1 1 0 = Unimplemented or Reserved Figure 5-4. External Bus Interface Control Register 1 (EBICTL1) Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data is read from this register. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. This register allows programming of two independent values determining the amount of additional stretch cycles for external accesses (wait states). With two bits in S12X_MMC register MMCCTL0 for every individual CSx line one of the two counter options or the EWAIT input is selected as stretch source. The chip select outputs can also be disabled to free up the pins for alternative functions (Table 5-6). Refer also to S12X_MMC section for register bit descriptions. Table 5-6. Chip select function CSxE1 CSxE0 Function 0 0 CSx disabled 0 1 CSx stretched with EXSTR0 1 0 CSx stretched with EXSTR1 1 1 CSx stretched with EWAIT If EWAIT input usage is selected in MMCCTL0 the minimum number of stretch cycles is 2 for accesses to the related address range. If configured respectively, stretch cycles are added as programmed or dependent on EWAIT in normal expanded mode and emulation expanded mode; function not available in all other operating modes. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 247 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-7. EBICTL1 Field Descriptions Field Description 6–4 External Access Stretch Option 1 Bits 2, 1, 0 — This three bit field determines the amount of additional clock EXSTR1[2:0] stretch cycles on every access to the external address space as shown in Table 5-8. 2–0 External Access Stretch Option 0 Bits 2, 1, 0 — This three bit field determines the amount of additional clock EXSTR0[2:0] stretch cycles on every access to the external address space as shown in Table 5-8. Table 5-8. External Access Stretch Bit Definition 5.4 EXSTRx[2:0] Number of Stretch Cycles 000 1 001 2 010 3 011 4 100 5 101 6 110 7 111 8 Functional Description This section describes the functions of the external bus interface. The availability of external signals and functions in relation to the operating mode is initially summarized and described in more detail in separate sub-sections. 5.4.1 Operating Modes and External Bus Properties A summary of the external bus interface functions for each operating mode is shown in Table 5-9. Table 5-9. Summary of Functions Single-Chip Modes Properties (if Enabled) Expanded Modes Normal Single-Chip Special Single-Chip PRR access(1) 2 cycles read internal write internal 2 cycles read internal write internal Internal access visible externally — — External address access and unimplemented area access(2) — — Normal Expanded Emulation Single-Chip Emulation Expanded Special Test 2 cycles read external write int & ext 2 cycles read external write int & ext 2 cycles read internal write internal 1 cycle 1 cycle 1 cycle 1 cycle Max. of 2 to 9 programmed cycles or n cycles of ext. wait3 1 cycle Timing Properties 2 cycles read internal write internal — Max. of 2 to 9 programmed cycles or n cycles of ext. wait(3) MC9S12XE-Family Reference Manual , Rev. 1.21 248 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-9. Summary of Functions (continued) Single-Chip Modes Properties (if Enabled) Flash area address access(4) Expanded Modes Normal Single-Chip Special Single-Chip Normal Expanded Emulation Single-Chip Emulation Expanded Special Test — — — 1 cycle 1 cycle 1 cycle Signal Properties Bus signals — — ADDR[22:1] DATA[15:0] ADDR[22:20]/ ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ADDR[15:0]/ IVD[15:0] DATA[15:0] ADDR[22:20]/ ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ADDR[15:0]/ IVD[15:0] DATA[15:0] ADDR[22:0] DATA[15:0] Data select signals (if 16-bit data bus) — — UDS LDS ADDR0 LSTRB ADDR0 LSTRB ADDR0 LSTRB Data direction signals — — RE WE RW RW RW — CS0 CS1 CS2 CS3 — — EWAIT — Chip Selects — — CS0 CS1 CS2 CS3 External wait feature — — EWAIT Reduced input — — Refer to DATA[15:0] DATA[15:0] Refer to threshold enabled on Table 5-4 EWAIT EWAIT Table 5-4 1. Incl. S12X_EBI registers 2. Refer to S12X_MMC section. 3. If EWAIT enabled for at least one CSx line (refer to S12X_MMC section), the minimum number of external bus cycles is 3. 4. Available only if configured appropriately by ROMON and EROMON (refer to S12X_MMC section). 5.4.2 Internal Visibility Internal visibility allows the observation of the internal CPU address and data bus as well as the determination of the access source and the CPU pipe (queue) status through the external bus interface. Internal visibility is always enabled in emulation single chip mode and emulation expanded mode. Internal CPU accesses are made visible on the external bus interface except CPU execution of BDM firmware instructions. Internal reads are made visible on ADDRx/IVDx (address and read data multiplexed, see Table 5-12 to Table 5-14), internal writes on ADDRx and DATAx (see Table 5-15 to Table 5-17). RW and LSTRB show the type of access. External read data are also visible on IVDx. During ‘no access’ cycles RW is held in read position while LSTRB is undetermined. All accesses which make use of the external bus interface are considered external accesses. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 249 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.4.2.1 Access Source Signals (ACC) The access source can be determined from the external bus control signals ACC[2:0] as shown in Table 510. Table 5-10. Determining Access Source from Control Signals ACC[2:0] Access Description 000 Repetition of previous access cycle 001 CPU access 010 BDM external access 011 XGATE PRR access 100 No access(1) 101 CPU access error 110, 111 Reserved 1. Denotes also CPU accesses to BDM firmware and BDM registers (IQSTATx are ‘XXXX’ and RW = 1 in these cases) 5.4.2.2 Instruction Queue Status Signals (IQSTAT) The CPU instruction queue status (execution-start and data-movement information) is brought out as IQSTAT[3:0] signals. For decoding of the IQSTAT values, refer to the S12X_CPU section. 5.4.2.3 Internal Visibility Data (IVD) Depending on the access size and alignment, either a word of read data is made visible on the address lines or only the related data byte will be presented in the ECLK low phase. For details refer to Table 5-11. Invalid IVD are brought out in case of non-CPU read accesses. Table 5-11. IVD Read Data Output Access IVD[15:8] IVD[7:0] ivd(even) ivd(even+1) ivd(odd+1) ivd(odd) Byte read of data at an even address ivd(even) addr[7:0] (rep.) Byte read of data at an odd address addr[15:8] (rep.) ivd(odd) Word read of data at an even and even+1 address Word read of data at an odd and odd+1 internal RAM address (misaligned) 5.4.2.4 Emulation Modes Timing A bus access lasts 1 ECLK cycle. In case of a stretched external access (emulation expanded mode), up to an infinite amount of ECLK cycles may be added. ADDRx values will only be shown in ECLK high phases, while ACCx, IQSTATx, and IVDx values will only be presented in ECLK low phases. Based on this multiplex timing, ACCx are only shown in the current (first) access cycle. IQSTATx and (for read accesses) IVDx follow in the next cycle. If the access takes more than one bus cycle, ACCx display NULL (0x000) in the second and all following cycles of the access. IQSTATx display NULL (0x0000) from the third until one cycle after the access to indicate continuation. MC9S12XE-Family Reference Manual , Rev. 1.21 250 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) The resulting timing pattern of the external bus signals is outlined in the following tables for read, write and interleaved read/write accesses. Three examples represent different access lengths of 1, 2, and n–1 bus cycles. Non-shaded bold entries denote all values related to Access #0. The following terminology is used: ‘addr’ — value(ADDRx); small letters denote the logic values at the respective pins ‘x’ — Undefined output pin values ‘z’ — Tristate pins ‘?’ — Dependent on previous access (read or write); IVDx: ‘ivd’ or ‘x’; DATAx: ‘data’ or ‘z’ 5.4.2.4.1 Read Access Timing Table 5-12. Read Access (1 Cycle) Access #0 Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... 1 Access #1 2 high low addr 0 iqstat -1 high low addr 1 iqstat 0 ? ... DATA[15:0] (internal read) ... ? DATA[15:0] (external read) ... RW ... low ... acc 2 ... addr 2 iqstat 1 ... ivd 1 ... z ... ivd 0 z z ? z 1 1 ... high acc 1 acc 0 ADDR[15:0] / IVD[15:0] 3 z z data 0 z data 1 z ... 1 1 1 1 ... Table 5-13. Read Access (2 Cycles) Access #0 Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] 1 high 2 low high acc 0 addr 0 Access #1 3 low iqstat-1 addr 0 iqstat 0 ? ... high 000 addr 1 x ... low ... acc 1 ... 0000 ... ivd 0 ... DATA[15:0] (internal read) ... ? z z z z z ... DATA[15:0] (external read) ... ? z z z data 0 z ... RW ... 1 1 1 1 1 1 ... Table 5-14. Read Access (n–1 Cycles) Access #0 Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] ... DATA[15:0] (internal read) ... 1 high 2 low high acc 0 addr 0 iqstat-1 z 3 low high 000 addr 0 ? ? Access #1 iqstat 0 addr 0 x z z z n ... low ... 000 ... 0000 ... x ... z ... high addr 1 z ... low ... acc 1 ... 0000 ... ivd 0 ... z ... MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 251 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-14. Read Access (n–1 Cycles) DATA[15:0] (external read) ... ? z z z z z ... data 0 z ... RW ... 1 1 1 1 1 1 ... 1 1 ... 5.4.2.4.2 Write Access Timing Table 5-15. Write Access (1 Cycle) Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] Access #0 Access #1 Access #2 1 2 3 high low high low iqstat -1 addr 0 addr 1 iqstat 0 ? ... DATA[15:0] (write) ... ? RW ... 0 high acc 1 acc 0 addr 2 ... low ... acc 2 ... iqstat 1 ... x ... x data 0 data 1 0 1 1 data 2 ... 1 ... 1 Table 5-16. Write Access (2 Cycles) Access #0 Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] Access #1 1 2 high low 3 high low acc 0 addr 0 iqstat-1 iqstat 0 addr 0 ? ... DATA[15:0] (write) ... ? RW ... 0 high 000 addr 1 ... low ... acc 1 ... 0000 ... x ... x ... 1 ... x data 0 0 0 0 1 Table 5-17. Write Access (n–1 Cycles) Access #0 Bus cycle -> ... ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] 1 high low high iqstat-1 DATA[15:0] (write) ... ? ... 0 3 low high 000 addr 0 ? ... RW 5.4.2.4.3 2 acc 0 addr 0 Access #1 iqstat 0 addr 0 x n ... low ... 000 ... 0000 ... x ... 0 ... high addr 1 data 0 0 0 0 0 1 ... low ... acc 1 ... 0000 ... x ... x ... 1 ... Read-Write-Read Access Timing Table 5-18. Interleaved Read-Write-Read Accesses (1 Cycle) Bus cycle -> ... Access #0 Access #1 Access #2 1 2 3 ... MC9S12XE-Family Reference Manual , Rev. 1.21 252 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-18. Interleaved Read-Write-Read Accesses (1 Cycle) (continued) ECLK phase ... ADDR[22:20] / ACC[2:0] ... ADDR[19:16] / IQSTAT[3:0] ... ADDR[15:0] / IVD[15:0] ... DATA[15:0] (internal read) ... high low addr 0 iqstat -1 high low addr 1 iqstat 0 acc 0 ... acc 2 ... addr 2 iqstat 1 ... x ... z ... (write) data 1 z ... 0 1 ... ivd 0 z z DATA[15:0] (external read) ... ? z data 0 RW ... 1 1 0 5.4.3 low acc 1 ? ? high (write) data 1 1 Accesses to Port Replacement Registers All read and write accesses to PRR addresses take two bus clock cycles independent of the operating mode. If writing to these addresses in emulation modes, the access is directed to both, the internal register and the external resource while reads will be treated external. The XEBI control registers also belong to this category. 5.4.4 Stretched External Bus Accesses In order to allow fast internal bus cycles to coexist in a system with slower external resources, the XEBI supports stretched external bus accesses (wait states) for each external address range related to one of the 4 chip select lines individually. This feature is available in normal expanded mode and emulation expanded mode for accesses to all external addresses except emulation memory and PRR. In these cases the fixed access times are 1 or 2 cycles, respectively. Stretched accesses are controlled by: 1. EXSTR1[2:0] and EXSTR0[2:0] bits in the EBICTL1 register configuring a fixed amount of stretch cycles individually for each CSx line in MMCCTL0 2. Activation of the external wait feature for each CSx line MMCCTL0 register 3. Assertion of the external EWAIT signal when at least one CSx line is configured for EWAIT The EXSTRx[2:0] control bits can be programmed for generation of a fixed number of 1 to 8 stretch cycles. If the external wait feature is enabled, the minimum number of additional stretch cycles is 2. An arbitrary amount of stretch cycles can be added using the EWAIT input. EWAIT needs to be asserted at least for a minimal specified time window within an external access cycle for the internal logic to detect it and add a cycle (refer to electrical characteristics). Holding it for additional cycles will cause the external bus access to be stretched accordingly. Write accesses are stretched by holding the initiator in its current state for additional cycles as programmed and controlled by external wait after the data have been driven out on the external bus. This results in an extension of time the bus signals and the related control signals are valid externally. Read data are not captured by the system in normal expanded mode until the specified setup time before the RE rising edge. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 253 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Read data are not captured in emulation expanded mode until the specified setup time before the falling edge of ECLK. In emulation expanded mode, accesses to the internal flash or the emulation memory (determined by EROMON and ROMON bits; see S12X_MMC section for details) always take 1 cycle and stretching is not supported. In case the internal flash is taken out of the map in user applications, accesses are stretched as programmed and controlled by external wait. 5.4.5 Data Select and Data Direction Signals The S12X_EBI supports byte and word accesses at any valid external address. The big endian system of the MCU is extended to the external bus; however, word accesses are restricted to even aligned addresses. The only exception is the visibility of misaligned word accesses to addresses in the internal RAM as this module exclusively supports these kind of accesses in a single cycle. With the above restriction, a fixed relationship is implied between the address parity and the dedicated bus halves where the data are accessed: DATA[15:8] is related to even addresses and DATA[7:0] is related to odd addresses. In expanded modes the data access type is externally determined by a set of control signals, i.e., data select and data direction signals, as described below. The data select signals are not available if using the external bus interface with an 8-bit data bus. 5.4.5.1 Normal Expanded Mode In normal expanded mode, the external signals RE, WE, UDS, LDS indicate the access type (read/write), data size and alignment of an external bus access (Table 5-19). Table 5-19. Access in Normal Expanded Mode DATA[15:8] Access DATA[7:0] RE WE UDS LDS I/O data(addr) I/O data(addr) Word write of data on DATA[15:0] at an even and even+1 address 1 0 0 0 Out data(even) Out Byte write of data on DATA[7:0] at an odd address 1 0 1 0 Byte write of data on DATA[15:8] at an even address 1 0 0 1 In x Word read of data on DATA[15:0] at an even and even+1 address 0 1 0 0 In data(even) In data(odd) Byte read of data on DATA[7:0] at an odd address 0 1 1 0 In x In data(odd) Byte read of data on DATA[15:8] at an even address 0 1 0 1 In data(even) In x In x Out data(even) Out data(odd) data(odd) Indicates No Access 1 1 1 1 In x In x Unimplemented 1 1 1 0 In x In x 1 1 0 1 In x In x 5.4.5.2 Emulation Modes and Special Test Mode In emulation modes and special test mode, the external signals LSTRB, RW, and ADDR0 indicate the access type (read/write), data size and alignment of an external bus access. Misaligned accesses to the MC9S12XE-Family Reference Manual , Rev. 1.21 254 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) internal RAM and misaligned XGATE PRR accesses in emulation modes are the only type of access that are able to produce LSTRB = ADDR0 = 1. This is summarized in Table 5-20. Table 5-20. Access in Emulation Modes and Special Test Mode DATA[15:8] Access DATA[7:0] RW LSTRB ADDR0 I/O data(addr) I/O data(addr) Word write of data on DATA[15:0] at an even and even+1 address 0 0 0 Out data(even) Out data(odd) Byte write of data on DATA[7:0] at an odd address 0 0 1 In x Out data(odd) Byte write of data on DATA[15:8] at an even address 0 1 0 Out data(odd) In x Word write at an odd and odd+1 internal RAM address (misaligned — only in emulation modes) 0 1 1 Out data(odd+1) Out Word read of data on DATA[15:0] at an even and even+1 address 1 0 0 In Byte read of data on DATA[7:0] at an odd address 1 0 1 Byte read of data on DATA[15:8] at an even address 1 1 0 Word read at an odd and odd+1 internal RAM address (misaligned - only in emulation modes) 1 1 1 data(odd) data(even) In data(even+1) In x In data(odd) In data(even) In x In data(odd+1) In data(odd) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 255 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.4.6 Low-Power Options The XEBI does not support any user-controlled options for reducing power consumption. 5.4.6.1 Run Mode The XEBI does not support any options for reducing power in run mode. Power consumption is reduced in single-chip modes due to the absence of the external bus interface. Operation in expanded modes results in a higher power consumption, however any unnecessary toggling of external bus signals is reduced to the lowest indispensable activity by holding the previous states between external accesses. 5.4.6.2 Wait Mode The XEBI does not support any options for reducing power in wait mode. 5.4.6.3 Stop Mode The XEBI will cease to function in stop mode. 5.5 Initialization/Application Information This section describes the external bus interface usage and timing. Typical customer operating modes are normal expanded mode and emulation modes, specifically to be used in emulator applications. Taking the availability of the external wait feature into account the use cases are divided into four scenarios: • Normal expanded mode — External wait feature disabled – External wait feature enabled • Emulation modes – Emulation single-chip mode (without wait states) – Emulation expanded mode (with optional access stretching) Normal single-chip mode and special single-chip mode do not have an external bus. Special test mode is used for factory test only. Therefore, these modes are omitted here. All timing diagrams referred to throughout this section are available in the Electrical Characteristics appendix of the SoC section. 5.5.1 Normal Expanded Mode This mode allows interfacing to external memories or peripherals which are available in the commercial market. In these applications the normal bus operation requires a minimum of 1 cycle stretch for each external access. MC9S12XE-Family Reference Manual , Rev. 1.21 256 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.5.1.1 Example 1a: External Wait Feature Disabled The first example of bus timing of an external read and write access with the external wait feature disabled is shown in • Figure ‘Example 1a: Normal Expanded Mode — Read Followed by Write’ The associated supply voltage dependent timing are numbers given in • Table ‘Example 1a: Normal Expanded Mode Timing VDD5 = 5.0 V (EWAIT disabled)’ • Table ‘Example 1a: Normal Expanded Mode Timing VDD5 = 3.0 V (EWAIT disabled)’ Systems designed this way rely on the internal programmable access stretching. These systems have predictable external memory access times. The additional stretch time can be programmed up to 8 cycles to provide longer access times. 5.5.1.2 Example 1b: External Wait Feature Enabled The external wait operation is shown in this example. It can be used to exceed the amount of stretch cycles over the programmed number in EXSTR[2:0]. The feature must be enabled by configuring at least one CSx line for EWAIT. If the EWAIT signal is not asserted, the number of stretch cycles is forced to a minimum of 2 cycles. If EWAIT is asserted within the predefined time window during the access it will be strobed active and another stretch cycle is added. If strobed inactive, the next cycle will be the last cycle before the access is finished. EWAIT can be held asserted as long as desired to stretch the access. An access with 1 cycle stretch by EWAIT assertion is shown in • Figure ‘Example 1b: Normal Expanded Mode — Stretched Read Access’ • Figure ‘Example 1b: Normal Expanded Mode — Stretched Write Access’ The associated timing numbers for both operations are given in • Table ‘Example 1b: Normal Expanded Mode Timing VDD5 = 5.0 V (EWAIT enabled)’ • Table ‘Example 1b: Normal Expanded Mode Timing VDD5 = 3.0 V (EWAIT enabled)’ It is recommended to use the free-running clock (ECLK) at the fastest rate (bus clock rate) to synchronize the EWAIT input signal. 5.5.2 Emulation Modes In emulation mode applications, the development systems use a custom PRU device to rebuild the singlechip or expanded bus functions which are lost due to the use of the external bus with an emulator. Accesses to a set of registers controlling the related ports in normal modes (refer to SoC section) are directed to the external bus in emulation modes which are substituted by PRR as part of the PRU. Accesses to these registers take a constant time of 2 cycles. Depending on the setting of ROMON and EROMON (refer to S12X_MMC section), the program code can be executed from internal memory or an optional external emulation memory (EMULMEM). No wait MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 257 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) state operation (stretching) of the external bus access is done in emulation modes when accessing internal memory or emulation memory addresses. In both modes observation of the internal operation is supported through the external bus (internal visibility). 5.5.2.1 Example 2a: Emulation Single-Chip Mode This mode is used for emulation systems in which the target application is operating in normal single-chip mode. Figure 5-5 shows the PRU connection with the available external bus signals in an emulator application. S12X_EBI Emulator ADDR[22:0]/IVD[15:0] DATA[15:0] EMULMEM PRU PRR Ports LSTRB RW ADDR[22:20]/ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ECLK ECLKX2 Figure 5-5. Application in Emulation Single-Chip Mode The timing diagram for this operation is shown in: • Figure ‘Example 2a: Emulation Single-Chip Mode — Read Followed by Write’ The associated timing numbers are given in: • Table ‘Example 2a: Emulation Single-Chip Mode Timing (EWAIT disabled)’ Timing considerations: • Signals muxed with address lines ADDRx, i.e., IVDx, IQSTATx and ACCx, have the same timing. • LSTRB has the same timing as RW. MC9S12XE-Family Reference Manual , Rev. 1.21 258 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) • • ECLKX2 rising edges have the same timing as ECLK edges. The timing for accesses to PRU registers, which take 2 cycles to complete, is the same as the timing for an external non-PRR access with 1 cycle of stretch as shown in example 2b. 5.5.2.2 Example 2b: Emulation Expanded Mode This mode is used for emulation systems in which the target application is operating in normal expanded mode. If the external bus is used with a PRU, the external device rebuilds the data select and data direction signals UDS, LDS, RE, and WE from the ADDR0, LSTRB, and RW signals. Figure 5-6 shows the PRU connection with the available external bus signals in an emulator application. S12X_EBI Emulator ADDR[22:0]/IVD[15:0] DATA[15:0] EMULMEM PRU PRR LSTRB RW Ports UDS LDS RE WE ADDR[22:20]/ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] CS[3:0] EWAIT ECLK ECLKX2 Figure 5-6. Application in Emulation Expanded Mode The timings of accesses with 1 stretch cycle are shown in • Figure ‘Example 2b: Emulation Expanded Mode — Read with 1 Stretch Cycle’ • Figure ‘Example 2b: Emulation Expanded Mode — Write with 1 Stretch Cycle’ The associated timing numbers are given in MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 259 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) • Table ‘Example 2b: Emulation Expanded Mode Timing VDD5 = 5.0 V (EWAIT disabled)’ (this also includes examples for alternative settings of 2 and 3 additional stretch cycles) Timing considerations: • If no stretch cycle is added, the timing is the same as in Emulation Single-Chip Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 260 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-1. Revision History Revision Number Revision Date Sections Affected V02.00 01 Jul 2005 6.1.2/6-262 V02.04 11 Jan 2007 6.3.2.2/6-267 6.3.2.4/6-268 V02.05 20 Mar 2007 6.4.6/6-274 - Fixed priority definition for software exceptions. V02.06 07 Jan 2008 6.1.2/6-262 - Added clarification of “Wake-up from STOP or WAIT by XIRQ with X bit set” feature. 6.1 Description of Changes Initial V2 release, added new features: - XGATE threads can be interrupted. - SYS instruction vector. - Access violation interrupt vectors. - Added Notes for devices without XGATE module. Introduction The XINT module decodes the priority of all system exception requests and provides the applicable vector for processing the exception to either the CPU or the XGATE module. The XINT module supports: • I bit and X bit maskable interrupt requests • One non-maskable unimplemented op-code trap • One non-maskable software interrupt (SWI) or background debug mode request • One non-maskable system call interrupt (SYS) • Three non-maskable access violation interrupt • One spurious interrupt vector request • Three system reset vector requests Each of the I bit maskable interrupt requests can be assigned to one of seven priority levels supporting a flexible priority scheme. For interrupt requests that are configured to be handled by the CPU, the priority scheme can be used to implement nested interrupt capability where interrupts from a lower level are automatically blocked if a higher level interrupt is being processed. Interrupt requests configured to be handled by the XGATE module can be nested one level deep. NOTE The HPRIO register and functionality of the original S12 interrupt module is no longer supported, since it is superseded by the 7-level interrupt request priority scheme. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 261 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.1 Glossary The following terms and abbreviations are used in the document. Table 6-2. Terminology Term CCR Condition Code Register (in the S12X CPU) DMA Direct Memory Access INT Interrupt IPL Interrupt Processing Level ISR Interrupt Service Routine MCU XGATE IRQ XIRQ 6.1.2 • • • • • • • • • • • • • • Meaning Micro-Controller Unit refers to the XGATE co-processor; XGATE is an optional feature refers to the interrupt request associated with the IRQ pin refers to the interrupt request associated with the XIRQ pin Features Interrupt vector base register (IVBR) One spurious interrupt vector (at address vector base1 + 0x0010). One non-maskable system call interrupt vector request (at address vector base + 0x0012). Three non-maskable access violation interrupt vector requests (at address vector base + 0x0014− 0x0018). 2–109 I bit maskable interrupt vector requests (at addresses vector base + 0x001A–0x00F2). Each I bit maskable interrupt request has a configurable priority level and can be configured to be handled by either the CPU or the XGATE module2. I bit maskable interrupts can be nested, depending on their priority levels. One X bit maskable interrupt vector request (at address vector base + 0x00F4). One non-maskable software interrupt request (SWI) or background debug mode vector request (at address vector base + 0x00F6). One non-maskable unimplemented op-code trap (TRAP) vector (at address vector base + 0x00F8). Three system reset vectors (at addresses 0xFFFA–0xFFFE). Determines the highest priority XGATE and interrupt vector requests, drives the vector to the XGATE module or to the bus on CPU request, respectively. Wakes up the system from stop or wait mode when an appropriate interrupt request occurs or whenever XIRQ is asserted, even if X interrupt is masked. XGATE can wake up and execute code, even with the CPU remaining in stop or wait mode. 1. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used as upper byte) and 0x00 (used as lower byte). 2. The IRQ interrupt can only be handled by the CPU MC9S12XE-Family Reference Manual , Rev. 1.21 262 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.3 • • • • Modes of Operation Run mode This is the basic mode of operation. Wait mode In wait mode, the XINT module is frozen. It is however capable of either waking up the CPU if an interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to Section 6.5.3, “Wake Up from Stop or Wait Mode” for details. Stop Mode In stop mode, the XINT module is frozen. It is however capable of either waking up the CPU if an interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to Section 6.5.3, “Wake Up from Stop or Wait Mode” for details. Freeze mode (BDM active) In freeze mode (BDM active), the interrupt vector base register is overridden internally. Please refer to Section 6.3.2.1, “Interrupt Vector Base Register (IVBR)” for details. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 263 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.4 Block Diagram Figure 6-1 shows a block diagram of the XINT module. Peripheral Interrupt Requests Wake Up CPU Non I Bit Maskable Channels Priority Decoder Interrupt Requests PRIOLVL2 PRIOLVL1 PRIOLVL0 RQST IVBR New IPL To CPU Vector Address IRQ Channel Current IPL One Set Per Channel (Up to 108 Channels) INT_XGPRIO XGATE Requests Priority Decoder Wake up XGATE Vector ID XGATE Interrupts To XGATE Module RQST XGATE Request Route, PRIOLVLn Priority Level = bits from the channel configuration in the associated configuration register INT_XGPRIO = XGATE Interrupt Priority IVBR = Interrupt Vector Base IPL = Interrupt Processing Level Figure 6-1. XINT Block Diagram 6.2 External Signal Description The XINT module has no external signals. MC9S12XE-Family Reference Manual , Rev. 1.21 264 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the XINT module. 6.3.1 Module Memory Map Table 6-3 gives an overview over all XINT module registers. Table 6-3. XINT Memory Map Address Use Access 0x0120 RESERVED — 0x0121 Interrupt Vector Base Register (IVBR) R/W 0x0122–0x0125 RESERVED — 0x0126 XGATE Interrupt Priority Configuration Register (INT_XGPRIO) R/W 0x0127 Interrupt Request Configuration Address Register (INT_CFADDR) R/W 0x0128 Interrupt Request Configuration Data Register 0 (INT_CFDATA0) R/W 0x0129 Interrupt Request Configuration Data Register 1 (INT_CFDATA1) R/W 0x012A Interrupt Request Configuration Data Register 2 (INT_CFDATA2 R/W 0x012B Interrupt Request Configuration Data Register 3 (INT_CFDATA3) R/W 0x012C Interrupt Request Configuration Data Register 4 (INT_CFDATA4) R/W 0x012D Interrupt Request Configuration Data Register 5 (INT_CFDATA5) R/W 0x012E Interrupt Request Configuration Data Register 6 (INT_CFDATA6) R/W 0x012F Interrupt Request Configuration Data Register 7 (INT_CFDATA7) R/W MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 265 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.3.2 Register Descriptions This section describes in address order all the XINT module registers and their individual bits. Address Register Name 0x0121 IVBR Bit 7 6 5 R INT_XGPRIO R 3 2 0 0 0 0 0 INT_CFADDR R R W 0x0129 INT_CFDATA1 R W 0x012A INT_CFDATA2 R W 0x012B INT_CFDATA3 R W 0x012C INT_CFDATA4 R W 0x012D INT_CFDATA5 R W 0x012E INT_CFDATA6 R W 0x012F INT_CFDATA7 R W 0 INT_CFADDR[7:4] W 0x0128 INT_CFDATA0 Bit 0 XILVL[2:0] W 0x0127 1 IVB_ADDR[7:0]7 W 0x0126 4 RQST RQST RQST RQST RQST RQST RQST RQST 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] = Unimplemented or Reserved Figure 6-2. XINT Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 266 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.3.2.1 Interrupt Vector Base Register (IVBR) Address: 0x0121 7 6 5 R 3 2 1 0 1 1 1 IVB_ADDR[7:0] W Reset 4 1 1 1 1 1 Figure 6-3. Interrupt Vector Base Register (IVBR) Read: Anytime Write: Anytime Table 6-4. IVBR Field Descriptions Field Description 7–0 Interrupt Vector Base Address Bits — These bits represent the upper byte of all vector addresses. Out of IVB_ADDR[7:0] reset these bits are set to 0xFF (i.e., vectors are located at 0xFF10–0xFFFE) to ensure compatibility to previous S12 microcontrollers. Note: A system reset will initialize the interrupt vector base register with “0xFF” before it is used to determine the reset vector address. Therefore, changing the IVBR has no effect on the location of the three reset vectors (0xFFFA–0xFFFE). Note: If the BDM is active (i.e., the CPU is in the process of executing BDM firmware code), the contents of IVBR are ignored and the upper byte of the vector address is fixed as “0xFF”. 6.3.2.2 XGATE Interrupt Priority Configuration Register (INT_XGPRIO) Address: 0x0126 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 2 0 0 XILVL[2:0] W Reset 1 0 0 1 = Unimplemented or Reserved Figure 6-4. XGATE Interrupt Priority Configuration Register (INT_XGPRIO) Read: Anytime Write: Anytime Table 6-5. INT_XGPRIO Field Descriptions Field Description 2–0 XILVL[2:0] XGATE Interrupt Priority Level — The XILVL[2:0] bits configure the shared interrupt level of the XGATE interrupts coming from the XGATE module. Out of reset the priority is set to the lowest active level (“1”). Note: If the XGATE module is not available on the device, write accesses to this register are ignored and read accesses to this register will return all 0. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 267 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-6. XGATE Interrupt Priority Levels Priority low high 6.3.2.3 XILVL2 XILVL1 XILVL0 Meaning 0 0 0 Interrupt request is disabled 0 0 1 Priority level 1 0 1 0 Priority level 2 0 1 1 Priority level 3 1 0 0 Priority level 4 1 0 1 Priority level 5 1 1 0 Priority level 6 1 1 1 Priority level 7 Interrupt Request Configuration Address Register (INT_CFADDR) Address: 0x0127 7 R 5 4 INT_CFADDR[7:4] W Reset 6 0 0 0 1 3 2 1 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 6-5. Interrupt Configuration Address Register (INT_CFADDR) Read: Anytime Write: Anytime Table 6-7. INT_CFADDR Field Descriptions Field Description 7–4 Interrupt Request Configuration Data Register Select Bits — These bits determine which of the 128 INT_CFADDR[7:4] configuration data registers are accessible in the 8 register window at INT_CFDATA0–7. The hexadecimal value written to this register corresponds to the upper nibble of the lower byte of the address of the interrupt vector, i.e., writing 0xE0 to this register selects the configuration data register block for the 8 interrupt vector requests starting with vector at address (vector base + 0x00E0) to be accessible as INT_CFDATA0–7. Note: Writing all 0s selects non-existing configuration registers. In this case write accesses to INT_CFDATA0–7 will be ignored and read accesses will return all 0. 6.3.2.4 Interrupt Request Configuration Data Registers (INT_CFDATA0–7) The eight register window visible at addresses INT_CFDATA0–7 contains the configuration data for the block of eight interrupt requests (out of 128) selected by the interrupt configuration address register (INT_CFADDR) in ascending order. INT_CFDATA0 represents the interrupt configuration data register of the vector with the lowest address in this block, while INT_CFDATA7 represents the interrupt configuration data register of the vector with the highest address, respectively. MC9S12XE-Family Reference Manual , Rev. 1.21 268 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Address: 0x0128 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-6. Interrupt Request Configuration Data Register 0 (INT_CFDATA0) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x0129 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-7. Interrupt Request Configuration Data Register 1 (INT_CFDATA1) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012A 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-8. Interrupt Request Configuration Data Register 2 (INT_CFDATA2) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012B 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-9. Interrupt Request Configuration Data Register 3 (INT_CFDATA3) 1. Please refer to the notes following the PRIOLVL[2:0] description below. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 269 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Address: 0x012C 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-10. Interrupt Request Configuration Data Register 4 (INT_CFDATA4) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012D 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-11. Interrupt Request Configuration Data Register 5 (INT_CFDATA5) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012E 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-12. Interrupt Request Configuration Data Register 6 (INT_CFDATA6) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012F 7 R W Reset RQST 0 6 5 4 3 0 0 0 0 0 0 0 0 2 1 0 PRIOLVL[2:0] 0 0 1(1) = Unimplemented or Reserved Figure 6-13. Interrupt Request Configuration Data Register 7 (INT_CFDATA7) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 270 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-8. INT_CFDATA0–7 Field Descriptions Field Description 7 RQST XGATE Request Enable — This bit determines if the associated interrupt request is handled by the CPU or by the XGATE module. 0 Interrupt request is handled by the CPU 1 Interrupt request is handled by the XGATE module Note: The IRQ interrupt cannot be handled by the XGATE module. For this reason, the configuration register for vector (vector base + 0x00F2) = IRQ vector address) does not contain a RQST bit. Writing a 1 to the location of the RQST bit in this register will be ignored and a read access will return 0. Note: If the XGATE module is not available on the device, writing a 1 to the location of the RQST bit in this register will be ignored and a read access will return 0. 2–0 Interrupt Request Priority Level Bits — The PRIOLVL[2:0] bits configure the interrupt request priority level of PRIOLVL[2:0] the associated interrupt request. Out of reset all interrupt requests are enabled at the lowest active level (“1”) to provide backwards compatibility with previous S12 interrupt controllers. Please also refer to Table 6-9 for available interrupt request priority levels. Note: Write accesses to configuration data registers of unused interrupt channels will be ignored and read accesses will return all 0. For information about what interrupt channels are used in a specific MCU, please refer to the Device Reference Manual of that MCU. Note: When vectors (vector base + 0x00F0–0x00FE) are selected by writing 0xF0 to INT_CFADDR, writes to INT_CFDATA2–7 (0x00F4–0x00FE) will be ignored and read accesses will return all 0s. The corresponding vectors do not have configuration data registers associated with them. Note: When vectors (vector base + 0x0010–0x001E) are selected by writing 0x10 to INT_CFADDR, writes to INT_CFDATA1–INT_CFDATA4 (0x0012–0x0018) will be ignored and read accesses will return all 0s. The corresponding vectors do not have configuration data registers associated with them. Note: Write accesses to the configuration register for the spurious interrupt vector request (vector base + 0x0010) will be ignored and read accesses will return 0x07 (request is handled by the CPU, PRIOLVL = 7). Table 6-9. Interrupt Priority Levels Priority low high 6.4 PRIOLVL2 PRIOLVL1 PRIOLVL0 Meaning 0 0 0 Interrupt request is disabled 0 0 1 Priority level 1 0 1 0 Priority level 2 0 1 1 Priority level 3 1 0 0 Priority level 4 1 0 1 Priority level 5 1 1 0 Priority level 6 1 1 1 Priority level 7 Functional Description The XINT module processes all exception requests to be serviced by the CPU module. These exceptions include interrupt vector requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the subsections below. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 271 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.4.1 S12X Exception Requests The CPU handles both reset requests and interrupt requests. The XINT module contains registers to configure the priority level of each I bit maskable interrupt request which can be used to implement an interrupt priority scheme. This also includes the possibility to nest interrupt requests. A priority decoder is used to evaluate the priority of a pending interrupt request. 6.4.2 Interrupt Prioritization After system reset all interrupt requests with a vector address lower than or equal to (vector base + 0x00F2) are enabled, are set up to be handled by the CPU and have a pre-configured priority level of 1. Exceptions to this rule are the non-maskable interrupt requests and the spurious interrupt vector request at (vector base + 0x0010) which cannot be disabled, are always handled by the CPU and have a fixed priority levels. A priority level of 0 effectively disables the associated I bit maskable interrupt request. If more than one interrupt request is configured to the same interrupt priority level the interrupt request with the higher vector address wins the prioritization. The following conditions must be met for an I bit maskable interrupt request to be processed. 1. The local interrupt enabled bit in the peripheral module must be set. 2. The setup in the configuration register associated with the interrupt request channel must meet the following conditions: a) The XGATE request enable bit must be 0 to have the CPU handle the interrupt request. b) The priority level must be set to non zero. c) The priority level must be greater than the current interrupt processing level in the condition code register (CCR) of the CPU (PRIOLVL[2:0] > IPL[2:0]). 3. The I bit in the condition code register (CCR) of the CPU must be cleared. 4. There is no access violation interrupt request pending. 5. There is no SYS, SWI, BDM, TRAP, or XIRQ request pending. NOTE All non I bit maskable interrupt requests always have higher priority than I bit maskable interrupt requests. If an I bit maskable interrupt request is interrupted by a non I bit maskable interrupt request, the currently active interrupt processing level (IPL) remains unaffected. It is possible to nest non I bit maskable interrupt requests, e.g., by nesting SWI or TRAP calls. 6.4.2.1 Interrupt Priority Stack The current interrupt processing level (IPL) is stored in the condition code register (CCR) of the CPU. This way the current IPL is automatically pushed to the stack by the standard interrupt stacking procedure. The new IPL is copied to the CCR from the priority level of the highest priority active interrupt request channel which is configured to be handled by the CPU. The copying takes place when the interrupt vector is fetched. The previous IPL is automatically restored by executing the RTI instruction. MC9S12XE-Family Reference Manual , Rev. 1.21 272 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.4.3 XGATE Requests If the XGATE module is implemented on the device, the XINT module is also used to process all exception requests to be serviced by the XGATE module. The overall priority level of those exceptions is discussed in the subsections below. 6.4.3.1 XGATE Request Prioritization An interrupt request channel is configured to be handled by the XGATE module, if the RQST bit of the associated configuration register is set to 1 (please refer to Section 6.3.2.4, “Interrupt Request Configuration Data Registers (INT_CFDATA0–7)”). The priority level configuration (PRIOLVL) for this channel becomes the XGATE priority which will be used to determine the highest priority XGATE request to be serviced next by the XGATE module. Additionally, XGATE interrupts may be raised by the XGATE module by setting one or more of the XGATE channel interrupt flags (by using the SIF instruction). This will result in an CPU interrupt with vector address vector base + (2 * channel ID number), where the channel ID number corresponds to the highest set channel interrupt flag, if the XGIE and channel RQST bits are set. The shared interrupt priority for the XGATE interrupt requests is taken from the XGATE interrupt priority configuration register (please refer to Section 6.3.2.2, “XGATE Interrupt Priority Configuration Register (INT_XGPRIO)”). If more than one XGATE interrupt request channel becomes active at the same time, the channel with the highest vector address wins the prioritization. 6.4.4 Priority Decoders The XINT module contains priority decoders to determine the priority for all interrupt requests pending for the respective target. There are two priority decoders, one for each interrupt request target, CPU or XGATE. The function of both priority decoders is basically the same with one exception: the priority decoder for the XGATE module does not take the current XGATE thread processing level into account. Instead, XGATE requests are handed to the XGATE module including a 1-bit priority identifier. The XGATE module uses this additional information to decide if the new request can interrupt a currently running thread. The 1-bit priority identifier corresponds to the most significant bit of the priority level configuration of the requesting channel. This means that XGATE requests with priority levels 4, 5, 6 or 7 can interrupt running XGATE threads with priority levels 1, 2 and 3. A CPU interrupt vector is not supplied until the CPU requests it. Therefore, it is possible that a higher priority interrupt request could override the original exception which caused the CPU to request the vector. In this case, the CPU will receive the highest priority vector and the system will process this exception instead of the original request. If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive after the interrupt has been recognized, but prior to the vector request), the vector address supplied to the CPU will default to that of the spurious interrupt vector. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 273 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) NOTE Care must be taken to ensure that all exception requests remain active until the system begins execution of the applicable service routine; otherwise, the exception request may not get processed at all or the result may be a spurious interrupt request (vector at address (vector base + 0x0010)). 6.4.5 Reset Exception Requests The XINT module supports three system reset exception request types (for details please refer to the Clock and Reset Generator module (CRG)): 1. Pin reset, power-on reset, low-voltage reset, or illegal address reset 2. Clock monitor reset request 3. COP watchdog reset request 6.4.6 Exception Priority The priority (from highest to lowest) and address of all exception vectors issued by the XINT module upon request by the CPU is shown in Table 6-10. Generally, all non-maskable interrupts have higher priorities than maskable interrupts. Please note that between the three software interrupts (Unimplemented op-code trap request, SWI/BGND request, SYS request) there is no real priority defined because they cannot occur simultaneously (the S12XCPU executes one instruction at a time). Table 6-10. Exception Vector Map and Priority Vector Address(1) Source 0xFFFE Pin reset, power-on reset, low-voltage reset, illegal address reset 0xFFFC Clock monitor reset 0xFFFA COP watchdog reset (Vector base + 0x00F8) Unimplemented op-code trap (Vector base + 0x00F6) Software interrupt instruction (SWI) or BDM vector request (Vector base + 0x0012) System call interrupt instruction (SYS) (Vector base + 0x0018) (reserved for future use) (Vector base + 0x0016) XGATE Access violation interrupt request(2) (Vector base + 0x0014) CPU Access violation interrupt request(3) (Vector base + 0x00F4) XIRQ interrupt request (Vector base + 0x00F2) IRQ interrupt request (Vector base + 0x00F0–0x001A) Device specific I bit maskable interrupt sources (priority determined by the associated configuration registers, in descending order) (Vector base + 0x0010) Spurious interrupt 1. 16 bits vector address based 2. only implemented if device features both a Memory Protection Unit (MPU) and an XGATE co-processor 3. only implemented if device features a Memory Protection Unit (MPU) MC9S12XE-Family Reference Manual , Rev. 1.21 274 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.5 6.5.1 Initialization/Application Information Initialization After system reset, software should: • Initialize the interrupt vector base register if the interrupt vector table is not located at the default location (0xFF10–0xFFF9). • Initialize the interrupt processing level configuration data registers (INT_CFADDR, INT_CFDATA0–7) for all interrupt vector requests with the desired priority levels and the request target (CPU or XGATE module). It might be a good idea to disable unused interrupt requests. • If the XGATE module is used, setup the XGATE interrupt priority register (INT_XGPRIO) and configure the XGATE module (please refer the XGATE Block Guide for details). • Enable I maskable interrupts by clearing the I bit in the CCR. • Enable the X maskable interrupt by clearing the X bit in the CCR (if required). 6.5.2 Interrupt Nesting The interrupt request priority level scheme makes it possible to implement priority based interrupt request nesting for the I bit maskable interrupt requests handled by the CPU. • I bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority, so that there can be up to seven nested I bit maskable interrupt requests at a time (refer to Figure 614 for an example using up to three nested interrupt requests). I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the I bit in the CCR (CLI). After clearing the I bit, I bit maskable interrupt requests with higher priority can interrupt the current ISR. An ISR of an interruptible I bit maskable interrupt request could basically look like this: • Service interrupt, e.g., clear interrupt flags, copy data, etc. • Clear I bit in the CCR by executing the instruction CLI (thus allowing interrupt requests with higher priority) • Process data • Return from interrupt by executing the instruction RTI MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 275 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 0 Stacked IPL IPL in CCR 0 0 4 0 0 0 4 7 4 3 1 0 7 6 RTI L7 5 4 RTI Processing Levels 3 L3 (Pending) 2 L4 RTI 1 L1 (Pending) 0 RTI Reset Figure 6-14. Interrupt Processing Example 6.5.3 6.5.3.1 Wake Up from Stop or Wait Mode CPU Wake Up from Stop or Wait Mode Every I bit maskable interrupt request which is configured to be handled by the CPU is capable of waking the MCU from stop or wait mode. To determine whether an I bit maskable interrupts is qualified to wake up the CPU or not, the same settings as in normal run mode are applied during stop or wait mode: • If the I bit in the CCR is set, all I bit maskable interrupts are masked from waking up the MCU. • An I bit maskable interrupt is ignored if it is configured to a priority level below or equal to the current IPL in CCR. • I bit maskable interrupt requests which are configured to be handled by the XGATE module are not capable of waking up the CPU. The X bit maskable interrupt request can wake up the MCU from stop or wait mode at anytime, even if the X bit in CCR is set. If the X bit maskable interrupt request is used to wake-up the MCU with the X bit in the CCR set, the associated ISR is not called. The CPU then resumes program execution with the instruction following the WAI or STOP instruction. This features works following the same rules like any interrupt request, i.e. care must be taken that the X interrupt request used for wake-up remains active at least until the system begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not occur. 6.5.3.2 XGATE Wake Up from Stop or Wait Mode Interrupt request channels which are configured to be handled by the XGATE module are capable of waking up the XGATE module. Interrupt request channels handled by the XGATE module do not affect the state of the CPU. MC9S12XE-Family Reference Manual , Rev. 1.21 276 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-1. Revision History Revision Number Revision Date V02.00 07 Mar 2006 - First version of S12XBDMV2 V02.01 14 May 2008 - Introduced standardized Revision History Table 7.1 Sections Affected Description of Changes Introduction This section describes the functionality of the background debug module (BDM) sub-block of the HCS12X core platform. The background debug module (BDM) sub-block is a single-wire, background debug system implemented in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD pin. The BDM has enhanced capability for maintaining synchronization between the target and host while allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate and a handshake signal to indicate when an operation is complete. The system is backwards compatible to the BDM of the S12 family with the following exceptions: • TAGGO command no longer supported by BDM • External instruction tagging feature now part of DBG module • BDM register map and register content extended/modified • Global page access functionality • Enabled but not active out of reset in emulation modes (if modes available) • CLKSW bit set out of reset in emulation modes (if modes available). • Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices is 0xC1) 7.1.1 Features The BDM includes these distinctive features: • Single-wire communication with host development system • Enhanced capability for allowing more flexibility in clock rates • SYNC command to determine communication rate • GO_UNTIL command • Hardware handshake protocol to increase the performance of the serial communication MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 277 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) • • • • • • • • • • • • Active out of reset in special single chip mode Nine hardware commands using free cycles, if available, for minimal CPU intervention Hardware commands not requiring active BDM 14 firmware commands execute from the standard BDM firmware lookup table Software control of BDM operation during wait mode Software selectable clocks Global page access functionality Enabled but not active out of reset in emulation modes (if modes available) CLKSW bit set out of reset in emulation modes (if modes available). When secured, hardware commands are allowed to access the register space in special single chip mode, if the non-volatile memory erase test fail. Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices is 0xC1) BDM hardware commands are operational until system stop mode is entered (all bus masters are in stop mode) 7.1.2 Modes of Operation BDM is available in all operating modes but must be enabled before firmware commands are executed. Some systems may have a control bit that allows suspending thefunction during background debug mode. 7.1.2.1 Regular Run Modes All of these operations refer to the part in run mode and not being secured. The BDM does not provide controls to conserve power during run mode. • Normal modes General operation of the BDM is available and operates the same in all normal modes. • Special single chip mode In special single chip mode, background operation is enabled and active out of reset. This allows programming a system with blank memory. • Emulation modes (if modes available) In emulation mode, background operation is enabled but not active out of reset. This allows debugging and programming a system in this mode more easily. 7.1.2.2 Secure Mode Operation If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode operation. Secure operation prevents BDM and CPU accesses to non-volatile memory (Flash and/or EEPROM) other than allowing erasure. For more information please see Section 7.4.1, “Security”. MC9S12XE-Family Reference Manual , Rev. 1.21 278 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.1.2.3 Low-Power Modes The BDM can be used until all bus masters (e.g., CPU or XGATE or others depending on which masters are available on the SOC) are in stop mode. When CPU is in a low power mode (wait or stop mode) all BDM firmware commands as well as the hardware BACKGROUND command can not be used respectively are ignored. In this case the CPU can not enter BDM active mode, and only hardware read and write commands are available. Also the CPU can not enter a low power mode during BDM active mode. If all bus masters are in stop mode, the BDM clocks are stopped as well. When BDM clocks are disabled and one of the bus masters exits from stop mode the BDM clocks will restart and BDM will have a soft reset (clearing the instruction register, any command in progress and disable the ACK function). The BDM is now ready to receive a new command. 7.1.3 Block Diagram A block diagram of the BDM is shown in Figure 7-1. Host System Serial Interface BKGD Data 16-Bit Shift Register Control Register Block Address TRACE BDMACT Instruction Code and Execution Bus Interface and Control Logic Data Control Clocks ENBDM SDV UNSEC CLKSW Standard BDM Firmware LOOKUP TABLE Secured BDM Firmware LOOKUP TABLE BDMSTS Register Figure 7-1. BDM Block Diagram 7.2 External Signal Description A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate with the BDM system. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the background debug mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 279 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3 Memory Map and Register Definition 7.3.1 Module Memory Map Table 7-2 shows the BDM memory map when BDM is active. Table 7-2. BDM Memory Map 7.3.2 Global Address Module Size (Bytes) 0x7FFF00–0x7FFF0B BDM registers 12 0x7FFF0C–0x7FFF0E BDM firmware ROM 3 0x7FFF0F Family ID (part of BDM firmware ROM) 1 0x7FFF10–0x7FFFFF BDM firmware ROM 240 Register Descriptions A summary of the registers associated with the BDM is shown in Figure 7-2. Registers are accessed by host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands. Global Address Register Name 0x7FFF00 Reserved R Bit 7 6 5 4 3 2 1 Bit 0 X X X X X X 0 0 BDMACT 0 SDV TRACE UNSEC 0 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 W 0x7FFF01 BDMSTS R W 0x7FFF02 Reserved R ENBDM CLKSW W 0x7FFF03 Reserved R W 0x7FFF04 Reserved R W 0x7FFF05 Reserved R W 0x7FFF06 BDMCCRL R W = Unimplemented, Reserved X = Indeterminate = Implemented (do not alter) 0 = Always read zero Figure 7-2. BDM Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 280 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Global Address Register Name 0x7FFF07 Bit 7 6 5 4 3 0 0 0 0 0 BGAE BGP6 BGP5 BGP4 0 0 0 0 0 0 0 BDMCCRH R 2 1 Bit 0 CCR10 CCR9 CCR8 BGP3 BGP2 BGP1 BGP0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W 0x7FFF08 BDMGPR R W 0x7FFF09 Reserved R W 0x7FFF0A Reserved R W 0x7FFF0B Reserved R W = Unimplemented, Reserved = Indeterminate X = Implemented (do not alter) = Always read zero 0 Figure 7-2. BDM Register Summary (continued) 7.3.2.1 BDM Status Register (BDMSTS) Register Global Address 0x7FFF01 7 R W ENBDM 6 5 4 3 BDMACT 0 SDV TRACE 1 0 0 0 2 1 0 UNSEC 0 0 0(3) 0 1(2) 0 0 0 0 0 CLKSW Reset Special Single-Chip Mode Emulation Modes 0(1) 1 0 0 0 0 0 0 0 0 (if modes available) All Other Modes 0 = Unimplemented, Reserved = Implemented (do not alter) 0 = Always read zero 1. ENBDM is read as 1 by a debugging environment in special single chip mode when the device is not secured or secured but fully erased (non-volatile memory). This is because the ENBDM bit is set by the standard firmware before a BDM command can be fully transmitted and executed. 2. CLKSW is read as 1 by a debugging environment in emulation modes when the device is not secured and read as 0 when secured if emulation modes available. 3. UNSEC is read as 1 by a debugging environment in special single chip mode when the device is secured and fully erased, else it is 0 and can only be read if not secure (see also bit description). Figure 7-3. BDM Status Register (BDMSTS) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 281 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured, but subject to the following: — ENBDM should only be set via a BDM hardware command if the BDM firmware commands are needed. (This does not apply in special single chip and emulation modes). — BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the standard BDM firmware lookup table upon exit from BDM active mode. — CLKSW can only be written via BDM hardware WRITE_BD commands. — All other bits, while writable via BDM hardware or standard BDM firmware write commands, should only be altered by the BDM hardware or standard firmware lookup table as part of BDM command execution. Table 7-3. BDMSTS Field Descriptions Field Description 7 ENBDM Enable BDM — This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM hardware commands are still allowed. 0 BDM disabled 1 BDM enabled Note: ENBDM is set by the firmware out of reset in special single chip mode. In emulation modes (if modes available) the ENBDM bit is set by BDM hardware out of reset. In special single chip mode with the device secured, this bit will not be set by the firmware until after the non-volatile memory erase verify tests are complete. In emulation modes (if modes available) with the device secured, the BDM operations are blocked. 6 BDMACT BDM Active Status — This bit becomes set upon entering BDM. The standard BDM firmware lookup table is then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from the map. 0 BDM not active 1 BDM active 4 SDV Shift Data Valid — This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as part of a firmware or hardware read command or after data has been received as part of a firmware or hardware write command. It is cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM firmware to control program flow execution. 0 Data phase of command not complete 1 Data phase of command is complete 3 TRACE TRACE1 BDM Firmware Command is Being Executed — This bit gets set when a BDM TRACE1 firmware command is first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands: GO or GO_UNTIL. 0 TRACE1 command is not being executed 1 TRACE1 command is being executed MC9S12XE-Family Reference Manual , Rev. 1.21 282 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-3. BDMSTS Field Descriptions (continued) Field Description 2 CLKSW Clock Switch — The CLKSW bit controls which clock the BDM operates with. It is only writable from a hardware BDM command. A minimum delay of 150 cycles at the clock speed that is active during the data portion of the command send to change the clock source should occur before the next command can be send. The delay should be obtained no matter which bit is modified to effectively change the clock source (either PLLSEL bit or CLKSW bit). This guarantees that the start of the next BDM command uses the new clock for timing subsequent BDM communications. Table 7-4 shows the resulting BDM clock source based on the CLKSW and the PLLSEL (PLL select in the CRG module, the bit is part of the CLKSEL register) bits. Note: The BDM alternate clock source can only be selected when CLKSW = 0 and PLLSEL = 1. The BDM serial interface is now fully synchronized to the alternate clock source, when enabled. This eliminates frequency restriction on the alternate clock which was required on previous versions. Refer to the device specification to determine which clock connects to the alternate clock source input. Note: If the acknowledge function is turned on, changing the CLKSW bit will cause the ACK to be at the new rate for the write command which changes it. Note: In emulation modes (if modes available), the CLKSW bit will be set out of RESET. 1 UNSEC Unsecure — If the device is secured this bit is only writable in special single chip mode from the BDM secure firmware. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled and put into the memory map overlapping the standard BDM firmware lookup table. The secure BDM firmware lookup table verifies that the non-volatile memories (e.g. on-chip EEPROM and/or Flash EEPROM) are erased. This being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware lookup table and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will not be asserted. 0 System is in a secured mode. 1 System is in a unsecured mode. Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip Flash EEPROM. Note that if the user does not change the state of the bits to “unsecured” mode, the system will be secured again when it is next taken out of reset.After reset this bit has no meaning or effect when the security byte in the Flash EEPROM is configured for unsecure mode. Table 7-4. BDM Clock Sources PLLSEL CLKSW BDMCLK 0 0 Bus clock dependent on oscillator 0 1 Bus clock dependent on oscillator 1 0 Alternate clock (refer to the device specification to determine the alternate clock source) 1 1 Bus clock dependent on the PLL MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 283 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3.2.2 BDM CCR LOW Holding Register (BDMCCRL) Register Global Address 0x7FFF06 7 6 5 4 3 2 1 0 CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 Special Single-Chip Mode 1 1 0 0 1 0 0 0 All Other Modes 0 0 0 0 0 0 0 0 R W Reset Figure 7-4. BDM CCR LOW Holding Register (BDMCCRL) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured NOTE When BDM is made active, the CPU stores the content of its CCRL register in the BDMCCRL register. However, out of special single-chip reset, the BDMCCRL is set to 0xD8 and not 0xD0 which is the reset value of the CCRL register in this CPU mode. Out of reset in all other modes the BDMCCRL register is read zero. When entering background debug mode, the BDM CCR LOW holding register is used to save the low byte of the condition code register of the user’s program. It is also used for temporary storage in the standard BDM firmware mode. The BDM CCR LOW holding register can be written to modify the CCR value. 7.3.2.3 BDM CCR HIGH Holding Register (BDMCCRH) Register Global Address 0x7FFF07 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 0 W Reset 2 1 0 CCR10 CCR9 CCR8 0 0 0 = Unimplemented or Reserved Figure 7-5. BDM CCR HIGH Holding Register (BDMCCRH) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured When entering background debug mode, the BDM CCR HIGH holding register is used to save the high byte of the condition code register of the user’s program. The BDM CCR HIGH holding register can be written to modify the CCR value. MC9S12XE-Family Reference Manual , Rev. 1.21 284 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3.2.4 BDM Global Page Index Register (BDMGPR) Register Global Address 0x7FFF08 R W Reset 7 6 5 4 3 2 1 0 BGAE BGP6 BGP5 BGP4 BGP3 BGP2 BGP1 BGP0 0 0 0 0 0 0 0 0 Figure 7-6. BDM Global Page Register (BDMGPR) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured Table 7-5. BDMGPR Field Descriptions Field Description 7 BGAE BDM Global Page Access Enable Bit — BGAE enables global page access for BDM hardware and firmware read/write instructions The BDM hardware commands used to access the BDM registers (READ_BD_ and WRITE_BD_) can not be used for global accesses even if the BGAE bit is set. 0 BDM Global Access disabled 1 BDM Global Access enabled 6–0 BGP[6:0] BDM Global Page Index Bits 6–0 — These bits define the extended address bits from 22 to 16. For more detailed information regarding the global page window scheme, please refer to the S12X_MMC Block Guide. 7.3.3 Family ID Assignment The family ID is a 8-bit value located in the firmware ROM (at global address: 0x7FFF0F). The read-only value is a unique family ID which is 0xC1 for S12X devices. 7.4 Functional Description The BDM receives and executes commands from a host via a single wire serial interface. There are two types of BDM commands: hardware and firmware commands. Hardware commands are used to read and write target system memory locations and to enter active background debug mode, see Section 7.4.3, “BDM Hardware Commands”. Target system memory includes all memory that is accessible by the CPU. Firmware commands are used to read and write CPU resources and to exit from active background debug mode, see Section 7.4.4, “Standard BDM Firmware Commands”. The CPU resources referred to are the accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC). Hardware commands can be executed at any time and in any mode excluding a few exceptions as highlighted (see Section 7.4.3, “BDM Hardware Commands”) and in secure mode (see Section 7.4.1, “Security”). Firmware commands can only be executed when the system is not secure and is in active background debug mode (BDM). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 285 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.4.1 Security If the user resets into special single chip mode with the system secured, a secured mode BDM firmware lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table. The secure BDM firmware verifies that the on-chip non-volatile memory (e.g. EEPROM and Flash EEPROM) is erased. This being the case, the UNSEC and ENBDM bit will get set. The BDM program jumps to the start of the standard BDM firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the non-volatile memory does not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled, but does not enable the firmware commands. This allows the BDM hardware to be used to erase the non-volatile memory. BDM operation is not possible in any other mode than special single chip mode when the device is secured. The device can be unsecured via BDM serial interface in special single chip mode only. For more information regarding security, please see the S12X_9SEC Block Guide. 7.4.2 Enabling and Activating BDM The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS) register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire interface, using a hardware command such as WRITE_BD_BYTE. After being enabled, BDM is activated by one of the following1: • Hardware BACKGROUND command • CPU BGND instruction • External instruction tagging mechanism2 • Breakpoint force or tag mechanism2 When BDM is activated, the CPU finishes executing the current instruction and then begins executing the firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type of breakpoint used determines if BDM becomes active before or after execution of the next instruction. NOTE If an attempt is made to activate BDM before being enabled, the CPU resumes normal instruction execution after a brief delay. If BDM is not enabled, any hardware BACKGROUND commands issued are ignored by the BDM and the CPU is not delayed. In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses 0x7FFF00 to 0x7FFFFF. BDM registers are mapped to addresses 0x7FFF00 to 0x7FFF0B. The BDM uses these registers which are readable anytime by the BDM. However, these registers are not readable by user programs. 1. BDM is enabled and active immediately out of special single-chip reset. 2. This method is provided by the S12X_DBG module. MC9S12XE-Family Reference Manual , Rev. 1.21 286 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.4.3 BDM Hardware Commands Hardware commands are used to read and write target system memory locations and to enter active background debug mode. Target system memory includes all memory that is accessible by the CPU on the SOC which can be on-chip RAM, non-volatile memory (e.g. EEPROM, Flash EEPROM), I/O and control registers, and all external memory. Hardware commands are executed with minimal or no CPU intervention and do not require the system to be in active BDM for execution, although, they can still be executed in this mode. When executing a hardware command, the BDM sub-block waits for a free bus cycle so that the background access does not disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the operation does not intrude on normal CPU operation provided that it can be completed in a single cycle. However, if an operation requires multiple cycles the CPU is frozen until the operation is complete, even though the BDM found a free cycle. The BDM hardware commands are listed in Table 7-6. The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations are not normally in the system memory map but share addresses with the application in memory. To distinguish between physical memory locations that share the same address, BDM memory resources are enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM locations unobtrusively, even if the addresses conflict with the application memory map. Table 7-6. Hardware Commands Opcode (hex) Data BACKGROUND 90 None Enter background mode if firmware is enabled. If enabled, an ACK will be issued when the part enters active background mode. ACK_ENABLE D5 None Enable Handshake. Issues an ACK pulse after the command is executed. ACK_DISABLE D6 None Disable Handshake. This command does not issue an ACK pulse. READ_BD_BYTE E4 16-bit address Read from memory with standard BDM firmware lookup table in map. 16-bit data out Odd address data on low byte; even address data on high byte. READ_BD_WORD EC 16-bit address Read from memory with standard BDM firmware lookup table in map. 16-bit data out Must be aligned access. READ_BYTE E0 16-bit address Read from memory with standard BDM firmware lookup table out of map. 16-bit data out Odd address data on low byte; even address data on high byte. READ_WORD E8 16-bit address Read from memory with standard BDM firmware lookup table out of map. 16-bit data out Must be aligned access. WRITE_BD_BYTE C4 16-bit address Write to memory with standard BDM firmware lookup table in map. 16-bit data in Odd address data on low byte; even address data on high byte. WRITE_BD_WORD CC 16-bit address Write to memory with standard BDM firmware lookup table in map. 16-bit data in Must be aligned access. WRITE_BYTE C0 16-bit address Write to memory with standard BDM firmware lookup table out of map. 16-bit data in Odd address data on low byte; even address data on high byte. Command Description MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 287 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-6. Hardware Commands (continued) Command WRITE_WORD Opcode (hex) C8 Data Description 16-bit address Write to memory with standard BDM firmware lookup table out of map. 16-bit data in Must be aligned access. NOTE: If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands. 7.4.4 Standard BDM Firmware Commands Firmware commands are used to access and manipulate CPU resources. The system must be in active BDM to execute standard BDM firmware commands, see Section 7.4.2, “Enabling and Activating BDM”. Normal instruction execution is suspended while the CPU executes the firmware located in the standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM. As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become visible in the on-chip memory map at 0x7FFF00–0x7FFFFF, and the CPU begins executing the standard BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are received. The firmware commands are shown in Table 7-7. MC9S12XE-Family Reference Manual , Rev. 1.21 288 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-7. Firmware Commands Command(1) Opcode (hex) Data Description READ_NEXT(2) 62 16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to. READ_PC 63 16-bit data out Read program counter. READ_D 64 16-bit data out Read D accumulator. READ_X 65 16-bit data out Read X index register. READ_Y 66 16-bit data out Read Y index register. READ_SP 67 16-bit data out Read stack pointer. WRITE_NEXT 42 16-bit data in Increment X index register by 2 (X = X + 2), then write word to location pointed to by X. WRITE_PC 43 16-bit data in Write program counter. WRITE_D 44 16-bit data in Write D accumulator. WRITE_X 45 16-bit data in Write X index register. WRITE_Y 46 16-bit data in Write Y index register. WRITE_SP 47 16-bit data in Write stack pointer. GO 08 none Go to user program. If enabled, ACK will occur when leaving active background mode. GO_UNTIL(3) 0C none Go to user program. If enabled, ACK will occur upon returning to active background mode. TRACE1 10 none Execute one user instruction then return to active BDM. If enabled, ACK will occur upon returning to active background mode. TAGGO -> GO 18 none (Previous enable tagging and go to user program.) This command will be deprecated and should not be used anymore. Opcode will be executed as a GO command. 1. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands. 2. When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space the BDM resources are accessed rather than user code. Writing BDM firmware is not possible. 3. System stop disables the ACK function and ignored commands will not have an ACK-pulse (e.g., CPU in stop or wait mode). The GO_UNTIL command will not get an Acknowledge if CPU executes the wait or stop instruction before the “UNTIL” condition (BDM active again) is reached (see Section 7.4.7, “Serial Interface Hardware Handshake Protocol” last Note). 7.4.5 BDM Command Structure Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a 16-bit data word depending on the command. All the read commands return 16 bits of data despite the byte or word implication in the command name. 8-bit reads return 16-bits of data, of which, only one byte will contain valid data. If reading an even address, the valid data will appear in the MSB. If reading an odd address, the valid data will appear in the LSB. 16-bit misaligned reads and writes are generally not allowed. If attempted by BDM hardware command, the BDM will ignore the least significant bit of the address and will assume an even address from the remaining bits. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 289 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) For devices with external bus: The following cycle count information is only valid when the external wait function is not used (see wait bit of EBI sub-block). During an external wait the BDM can not steal a cycle. Hence be careful with the external wait function if the BDM serial interface is much faster than the bus, because of the BDM soft-reset after time-out (see Section 7.4.11, “Serial Communication Time Out”). For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending the address before attempting to obtain the read data. This is to be certain that valid data is available in the BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait 150 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a free cycle before stealing a cycle. For firmware read commands, the external host should wait at least 48 bus clock cycles after sending the command opcode and before attempting to obtain the read data. This includes the potential of extra cycles when the access is external and stretched (+1 to maximum +7 cycles) or to registers of the PRU (port replacement unit) in emulation modes (if modes available). The 48 cycle wait allows enough time for the requested data to be made available in the BDM shift register, ready to be shifted out. NOTE This timing has increased from previous BDM modules due to the new capability in which the BDM serial interface can potentially run faster than the bus. On previous BDM modules this extra time could be hidden within the serial time. For firmware write commands, the external host must wait 36 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The external host should wait at least for 76 bus clock cycles after a TRACE1 or GO command before starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup table and resume execution of the user code. Disturbing the BDM shift register prematurely may adversely affect the exit from the standard BDM firmware lookup table. NOTE If the bus rate of the target processor is unknown or could be changing or the external wait function is used, it is recommended that the ACK (acknowledge function) is used to indicate when an operation is complete. When using ACK, the delay times are automated. Figure 7-7 represents the BDM command structure. The command blocks illustrate a series of eight bit times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is 8 × 16 target clock cycles.1 1. Target clock cycles are cycles measured using the target MCU’s serial clock rate. See Section 7.4.6, “BDM Serial Interface” and Section 7.3.2.1, “BDM Status Register (BDMSTS)” for information on how serial clock rate is selected. MC9S12XE-Family Reference Manual , Rev. 1.21 290 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Hardware Read 8 Bits AT ~16 TC/Bit 16 Bits AT ~16 TC/Bit Command Address 150-BC Delay 16 Bits AT ~16 TC/Bit Data Next Command 150-BC Delay Hardware Write Command Address Next Command Data 48-BC DELAY Firmware Read Command Next Command Data 36-BC DELAY Firmware Write Command Data Next Command 76-BC Delay GO, TRACE Command Next Command BC = Bus Clock Cycles TC = Target Clock Cycles Figure 7-7. BDM Command Structure 7.4.6 BDM Serial Interface The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the BDM. The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see Section 7.3.2.1, “BDM Status Register (BDMSTS)”. This clock will be referred to as the target clock in the following explanation. The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per bit. The interface times out if 512 clock cycles occur between falling edges from the host. The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host for transmit cases and the target for receive cases. The timing for host-to-target is shown in Figure 7-8 and that of target-to-host in Figure 7-9 and Figure 7-10. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since the host and target are operating from separate clocks, it can take the target system up to one full clock cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 291 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) earlier. Synchronization between the host and target is established in this manner at the start of every bit time. Figure 7-8 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1 transmission. Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals. BDM Clock (Target MCU) Host Transmit 1 Host Transmit 0 Perceived Start of Bit Time Target Senses Bit 10 Cycles Synchronization Uncertainty Earliest Start of Next Bit Figure 7-8. BDM Host-to-Target Serial Bit Timing The receive cases are more complicated. Figure 7-9 shows the host receiving a logic 1 from the target system. Since the host is asynchronous to the target, there is up to one clock-cycle delay from the hostgenerated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time. MC9S12XE-Family Reference Manual , Rev. 1.21 292 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) BDM Clock (Target MCU) Host Drive to BKGD Pin Target System Speedup Pulse High-Impedance High-Impedance High-Impedance Perceived Start of Bit Time R-C Rise BKGD Pin 10 Cycles 10 Cycles Host Samples BKGD Pin Earliest Start of Next Bit Figure 7-9. BDM Target-to-Host Serial Bit Timing (Logic 1) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 293 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Figure 7-10 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Since the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting the bit time. BDM Clock (Target MCU) Host Drive to BKGD Pin High-Impedance Speedup Pulse Target System Drive and Speedup Pulse Perceived Start of Bit Time BKGD Pin 10 Cycles 10 Cycles Host Samples BKGD Pin Earliest Start of Next Bit Figure 7-10. BDM Target-to-Host Serial Bit Timing (Logic 0) 7.4.7 Serial Interface Hardware Handshake Protocol BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM clock source can be asynchronously related to the bus frequency, when CLKSW = 0, it is very helpful to provide a handshake protocol in which the host could determine when an issued command is executed by the CPU. The alternative is to always wait the amount of time equal to the appropriate number of cycles at the slowest possible rate the clock could be running. This sub-section will describe the hardware handshake protocol. The hardware handshake protocol signals to the host controller when an issued command was successfully executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 7-11). This pulse is referred to as the ACK pulse. After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read command, or start a new command if the last command was a write command or a control command (BACKGROUND, GO, GO_UNTIL or TRACE1). The ACK pulse is not issued earlier than 32 serial clock cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also that, there is no upper limit for the delay between the command and the related ACK pulse, since the command execution depends upon the CPU bus frequency, which in some cases could be very slow MC9S12XE-Family Reference Manual , Rev. 1.21 294 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) compared to the serial communication rate. This protocol allows a great flexibility for the POD designers, since it does not rely on any accurate time measurement or short response time to any event in the serial communication. BDM Clock (Target MCU) 16 Cycles Target Transmits ACK Pulse High-Impedance High-Impedance 32 Cycles Speedup Pulse Minimum Delay From the BDM Command BKGD Pin Earliest Start of Next Bit 16th Tick of the Last Command Bit Figure 7-11. Target Acknowledge Pulse (ACK) NOTE If the ACK pulse was issued by the target, the host assumes the previous command was executed. If the CPU enters wait or stop prior to executing a hardware command, the ACK pulse will not be issued meaning that the BDM command was not executed. After entering wait or stop mode, the BDM command is no longer pending. Figure 7-12 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed (free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved. After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form of a word and the host needs to determine which is the appropriate byte based on whether the address was odd or even. Target BKGD Pin READ_BYTE Host Byte Address Host (2) Bytes are Retrieved New BDM Command Host Target Target BDM Issues the ACK Pulse (out of scale) BDM Decodes the Command BDM Executes the READ_BYTE Command Figure 7-12. Handshake Protocol at Command Level MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 295 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK handshake pulse is initiated by the target MCU by issuing a negative edge in the BKGD pin. The hardware handshake protocol in Figure 7-11 specifies the timing when the BKGD pin is being driven, so the host should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin. NOTE The only place the BKGD pin can have an electrical conflict is when one side is driving low and the other side is issuing a speedup pulse (high). Other “highs” are pulled rather than driven. However, at low rates the time of the speedup pulse can become lengthy and so the potential conflict time becomes longer as well. The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to issue a new BDM command. When the CPU enters wait or stop while the host issues a hardware command (e.g., WRITE_BYTE), the target discards the incoming command due to the wait or stop being detected. Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be issued in this case. After a certain time the host (not aware of stop or wait) should decide to abort any possible pending ACK pulse in order to be sure a new command can be issued. Therefore, the protocol provides a mechanism in which a command, and its corresponding ACK, can be aborted. NOTE The ACK pulse does not provide a time out. This means for the GO_UNTIL command that it can not be distinguished if a stop or wait has been executed (command discarded and ACK not issued) or if the “UNTIL” condition (BDM active) is just not reached yet. Hence in any case where the ACK pulse of a command is not issued the possible pending command should be aborted before issuing a new command. See the handshake abort procedure described in Section 7.4.8, “Hardware Handshake Abort Procedure”. 7.4.8 Hardware Handshake Abort Procedure The abort procedure is based on the SYNC command. In order to abort a command, which had not issued the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol, see Section 7.4.9, “SYNC — Request Timed Reference Pulse”, and assumes that the pending command and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been completed the host is free to issue new BDM commands. For Firmware READ or WRITE commands it can not be guaranteed that the pending command is aborted when issuing a SYNC before the corresponding ACK pulse. There is a short latency time from the time the READ or WRITE access begins until it is finished and the corresponding ACK pulse is issued. The latency time depends on the firmware READ or WRITE command that is issued and if the serial interface is running on a different clock rate than the bus. When the SYNC command starts during this latency time the READ or WRITE command will not be aborted, but the corresponding ACK pulse will be aborted. A pending GO, TRACE1 or MC9S12XE-Family Reference Manual , Rev. 1.21 296 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) GO_UNTIL command can not be aborted. Only the corresponding ACK pulse can be aborted by the SYNC command. Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command. The ACK is actually aborted when a negative edge is perceived by the target in the BKGD pin. The short abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the negative edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending command will be aborted along with the ACK pulse. The potential problem with this abort procedure is when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not perceive the abort pulse. The worst case is when the pending command is a read command (i.e., READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new command after the abort pulse was issued, while the target expects the host to retrieve the accessed memory byte. In this case, host and target will run out of synchronism. However, if the command to be aborted is not a read command the short abort pulse could be used. After a command is aborted the target assumes the next negative edge, after the abort pulse, is the first bit of a new BDM command. NOTE The details about the short abort pulse are being provided only as a reference for the reader to better understand the BDM internal behavior. It is not recommended that this procedure be used in a real application. Since the host knows the target serial clock frequency, the SYNC command (used to abort a command) does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to assure the SYNC pulse will not be misinterpreted by the target. See Section 7.4.9, “SYNC — Request Timed Reference Pulse”. Figure 7-13 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE command. Note that, after the command is aborted a new command could be issued by the host computer. READ_BYTE CMD is Aborted by the SYNC Request (Out of Scale) BKGD Pin READ_BYTE Host Memory Address Target BDM Decode and Starts to Execute the READ_BYTE Command SYNC Response From the Target (Out of Scale) READ_STATUS Host Target New BDM Command Host Target New BDM Command Figure 7-13. ACK Abort Procedure at the Command Level NOTE Figure 7-13 does not represent the signals in a true timing scale Figure 7-14 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 297 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Since this is not a probable situation, the protocol does not prevent this conflict from happening. At Least 128 Cycles BDM Clock (Target MCU) ACK Pulse Target MCU Drives to BKGD Pin Host Drives SYNC To BKGD Pin High-Impedance Host and Target Drive to BKGD Pin Electrical Conflict Speedup Pulse Host SYNC Request Pulse BKGD Pin 16 Cycles Figure 7-14. ACK Pulse and SYNC Request Conflict NOTE This information is being provided so that the MCU integrator will be aware that such a conflict could eventually occur. The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE BDM commands. This provides backwards compatibility with the existing POD devices which are not able to execute the hardware handshake protocol. It also allows for new POD devices, that support the hardware handshake protocol, to freely communicate with the target device. If desired, without the need for waiting for the ACK pulse. The commands are described as follows: • ACK_ENABLE — enables the hardware handshake protocol. The target will issue the ACK pulse when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the ACK pulse as a response. • ACK_DISABLE — disables the ACK pulse protocol. In this case, the host needs to use the worst case delay time at the appropriate places in the protocol. The default state of the BDM after reset is hardware handshake protocol disabled. All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See Section 7.4.3, “BDM Hardware Commands” and Section 7.4.4, “Standard BDM Firmware Commands” for more information on the BDM commands. MC9S12XE-Family Reference Manual , Rev. 1.21 298 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host knows that the target supports the hardware handshake protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a valid command. The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this case, is issued when the CPU enters into background mode. This command is an alternative to the GO command and should be used when the host wants to trace if a breakpoint match occurs and causes the CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related to this command could be aborted using the SYNC command. The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode after one instruction of the application program is executed. The ACK pulse related to this command could be aborted using the SYNC command. 7.4.9 SYNC — Request Timed Reference Pulse The SYNC command is unlike other BDM commands because the host does not necessarily know the correct communication speed to use for BDM communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host should perform the following steps: 1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication frequency (the lowest serial communication frequency is determined by the crystal oscillator or the clock chosen by CLKSW.) 2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically one cycle of the host clock.) 3. Remove all drive to the BKGD pin so it reverts to high impedance. 4. Listen to the BKGD pin for the sync response pulse. Upon detecting the SYNC request from the host, the target performs the following steps: 1. Discards any incomplete command received or bit retrieved. 2. Waits for BKGD to return to a logic one. 3. Delays 16 cycles to allow the host to stop driving the high speedup pulse. 4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency. 5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD. 6. Removes all drive to the BKGD pin so it reverts to high impedance. The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed for subsequent BDM communications. Typically, the host can determine the correct communication speed MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 299 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) within a few percent of the actual target speed and the communication protocol can easily tolerate speed errors of several percent. As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the SYNC response, the target will consider the next negative edge (issued by the host) as the start of a new BDM command or the start of new SYNC request. Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the same as in a regular SYNC command. Note that one of the possible causes for a command to not be acknowledged by the target is a host-target synchronization problem. In this case, the command may not have been understood by the target and so an ACK response pulse will not be issued. 7.4.10 Instruction Tracing When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM firmware and executes a single instruction in the user code. Once this has occurred, the CPU is forced to return to the standard BDM firmware and the BDM is active and ready to receive a new command. If the TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or tracing through the user code one instruction at a time. If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but no user instruction is executed. Once back in standard BDM firmware execution, the program counter points to the first instruction in the interrupt service routine. Be aware when tracing through the user code that the execution of the user code is done step by step but all peripherals are free running. Hence possible timing relations between CPU code execution and occurrence of events of other peripherals no longer exist. Do not trace the CPU instruction BGND used for soft breakpoints. Tracing the BGND instruction will result in a return address pointing to BDM firmware address space. When tracing through user code which contains stop or wait instructions the following will happen when the stop or wait instruction is traced: The CPU enters stop or wait mode and the TRACE1 command can not be finished before leaving the low power mode. This is the case because BDM active mode can not be entered after CPU executed the stop instruction. However all BDM hardware commands except the BACKGROUND command are operational after tracing a stop or wait instruction and still being in stop or wait mode. If system stop mode is entered (all bus masters are in stop mode) no BDM command is operational. As soon as stop or wait mode is exited the CPU enters BDM active mode and the saved PC value points to the entry of the corresponding interrupt service routine. In case the handshake feature is enabled the corresponding ACK pulse of the TRACE1 command will be discarded when tracing a stop or wait instruction. Hence there is no ACK pulse when BDM active mode is entered as part of the TRACE1 command after CPU exited from stop or wait mode. All valid commands sent during CPU being in stop or wait mode or after CPU exited from stop or wait mode will have an ACK pulse. The handshake feature becomes disabled only when system MC9S12XE-Family Reference Manual , Rev. 1.21 300 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) stop mode has been reached. Hence after a system stop mode the handshake feature must be enabled again by sending the ACK_ENABLE command. 7.4.11 Serial Communication Time Out The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any time-out limit. Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset. If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will occur causing the command to be disregarded. The data is not available for retrieval after the time-out has occurred. This is the expected behavior if the handshake protocol is not enabled. However, consider the behavior where the BDM is running in a frequency much greater than the CPU frequency. In this case, the command could time out before the data is ready to be retrieved. In order to allow the data to be retrieved even with a large clock frequency mismatch (between BDM and CPU) when the hardware handshake protocol is enabled, the time out between a read command and the data retrieval is disabled. Therefore, the host could wait for more then 512 serial clock cycles and still be able to retrieve the data from an issued read command. However, once the handshake pulse (ACK pulse) is issued, the time-out feature is reactivated, meaning that the target will time out after 512 clock cycles. Therefore, the host needs to retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After that period, the read command is discarded and the data is no longer available for retrieval. Any negative edge in the BKGD pin after the time-out period is considered to be a new command or a SYNC request. Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the serial communication is active. This means that if a time frame higher than 512 serial clock cycles is observed between two consecutive negative edges and the command being issued or data being retrieved is not complete, a soft-reset will occur causing the partially received command or data retrieved to be disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is considered by the target as the start of a new BDM command, or the start of a SYNC request pulse. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 301 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) MC9S12XE-Family Reference Manual , Rev. 1.21 302 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-1. Revision History Revision Number Revision Date V03.18 20 Apr 2007 V03.19 Sections Affected Description of Changes 8.4.2.3/8-327 - Added “Data Bus Comparison NDB Dependency” section - Clarified effect TRIG has on state sequencer. 24 Apr 2007 8.4.3.5/8-329 - Clarified simultaneous arm and disarm effect. V03.20 14 Apr 2007 8.3.2.7/8-315 - Clarified reserved State Sequencer encodings. V03.21 23 Oct 2007 8.4.2.2/8-327 8.4.2.4/8-328 - Added single databyte comparison limitation information - Added statement about interrupt vector fetches whilst tagging. V03.22 12 Nov 2007 8.4.5.2/8-332 8.4.5.5/8-339 - Removed LOOP1 tracing restriction NOTE. - Added pin reset effect NOTE. V03.23 13 Nov 2007 General V03.24 04 Jan 2008 8.4.5.3/8-334 8.1 - Text readability improved, typo removed. - Corrected bit name. Introduction The S12XDBG module provides an on-chip trace buffer with flexible triggering capability to allow nonintrusive debug of application software. The S12XDBG module is optimized for the S12X 16-bit architecture and allows debugging of CPU12Xand XGATE module operations. Typically the S12XDBG module is used in conjunction with the S12XBDM module, whereby the user configures the S12XDBG module for a debugging session over the BDM interface. Once configured the S12XDBG module is armed and the device leaves BDM Mode returning control to the user program, which is then monitored by the S12XDBG module. Alternatively the S12XDBG module can be configured over a serial interface using SWI routines. 8.1.1 Glossary Table 8-2. Glossary Of Terms Term Definition COF Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt BDM Background Debug Mode DUG Device User Guide, describing the features of the device into which the DBG is integrated MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 303 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-2. Glossary Of Terms (continued) Term Definition WORD 16 bit data entity Data Line 64 bit data entity CPU CPU12X module Tag Tags can be attached to XGATE or CPU opcodes as they enter the instruction pipe. If the tagged opcode reaches the execution stage a tag hit occurs. 8.1.2 Overview The comparators monitor the bus activity of the CPU12X and XGATE. When a match occurs the control logic can trigger the state sequencer to a new state. On a transition to the Final State, bus tracing is triggered and/or a breakpoint can be generated. Independent of comparator matches a transition to Final State with associated tracing and breakpoint can be triggered by the external TAGHI and TAGLO signals, or by an XGATE module S/W breakpoint request or by writing to the TRIG control bit. The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word reads. Tracing is disabled when the MCU system is secured. 8.1.3 • • • • Features Four comparators (A, B, C, and D) — Comparators A and C compare the full address bus and full 16-bit data bus — Comparators A and C feature a data bus mask register — Comparators B and D compare the full address bus only — Each comparator can be configured to monitor CPU12X or XGATE buses — Each comparator features selection of read or write access cycles — Comparators B and D allow selection of byte or word access cycles — Comparisons can be used as triggers for the state sequencer Three comparator modes — Simple address/data comparator match mode — Inside address range mode, Addmin ≤ Address ≤ Addmax — Outside address range match mode, Address < Addmin or Address > Addmax Two types of triggers — Tagged — This triggers just before a specific instruction begins execution — Force — This triggers on the first instruction boundary after a match occurs. The following types of breakpoints — CPU12X breakpoint entering BDM on breakpoint (BDM) — CPU12X breakpoint executing SWI on breakpoint (SWI) — XGATE breakpoint MC9S12XE-Family Reference Manual , Rev. 1.21 304 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module • • • • External CPU12X instruction tagging trigger independent of comparators XGATE S/W breakpoint request trigger independent of comparators TRIG Immediate software trigger independent of comparators Four trace modes — Normal: change of flow (COF) PC information is stored (see Section 8.4.5.2.1) for change of flow definition. — Loop1: same as Normal but inhibits consecutive duplicate source address entries — Detail: address and data for all cycles except free cycles and opcode fetches are stored — Pure PC: All program counter addresses are stored. 4-stage state sequencer for trace buffer control — Tracing session trigger linked to Final State of state sequencer — Begin, End, and Mid alignment of tracing to trigger • 8.1.4 Modes of Operation The S12XDBG module can be used in all MCU functional modes. During BDM hardware accesses and whilst the BDM module is active, CPU12X monitoring is disabled. Thus breakpoints, comparators, and CPU12X bus tracing are disabled but XGATE bus monitoring accessing the S12XDBG registers, including comparator registers, is still possible. While in active BDM or during hardware BDM accesses, XGATE activity can still be compared, traced and can be used to generate a breakpoint to the XGATE module. When the CPU12X enters active BDM Mode through a BACKGROUND command, with the S12XDBG module armed, the S12XDBG remains armed. The S12XDBG module tracing is disabled if the MCU is secure. However, breakpoints can still be generated if the MCU is secure. Table 8-3. Mode Dependent Restriction Summary BDM Enable BDM Active MCU Secure Comparator Matches Enabled Breakpoints Possible Tagging Possible Tracing Possible x x 1 Yes Yes Yes No 0 0 0 Yes Only SWI Yes Yes 0 1 0 1 0 0 Yes Yes Yes Yes 1 1 0 XGATE only XGATE only XGATE only XGATE only Active BDM not possible when not enabled MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 305 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.1.5 Block Diagram TAGS TAGHITS EXTERNAL TAGHI / TAGLO BREAKPOINT REQUESTS XGATE S/W BREAKPOINT REQUEST CPU12X & XGATE XGATE BUS COMPARATOR A COMPARATOR B COMPARATOR C COMPARATOR D MATCH0 COMPARATOR MATCH CONTROL CPU12X BUS BUS INTERFACE SECURE MATCH1 TAG & TRIGGER CONTROL LOGIC TRIGGER STATE STATE SEQUENCER STATE MATCH2 MATCH3 TRACE CONTROL TRIGGER TRACE BUFFER READ TRACE DATA (DBG READ DATA BUS) Figure 8-1. Debug Module Block Diagram 8.2 External Signal Description The S12XDBG sub-module features two external tag input signals. See Device User Guide (DUG) for the mapping of these signals to device pins. These tag pins may be used for the external tagging in emulation modes only. Table 8-4. External System Pins Associated With S12XDBG Pin Name Pin Functions TAGHI (See DUG) TAGHI When instruction tagging is on, tags the high half of the instruction word being read into the instruction queue. TAGLO (See DUG) TAGLO When instruction tagging is on, tags the low half of the instruction word being read into the instruction queue. TAGLO (See DUG) Unconditional Tagging Enable In emulation modes, a low assertion on this pin in the 7th or 8th cycle after the end of reset enables the Unconditional Tagging function. 8.3 8.3.1 Description Memory Map and Registers Module Memory Map A summary of the registers associated with the S12XDBG sub-block is shown in Table 8-2. Detailed descriptions of the registers and bits are given in the subsections that follow. MC9S12XE-Family Reference Manual , Rev. 1.21 306 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Address Name Bit 7 6 0 TRIG 5 4 XGSBPE BDM 0 0 3 2 1 Bit 0 0x0020 DBGC1 R W 0x0021 DBGSR R W 0x0022 DBGTCR R W 0x0023 DBGC2 R W 0 0 0 0 0x0024 DBGTBH R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x0025 DBGTBL R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0026 DBGCNT R W 0 0x0027 DBGSCRX 0 0 0 0 SC3 SC2 SC1 SC0 0x0027 DBGMFR R W R W 0 0 0 0 MC3 MC2 MC1 MC0 DBGXCTL R (COMPA/C) W DBGXCTL R (COMPB/D) W 0 NDB TAG BRK RW RWE SRC COMPE SZ TAG BRK RW RWE SRC COMPE Bit 22 21 20 19 18 17 Bit 16 0x00281 0x00282 ARM TBF EXTF TSOURCE SZE 0 DBGBRK 0 TRANGE COMRV SSF2 SSF1 SSF0 TRCMOD TALIGN CDCM ABCM CNT 0x0029 DBGXAH R W 0x002A DBGXAM R W Bit 15 14 13 12 11 10 9 Bit 8 0x002B DBGXAL R W Bit 7 6 5 4 3 2 1 Bit 0 0x002C DBGXDH R W Bit 15 14 13 12 11 10 9 Bit 8 0x002D DBGXDL R W Bit 7 6 5 4 3 2 1 Bit 0 0x002E DBGXDHM R W Bit 15 14 13 12 11 10 9 Bit 8 1 Bit 0 R Bit 7 6 5 4 3 2 W 1 This represents the contents if the Comparator A or C control register is blended into this address. 2 This represents the contents if the Comparator B or D control register is blended into this address 0x002F DBGXDLM Figure 8-2. Quick Reference to S12XDBG Registers MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 307 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2 Register Descriptions This section consists of the S12XDBG control and trace buffer register descriptions in address order. Each comparator has a bank of registers that are visible through an 8-byte window between 0x0028 and 0x002F in the S12XDBG module register address map. When ARM is set in DBGC1, the only bits in the S12XDBG module registers that can be written are ARM, TRIG, and COMRV[1:0] 8.3.2.1 Debug Control Register 1 (DBGC1) Address: 0x0020 7 R W Reset 6 ARM 0 0 TRIG 0 5 4 XGSBPE BDM 0 0 3 2 1 DBGBRK 0 0 COMRV 0 0 0 Figure 8-3. Debug Control Register (DBGC1) Read: Anytime Write: Bits 7, 1, 0 anytime Bit 6 can be written anytime but always reads back as 0. Bits 5:2 anytime S12XDBG is not armed. NOTE If a write access to DBGC1 with the ARM bit position set occurs simultaneously to a hardware disarm from an internal trigger event, then the ARM bit is cleared due to the hardware disarm. NOTE When disarming the S12XDBG by clearing ARM with software, the contents of bits[5:2] are not affected by the write, since up until the write operation, ARM = 1 preventing these bits from being written. These bits must be cleared using a second write if required. Table 8-5. DBGC1 Field Descriptions Field Description 7 ARM Arm Bit — The ARM bit controls whether the S12XDBG module is armed. This bit can be set and cleared by user software and is automatically cleared on completion of a tracing session, or if a breakpoint is generated with tracing not enabled. On setting this bit the state sequencer enters State1. 0 Debugger disarmed 1 Debugger armed 6 TRIG Immediate Trigger Request Bit — This bit when written to 1 requests an immediate trigger independent of comparator or external tag signal status. When tracing is complete a forced breakpoint may be generated depending upon DBGBRK and BDM bit settings. This bit always reads back a 0. Writing a 0 to this bit has no effect. If TSOURCE are clear no tracing is carried out. If tracing has already commenced using BEGIN- or MID trigger alignment, it continues until the end of the tracing session as defined by the TALIGN bit settings, thus TRIG has no affect. In secure mode tracing is disabled and writing to this bit has no effect. 0 Do not trigger until the state sequencer enters the Final State. 1 Trigger immediately . MC9S12XE-Family Reference Manual , Rev. 1.21 308 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-5. DBGC1 Field Descriptions (continued) Field 5 XGSBPE Description XGATE S/W Breakpoint Enable — The XGSBPE bit controls whether an XGATE S/W breakpoint request is passed to the CPU12X. The XGATE S/W breakpoint request is handled by the S12XDBG module, which can request an CPU12X breakpoint depending on the state of this bit. 0 XGATE S/W breakpoint request is disabled 1 XGATE S/W breakpoint request is enabled 4 BDM Background Debug Mode Enable — This bit determines if an S12X breakpoint causes the system to enter Background Debug Mode (BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDM is not enabled by the ENBDM bit in the BDM module, then breakpoints default to SWI. 0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint. 1 Breakpoint to BDM, if BDM enabled. Otherwise breakpoint to SWI 3–2 DBGBRK S12XDBG Breakpoint Enable Bits — The DBGBRK bits control whether the debugger will request a breakpoint to either CPU12X or XGATE or both upon reaching the state sequencer Final State. If tracing is enabled, the breakpoint is generated on completion of the tracing session. If tracing is not enabled, the breakpoint is generated immediately. Please refer to Section 8.4.7 for further details. XGATE software breakpoints are independent of the DBGBRK bits. XGATE software breakpoints force a breakpoint to the CPU12X independent of the DBGBRK bit field configuration. See Table 8-6. 1–0 COMRV Comparator Register Visibility Bits — These bits determine which bank of comparator register is visible in the 8-byte window of the S12XDBG module address map, located between 0x0028 to 0x002F. Furthermore these bits determine which register is visible at the address 0x0027. See Table 8-7. Table 8-6. DBGBRK Encoding DBGBRK Resource Halted by Breakpoint 00 No breakpoint generated 01 XGATE breakpoint generated 10 CPU12X breakpoint generated 11 Breakpoints generated for CPU12X and XGATE Table 8-7. COMRV Encoding COMRV Visible Comparator Visible Register at 0x0027 00 Comparator A DBGSCR1 01 Comparator B DBGSCR2 10 Comparator C DBGSCR3 11 Comparator D DBGMFR MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 309 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.2 Debug Status Register (DBGSR) Address: 0x0021 R 7 6 5 4 3 2 1 0 TBF EXTF 0 0 0 SSF2 SSF1 SSF0 — 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset POR = Unimplemented or Reserved Figure 8-4. Debug Status Register (DBGSR) Read: Anytime Write: Never Table 8-8. DBGSR Field Descriptions Field Description 7 TBF Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits CNT[6:0]. The TBF bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no affect on this bit 6 EXTF External Tag Hit Flag — The EXTF bit indicates if a tag hit condition from an external TAGHI/TAGLO tag was met since arming. This bit is cleared when ARM in DBGC1 is written to a one. 0 External tag hit has not occurred 1 External tag hit has occurred 2–0 SSF[2:0] State Sequencer Flag Bits — The SSF bits indicate in which state the State Sequencer is currently in. During a debug session on each transition to a new state these bits are updated. If the debug session is ended by software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer before disarming. If a debug session is ended by an internal trigger, then the state sequencer returns to state0 and these bits are cleared to indicate that state0 was entered during the session. On arming the module the state sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See Table 8-9. Table 8-9. SSF[2:0] — State Sequence Flag Bit Encoding SSF[2:0] Current State 000 State0 (disarmed) 001 State1 010 State2 011 State3 100 Final State 101,110,111 Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 310 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.3 Debug Trace Control Register (DBGTCR) Address: 0x0022 7 6 R TSOURCE W Reset 5 0 4 3 TRANGE 0 0 2 1 TRCMOD 0 0 0 TALIGN 0 0 0 Figure 8-5. Debug Trace Control Register (DBGTCR) Read: Anytime Write: Bits 7:6 only when S12XDBG is neither secure nor armed. Bits 5:0 anytime the module is disarmed. Table 8-10. DBGTCR Field Descriptions Field 7–6 TSOURCE Description Trace Source Control Bits — The TSOURCE bits select the data source for the tracing session. If the MCU system is secured, these bits cannot be set and tracing is inhibited. See Table 8-11. 5–4 TRANGE Trace Range Bits — The TRANGE bits allow filtering of trace information from a selected address range when tracing from the CPU12X in Detail Mode. The XGATE tracing range cannot be narrowed using these bits. To use a comparator for range filtering, the corresponding COMPE and SRC bits must remain cleared. If the COMPE bit is not clear then the comparator will also be used to generate state sequence triggers. If the corresponding SRC bit is set the comparator is mapped to the XGATE buses, the TRANGE bits have no effect on the valid address range, memory accesses within the whole memory map are traced. See Table 8-12. 3–2 TRCMOD Trace Mode Bits — See Section 8.4.5.2 for detailed Trace Mode descriptions. In Normal Mode, change of flow information is stored. In Loop1 Mode, change of flow information is stored but redundant entries into trace memory are inhibited. In Detail Mode, address and data for all memory and register accesses is stored. See Table 8-13. 1–0 TALIGN Trigger Align Bits — These bits control whether the trigger is aligned to the beginning, end or the middle of a tracing session. See Table 8-14. Table 8-11. TSOURCE — Trace Source Bit Encoding TSOURCE Tracing Source 00 No tracing requested 01 CPU12X (1) 10 XGATE Both CPU12X and XGATE 111,(2) 1. No range limitations are allowed. Thus tracing operates as if TRANGE = 00. 2. No Detail Mode tracing supported. If TRCMOD = 10, no information is stored. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 311 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-12. TRANGE Trace Range Encoding TRANGE Tracing Range 00 Trace from all addresses (No filter) 01 Trace only in address range from $00000 to Comparator D 10 Trace only in address range from Comparator C to $7FFFFF 11 Trace only in range from Comparator C to Comparator D Table 8-13. TRCMOD Trace Mode Bit Encoding TRCMOD Description 00 Normal 01 Loop1 10 Detail 11 Pure PC Table 8-14. TALIGN Trace Alignment Encoding 8.3.2.4 TALIGN Description 00 Trigger at end of stored data 01 Trigger before storing data 10 Trace buffer entries before and after trigger 11 Reserved Debug Control Register2 (DBGC2) Address: 0x0023 R 7 6 5 4 0 0 0 0 0 0 0 3 0 1 CDCM W Reset 2 0 0 ABCM 0 0 0 = Unimplemented or Reserved Figure 8-6. Debug Control Register2 (DBGC2) Read: Anytime Write: Anytime the module is disarmed. This register configures the comparators for range matching. Table 8-15. DBGC2 Field Descriptions Field Description 3–2 CDCM[1:0] C and D Comparator Match Control — These bits determine the C and D comparator match mapping as described in Table 8-16. 1–0 ABCM[1:0] A and B Comparator Match Control — These bits determine the A and B comparator match mapping as described in Table 8-17. MC9S12XE-Family Reference Manual , Rev. 1.21 312 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-16. CDCM Encoding CDCM Description 00 Match2 mapped to comparator C match....... Match3 mapped to comparator D match. 01 Match2 mapped to comparator C/D inside range....... Match3 disabled. 10 Match2 mapped to comparator C/D outside range....... Match3 disabled. 11 Reserved(1) 1. Currently defaults to Match2 mapped to comparator C : Match3 mapped to comparator D Table 8-17. ABCM Encoding ABCM Description 00 Match0 mapped to comparator A match....... Match1 mapped to comparator B match. 01 Match 0 mapped to comparator A/B inside range....... Match1 disabled. 10 Match 0 mapped to comparator A/B outside range....... Match1 disabled. 11 Reserved(1) 1. Currently defaults to Match0 mapped to comparator A : Match1 mapped to comparator B 8.3.2.5 Debug Trace Buffer Register (DBGTBH:DBGTBL) Address: 0x0024, 0x0025 15 R W 14 13 12 11 10 9 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 8 7 6 5 4 3 2 1 0 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 POR X X X X X X X X X X X X X X X X Other Resets — — — — — — — — — — — — — — — — Figure 8-7. Debug Trace Buffer Register (DBGTB) Read: Only when unlocked AND not secured AND not armed AND with a TSOURCE bit set. Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer contents. Table 8-18. DBGTB Field Descriptions Field Description 15–0 Bit[15:0] Trace Buffer Data Bits — The Trace Buffer Register is a window through which the 64-bit wide data lines of the Trace Buffer may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer which points to the next address to be read. When the ARM bit is written to 1 the trace buffer is locked to prevent reading. The trace buffer can only be unlocked for reading by writing to DBGTB with an aligned word write when the module is disarmed. The DBGTB register can be read only as an aligned word, any byte reads or misaligned access of these registers will return 0 and will not cause the trace buffer pointer to increment to the next trace buffer address. The same is true for word reads while the debugger is armed. The POR state is undefined Other resets do not affect the trace buffer contents. . MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 313 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.6 Debug Count Register (DBGCNT) Address: 0x0026 7 R 6 5 4 0 3 2 1 0 — 0 — 0 — 0 CNT W Reset POR 0 0 — 0 — 0 — 0 — 0 = Unimplemented or Reserved Figure 8-8. Debug Count Register (DBGCNT) Read: Anytime Write: Never Table 8-19. DBGCNT Field Descriptions Field Description 6–0 CNT[6:0] Count Value — The CNT bits [6:0] indicate the number of valid data 64-bit data lines stored in the Trace Buffer. Table 8-20 shows the correlation between the CNT bits and the number of valid data lines in the Trace Buffer. When the CNT rolls over to zero, the TBF bit in DBGSR is set and incrementing of CNT will continue in endtrigger or mid-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a one. The DBGCNT register is cleared by power-on-reset initialization but is not cleared by other system resets. Thus should a reset occur during a debug session, the DBGCNT register still indicates after the reset, the number of valid trace buffer entries stored before the reset occurred. The DBGCNT register is not decremented when reading from the trace buffer. Table 8-20. CNT Decoding Table TBF (DBGSR) CNT[6:0] Description 0 0000000 No data valid 0 0000001 32 bits of one line valid(1) 0 0000010 0000100 0000110 .. 1111100 1 line valid 2 lines valid 3 lines valid .. 62 lines valid 0 1111110 63 lines valid 1 0000000 64 lines valid; if using Begin trigger alignment, ARM bit will be cleared and the tracing session ends. 64 lines valid, 0000010 oldest data has been overwritten by most recent data .. .. 1111110 1. This applies to Normal/Loop1/PurePC Modes when tracing from either CPU12X or XGATE only. 1 MC9S12XE-Family Reference Manual , Rev. 1.21 314 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.7 Debug State Control Registers There is a dedicated control register for each of the state sequencer states 1 to 3 that determines if transitions from that state are allowed, depending upon comparator matches or tag hits, and defines the next state for the state sequencer following a match. The three debug state control registers are located at the same address in the register address map (0x0027). Each register can be accessed using the COMRV bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag register (DBGMFR). Table 8-21. State Control Register Access Encoding 8.3.2.7.1 COMRV Visible State Control Register 00 DBGSCR1 01 DBGSCR2 10 DBGSCR3 11 DBGMFR Debug State Control Register 1 (DBGSCR1) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 W Reset 0 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Figure 8-9. Debug State Control Register 1 (DBGSCR1) Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the targeted next state whilst in State1. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1”. Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-22. DBGSCR1 Field Descriptions Field 3–0 SC[3:0] Description These bits select the targeted next state whilst in State1, based upon the match event. Table 8-23. State1 Sequencer Next State Selection SC[3:0] 0000 0001 0010 0011 Description Any match triggers to state2 Any match triggers to state3 Any match triggers to Final State Match2 triggers to State2....... Other matches have no effect MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 315 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-23. State1 Sequencer Next State Selection (continued) SC[3:0] 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Match2 triggers to State3....... Other matches have no effect Match2 triggers to Final State....... Other matches have no effect Match0 triggers to State2....... Match1 triggers to State3....... Other matches have no effect Match1 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match0 triggers to State2....... Match2 triggers to State3....... Other matches have no effect Match2 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match1 triggers to State2....... Match3 triggers to State3....... Other matches have no effect Match3 triggers to State3....... Match1 triggers to Final State....... Other matches have no effect Match3 has no effect....... All other matches (M0,M1,M2) trigger to State2 Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.2 Debug State Control Register 2 (DBGSCR2) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 W Reset 0 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Figure 8-10. Debug State Control Register 2 (DBGSCR2) Read: If COMRV[1:0] = 01 Write: If COMRV[1:0] = 01 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the targeted next state whilst in State2. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1”. Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-24. DBGSCR2 Field Descriptions Field 3–0 SC[3:0] Description These bits select the targeted next state whilst in State2, based upon the match event. Table 8-25. State2 —Sequencer Next State Selection SC[3:0] 0000 0001 Description Any match triggers to state1 Any match triggers to state3 MC9S12XE-Family Reference Manual , Rev. 1.21 316 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-25. State2 —Sequencer Next State Selection (continued) SC[3:0] 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Any match triggers to Final State Match3 triggers to State1....... Other matches have no effect Match3 triggers to State3....... Other matches have no effect Match3 triggers to Final State....... Other matches have no effect Match0 triggers to State1....... Match1 triggers to State3....... Other matches have no effect Match1 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match0 triggers to State1....... Match2 triggers to State3....... Other matches have no effect Match2 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match1 triggers to State1....... Match3 triggers to State3....... Other matches have no effect Match3 triggers to State3....... Match1 triggers Final State....... Other matches have no effect Match2 triggers to State1..... Match3 trigger to Final State Match2 has no affect, all other matches (M0,M1,M3) trigger to Final State Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.3 Debug State Control Register 3 (DBGSCR3) Address: 0x0027 R 7 6 5 4 0 0 0 0 0 0 0 W Reset 0 3 2 1 0 SC3 SC2 SC1 SC0 0 0 0 0 = Unimplemented or Reserved Figure 8-11. Debug State Control Register 3 (DBGSCR3) Read: If COMRV[1:0] = 10 Write: If COMRV[1:0] = 10 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 10. The state control register three selects the targeted next state whilst in State3. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1”. Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-26. DBGSCR3 Field Descriptions Field 3–0 SC[3:0] Description These bits select the targeted next state whilst in State3, based upon the match event. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 317 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-27. State3 — Sequencer Next State Selection SC[3:0] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Any match triggers to state1 Any match triggers to state2 Any match triggers to Final State Match0 triggers to State1....... Other matches have no effect Match0 triggers to State2....... Other matches have no effect Match0 triggers to Final State.......Match1 triggers to State1...Other matches have no effect Match1 triggers to State1....... Other matches have no effect Match1 triggers to State2....... Other matches have no effect Match1 triggers to Final State....... Other matches have no effect Match2 triggers to State2....... Match0 triggers to Final State....... Other matches have no effect Match1 triggers to State1....... Match3 triggers to State2....... Other matches have no effect Match3 triggers to State2....... Match1 triggers to Final State....... Other matches have no effect Match2 triggers to Final State....... Other matches have no effect Match3 triggers to Final State....... Other matches have no effect Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.4 Debug Match Flag Register (DBGMFR) Address: 0x0027 R 7 6 5 4 3 2 1 0 0 0 0 0 MC3 MC2 MC1 MC0 0 0 0 0 0 0 0 W Reset 0 = Unimplemented or Reserved Figure 8-12. Debug Match Flag Register (DBGMFR) Read: If COMRV[1:0] = 11 Write: Never DBGMFR is visible at 0x0027 only with COMRV[1:0] = 11. It features four flag bits each mapped directly to a channel. Should a match occur on the channel during the debug session, then the corresponding flag is set and remains set until the next time the module is armed by writing to the ARM bit. Thus the contents are retained after a debug session for evaluation purposes. These flags cannot be cleared by software, they are cleared only when arming the module. A set flag does not inhibit the setting of other flags. Once a flag is set, further triggers on the same channel have no affect. MC9S12XE-Family Reference Manual , Rev. 1.21 318 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8 Comparator Register Descriptions Each comparator has a bank of registers that are visible through an 8-byte window in the S12XDBG module register address map. Comparators A and C consist of 8 register bytes (3 address bus compare registers, two data bus compare registers, two data bus mask registers and a control register). Comparators B and D consist of four register bytes (three address bus compare registers and a control register). Each set of comparator registers is accessible in the same 8-byte window of the register address map and can be accessed using the COMRV bits in the DBGC1 register. If the Comparators B or D are accessed through the 8-byte window, then only the address and control bytes are visible, the 4 bytes associated with data bus and data bus masking read as zero and cannot be written. Furthermore the control registers for comparators B and D differ from those of comparators A and C. Table 8-28. Comparator Register Layout 0x0028 CONTROL Read/Write Comparators A,B,C,D 0x0029 ADDRESS HIGH Read/Write Comparators A,B,C,D 0x002A ADDRESS MEDIUM Read/Write Comparators A,B,C,D 0x002B ADDRESS LOW Read/Write Comparators A,B,C,D 0x002C DATA HIGH COMPARATOR Read/Write Comparator A and C only 0x002D DATA LOW COMPARATOR Read/Write Comparator A and C only 0x002E DATA HIGH MASK Read/Write Comparator A and C only 0x002F DATA LOW MASK Read/Write Comparator A and C only 8.3.2.8.1 Debug Comparator Control Register (DBGXCTL) The contents of this register bits 7 and 6 differ depending upon which comparator registers are visible in the 8-byte window of the DBG module register address map. Address: 0x0028 7 R 0 W Reset 0 6 5 4 3 2 1 0 NDB TAG BRK RW RWE SRC COMPE 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-13. Debug Comparator Control Register (Comparators A and C) Address: 0x0028 R W Reset 7 6 5 4 3 2 1 0 SZE SZ TAG BRK RW RWE SRC COMPE 0 0 0 0 0 0 0 0 Figure 8-14. Debug Comparator Control Register (Comparators B and D) Read: Anytime. See Table 8-29 for visible register encoding. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 319 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Write: If DBG not armed. See Table 8-29 for visible register encoding. The DBGC1_COMRV bits determine which comparator control, address, data and datamask registers are visible in the 8-byte window from 0x0028 to 0x002F as shown in Section Table 8-29. Table 8-29. Comparator Address Register Visibility COMRV Visible Comparator 00 DBGACTL, DBGAAH ,DBGAAM, DBGAAL, DBGADH, DBGADL, DBGADHM, DBGADLM 01 DBGBCTL, DBGBAH, DBGBAM, DBGBAL 10 DBGCCTL, DBGCAH, DBGCAM, DBGCAL, DBGCDH, DBGCDL, DBGCDHM, DBGCDLM 11 DBGDCTL, DBGDAH, DBGDAM, DBGDAL Table 8-30. DBGXCTL Field Descriptions Field Description 7 SZE (Comparators B and D) Size Comparator Enable Bit — The SZE bit controls whether access size comparison is enabled for the associated comparator. This bit is ignored if the TAG bit in the same register is set. 0 Word/Byte access size is not used in comparison 1 Word/Byte access size is used in comparison 6 NDB (Comparators A and C Not Data Bus — The NDB bit controls whether the match occurs when the data bus matches the comparator register value or when the data bus differs from the register value. Furthermore data bus bits can be individually masked using the comparator data mask registers. This bit is only available for comparators A and C. This bit is ignored if the TAG bit in the same register is set. This bit position has an SZ functionality for comparators B and D. 0 Match on data bus equivalence to comparator register contents 1 Match on data bus difference to comparator register contents 6 SZ (Comparators B and D) Size Comparator Value Bit — The SZ bit selects either word or byte access size in comparison for the associated comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set. This bit position has NDB functionality for comparators A and C 0 Word access size will be compared 1 Byte access size will be compared 5 TAG Tag Select — This bit controls whether the comparator match will cause a trigger or tag the opcode at the matched address. Tagged opcodes trigger only if they reach the execution stage of the instruction queue. 0 Trigger immediately on match 1 On match, tag the opcode. If the opcode is about to be executed a trigger is generated 4 BRK Break — This bit controls whether a channel match terminates a debug session immediately, independent of state sequencer state. To generate an immediate breakpoint the module breakpoints must be enabled using DBGBRK. 0 The debug session termination is dependent upon the state sequencer and trigger conditions. 1 A match on this channel terminates the debug session immediately; breakpoints if active are generated, tracing, if active, is terminated and the module disarmed. 3 RW Read/Write Comparator Value Bit — The RW bit controls whether read or write is used in compare for the associated comparator . The RW bit is not used if RWE = 0. 0 Write cycle will be matched 1 Read cycle will be matched 2 RWE Read/Write Enable Bit — The RWE bit controls whether read or write comparison is enabled for the associated comparator. This bit is not used for tagged operations. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison MC9S12XE-Family Reference Manual , Rev. 1.21 320 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-30. DBGXCTL Field Descriptions (continued) Field Description 1 SRC Determines mapping of comparator to CPU12X or XGATE 0 The comparator is mapped to CPU12X buses 1 The comparator is mapped to XGATE address and data buses 0 COMPE Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled for state sequence triggers or tag generation Table 8-31 shows the effect for RWE and RW on the comparison conditions. These bits are not useful for tagged operations since the trigger occurs based on the tagged opcode reaching the execution stage of the instruction queue. Thus these bits are ignored if tagged triggering is selected. Table 8-31. Read or Write Comparison Logic Table 8.3.2.8.2 RWE Bit RW Bit RW Signal Comment 0 x 0 RW not used in comparison 0 x 1 RW not used in comparison 1 0 0 Write 1 0 1 No match 1 1 0 No match 1 1 1 Read Debug Comparator Address High Register (DBGXAH) Address: 0x0029 7 R 0 W Reset 0 6 5 4 3 2 1 0 Bit 22 Bit 21 Bit 20 Bit 19 Bit 18 Bit 17 Bit 16 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 8-15. Debug Comparator Address High Register (DBGXAH) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-32. DBGXAH Field Descriptions Field Description 6–0 Bit[22:16] Comparator Address High Compare Bits — The Comparator address high compare bits control whether the selected comparator will compare the address bus bits [22:16] to a logic one or logic zero. This register byte is ignored for XGATE compares. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 321 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.3 Debug Comparator Address Mid Register (DBGXAM) Address: 0x002A R W Reset 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Figure 8-16. Debug Comparator Address Mid Register (DBGXAM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-33. DBGXAM Field Descriptions Field 7–0 Bit[15:8] Description Comparator Address Mid Compare Bits— The Comparator address mid compare bits control whether the selected comparator will compare the address bus bits [15:8] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 8.3.2.8.4 Debug Comparator Address Low Register (DBGXAL) Address: 0x002B R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 8-17. Debug Comparator Address Low Register (DBGXAL) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-34. DBGXAL Field Descriptions Field 7–0 Bits[7:0] Description Comparator Address Low Compare Bits — The Comparator address low compare bits control whether the selected comparator will compare the address bus bits [7:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12XE-Family Reference Manual , Rev. 1.21 322 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.5 Debug Comparator Data High Register (DBGXDH) Address: 0x002C R W Reset 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Figure 8-18. Debug Comparator Data High Register (DBGXDH) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-35. DBGXAH Field Descriptions Field Description 7–0 Bits[15:8] Comparator Data High Compare Bits — The Comparator data high compare bits control whether the selected comparator compares the data bus bits [15:8] to a logic one or logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators A and C. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one 8.3.2.8.6 Debug Comparator Data Low Register (DBGXDL) Address: 0x002D R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 8-19. Debug Comparator Data Low Register (DBGXDL) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-36. DBGXDL Field Descriptions Field Description 7–0 Bits[7:0] Comparator Data Low Compare Bits — The Comparator data low compare bits control whether the selected comparator compares the data bus bits [7:0] to a logic one or logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators A and C. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 323 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.7 Debug Comparator Data High Mask Register (DBGXDHM) Address: 0x002E R W Reset 7 6 5 4 3 2 1 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 0 0 0 0 0 0 0 Figure 8-20. Debug Comparator Data High Mask Register (DBGXDHM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-37. DBGXDHM Field Descriptions Field Description 7–0 Bits[15:8] Comparator Data High Mask Bits — The Comparator data high mask bits control whether the selected comparator compares the data bus bits [15:8] to the corresponding comparator data compare bits. This register is available only for comparators A and C. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 8.3.2.8.8 Debug Comparator Data Low Mask Register (DBGXDLM) Address: 0x002F R W Reset 7 6 5 4 3 2 1 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Figure 8-21. Debug Comparator Data Low Mask Register (DBGXDLM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-38. DBGXDLM Field Descriptions Field Description 7–0 Bits[7:0] Comparator Data Low Mask Bits — The Comparator data low mask bits control whether the selected comparator compares the data bus bits [7:0] to the corresponding comparator data compare bits. This register is available only for comparators A and C. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 8.4 Functional Description This section provides a complete functional description of the S12XDBG module. If the part is in secure mode, the S12XDBG module can generate breakpoints but tracing is not possible. MC9S12XE-Family Reference Manual , Rev. 1.21 324 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.1 S12XDBG Operation Arming the S12XDBG module by setting ARM in DBGC1 allows triggering, and storing of data in the trace buffer and can be used to cause breakpoints to the CPU12X or the XGATE module. The DBG module is made up of four main blocks, the comparators, control logic, the state sequencer, and the trace buffer. The comparators monitor the bus activity of the CPU12X and XGATE. Comparators can be configured to monitor address and databus. Comparators can also be configured to mask out individual data bus bits during a compare and to use R/W and word/byte access qualification in the comparison. When a match with a comparator register value occurs the associated control logic can trigger the state sequencer to another state (see Figure 8-22). Either forced or tagged triggers are possible. Using a forced trigger, the trigger is generated immediately on a comparator match. Using a tagged trigger, at a comparator match, the instruction opcode is tagged and only if the instruction reaches the execution stage of the instruction queue is a trigger generated. In the case of a transition to Final State, bus tracing is triggered and/or a breakpoint can be generated. Tracing of both CPU12X and/or XGATE bus activity is possible. Independent of the state sequencer, a breakpoint can be triggered by the external TAGHI / TAGLO signals or by an XGATE S/W breakpoint request or by writing to the TRIG bit in the DBGC1 control register. The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word reads. 8.4.2 Comparator Modes The S12XDBG contains four comparators, A, B, C, and D. Each comparator can be configured to monitor CPU12X or XGATE buses. Each comparator compares the selected address bus with the address stored in DBGXAH, DBGXAM, and DBGXAL. Furthermore, comparators A and C also compare the data buses to the data stored in DBGXDH, DBGXDL and allow masking of individual data bus bits. S12X comparator matches are disabled in BDM and during BDM accesses. The comparator match control logic configures comparators to monitor the buses for an exact address or an address range. The comparator configuration is controlled by the control register contents and the range control by the DBGC2 contents. On a match a trigger can initiate a transition to another state sequencer state (see Section 8.4.3”). The comparator control register also allows the type of access to be included in the comparison through the use of the RWE, RW, SZE, and SZ bits. The RWE bit controls whether read or write comparison is enabled for the associated comparator and the RW bit selects either a read or write access for a valid match. Similarly the SZE and SZ bits allows the size of access (word or byte) to be considered in the compare. Only comparators B and D feature SZE and SZ. The TAG bit in each comparator control register is used to determine the triggering condition. By setting TAG, the comparator will qualify a match with the output of opcode tracking logic and a trigger occurs before the tagged instruction executes (tagged-type trigger). Whilst tagging, the RW, RWE, SZE, and SZ bits are ignored and the comparator register must be loaded with the exact opcode address. If the TAG bit is clear (forced type trigger) a comparator match is generated when the selected address appears on the system address bus. If the selected address is an opcode address, the match is generated MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 325 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module when the opcode is fetched from the memory. This precedes the instruction execution by an indefinite number of cycles due to instruction pipe lining. For a comparator match of an opcode at an odd address when TAG = 0, the corresponding even address must be contained in the comparator register. Thus for an opcode at odd address (n), the comparator register must contain address (n–1). Once a successful comparator match has occurred, the condition that caused the original match is not verified again on subsequent matches. Thus if a particular data value is verified at a given address, this address may not still contain that data value when a subsequent match occurs. Comparators C and D can also be used to select an address range to trace from. This is determined by the TRANGE bits in the DBGTCR register. The TRANGE encoding is shown in Table 8-12. If the TRANGE bits select a range definition using comparator D, then comparator D is configured for trace range definition and cannot be used for address bus comparisons. Similarly if the TRANGE bits select a range definition using comparator C, then comparator C is configured for trace range definition and cannot be used for address bus comparisons. Match[0, 1, 2, 3] map directly to Comparators[A, B, C, D] respectively, except in range modes (see Section 8.3.2.4”). Comparator priority rules are described in the trigger priority section (Section 8.4.3.6”). 8.4.2.1 Exact Address Comparator Match (Comparators A and C) With range comparisons disabled, the match condition is an exact equivalence of address/data bus with the value stored in the comparator address/data registers. Further qualification of the type of access (R/W, word/byte) is possible. Comparators A and C do not feature SZE or SZ control bits, thus the access size is not compared. Table 840 lists access considerations without data bus compare. Table 8-39 lists access considerations with data bus comparison. To compare byte accesses DBGxDH must be loaded with the data byte, the low byte must be masked out using the DBGxDLM mask register. On word accesses the data byte of the lower address is mapped to DBGxDH. Table 8-39. Comparator A and C Data Bus Considerations Access Address DBGxDH DBGxDL DBGxDHM DBGxDLM Example Valid Match Word ADDR[n] Data[n] Byte ADDR[n] Data[n] Data[n+1] $FF $FF MOVW #$WORD ADDR[n] config1 x $FF $00 MOVB #$BYTE ADDR[n] config2 Word ADDR[n] Data[n] x $FF $00 MOVW #$WORD ADDR[n] config2 Word ADDR[n] x Data[n+1] $00 $FF MOVW #$WORD ADDR[n] config3 Code may contain various access forms of the same address, i.e. a word access of ADDR[n] or byte access of ADDR[n+1] both access n+1. At a word access of ADDR[n], address ADDR[n+1] does not appear on the address bus and so cannot cause a comparator match if the comparator contains ADDR[n]. Thus it is not possible to monitor all data accesses of ADDR[n+1] with one comparator. To detect an access of ADDR[n+1] through a word access of ADDR[n] the comparator can be configured to ADDR[n], DBGxDL is loaded with the data pattern and DBGxDHM is cleared so only the data[n+1] is compared on accesses of ADDR[n]. MC9S12XE-Family Reference Manual , Rev. 1.21 326 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module NOTE Using this configuration, a byte access of ADDR[n] can cause a comparator match if the databus low byte by chance contains the same value as ADDR[n+1] because the databus comparator does not feature access size comparison and uses the mask as a “don’t care” function. Thus masked bits do not prevent a match. Comparators A and C feature an NDB control bit to determine if a match occurs when the data bus differs to comparator register contents or when the data bus is equivalent to the comparator register contents. 8.4.2.2 Exact Address Comparator Match (Comparators B and D) Comparators B and D feature SZ and SZE control bits. If SZE is clear, then the comparator address match qualification functions the same as for comparators A and C. If the SZE bit is set the access size (word or byte) is compared with the SZ bit value such that only the specified type of access causes a match. Thus if configured for a byte access of a particular address, a word access covering the same address does not lead to match. Table 8-40. Comparator Access Size Considerations Comparator Address SZE SZ8 Condition For Valid Match Comparators A and C ADDR[n] — — Word and byte accesses of ADDR[n](1) MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] Comparators B and D ADDR[n] 0 X Word and byte accesses of ADDR[n]1 MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] Comparators B and D ADDR[n] 1 0 Word accesses of ADDR[n]1 MOVW #$WORD ADDR[n] Comparators ADDR[n] 1 1 Byte accesses of ADDR[n] B and D MOVB #$BYTE ADDR[n] 1. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain the exact address used in the code. 8.4.2.3 Data Bus Comparison NDB Dependency Comparators A and C each feature an NDB control bit, which allows data bus comparators to be configured to either trigger on equivalence or trigger on difference. This allows monitoring of a difference in the contents of an address location from an expected value. When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by clearing the corresponding mask bit (DBGxDHM/DBGxDLM), so that it is ignored in the comparison. A match occurs when all data bus bits with corresponding mask bits set are equivalent. If all mask register bits are clear, then a match is based on the address bus only, the data bus is ignored. When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any data bus bit with corresponding mask bit set is different. Clearing all mask bits, causes all bits to be ignored and prevents a match because no difference can be detected. In this case address bus equivalence does not cause a match. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 327 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-41. NDB and MASK bit dependency 8.4.2.4 NDB DBGxDHM[n] / DBGxDLM[n] Comment 0 0 Do not compare data bus bit. 0 1 Compare data bus bit. Match on equivalence. 1 0 Do not compare data bus bit. 1 1 Compare data bus bit. Match on difference. Range Comparisons When using the AB comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator A data and data mask registers. Furthermore the DBGACTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access. The corresponding DBGBCTL bits are ignored. Similarly when using the CD comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator C data and data mask registers. Furthermore the DBGCCTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access if tagging is not selected. The corresponding DBGDCTL bits are ignored. The SZE and SZ control bits are ignored in range mode. The comparator A and C TAG bits are used to tag range comparisons for the AB and CD ranges respectively. The comparator B and D TAG bits are ignored in range modes. In order for a range comparison using comparators A and B, both COMPEA and COMPEB must be set; to disable range comparisons both must be cleared. Similarly for a range CD comparison, both COMPEC and COMPED must be set. If a range mode is selected SRCA and SRCC select the source (S12X or XGATE), SRCB and SRCD are ignored. The comparator A and C BRK bits are used for the AB and CD ranges respectively, the comparator B and D BRK bits are ignored in range mode. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. 8.4.2.4.1 Inside Range (CompAC_Addr ≤ address ≤ CompBD_Addr) In the Inside Range comparator mode, either comparator pair A and B or comparator pair C and D can be configured for range comparisons by the control register (DBGC2). The match condition requires that a valid match for both comparators happens on the same bus cycle. A match condition on only one comparator is not valid. An aligned word access which straddles the range boundary will cause a trigger only if the aligned address is inside the range. 8.4.2.4.2 Outside Range (address < CompAC_Addr or address > CompBD_Addr) In the Outside Range comparator mode, either comparator pair A and B or comparator pair C and D can be configured for range comparisons. A single match condition on either of the comparators is recognized as valid. An aligned word access which straddles the range boundary will cause a trigger only if the aligned address is outside the range. Outside range mode in combination with tagged triggers can be used to detect if the opcode fetches are from an unexpected range. In forced trigger modes the outside range trigger would typically be activated at any interrupt vector fetch or register access. This can be avoided by setting the upper or lower range limit to $7FFFFF or $000000 respectively. Interrupt vector fetches do not cause taghits MC9S12XE-Family Reference Manual , Rev. 1.21 328 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module When comparing the XGATE address bus in outside range mode, the initial vector fetch as determined by the vector contained in the XGATE XGVBR register should be taken into consideration. The XGVBR register and hence vector address can be modified. 8.4.3 Trigger Modes Trigger modes are used as qualifiers for a state sequencer change of state. The control logic determines the trigger mode and provides a trigger to the state sequencer. The individual trigger modes are described in the following sections. 8.4.3.1 Forced Trigger On Comparator Match If a forced trigger comparator match occurs, the trigger immediately initiates a transition to the next state sequencer state whereby the corresponding flags in DBGSR are set. The state control register for the current state determines the next state for each trigger. Forced triggers are generated as soon as the matching address appears on the address bus, which in the case of opcode fetches occurs several cycles before the opcode execution. For this reason a forced trigger at an opcode address precedes a tagged trigger at the same address by several cycles. 8.4.3.2 Trigger On Comparator Related Taghit If a CPU12X or XGATE taghit occurs, a transition to another state sequencer state is initiated and the corresponding DBGSR flags are set. For a comparator related taghit to occur, the S12XDBG must first generate tags based on comparator matches. When the tagged instruction reaches the execution stage of the instruction queue a taghit is generated by the CPU12X/XGATE. The state control register for the current state determines the next state for each trigger. 8.4.3.3 External Tagging Trigger The TAGLO and TAGHI pins (mapped to device pins) can be used to tag an instruction. This function can be used as another breakpoint source. When the tagged opcode reaches the execution stage of the instruction queue a transition to the disarmed state0 occurs, ending the debug session and generating a breakpoint, if breakpoints are enabled. External tagging is only possible in device emulation modes. 8.4.3.4 Trigger On XGATE S/W Breakpoint Request The XGATE S/W breakpoint request issues a forced breakpoint request to the CPU12X immediately and triggers the state sequencer into the disarmed state. Active tracing sessions are terminated immediately, thus if tracing has not yet begun, no trace information is stored. XGATE generated breakpoints are independent of the DBGBRK bits. The XGSBPE bit in DBGC1 determines if the XGATE S/W breakpoint function is enabled. The BDM bit in DBGC1 determines if the XGATE requested breakpoint causes the system to enter BDM Mode or initiate a software interrupt (SWI). 8.4.3.5 TRIG Immediate Trigger Independent of comparator matches or external tag signals it is possible to initiate a tracing session and/or breakpoint by writing the TRIG bit in DBGC1 to a logic “1”. If configured for begin or mid aligned tracing, MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 329 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module this triggers the state sequencer into the Final State, if configured for end alignment, setting the TRIG bit disarms the module, ending the session. If breakpoints are enabled, a forced breakpoint request is issued immediately (end alignment) or when tracing has completed (begin or mid alignment). 8.4.3.6 Trigger Priorities In case of simultaneous triggers, the priority is resolved according to Table 8-42. The lower priority trigger is suppressed. It is thus possible to miss a lower priority trigger if it occurs simultaneously with a trigger of a higher priority. The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches in each state sequencer state. When configured for range modes a simultaneous match of comparators A and C generates an active match0 whilst match2 is suppressed. If a write access to DBGC1 with the ARM bit position set occurs simultaneously to a hardware disarm from an internal trigger event, then the ARM bit is cleared due to the hardware disarm. Table 8-42. Trigger Priorities Priority Source Action Highest XGATE BKP Immediate forced breakpoint......(Tracing terminated immediately). TRIG Trigger immediately to final state (begin or mid aligned tracing enabled) Trigger immediately to state 0 (end aligned or no tracing enabled) External TAGHI/TAGLO Enter State0 Match0 (force or tag hit) Trigger to next state as defined by state control registers Match1 (force or tag hit) Trigger to next state as defined by state control registers Match2 (force or tag hit) Trigger to next state as defined by state control registers Match3 (force or tag hit) Trigger to next state as defined by state control registers Lowest 8.4.4 State Sequence Control ARM = 0 State 0 (Disarmed) ARM = 1 State1 State2 ARM = 0 Session Complete (Disarm) Final State State3 ARM = 0 Figure 8-22. State Sequencer Diagram The state sequencer allows a defined sequence of events to provide a trigger point for tracing of data in the trace buffer. Once the S12XDBG module has been armed by setting the ARM bit in the DBGC1 register, MC9S12XE-Family Reference Manual , Rev. 1.21 330 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module then state1 of the state sequencer is entered. Further transitions between the states are then controlled by the state control registers and depend upon a selected trigger mode condition being met. From Final State the only permitted transition is back to the disarmed state0. Transition between any of the states 1 to 3 is not restricted. Each transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current state. Alternatively by setting the TRIG bit in DBGSC1, the state machine can be triggered to state0 or Final State depending on tracing alignment. A tag hit through TAGHI/TAGLO brings the state sequencer immediately into state0, causes a breakpoint, if breakpoints are enabled, and ends tracing immediately independent of the trigger alignment bits TALIGN[1:0]. Independent of the state sequencer, each comparator channel can be individually configured to generate an immediate breakpoint when a match occurs through the use of the BRK bits in the DBGxCTL registers. Thus it is possible to generate an immediate breakpoint on selected channels, whilst a state sequencer transition can be initiated by a match on other channels. If a debug session is ended by a trigger on a channel with BRK = 1, the state sequencer transitions through Final State for a clock cycle to state0. This is independent of tracing and breakpoint activity, thus with tracing and breakpoints disabled, the state sequencer enters state0 and the debug module is disarmed. An XGATE S/W breakpoint request, if enabled causes a transition to the State0 and generates a breakpoint request to the CPU12X immediately 8.4.4.1 Final State On entering Final State a trigger may be issued to the trace buffer according to the trace position control as defined by the TALIGN field (see Section 8.3.2.3”). If TSOURCE in the trace control register DBGTCR are cleared then the trace buffer is disabled and the transition to Final State can only generate a breakpoint request. In this case or upon completion of a tracing session when tracing is enabled, the ARM bit in the DBGC1 register is cleared, returning the module to the disarmed state0. If tracing is enabled, a breakpoint request can occur at the end of the tracing session. If neither tracing nor breakpoints are enabled then when the final state is reached it returns automatically to state0 and the debug module is disarmed. 8.4.5 Trace Buffer Operation The trace buffer is a 64 lines deep by 64-bits wide RAM array. The S12XDBG module stores trace information in the RAM array in a circular buffer format. The RAM array can be accessed through a register window (DBGTBH:DBGTBL) using 16-bit wide word accesses. After each complete 64-bit trace buffer line is read, an internal pointer into the RAM is incremented so that the next read will receive fresh information. Data is stored in the format shown in Table 8-43. After each store the counter register bits DBGCNT[6:0] are incremented. Tracing of CPU12X activity is disabled when the BDM is active but tracing of XGATE activity is still possible. Reading the trace buffer whilst the DBG is armed returns invalid data and the trace buffer pointer is not incremented. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 331 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.1 Trace Trigger Alignment Using the TALIGN bits (see Section 8.3.2.3”) it is possible to align the trigger with the end, the middle, or the beginning of a tracing session. If End or Mid tracing is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered. The transition to Final State if End is selected signals the end of the tracing session. The transition to Final State if Mid is selected signals that another 32 lines will be traced before ending the tracing session. Tracing with Begin-Trigger starts at the opcode of the trigger. 8.4.5.1.1 Storing with Begin-Trigger Storing with Begin-Trigger, data is not stored in the Trace Buffer until the Final State is entered. Once the trigger condition is met the S12XDBG module will remain armed until 64 lines are stored in the Trace Buffer. If the trigger is at the address of the change-of-flow instruction the change of flow associated with the trigger will be stored in the Trace Buffer. Using Begin-trigger together with tagging, if the tagged instruction is about to be executed then the trace is started. Upon completion of the tracing session the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary. 8.4.5.1.2 Storing with Mid-Trigger Storing with Mid-Trigger, data is stored in the Trace Buffer as soon as the S12XDBG module is armed. When the trigger condition is met, another 32 lines will be traced before ending the tracing session, irrespective of the number of lines stored before the trigger occurred, then the S12XDBG module is disarmed and no more data is stored. Using Mid-trigger with tagging, if the tagged instruction is about to be executed then the trace is continued for another 32 lines. Upon tracing completion the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary. 8.4.5.1.3 Storing with End-Trigger Storing with End-Trigger, data is stored in the Trace Buffer until the Final State is entered, at which point the S12XDBG module will become disarmed and no more data will be stored. If the trigger is at the address of a change of flow instruction the trigger event will not be stored in the Trace Buffer. 8.4.5.2 Trace Modes The S12XDBG module can operate in four trace modes. The mode is selected using the TRCMOD bits in the DBGTCR register. In each mode tracing of XGATE or CPU12X information is possible. The source for the trace is selected using the TSOURCE bits in the DBGTCR register. The modes are described in the following subsections. The trace buffer organization is shown in Table 8-43. 8.4.5.2.1 Normal Mode In Normal Mode, change of flow (COF) program counter (PC) addresses will be stored. COF addresses are defined as follows for the CPU12X: • Source address of taken conditional branches (long, short, bit-conditional, and loop primitives) • Destination address of indexed JMP, JSR, and CALL instruction MC9S12XE-Family Reference Manual , Rev. 1.21 332 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module • • Destination address of RTI, RTS, and RTC instructions. Vector address of interrupts, except for SWI and BDM vectors LBRA, BRA, BSR, BGND as well as non-indexed JMP, JSR, and CALL instructions are not classified as change of flow and are not stored in the trace buffer. COF addresses are defined as follows for the XGATE: • Source address of taken conditional branches • Destination address of indexed JAL instructions. • First XGATE code address in a thread Change-of-flow addresses stored include the full 23-bit address bus of CPU12X, the 16-bit address bus for the XGATE module and an information byte, which contains a source/destination bit to indicate whether the stored address was a source address or destination address. NOTE When an CPU12X COF instruction with destination address is executed, the destination address is stored to the trace buffer on instruction completion, indicating the COF has taken place. If an interrupt occurs simultaneously then the next instruction carried out is actually from the interrupt service routine. The instruction at the destination address of the original program flow gets exectuted after the interrupt service routine. In the following example an IRQ interrupt occurs during execution of the indexed JMP at address MARK1. The BRN at the destination (SUB_1) is not executed until after the IRQ service routine but the destination address is entered into the trace buffer to indicate that the indexed JMP COF has taken place. MARK1 MARK2 LDX JMP NOP #SUB_1 0,X SUB_1 BRN * ADDR1 NOP DBNE A,PART5 IRQ_ISR LDAB STAB RTI #$F0 VAR_C1 ; IRQ interrupt occurs during execution of this ; ; JMP Destination address TRACE BUFFER ENTRY 1 ; RTI Destination address TRACE BUFFER ENTRY 3 ; ; Source address TRACE BUFFER ENTRY 4 ; IRQ Vector $FFF2 = TRACE BUFFER ENTRY 2 ; The execution flow taking into account the IRQ is as follows MARK1 IRQ_ISR SUB_1 ADDR1 LDX JMP LDAB STAB RTI BRN NOP DBNE #SUB_1 0,X #$F0 VAR_C1 ; ; ; * A,PART5 ; ; MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 333 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.2.2 Loop1 Mode Loop1 Mode, similarly to Normal Mode also stores only COF address information to the trace buffer, it however allows the filtering out of redundant information. The intent of Loop1 Mode is to prevent the Trace Buffer from being filled entirely with duplicate information from a looping construct such as delays using the DBNE instruction or polling loops using BRSET/BRCLR instructions. Immediately after address information is placed in the Trace Buffer, the S12XDBG module writes this value into a background register. This prevents consecutive duplicate address entries in the Trace Buffer resulting from repeated branches. Loop1 Mode only inhibits consecutive duplicate source address entries that would typically be stored in most tight looping constructs. It does not inhibit repeated entries of destination addresses or vector addresses, since repeated entries of these would most likely indicate a bug in the user’s code that the S12XDBG module is designed to help find. 8.4.5.2.3 Detail Mode In Detail Mode, address and data for all memory and register accesses is stored in the trace buffer. In the case of XGATE tracing this means that initialization of the R1 register during a vector fetch is not traced. This mode also features information byte entries to the trace buffer, for each address byte entry. The information byte indicates the size of access (word or byte) and the type of access (read or write). When tracing CPU12X activity in Detail Mode, all cycles are traced except those when the CPU12X is either in a free or opcode fetch cycle. In this mode the XGATE program counter is also traced to provide a snapshot of the XGATE activity. CXINF information byte bits indicate the type of XGATE activity occurring at the time of the trace buffer entry. When tracing CPU12X activity alone in Detail Mode, the address range can be limited to a range specified by the TRANGE bits in DBGTCR. This function uses comparators C and D to define an address range inside which CPU12X activity should be traced (see Table 8-43). Thus the traced CPU12X activity can be restricted to particular register range accesses. When tracing XGATE activity in Detail Mode, all load and store cycles are traced. Additionally the CPU12X program counter is stored at the time of the XGATE trace buffer entry to provide a snapshot of CPU12X activity. 8.4.5.2.4 Pure PC Mode In Pure PC Mode, tracing from the CPU the PC addresses of all executed opcodes, including illegal opcodes, are stored. In Pure PC Mode, tracing from the XGATE the PC addresses of all executed opcodes are stored. 8.4.5.3 Trace Buffer Organization Referring to Table 8-43. An X prefix denotes information from the XGATE module, a C prefix denotes information from the CPU12X. ADRH, ADRM, ADRL denote address high, middle and low byte respectively. INF bytes contain control information (R/W, S/D etc.). The numerical suffix indicates which tracing step. The information format for Loop1 Mode and PurePC Mode is the same as that of Normal Mode. Whilst tracing from XGATE or CPU12X only, in Normal or Loop1 modes each array line contains MC9S12XE-Family Reference Manual , Rev. 1.21 334 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 2 data entries, thus in this case the DBGCNT[0] is incremented after each separate entry. In Detail mode DBGCNT[0] remains cleared whilst the other DBGCNT bits are incremented on each trace buffer entry. XGATE and CPU12X COFs occur independently of each other and the profile of COFs for the two sources is totally different. When both sources are being traced in Normal or Loop1 mode, for each COF from one source, there may be many COFs from the other source, depending on user code. COF events could occur far from each other in the time domain, on consecutive cycles or simultaneously. When a COF occurs in either source (S12X or XGATE) a trace buffer entry is made and the corresponding CDV or XDV bit is set. The current PC of the other source is simultaneously stored to the trace buffer even if no COF has occurred, in which case CDV/XDV remains cleared indicating the address is not associated with a COF, but is simply a snapshot of the PC contents at the time of the COF from the other source. Single byte data accesses in Detail Mode are always stored to the low byte of the trace buffer (CDATAL or XDATAL) and the high byte is cleared. When tracing word accesses, the byte at the lower address is always stored to trace buffer byte3 and the byte at the higher address is stored to byte2 Table 8-43. Trace Buffer Organization Mode 8-Byte Wide Word Buffer 7 6 5 4 3 2 1 0 XGATE Detail CXINF1 CADRH1 CADRM1 CADRL1 XDATAH1 XDATAL1 XADRM1 XADRL1 CXINF2 CADRH2 CADRM2 CADRL2 XDATAH2 XDATAL2 XADRM2 XADRL2 CPU12X Detail CXINF1 CADRH1 CADRM1 CADRL1 CDATAH1 CDATAL1 XADRM1 XADRL1 CXINF2 CADRH2 CADRM2 CADRL2 CDATAH2 CDATAL2 XADRM2 XADRL2 Both Other Modes XINF0 XPCM0 XPCL0 CINF0 CPCH0 CPCM0 CPCL0 XINF1 XPCM1 XPCL1 CINF1 CPCH1 CPCM1 CPCL1 XGATE Other Modes XINF1 XPCM1 XPCL1 XINF0 XPCM0 XPCL0 XINF3 XPCM3 XPCL3 XINF2 XPCM2 XPCL2 CPU12X Other Modes CINF1 CPCH1 CPCM1 CPCL1 CINF0 CPCH0 CPCM0 CPCL0 CINF3 CPCH3 CPCM3 CPCL3 CINF2 CPCH2 CPCM2 CPCL2 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 335 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.3.1 Information Byte Organization The format of the control information byte is dependent upon the active trace mode as described below. In Normal, Loop1, or Pure PC modes tracing of XGATE activity, XINF is used to store control information. In Normal, Loop1, or Pure PC modes tracing of CPU12X activity, CINF is used to store control information. In Detail Mode, CXINF contains the control information XGATE Information Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 XSD XSOT XCOT XDV 0 0 0 0 Figure 8-23. XGATE Information Byte XINF Table 8-44. XINF Field Descriptions Field Description 7 XSD Source Destination Indicator — This bit indicates if the corresponding stored address is a source or destination address. This is only used in Normal and Loop1 mode tracing. 0 Source address 1 Destination address or Start of Thread or Continuation of Thread 6 XSOT Start Of Thread Indicator — This bit indicates that the corresponding stored address is a start of thread address. This is only used in Normal and Loop1 mode tracing. NOTE. This bit only has effect on devices where the XGATE module supports multiple interrupt levels. 0 Stored address not from a start of thread 1 Stored address from a start of thread 5 XCOT Continuation Of Thread Indicator — This bit indicates that the corresponding stored address is the first address following a return from a higher priority thread. This is only used in Normal and Loop1 mode tracing. NOTE. This bit only has effect on devices where the XGATE module supports multiple interrupt levels. 0 Stored address not from a continuation of thread 1 Stored address from a continuation of thread 4 XDV Data Invalid Indicator — This bit indicates if the trace buffer entry is invalid. It is only used when tracing from both sources in Normal, Loop1 and Pure PC modes, to indicate that the XGATE trace buffer entry is valid. 0 Trace buffer entry is invalid 1 Trace buffer entry is valid XGATE info bit setting XGATE FLOW SOT1 SOT2 JAL RTS COT1 RTS XSD XSOT XCOT Figure 8-24. XGATE info bit setting Figure 8-24 indicates the XGATE information bit setting when switching between threads, the initial thread starting at SOT1 and continuing at COT1 after the higher priority thread2 has ended. MC9S12XE-Family Reference Manual , Rev. 1.21 336 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module CPU12X Information Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 CSD CVA 0 CDV 0 0 0 0 Figure 8-25. CPU12X Information Byte CINF Table 8-45. CINF Field Descriptions Field Description 7 CSD Source Destination Indicator — This bit indicates if the corresponding stored address is a source or destination address. This is only used in Normal and Loop1 mode tracing. 0 Source address 1 Destination address 6 CVA Vector Indicator — This bit indicates if the corresponding stored address is a vector address.. Vector addresses are destination addresses, thus if CVA is set, then the corresponding CSD is also set. This is only used in Normal and Loop1 mode tracing. This bit has no meaning in Pure PC mode. 0 Indexed jump destination address 1 Vector destination address 4 CDV Data Invalid Indicator — This bit indicates if the trace buffer entry is invalid. It is only used when tracing from both sources in Normal, Loop1 and Pure PC modes, to indicate that the CPU12X trace buffer entry is valid. 0 Trace buffer entry is invalid 1 Trace buffer entry is valid CXINF Information Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 CFREE CSZ CRW COCF XACK XSZ XRW XOCF Figure 8-26. Information Byte CXINF This describes the format of the information byte used only when tracing in Detail Mode. When tracing from the CPU12X in Detail Mode, information is stored to the trace buffer on all cycles except opcode fetch and free cycles. The XGATE entry stored on the same line is a snapshot of the XGATE program counter. In this case the CSZ and CRW bits indicate the type of access being made by the CPU12X, whilst the XACK and XOCF bits indicate if the simultaneous XGATE cycle is a free cycle (no bus acknowledge) or opcode fetch cycle. Similarly when tracing from the XGATE in Detail Mode, information is stored to the trace buffer on all cycles except opcode fetch and free cycles. The CPU12X entry stored on the same line is a snapshot of the CPU12X program counter. In this case the XSZ and XRW bits indicate the type of access being made by the XGATE, whilst the CFREE and COCF bits indicate if the simultaneous CPU12X cycle is a free cycle or opcode fetch cycle. Table 8-46. CXINF Field Descriptions Field Description 7 CFREE CPU12X Free Cycle Indicator — This bit indicates if the stored CPU12X address corresponds to a free cycle. This bit only contains valid information when tracing the XGATE accesses in Detail Mode. 0 Stored information corresponds to free cycle 1 Stored information does not correspond to free cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 337 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-46. CXINF Field Descriptions (continued) Field Description 6 CSZ Access Type Indicator — This bit indicates if the access was a byte or word size access.This bit only contains valid information when tracing CPU12X activity in Detail Mode. 0 Word Access 1 Byte Access 5 CRW Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write access. This bit only contains valid information when tracing CPU12X activity in Detail Mode. 0 Write Access 1 Read Access 4 COCF CPU12X Opcode Fetch Indicator — This bit indicates if the stored address corresponds to an opcode fetch cycle. This bit only contains valid information when tracing the XGATE accesses in Detail Mode. 0 Stored information does not correspond to opcode fetch cycle 1 Stored information corresponds to opcode fetch cycle 3 XACK XGATE Access Indicator — This bit indicates if the stored XGATE address corresponds to a free cycle. This bit only contains valid information when tracing the CPU12X accesses in Detail Mode. 0 Stored information corresponds to free cycle 1 Stored information does not correspond to free cycle 2 XSZ Access Type Indicator — This bit indicates if the access was a byte or word size access. This bit only contains valid information when tracing XGATE activity in Detail Mode. 0 Word Access 1 Byte Access 1 XRW Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write access. This bit only contains valid information when tracing XGATE activity in Detail Mode. 0 Write Access 1 Read Access 0 XOCF XGATE Opcode Fetch Indicator — This bit indicates if the stored address corresponds to an opcode fetch cycle.This bit only contains valid information when tracing the CPU12X accesses in Detail Mode. 0 Stored information does not correspond to opcode fetch cycle 1 Stored information corresponds to opcode fetch cycle 8.4.5.4 Reading Data from Trace Buffer The data stored in the Trace Buffer can be read using either the background debug module (BDM) module, the XGATE or the CPU12X provided the S12XDBG module is not armed, is configured for tracing and the system not secured. When the ARM bit is written to 1 the trace buffer is locked to prevent reading. The trace buffer can only be unlocked for reading by an aligned word write to DBGTB when the module is disarmed. The Trace Buffer can only be read through the DBGTB register using aligned word reads, any byte or misaligned reads return 0 and do not cause the trace buffer pointer to increment to the next trace buffer address. The Trace Buffer data is read out first-in first-out. By reading CNT in DBGCNT the number of valid 64-bit lines can be determined. DBGCNT will not decrement as data is read. Whilst reading an internal pointer is used to determine the next line to be read. After a tracing session, the pointer points to the oldest data entry, thus if no overflow has occurred, the pointer points to line0, otherwise it points to the line with the oldest entry. The pointer is initialized by each aligned write to DBGTBH to point to the oldest data again. This enables an interrupted trace buffer read sequence to be easily restarted from the oldest data entry. MC9S12XE-Family Reference Manual , Rev. 1.21 338 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module The least significant word of each 64-bit wide array line is read out first. This corresponds to the bytes 1 and 0 of Table 8-43. The bytes containing invalid information (shaded in Table 8-43) are also read out. Reading the Trace Buffer while the S12XDBG module is armed will return invalid data and no shifting of the RAM pointer will occur. 8.4.5.5 Trace Buffer Reset State The Trace Buffer contents are not initialized by a system reset. Thus should a system reset occur, the trace session information from immediately before the reset occurred can be read out. The DBGCNT bits are not cleared by a system reset. Thus should a reset occur, the number of valid lines in the trace buffer is indicated by DBGCNT. The internal pointer to the current trace buffer address is initialized by unlocking the trace buffer thus points to the oldest valid data even if a reset occurred during the tracing session. Generally debugging occurrences of system resets is best handled using mid or end trigger alignment since the reset may occur before the trace trigger, which in the begin trigger alignment case means no information would be stored in the trace buffer. NOTE An external pin RESET that occurs simultaneous to a trace buffer entry can, in very seldom cases, lead to either that entry being corrupted or the first entry of the session being corrupted. In such cases the other contents of the trace buffer still contain valid tracing information. The case occurs when the reset assertion coincides with the trace buffer entry clock edge. 8.4.6 Tagging A tag follows program information as it advances through the instruction queue. When a tagged instruction reaches the head of the queue a tag hit occurs and triggers the state sequencer. Each comparator control register features a TAG bit, which controls whether the comparator match will cause a trigger immediately or tag the opcode at the matched address. If a comparator is enabled for tagged comparisons, the address stored in the comparator match address registers must be an opcode address for the trigger to occur. Both CPU12X and XGATE opcodes can be tagged with the comparator register TAG bits. Using Begin trigger together with tagging, if the tagged instruction is about to be executed then the transition to the next state sequencer state occurs. If the transition is to the Final State, tracing is started. Only upon completion of the tracing session can a breakpoint be generated. Similarly using Mid trigger with tagging, if the tagged instruction is about to be executed then the trace is continued for another 32 lines. Upon tracing completion the breakpoint is generated. Using End trigger, when the tagged instruction is about to be executed and the next transition is to Final State then a breakpoint is generated immediately, before the tagged instruction is carried out. Read/Write (R/W), access size (SZ) monitoring and data bus monitoring is not useful if tagged triggering is selected, since the tag is attached to the opcode at the matched address and is not dependent on the data bus nor on the type of access. Thus these bits are ignored if tagged triggering is selected. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 339 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module S12X tagging is disabled when the BDM becomes active. XGATE tagging is possible when the BDM is active. 8.4.6.1 External Tagging using TAGHI and TAGLO External tagging using the external TAGHI and TAGLO pins can only be used to tag CPU12X opcodes; tagging of XGATE code using these pins is not possible. An external tag triggers the state sequencer into state0 when the tagged opcode reaches the execution stage of the instruction queue. The pins operate independently, thus the state of one pin does not affect the function of the other. External tagging is possible in emulation modes only. The presence of logic level 0 on either pin at the rising edge of the external clock (ECLK) performs the function indicated in the Table 8-47. It is possible to tag both bytes of an instruction word. If a taghit occurs, a breakpoint can be generated as defined by the DBGBRK and BDM bits in DBGC1. Each time TAGHI or TAGLO are low on the rising edge of ECLK, the old tag is replaced by a new one. Table 8-47. Tag Pin Function TAGHI 1 1 0 0 8.4.6.2 TAGLO 1 0 1 0 Tag No tag Low byte High byte Both bytes Unconditional Tagging Function In emulation modes a low assertion of PE5/TAGLO/MODA in the 7th or 8th bus cycle after reset enables the unconditional tagging function, allowing immediate tagging via TAGHI/TAGLO with breakpoint to BDM independent of the ARM, BDM and DBGBRK bits. Conversely these bits are not affected by unconditional tagging. The unconditional tagging function remains enabled until the next reset. This function allows an immediate entry to BDM in emulation modes before user code execution. The TAGLO assertion must be in the 7th or 8th bus cycle following the end of reset, whereby the prior RESET pin assertion lasts the full 192 bus cycles. 8.4.7 Breakpoints Breakpoints can be generated as follows. • Through XGATE software breakpoint requests. • From comparator channel triggers to final state. • Using software to write to the TRIG bit in the DBGC1 register. • From taghits generated using the external TAGHI and TAGLO pins. Breakpoints generated by the XGATE module or via the BDM BACKGROUND command have no affect on the CPU12X in STOP or WAIT mode. MC9S12XE-Family Reference Manual , Rev. 1.21 340 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.7.1 XGATE Software Breakpoints The XGATE software breakpoint instruction BRK can request a CPU12X breakpoint, via the S12XDBG module. In this case, if the XGSBPE bit is set, the S12XDBG module immediately generates a forced breakpoint request to the CPU12X, the state sequencer is returned to state0 and tracing, if active, is terminated. If configured for BEGIN trigger and tracing has not yet been triggered from another source, the trace buffer contains no information. Breakpoint requests from the XGATE module do not depend upon the state of the DBGBRK or ARM bits in DBGC1. They depend solely on the state of the XGSBPE and BDM bits. Thus it is not necessary to ARM the DBG module to use XGATE software breakpoints to generate breakpoints in the CPU12X program flow, but it is necessary to set XGSBPE. Furthermore, if a breakpoint to BDM is required, the BDM bit must also be set. When the XGATE requests an CPU12X breakpoint, the XGATE program flow stops by default, independent of the S12XDBG module. 8.4.7.2 Breakpoints From Internal Comparator Channel Final State Triggers Breakpoints can be generated when internal comparator channels trigger the state sequencer to the Final State. If configured for tagging, then the breakpoint is generated when the tagged opcode reaches the execution stage of the instruction queue. If a tracing session is selected by TSOURCE, breakpoints are requested when the tracing session has completed, thus if Begin or Mid aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 8-48). If no tracing session is selected, breakpoints are requested immediately. If the BRK bit is set on the triggering channel, then the breakpoint is generated immediately independent of tracing trigger alignment. Table 8-48. Breakpoint Setup For Both XGATE and CPU12X Breakpoints BRK TALIGN DBGBRK[n] Breakpoint Alignment 0 00 0 Fill Trace Buffer until trigger (no breakpoints — keep running) 0 00 1 Fill Trace Buffer until trigger, then breakpoint request occurs 0 01 0 Start Trace Buffer at trigger (no breakpoints — keep running) 0 01 1 Start Trace Buffer at trigger A breakpoint request occurs when Trace Buffer is full 0 10 0 Store a further 32 Trace Buffer line entries after trigger (no breakpoints — keep running) 0 10 1 Store a further 32 Trace Buffer line entries after trigger Request breakpoint after the 32 further Trace Buffer entries 1 00,01,10 1 Terminate tracing and generate breakpoint immediately on trigger 1 00,01,10 0 Terminate tracing immediately on trigger x 11 x Reserved MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 341 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.7.3 Breakpoints Generated Via The TRIG Bit If a TRIG triggers occur, the Final State is entered. If a tracing session is selected by TSOURCE, breakpoints are requested when the tracing session has completed, thus if Begin or Mid aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 8-48). If no tracing session is selected, breakpoints are requested immediately. TRIG breakpoints are possible even if the S12XDBG module is disarmed. 8.4.7.4 Breakpoints Via TAGHI Or TAGLO Pin Taghits Tagging using the external TAGHI/TAGLO pins always ends the session immediately at the tag hit. It is always end aligned, independent of internal channel trigger alignment configuration. 8.4.7.5 S12XDBG Breakpoint Priorities XGATE software breakpoints have the highest priority. Active tracing sessions are terminated immediately. If a TRIG trigger occurs after Begin or Mid aligned tracing has already been triggered by a comparator instigated transition to Final State, then TRIG no longer has an effect. When the associated tracing session is complete, the breakpoint occurs. Similarly if a TRIG is followed by a subsequent trigger from a comparator channel, it has no effect, since tracing has already started. If a comparator tag hit occurs simultaneously with an external TAGHI/TAGLO hit, the state sequencer enters state0. TAGHI/TAGLO triggers are always end aligned, to end tracing immediately, independent of the tracing trigger alignment bits TALIGN[1:0]. 8.4.7.5.1 S12XDBG Breakpoint Priorities And BDM Interfacing Breakpoint operation is dependent on the state of the S12XBDM module. If the S12XBDM module is active, the CPU12X is executing out of BDM firmware and S12X breakpoints are disabled. In addition, while executing a BDM TRACE command, tagging into BDM is disabled. If BDM is not active, the breakpoint will give priority to BDM requests over SWI requests if the breakpoint coincides with a SWI instruction in the user’s code. On returning from BDM, the SWI from user code gets executed. Table 8-49. Breakpoint Mapping Summary DBGBRK[1] (DBGC1[3]) BDM Bit (DBGC1[4]) BDM Enabled BDM Active S12X Breakpoint Mapping 0 X X X No Breakpoint 1 0 X 0 Breakpoint to SWI 1 0 X 1 No Breakpoint 1 1 0 X Breakpoint to SWI 1 1 1 0 Breakpoint to BDM 1 1 1 1 No Breakpoint BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via a BGND instruction is attempted and the ENABLE bit in the BDM is cleared, the CPU12X actually MC9S12XE-Family Reference Manual , Rev. 1.21 342 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module executes the BDM firmware code. It checks the ENABLE and returns if ENABLE is not set. If not serviced by the monitor then the breakpoint is re-asserted when the BDM returns to normal CPU12X flow. If the comparator register contents coincide with the SWI/BDM vector address then an SWI in user code and DBG breakpoint could occur simultaneously. The CPU12X ensures that BDM requests have a higher priority than SWI requests. Returning from the BDM/SWI service routine care must be taken to avoid re triggering a breakpoint. NOTE When program control returns from a tagged breakpoint using an RTI or BDM GO command without program counter modification it will return to the instruction whose tag generated the breakpoint. To avoid re triggering a breakpoint at the same location reconfigure the S12XDBG module in the SWI routine, if configured for an SWI breakpoint, or over the BDM interface by executing a TRACE command before the GO to increment the program flow past the tagged instruction. An XGATE software breakpoint is forced immediately, the tracing session terminated and the XGATE module execution stops. The user can thus determine if an XGATE breakpoint has occurred by reading out the XGATE program counter over the BDM interface. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 343 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module MC9S12XE-Family Reference Manual , Rev. 1.21 344 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) Table 9-1. Revision History Revision Number Revision Date V02.00 27 Aug 2004 - Reviewed and updated for S12XD architecture V02.01 21 Feb 2007 - Added S12XE, S12XF and S12XS architectures V02.02 19 Apr 2007 - Corrected statement about Backdoor key access via BDM on XE, XF, XS 9.1 Sections Affected Description of Changes Introduction This specification describes the function of the security mechanism in the S12XE chip family (9SEC). NOTE No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the FLASH and/or EEPROM difficult for unauthorized users. 9.1.1 Features The user must be reminded that part of the security must lie with the application code. An extreme example would be application code that dumps the contents of the internal memory. This would defeat the purpose of security. At the same time, the user may also wish to put a backdoor in the application program. An example of this is the user downloads a security key through the SCI, which allows access to a programming routine that updates parameters stored in another section of the Flash memory. The security features of the S12XE chip family (in secure mode) are: • Protect the content of non-volatile memories (Flash, EEPROM) • Execution of NVM commands is restricted • Disable access to internal memory via background debug module (BDM) • Disable access to internal Flash/EEPROM in expanded modes • Disable debugging features for the CPU and XGATE MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 345 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) 9.1.2 Modes of Operation Table 9-2 gives an overview over availability of security relevant features in unsecure and secure modes. Table 9-2. Feature Availability in Unsecure and Secure Modes on S12XE Unsecure Mode Secure Mode NS SS NX ES EX ST NS SS NX ES EX ST Flash Array Access ✔ ✔ ✔(1) ✔1 ✔1 ✔1 ✔ ✔ — — — — EEPROM Array Access ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ — — — — ✔ 2 ✔ ✔ 2 2 ✔ ✔ 2 ✔ 2 ✔ ✔ 2 2 ✔ ✔ 2 ✔2 NVM Commands ✔ (2) BDM ✔ ✔ ✔ ✔ ✔ ✔ — ✔(3) — — — — DBG Module Trace ✔ ✔ ✔ ✔ ✔ ✔ — — — — — — XGATE Debugging ✔ ✔ ✔ ✔ ✔ ✔ — — — — — — External Bus Interface — — ✔ ✔ ✔ ✔ — — ✔ ✔ ✔ ✔ Internal status visible multiplexed on external bus — — — ✔ ✔ — — — — ✔ ✔ — Internal accesses visible — — — — — ✔ — — — — — ✔ on external bus 1. Availability of Flash arrays in the memory map depends on ROMCTL/EROMCTL pins and/or the state of the ROMON/EROMON bits in the MMCCTL1 register. Please refer to the S12X_MMC block guide for detailed information. 2. Restricted NVM command set only. Please refer to the NVM wrapper block guides for detailed information. 3. BDM hardware commands restricted to peripheral registers only. 9.1.3 Securing the Microcontroller Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the security bits located in the options/security byte in the Flash memory array. These non-volatile bits will keep the device secured through reset and power-down. The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory array. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used for security (SEC[1:0]). On devices which have a memory page window, the Flash options/security byte is also available at address 0xBF0F by selecting page 0x3F with the PPAGE register. The contents of this byte are copied into the Flash security register (FSEC) during a reset sequence. 0xFF0F 7 6 5 4 3 2 1 0 KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0 Figure 9-1. Flash Options/Security Byte The meaning of the bits KEYEN[1:0] is shown in Table 9-3. Please refer to Section 9.1.5.1, “Unsecuring the MCU Using the Backdoor Key Access” for more information. MC9S12XE-Family Reference Manual , Rev. 1.21 346 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) Table 9-3. Backdoor Key Access Enable Bits KEYEN[1:0] Backdoor Key Access Enabled 00 0 (disabled) 01 0 (disabled) 10 1 (enabled) 11 0 (disabled) The meaning of the security bits SEC[1:0] is shown in Table 9-4. For security reasons, the state of device security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to SEC[1:0] = ‘10’. All other combinations put the device in a secured mode. The recommended value to put the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = ‘01’. Table 9-4. Security Bits SEC[1:0] Security State 00 1 (secured) 01 1 (secured) 10 0 (unsecured) 11 1 (secured) NOTE Please refer to the Flash block guide for actual security configuration (in section “Flash Module Security”). 9.1.4 Operation of the Secured Microcontroller By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented. However, it must be understood that the security of the EEPROM and Flash memory contents also depends on the design of the application program. For example, if the application has the capability of downloading code through a serial port and then executing that code (e.g. an application containing bootloader code), then this capability could potentially be used to read the EEPROM and Flash memory contents even when the microcontroller is in the secure state. In this example, the security of the application could be enhanced by requiring a challenge/response authentication before any code can be downloaded. Secured operation has the following effects on the microcontroller: 9.1.4.1 • • • • Normal Single Chip Mode (NS) Background debug module (BDM) operation is completely disabled. Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 347 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) 9.1.4.2 • • • • • Special Single Chip Mode (SS) BDM firmware commands are disabled. BDM hardware commands are restricted to the register space. Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled. Special single chip mode means BDM is active after reset. The availability of BDM firmware commands depends on the security state of the device. The BDM secure firmware first performs a blank check of both the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off and the state of the security bits in the appropriate Flash memory location can be changed If the blank check fails, security will remain active, only the BDM hardware commands will be enabled, and the accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed and the options/security byte can be programmed to “unsecured” state via BDM. While the BDM is executing the blank check, the BDM interface is completely blocked, which means that all BDM commands are temporarily blocked. 9.1.4.3 • • • • • Expanded Modes (NX, ES, EX, and ST) BDM operation is completely disabled. Internal Flash memory and EEPROM are disabled. Execution of Flash and EEPROM commands is restricted. Please refer to the FTM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled 9.1.5 Unsecuring the Microcontroller Unsecuring the microcontroller can be done by three different methods: 1. Backdoor key access 2. Reprogramming the security bits 3. Complete memory erase (special modes) 9.1.5.1 Unsecuring the MCU Using the Backdoor Key Access In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key access method. This method requires that: • The backdoor key at 0xFF00–0xFF07 (= global addresses 0x7F_FF00–0x7F_FF07) has been programmed to a valid value. MC9S12XE-Family Reference Manual , Rev. 1.21 348 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) • • The KEYEN[1:0] bits within the Flash options/security byte select ‘enabled’. In single chip mode, the application program programmed into the microcontroller must be designed to have the capability to write to the backdoor key locations. The backdoor key values themselves would not normally be stored within the application data, which means the application program would have to be designed to receive the backdoor key values from an external source (e.g. through a serial port). The backdoor key access method allows debugging of a secured microcontroller without having to erase the Flash. This is particularly useful for failure analysis. NOTE No word of the backdoor key is allowed to have the value 0x0000 or 0xFFFF. 9.1.6 Reprogramming the Security Bits In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security bits within Flash options/security byte to the unsecured value. Because the erase operation will erase the entire sector from 0xFE00–0xFFFF (0x7F_FE00–0x7F_FFFF), the backdoor key and the interrupt vectors will also be erased; this method is not recommended for normal single chip mode. The application software can only erase and program the Flash options/security byte if the Flash sector containing the Flash options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of preventing this method. The microcontroller will enter the unsecured state after the next reset following the programming of the security bits to the unsecured value. This method requires that: • The application software previously programmed into the microcontroller has been designed to have the capability to erase and program the Flash options/security byte, or security is first disabled using the backdoor key method, allowing BDM to be used to issue commands to erase and program the Flash options/security byte. • The Flash sector containing the Flash options/security byte is not protected. 9.1.7 Complete Memory Erase (Special Modes) The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory contents. When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies whether the EEPROM and Flash memory are erased. If any EEPROM or Flash memory address is not erased, only BDM hardware commands are enabled. BDM hardware commands can then be used to write to the EEPROM and Flash registers to mass erase the EEPROM and all Flash memory blocks. When next reset into special single chip mode, the BDM firmware will again verify whether all EEPROM and Flash memory are erased, and this being the case, will enable all BDM commands, allowing the Flash options/security byte to be programmed to the unsecured value. The security bits SEC[1:0] in the Flash security register will indicate the unsecure state following the next reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 349 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) MC9S12XE-Family Reference Manual , Rev. 1.21 350 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-1. Revision History Revision Number V03.22 06 Oct 2005 V03.23 14 Dec 2005 V03.24 17 Jan 2006 10.1 Sections Affected Revision Date Description of Changes - Internal updates 10.9.2/10-461 - Updated code example - Internal updates Introduction The XGATE module is a peripheral co-processor that allows autonomous data transfers between the MCU’s peripherals and the internal memories. It has a built in RISC core that is able to pre-process the transferred data and perform complex communication protocols. The XGATE module is intended to increase the MCU’s data throughput by lowering the S12X_CPU’s interrupt load. Figure 10-1 gives an overview on the XGATE architecture. This document describes the functionality of the XGATE module, including: • XGATE registers (Section 10.3, “Memory Map and Register Definition”) • XGATE RISC core (Section 10.4.1, “XGATE RISC Core”) • Hardware semaphores (Section 10.4.4, “Semaphores”) • Interrupt handling (Section 10.5, “Interrupts”) • Debug features (Section 10.6, “Debug Mode”) • Security (Section 10.7, “Security”) • Instruction set (Section 10.8, “Instruction Set”) 10.1.1 Glossary of Terms XGATE Request A service request from a peripheral module which is directed to the XGATE by the S12X_INT module (see Figure 10-1). Each XGATE request attempts to activate a XGATE channel at a certain priority level. XGATE Channel The resources in the XGATE module (i.e. Channel ID number, Priority level, Service Request Vector, Interrupt Flag) which are associated with a particular XGATE Request. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 351 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XGATE Channel ID A 7-bit identifier associated with an XGATE channel. In S12XE designs valid Channel IDs range from $0D to $78. XGATE Priority Level A priority ranging from 1 to 7 which is associated with an XGATE channel. The priority level of an XGATE channel is selected in the S12X_INT module. XGATE Register Bank A register bank consists of registers R1-R7, CCR and the PC. Each interrupt level is associated with one register bank. XGATE Channel Interrupt An S12X_CPU interrupt that is triggered by a code sequence running on the XGATE module. XGATE Software Channel Special XGATE channel that is not associated with any peripheral service request. A Software Channel is triggered by its Software Trigger Bit which is implemented in the XGATE module. XGATE Semaphore A set of hardware flip-flops that can be exclusively set by either the S12X_CPU or the XGATE. (see Section 10.4.4, “Semaphores”) XGATE Thread A code sequence which is executed by the XGATE’s RISC core after receiving an XGATE request. XGATE Debug Mode A special mode in which the XGATE’s RISC core is halted for debug purposes. This mode enables the XGATE’s debug features (see Section 10.6, “Debug Mode”). XGATE Software Error The XGATE is able to detect a number of error conditions caused by erratic software (see Section 10.4.5, “Software Error Detection”). These error conditions will cause the XGATE to seize program execution and flag an Interrupt to the S12X_CPU. Word A 16 bit entity. Byte An 8 bit entity. 10.1.2 Features The XGATE module includes these features: • Data movement between various targets (i.e. Flash, RAM, and peripheral modules) • Data manipulation through built in RISC core MC9S12XE-Family Reference Manual , Rev. 1.21 352 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) • • • • • • Provides up to 108 XGATE channels, including 8 software triggered channels Interruptible thread execution Two register banks to support fast context switching between threads Hardware semaphores which are shared between the S12X_CPU and the XGATE module Able to trigger S12X_CPU interrupts upon completion of an XGATE transfer Software error detection to catch erratic application code 10.1.3 Modes of Operation There are four run modes on S12XE devices. • • Run mode, wait mode, stop mode The XGATE is able to operate in all of these three system modes. Clock activity will be automatically stopped when the XGATE module is idle. Freeze mode (BDM active) In freeze mode all clocks of the XGATE module may be stopped, depending on the module configuration (see Section 10.3.1.1, “XGATE Control Register (XGMCTL)”). 10.1.4 Block Diagram Figure 10-1 shows a block diagram of the XGATE. Peripheral Interrupts XGATE Requests XGATE XGATE Interrupts (XGIF) S12X_INT Interrupt Flags Semaphores RISC Core Software Triggers Software Triggers SWE Interrupt Data/Code Software Error Logic S12X_DBG Peripherals S12X_MMC Figure 10-1. XGATE Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 353 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.2 External Signal Description The XGATE module has no external pins. 10.3 Memory Map and Register Definition This section provides a detailed description of address space and registers used by the XGATE module. The memory map for the XGATE module is given below in Figure 10-2.The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reserved registers read zero. Write accesses to the reserved registers have no effect. 10.3.1 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bits and field functions follow the register diagrams, in bit order. Register Name 0x0000 R XGMCTL 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 XG XG XG XGEM XGSSM W FRZM DBGM FACTM XG SWEFM XGIEM 7 6 5 4 XGE XGFRZ XGDBG XGSS 3 XG FACT 0x0002 R XGCHID W 0 0x0003 R XGCHPL W 0 0 0 0 0 0 0 0 0 0 2 0 1 0 XG XGIE SWEF XGCHID[6:0] XGCHPL[2:0] 0x0004 R Reserved W 0x0005 R XGISPSEL W 0x0006 R XGISP74 W XGISP74[15:1] 0x0006 R XGISP31 W XGISP31[15:1] 0x0006 XGVBR R XGVBR[15:1] W 0 XGISPSEL[1:0] 0 0 0 = Unimplemented or Reserved Figure 10-2. XGATE Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 354 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 0x0008 XGIF R 127 126 125 124 123 122 121 0 0 0 0 0 0 0 W 113 112 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 R W XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 R W XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R W XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10 15 0x0016 XGIF 114 R 31 0x0014 XGIF 115 XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50 47 0x0012 XGIF 116 R W 63 0x0010 XGIF 117 XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGF_67 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60 79 0x000E XGIF 118 R W 95 0x000C XGIF 119 XGIF_78 XGF_77 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70 W 111 0x000A XGIF 120 14 13 R W 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XGIF_0F XGIF_0E XGIF_0D = Unimplemented or Reserved Figure 10-2. XGATE Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 355 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 15 14 13 0x0018 R XGSWTM W 0 0 0 0x001A R XGSEMM W 0 12 11 10 9 8 0 0 0 0 0 0 0 0 7 6 5 0 0 0 3 2 1 0 XGSWT[7:0] XGSWTM[7:0] 0 4 XGSEM[7:0] XGSEMM[7:0] 0x001C R Reserved W 0x001D XGCCR 0x001E XGPC R 0 0 0 0 W R XGN XGZ XGV XGC XGPC W 0x0020 R Reserved W 0x0021 R Reserved W 0x0022 XGR1 0x0024 XGR2 R R XGR2 W 0x0026 XGR3 W 0x0028 XGR4 W 0x002A XGR5 XGR1 W R XGR3 R XGR4 R XGR5 W 0x002C XGR6 R W 0x002E XGR7 W XGR6 R XGR7 = Unimplemented or Reserved Figure 10-2. XGATE Register Summary (Sheet 3 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 356 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.1 XGATE Control Register (XGMCTL) All module level switches and flags are located in the XGATE Module Control Register Figure 10-3. Module Base +0x00000 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 XG SSM XG FACTM 0 0 R W XGEM Reset 0 XG XG FRZM DBGM 0 0 7 0 0 5 4 3 2 0 XG XGIEM SWEFM 0 6 XGE XGFRZ XGDBG XGSS XGFACT 0 0 0 0 0 0 1 0 XG SWEF XGIE 0 0 = Unimplemented or Reserved Figure 10-3. XGATE Control Register (XGMCTL) Read: Anytime Write: Anytime Table 10-2. XGMCTL Field Descriptions (Sheet 1 of 3) Field Description 15 XGEM XGE Mask — This bit controls the write access to the XGE bit. The XGE bit can only be set or cleared if a "1" is written to the XGEM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGE in the same bus cycle 1 Enable write access to the XGE in the same bus cycle 14 XGFRZM XGFRZ Mask — This bit controls the write access to the XGFRZ bit. The XGFRZ bit can only be set or cleared if a "1" is written to the XGFRZM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGFRZ in the same bus cycle 1 Enable write access to the XGFRZ in the same bus cycle 13 XGDBGM XGDBG Mask — This bit controls the write access to the XGDBG bit. The XGDBG bit can only be set or cleared if a "1" is written to the XGDBGM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGDBG in the same bus cycle 1 Enable write access to the XGDBG in the same bus cycle 12 XGSSM XGSS Mask — This bit controls the write access to the XGSS bit. The XGSS bit can only be set or cleared if a "1" is written to the XGSSM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGSS in the same bus cycle 1 Enable write access to the XGSS in the same bus cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 357 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-2. XGMCTL Field Descriptions (Sheet 2 of 3) Field 11 XGFACTM Description XGFACT Mask — This bit controls the write access to the XGFACT bit. The XGFACT bit can only be set or cleared if a "1" is written to the XGFACTM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGFACT in the same bus cycle 1 Enable write access to the XGFACT in the same bus cycle XGSWEF Mask — This bit controls the write access to the XGSWEF bit. The XGSWEF bit can only be cleared 9 XGSWEFM if a "1" is written to the XGSWEFM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGSWEF in the same bus cycle 1 Enable write access to the XGSWEF in the same bus cycle 8 XGIEM XGIE Mask — This bit controls the write access to the XGIE bit. The XGIE bit can only be set or cleared if a "1" is written to the XGIEM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGIE in the same bus cycle 1 Enable write access to the XGIE in the same bus cycle 7 XGE XGATE Module Enable (Request Enable)— This bit enables incoming XGATE requests from the S12X_INT module. If the XGE bit is cleared, pending XGATE requests will be ignored. The thread that is executed by the RISC core while the XGE bit is cleared will continue to run. Read: 0 Incoming requests are disabled 1 Incoming requests are enabled Write: 0 Disable incoming requests 1 Enable incoming requests 6 XGFRZ Halt XGATE in Freeze Mode — The XGFRZ bit controls the XGATE operation in Freeze Mode (BDM active). Read: 0 RISC core operates normally in Freeze (BDM active) 1 RISC core stops in Freeze Mode (BDM active) Write: 0 Don’t stop RISC core in Freeze Mode (BDM active) 1 Stop RISC core in Freeze Mode (BDM active) 5 XGDBG XGATE Debug Mode — This bit indicates that the XGATE is in Debug Mode (see Section 10.6, “Debug Mode”). Debug Mode can be entered by Software Breakpoints (BRK instruction), Tagged or Forced Breakpoints (see S12X_DBG Section), or by writing a "1" to this bit. Read: 0 RISC core is not in Debug Mode 1 RISC core is in Debug Mode Write: 0 Leave Debug Mode 1 Enter Debug Mode Note: Freeze Mode and Software Error Interrupts have no effect on the XGDBG bit. MC9S12XE-Family Reference Manual , Rev. 1.21 358 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-2. XGMCTL Field Descriptions (Sheet 3 of 3) Field 4 XGSS Description XGATE Single Step — This bit forces the execution of a single instruction.(1) Read: 0 No single step in progress 1 Single step in progress Write 0 No effect 1 Execute a single RISC instruction Note: Invoking a Single Step will cause the XGATE to temporarily leave Debug Mode until the instruction has been executed. 3 XGFACT Fake XGATE Activity — This bit forces the XGATE to flag activity to the MCU even when it is idle. When it is set the MCU will never enter system stop mode which assures that peripheral modules will be clocked during XGATE idle periods Read: 0 XGATE will only flag activity if it is not idle or in debug mode. 1 XGATE will always signal activity to the MCU. Write: 0 Only flag activity if not idle or in debug mode. 1 Always signal XGATE activity. 1 XGSWEF XGATE Software Error Flag — This bit signals a software error. It is set whenever the RISC core detects an error condition(2). The RISC core is stopped while this bit is set. Clearing this bit will terminate the current thread and cause the XGATE to become idle. Read: 0 No software error detected 1 Software error detected Write: 0 No effect 1 Clears the XGSWEF bit 0 XGIE XGATE Interrupt Enable — This bit acts as a global interrupt enable for the XGATE module Read: 0 All outgoing XGATE interrupts disabled (except software error interrupts) 1 All outgoing XGATE interrupts enabled Write: 0 Disable all outgoing XGATE interrupts (except software error interrupts) 1 Enable all outgoing XGATE interrupts 1. Refer to Section 10.6.1, “Debug Features” 2. Refer to Section 10.4.5, “Software Error Detection” 10.3.1.2 XGATE Channel ID Register (XGCHID) The XGATE Channel ID Register (Figure 10-4) shows the identifier of the XGATE channel that is currently active. This register will read “$00” if the XGATE module is idle. In debug mode this register can be used to start and terminate threads. Refer to Section 10.6.1, “Debug Features” for further information. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 359 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Module Base +0x0002 7 R 6 5 4 0 3 2 1 0 0 0 0 XGCHID[6:0] W Reset 0 0 0 0 0 = Unimplemented or Reserved Figure 10-4. XGATE Channel ID Register (XGCHID) Read: Anytime Write: In Debug Mode1 Table 10-3. XGCHID Field Descriptions Field Description 6–0 Request Identifier — ID of the currently active channel XGCHID[6:0] 10.3.1.3 XGATE Channel Priority Level (XGCHPL) The XGATE Channel Priority Level Register (Figure 10-5) shows the priority level of the current thread. In debug mode this register can be used to select a priority level when launching a thread (see Section 10.6.1, “Debug Features”). Module Base +0x0003 R 7 6 5 4 3 0 0 0 0 0 0 0 0 0 2 1 0 XGCHPL[2:0] W Reset 0 0 0 0 = Unimplemented or Reserved Figure 10-5. XGATE Channel Priority Level Register (XGCHPL) Read: Anytime Write: In Debug Mode1 Table 10-4. XGCHPL Field Descriptions Field 2-0 XGCHPL[2:0] 10.3.1.4 Description Priority Level— Priority level of the currently active channel XGATE Initial Stack Pointer Select Register (XGISPSEL) The XGATE Initial Stack Pointer Select Register (Figure 10-6) determines the register which is mapped to address “Module Base +0x0006”. A value of zero selects the Vector Base Register (XGVBR). Setting 1. Refer to Section 10.6.1, “Debug Features” MC9S12XE-Family Reference Manual , Rev. 1.21 360 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) this register to a channel priority level (non-zero value) selects the corresponding Initial Stack Pointer Registers XGISP74 or XGISP31 (see Table 10-6). Module Base +0x0005 R 7 6 5 4 3 2 0 0 0 0 0 0 0 0 0 0 0 1 XGISPSEL[1:0] W Reset 0 0 0 0 = Unimplemented or Reserved Figure 10-6. XGATE Initial Stack Pointer Select Register (XGISPSEL) Read: Anytime Write: Anytime Table 10-5. XGISPSEL Field Descriptions Field Description 1-0 Register select— Determines whether XGISP74, XGISP31, or XGVBR is mapped to “Module Base +0x0006”. XGISPSEL[1:0] See Table 10-6. Table 10-6. XGISP74, XGISP31, XGVBR Mapping 10.3.1.5 XGISPSEL[1:0] Register Mapped to “Module Base +0x0006“ 3 Reserved 2 XGISP74 1 XGISP31 0 XGVBR XGATE Initial Stack Pointer for Interrupt Priorities 7 to 4 (XGISP74) The XGISP74 register is intended to point to the stack region that is used by XGATE channels of priority 7 to 4. Every time a thread of such priority is started, RISC core register R7 will be initialized with the content of XGISP74. Module Base +0x0006 15 14 13 12 11 10 R 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 XGISP74[15:1] W Reset 9 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-7. XGATE Initial Stack Pointer for Interrupt Priorities 7 to 4 (XGISP74) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 361 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-7. XGISP74 Field Descriptions Field 15–1 XBISP74[15:1] 10.3.1.6 Description Initial Stack Pointer— The XGISP74 register holds the initial value of RISC core register R7, for threads of priority 7 to 4. XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31) The XGISP31 register is intended to point to the stack region that is used by XGATE channels of priority 3 to 1. Every time a thread of such priority is started, RISC core register R7 will be initialized with the content of XGISP31. Module Base +0x0006 15 14 13 12 11 10 R 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 XGISP31[15:1] W Reset 9 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-8. XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) Table 10-8. XGISP31 Field Descriptions Field 15–1 XBISP31[15:1] 10.3.1.7 Description Initial Stack Pointer— The XGISP31 register holds the initial value of RISC core register R7, for threads of priority 3 to 1. XGATE Vector Base Address Register (XGVBR) The Vector Base Address Register (Figure 10-9) determines the location of the XGATE vector block (see Section Figure 10-23., “XGATE Vector Block). Module Base +0x0006 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 1 1 1 1 1 1 1 0 0 0 XGVBR[15:1] W Reset 8 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-9. XGATE Vector Base Address Register (XGVBR) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) MC9S12XE-Family Reference Manual , Rev. 1.21 362 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-9. XGVBR Field Descriptions Field Description 15–1 Vector Base Address — The XGVBR register holds the start address of the vector block in the XGATE XBVBR[15:1] memory map. 10.3.1.8 XGATE Channel Interrupt Flag Vector (XGIF) The XGATE Channel Interrupt Flag Vector (Figure 10-10) provides access to the interrupt flags of all channels. Each flag may be cleared by writing a "1" to its bit location. Refer to Section 10.5.2, “Outgoing Interrupt Requests” for further information. Module Base +0x0008 R 127 126 125 124 123 122 121 0 0 0 0 0 0 0 120 119 XGIF_78 XGF_77 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 W Reset R W Reset R W Reset R W Reset XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGF_67 118 117 116 115 114 113 112 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 10-10. XGATE Channel Interrupt Flag Vector (XGIF) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 363 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 63 R W 62 0 47 W Reset R W Reset R W Reset 60 59 58 57 56 55 54 53 52 51 50 49 48 XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30 Reset R 61 0 46 0 45 0 44 0 43 0 42 0 41 0 40 0 39 0 38 0 37 0 36 0 35 0 34 0 33 0 32 XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XGIF_0F XGIF_0E XGIF_0D 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-10. XGATE Channel Interrupt Flag Vector (XGIF) (continued) Read: Anytime Write: Anytime Table 10-10. XGIV Field Descriptions Field Description 127–9 XGIF[78:9] Channel Interrupt Flags — These bits signal pending channel interrupts. They can only be set by the RISC core (see SIF instruction on page 10-447). Each flag can be cleared by writing a "1" to its bit location. Unimplemented interrupt flags will always read "0". Section “Interrupts” of the device overview for a list of implemented Interrupts. Read: 0 Channel interrupt is not pending 1 Channel interrupt is pending if XGIE is set Write: 0 No effect 1 Clears the interrupt flag MC9S12XE-Family Reference Manual , Rev. 1.21 364 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NOTE Suggested Mnemonics for accessing the interrupt flag vector on a word basis are: XGIF_7F_70 (XGIF[127:112]), XGIF_6F_60 (XGIF[111:96]), XGIF_5F_50 (XGIF[95:80]), XGIF_4F_40 (XGIF[79:64]), XGIF_3F_30 (XGIF[63:48]), XGIF_2F_20 (XGIF[47:32]), XGIF_1F_10 (XGIF[31:16]), XGIF_0F_00 (XGIF[15:0]) 10.3.1.9 XGATE Software Trigger Register (XGSWT) The eight software triggers of the XGATE module can be set and cleared through the XGATE Software Trigger Register (Figure 10-11). The upper byte of this register, the software trigger mask, controls the write access to the lower byte, the software trigger bits. These bits can be set or cleared if a "1" is written to the associated mask in the same bus cycle. Refer to Section 10.5.2, “Outgoing Interrupt Requests” for further information. Module Base +0x00018 R 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 0 0 0 6 5 0 0 0 0 0 4 3 2 1 0 0 0 0 XGSWT[7:0] XGSWTM[7:0] W Reset 7 0 0 0 0 0 Figure 10-11. XGATE Software Trigger Register (XGSWT) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 365 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-11. XGSWT Field Descriptions Field Description 15–8 Software Trigger Mask — These bits control the write access to the XGSWT bits. Each XGSWT bit can only XGSWTM[7:0] be written if a "1" is written to the corresponding XGSWTM bit in the same access. Read: These bits will always read "0". Write: 0 Disable write access to the XGSWT in the same bus cycle 1 Enable write access to the corresponding XGSWT bit in the same bus cycle 7–0 XGSWT[7:0] Software Trigger Bits — These bits act as interrupt flags that are able to trigger XGATE software channels. They can only be set and cleared by software. Read: 0 No software trigger pending 1 Software trigger pending if the XGIE bit is set Write: 0 Clear Software Trigger 1 Set Software Trigger NOTE The XGATE channel IDs that are associated with the eight software triggers are determined on chip integration level. (see Section “Interrupts“ of the device overview) XGATE software triggers work like any peripheral interrupt. They can be used as XGATE requests as well as S12X_CPU interrupts. The target of the software trigger must be selected in the S12X_INT module. 10.3.1.10 XGATE Semaphore Register (XGSEM) The XGATE provides a set of eight hardware semaphores that can be shared between the S12X_CPU and the XGATE RISC core. Each semaphore can either be unlocked, locked by the S12X_CPU or locked by the RISC core. The RISC core is able to lock and unlock a semaphore through its SSEM and CSEM instructions. The S12X_CPU has access to the semaphores through the XGATE Semaphore Register (Figure 10-12). Refer to section Section 10.4.4, “Semaphores” for details. Module Base +0x0001A R 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 0 0 0 W Reset 7 6 5 0 0 0 0 3 2 1 0 0 0 0 XGSEM[7:0] XGSEMM[7:0] 0 4 0 0 0 0 0 Figure 10-12. XGATE Semaphore Register (XGSEM) Read: Anytime Write: Anytime (see Section 10.4.4, “Semaphores”) MC9S12XE-Family Reference Manual , Rev. 1.21 366 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-12. XGSEM Field Descriptions Field Description 15–8 Semaphore Mask — These bits control the write access to the XGSEM bits. XGSEMM[7:0] Read: These bits will always read "0". Write: 0 Disable write access to the XGSEM in the same bus cycle 1 Enable write access to the XGSEM in the same bus cycle 7–0 XGSEM[7:0] Semaphore Bits — These bits indicate whether a semaphore is locked by the S12X_CPU. A semaphore can be attempted to be set by writing a "1" to the XGSEM bit and to the corresponding XGSEMM bit in the same write access. Only unlocked semaphores can be set. A semaphore can be cleared by writing a "0" to the XGSEM bit and a "1" to the corresponding XGSEMM bit in the same write access. Read: 0 Semaphore is unlocked or locked by the RISC core 1 Semaphore is locked by the S12X_CPU Write: 0 Clear semaphore if it was locked by the S12X_CPU 1 Attempt to lock semaphore by the S12X_CPU 10.3.1.11 XGATE Condition Code Register (XGCCR) The XGCCR register (Figure 10-13) provides access to the RISC core’s condition code register. Module Base +0x001D R 7 6 5 4 0 0 0 0 0 0 0 0 W Reset 3 2 1 0 XGN XGZ XGV XGC 0 0 0 0 = Unimplemented or Reserved Figure 10-13. XGATE Condition Code Register (XGCCR) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-13. XGCCR Field Descriptions Field Description 3 XGN Sign Flag — The RISC core’s Sign flag 2 XGZ Zero Flag — The RISC core’s Zero flag 1 XGV Overflow Flag — The RISC core’s Overflow flag 0 XGC Carry Flag — The RISC core’s Carry flag MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 367 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.12 XGATE Program Counter Register (XGPC) The XGPC register (Figure 10-14) provides access to the RISC core’s program counter. Module Base +0x0001E 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGPC W Reset 7 0 0 0 0 0 0 0 0 Figure 10-14. XGATE Program Counter Register (XGPC) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-14. XGPC Field Descriptions Field 15–0 XGPC[15:0] Description Program Counter — The RISC core’s program counter 10.3.1.13 XGATE Register 1 (XGR1) The XGR1 register (Figure 10-15) provides access to the RISC core’s register 1. Module Base +0x00022 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR1 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-15. XGATE Register 1 (XGR1) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-15. XGR1 Field Descriptions Field 15–0 XGR1[15:0] Description XGATE Register 1 — The RISC core’s register 1 MC9S12XE-Family Reference Manual , Rev. 1.21 368 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.14 XGATE Register 2 (XGR2) The XGR2 register (Figure 10-16) provides access to the RISC core’s register 2. Module Base +0x00024 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR2 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-16. XGATE Register 2 (XGR2) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-16. XGR2 Field Descriptions Field 15–0 XGR2[15:0] Description XGATE Register 2 — The RISC core’s register 2 10.3.1.15 XGATE Register 3 (XGR3) The XGR3 register (Figure 10-17) provides access to the RISC core’s register 3. Module Base +0x00026 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR3 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-17. XGATE Register 3 (XGR3) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-17. XGR3 Field Descriptions Field 15–0 XGR3[15:0] Description XGATE Register 3 — The RISC core’s register 3 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 369 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.16 XGATE Register 4 (XGR4) The XGR4 register (Figure 10-18) provides access to the RISC core’s register 4. Module Base +0x00028 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR4 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-18. XGATE Register 4 (XGR4) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-18. XGR4 Field Descriptions Field 15–0 XGR4[15:0] Description XGATE Register 4 — The RISC core’s register 4 10.3.1.17 XGATE Register 5 (XGR5) The XGR5 register (Figure 10-19) provides access to the RISC core’s register 5. Module Base +0x0002A 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR5 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-19. XGATE Register 5 (XGR5) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-19. XGR5 Field Descriptions Field 15–0 XGR5[15:0] Description XGATE Register 5 — The RISC core’s register 5 MC9S12XE-Family Reference Manual , Rev. 1.21 370 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.18 XGATE Register 6 (XGR6) The XGR6 register (Figure 10-20) provides access to the RISC core’s register 6. Module Base +0x0002C 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR6 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-20. XGATE Register 6 (XGR6) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-20. XGR6 Field Descriptions Field Description 15–0 XGR6[15:0] XGATE Register 6 — The RISC core’s register 6 10.3.1.19 XGATE Register 7 (XGR7) The XGR7 register (Figure 10-21) provides access to the RISC core’s register 7. Module Base +0x0002E 15 14 13 12 11 10 9 8 R 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 XGR7 W Reset 7 0 0 0 0 0 0 0 0 Figure 10-21. XGATE Register 7 (XGR7) Read: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Write: In debug mode if unsecured and not idle (XGCHID ≠ 0x00) Table 10-21. XGR7 Field Descriptions Field Description 15–0 XGR7[15:0] 10.4 XGATE Register 7 — The RISC core’s register 7 Functional Description The core of the XGATE module is a RISC processor which is able to access the MCU’s internal memories and peripherals (see Figure 10-1). The RISC processor always remains in an idle state until it is triggered by an XGATE request. Then it executes a code sequence (thread) that is associated with the requested XGATE channel. Each thread can run on a priority level ranging from 1 to 7. Refer to the S12X_INT MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 371 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Section for information on how to select priority levels for XGATE threads. Low priority threads (interrupt levels 1 to 3) can be interrupted by high priority threads (interrupt levels 4 to 7). High priority threads are not interruptible. The register content of an interrupted thread is maintained and restored by the XGATE hardware. To signal the completion of a task the XGATE is able to send interrupts to the S12X_CPU. Each XGATE channel has its own interrupt vector. Refer to the S12X_INT Section for detailed information. The XGATE module also provides a set of hardware semaphores which are necessary to ensure data consistency whenever RAM locations or peripherals are shared with the S12X_CPU. The following sections describe the components of the XGATE module in further detail. 10.4.1 XGATE RISC Core The RISC core is a 16 bit processor with an instruction set that is well suited for data transfers, bit manipulations, and simple arithmetic operations (see Section 10.8, “Instruction Set”). It is able to access the MCU’s internal memories and peripherals without blocking these resources from the S12X_CPU1. Whenever the S12X_CPU and the RISC core access the same resource, the RISC core will be stalled until the resource becomes available again.1 The XGATE offers a high access rate to the MCU’s internal RAM. Depending on the bus load, the RISC core can perform up to two RAM accesses per S12X_CPU bus cycle. Bus accesses to peripheral registers or flash are slower. A transfer rate of one bus access per S12X_CPU cycle can not be exceeded. The XGATE module is intended to execute short interrupt service routines that are triggered by peripheral modules or by software. 10.4.2 Programmer’s Model Register Block 15 15 R7 (Stack Pointer) R6 15 R5 15 R4 15 R3 15 R2 15 R1(Data Pointer) 15 R0 = 0 Program Counter 0 15 PC 0 0 0 0 0 Condition Code Register NZVC 3 2 1 0 0 0 0 Figure 10-22. Programmer’s Model 1. With the exception of PRR registers (see Section “S12X_MMC”). MC9S12XE-Family Reference Manual , Rev. 1.21 372 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) The programmer’s model of the XGATE RISC core is shown in Figure 10-22. The processor offers a set of seven general purpose registers (R1 - R7), which serve as accumulators and index registers. An additional eighth register (R0) is tied to the value “$0000”. Registers R1 and R7 have additional functionality. R1 is preloaded with the initial data pointer of the channel’s service request vector (see Figure 10-23). R7 is either preloaded with the content of XGISP74 if the interrupt priority of the current channel is in the range 7 to 4, or it is with preloaded the content of XGISP31 if the interrupt priority of the current channel is in the range 3 to 1. The remaining general purpose registers will be reset to an unspecified value at the beginning of each thread. The 16 bit program counter allows the addressing of a 64 kbyte address space. The condition code register contains four bits: the sign bit (S), the zero flag (Z), the overflow flag (V), and the carry bit (C). The initial content of the condition code register is undefined. 10.4.3 Memory Map The XGATE’s RISC core is able to access an address space of 64K bytes. The allocation of memory blocks within this address space is determined on chip level. Refer to the S12X_MMC Section for a detailed information. The XGATE vector block assigns a start address and a data pointer to each XGATE channel. Its position in the XGATE memory map can be adjusted through the XGVBR register (see Section 10.3.1.7, “XGATE Vector Base Address Register (XGVBR)”). Figure 10-23 shows the layout of the vector block. Each vector consists of two 16 bit words. The first contains the start address of the service routine. This value will be loaded into the program counter before a service routine is executed. The second word is a pointer to the service routine’s data space. This value will be loaded into register R1 before a service routine is executed. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 373 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XGVBR +$0000 unused Code +$0024 Channel $09 Initial Program Counter Channel $09 Initial Data Pointer +$0028 Channel $0A Initial Program Counter Data Channel $0A Initial Data Pointer +$002C Channel $0B Initial Program Counter Channel $0B Initial Data Pointer +$0030 Channel $0C Initial Program Counter Code Channel $0C Initial Data Pointer +$01E0 Channel $78 Initial Program Counter Data Channel $78 Initial Data Pointer Figure 10-23. XGATE Vector Block 10.4.4 Semaphores The XGATE module offers a set of eight hardware semaphores. These semaphores provide a mechanism to protect system resources that are shared between two concurrent threads of program execution; one thread running on the S12X_CPU and one running on the XGATE RISC core. Each semaphore can only be in one of the three states: “Unlocked”, “Locked by S12X_CPU”, and “Locked by XGATE”. The S12X_CPU can check and change a semaphore’s state through the XGATE semaphore register (XGSEM, see Section 10.3.1.10, “XGATE Semaphore Register (XGSEM)”). The RISC core does this through its SSEM and CSEM instructions. IFigure 10-24 illustrates the valid state transitions. MC9S12XE-Family Reference Manual , Rev. 1.21 374 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) set_xgsem: clr_xgsem: ssem: csem: 1 is written to XGSEM[n] (and 1 is written to XGSEMM[n]) 0 is written to XGSEM[n] (and 1 is written to XGSEMM[n]) Executing SSEM instruction (on semaphore n) Executing CSEM instruction (on semaphore n) clr_xgsem csem LOCKED BY S12X_CPU LOCKED BY XGATE clr_xgsem csem ssem & set_xgsem ssem UNLOCKED ssem & set_xgsem Figure 10-24. Semaphore State Transitions Figure 10-25 gives an example of the typical usage of the XGATE hardware semaphores. Two concurrent threads are running on the system. One is running on the S12X_CPU and the other is running on the RISC core. They both have a critical section of code that accesses the same system resource. To guarantee that the system resource is only accessed by one thread at a time, the critical code sequence must be embedded in a semaphore lock/release sequence as shown. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 375 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) S12X_CPU XGATE ......... ......... 1 ⇒ XGSEM[n] SSEM XGSEM[n] 1? BCC? critical code sequence 0 ⇒ XGSEM[n] ......... critical code sequence CSEM ......... Figure 10-25. Algorithm for Locking and Releasing Semaphores 10.4.5 Software Error Detection Upon detecting an error condition caused by erratic application code, the XGATE module will immediately terminate program execution and trigger a non-maskable interrupt to the S12X_CPU. There are three error conditions: • Execution of an illegal opcode • Illegal opcode fetches • Illegal load or store accesses All opcodes which are not listed in section Section 10.8, “Instruction Set” are illegal opcodes. Illegal opcode fetches as well as illegal load and store accesses are defined on chip level. Refer to the S12X_MMC Section for a detailed information. NOTE When executing a branch (BCC, BCS,...), a jump (JAL) or an RTS instruction, the XGATE prefetches and discards the opcode of the following instruction. The XGATE will perform its software error handling actions (see above) if this opcode fetch is illegal. MC9S12XE-Family Reference Manual , Rev. 1.21 376 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.5 10.5.1 Interrupts Incoming Interrupt Requests XGATE threads are triggered by interrupt requests which are routed to the XGATE module (see S12X_INT Section). Only a subset of the MCU’s interrupt requests can be routed to the XGATE. Which specific interrupt requests these are and which channel ID they are assigned to is documented in Section “Interrupts” of the device overview. 10.5.2 Outgoing Interrupt Requests There are three types of interrupt requests which can be triggered by the XGATE module: 4. Channel interrupts For each XGATE channel there is an associated interrupt flag in the XGATE interrupt flag vector (XGIF, see Section 10.3.1.8, “XGATE Channel Interrupt Flag Vector (XGIF)”). These flags can be set through the "SIF" instruction by the RISC core. They are typically used to flag an interrupt to the S12X_CPU when the XGATE has completed one of its task. 5. Software triggers Software triggers are interrupt flags, which can be set and cleared by software (see Section 10.3.1.9, “XGATE Software Trigger Register (XGSWT)”). They are typically used to trigger XGATE tasks by the S12X_CPU software. However these interrupts can also be routed to the S12X_CPU (see S12X_INT Section) and triggered by the XGATE software. 6. Software error interrupt The software error interrupt signals to the S12X_CPU the detection of an error condition in the XGATE application code (see Section 10.4.5, “Software Error Detection”). This is a non-maskable interrupt. Executing the interrupt service routine will automatically reset the interrupt line. All outgoing XGATE interrupts, except software error interrupts, can be disabled by the XGIE bit in the XGATE module control register (XGMCTL, see Section 10.3.1.1, “XGATE Control Register (XGMCTL)”). 10.6 Debug Mode The XGATE debug mode is a feature to allow debugging of application code. 10.6.1 Debug Features In debug mode the RISC core will be halted and the following debug features will be enabled: • Read and Write accesses to RISC core registers (XGCCR, XGPC, XGR1–XGR7)1 All RISC core registers can be modified. Leaving debug mode will cause the RISC core to continue program execution with the modified register values. 1. Only possible if MCU is unsecured MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 377 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) • • Single Stepping Writing a "1" to the XGSS bit will call the RISC core to execute a single instruction. All RISC core registers will be updated accordingly. Write accesses to the XGCHID register and the XGCHPL register XGATE threads can be initiated and terminated through a 16 write access to the XGCHID and the XGCHPL register or through a 8 bit write access to the XGCHID register. Detailed operation is shown in Table 10-22. Once a thread has been initiated it’s code can be either single stepped or it can be executed by leaving debug mode. Table 10-22. Initiating and Terminating Threads in Debug Mode Register Content Single Cycle Write Access to... Action XGCHID XGCHPL XGCHID XGCHPL 0 0 1..127 -(1) Set new XGCHID Set XGCHPL to 0x01 Initiate new thread 0 0 1..127 0..7 Set new XGCHID Set new XGCHPL Initiate new thread 4..7 Interrupt current thread Set new XGCHID Set new XGCHPL Initiate new thread 1..127 0..3 1..127 1..127 0..7 0 0..7 All other combinations 1. 8 bit write access to XGCHID -1 Terminate current thread. Resume interrupted thread or become idle if no interrupted thread is pending No action NOTE Even though zero is not a valid interrupt priority level of the S12X_INT module, a thread of priority level 0 can be initiated in debug mode. The XGATE handles requests of priority level 0 in the same way as it handles requests of priority levels 1 to 3. NOTE All channels 1 to 127 can be initiated by writing to the XGCHID register, even if they are not assigned to any peripheral module. NOTE In Debug Mode the XGATE will ignore all requests from peripheral modules. 10.6.1.0.1 Entering Debug Mode Debug mode can be entered in four ways: 1. Setting XGDBG to "1" MC9S12XE-Family Reference Manual , Rev. 1.21 378 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Writing a "1" to XGDBG and XGDBGM in the same write access causes the XGATE to enter debug mode upon completion of the current instruction. NOTE After writing to the XGDBG bit the XGATE will not immediately enter debug mode. Depending on the instruction that is executed at this time there may be a delay of several clock cycles. The XGDBG will read "0" until debug mode is entered. 2. Software breakpoints XGATE programs which are stored in the internal RAM allow the use of software breakpoints. A software breakpoint is set by replacing an instruction of the program code with the "BRK" instruction. As soon as the program execution reaches the "BRK" instruction, the XGATE enters debug mode. Additionally a software breakpoint request is sent to the S12X_DBG module (see section 4.9 of the S12X_DBG Section). Upon entering debug mode, the program counter will point to the "BRK" instruction. The other RISC core registers will hold the result of the previous instruction. To resume program execution, the "BRK" instruction must be replaced by the original instruction before leaving debug mode. 3. Tagged Breakpoints The S12X_DBG module is able to place tags on fetched opcodes. The XGATE is able to enter debug mode right before a tagged opcode is executed (see section 4.9 of the S12X_DBG Section). Upon entering debug mode, the program counter will point to the tagged instruction. The other RISC core registers will hold the result of the previous instruction. 4. Forced Breakpoints Forced breakpoints are triggered by the S12X_DBG module (see section 4.9 of the S12X_DBG Section). When a forced breakpoint occurs, the XGATE will enter debug mode upon completion of the current instruction. 10.6.2 Leaving Debug Mode Debug mode can only be left by setting the XGDBG bit to "0". If a thread is active (XGCHID has not been cleared in debug mode), program execution will resume at the value of XGPC. 10.7 Security In order to protect XGATE application code on secured S12X devices, a few restrictions in the debug features have been made. These are: • Registers XGCCR, XGPC, and XGR1–XGR7 will read zero on a secured device • Registers XGCCR, XGPC, and XGR1–XGR7 can not be written on a secured device • Single stepping is not possible on a secured device MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 379 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8 Instruction Set 10.8.1 Addressing Modes For the ease of implementation the architecture is a strict Load/Store RISC machine, which means all operations must have one of the eight general purpose registers R0 … R7 as their source as well their destination. All word accesses must work with a word aligned address, that is A[0] = 0! 10.8.1.1 Naming Conventions RD RD.L RD.H RS, RS1, RS2 RS.L, RS1.L, RS2.L RS.H, RS1.H, RS2.H RB RI RI+ –RI Destination register, allowed range is R0–R7 Low byte of the destination register, bits [7:0] High byte of the destination register, bits [15:8] Source register, allowed range is R0–R7 Low byte of the source register, bits [7:0] High byte of the source register, bits[15:8] Base register for indexed addressing modes, allowed range is R0–R7 Offset register for indexed addressing modes with register offset, allowed range is R0–R7 Offset register for indexed addressing modes with register offset and post-increment, Allowed range is R0–R7 (R0+ is equivalent to R0) Offset register for indexed addressing modes with register offset and pre-decrement, Allowed range is R0–R7 (–R0 is equivalent to R0) NOTE Even though register R1 is intended to be used as a pointer to the data segment, it may be used as a general purpose data register as well. Selecting R0 as destination register will discard the result of the instruction. Only the condition code register will be updated 10.8.1.2 Inherent Addressing Mode (INH) Instructions that use this addressing mode either have no operands or all operands are in internal XGATE registers. Examples: BRK RTS MC9S12XE-Family Reference Manual , Rev. 1.21 380 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.3 Immediate 3-Bit Wide (IMM3) Operands for immediate mode instructions are included in the instruction stream and are fetched into the instruction queue along with the rest of the 16 bit instruction. The ’#’ symbol is used to indicate an immediate addressing mode operand. This address mode is used for semaphore instructions. Examples: CSEM SSEM 10.8.1.4 #1 #3 ; Unlock semaphore 1 ; Lock Semaphore 3 Immediate 4 Bit Wide (IMM4) The 4 bit wide immediate addressing mode is supported by all shift instructions. RD = RD ∗ IMM4 Examples: LSL LSR 10.8.1.5 R4,#1 R4,#3 ; R4 = R4 << 1; shift register R4 by 1 bit to the left ; R4 = R4 >> 3; shift register R4 by 3 bits to the right Immediate 8 Bit Wide (IMM8) The 8 bit wide immediate addressing mode is supported by four major commands (ADD, SUB, LD, CMP). RD = RD ∗ imm8 Examples: ADDL SUBL LDH CMPL 10.8.1.6 R1,#1 R2,#2 R3,#3 R4,#4 ; ; ; ; adds an 8 bit value to register R1 subtracts an 8 bit value from register R2 loads an 8 bit immediate into the high byte of Register R3 compares the low byte of register R4 with an immediate value Immediate 16 Bit Wide (IMM16) The 16 bit wide immediate addressing mode is a construct to simplify assembler code. Instructions which offer this mode are translated into two opcodes using the eight bit wide immediate addressing mode. RD = RD ∗ IMM16 Examples: LDW ADD 10.8.1.7 R4,#$1234 R4,#$5678 ; translated to LDL R4,#$34; LDH R4,#$12 ; translated to ADDL R4,#$78; ADDH R4,#$56 Monadic Addressing (MON) In this addressing mode only one operand is explicitly given. This operand can either be the source (f(RD)), the target (RD = f()), or both source and target of the operation (RD = f(RD)). Examples: JAL SIF R1 R2 ; PC = R1, R1 = PC+2 ; Trigger IRQ associated with the channel number in R2.L MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 381 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.8 Dyadic Addressing (DYA) In this mode the result of an operation between two registers is stored in one of the registers used as operands. RD = RD ∗ RS is the general register to register format, with register RD being the first operand and RS the second. RD and RS can be any of the 8 general purpose registers R0 … R7. If R0 is used as the destination register, only the condition code flags are updated. This addressing mode is used only for shift operations with a variable shift value Examples: LSL LSR 10.8.1.9 R4,R5 R4,R5 ; R4 = R4 << R5 ; R4 = R4 >> R5 Triadic Addressing (TRI) In this mode the result of an operation between two or three registers is stored into a third one. RD = RS1 ∗ RS2 is the general format used in the order RD, RS1, RS1. RD, RS1, RS2 can be any of the 8 general purpose registers R0 … R7. If R0 is used as the destination register RD, only the condition code flags are updated. This addressing mode is used for all arithmetic and logical operations. Examples: ADC SUB R5,R6,R7 R5,R6,R7 ; R5 = R6 + R7 + Carry ; R5 = R6 - R7 10.8.1.10 Relative Addressing 9-Bit Wide (REL9) A 9-bit signed word address offset is included in the instruction word. This addressing mode is used for conditional branch instructions. Examples: BCC BEQ REL9 REL9 ; PC = PC + 2 + (REL9 << 1) ; PC = PC + 2 + (REL9 << 1) 10.8.1.11 Relative Addressing 10-Bit Wide (REL10) An 10-bit signed word address offset is included in the instruction word. This addressing mode is used for the unconditional branch instruction. Examples: BRA REL10 ; PC = PC + 2 + (REL10 << 1) 10.8.1.12 Index Register plus Immediate Offset (IDO5) (RS, #OFFS5) provides an unsigned offset from the base register. Examples: LDB STW R4,(R1,#OFFS5) R4,(R1,#OFFS5) ; loads a byte from (R1+OFFS5) into R4 ; stores R4 as a word to (R1+OFFS5) MC9S12XE-Family Reference Manual , Rev. 1.21 382 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.13 Index Register plus Register Offset (IDR) For load and store instructions (RS, RI) provides a variable offset in a register. Examples: LDB STW R4,(R1,R2) R4,(R1,R2) ; loads a byte from (R1+R2) into R4 ; stores R4 as a word to (R1+R2) 10.8.1.14 Index Register plus Register Offset with Post-increment (IDR+) [RS, RI+] provides a variable offset in a register, which is incremented after accessing the memory. In case of a byte access the index register will be incremented by one. In case of a word access it will be incremented by two. Examples: LDB STW R4,(R1,R2+) R4,(R1,R2+) ; loads a byte from (R1+R2) into R4, R2+=1 ; stores R4 as a word to (R1+R2), R2+=2 10.8.1.15 Index Register plus Register Offset with Pre-decrement (–IDR) [RS, -RI] provides a variable offset in a register, which is decremented before accessing the memory. In case of a byte access the index register will be decremented by one. In case of a word access it will be decremented by two. Examples: LDB STW 10.8.2 R4,(R1,-R2) R4,(R1,-R2) ; R2 -=1, loads a byte from (R1+R2) into R4 ; R2 -=2, stores R4 as a word to (R1+R2) Instruction Summary and Usage 10.8.2.1 Load & Store Instructions Any register can be loaded either with an immediate or from the address space using indexed addressing modes. LDL LDW RD,#IMM8 RD,(RB,RI) ; loads an immediate 8 bit value to the lower byte of RD ; loads data using RB+RI as effective address LDB RD,(RB, RI+) ; loads data using RB+RI as effective address ; followed by an increment of RI depending on ; the size of the operation The same set of modes is available for the store instructions STB RS,(RB, RI) ; stores data using RB+RI as effective address STW RS,(RB, RI+) ; stores data using RB+RI as effective address ; followed by an increment of RI depending on ; the size of the operation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 383 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.2.2 Logic and Arithmetic Instructions All logic and arithmetic instructions support the 8 bit immediate addressing mode (IMM8: RD = RD ∗ #IMM8) and the triadic addressing mode (TRI: RD = RS1 ∗ RS2). All arithmetic is considered as signed, sign, overflow, zero and carry flag will be updated. The carry will not be affected for logical operations. ADDL ANDH R2,#1 R4,#$FE ; increment R2 ; R4.H = R4.H & $FE, clear lower bit of higher byte ADD SUB R3,R4,R5 R3,R4,R5 ; R3 = R4 + R5 ; R3 = R4 - R5 AND OR R3,R4,R5 R3,R4,R5 ; R3 = R4 & R5 logical AND on the whole word ; R3 = R4 | R5 10.8.2.3 Register – Register Transfers This group comprises transfers from and to some special registers TFR R3,CCR ; transfers the condition code register to the low byte of ; register R3 Branch Instructions The branch offset is +255 words or -256 words counted from the beginning of the next instruction. Since instructions have a fixed 16 bit width, the branch offsets are word aligned by shifting the offset value by 2. BEQ label ; if Z flag = 1 branch to label An unconditional branch allows a +511 words or -512 words branch distance. BRA 10.8.2.4 label Shift Instructions Shift operations allow the use of a 4 bit wide immediate value to identify a shift width within a 16 bit word. For shift operations a value of 0 does not shift at all, while a value of 15 shifts the register RD by 15 bits. In a second form the shift value is contained in the bits 3:0 of the register RS. Examples: LSL LSR ASR R4,#1 R4,#3 R4,R2 ; R4 = R4 << 1; shift register R4 by 1 bit to the left ; R4 = R4 >> 3; shift register R4 by 3 bits to the right ; R4 = R4 >> R2;arithmetic shift register R4 right by the amount ; of bits contained in R2[3:0]. MC9S12XE-Family Reference Manual , Rev. 1.21 384 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.2.5 Bit Field Operations This addressing mode is used to identify the position and size of a bit field for insertion or extraction. The width and offset are coded in the lower byte of the source register 2, RS2. The content of the upper byte is ignored. An offset of 0 denotes the right most position and a width of 0 denotes 1 bit. These instructions are very useful to extract, insert, clear, set or toggle portions of a 16 bit word 7 4 3 W4 O4 5 2 W4=3, O4=2 15 0 RS2 0 RS1 Bit Field Extract Bit Field Insert 15 3 0 RD Figure 10-26. Bit Field Addressing BFEXT 10.8.2.6 R3,R4,R5 ; R5: W4+1 bits with offset O4, will be extracted from R4 into R3 Special Instructions for DMA Usage The XGATE offers a number of additional instructions for flag manipulation, program flow control and debugging: 1. SIF: Set a channel interrupt flag 2. SSEM: Test and set a hardware semaphore 3. CSEM: Clear a hardware semaphore 4. BRK: Software breakpoint 5. NOP: No Operation 6. RTS: Terminate the current thread 10.8.3 Cycle Notation Table 10-23 show the XGATE access detail notation. Each code letter equals one XGATE cycle. Each letter implies additional wait cycles if memories or peripherals are not accessible. Memories or peripherals are not accessible if they are blocked by the S12X_CPU. In addition to this Peripherals are only accessible every other XGATE cycle. Uppercase letters denote 16 bit operations. Lowercase letters denote 8 bit operations. The XGATE is able to perform two bus or wait cycles per S12X_CPU cycle. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 385 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-23. Access Detail Notation V — Vector fetch: always an aligned word read, lasts for at least one RISC core cycle P — Program word fetch: always an aligned word read, lasts for at least one RISC core cycle r — 8 bit data read: lasts for at least one RISC core cycle R — 16 bit data read: lasts for at least one RISC core cycle w — 8 bit data write: lasts for at least one RISC core cycle W — 16 bit data write: lasts for at least one RISC core cycle A — Alignment cycle: no read or write, lasts for zero or one RISC core cycles f — Free cycle: no read or write, lasts for one RISC core cycles Special Cases PP/P — Branch: PP if branch taken, P if not 10.8.4 Thread Execution When the RISC core is triggered by an interrupt request (see Figure 10-1) it first executes a vector fetch sequence which performs three bus accesses: 1. A V-cycle to fetch the initial content of the program counter. 2. A V-cycle to fetch the initial content of the data segment pointer (R1). 3. A P-cycle to load the initial opcode. Afterwards a sequence of instructions (thread) is executed which is terminated by an "RTS" instruction. If further interrupt requests are pending after a thread has been terminated, a new vector fetch will be performed. Otherwise the RISC core will either resume a previous thread (beginning with a P-cycle to refetch the interrupted opcode) or it will become idle until a new interrupt request is received. A thread can only be interrupted by an interrupt request of higher priority. 10.8.5 Instruction Glossary This section describes the XGATE instruction set in alphabetical order. MC9S12XE-Family Reference Manual , Rev. 1.21 386 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADC ADC Add with Carry Operation RS1 + RS2 + C ⇒ RD Adds the content of register RS1, the content of register RS2 and the value of the Carry bit using binary addition and stores the result in the destination register RD. The Zero Flag is also carried forward from the previous operation allowing 32 and more bit additions. Example: ADD ADC BCC R6,R2,R2 R7,R3,R3 ; R7:R6 = R5:R4 + R3:R2 ; conditional branch on 32 bit addition CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000 and Z was set before this operation; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Code and CPU Cycles Source Form ADC RD, RS1, RS2 Address Mode TRI Machine Code 0 0 0 1 1 RD RS1 Cycles RS2 1 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 387 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADD ADD Add without Carry Operation RS1 + RS2 ⇒ RD RD + IMM16 ⇒ RD (translates to ADDL RD, #IMM16[7:0]; ADDH RD, #IMM16[15:8]) Performs a 16 bit addition and stores the result in the destination register RD. NOTE When using immediate addressing mode (ADD RD, #IMM16), the V-flag and the C-Flag of the first instruction (ADDL RD, #IMM16[7:0]) are not considered by the second instruction (ADDH RD, #IMM16[15:8]). ⇒ Don’t rely on the V-Flag if RD + IMM16[7:0] ≥ 215. ⇒ Don’t rely on the C-Flag if RD + IMM16[7:0] ≥ 216. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Refer to ADDH instruction for #IMM16 operations. Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Refer to ADDH instruction for #IMM16 operations. Code and CPU Cycles Source Form Address Mode Machine Code RS1 Cycles ADD RD, RS1, RS2 TRI 0 0 0 1 1 RD RS2 1 0 P ADD RD, #IMM16 IMM8 1 1 1 0 0 RD IMM16[7:0] P IMM8 1 1 1 0 1 RD IMM16[15:8] P MC9S12XE-Family Reference Manual , Rev. 1.21 388 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADDH Add Immediate 8 bit Constant (High Byte) ADDH Operation RD + IMM8:$00 ⇒ RD Adds the content of high byte of register RD and a signed immediate 8 bit constant using binary addition and stores the result in the high byte of the destination register RD. This instruction can be used after an ADDL for a 16 bit immediate addition. Example: ADDL ADDH R2,#LOWBYTE R2,#HIGHBYTE ; R2 = R2 + 16 bit immediate CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old & IMM8[7] & RD[15]new | RD[15]old & IMM8[7] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & IMM8[7] | RD[15]old & RD[15]new | IMM8[7] & RD[15]new Code and CPU Cycles Source Form ADDH RD, #IMM8 Address Mode IMM8 Machine Code 1 1 1 0 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 389 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADDL Add Immediate 8 bit Constant (Low Byte) ADDL Operation RD + $00:IMM8 ⇒ RD Adds the content of register RD and an unsigned immediate 8 bit constant using binary addition and stores the result in the destination register RD. This instruction must be used first for a 16 bit immediate addition in conjunction with the ADDH instruction. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the 8 bit operation; cleared otherwise. RD[15]old & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & RD[15]new Code and CPU Cycles Source Form ADDL RD, #IMM8 Address Mode IMM8 Machine Code 1 1 1 0 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 390 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) AND AND Logical AND Operation RS1 & RS2 ⇒ RD RD & IMM16 ⇒ RD (translates to ANDL RD, #IMM16[7:0]; ANDH RD, #IMM16[15:8]) Performs a bit wise logical AND of two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (AND RD, #IMM16), the Z-flag of the first instruction (ANDL RD, #IMM16[7:0]) is not considered by the second instruction (ANDH RD, #IMM16[15:8]). ⇒ Don’t rely on the Z-Flag. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to ANDH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form AND RD, RS1, RS2 AND RD, #IMM16 Address Mode Machine Code RS1 Cycles TRI 0 0 0 1 0 RD RS2 0 0 P IMM8 1 0 0 0 0 RD IMM16[7:0] P IMM8 1 0 0 0 1 RD IMM16[15:8] P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 391 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ANDH Logical AND Immediate 8 bit Constant (High Byte) ANDH Operation RD.H & IMM8 ⇒ RD.H Performs a bit wise logical AND between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ANDH RD, #IMM8 Address Mode IMM8 Machine Code 1 0 0 0 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 392 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ANDL Logical AND Immediate 8 bit Constant (Low Byte) ANDL Operation RD.L & IMM8 ⇒ RD.L Performs a bit wise logical AND between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ANDL RD, #IMM8 Address Mode IMM8 Machine Code 1 0 0 0 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 393 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ASR ASR Arithmetic Shift Right Operation n b15 RD C n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with the sign bit (RD[15]). The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form ASR RD, #IMM4 ASR RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 0 0 1 P 0 0 0 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 394 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BCC BCC Branch if Carry Cleared (Same as BHS) Operation If C = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Carry flag and branches if C = 0. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BCC REL9 Address Mode REL9 Machine Code 0 0 1 0 0 0 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 395 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BCS BCS Branch if Carry Set (Same as BLO) Operation If C = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Carry flag and branches if C = 1. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BCS REL9 Address Mode REL9 Machine Code 0 0 1 0 0 0 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 396 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BEQ BEQ Branch if Equal Operation If Z = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Zero flag and branches if Z = 1. CCR Effect N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BEQ REL9 Address Mode REL9 Machine Code 0 0 1 0 0 1 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 397 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFEXT BFEXT Bit Field Extract Operation RS1[(o+w):o] ⇒ RD[w:0]; 0 ⇒ RD[15:(w+1)] w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position o and writes them right aligned into register RD. The remaining bits in RD will be cleared. If (o+w) > 15 only bits [15:o] get extracted. 15 7 4 3 0 W4 15 O4 5 RS2 2 0 W4=3, O4=2 RS1 Bit Field Extract 15 3 0 0 RD CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFEXT RD, RS1, RS2 Address Mode TRI Machine Code 0 1 1 0 0 RD RS1 Cycles RS2 1 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 398 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFFO BFFO Bit Field Find First One Operation FirstOne(RS) ⇒ RD; Searches the first “1” in register RS (from MSB to LSB) and writes the bit position into the destination register RD. The upper bits of RD are cleared. In case the content of RS is equal to $0000, RD will be cleared and the carry flag will be set. This is used to distinguish a “1” in position 0 versus no “1” in the whole RS register at all. CCR Effects N Z V C 0 ∆ 0 ∆ N: 0; cleared. Z: Set if the result is $0000; cleared otherwise. V: 0; cleared. C: Set if RS = $0000(1); cleared otherwise. 1. Before executing the instruction Code and CPU Cycles Source Form BFFO RD, RS Address Mode DYA Machine Code 0 0 0 0 1 RD RS Cycles 1 0 0 0 0 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 399 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINS BFINS Bit Field Insert Operation RS1[w:0] ⇒ RD[(w+o):o]; w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position 0 and writes them into register RD starting at position o. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to clear bits. 15 7 4 3 0 W4 O4 15 RS2 3 0 RS1 Bit Field Insert 15 5 2 0 W4=3, O4=2 RD CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINS RD, RS1, RS2 Address Mode TRI Machine Code 0 1 1 0 1 RD RS1 Cycles RS2 1 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 400 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINSI BFINSI Bit Field Insert and Invert Operation !RS1[w:0] ⇒ RD[w+o:o]; w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position 0, inverts them and writes into register RD starting at position o. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to set bits. 15 7 4 3 0 W4 O4 15 3 RS2 0 RS1 Inverted Bit Field Insert 15 5 2 0 W4=3, O4=2 RD CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINSI RD, RS1, RS2 Address Mode TRI Machine Code 0 1 1 1 0 RD RS1 Cycles RS2 1 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 401 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINSX BFINSX Bit Field Insert and XNOR Operation !(RS1[w:0] ^ RD[w+o:o]) ⇒ RD[w+o:o]; w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position 0, performs an XNOR with RD[w+o:o] and writes the bits back to RD. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to toggle bits. 15 7 4 3 0 W4 O4 15 3 RS2 0 RS1 Bit Field Insert XNOR 15 5 2 0 W4=3, O4=2 RD CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINSX RD, RS1, RS2 Address Mode TRI Machine Code 0 1 1 1 1 RD RS1 Cycles RS2 1 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 402 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BGE BGE Branch if Greater than or Equal to Zero Operation If N ^ V = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare signed numbers. Branch if RS1 ≥ RS2: SUB BGE R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BGE REL9 Address Mode REL9 Machine Code 0 0 1 1 0 1 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 403 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BGT BGT Branch if Greater than Zero Operation If Z | (N ^ V) = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare signed numbers. Branch if RS1 > RS2: SUB BGT R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BGT REL9 Address Mode REL9 Machine Code 0 0 1 1 1 0 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 404 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BHI BHI Branch if Higher Operation If C | Z = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare unsigned numbers. Branch if RS1 > RS2: SUB BHI R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BHI REL9 Address Mode REL9 Machine Code 0 0 1 1 0 0 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 405 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BHS BHS Branch if Higher or Same (Same as BCC) Operation If C = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare unsigned numbers. Branch if RS1 ≥ RS2: SUB BHS R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BHS REL9 Address Mode REL9 Machine Code 0 0 1 0 0 0 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 406 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BITH BITH Bit Test Immediate 8 bit Constant (High Byte) Operation RD.H & IMM8 ⇒ NONE Performs a bit wise logical AND between the high byte of register RD and an immediate 8 bit constant. Only the condition code flags get updated, but no result is written back. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BITH RD, #IMM8 Address Mode IMM8 Machine Code 1 0 0 1 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 407 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BITL BITL Bit Test Immediate 8 bit Constant (Low Byte) Operation RD.L & IMM8 ⇒ NONE Performs a bit wise logical AND between the low byte of register RD and an immediate 8 bit constant. Only the condition code flags get updated, but no result is written back. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BITL RD, #IMM8 Address Mode IMM8 Machine Code 1 0 0 1 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 408 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLE BLE Branch if Less or Equal to Zero Operation If Z | (N ^ V) = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare signed numbers. Branch if RS1 ≤ RS2: SUB BLE R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLE REL9 Address Mode REL9 Machine Code 0 0 1 1 1 0 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 409 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLO BLO Branch if Carry Set (Same as BCS) Operation If C = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare unsigned numbers. Branch if RS1 < RS2: SUB BLO R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLO REL9 Address Mode REL9 Machine Code 0 0 1 0 0 0 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 410 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLS BLS Branch if Lower or Same Operation If C | Z = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare unsigned numbers. Branch if RS1 ≤ RS2: SUB BLS R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLS REL9 Address Mode REL9 Machine Code 0 0 1 1 0 0 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 411 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLT BLT Branch if Lower than Zero Operation If N ^ V = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Branch instruction to compare signed numbers. Branch if RS1 < RS2: SUB BLT R0,RS1,RS2 REL9 CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLT REL9 Address Mode REL9 Machine Code 0 0 1 1 0 1 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 412 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BMI BMI Branch if Minus Operation If N = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the sign flag and branches if N = 1. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BMI REL9 Address Mode REL9 Machine Code 0 0 1 0 1 0 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 413 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BNE BNE Branch if Not Equal Operation If Z = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Zero flag and branches if Z = 0. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BNE REL9 Address Mode REL9 Machine Code 0 0 1 0 0 1 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 414 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BPL BPL Branch if Plus Operation If N = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Sign flag and branches if N = 0. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BPL REL9 Address Mode REL9 Machine Code 0 0 1 0 1 0 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 415 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BRA BRA Branch Always Operation PC + $0002 + (REL10 << 1) ⇒ PC Branches always. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BRA REL10 Address Mode REL10 Machine Code 0 0 1 1 1 1 Cycles REL10 PP MC9S12XE-Family Reference Manual , Rev. 1.21 416 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BRK BRK Break Operation Put XGATE into Debug Mode (see Section 10.6.1.0.1, “Entering Debug Mode”) and signals a software breakpoint to the S12X_DBG module (see section 4.9 of the S12X_DBG Section). NOTE It is not possible to single step over a BRK instruction. This instruction does not advance the program counter. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BRK Address Mode INH Machine Code 0 0 0 0 0 0 0 0 0 0 Cycles 0 0 0 0 0 0 PAff MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 417 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BVC BVC Branch if Overflow Cleared Operation If V = 0, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Overflow flag and branches if V = 0. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BVC REL9 Address Mode REL9 Machine Code 0 0 1 0 1 1 0 Cycles REL9 PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 418 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BVS BVS Branch if Overflow Set Operation If V = 1, then PC + $0002 + (REL9 << 1) ⇒ PC Tests the Overflow flag and branches if V = 1. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BVS REL9 Address Mode REL9 Machine Code 0 0 1 0 1 1 1 Cycles REL9 PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 419 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CMP CMP Compare Operation RS1 – RS2 ⇒ NONE (translates to SUB R0, RS1, RS2) RD – IMM16 ⇒ NONE (translates to CMPL RD, #IMM16[7:0]; CPCH RD, #IMM16[15:8]) Subtracts two 16 bit values and discards the result. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15] RD[15] & IMM16[15] & result[15] | RD[15] & IMM16[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15] RD[15] & IMM16[15] | RD[15] & result[15] | IMM16[15] & result[15] Code and CPU Cycles Source Form CMP RS1, RS2 CMP RS, #IMM16 Address Mode Machine Code 0 0 0 RS1 Cycles TRI 0 0 0 1 1 RS2 0 0 P IMM8 1 1 0 1 0 RS IMM16[7:0] P IMM8 1 1 0 1 1 RS IMM16[15:8] P MC9S12XE-Family Reference Manual , Rev. 1.21 420 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CMPL Compare Immediate 8 bit Constant (Low Byte) CMPL Operation RS.L – IMM8 ⇒ NONE, only condition code flags get updated Subtracts the 8 bit constant IMM8 contained in the instruction code from the low byte of the source register RS.L using binary subtraction and updates the condition code register accordingly. Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers can be performed by using the subtract instruction with R0 as destination register. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. Set if a two´s complement overflow resulted from the 8 bit operation; cleared otherwise. RS[7] & IMM8[7] & result[7] | RS[7] & IMM8[7] & result[7] Set if there is a carry from the Bit 7 to Bit 8 of the result; cleared otherwise. RS[7] & IMM8[7] | RS[7] & result[7] | IMM8[7] & result[7] Code and CPU Cycles Source Form CMPL RS, #IMM8 Address Mode IMM8 Machine Code 1 1 0 1 0 RS Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 421 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) COM COM One’s Complement Operation ~RS ⇒ RD (translates to XNOR RD, R0, RS) ~RD ⇒ RD (translates to XNOR RD, R0, RD) Performs a one’s complement on a general purpose register. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form Address Mode Machine Code Cycles COM RD, RS TRI 0 0 0 1 0 RD 0 0 0 RS 1 1 P COM RD TRI 0 0 0 1 0 RD 0 0 0 RD 1 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 422 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CPC CPC Compare with Carry Operation RS1 – RS2 - C ⇒ NONE (translates to SBC R0, RS1, RS2) Subtracts the carry bit and the content of register RS2 from the content of register RS1 using binary subtraction and discards the result. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15] Code and CPU Cycles Source Form CPC RS1, RS2 Address Mode TRI Machine Code 0 0 0 1 1 0 0 0 RS1 Cycles RS2 0 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 423 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CPCH Compare Immediate 8 bit Constant with Carry (High Byte) CPCH Operation RS.H - IMM8 - C ⇒ NONE, only condition code flags get updated Subtracts the carry bit and the 8 bit constant IMM8 contained in the instruction code from the high byte of the source register RD using binary subtraction and updates the condition code register accordingly. The carry bit and Zero bits are taken into account to allow a 16 bit compare in the form of CMPL CPCH BCC R2,#LOWBYTE R2,#HIGHBYTE ; branch condition Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers can be performed by using the subtract instruction with R0 as destination register. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $00 and Z was set before this operation; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS[15] & IMM8[7] & result[15] | RS[15] & IMM8[7] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS[15] & IMM8[7] | RS[15] & result[15] | IMM8[7] & result[15] Code and CPU Cycles Source Form CPCH RD, #IMM8 Address Mode IMM8 Machine Code 1 1 0 1 1 RS Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 424 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSEM CSEM Clear Semaphore Operation Unlocks a semaphore that was locked by the RISC core. In monadic address mode, bits RS[2:0] select the semaphore to be cleared. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form Address Mode Machine Code Cycles CSEM #IMM3 IMM3 0 0 0 0 0 IMM3 1 1 1 1 0 0 0 0 PA CSEM RS MON 0 0 0 0 0 RS 1 1 1 1 0 0 0 1 PA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 425 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSL CSL Logical Shift Left with Carry Operation n C RD C C C C n bits n = RS or IMM4 Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with the carry flag. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form CSL RD, #IMM4 CSL RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 0 1 0 P 0 0 1 0 P MC9S12XE-Family Reference Manual , Rev. 1.21 426 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSR CSR Logical Shift Right with Carry Operation n C C C C RD C n bits n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with the carry flag. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form CSR RD, #IMM4 CSR RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 0 1 1 P 0 0 1 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 427 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) JAL JAL Jump and Link Operation PC + $0002 ⇒ RD; RD ⇒ PC Jumps to the address stored in RD and saves the return address in RD. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form JAL RD Address Mode MON Machine Code 0 0 0 0 0 RD 1 1 Cycles 1 1 0 1 1 0 PP MC9S12XE-Family Reference Manual , Rev. 1.21 428 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDB LDB Load Byte from Memory (Low Byte) Operation M[RB, #OFFS5] M[RB, RI] M[RB, RI] RI-1 ⇒ RD.L; ⇒ RD.L; ⇒ RD.L; ⇒ RI; $00 ⇒ RD.H $00 ⇒ RD.H $00 ⇒ RD.H; M[RS, RI] ⇒ RD.L; RI+1 ⇒ RI;1 $00 ⇒ RD.H Loads a byte from memory into the low byte of register RD. The high byte is cleared. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDB RD, (RB, #OFFS5) Address Mode Machine Code Cycles IDO5 0 1 0 0 0 RD RB OFFS5 Pr LDB RD, (RS, RI) IDR 0 1 1 0 0 RD RB RI 0 0 Pr LDB RD, (RS, RI+) IDR+ 0 1 1 0 0 RD RB RI 0 1 Pr LDB RD, (RS, -RI) -IDR 0 1 1 0 0 RD RB RI 1 0 Pr 1. If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not be incremented after the data move: M[RB, RI] ⇒ RD.L; $00 ⇒ RD.H MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 429 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDH LDH Load Immediate 8 bit Constant (High Byte) Operation IMM8 ⇒ RD.H; Loads an 8 bit immediate constant into the high byte of register RD. The low byte is not affected. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDH RD, #IMM8 Address Mode IMM8 Machine Code 1 1 1 1 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 430 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDL LDL Load Immediate 8 bit Constant (Low Byte) Operation IMM8 ⇒ RD.L; $00 ⇒ RD.H Loads an 8 bit immediate constant into the low byte of register RD. The high byte is cleared. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDL RD, #IMM8 Address Mode IMM8 Machine Code 1 1 1 1 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 431 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDW LDW Load Word from Memory Operation M[RB, #OFFS5] M[RB, RI] M[RB, RI] RI-2 IMM16 ⇒ RD ⇒ RD ⇒ RD; RI+2 ⇒ RI1 ⇒ RI; M[RS, RI] ⇒ RD ⇒ RD (translates to LDL RD, #IMM16[7:0]; LDH RD, #IMM16[15:8]) Loads a 16 bit value into the register RD. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDW RD, (RB, #OFFS5) Address Mode Machine Code Cycles IDO5 0 1 0 0 1 RD RB OFFS5 PR LDW RD, (RB, RI) IDR 0 1 1 0 1 RD RB RI 0 0 PR LDW RD, (RB, RI+) IDR+ 0 1 1 0 1 RD RB RI 0 1 PR LDW RD, (RB, -RI) -IDR 0 1 1 0 1 RD RB RI 1 0 PR LDW RD, #IMM16 IMM8 1 1 1 1 0 RD IMM16[7:0] P IMM8 1 1 1 1 1 RD IMM16[15:8] P 1. If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not be incremented after the data move: M[RB, RI] ⇒ RD MC9S12XE-Family Reference Manual , Rev. 1.21 432 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LSL LSL Logical Shift Left Operation n C RD 0 0 0 0 n bits n = RS or IMM4 Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with zeros. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form LSL RD, #IMM4 LSL RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 1 0 0 P 0 1 0 0 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 433 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LSR LSR Logical Shift Right Operation n 0 0 0 0 RD C n bits n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with zeros. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form LSR RD, #IMM4 LSR RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 1 0 1 P 0 1 0 1 P MC9S12XE-Family Reference Manual , Rev. 1.21 434 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MOV MOV Move Register Content Operation RS ⇒ RD (translates to OR RD, R0, RS) Copies the content of RS to RD. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form MOV RD, RS Address Mode TRI Machine Code 0 0 0 1 0 RD 0 0 Cycles 0 RS 1 0 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 435 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NEG NEG Two’s Complement Operation –RS ⇒ RD (translates to SUB RD, R0, RS) –RD ⇒ RD (translates to SUB RD, R0, RD) Performs a two’s complement on a general purpose register. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS[15] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise RS[15] | RD[15]new Code and CPU Cycles Source Form Address Mode Machine Code Cycles NEG RD, RS TRI 0 0 0 1 1 RD 0 0 0 RS 0 0 P NEG RD TRI 0 0 0 1 1 RD 0 0 0 RD 0 0 P MC9S12XE-Family Reference Manual , Rev. 1.21 436 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NOP NOP No Operation Operation No Operation for one cycle. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form NOP Address Mode INH Machine Code 0 0 0 0 0 0 0 1 0 0 Cycles 0 0 0 0 0 0 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 437 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) OR OR Logical OR Operation RS1 | RS2 ⇒ RD RD | IMM16⇒ RD (translates to ORL RD, #IMM16[7:0]; ORH RD, #IMM16[15:8] Performs a bit wise logical OR between two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (OR RD, #IMM16), the Z-flag of the first instruction (ORL RD, #IMM16[7:0]) is not considered by the second instruction (ORH RD, #IMM16[15:8]). ⇒ Don’t rely on the Z-Flag. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to ORH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form OR RD, RS1, RS2 OR RD, #IMM16 Address Mode Machine Code RS1 Cycles TRI 0 0 0 1 0 RD RS2 1 0 P IMM8 1 0 1 0 0 RD IMM16[7:0] P IMM8 1 0 1 0 1 RD IMM16[15:8] P MC9S12XE-Family Reference Manual , Rev. 1.21 438 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ORH ORH Logical OR Immediate 8 bit Constant (High Byte) Operation RD.H | IMM8 ⇒ RD.H Performs a bit wise logical OR between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ORH RD, #IMM8 Address Mode IMM8 Machine Code 1 0 1 0 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 439 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ORL ORL Logical OR Immediate 8 bit Constant (Low Byte) Operation RD.L | IMM8 ⇒ RD.L Performs a bit wise logical OR between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ORL RD, #IMM8 Address Mode IMM8 Machine Code 1 0 1 0 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 440 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) PAR PAR Calculate Parity Operation Calculates the number of ones in the register RD. The Carry flag will be set if the number is odd, otherwise it will be cleared. CCR Effects N Z V C 0 ∆ 0 ∆ N: Z: V: C: 0; cleared. Set if RD is $0000; cleared otherwise. 0; cleared. Set if the number of ones in the register RD is odd; cleared otherwise. Code and CPU Cycles Source Form PAR, RD Address Mode MON Machine Code 0 0 0 0 0 RD 1 1 Cycles 1 1 0 1 0 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 441 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ROL ROL Rotate Left Operation RD n bits n = RS or IMM4 Rotates the bits in register RD n positions to the left. The lower n bits of the register RD are filled with the upper n bits. Two source forms are available. In the first form, the parameter n is contained in the instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits of the source register RS[3:0]. All other bits in RS are ignored. If n is zero, no shift will take place and the register RD will be unaffected; however, the condition code flags will be updated. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ROL RD, #IMM4 ROL RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 1 1 0 P 0 1 1 0 P MC9S12XE-Family Reference Manual , Rev. 1.21 442 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ROR ROR Rotate Right Operation RD n bits n = RS or IMM4 Rotates the bits in register RD n positions to the right. The upper n bits of the register RD are filled with the lower n bits. Two source forms are available. In the first form, the parameter n is contained in the instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits of the source register RS[3:0]. All other bits in RS are ignored. If n is zero no shift will take place and the register RD will be unaffected; however, the condition code flags will be updated. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ROR RD, #IMM4 ROR RD, RS Address Mode Machine Code IMM4 0 0 0 0 1 RD IMM4 DYA 0 0 0 0 1 RD RS Cycles 1 1 1 1 1 P 0 1 1 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 443 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) RTS RTS Return to Scheduler Operation Terminates the current thread of program execution. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form RTS Address Mode INH Machine Code 0 0 0 0 0 0 1 0 0 0 Cycles 0 0 0 0 0 0 PA MC9S12XE-Family Reference Manual , Rev. 1.21 444 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SBC SBC Subtract with Carry Operation RS1 - RS2 - C ⇒ RD Subtracts the content of register RS2 and the value of the Carry bit from the content of register RS1 using binary subtraction and stores the result in the destination register RD. Also the zero flag is carried forward from the previous operation allowing 32 and more bit subtractions. Example: SUB SBC BCC R6,R4,R2 R7,R5,R3 ; R7:R6 = R5:R4 - R3:R2 ; conditional branch on 32 bit subtraction CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000 and Z was set before this operation; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Code and CPU Cycles Source Form SBC RD, RS1, RS2 Address Mode TRI Machine Code 0 0 0 1 1 RD RS1 Cycles RS2 0 1 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 445 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SEX SEX Sign Extend Byte to Word Operation The result in RD is the 16 bit sign extended representation of the original two’s complement number in the low byte of RD.L. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form SEX RD Address Mode MON Machine Code 0 0 0 0 0 RD 1 1 Cycles 1 1 0 1 0 0 P MC9S12XE-Family Reference Manual , Rev. 1.21 446 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SIF SIF Set Interrupt Flag Operation Sets the interrupt flag of an XGATE channel (XGIF). This instruction supports two source forms. If inherent address mode is used, then the interrupt flag of the current channel (XGCHID) will be set. If the monadic address form is used, the interrupt flag associated with the channel id number contained in RS[6:0] is set. The content of RS[15:7] is ignored. NOTE Interrupt flags of reserved channels (see Device User Guide) can’t be set. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form SIF SIF RS Address Mode Machine Code INH 0 0 0 0 0 MON 0 0 0 0 0 0 1 RS 1 Cycles 0 0 0 0 0 0 0 0 PA 1 1 1 1 0 1 1 1 PA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 447 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SSEM SSEM Set Semaphore Operation Attempts to set a semaphore. The state of the semaphore will be stored in the Carry-Flag: 1 = Semaphore is locked by the RISC core 0 = Semaphore is locked by the S12X_CPU In monadic address mode, bits RS[2:0] select the semaphore to be set. CCR Effects N Z V C — — — ∆ N: Z: V: C: Not affected. Not affected. Not affected. Set if semaphore is locked by the RISC core; cleared otherwise. Code and CPU Cycles Source Form Address Mode Machine Code Cycles SSEM #IMM3 IMM3 0 0 0 0 0 IMM3 1 1 1 1 0 0 1 0 PA SSEM RS MON 0 0 0 0 0 RS 1 1 1 1 0 0 1 1 PA MC9S12XE-Family Reference Manual , Rev. 1.21 448 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) STB STB Store Byte to Memory (Low Byte) Operation RS.L ⇒ M[RB, #OFFS5] RS.L ⇒ M[RB, RI] RS.L ⇒ M[RB, RI]; RI+1 ⇒ RI; RI–1 ⇒ RI; RS.L ⇒ M[RB, RI]1 Stores the low byte of register RS to memory. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form STB RS, (RB, #OFFS5), Address Mode Machine Code Cycles IDO5 0 1 0 1 0 RS RB OFFS5 Pw STB RS, (RB, RI) IDR 0 1 1 1 0 RS RB RI 0 0 Pw STB RS, (RB, RI+) IDR+ 0 1 1 1 0 RS RB RI 0 1 Pw STB RS, (RB, -RI) -IDR 0 1 1 1 0 RS RB RI 1 0 Pw 1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source register is written to the memory: RS.L ⇒ M[RB, RS-1]; RS-1 ⇒ RS MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 449 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) STW STW Store Word to Memory Operation RS ⇒ M[RB, #OFFS5] RS ⇒ M[RB, RI] RS ⇒ M[RB, RI]; RI+2 ⇒ RI; RI–2 ⇒ RI; RS ⇒ M[RB, RI]1 Stores the content of register RS to memory. CCR Effects N Z V C — — — — N: Z: V: C: Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form STW RS, (RB, #OFFS5) Address Mode Machine Code Cycles IDO5 0 1 0 1 1 RS RB OFFS5 PW STW RS, (RB, RI) IDR 0 1 1 1 1 RS RB RI 0 0 PW STW RS, (RB, RI+) IDR+ 0 1 1 1 1 RS RB RI 0 1 PW STW RS, (RB, -RI) -IDR 0 1 1 1 1 RS RB RI 1 0 PW 1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source register is written to the memory: RS ⇒ M[RB, RS–2]; RS–2 ⇒ RS MC9S12XE-Family Reference Manual , Rev. 1.21 450 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUB SUB Subtract without Carry Operation RS1 – RS2 ⇒ RD RD − IMM16 ⇒ RD (translates to SUBL RD, #IMM16[7:0]; SUBH RD, #IMM16{15:8]) Subtracts two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (SUB RD, #IMM16), the V-flag and the C-Flag of the first instruction (SUBL RD, #IMM16[7:0]) are not considered by the second instruction (SUBH RD, #IMM16[15:8]). ⇒ Don’t rely on the V-Flag if RD - IMM16[7:0] < −215. ⇒ Don’t rely on the C-Flag if RD < IMM16[7:0]. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Refer to SUBH instruction for #IMM16 operations. Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Refer to SUBH instruction for #IMM16 operations. Code and CPU Cycles Source Form SUB RD, RS1, RS2 SUB RD, #IMM16 Address Mode Machine Code RS1 Cycles TRI 0 0 0 1 1 RD RS2 0 0 P IMM8 1 1 0 0 0 RD IMM16[7:0] P IMM8 1 1 0 0 1 RD IMM16[15:8] P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 451 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUBH Subtract Immediate 8 bit Constant (High Byte) SUBH Operation RD – IMM8:$00 ⇒ RD Subtracts a signed immediate 8 bit constant from the content of high byte of register RD and using binary subtraction and stores the result in the high byte of destination register RD. This instruction can be used after an SUBL for a 16 bit immediate subtraction. Example: SUBL SUBH R2,#LOWBYTE R2,#HIGHBYTE ; R2 = R2 - 16 bit immediate CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RD[15]old & IMM8[7] & RD[15]new | RD[15]old & IMM8[7] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & IMM8[7] | RD[15]old & RD[15]new | IMM8[7] & RD[15]new Code and CPU Cycles Source Form SUBH RD, #IMM8 Address Mode IMM8 Machine Code 1 1 0 0 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 452 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUBL Subtract Immediate 8 bit Constant (Low Byte) SUBL Operation RD – $00:IMM8 ⇒ RD Subtracts an immediate 8 bit constant from the content of register RD using binary subtraction and stores the result in the destination register RD. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the 8 bit operation; cleared otherwise. RD[15]old & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & RD[15]new Code and CPU Cycles Source Form SUBL RD, #IMM8 Address Mode IMM8 Machine Code 1 1 0 0 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 453 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) TFR TFR Transfer from and to Special Registers Operation TFR RD,CCR: CCR ⇒ RD[3:0]; 0 ⇒ RD[15:4] TFR CCR,RD: RD[3:0] ⇒ CCR TFR RD,PC: PC+4 ⇒ RD Transfers the content of one RISC core register to another. The TFR RD,PC instruction can be used to implement relative subroutine calls. Example: RETADDR SUBR TFR BRA ... ... JAL R7,PC SUBR ;Return address (RETADDR) is stored in R7 ;Relative branch to subroutine (SUBR) R7 ;Jump to return address (RETADDR) CCR Effects TFR RD,CCR, TFR RD,PC: TFR CCR,RS: N Z V C N Z V C — — — — ∆ ∆ ∆ ∆ N: Z: V: C: Not affected. Not affected. Not affected. Not affected. N: Z: V: C: RS[3]. RS[2]. RS[1]. RS[0]. Code and CPU Cycles Source Form Address Mode Machine Code Cycles TFR RD,CCR CCR ⇒ RD MON 0 0 0 0 0 RD 1 1 1 1 1 0 0 0 P TFR CCR,RS RS ⇒ CCR MON 0 0 0 0 0 RS 1 1 1 1 1 0 0 1 P TFR RD,PCPC+4 ⇒ RD MON 0 0 0 0 0 RD 1 1 1 1 1 0 1 0 P MC9S12XE-Family Reference Manual , Rev. 1.21 454 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) TST TST Test Register Operation RS – 0 ⇒ NONE (translates to SUB R0, RS, R0) Subtracts zero from the content of register RS using binary subtraction and discards the result. CCR Effects N Z V C ∆ ∆ ∆ ∆ N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a two´s complement overflow resulted from the operation; cleared otherwise. RS[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & result[15] Code and CPU Cycles Source Form TST RS Address Mode TRI Machine Code 0 0 0 1 1 0 0 0 RS1 Cycles 0 0 0 0 0 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 455 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNOR XNOR Logical Exclusive NOR Operation ~(RS1 ^ RS2) ⇒ RD ~(RD ^ IMM16)⇒ RD (translates to XNOR RD, #IMM16{15:8]; XNOR RD, #IMM16[7:0]) Performs a bit wise logical exclusive NOR between two 16 bit values and stores the result in the destination register RD. Remark: Using R0 as a source registers will calculate the one’s complement of the other source register. Using R0 as both source operands will fill RD with $FFFF. NOTE When using immediate addressing mode (XNOR RD, #IMM16), the Z-flag of the first instruction (XNORL RD, #IMM16[7:0]) is not considered by the second instruction (XNORH RD, #IMM16[15:8]). ⇒ Don’t rely on the Z-Flag. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to XNORH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form XNOR RD, RS1, RS2 XNOR RD, #IMM16 Address Mode Machine Code RS1 Cycles TRI 0 0 0 1 0 RD RS2 1 1 P IMM8 1 0 1 1 0 RD IMM16[7:0] P IMM8 1 0 1 1 1 RD IMM16[15:8] P MC9S12XE-Family Reference Manual , Rev. 1.21 456 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNORH Logical Exclusive NOR Immediate 8 bit Constant (High Byte) XNORH Operation ~(RD.H ^ IMM8) ⇒ RD.H Performs a bit wise logical exclusive NOR between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form XNORH RD, #IMM8 Address Mode IMM8 Machine Code 1 0 1 1 1 RD Cycles IMM8 P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 457 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNORL Logical Exclusive NOR Immediate 8 bit Constant (Low Byte) XNORL Operation ~(RD.L ^ IMM8) ⇒ RD.L Performs a bit wise logical exclusive NOR between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C ∆ ∆ 0 — N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form XNORL RD, #IMM8 Address Mode IMM8 Machine Code 1 0 1 1 0 RD Cycles IMM8 P MC9S12XE-Family Reference Manual , Rev. 1.21 458 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.6 Instruction Coding Table 10-24 summarizes all XGATE instructions in the order of their machine coding. Table 10-24. Instruction Set Summary (Sheet 1 of 3) Functionality Return to Scheduler and Others BRK NOP RTS SIF Semaphore Instructions CSEM IMM3 CSEM RS SSEM IMM3 SSEM RS Single Register Instructions SEX RD PAR RD JAL RD SIF RS Special Move instructions TFR RD,CCR TFR CCR,RS TFR RD,PC Shift instructions Dyadic BFFO RD, RS ASR RD, RS CSL RD, RS CSR RD, RS LSL RD, RS LSR RD, RS ROL RD, RS ROR RD, RS Shift instructions immediate ASR RD, #IMM4 CSL RD, #IMM4 CSR RD, #IMM4 LSL RD, #IMM4 LSR RD, #IMM4 ROL RD, #IMM4 ROR RD, #IMM4 Logical Triadic AND RD, RS1, RS2 OR RD, RS1, RS2 XNOR RD, RS1, RS2 Arithmetic Triadic SUB RD, RS1, RS2 SBC RD, RS1, RS2 ADD RD, RS1, RS2 ADC RD, RS1, RS2 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 IMM3 RS IMM3 RS 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RD RD RD RS 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RD RS RD 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 RD RD RD RD RD RD RD RD 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 RD RD RD RD RD RD RD 1 1 1 1 1 1 1 0 0 0 1 1 1 1 0 1 1 0 0 1 1 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 For compare use SUB R0,Rs1,Rs2 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 0 0 1 1 0 1 0 1 RS RS RS RS RS RS RS RS IMM4 IMM4 IMM4 IMM4 IMM4 IMM4 IMM4 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 459 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-24. Instruction Set Summary (Sheet 2 of 3) Functionality Branches BCC REL9 BCS REL9 BNE REL9 BEQ REL9 BPL REL9 BMI REL9 BVC REL9 BVS REL9 BHI REL9 BLS REL9 BGE REL9 BLT REL9 BGT REL9 BLE REL9 BRA REL10 Load and Store Instructions LDB RD, (RB, #OFFS5) LDW RD, (RB, #OFFS5) STB RS, (RB, #OFFS5) STW RS, (RB, #OFFS5) LDB RD, (RB, RI) LDW RD, (RB, RI) STB RS, (RB, RI) STW RS, (RB, RI) LDB RD, (RB, RI+) LDW RD, (RB, RI+) STB RS, (RB, RI+) STW RS, (RB, RI+) LDB RD, (RB, –RI) LDW RD, (RB, –RI) STB RS, (RB, –RI) STW RS, (RB, –RI) Bit Field Instructions BFEXT RD, RS1, RS2 BFINS RD, RS1, RS2 BFINSI RD, RS1, RS2 BFINSX RD, RS1, RS2 Logic Immediate Instructions ANDL RD, #IMM8 ANDH RD, #IMM8 BITL RD, #IMM8 BITH RD, #IMM8 ORL RD, #IMM8 ORH RD, #IMM8 XNORL RD, #IMM8 XNORH RD, #IMM8 15 14 13 12 11 10 9 8 7 6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 RD RD RS RS RD RD RS RS RD RD RS RS RD RD RS RS RB RB RB RB RB RB RB RB RB RB RB RB RB RB RB RB 0 0 0 0 1 1 1 1 1 1 1 1 0 0 1 1 0 1 0 1 RD RD RD RD RS1 RS1 RS1 RS1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 RD RD RD RD RD RD RD RD 5 4 3 2 1 0 RI RI RI RI RI RI RI RI RI RI RI RI 0 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 RS2 RS2 RS2 RS2 1 1 1 1 1 1 1 1 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL10 OFFS5 OFFS5 OFFS5 OFFS5 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 MC9S12XE-Family Reference Manual , Rev. 1.21 460 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-24. Instruction Set Summary (Sheet 3 of 3) Functionality Arithmetic Immediate Instructions SUBL RD, #IMM8 SUBH RD, #IMM8 CMPL RS, #IMM8 CPCH RS, #IMM8 ADDL RD, #IMM8 ADDH RD, #IMM8 LDL RD, #IMM8 LDH RD, #IMM8 10.9 10.9.1 15 14 13 12 11 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 10 9 8 7 6 RD RD RS RS RD RD RD RD 5 4 3 2 1 0 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 Initialization and Application Information Initialization The recommended initialization of the XGATE is as follows: 1. Clear the XGE bit to suppress any incoming service requests. 2. Make sure that no thread is running on the XGATE. This can be done in several ways: a) Poll the XGCHID register until it reads $00. Also poll XGDBG and XGSWEF to make sure that the XGATE has not been stopped. b) Enter Debug Mode by setting the XGDBG bit. Clear the XGCHID register. Clear the XGDBG bit. The recommended method is a). 3. Set the XGVBR register to the lowest address of the XGATE vector space. 4. Clear all Channel ID flags. 5. Copy XGATE vectors and code into the RAM. 6. Initialize the S12X_INT module. 7. Enable the XGATE by setting the XGE bit. The following code example implements the XGATE initialization sequence. 10.9.2 Code Example (Transmit "Hello World!" on SCI) SCI_REGS SCIBDH SCIBDL SCICR2 SCISR1 SCIDRL TIE TE RE CPU S12X ;########################################### ;# SYMBOLS # ;########################################### EQU $00C8 ;SCI register space EQU SCI_REGS+$00; ;SCI Baud Rate Register EQU SCI_REGS+$00 ;SCI Baud Rate Register EQU SCI_REGS+$03 ;SCI Control Register 2 EQU SCI_REGS+$04 ;SCI Status Register 1 EQU SCI_REGS+$07 ;SCI Control Register 2 EQU $80 ;TIE bit mask EQU $08 ;TE bit mask EQU $04 ;RE bit mask MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 461 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SCI_VEC EQU $D6 ;SCI vector number INT_REGS INT_CFADDR INT_CFDATA RQST EQU EQU EQU EQU $0120 INT_REGS+$07 INT_REGS+$08 $80 ;S12X_INT register space ;Interrupt Configuration Address Register ;Interrupt Configuration Data Registers ;RQST bit mask XGATE_REGS XGMCTL XGMCTL_CLEAR XGMCTL_ENABLE XGCHID XGISPSEL XGVBR XGIF XGSWT XGSEM EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU $0380 XGATE_REGS+$00 $FA02 $8282 XGATE_REGS+$02 XGATE_REGS+$05 XGATE_REGS+$06 XGATE_REGS+$08 XGATE_REGS+$18 XGATE_REGS+$1A ;XGATE register space ;XGATE Module Control Register ;Clear all XGMCTL bits ;Enable XGATE ;XGATE Channel ID Register ;XGATE Channel ID Register ;XGATE ISP Select Register ;XGATE Interrupt Flag Vector ;XGATE Software Trigger Register ;XGATE Semaphore Register RPAGE EQU $0016 RAM_SIZE EQU 32*$400 RAM_START RAM_START_XG RAM_START_GLOB EQU EQU EQU $1000 $10000-RAM_SIZE $100000-RAM_SIZE XGATE_VECTORS XGATE_VECTORS_XG EQU EQU RAM_START RAM_START_XG XGATE_DATA XGATE_DATA_XG EQU EQU RAM_START+(4*128) RAM_START_XG+(4*128) XGATE_CODE XGATE_CODE_XG EQU EQU XGATE_DATA+(XGATE_CODE_FLASH-XGATE_DATA_FLASH) XGATE_DATA_XG+(XGATE_CODE_FLASH-XGATE_DATA_FLASH) BUS_FREQ_HZ EQU 40000000 ;32k RAM ;########################################### ;# S12XE VECTOR TABLE # ;########################################### ORG $FF10 ;non-maskable interrupts DW DUMMY_ISR DUMMY_ISR DUMMY_ISR DUMMY_ISR ORG DW $FFF4 ;non-maskable interrupts DUMMY_ISR DUMMY_ISR DUMMY_ISR ORG DW $FFFA ;resets START_OF_CODE START_OF_CODE START_OF_CODE ;########################################### ;# DISABLE COP # ;########################################### ORG $FF0E DW $FFFE ORG $C000 START_OF_CODE MC9S12XE-Family Reference Manual , Rev. 1.21 462 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ;########################################### ;# INITIALIZE S12XE CORE # ;########################################### SEI MOVB #(RAM_START_GLOB>>12), RPAGE ;set RAM page INIT_SCI INIT_INT INIT_XGATE INIT_XGATE_BUSY_LOOP ;########################################### ;# INITIALIZE SCI # ;########################################### MOVW #(BUS_FREQ_HZ/(16*9600)), SCIBDH;set baud rate MOVB #(TIE|TE), SCICR2;enable tx buffer empty interrupt ;########################################### ;# INITIALIZE S12X_INT # ;########################################### MOVB #(SCI_VEC&$F0), INT_CFADDR ;switch SCI interrupts to XGATE MOVB #RQST|$01, INT_CFDATA+((SCI_VEC&$0F)>>1) ;########################################### ;# INITIALIZE XGATE # ;########################################### MOVW #XGMCTL_CLEAR, XGMCTL ;clear all XGMCTL bits TST BNE XGCHID ;wait until current thread is finished INIT_XGATE_BUSY_LOOP LDX LDD STD STD STD STD STD STD STD STD #XGIF #$FFFF 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ ;clear all channel interrupt flags CLR XGISPSEL ;set vector base register MOVW #XGATE_VECTORS_XG, XGVBR MOVW #$FF00, XGSWT ;clear all software triggers INIT_XGATE_VECTAB_LOOP ;########################################### ;# INITIALIZE XGATE VECTOR TABLE # ;########################################### LDAA #128 ;build XGATE vector table LDY #XGATE_VECTORS MOVW #XGATE_DUMMY_ISR_XG, 4,Y+ DBNE A, INIT_XGATE_VECTAB_LOOP MOVW #XGATE_CODE_XG, RAM_START+(2*SCI_VEC) MOVW #XGATE_DATA_XG, RAM_START+(2*SCI_VEC)+2 COPY_XGATE_CODE COPY_XGATE_CODE_LOOP ;########################################### ;# COPY XGATE CODE # ;########################################### LDX #XGATE_DATA_FLASH MOVW 2,X+, 2,Y+ MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 463 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MOVW MOVW MOVW CPX BLS START_XGATE ;########################################### ;# START XGATE # ;########################################### MOVW #XGMCTL_ENABLE, XGMCTL ;enable XGATE BRA * ;########################################### ;# DUMMY INTERRUPT SERVICE ROUTINE # ;########################################### RTI DUMMY_ISR XGATE_DATA_FLASH XGATE_DATA_SCI XGATE_DATA_IDX XGATE_DATA_MSG XGATE_CODE_FLASH XGATE_CODE_DONE XGATE_CODE_FLASH_END XGATE_DUMMY_ISR_XG 10.9.3 2,X+, 2,Y+ 2,X+, 2,Y+ 2,X+, 2,Y+ #XGATE_CODE_FLASH_END COPY_XGATE_CODE_LOOP CPU XGATE ;########################################### ;# XGATE DATA # ;########################################### ALIGN 1 EQU * EQU *-XGATE_DATA_FLASH DW SCI_REGS ;pointer to SCI register space EQU *-XGATE_DATA_FLASH DB XGATE_DATA_MSG ;string pointer EQU *-XGATE_DATA_FLASH FCC "Hello World! ;ASCII string DB $0D ;CR ;########################################### ;# XGATE CODE # ;########################################### ALIGN 1 LDW R2,(R1,#XGATE_DATA_SCI) ;SCI -> R2 LDB R3,(R1,#XGATE_DATA_IDX) ;msg -> R3 LDB R4,(R1,R3+) ;curr. char -> R4 STB R3,(R1,#XGATE_DATA_IDX) ;R3 -> idx LDB R0,(R2,#(SCISR1-SCI_REGS)) ;initiate SCI transmit STB R4,(R2,#(SCIDRL-SCI_REGS)) ;initiate SCI transmit CMPL R4,#$0D BEQ XGATE_CODE_DONE RTS LDL R4,#$00 ;disable SCI interrupts STB R4,(R2,#(SCICR2-SCI_REGS)) LDL R3,#XGATE_DATA_MSG;reset R3 STB R3,(R1,#XGATE_DATA_IDX) RTS EQU (XGATE_CODE_FLASH_END-XGATE_CODE_FLASH)+XGATE_CODE_XG Stack Support To simplify the implementation of a program stack the XGATE can be configured to set RISC core register R7 to the beginning of a stack region before executing a thread. Two separate stack regions can be defined: One for threads of priority level 7 to 4 (refer to Section 10.3.1.5, “XGATE Initial Stack Pointer for MC9S12XE-Family Reference Manual , Rev. 1.21 464 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Interrupt Priorities 7 to 4 (XGISP74)”) and one for threads of priority level 3 to 1 (refer to Section 10.3.1.6, “XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31)”). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 465 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MC9S12XE-Family Reference Manual , Rev. 1.21 466 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-1. Revision History Revision Number Revision Date V01.00 26 Oct. 2005 V01.01 02 Nov 2006 11.4.1.1/11-484 Table “Examples of IPLL Divider settings”: corrected $32 to $31 V01.02 4 Mar. 2008 11.4.1.4/11-487 Corrected details 11.4.3.3/11-491 V01.03 1 Sep. 2008 V01.04 20 Nov. 2008 11.1 Sections Affected Description of Changes Initial release Table 11-14 added 100MHz example for PLL 11.3.2.4/11-473 S12XECRG Flags Register: corrected address to Module Base + 0x0003 Introduction This specification describes the function of the Clocks and Reset Generator (S12XECRG). 11.1.1 Features The main features of this block are: • Phase Locked Loop (IPLL) frequency multiplier with internal filter — Reference divider — Post divider — Configurable internal filter (no external pin) — Optional frequency modulation for defined jitter and reduced emission — Automatic frequency lock detector — Interrupt request on entry or exit from locked condition — Self Clock Mode in absence of reference clock • System Clock Generator — Clock Quality Check — User selectable fast wake-up from Stop in Self-Clock Mode for power saving and immediate program execution — Clock switch for either Oscillator or PLL based system clocks • Computer Operating Properly (COP) watchdog timer with time-out clear window. • System Reset generation from the following possible sources: — Power on reset — Low voltage reset MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 467 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) • — Illegal address reset — COP reset — Loss of clock reset — External pin reset Real-Time Interrupt (RTI) 11.1.2 Modes of Operation This subsection lists and briefly describes all operating modes supported by the S12XECRG. • Run Mode All functional parts of the S12XECRG are running during normal Run Mode. If RTI or COP functionality is required the individual bits of the associated rate select registers (COPCTL, RTICTL) have to be set to a non zero value. • Wait Mode In this mode the IPLL can be disabled automatically depending on the PLLWAI bit. • Stop Mode Depending on the setting of the PSTP bit Stop Mode can be differentiated between Full Stop Mode (PSTP = 0) and Pseudo Stop Mode (PSTP = 1). — Full Stop Mode The oscillator is disabled and thus all system and core clocks are stopped. The COP and the RTI remain frozen. — Pseudo Stop Mode The oscillator continues to run and most of the system and core clocks are stopped. If the respective enable bits are set the COP and RTI will continue to run, else they remain frozen. • Self Clock Mode Self Clock Mode will be entered if the Clock Monitor Enable Bit (CME) and the Self Clock Mode Enable Bit (SCME) are both asserted and the clock monitor in the oscillator block detects a loss of clock. As soon as Self Clock Mode is entered the S12XECRG starts to perform a clock quality check. Self Clock Mode remains active until the clock quality check indicates that the required quality of the incoming clock signal is met (frequency and amplitude). Self Clock Mode should be used for safety purposes only. It provides reduced functionality to the MCU in case a loss of clock is causing severe system conditions. 11.1.3 Block Diagram Figure 11-1 shows a block diagram of the S12XECRG. MC9S12XE-Family Reference Manual , Rev. 1.21 468 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Illegal Address Reset S12X_MMC Power on Reset Voltage Regulator Low Voltage Reset ICRG RESET CM Fail Clock Monitor OSCCLK EXTAL Oscillator XTAL COP Timeout XCLKS Reset Generator Clock Quality Checker System Reset Bus Clock Core Clock COP RTI Oscillator Clock Registers PLLCLK VDDPLL IPLL VSSPLL Real Time Interrupt Clock and Reset Control PLL Lock Interrupt Self Clock Mode Interrupt Figure 11-1. Block diagram of S12XECRG 11.2 Signal Description This section lists and describes the signals that connect off chip. 11.2.1 VDDPLL, VSSPLL These pins provides operating voltage (VDDPLL) and ground (VSSPLL) for the IPLL circuitry. This allows the supply voltage to the IPLL to be independently bypassed. Even if IPLL usage is not required VDDPLL and VSSPLL must be connected to properly. 11.2.2 RESET RESET is an active low bidirectional reset pin. As an input it initializes the MCU asynchronously to a known start-up state. As an open-drain output it indicates that an system reset (internal to MCU) has been triggered. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 469 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3 Memory Map and Registers This section provides a detailed description of all registers accessible in the S12XECRG. 11.3.1 Module Memory Map Figure 11-2 gives an overview on all S12XECRG registers. Address Name 0x0000 SYNR 0x0001 REFDV 0x0002 POSTDIV 0x0003 CRGFLG 0x0004 CRGINT 0x0005 CLKSEL 0x0006 PLLCTL 0x0007 RTICTL 0x0008 COPCTL 0x0009 FORBYP2 0x000A CTCTL2 0x000B ARMCOP Bit 7 R W R W R 6 5 4 3 VCOFRQ[1:0] SYNDIV[5:0] REFFRQ[1:0] REFDIV[5:0] 0 0 0 RTIF PORF LVRF W R W 0 0 R RTIE LOCKIF LOCKIE LOCK 0 XCLKS 0 PLLON FM1 FM0 FSTWKP RTDEC RTR6 RTR5 RTR4 RTR3 WCOP RSBCK 0 0 0 0 0 0 0 0 0 0 R 0 0 W Bit 7 Bit 6 W R W R W R W R PLLSEL PSTP CME 1 Bit 0 POSTDIV[4:0] W R 2 PLLWAI ILAF 0 0 SCMIF SCMIE SCM 0 RTIWAI COPWAI PRE PCE SCME RTR2 RTR1 RTR0 CR2 CR1 CR0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 WRTMASK W R W 2. FORBYP and CTCTL are intended for factory test purposes only. = Unimplemented or Reserved Figure 11-2. CRG Register Summary NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. MC9S12XE-Family Reference Manual , Rev. 1.21 470 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3.2 Register Descriptions This section describes in address order all the S12XECRG registers and their individual bits. 11.3.2.1 S12XECRG Synthesizer Register (SYNR) The SYNR register controls the multiplication factor of the IPLL and selects the VCO frequency range. Module Base + 0x0000 7 6 5 4 3 2 1 0 0 0 0 R VCOFRQ[1:0] SYNDIV[5:0] W Reset 0 0 0 0 0 Figure 11-3. S12XECRG Synthesizer Register (SYNR) Read: Anytime Write: Anytime except if PLLSEL = 1 NOTE Write to this register initializes the lock detector bit. ( SYNDIV + 1 ) f VCO = 2 × f OSC × ------------------------------------( REFDIV + 1 ) f VCO f PLL = -----------------------------------2 × POSTDIV f PLL f BUS = ------------2 NOTE fVCO must be within the specified VCO frequency lock range. F.BUS (Bus Clock) must not exceed the specified maximum. If POSTDIV = $00 then fPLL is same as fVCO (divide by one). The VCOFRQ[1:0] bit are used to configure the VCO gain for optimal stability and lock time. For correct IPLL operation the VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK frequency as shown in Table 11-2. Setting the VCOFRQ[1:0] bits wrong can result in a non functional IPLL (no locking and/or insufficient stability). Table 11-2. VCO Clock Frequency Selection VCOCLK Frequency Ranges VCOFRQ[1:0] 32MHz <= fVCO<= 48MHz 00 48MHz < fVCO<= 80MHz 01 Reserved 10 80MHz < fVCO <= 120MHz 11 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 471 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3.2.2 S12XECRG Reference Divider Register (REFDV) The REFDV register provides a finer granularity for the IPLL multiplier steps. Module Base + 0x0001 7 6 5 4 3 2 1 0 0 0 0 R REFFRQ[1:0] REFDIV[5:0] W Reset 0 0 0 0 0 Figure 11-4. S12XECRG Reference Divider Register (REFDV) Read: Anytime Write: Anytime except when PLLSEL = 1 NOTE Write to this register initializes the lock detector bit. f OSC f REF = -----------------------------------( REFDIV + 1 ) The REFFRQ[1:0] bit are used to configure the internal PLL filter for optimal stability and lock time. For correct IPLL operation the REFFRQ[1:0] bits have to be selected according to the actual REFCLK frequency as shown in Figure 11-3. Setting the REFFRQ[1:0] bits wrong can result in a non functional IPLL (no locking and/or insufficient stability). Table 11-3. Reference Clock Frequency Selection 11.3.2.3 REFCLK Frequency Ranges REFFRQ[1:0] 1MHz <= fREF <= 2MHz 00 2MHz < fREF <= 6MHz 01 6MHz < fREF <= 12MHz 10 fREF >12MHz 11 S12XECRG Post Divider Register (POSTDIV) The POSTDIV register controls the frequency ratio between the VCOCLK and PLLCLK. The count in the final divider divides VCOCLK frequency by 1 or 2*POSTDIV. Note that if POSTDIV = $00 fPLL= fVCO (divide by one). MC9S12XE-Family Reference Manual , Rev. 1.21 472 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Module Base + 0x0002 R 7 6 5 0 0 0 4 3 2 1 0 0 0 2 1 0 ILAF SCMIF 0 0 POSTDIV[4:0] W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-5. S12XECRG Post Divider Register (POSTDIV) Read: Anytime Write: Anytime except if PLLSEL = 1 f VCO f PLL = -------------------------------------( 2xPOSTDIV ) NOTE If POSTDIV = $00 then fPLL is identical to fVCO (divide by one). 11.3.2.4 S12XECRG Flags Register (CRGFLG) This register provides S12XECRG status bits and flags. Module Base + 0x0003 7 6 5 4 RTIF PORF LVRF LOCKIF 0 Note 1 Note 2 Note 3 R 3 LOCK SCM W Reset 0 0 1. PORF is set to 1 when a power on reset occurs. Unaffected by system reset. 2. LVRF is set to 1 when a low voltage reset occurs. Unaffected by system reset. 3. ILAF is set to 1 when an illegal address reset occurs. Unaffected by system reset. Cleared by power on or low voltage reset. = Unimplemented or Reserved Figure 11-6. S12XECRG Flags Register (CRGFLG) Read: Anytime Write: Refer to each bit for individual write conditions MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 473 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-4. CRGFLG Field Descriptions Field Description 7 RTIF Real Time Interrupt Flag — RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request. 0 RTI time-out has not yet occurred. 1 RTI time-out has occurred. 6 PORF Power on Reset Flag — PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Power on reset has not occurred. 1 Power on reset has occurred. 5 LVRF Low Voltage Reset Flag — LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Low voltage reset has not occurred. 1 Low voltage reset has occurred. 4 LOCKIF IPLL Lock Interrupt Flag — LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect.If enabled (LOCKIE=1), LOCKIF causes an interrupt request. 0 No change in LOCK bit. 1 LOCK bit has changed. 3 LOCK Lock Status Bit — LOCK reflects the current state of IPLL lock condition. This bit is cleared in Self Clock Mode. Writes have no effect. 0 VCOCLK is not within the desired tolerance of the target frequency. 1 VCOCLK is within the desired tolerance of the target frequency. 2 ILAF Illegal Address Reset Flag — ILAF is set to 1 when an illegal address reset occurs. Refer to S12XMMC Block Guide for details. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Illegal address reset has not occurred. 1 Illegal address reset has occurred. 1 SCMIF 0 SCM 11.3.2.5 Self Clock Mode Interrupt Flag — SCMIF is set to 1 when SCM status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (SCMIE=1), SCMIF causes an interrupt request. 0 No change in SCM bit. 1 SCM bit has changed. Self Clock Mode Status Bit — SCM reflects the current clocking mode. Writes have no effect. 0 MCU is operating normally with OSCCLK available. 1 MCU is operating in Self Clock Mode with OSCCLK in an unknown state. All clocks are derived from PLLCLK running at its minimum frequency fSCM. S12XECRG Interrupt Enable Register (CRGINT) This register enables S12XECRG interrupt requests. Module Base + 0x0004 7 R 6 5 0 0 RTIE 4 3 2 0 0 LOCKIE 1 0 0 SCMIE W Reset 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-7. S12XECRG Interrupt Enable Register (CRGINT) MC9S12XE-Family Reference Manual , Rev. 1.21 474 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Read: Anytime Write: Anytime Table 11-5. CRGINT Field Descriptions Field 7 RTIE Description Real Time Interrupt Enable Bit 0 Interrupt requests from RTI are disabled. 1 Interrupt will be requested whenever RTIF is set. 4 LOCKIE Lock Interrupt Enable Bit 0 LOCK interrupt requests are disabled. 1 Interrupt will be requested whenever LOCKIF is set. 1 SCMIE Self Clock Mode Interrupt Enable Bit 0 SCM interrupt requests are disabled. 1 Interrupt will be requested whenever SCMIF is set. 11.3.2.6 S12XECRG Clock Select Register (CLKSEL) This register controls S12XECRG clock selection. Refer toFigure 11-16 for more details on the effect of each bit. Module Base + 0x0005 7 6 PLLSEL PSTP 0 0 R 5 4 XCLKS 0 3 2 1 0 RTIWAI COPWAI 0 0 0 PLLWAI W Reset 0 0 0 0 = Unimplemented or Reserved Figure 11-8. S12XECRG Clock Select Register (CLKSEL) Read: Anytime Write: Refer to each bit for individual write conditions MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 475 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-6. CLKSEL Field Descriptions Field 7 PLLSEL 6 PSTP Description PLL Select Bit Write: Anytime. Writing a one when LOCK=0 has no effect. This prevents the selection of an unstable PLLCLK as SYSCLK. PLLSEL bit is cleared when the MCU enters Self Clock Mode, Stop Mode or Wait Mode with PLLWAI bit set. It is recommended to read back the PLLSEL bit to make sure PLLCLK has really been selected as SYSCLK, as LOCK status bit could theoretically change at the very moment writing the PLLSEL bit. 0 System clocks are derived from OSCCLK (fBUS = fOSC / 2). 1 System clocks are derived from PLLCLK (fBUS = fPLL / 2). Pseudo Stop Bit Write: Anytime This bit controls the functionality of the oscillator during Stop Mode. 0 Oscillator is disabled in Stop Mode. 1 Oscillator continues to run in Stop Mode (Pseudo Stop). Note: Pseudo Stop Mode allows for faster STOP recovery and reduces the mechanical stress and aging of the resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption. 5 XCLKS Oscillator Configuration Status Bit — This read-only bit shows the oscillator configuration status. 0 Loop controlled Pierce Oscillator is selected. 1 External clock / full swing Pierce Oscillator is selected. 3 PLLWAI PLL Stops in Wait Mode Bit Write: Anytime If PLLWAI is set, the S12XECRG will clear the PLLSEL bit before entering Wait Mode. The PLLON bit remains set during Wait Mode but the IPLL is powered down. Upon exiting Wait Mode, the PLLSEL bit has to be set manually if PLL clock is required. 0 IPLL keeps running in Wait Mode. 1 IPLL stops in Wait Mode. 1 RTIWAI RTI Stops in Wait Mode Bit Write: Anytime 0 RTI keeps running in Wait Mode. 1 RTI stops and initializes the RTI dividers whenever the part goes into Wait Mode. 0 COPWAI COP Stops in Wait Mode Bit Normal modes: Write once Special modes: Write anytime 0 COP keeps running in Wait Mode. 1 COP stops and initializes the COP counter whenever the part goes into Wait Mode. 11.3.2.7 S12XECRG IPLL Control Register (PLLCTL) This register controls the IPLL functionality. Module Base + 0x0006 7 6 5 4 3 2 1 0 CME PLLON FM1 FM0 FSTWKP PRE PCE SCME 1 1 0 0 0 0 0 1 R W Reset Figure 11-9. S12XECRG IPLL Control Register (PLLCTL) MC9S12XE-Family Reference Manual , Rev. 1.21 476 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Read: Anytime Write: Refer to each bit for individual write conditions Table 11-7. PLLCTL Field Descriptions Field Description 7 CME Clock Monitor Enable Bit — CME enables the clock monitor. Write anytime except when SCM = 1. 0 Clock monitor is disabled. 1 Clock monitor is enabled. Slow or stopped clocks will cause a clock monitor reset sequence or Self Clock Mode. Note: Operating with CME=0 will not detect any loss of clock. In case of poor clock quality this could cause unpredictable operation of the MCU! In Stop Mode (PSTP=0) the clock monitor is disabled independently of the CME bit setting and any loss of external clock will not be detected. Also after wake-up from stop mode (PSTP = 0) with fast wake-up enabled (FSTWKP = 1) the clock monitor is disabled independently of the CME bit setting and any loss of external clock will not be detected. 6 PLLON Phase Lock Loop On Bit — PLLON turns on the IPLL circuitry. In Self Clock Mode, the IPLL is turned on, but the PLLON bit reads the last written value. Write anytime except when PLLSEL = 1. 0 IPLL is turned off. 1 IPLL is turned on. 5, 4 FM1, FM0 IPLL Frequency Modulation Enable Bit — FM1 and FM0 enable additional frequency modulation on the VCOCLK. This is to reduce noise emission. The modulation frequency is fref divided by 16. Write anytime except when PLLSEL = 1. See Table 11-8 for coding. 3 FSTWKP Fast Wake-up from Full Stop Bit — FSTWKP enables fast wake-up from full stop mode. Write anytime. If SelfClock Mode is disabled (SCME = 0) this bit has no effect. 0 Fast wake-up from full stop mode is disabled. 1 Fast wake-up from full stop mode is enabled. When waking up from full stop mode the system will immediately resume operation in Self-Clock Mode (see Section 11.4.1.4, “Clock Quality Checker”). The SCMIF flag will not be set. The system will remain in Self-Clock Mode with oscillator and clock monitor disabled until FSTWKP bit is cleared. The clearing of FSTWKP will start the oscillator, the clock monitor and the clock quality check. If the clock quality check is successful, the S12XECRG will switch all system clocks to OSCCLK. The SCMIF flag will be set. See application examples in Figure 11-19 and Figure 11-20. 2 PRE RTI Enable During Pseudo Stop Bit — PRE enables the RTI during Pseudo Stop Mode. Write anytime. 0 RTI stops running during Pseudo Stop Mode. 1 RTI continues running during Pseudo Stop Mode. Note: If the PRE bit is cleared the RTI dividers will go static while Pseudo Stop Mode is active. The RTI dividers will not initialize like in Wait Mode with RTIWAI bit set. 1 PCE COP Enable During Pseudo Stop Bit — PCE enables the COP during Pseudo Stop Mode. Write anytime. 0 COP stops running during Pseudo Stop Mode 1 COP continues running during Pseudo Stop Mode Note: If the PCE bit is cleared the COP dividers will go static while Pseudo Stop Mode is active. The COP dividers will not initialize like in Wait Mode with COPWAI bit set. 0 SCME Self Clock Mode Enable Bit Normal modes: Write once Special modes: Write anytime SCME can not be cleared while operating in Self Clock Mode (SCM = 1). 0 Detection of crystal clock failure causes clock monitor reset (see Section 11.5.1.1, “Clock Monitor Reset”). 1 Detection of crystal clock failure forces the MCU in Self Clock Mode (see Section 11.4.2.2, “Self Clock Mode”). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 477 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-8. FM Amplitude selection FM1 11.3.2.8 FM Amplitude / fVCO Variation FM0 0 0 FM off 0 1 ±1% 1 0 ±2% 1 1 ±4% S12XECRG RTI Control Register (RTICTL) This register selects the timeout period for the Real Time Interrupt. Module Base + 0x0007 7 6 5 4 3 2 1 0 RTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0 0 0 0 0 0 0 0 0 R W Reset Figure 11-10. S12XECRG RTI Control Register (RTICTL) Read: Anytime Write: Anytime NOTE A write to this register initializes the RTI counter. Table 11-9. RTICTL Field Descriptions Field Description 7 RTDEC Decimal or Binary Divider Select Bit — RTDEC selects decimal or binary based prescaler values. 0 Binary based divider value. See Table 11-10 1 Decimal based divider value. See Table 11-11 6–4 RTR[6:4] Real Time Interrupt Prescale Rate Select Bits — These bits select the prescale rate for the RTI. See Table 1110 and Table 11-11. 3–0 RTR[3:0] Real Time Interrupt Modulus Counter Select Bits — These bits select the modulus counter target value to provide additional granularity.Table 11-10 and Table 11-11 show all possible divide values selectable by the RTICTL register. The source clock for the RTI is OSCCLK. Table 11-10. RTI Frequency Divide Rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 0000 (÷1) 000 (OFF) 001 (210) 010 (211) 011 (212) 100 (213) 101 (214) 110 (215) 111 (216) OFF(1) 210 211 212 213 214 215 216 MC9S12XE-Family Reference Manual , Rev. 1.21 478 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-10. RTI Frequency Divide Rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 000 (OFF) 001 (210) 010 (211) 011 (212) 100 (213) 101 (214) 110 (215) 111 (216) 0001 (÷2) OFF 2x210 2x211 2x212 2x213 2x214 2x215 2x216 0010 (÷3) OFF 3x210 3x211 3x212 3x213 3x214 3x215 3x216 0011 (÷4) OFF 4x210 4x211 4x212 4x213 4x214 4x215 4x216 0100 (÷5) OFF 5x210 5x211 5x212 5x213 5x214 5x215 5x216 0101 (÷6) OFF 6x210 6x211 6x212 6x213 6x214 6x215 6x216 0110 (÷7) OFF 7x210 7x211 7x212 7x213 7x214 7x215 7x216 0111 (÷8) OFF 8x210 8x211 8x212 8x213 8x214 8x215 8x216 1000 (÷9) OFF 9x210 9x211 9x212 9x213 9x214 9x215 9x216 1001 (÷10) OFF 10x210 10x211 10x212 10x213 10x214 10x215 10x216 1010 (÷11) OFF 11x210 11x211 11x212 11x213 11x214 11x215 11x216 1011 (÷12) OFF 12x210 12x211 12x212 12x213 12x214 12x215 12x216 1100 (÷13) OFF 13x210 13x211 13x212 13x213 13x214 13x215 13x216 1101 (÷14) OFF 14x210 14x211 14x212 14x213 14x214 14x215 14x216 1110 (÷15) OFF 15x210 15x211 15x212 15x213 15x214 15x215 15x216 1111 (÷16) OFF 16x210 16x211 16x212 16x213 16x214 16x215 16x216 1. Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility. Table 11-11. RTI Frequency Divide Rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 001 (2x103) 010 (5x103) 011 (10x103) 100 (20x103) 101 (50x103) 110 (100x103) 111 (200x103) 0000 (÷1) 1x103 2x103 5x103 10x103 20x103 50x103 100x103 200x103 0001 (÷2) 2x103 4x103 10x103 20x103 40x103 100x103 200x103 400x103 0010 (÷3) 3x103 6x103 15x103 30x103 60x103 150x103 300x103 600x103 0011 (÷4) 4x103 8x103 20x103 40x103 80x103 200x103 400x103 800x103 0100 (÷5) 5x103 10x103 25x103 50x103 100x103 250x103 500x103 1x106 0101 (÷6) 6x103 12x103 30x103 60x103 120x103 300x103 600x103 1.2x106 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 479 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-11. RTI Frequency Divide Rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 001 (2x103) 010 (5x103) 011 (10x103) 100 (20x103) 101 (50x103) 110 (100x103) 111 (200x103) 0110 (÷7) 7x103 14x103 35x103 70x103 140x103 350x103 700x103 1.4x106 0111 (÷8) 8x103 16x103 40x103 80x103 160x103 400x103 800x103 1.6x106 1000 (÷9) 9x103 18x103 45x103 90x103 180x103 450x103 900x103 1.8x106 1001 (÷10) 10 x103 20x103 50x103 100x103 200x103 500x103 1x106 2x106 1010 (÷11) 11 x103 22x103 55x103 110x103 220x103 550x103 1.1x106 2.2x106 1011 (÷12) 12x103 24x103 60x103 120x103 240x103 600x103 1.2x106 2.4x106 1100 (÷13) 13x103 26x103 65x103 130x103 260x103 650x103 1.3x106 2.6x106 1101 (÷14) 14x103 28x103 70x103 140x103 280x103 700x103 1.4x106 2.8x106 1110 (÷15) 15x103 30x103 75x103 150x103 300x103 750x103 1.5x106 3x106 1111 (÷16) 16x103 32x103 80x103 160x103 320x103 800x103 1.6x106 3.2x106 11.3.2.9 S12XECRG COP Control Register (COPCTL) This register controls the COP (Computer Operating Properly) watchdog. Module Base + 0x0008 7 6 WCOP RSBCK R W Reset1 5 4 3 0 0 0 2 1 0 CR2 CR1 CR0 0 0 0 WRTMASK 0 0 0 0 0 1. Refer to Device User Guide (Section: S12XECRG) for reset values of WCOP, CR2, CR1 and CR0. = Unimplemented or Reserved Figure 11-11. S12XECRG COP Control Register (COPCTL) Read: Anytime Write: 1. RSBCK: anytime in special modes; write to “1” but not to “0” in all other modes 2. WCOP, CR2, CR1, CR0: — Anytime in special modes — Write once in all other modes – Writing CR[2:0] to “000” has no effect, but counts for the “write once” condition. – Writing WCOP to “0” has no effect, but counts for the “write once” condition. MC9S12XE-Family Reference Manual , Rev. 1.21 480 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The COP time-out period is restarted if one these two conditions is true: 1. Writing a non zero value to CR[2:0] (anytime in special modes, once in all other modes) with WRTMASK = 0. or 2. Changing RSBCK bit from “0” to “1”. Table 11-12. COPCTL Field Descriptions Field Description 7 WCOP Window COP Mode Bit — When set, a write to the ARMCOP register must occur in the last 25% of the selected period. A write during the first 75% of the selected period will reset the part. As long as all writes occur during this window, $55 can be written as often as desired. Once $AA is written after the $55, the time-out logic restarts and the user must wait until the next window before writing to ARMCOP. Table 11-13 shows the duration of this window for the seven available COP rates. 0 Normal COP operation 1 Window COP operation 6 RSBCK COP and RTI Stop in Active BDM Mode Bit 0 Allows the COP and RTI to keep running in Active BDM mode. 1 Stops the COP and RTI counters whenever the part is in Active BDM mode. Write Mask for WCOP and CR[2:0] Bit — This write-only bit serves as a mask for the WCOP and CR[2:0] bits 5 WRTMASK while writing the COPCTL register. It is intended for BDM writing the RSBCK without touching the contents of WCOP and CR[2:0]. 0 Write of WCOP and CR[2:0] has an effect with this write of COPCTL 1 Write of WCOP and CR[2:0] has no effect with this write of COPCTL. (Does not count for “write once”.) 2–0 CR[2:0] COP Watchdog Timer Rate Select — These bits select the COP time-out rate (see Table 11-13). Writing a nonzero value to CR[2:0] enables the COP counter and starts the time-out period. A COP counter time-out causes a system reset. This can be avoided by periodically (before time-out) reinitialize the COP counter via the ARMCOP register. While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at highest time-out period (2 24 cycles) in normal COP mode (Window COP mode disabled): 1) COP is enabled (CR[2:0] is not 000) 2) BDM mode active 3) RSBCK = 0 4) Operation in emulation or special modes Table 11-13. COP Watchdog Rates(1) CR2 CR1 CR0 OSCCLK Cycles to Timeout 0 0 0 COP disabled 0 0 1 2 14 0 1 0 2 16 0 1 1 2 18 1 0 0 2 20 1 0 1 2 22 1 1 0 2 23 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 481 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-13. COP Watchdog Rates(1) CR2 CR1 OSCCLK Cycles to Timeout CR0 1 1 1 2 24 1. OSCCLK cycles are referenced from the previous COP time-out reset (writing $55/$AA to the ARMCOP register) 11.3.2.10 Reserved Register (FORBYP) NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special modes can alter the S12XECRG’s functionality. Module Base + 0x0009 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 11-12. Reserved Register (FORBYP) Read: Always read $00 except in special modes Write: Only in special modes 11.3.2.11 Reserved Register (CTCTL) NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special test modes can alter the S12XECRG’s functionality. Module Base + 0x000A R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 11-13. Reserved Register (CTCTL) Read: Always read $00 except in special modes MC9S12XE-Family Reference Manual , Rev. 1.21 482 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Write: Only in special modes 11.3.2.12 S12XECRG COP Timer Arm/Reset Register (ARMCOP) This register is used to restart the COP time-out period. Module Base + 0x000B 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 Reset Figure 11-14. S12XECRG ARMCOP Register Diagram Read: Always reads $00 Write: Anytime When the COP is disabled (CR[2:0] = “000”) writing to this register has no effect. When the COP is enabled by setting CR[2:0] nonzero, the following applies: Writing any value other than $55 or $AA causes a COP reset. To restart the COP time-out period you must write $55 followed by a write of $AA. Other instructions may be executed between these writes but the sequence ($55, $AA) must be completed prior to COP end of time-out period to avoid a COP reset. Sequences of $55 writes or sequences of $AA writes are allowed. When the WCOP bit is set, $55 and $AA writes must be done in the last 25% of the selected time-out period; writing any value in the first 75% of the selected period will cause a COP reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 483 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4 Functional Description 11.4.1 11.4.1.1 Functional Blocks Phase Locked Loop with Internal Filter (IPLL) The IPLL is used to run the MCU from a different time base than the incoming OSCCLK. Figure 11-15 shows a block diagram of the IPLL. REFCLK REFDIV[5:0] EXTAL REDUCED CONSUMPTION OSCILLATOR OSCCLK REFERENCE PROGRAMMABLE DIVIDER XTAL CLOCK MONITOR Supplied by: FBCLK LOCK LOCK DETECTOR VDDPLL/VSSPLL PDET PHASE DETECTOR UP CPUMP AND FILTER DOWN VCO VCOCLK LOOP PROGRAMMABLE DIVIDER POST PROGRAMMABLE DIVIDER PLLCLK SYNDIV[5:0] VDDPLL/VSSPLL POSTDIV[4:0] VDD/VSS Figure 11-15. IPLL Functional Diagram For increased flexibility, OSCCLK can be divided in a range of 1 to 64 to generate the reference frequency REFCLK using the REFDIV[5:0] bits. This offers a finer multiplication granularity. Based on the SYNDIV[5:0] bits the IPLL generates the VCOCLK by multiplying the reference clock by a multiple of 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits the VCOCLK can be divided in a range of 1,2,4,6,8,... to 62 to generate the PLLCLK. . SYNDIV + 1 f PLL = 2 × f OSC × -----------------------------------------------------------------------------[ REFDIV + 1 ] [ 2 × POSTDIV ] NOTE Although it is possible to set the dividers to command a very high clock frequency, do not exceed the specified bus frequency limit for the MCU. If (PLLSEL = 1) then fBUS = fPLL / 2. IF POSTDIV = $00 the fPLL is identical to fVCO (divide by one) Several examples of IPLL divider settings are shown in Table 11-14. Shaded rows indicated that these settings are not recommended. The following rules help to achieve optimum stability and shortest lock time: • Use lowest possible fVCO / fREF ratio (SYNDIV value). • Use highest possible REFCLK frequency fREF. MC9S12XE-Family Reference Manual , Rev. 1.21 484 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-14. Examples of IPLL Divider Settings fOSC REFDIV[5:0] fREF 4MHz $01 2MHz 01 $18 100MHz 11 $00 100MHz 50 MHz 8MHz $03 2MHz 01 $18 100MHz 11 $00 100MHz 50 MHz 4MHz $00 4MHz 01 $09 80MHz 01 $00 80MHz 40MHz 8MHz $00 8MHz 10 $04 80MHz 01 $00 80MHz 40MHz 4MHz $00 4MHz 01 $03 32MHz 00 $01 16MHz 8MHz 4MHz $01 2MHz 01 $18 100MHz 11 $01 50MHz 25MHz 4MHz $03 1MHz 00 $18 50MHz 01 $00 50MHz 25MHz 4MHz $03 1MHz 00 $31 100MHz 11 $01 50MHz 25MHz 11.4.1.1.1 REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV[4:0] fPLL fBUS IPLL Operation The oscillator output clock signal (OSCCLK) is fed through the reference programmable divider and is divided in a range of 1 to 64 (REFDIV+1) to output the REFCLK. The VCO output clock, (VCOCLK) is fed back through the programmable loop divider and is divided in a range of 2 to 128 in increments of [2 x (SYNDIV +1)] to output the FBCLK. The VCOCLK is fed to the final programmable divider and is divided in a range of 1,2,4,6,8,... to 62 (2*POSTDIV) to output the PLLCLK. See Figure 11-15. The phase detector then compares the FBCLK, with the REFCLK. Correction pulses are generated based on the phase difference between the two signals. The loop filter then slightly alters the DC voltage on the internal filter capacitor, based on the width and direction of the correction pulse. The user must select the range of the REFCLK frequency and the range of the VCOCLK frequency to ensure that the correct IPLL loop bandwidth is set. The lock detector compares the frequencies of the FBCLK, and the REFCLK. Therefore, the speed of the lock detector is directly proportional to the reference clock frequency. The circuit determines the lock condition based on this comparison. If IPLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and then check the LOCK bit. If interrupt requests are disabled, software can poll the LOCK bit continuously (during IPLL start-up, usually) or at periodic intervals. In either case, only when the LOCK bit is set, the PLLCLK can be selected as the source for the system and core clocks. If the IPLL is selected as the source for the system and core clocks and the LOCK bit is clear, the IPLL has suffered a severe noise hit and the software must take appropriate action, depending on the application. • The LOCK bit is a read-only indicator of the locked state of the IPLL. • The LOCK bit is set when the VCO frequency is within a certain tolerance, ∆Lock, and is cleared when the VCO frequency is out of a certain tolerance, ∆unl. • Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 485 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.2 System Clocks Generator PLLSEL or SCM PLLCLK PHASE LOCK LOOP (IIPLL) STOP 1 SYSCLK ÷2 SCM EXTAL 1 OSCILLATOR Core Clock 0 WAIT(RTIWAI), STOP(PSTP, PRE), RTI ENABLE CLOCK PHASE GENERATOR Bus Clock RTI OSCCLK 0 WAIT(COPWAI), STOP(PSTP, PCE), COP ENABLE XTAL COP Clock Monitor STOP Oscillator Clock Gating Condition = Clock Gate Figure 11-16. System Clocks Generator The clock generator creates the clocks used in the MCU (see Figure 11-16). The gating condition placed on top of the individual clock gates indicates the dependencies of different modes (STOP, WAIT) and the setting of the respective configuration bits. The peripheral modules use the Bus Clock. Some peripheral modules also use the Oscillator Clock. If the MCU enters Self Clock Mode (see Section 11.4.2.2, “Self Clock Mode”) Oscillator clock source is switched to PLLCLK running at its minimum frequency fSCM. The Bus Clock is used to generate the clock visible at the ECLK pin. The Core Clock signal is the clock for the CPU. The Core Clock is twice the Bus Clock. But note that a CPU cycle corresponds to one Bus Clock. IPLL clock mode is selected with PLLSEL bit in the CLKSEL register. When selected, the IPLL output clock drives SYSCLK for the main system including the CPU and peripherals. The IPLL cannot be turned off by clearing the PLLON bit, if the IPLL clock is selected. When PLLSEL is changed, it takes a maximum of 4 OSCCLK plus 4 PLLCLK cycles to make the transition. During the transition, all clocks freeze and CPU activity ceases. MC9S12XE-Family Reference Manual , Rev. 1.21 486 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.3 Clock Monitor (CM) If no OSCCLK edges are detected within a certain time, the clock monitor within the oscillator block generates a clock monitor fail event. The S12XECRG then asserts self clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated by the oscillator block.The clock monitor function is enabled/disabled by the CME control bit. 11.4.1.4 Clock Quality Checker The clock monitor performs a coarse check on the incoming clock signal. The clock quality checker provides a more accurate check in addition to the clock monitor. A clock quality check is triggered by any of the following events: • Power on reset (POR) • Low voltage reset (LVR) • Wake-up from Full Stop Mode (exit full stop) • Clock Monitor fail indication (CM fail) A time window of 50000 PLLCLK cycles1 is called check window. A number greater equal than 4096 rising OSCCLK edges within a check window is called osc ok. Note that osc ok immediately terminates the current check window. See Figure 11-17 as an example. CHECK WINDOW 1 3 2 49999 50000 PLLCLK 1 2 3 4 5 4096 OSCCLK 4095 OSC OK Figure 11-17. Check Window Example 1. IPLL is running at self clock mode frequency fSCM. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 487 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The Sequence for clock quality check is shown in Figure 11-18. CM FAIL CLOCK OK NO EXIT FULL STOP POR LVR YES SCME=1 & FSTWKP=1 ? NO NUM = 0 FSTWKP = 0 ? ENTER SCM YES CLOCK MONITOR RESET ENTER SCM NUM = 50 YES CHECK WINDOW SCM ACTIVE? NUM = NUM-1 YES OSC OK ? NUM = 0 NO NO NUM > 0 ? YES NO SCME = 1 ? NO YES SCM ACTIVE? YES SWITCH TO OSCCLK NO EXIT SCM Figure 11-18. Sequence for Clock Quality Check NOTE Remember that in parallel to additional actions caused by Self Clock Mode or Clock Monitor Reset1 handling the clock quality checker continues to check the OSCCLK signal. NOTE The Clock Quality Checker enables the IPLL and the voltage regulator (VREG) anytime a clock check has to be performed. An ongoing clock quality check could also cause a running IPLL (fSCM) and an active VREG during Pseudo Stop Mode. 1. A Clock Monitor Reset will always set the SCME bit to logical’1’. MC9S12XE-Family Reference Manual , Rev. 1.21 488 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.5 Computer Operating Properly Watchdog (COP) The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. When the COP is being used, software is responsible for keeping the COP from timing out. If the COP times out it is an indication that the software is no longer being executed in the intended sequence; thus a system reset is initiated (see Section 11.4.1.5, “Computer Operating Properly Watchdog (COP)”). The COP runs with a gated OSCCLK. Three control bits in the COPCTL register allow selection of seven COP time-out periods. When COP is enabled, the program must write $55 and $AA (in this order) to the ARMCOP register during the selected time-out period. Once this is done, the COP time-out period is restarted. If the program fails to do this and the COP times out, the part will reset. Also, if any value other than $55 or $AA is written, the part is immediately reset. Windowed COP operation is enabled by setting WCOP in the COPCTL register. In this mode, writes to the ARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period. A premature write will immediately reset the part. If PCE bit is set, the COP will continue to run in Pseudo Stop Mode. 11.4.1.6 Real Time Interrupt (RTI) The RTI can be used to generate a hardware interrupt at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will occur at the rate selected by the RTICTL register. The RTI runs with a gated OSCCLK. At the end of the RTI time-out period the RTIF flag is set to one and a new RTI time-out period starts immediately. A write to the RTICTL register restarts the RTI time-out period. If the PRE bit is set, the RTI will continue to run in Pseudo Stop Mode. 11.4.2 11.4.2.1 Operation Modes Normal Mode The S12XECRG block behaves as described within this specification in all normal modes. 11.4.2.2 Self Clock Mode If the external clock frequency is not available due to a failure or due to long crystal start-up time, the Bus Clock and the Core Clock are derived from the PLLCLK running at self clock mode frequency fSCM; this mode of operation is called Self Clock Mode. This requires CME = 1 and SCME = 1, which is the default after reset. If the MCU was clocked by the PLLCLK prior to entering Self Clock Mode, the PLLSEL bit will be cleared. If the external clock signal has stabilized again, the S12XECRG will automatically select OSCCLK to be the system clock and return to normal mode. See Section 11.4.1.4, “Clock Quality Checker” for more information on entering and leaving Self Clock Mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 489 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) NOTE In order to detect a potential clock loss the CME bit should always be enabled (CME = 1). If CME bit is disabled and the MCU is configured to run on PLLCLK, a loss of external clock (OSCCLK) will not be detected and will cause the system clock to drift towards lower frequencies. As soon as the external clock is available again the system clock ramps up to its IPLL target frequency. If the MCU is running on external clock any loss of clock will cause the system to go static. 11.4.3 Low Power Options This section summarizes the low power options available in the S12XECRG. 11.4.3.1 Run Mode This is the default mode after reset. The RTI can be stopped by setting the associated rate select bits to zero. The COP can be stopped by setting the associated rate select bits to zero. 11.4.3.2 Wait Mode The WAI instruction puts the MCU in a low power consumption stand-by mode depending on setting of the individual bits in the CLKSEL register. All individual Wait Mode configuration bits can be superposed. This provides enhanced granularity in reducing the level of power consumption during Wait Mode. Table 11-15 lists the individual configuration bits and the parts of the MCU that are affected in Wait Mode. Table 11-15. MCU Configuration During Wait Mode PLLWAI RTIWAI COPWAI IPLL Stopped — — RTI — Stopped — COP — — Stopped After executing the WAI instruction the core requests the S12XECRG to switch MCU into Wait Mode. The S12XECRG then checks whether the PLLWAI bit is asserted. Depending on the configuration the S12XECRG switches the system and core clocks to OSCCLK by clearing the PLLSEL bit and disables the IPLL. There are two ways to restart the MCU from Wait Mode: 1. Any reset 2. Any interrupt MC9S12XE-Family Reference Manual , Rev. 1.21 490 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.3.3 Stop Mode All clocks are stopped in STOP mode, dependent of the setting of the PCE, PRE and PSTP bit. The oscillator is disabled in STOP mode unless the PSTP bit is set. If the PRE or PCE bits are set, the RTI or COP continues to run in Pseudo Stop Mode. In addition to disabling system and core clocks the S12XECRG requests other functional units of the MCU (e.g. voltage-regulator) to enter their individual power saving modes (if available). If the PLLSEL bit is still set when entering Stop Mode, the S12XECRG will switch the system and core clocks to OSCCLK by clearing the PLLSEL bit. Then the S12XECRG disables the IPLL, disables the core clock and finally disables the remaining system clocks. If Pseudo Stop Mode is entered from Self-Clock Mode the S12XECRG will continue to check the clock quality until clock check is successful. In this case the IPLL and the voltage regulator (VREG) will remain enabled. If Full Stop Mode (PSTP = 0) is entered from Self-Clock Mode the ongoing clock quality check will be stopped. A complete timeout window check will be started when Stop Mode is left again. There are two ways to restart the MCU from Stop Mode: 1. Any reset 2. Any interrupt If the MCU is woken-up from Full Stop Mode by an interrupt and the fast wake-up feature is enabled (FSTWKP=1 and SCME=1), the system will immediately (no clock quality check) resume operation in Self-Clock Mode (see Section 11.4.1.4, “Clock Quality Checker”). The SCMIF flag will not be set for this special case. The system will remain in Self-Clock Mode with oscillator disabled until FSTWKP bit is cleared. The clearing of FSTWKP will start the oscillator and the clock quality check. If the clock quality check is successful, the S12XECRG will switch all system clocks to oscillator clock. The SCMIF flag will be set. See application examples in Figure 11-19 and Figure 11-20. Because the IPLL has been powered-down during Stop Mode the PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving Stop-Mode. The software must manually set the PLLSEL bit again, in order to switch system and core clocks to the PLLCLK. NOTE In Full Stop Mode or Self-Clock Mode caused by the fast wake-up feature the clock monitor and the oscillator are disabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 491 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) CPU resumes program execution immediately Instruction STOP STOP FSTWKP=1 SCME=1 STOP Interrupt IRQ service IRQ service IRQ service Interrupt Interrupt Power Saving Oscillator Clock Oscillator Disabled PLL Clock Core Clock Self-Clock Mode Figure 11-19. Fast Wake-up from Full Stop Mode: Example 1 . CPU resumes program execution immediately Instruction Frequent Uncritical Frequent Critical Instructions Instructions Possible IRQ Service STOP FSTWKP=1 SCME=1 IRQ Interrupt FSTWKP=0 SCMIE=1 SCM Interrupt Clock Quality Check Oscillator Clock Oscillator Disabled Osc Startup PLL Clock Self-Clock Mode Core Clock Figure 11-20. Fast Wake-up from Full Stop Mode: Example 2 11.5 Resets All reset sources are listed in Table 11-16. Refer to MCU specification for related vector addresses and priorities. Table 11-16. Reset Summary Reset Source Local Enable Power on Reset None Low Voltage Reset None External Reset None Illegal Address Reset None Clock Monitor Reset PLLCTL (CME=1, SCME=0) MC9S12XE-Family Reference Manual , Rev. 1.21 492 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-16. Reset Summary 11.5.1 Reset Source Local Enable COP Watchdog Reset COPCTL (CR[2:0] nonzero) Description of Reset Operation The reset sequence is initiated by any of the following events: • Low level is detected at the RESET pin (External Reset). • Power on is detected. • Low voltage is detected. • Illegal Address Reset is detected (see S12XMMC Block Guide for details). • COP watchdog times out. • Clock monitor failure is detected and Self-Clock Mode was disabled (SCME=0). Upon detection of any reset event, an internal circuit drives the RESET pin low for 128 SYSCLK cycles (see Figure 11-21). Since entry into reset is asynchronous it does not require a running SYSCLK. However, the internal reset circuit of the S12XECRG cannot sequence out of current reset condition without a running SYSCLK. The number of 128 SYSCLK cycles might be increased by n = 3 to 6 additional SYSCLK cycles depending on the internal synchronization latency. After 128+n SYSCLK cycles the RESET pin is released. The reset generator of the S12XECRG waits for additional 64 SYSCLK cycles and then samples the RESET pin to determine the originating source. Table 11-17 shows which vector will be fetched. Table 11-17. Reset Vector Selection Sampled RESET Pin Clock Monitor COP (64 cycles after release) Reset Pending Reset Pending Vector Fetch 1 0 0 POR / LVR / Illegal Address Reset/ External Reset 1 1 X Clock Monitor Reset 1 0 1 COP Reset 0 X X POR / LVR / Illegal Address Reset/ External Reset with rise of RESET pin NOTE External circuitry connected to the RESET pin should not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one within 64 SYSCLK cycles after the low drive is released. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 493 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The internal reset of the MCU remains asserted while the reset generator completes the 192 SYSCLK long reset sequence. In case the RESET pin is externally driven low for more than these 192 SYSCLK cycles (External Reset), the internal reset remains asserted longer. Figure 11-21. RESET Timing RESET )( )( ICRG drives RESET pin low ) ) SYSCLK ( 128+n cycles possibly SYSCLK not running 11.5.1.1 RESET pin released ) ( ( 64 cycles with n being min 3 / max 6 cycles depending on internal synchronization delay possibly RESET driven low externally Clock Monitor Reset The S12XECRG generates a Clock Monitor Reset in case all of the following conditions are true: • Clock monitor is enabled (CME = 1) • Loss of clock is detected • Self-Clock Mode is disabled (SCME = 0). The reset event asynchronously forces the configuration registers to their default settings. In detail the CME and the SCME are reset to logical ‘1’ (which changes the state of the SCME bit. As a consequence the S12XECRG immediately enters Self Clock Mode and starts its internal reset sequence. In parallel the clock quality check starts. As soon as clock quality check indicates a valid Oscillator Clock the S12XECRG switches to OSCCLK and leaves Self Clock Mode. Since the clock quality checker is running in parallel to the reset generator, the S12XECRG may leave Self Clock Mode while still completing the internal reset sequence. 11.5.1.2 Computer Operating Properly Watchdog (COP) Reset When COP is enabled, the S12XECRG expects sequential write of $55 and $AA (in this order) to the ARMCOP register during the selected time-out period. Once this is done, the COP time-out period restarts. If the program fails to do this the S12XECRG will generate a reset. 11.5.1.3 Power On Reset, Low Voltage Reset The on-chip voltage regulator detects when VDD to the MCU has reached a certain level and asserts power on reset or low voltage reset or both. As soon as a power on reset or low voltage reset is triggered the MC9S12XE-Family Reference Manual , Rev. 1.21 494 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) S12XECRG performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid Oscillator Clock signal the reset sequence starts using the Oscillator clock. If after 50 check windows the clock quality check indicated a non-valid Oscillator Clock the reset sequence starts using Self-Clock Mode. Figure 11-22 and Figure 11-23 show the power-up sequence for cases when the RESET pin is tied to VDD and when the RESET pin is held low. Clock Quality Check (no Self-Clock Mode) RESET )( Internal POR )( 128 SYSCLK Internal RESET 64 SYSCLK )( Figure 11-22. RESET Pin Tied to VDD (by a Pull-up Resistor) Clock Quality Check (no Self Clock Mode) )( RESET Internal POR )( 128 SYSCLK Internal RESET )( 64 SYSCLK Figure 11-23. RESET Pin Held Low Externally 11.6 Interrupts The interrupts/reset vectors requested by the S12XECRG are listed in Table 11-18. Refer to MCU specification for related vector addresses and priorities. Table 11-18. S12XECRG Interrupt Vectors Interrupt Source CCR Mask Local Enable Real time interrupt I bit CRGINT (RTIE) LOCK interrupt I bit CRGINT (LOCKIE) SCM interrupt I bit CRGINT (SCMIE) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 495 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.6.1 11.6.1.1 Description of Interrupt Operation Real Time Interrupt The S12XECRG generates a real time interrupt when the selected interrupt time period elapses. RTI interrupts are locally disabled by setting the RTIE bit to zero. The real time interrupt flag (RTIF) is set to1 when a timeout occurs, and is cleared to 0 by writing a 1 to the RTIF bit. The RTI continues to run during Pseudo Stop Mode if the PRE bit is set to 1. This feature can be used for periodic wakeup from Pseudo Stop if the RTI interrupt is enabled. 11.6.1.2 IPLL Lock Interrupt The S12XECRG generates a IPLL Lock interrupt when the LOCK condition of the IPLL has changed, either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to zero. The IPLL Lock interrupt flag (LOCKIF) is set to1 when the LOCK condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit. 11.6.1.3 Self Clock Mode Interrupt The S12XECRG generates a Self Clock Mode interrupt when the SCM condition of the system has changed, either entered or exited Self Clock Mode. SCM conditions are caused by a failing clock quality check after power on reset (POR) or low voltage reset (LVR) or recovery from Full Stop Mode (PSTP = 0) or Clock Monitor failure. For details on the clock quality check refer to Section 11.4.1.4, “Clock Quality Checker”. If the clock monitor is enabled (CME = 1) a loss of external clock will also cause a SCM condition (SCME = 1). SCM interrupts are locally disabled by setting the SCMIE bit to zero. The SCM interrupt flag (SCMIF) is set to1 when the SCM condition has changed, and is cleared to 0 by writing a 1 to the SCMIF bit. MC9S12XE-Family Reference Manual , Rev. 1.21 496 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) Table 12-1. Revision History Revision Number Revision Date Sections Affected Description of Changes V01.05 19 Jul 2006 - All xclks info was removed V02.00 04 Aug 2006 - Incremented revision to match the design system spec revision 12.1 Introduction The Pierce oscillator (XOSC) module provides a robust, low-noise and low-power clock source. The module will be operated from the VDDPLL supply rail (1.8 V nominal) and require the minimum number of external components. It is designed for optimal start-up margin with typical crystal oscillators. 12.1.1 Features The XOSC will contain circuitry to dynamically control current gain in the output amplitude. This ensures a signal with low harmonic distortion, low power and good noise immunity. • High noise immunity due to input hysteresis • Low RF emissions with peak-to-peak swing limited dynamically • Transconductance (gm) sized for optimum start-up margin for typical oscillators • Dynamic gain control eliminates the need for external current limiting resistor • Integrated resistor eliminates the need for external bias resistor in loop controlled Pierce mode. • Low power consumption: — Operates from 1.8 V (nominal) supply — Amplitude control limits power • Clock monitor 12.1.2 Modes of Operation Two modes of operation exist: 1. Loop controlled Pierce (LCP) oscillator 2. External square wave mode featuring also full swing Pierce (FSP) without internal bias resistor The oscillator mode selection is described in the Device Overview section, subsection Oscillator Configuration. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 497 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.1.3 Block Diagram Figure 12-1 shows a block diagram of the XOSC. Monitor_Failure Clock Monitor OSCCLK Peak Detector Gain Control VDDPLL = 1.8 V Rf XTAL EXTAL Figure 12-1. XOSC Block Diagram 12.2 External Signal Description This section lists and describes the signals that connect off chip 12.2.1 VDDPLL and VSSPLL — Operating and Ground Voltage Pins Theses pins provides operating voltage (VDDPLL) and ground (VSSPLL) for the XOSC circuitry. This allows the supply voltage to the XOSC to use an independent bypass capacitor. 12.2.2 EXTAL and XTAL — Input and Output Pins These pins provide the interface for either a crystal or a 1.8V CMOS compatible clock to control the internal clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. The MCU internal system clock is derived MC9S12XE-Family Reference Manual , Rev. 1.21 498 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) from the EXTAL input frequency. In full stop mode (PSTP = 0), the EXTAL pin is pulled down by an internal resistor of typical 200 kΩ. NOTE Freescale recommends an evaluation of the application board and chosen resonator or crystal by the resonator or crystal supplier. Loop controlled circuit is not suited for overtone resonators and crystals. EXTAL C1 MCU Crystal or Ceramic Resonator XTAL C2 VSSPLL Figure 12-2. Loop Controlled Pierce Oscillator Connections (LCP mode selected) NOTE Full swing Pierce circuit is not suited for overtone resonators and crystals without a careful component selection. EXTAL C1 MCU RB Crystal or Ceramic Resonator RS* XTAL C2 VSSPLL * Rs can be zero (shorted) when use with higher frequency crystals. Refer to manufacturer’s data. Figure 12-3. Full Swing Pierce Oscillator Connections (FSP mode selected) EXTAL CMOS Compatible External Oscillator (VDDPLL Level) MCU XTAL Not Connected Figure 12-4. External Clock Connections (FSP mode selected) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 499 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.3 Memory Map and Register Definition The CRG contains the registers and associated bits for controlling and monitoring the oscillator module. 12.4 Functional Description The XOSC module has control circuitry to maintain the crystal oscillator circuit voltage level to an optimal level which is determined by the amount of hysteresis being used and the maximum oscillation range. The oscillator block has two external pins, EXTAL and XTAL. The oscillator input pin, EXTAL, is intended to be connected to either a crystal or an external clock source. The XTAL pin is an output signal that provides crystal circuit feedback. A buffered EXTAL signal becomes the internal clock. To improve noise immunity, the oscillator is powered by the VDDPLL and VSSPLL power supply pins. 12.4.1 Gain Control In LCP mode a closed loop control system will be utilized whereby the amplifier is modulated to keep the output waveform sinusoidal and to limit the oscillation amplitude. The output peak to peak voltage will be kept above twice the maximum hysteresis level of the input buffer. Electrical specification details are provided in the Electrical Characteristics appendix. 12.4.2 Clock Monitor The clock monitor circuit is based on an internal RC time delay so that it can operate without any MCU clocks. If no OSCCLK edges are detected within this RC time delay, the clock monitor indicates failure which asserts self-clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated.The clock monitor function is enabled/disabled by the CME control bit, described in the CRG block description chapter. 12.4.3 Wait Mode Operation During wait mode, XOSC is not impacted. 12.4.4 Stop Mode Operation XOSC is placed in a static state when the part is in stop mode except when pseudo-stop mode is enabled. During pseudo-stop mode, XOSC is not impacted. MC9S12XE-Family Reference Manual , Rev. 1.21 500 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-1. Revision History Revision Number Revision Date V01.00 13 Oct. 2005 - Initial version V01.01 04 Mar. 2008 corrected reference to DJM bit 13.1 Sections Affected Description of Changes Introduction The ADC12B16C is a 16-channel, 12-bit, multiplexed input successive approximation analog-to-digital converter. Refer to device electrical specifications for ATD accuracy. 13.1.1 • • • • • • • • • • • • • • • Features 8-, 10-, or 12-bit resolution. Conversion in Stop Mode using internally generated clock Automatic return to low power after conversion sequence Automatic compare with interrupt for higher than or less/equal than programmable value Programmable sample time. Left/right justified result data. External trigger control. Sequence complete interrupt. Analog input multiplexer for 16 analog input channels. Special conversions for VRH, VRL, (VRL+VRH)/2. 1-to-16 conversion sequence lengths. Continuous conversion mode. Multiple channel scans. Configurable external trigger functionality on any AD channel or any of four additional trigger inputs. The four additional trigger inputs can be chip external or internal. Refer to device specification for availability and connectivity. Configurable location for channel wrap around (when converting multiple channels in a sequence). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 501 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1.2 13.1.2.1 Modes of Operation Conversion Modes There is software programmable selection between performing single or continuous conversion on a single channel or multiple channels. 13.1.2.2 • • • MCU Operating Modes Stop Mode — ICLKSTP=0 (in ATDCTL2 register) Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted sequence all flags are cleared etc. — ICLKSTP=1 (in ATDCTL2 register) A/D conversion sequence seamless continues in Stop Mode based on the internally generated clock ICLK as ATD clock. For conversions during transition from Run to Stop Mode or vice versa the result is not written to the results register, no CCF flag is set and no compare is done. When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time. Wait Mode ADC12B16C behaves same in Run and Wait Mode. For reduced power consumption continuos conversions should be aborted before entering Wait mode. Freeze Mode In Freeze Mode the ADC12B16C will either continue or finish or stop converting according to the FRZ1 and FRZ0 bits. This is useful for debugging and emulation. MC9S12XE-Family Reference Manual , Rev. 1.21 502 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1.3 Block Diagram Bus Clock ICLK Clock Prescaler Internal Clock ATD Clock ETRIG0 ETRIG1 ETRIG2 Trigger Mux Mode and ATD_12B16C Sequence Complete Interrupt Compare Interrupt Timing Control ETRIG3 (See device specification for availability and connectivity) ATDCTL1 ATDDIEN VDDA VSSA Successive Approximation Register (SAR) and DAC VRH VRL AN15 AN14 AN13 Results ATD 0 ATD 1 ATD 2 ATD 3 ATD 4 ATD 5 ATD 6 ATD 7 ATD 8 ATD 9 ATD 10 ATD 11 ATD 12 ATD 13 ATD 14 ATD 15 AN12 AN11 + AN10 Sample & Hold AN9 - AN8 AN7 Analog MUX Comparator AN6 AN5 AN4 AN3 AN2 AN1 AN0 Figure 13-1. ADC12B16C Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 503 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.2 Signal Description This section lists all inputs to the ADC12B16C block. 13.2.1 Detailed Signal Descriptions 13.2.1.1 ANx (x = 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger for the ATD conversion. 13.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0 These inputs can be configured to serve as an external trigger for the ATD conversion. Refer to device specification for availability and connection of these inputs! 13.2.1.3 VRH, VRL VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion. 13.2.1.4 VDDA, VSSA These pins are the power supplies for the analog circuitry of the ADC12B16C block. 13.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the ADC12B16C. 13.3.1 Module Memory Map Figure 13-2 gives an overview on all ADC12B16C registers. NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. Address Name 0x0000 ATDCTL0 0x0001 ATDCTL1 0x0002 ATDCTL2 Bit 7 R Reserved W R ETRIGSEL W R 0 W 6 0 5 0 SRES1 SRES0 AFFC 4 0 3 2 1 Bit 0 WRAP3 WRAP2 WRAP1 WRAP0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 ICLKSTP ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE = Unimplemented or Reserved Figure 13-2. ADC12B16C Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 504 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Address Name 0x0003 ATDCTL3 0x0004 ATDCTL4 0x0005 ATDCTL5 0x0006 ATDSTAT0 0x0007 Unimplemented 0x0008 ATDCMPEH 0x0009 ATDCMPEL 0x000A ATDSTAT2H 0x000B ATDSTAT2L 0x000C ATDDIENH 0x000D ATDDIENL 0x000E ATDCMPHTH 0x000F ATDCMPHTL 0x0010 ATDDR0 0x0012 ATDDR1 0x0014 ATDDR2 0x0016 ATDDR3 0x0018 ATDDR4 0x001A ATDDR5 0x001C ATDDR6 0x001E ATDDR7 0x0020 ATDDR8 0x0022 ATDDR9 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0 SMP2 SMP1 SMP0 SC SCAN MULT ETORF FIFOR 0 0 0 SCF 0 0 0 PRS[4:0] CD CC CB CA CC3 CC2 CC1 CC0 0 0 0 0 CMPE[15:8] CMPE[7:0] CCF[15:8] CCF[7:0] IEN[15:8] IEN[7:0] CMPHT[15:8] CMPHT[7:0] See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” = Unimplemented or Reserved Figure 13-2. ADC12B16C Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 505 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Address Name Bit 7 0x0024 ATDDR10 0x0026 ATDDR11 0x0028 ATDDR12 0x002A ATDDR13 0x002C ATDDR14 0x002E ATDDR15 6 5 4 3 2 1 See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” R W R W R W R W R W R W Bit 0 See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” See Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)” and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)” = Unimplemented or Reserved Figure 13-2. ADC12B16C Register Summary (Sheet 3 of 3) 13.3.2 Register Descriptions This section describes in address order all the ADC12B16C registers and their individual bits. 13.3.2.1 ATD Control Register 0 (ATDCTL0) Writes to this register will abort current conversion sequence. Module Base + 0x0000 7 R W Reserved Reset 0 6 5 4 0 0 0 0 0 0 3 2 1 0 WRAP3 WRAP2 WRAP1 WRAP0 1 1 1 1 = Unimplemented or Reserved Figure 13-3. ATD Control Register 0 (ATDCTL0) Read: Anytime Write: Anytime, in special modes always write 0 to Reserved Bit 7. Table 13-2. ATDCTL0 Field Descriptions Field 3-0 WRAP[3-0] Description Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing multichannel conversions. The coding is summarized in Table 13-3. Table 13-3. Multi-Channel Wrap Around Coding WRAP3 WRAP2 WRAP1 WRAP0 0 0 0 0 Multiple Channel Conversions (MULT = 1) Wraparound to AN0 after Converting Reserved(1) MC9S12XE-Family Reference Manual , Rev. 1.21 506 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-3. Multi-Channel Wrap Around Coding Multiple Channel Conversions (MULT = 1) Wraparound to AN0 after Converting WRAP3 WRAP2 WRAP1 WRAP0 0 0 0 1 AN1 0 0 1 0 AN2 0 0 1 1 AN3 0 1 0 0 AN4 0 1 0 1 AN5 0 1 1 0 AN6 0 1 1 1 AN7 1 0 0 0 AN8 1 0 0 1 AN9 1 0 1 0 AN10 1 0 1 1 AN11 1 1 0 0 AN12 1 1 0 1 AN13 1 1 1 0 AN14 1 1 1 1 1. If only AN0 should be converted use MULT=0. 13.3.2.2 AN15 ATD Control Register 1 (ATDCTL1) Writes to this register will abort current conversion sequence. Module Base + 0x0001 7 6 5 4 3 2 1 0 ETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 0 0 1 0 1 1 1 1 R W Reset Figure 13-4. ATD Control Register 1 (ATDCTL1) Read: Anytime Write: Anytime Table 13-4. ATDCTL1 Field Descriptions Field Description 7 ETRIGSEL External Trigger Source Select — This bit selects the external trigger source to be either one of the AD channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG30 inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has not effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for external trigger. The coding is summarized in Table 13-6. 6–5 SRES[1:0] A/D Resolution Select — These bits select the resolution of A/D conversion results. See Table 13-5 for coding. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 507 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-4. ATDCTL1 Field Descriptions (continued) Field Description 4 SMP_DIS Discharge Before Sampling Bit 0 No discharge before sampling. 1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to the sampling time. This can help to detect an open circuit instead of measuring the previous sampled channel. 3–0 External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3-0 inputs ETRIGCH[3:0] as source for the external trigger. The coding is summarized in Table 13-6. Table 13-5. A/D Resolution Coding SRES1 SRES0 A/D Resolution 0 0 8-bit data 0 1 10-bit data 1 0 12-bit data 1 1 Reserved Table 13-6. External Trigger Channel Select Coding ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is 0 0 0 0 0 AN0 0 0 0 0 1 AN1 0 0 0 1 0 AN2 0 0 0 1 1 AN3 0 0 1 0 0 AN4 0 0 1 0 1 AN5 0 0 1 1 0 AN6 0 0 1 1 1 AN7 0 1 0 0 0 AN8 0 1 0 0 1 AN9 0 1 0 1 0 AN10 0 1 0 1 1 AN11 0 1 1 0 0 AN12 0 1 1 0 1 AN13 0 1 1 1 0 AN14 0 1 1 1 1 AN15 1 0 0 0 0 ETRIG0(1) 1 0 0 0 1 ETRIG11 1 0 0 1 0 ETRIG21 1 0 0 1 1 ETRIG31 1 0 1 X X Reserved 1 1 X X X Reserved 1. Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means external trigger source is still on one of the AD channels selected by ETRIGCH3-0 MC9S12XE-Family Reference Manual , Rev. 1.21 508 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.3 ATD Control Register 2 (ATDCTL2) Writes to this register will abort current conversion sequence. Module Base + 0x0002 7 R 6 5 4 3 2 1 0 AFFC ICLKSTP ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE 0 0 0 0 0 0 0 0 W Reset 0 = Unimplemented or Reserved Figure 13-5. ATD Control Register 2 (ATDCTL2) Read: Anytime Write: Anytime Table 13-7. ATDCTL2 Field Descriptions Field Description 6 AFFC ATD Fast Flag Clear All 0 ATD flag clearing done by write 1 to respective CCF[n] flag. 1 Changes all ATD conversion complete flags to a fast clear sequence. For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag to clear automatically. For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag to clear automatically. 5 ICLKSTP Internal Clock in Stop Mode Bit — This bit enables A/D conversions in stop mode. When going into stop mode and ICLKSTP=1 the ATD conversion clock is automatically switched to the internally generated clock ICLK. Current conversion sequence will seamless continue. Conversion speed will change from prescaled bus frequency to the ICLK frequency (see ATD Electrical Characteristics in device description). The prescaler bits PRS4-0 in ATDCTL4 have no effect on the ICLK frequency. For conversions during stop mode the automatic compare interrupt or the sequence complete interrupt can be used to inform software handler about changing A/D values. External trigger will not work while converting in stop mode. For conversions during transition from Run to Stop Mode or vice versa the result is not written to the results register, no CCF flag is set and no compare is done. When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time. 0 If A/D conversion sequence is ongoing when going into stop mode, the actual conversion sequence will be aborted and automatically restarted when exiting stop mode. 1 A/D continues to convert in stop mode using internally generated clock (ICLK) 4 ETRIGLE External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See Table 13-8 for details. 3 ETRIGP External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 13-8 for details. 2 ETRIGE External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of the ETRIG3-0 inputs as described in Table 13-6. If external trigger source is one of the AD channels, the digital input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with external events. External trigger will not work while converting in stop mode. 0 Disable external trigger 1 Enable external trigger MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 509 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-7. ATDCTL2 Field Descriptions (continued) Field 1 ASCIE 0 ACMPIE Description ATD Sequence Complete Interrupt Enable 0 ATD Sequence Complete interrupt requests are disabled. 1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set. ATD Compare Interrupt Enable — If automatic compare is enabled for conversion n (CMPE[n]=1 in ATDCMPE register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for conversion n), the compare interrupt is triggered. 0 ATD Compare interrupt requests are disabled. 1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), ATD Compare Interrupt will be requested whenever any of the respective CCF flags is set. Table 13-8. External Trigger Configurations 13.3.2.4 ETRIGLE ETRIGP External Trigger Sensitivity 0 0 Falling edge 0 1 Rising edge 1 0 Low level 1 1 High level ATD Control Register 3 (ATDCTL3) Writes to this register will abort current conversion sequence. Module Base + 0x0003 7 6 5 4 3 2 1 0 DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0 0 0 1 0 0 0 0 0 R W Reset = Unimplemented or Reserved Figure 13-6. ATD Control Register 3 (ATDCTL3) Read: Anytime Write: Anytime Field 7 DJM Description Result Register Data Justification — Result data format is always unsigned. This bit controls justification of conversion data in the result registers. 0 Left justified data in the result registers. 1 Right justified data in the result registers. Table 13-10 gives examples ATD results for an input signal range between 0 and 5.12 Volts. Table 13-9. ATDCTL3 Field Descriptions MC9S12XE-Family Reference Manual , Rev. 1.21 510 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Field Description 6–3 S8C, S4C, S2C, S1C Conversion Sequence Length — These bits control the number of conversions per sequence. Table 13-11 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 family. 2 FIFO Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result registers based on the conversion sequence; the result of the first conversion appears in the first result register (ATDDR0), the second result in the second result register (ATDDR1), and so on. If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or ending of a conversion sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning conversion sequence, the result register counter will wrap around when it reaches the end of the result register file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register file, the current conversion result will be placed. Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register (ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion (ETRIG=1). Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode may or may not be useful in a particular application to track valid data. If this bit is one, automatic compare of result registers is always disabled, that is ADC12B16C will behave as if ACMPIE and all CPME[n] were zero. 0 Conversion results are placed in the corresponding result register up to the selected sequence length. 1 Conversion results are placed in consecutive result registers (wrap around at end). 1–0 FRZ[1:0] Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond to a breakpoint as shown in Table 13-12. Leakage onto the storage node and comparator reference capacitors may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period. Table 13-9. ATDCTL3 Field Descriptions (continued) Table 13-10. Examples of ideal decimal ATD Results Input Signal VRL = 0 Volts VRH = 5.12 Volts 8-Bit Codes (resolution=20mV) 10-Bit Codes (resolution=5mV) 12-Bit Codes (transfer curve has 1.25mV offset) (resolution=1.25mV) 5.120 Volts ... 0.022 0.020 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.003 0.002 0.000 255 ... 1 1 1 1 1 1 1 0 0 0 0 0 0 1023 ... 4 4 4 3 3 2 2 2 1 1 0 0 0 4095 ... 17 16 14 12 11 9 8 6 4 3 2 1 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 511 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-11. Conversion Sequence Length Coding S8C S4C S2C S1C Number of Conversions per Sequence 0 0 0 0 16 0 0 0 1 1 0 0 1 0 2 0 0 1 1 3 0 1 0 0 4 0 1 0 1 5 0 1 1 0 6 0 1 1 1 7 1 0 0 0 8 1 0 0 1 9 1 0 1 0 10 1 0 1 1 11 1 1 0 0 12 1 1 0 1 13 1 1 1 0 14 1 1 1 1 15 Table 13-12. ATD Behavior in Freeze Mode (Breakpoint) 13.3.2.5 FRZ1 FRZ0 Behavior in Freeze Mode 0 0 Continue conversion 0 1 Reserved 1 0 Finish current conversion, then freeze 1 1 Freeze Immediately ATD Control Register 4 (ATDCTL4) Writes to this register will abort current conversion sequence. Module Base + 0x0004 7 6 5 SMP2 SMP1 SMP0 0 0 0 4 3 2 1 0 0 1 R PRS[4:0] W Reset 0 0 1 Figure 13-7. ATD Control Register 4 (ATDCTL4) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 512 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-13. ATDCTL4 Field Descriptions Field Description 7–5 SMP[2:0] Sample Time Select — These three bits select the length of the sample time in units of ATD conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0). Table 13-14 lists the available sample time lengths. 4–0 PRS[4:0] ATD Clock Prescaler — These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency is calculated as follows: f BUS f ATDCLK = ------------------------------------2 × ( PRS + 1 ) Refer to Device Specification for allowed frequency range of fATDCLK. Table 13-14. Sample Time Select 13.3.2.6 SMP2 SMP1 SMP0 Sample Time in Number of ATD Clock Cycles 0 0 0 4 0 0 1 6 0 1 0 8 0 1 1 10 1 0 0 12 1 0 1 16 1 1 0 20 1 1 1 24 ATD Control Register 5 (ATDCTL5) Writes to this register will abort current conversion sequence and start a new conversion sequence. If external trigger is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting of a conversion sequence which will then occur on each trigger event. Start of conversion means the beginning of the sampling phase. Module Base + 0x0005 7 R 6 5 4 3 2 1 0 SC SCAN MULT CD CC CB CA 0 0 0 0 0 0 0 0 W Reset 0 Figure 13-8. ATD Control Register 5 (ATDCTL5) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 513 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-15. ATDCTL5 Field Descriptions Field Description 6 SC Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CD, CC, CB and CA of ATDCTL5. Table 13-16 lists the coding. 0 Special channel conversions disabled 1 Special channel conversions enabled 5 SCAN Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed continuously or only once. If external trigger is enabled (ETRIGE=1) setting this bit has no effect, that means external trigger always starts a single conversion sequence. 0 Single conversion sequence 1 Continuous conversion sequences (scan mode) 4 MULT Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified analog input channel for an entire conversion sequence. The analog channel is selected by channel selection code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C, S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits); subsequent channels sampled in the sequence are determined by incrementing the channel selection code or wrapping around to AN0 (channel 0). 0 Sample only one channel 1 Sample across several channels 3–0 CD, CC, CB, CA Analog Input Channel Select Code — These bits select the analog input channel(s) whose signals are sampled and converted to digital codes. Table 13-16 lists the coding used to select the various analog input channels. In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined. In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be examined in the conversion sequence. Subsequent channels are determined by incrementing the channel selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel Select Bits WRAP3-0 in ATDCTL0). In case of starting with a channel number higher than the one defined by WRAP3-0 the first wrap around will be AN15 to AN0. MC9S12XE-Family Reference Manual , Rev. 1.21 514 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-16. Analog Input Channel Select Coding SC CD CC CB CA Analog Input Channel 0 0 0 0 0 AN0 0 0 0 1 AN1 0 0 1 0 AN2 0 0 1 1 AN3 0 1 0 0 AN4 0 1 0 1 AN5 0 1 1 0 AN6 0 1 1 1 AN7 1 0 0 0 AN8 1 13.3.2.7 1 0 0 1 AN9 1 0 1 0 AN10 1 0 1 1 AN11 1 1 0 0 AN12 1 1 0 1 AN13 1 1 1 0 AN14 1 1 1 1 AN15 0 0 0 0 Reserved 0 0 0 1 Reserved 0 0 1 X Reserved 0 1 0 0 VRH 0 1 0 1 VRL 0 1 1 0 (VRH+VRL) / 2 0 1 1 1 Reserved 1 X X X Reserved ATD Status Register 0 (ATDSTAT0) This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and the conversion counter. Module Base + 0x0006 7 6 R 5 4 ETORF FIFOR 0 0 0 SCF 3 2 1 0 CC3 CC2 CC1 CC0 0 0 0 0 W Reset 0 0 = Unimplemented or Reserved Figure 13-9. ATD Status Register 0 (ATDSTAT0) Read: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 515 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Write: Anytime (No effect on (CC3, CC2, CC1, CC0)) Table 13-17. ATDSTAT0 Field Descriptions Field Description 7 SCF Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared when one of the following occurs: A) Write “1” to SCF B) Write to ATDCTL5 (a new conversion sequence is started) C) If AFFC=1 and read of a result register 0 Conversion sequence not completed 1 Conversion sequence has completed 5 ETORF External Trigger Overrun Flag — While in edge trigger mode (ETRIGLE=0), if additional active edges are detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the following occurs: A) Write “1” to ETORF B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted) C) Write to ATDCTL5 (a new conversion sequence is started) 0 No External trigger over run error has occurred 1 External trigger over run error has occurred 4 FIFOR Result Register Over Run Flag — This bit indicates that a result register has been written to before its associated conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because the flag potentially indicates that result registers are out of sync with the input channels. However, it is also practical for non-FIFO modes, and indicates that a result register has been over written before it has been read (i.e. the old data has been lost). This flag is cleared when one of the following occurs: A) Write “1” to FIFOR B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted) C) Write to ATDCTL5 (a new conversion sequence is started) 0 No over run has occurred 1 Overrun condition exists (result register has been written while associated CCFx flag was still set) 3–0 CC[3:0] Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1, CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO mode (FIFO=0) the conversion counter is initialized to zero at the begin and end of the conversion sequence. If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counters wraps around when its maximum value is reached. Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. 13.3.2.8 ATD Compare Enable Register (ATDCMPE) Writes to this register will abort current conversion sequence. Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 516 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Module Base + 0x0008 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 CMPE[15:0] W Reset 8 0 0 0 0 0 0 0 0 0 Figure 13-10. ATD Compare Enable Register (ATDCMPE) Table 13-18. ATDCMPE Field Descriptions Field Description 15–0 Compare Enable for Conversion Number n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence CMPE[15:0] — These bits enable automatic compare of conversion results individually for conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in the ATDCMPHT register. For each conversion number with CMPE[n]=1 do the following: 1) Write compare value to ATDDRn result register 2) Write compare operator with CMPHT[n] in ATDCPMHT register CCF[n] in ATDSTAT2 register will flag individual success of any comparison. 0 No automatic compare 1 Automatic compare of results for conversion n of a sequence is enabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 517 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.9 ATD Status Register 2 (ATDSTAT2) This read-only register contains the Conversion Complete Flags CCF[15:0]. Module Base + 0x000A 15 14 13 12 11 10 9 R 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 CCF[15:0] W Reset 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 13-11. ATD Status Register 2 (ATDSTAT2) Read: Anytime Write: Anytime, no effect Table 13-19. ATDSTAT2 Field Descriptions Field Description 15–0 CCF[15:0] Conversion Complete Flag n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — A conversion complete flag is set at the end of each conversion in a sequence. The flags are associated with the conversion position in a sequence (and also the result register number). Therefore in non-fifo mode, CCF[8] is set when the ninth conversion in a sequence is complete and the result is available in result register ATDDR8; CCF[9] is set when the tenth conversion in a sequence is complete and the result is available in ATDDR9, and so forth. If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag is only set if comparison with ATDDRn is true and if ACMPIE=1 a compare interrupt will be requested. In this case, as the ATDDRn result register is used to hold the compare value, the result will not be stored there at the end of the conversion but is lost. A flag CCF[n] is cleared when one of the following occurs: A) Write to ATDCTL5 (a new conversion sequence is started) B) If AFFC=0, write “1” to CCF[n] C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing by methods B) or C) or D) will be overwritten by the set. 0 Conversion number n not completed or successfully compared 1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn. If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare operator CMPGT[n] is true. (No result available in ATDDRn) MC9S12XE-Family Reference Manual , Rev. 1.21 518 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.10 ATD Input Enable Register (ATDDIEN) Module Base + 0x000C 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 IEN[15:0] W Reset 8 0 0 0 0 0 0 0 0 0 Figure 13-12. ATD Input Enable Register (ATDDIEN) Read: Anytime Write: Anytime Table 13-20. ATDDIEN Field Descriptions Field Description 15–0 IEN[15:0] ATD Digital Input Enable on channel x (x= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls the digital input buffer from the analog input pin (ANx) to the digital data register. 0 Disable digital input buffer to ANx pin 1 Enable digital input buffer on ANx pin. Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while simultaneously using it as an analog port, there is potentially increased power consumption because the digital input buffer maybe in the linear region. 13.3.2.11 ATD Compare Higher Than Register (ATDCMPHT) Writes to this register will abort current conversion sequence. Read: Anytime Write: Anytime Module Base + 0x000E 15 14 13 12 11 10 9 R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 CMPHT[15:0] W Reset 8 0 0 0 0 0 0 0 0 0 Figure 13-13. ATD Compare Higher Than Register (ATDCMPHT) Table 13-21. ATDCMPHT Field Descriptions Field Description 15–0 Compare Operation Higher Than Enable for conversion number n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, CMPHT[15:0] 4, 3, 2, 1, 0) of a Sequence — This bit selects the operator for comparison of conversion results. 0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2 1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 519 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.12 ATD Conversion Result Registers (ATDDRn) The A/D conversion results are stored in 16 result registers. Results are always in unsigned data representation. Left and right justification is selected using the DJM control bit in ATDCTL3. If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must be written with the compare values in left or right justified format depending on the actual value of the DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be stored there at the end of the conversion but is lost. Read: Anytime Write: Anytime NOTE For conversions not using automatic compare, results are stored in the result registers after each conversion. In this case avoid writing to ATDDRn except for initial values, because an A/D result might be overwritten. 13.3.2.12.1 Left Justified Result Data (DJM=0) Module Base + 0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3 0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7 0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11 0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15 15 R W Reset 14 13 Bit 11 Bit 10 Bit 9 0 0 0 12 11 10 9 8 7 6 5 4 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 0 0 0 0 3 2 1 0 0 0 0 0 0 0 0 0 Figure 13-14. Left justified ATD conversion result register (ATDDRn) 13.3.2.12.2 Right Justified Result Data (DJM=1) Module Base + 0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3 0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7 0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11 0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15 R 15 14 13 12 0 0 0 0 0 0 0 0 W Reset 11 10 9 Bit 11 Bit 10 Bit 9 0 0 0 8 7 6 5 4 3 2 1 0 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bi1 1 Bit 0 0 0 0 0 0 0 0 0 0 Figure 13-15. Right justified ATD conversion result register (ATDDRn) Table 13-16 shows how depending on the A/D resolution the conversion result is transferred to the ATD result registers. Compare is always done using all 12 bits of both the conversion result and the compare value in ATDDRn. MC9S12XE-Family Reference Manual , Rev. 1.21 520 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-22. Conversion result mapping to ATDDRn A/D resolution 13.4 DJM conversion result mapping to ATDDRn 8-bit data 0 Bit[11:4] = result, Bit[3:0]=0000 8-bit data 1 Bit[7:0] = result, Bit[11:8]=0000 10-bit data 0 Bit[11:2] = result, Bit[1:0]=00 10-bit data 1 Bit[9:0] = result, Bit[11:10]=00 12-bit data X Bit[11:0] = result Functional Description The ADC12B16C is structured into an analog sub-block and a digital sub-block. 13.4.1 Analog Sub-Block The analog sub-block contains all analog electronics required to perform a single conversion. Separate power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block. 13.4.1.1 Sample and Hold Machine The Sample and Hold (S/H) Machine accepts analog signals from the external world and stores them as capacitor charge on a storage node. During the sample process the analog input connects directly to the storage node. The input analog signals are unipolar and must fall within the potential range of VSSA to VDDA. During the hold process the analog input is disconnected from the storage node. 13.4.1.2 Analog Input Multiplexer The analog input multiplexer connects one of the 16 external analog input channels to the sample and hold machine. 13.4.1.3 Analog-to-Digital (A/D) Machine The A/D Machine performs analog to digital conversions. The resolution is program selectable at either 8 or 10 or 12 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the stored analog sample potential with a series of digitally generated analog potentials. By following a binary search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled potential. When not converting the A/D machine is automatically powered down. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 521 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result in a non-railed digital output code. 13.4.2 Digital Sub-Block This subsection explains some of the digital features in more detail. See Section 13.3.2, “Register Descriptions” for all details. 13.4.2.1 External Trigger Input The external trigger feature allows the user to synchronize ATD conversions to the external environment events rather than relying on software to signal the ATD module when ATD conversions are to take place. The external trigger signal (out of reset ATD channel 15, configurable in ATDCTL1) is programmable to be edge or level sensitive with polarity control. Table 13-23 gives a brief description of the different combinations of control bits and their effect on the external trigger function. Table 13-23. External Trigger Control Bits ETRIGLE ETRIGP ETRIGE SCAN Description X X 0 0 Ignores external trigger. Performs one conversion sequence and stops. X X 0 1 Ignores external trigger. Performs continuous conversion sequences. 0 0 1 X Falling edge triggered. Performs one conversion sequence per trigger. 0 1 1 X Rising edge triggered. Performs one conversion sequence per trigger. 1 0 1 X Trigger active low. Performs continuous conversions while trigger is active. 1 1 1 X Trigger active high. Performs continuous conversions while trigger is active. During a conversion, if additional active edges are detected the overrun error flag ETORF is set. In either level or edge triggered modes, the first conversion begins when the trigger is received. Once ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be triggered externally. If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left asserted in level mode while a sequence is completing, another sequence will be triggered immediately. MC9S12XE-Family Reference Manual , Rev. 1.21 522 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.4.2.2 General-Purpose Digital Port Operation The input channel pins can be multiplexed between analog and digital data. As analog inputs, they are multiplexed and sampled as analog channels to the A/D converter. The analog/digital multiplex operation is performed in the input pads. The input pad is always connected to the analog input channels of the ADC12B16C. The input pad signal is buffered to the digital port registers. This buffer can be turned on or off with the ATDDIEN register. This is important so that the buffer does not draw excess current when analog potentials are presented at its input. 13.5 Resets At reset the ADC12B16C is in a power down state. The reset state of each individual bit is listed within the Register Description section (see Section 13.3.2, “Register Descriptions”) which details the registers and their bit-field. 13.6 Interrupts The interrupts requested by the ADC12B16C are listed in Table 13-24. Refer to MCU specification for related vector address and priority. Table 13-24. ATD Interrupt Vectors Interrupt Source CCR Mask Local Enable Sequence Complete Interrupt I bit ASCIE in ATDCTL2 Compare Interrupt I bit ACMPIE in ATDCTL2 See Section 13.3.2, “Register Descripti