Datasheet Voltage Detectors Voltage Detector ICs with Watchdog Timer BD37Axx Series BD87Axx Series BD99A41F General Description Key Specifications RESET Power Supply Voltage Range: 1.0V to 10V WDT Power Supply Voltage Range: 2.5V to 10V High Precision Detection Voltage: (Ta = 25°C) ±1.5% (Ta = −40°C to 105°C) ±2.5% Super-Low Current Consumption: 5μA(Typ) Operating Temperature Range: -40°C to +105°C The BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM, BD87A34FVM, BD87A41FVM and BD99A41F are watchdog timer reset ICs. It delivers a high precision detection voltage of ±1.5% and a super-low current consumption of 5 µA (Typ). It can be used in a wide range of electronic devices to monitor power supply voltages and in system operation to prevent runaway operation. Packages Features Built-in Watchdog Timer Reset delay time can be set with the CT pin's external capacitance Watchdog timer monitor time and reset time can be set with the CTW pin's external capacitance. Output Circuit Type: N-Channel Open Drain Applications W (Typ) x D (Typ) x H (Max) MSOP8 2.90mm x 4.00mm x 0.90mm SOP8 5.00mm x 6.20mm x 1.71mm All devices using microcontrollers or DSP, including vehicle equipment, displays, servers, DVD players, and telephone systems Ordering Information B D 3 7 A 1 9 F V M - TR Part Number Detection Voltage Package Packaging and forming specification 37A：WDT H Active 87A：WDT L Active 99A：WDT H Active 19：1.9V 28：2.8V 29：2.9V 34：3.4V 41：4.1V FVM : MSOP8 F : SOP8 TR: Embossed tape and reel E2: Embossed tape and reel Lineup Detection voltage (Typ) INH logic 1.9V H: Active MSOP8 Reel of 3000 BD37A19FVM-TR 4.1V H: Active MSOP8 Reel of 3000 BD37A41FVM-TR 2.8V L: Active MSOP8 Reel of 3000 BD87A28FVM-TR 2.9V L: Active MSOP8 Reel of 3000 BD87A29FVM-TR 3.4V L: Active MSOP8 Reel of 3000 BD87A34FVM-TR 4.1V L: Active MSOP8 Reel of 3000 BD87A41FVM-TR 4.1V H: Active SOP8 Reel of 2500 BD99A41F-E2 ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Package Orderable Part Number ○This product has not designed protection against radioactive rays 1/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Pin Configurations MSOP8 (TOP VIEW) 8 7 6 5 SOP8 (TOP VIEW) 8 7 6 5 1 2 3 4 1 2 3 4 Figure 1. Pin Configurations Pin Descriptions BD37AxxFVM No. Pin name 1 CLK 2 CT 3 BD87AxxFVM / BD99A41F No. Pin name Function Clock input from microcontroller 1 CTW WDT time setting capacitor connection pin Reset delay time setting capacitor connection pin 2 CT CTW WDT time setting capacitor connection pin 3 CLK Clock input from microcontroller 4 VDD Power supply pin 4 GND GND pin 5 N.C. NC pin 5 VDD Power supply pin 6 GND GND pin 6 INH WDT ON/OFF setting pin INH=H/L:WDT=OFF/ON(BD87AxxFVM) INH=H/L:WDT=ON/OFF(BD99A41F) 7 INH WDT ON/OFF setting pin INH=H/L:WDT=ON/OFF 7 N.C. NC pin 8 Function RESET Reset output pin Reset delay time setting capacitor connection pin 8 RESET Reset output pin Block Diagrams BD37AxxFVM BD87AxxFVM / BD99A41F VDD VDD RESET RESET 8 CLK 8 CTW 1 1 R R + S Q + Vref S Q Vref 2 N.C. CT INH CT 7 2 7 VDD Pulse Generation Circuit CTW + R 3 + VthH VDD S + CLK GND Q Pulse Generation Circuit VthL 4 + VthH S Q INH 6 VthL GND N.C. VDD R 3 6 VDD 4 5 5 CT pin capacitor: 470pF to 3.3µF CTW pin capacitor: 0.001µF to 10µF Figure 2.Block Diagrams www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Absolute Maximum Ratings (Ta=25℃) Parameter Power Supply Voltage *1 Symbol Ratings Unit VDD −0.3 to 10 V VCT −0.3 to VDD + 0.3 V VCTW −0.3 to VDD + 0.3 V VRESET −0.3 to VDD + 0.3 V INH Pin Voltage VINH −0.3 to VDD + 0.3 V CLK Pin Voltage VCLK −0.3 to VDD + 0.3 V CT Pin Voltage CTW Pin Voltage RESET Pin Voltage Power Dissipation 0.47*2 Pd Operating Ambient Temperature Storage Temperature Maximum Junction Temperature W 0.55*3 Topr −40 to + 105 °C Tstg −55 to + 125 °C Tjmax 125 °C *1 Do not exceed Pd. *2 MSOP8 : Reduced by 4.70 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). *3 SOP8 : Reduced by 5.50 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Ratings(Ta = −40°C to 105°C) Parameter Symbol RESET Power Supply Voltage WDT Power Supply Voltage Min Max Unit VDD RESET 1.0 10 V VDD WDT 2.5 10 V Electrical Characteristics (Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V) Limits Parameter Symbol Min Typ Max Unit Conditions [Overall] Total Supply Current 1 (during WDT operation) Total Supply Current 2 (when WDT stopped) IDD1 — 5 14 µA INH : WDT ON Logic Input CTW = 0.1µF IDD2 — 5 14 µA INH : WDT OFF Logic Input Output Leak Current Ileak — — 1 µA VDD = VDS = 10V Output Current Capacity IOL 0.7 — — mA VDD = 1.2V, VDS = 0.5V 1.9V Detect VDET1 1.871 1.900 1.929 V Ta = 25°C 2.8V Detect VDET1 2.758 2.800 2.842 V Ta = 25°C 2.9V Detect VDET1 2.886 2.930 2.974 V Ta = 25°C 3.4V Detect VDET1 3.349 3.400 3.451 V Ta = 25°C 4.1V Detect VDET1 4.039 4.100 4.162 V Ta = 25°C 1.9V Detect VDET2 1.852 1.900 1.948 V Ta = −40°C to 105°C 2.8V Detect VDET2 2.730 2.800 2.870 V Ta = −40°C to 105°C 2.9V Detect VDET2 2.857 2.930 3.003 V Ta = −40°C to 105°C 3.4V Detect VDET2 3.315 3.400 3.485 V Ta = −40°C to 105°C 4.1V Detect VDET2 4.007 4.100 4.202 V Ta = −40°C to 105°C 1.9V Detect Vrhys VDET×0.03 VDET×0.13 VDET×0.19 V Ta=−40°C to 105°C 2.8V Detect Vrhys VDET×0.018 VDET×0.045 VDET×0.060 V Ta=−40°C to 105°C 2.9V Detect Vrhys VDET×0.02 VDET×0.05 VDET×0.06 V Ta=−40°C to 105°C 3.4V Detect Vrhys VDET×0.02 VDET×0.05 VDET×0.07 V Ta=−40°C to 105°C 4.1V Detect Vrhys VDET×0.018 VDET×0.035 VDET×0.050 V Ta=−40°C to 105°C [RESET] Detection Voltage 1 Detection Voltage 2 Hysteresis Width www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F ●Electrical Characteristics - continued (Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V) Limits Parameter Symbol Min Typ RESET Transmission tPLH 3.9 6.9 Delay Time: Low → High Max Unit Conditions 10.1 ms CCT = 0.001µF *1 When VDD = VDET ±0.5V Delay Circuit Resistance Rrst 5.8 10.0 14.5 MΩ VCT = GND Delay Pin Threshold Voltage VCTH VDD×0.3 VDD×0.45 VDD×0.6 V RL = 470KΩ ICT 150 — — µA VDD = 1.50V, VCT = 0.5V VOPL 1.0 — — V VOL ≤ 0.4V, RL = 470KΩ WDT Monitor Time twH 7.0 10.0 20.0 ms CCTW = 0.01µF *2 WDT Reset Time twL 2.4 3.3 7.0 ms CCTW = 0.01µF *3 Clock Input Pulse Width tWCLK 500 — — ns CLK High Threshold Voltage VCLKH VDD × 0.8 — VDD V CLK Low Threshold Voltage VCLKL 0 — VDD × 0.3 V INH High Threshold Voltage VINHH VDD × 0.8 — VDD V INH Low Threshold Voltage VINHL 0 — VDD × 0.3 V CTW Charge Current ICTWC 0.25 0.50 0.75 µA VCTW = 0.2V CTW Discharge Current ICTWO 0.75 1.50 2.00 µA VCTW = 0.8V Delay Pin Output Current Min Operating Voltage [WDT] *1 *2 *3 tPLH can be varied by changing the CT capacitance value. tPLH (s) ≈ 0.69 × Rrst (MΩ) × CCT (µF) Rrst = 10 MΩ (Typ) twH can be varied by changing the CTW capacitance value. twH (s) ≈ (0.5 × CCTW (µF))/ICTWC (µA) ICTWC = 0.5 µA(Typ) twL can be varied by changing the CTW capacitance value. twL (s) ≈ (0.5 × CCTW (µF))/ICTWO (µA) ICTWO = 1.5 µA(Typ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Typical Performance Curves (Unless otherwise specified, Ta = 25°C) : 4.1V Detection 10 10 CIRCUIT CURRENT: IDD [μA] RESET VOLTAGE: VRESET [V] . 12 8 6 4 2 0 8 Ta=105°C 6 Ta=25°C 4 Ta=-40°C 2 0 0 2 4 6 8 10 0 4 6 8 10 SUPPLY VOLTAGE: VDD [V] SUPPLY VOLTAGE: VDD [V] Figure 4. Total Supply Current Figure 3. Detection Voltage 2 400 CTW PIN CURRENT: ICTW [μA] 350 CT PIN CURRENT: ICT [μA] . 2 300 250 200 150 100 1.5 1 0.5 0 -0.5 50 -1 0 0 1 2 3 4 5 SUPPLY VOLTAGE: VDD [V] Figure 5. Delay Pin Current vs Power Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/15 0 1 2 3 4 CTW PIN VOLTAGE: VCTW [V] Figure 6. CTW Charge Discharge Current TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 5 BD37Axx Series BD87Axx Series Datasheet BD99A41F Typical Performance Curves – continued (Unless otherwise specified, Ta = 25°C) : 4.1V Detection 10000 OUTPUT DELAY TIME: TPLH [ms] . RESET CURRENT: IRESET [mA] 2 Ta=105°C 1.5 1 Ta=25°C Ta=-40°C 0.5 1000 100 10 1 0.0001 0 0 2 4 6 8 10 5 DETECTION VOLTAGE: VDET [V] 10000 WDT RESET TIME: Tw [ms] 0.1 Figure 8. T RESET Transmission Delay Time vs Capacitance Figure 7. Output Current 1000 Moniter Time 10 Reset Time 1 0.1 0.001 0.01 CT PIN CAPACITY: CT [μF] RESET VOLTAGE: VRESET [V] 100 0.001 4.75 4.5 L→H 4.25 4 H→L 3.75 3.5 0.01 0.1 1 10 -40 0 40 80 CTW PIN CAPACITY: CTW [V] AMBIENT TEMPERATURE: Ta [℃] Figure 9. WDT Time vs Capacitance Figure 10. Detection Voltage vs Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Typical Performance Curves – continued (Unless otherwise specified, Ta = 25°C) : 4.1V Detection OUTPUT DELAY RESISTANCE: Rrst [MΩ] OPERATING VOLTAGE: VOPL [V] 1 0.75 0.5 0.25 0 -40 0 40 13 12 11 10 9 8 80 -40 AMBIENT TEMPERATURE: Ta [℃] 40 80 AMBIENT TEMPERATURE: Ta [℃] Figure 11. Operating Marginal Voltage vs Temperature Figure 12. CT Pin Circuit Resistance vs Temperature 10 15 9 12 WDT RESET TIME: Tw [ms] OUTPUT DELAY TIME: TPLH [ms] 0 8 7 6 9 6 3 0 5 -40 0 40 -40 80 40 80 AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃] Figure 13. RESET Transmission Delay Time vs Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 14. WDT Time vs Temperature 7/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Timing Chart VDD Datasheet BD99A41F VDETH VDET VDETH=VDET+Vrhys WDT circuit turns off when INH is low INH0 (BD37AxxFVM／BD99A41F) 0 WDT circuit turns off when INH is high INH (BD87AxxFVM) 0 CLK 0 *4 tWCLK VCT tWCLK VCTH 0 VCTW VthH VthL 0 *2 *1 *3 TWH TWL TPLH RESET 0 ①② ③ ④⑤ ④⑤ ⑥ ⑦ ⑦ ④ ⑤⑧ ⑨ ④ ⑤⑩ ②③ ④ ⑤ ⑩ ②③ ④ ⑤⑩ ⑪ Figure 15. Timing Chart Explanation ① The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V. ② The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage (VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches or exceeds the VDETH voltage. The RESET transmission delay time tPLH allowed to elapse before RESET switches from low to high is given by the following equation: tPLH (s) ≈ 0.69 × Rrst × CCT (µF) [1] Rrst denotes the IC's built-in resistance and is designed to be 10 MΩ (Typ). CCT denotes the external capacitor connected to the CT pin. ③ The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer. ④ The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW) reaches VthH, and RESET switches from high to low. The watchdog timer monitor time tWH is given by the following equation: tWH (s) ≈ (0.5 × CCTW (µF))/(ICTWC) [2] ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ). CCTW denotes the external capacitor connected to the CTW pin. ⑤ The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to high. The watchdog timer reset time tWL is given by the following equation: tWL (s) ≈ (0.5 × CCTW (µF))/(ICTWO) [3] ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ). ⑥ The CTW pin state may not switch from charge to discharge when the CLK input pulse width tWCLK is short. Use a tWCLK input pulse width of at least 500 ns. tWCLK ≥ 500 ns (Min) ⑦ When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW state switches from charge to discharge. Once it discharges to VthL, it will charge again. ⑧ Watchdog timer operation is forced off when the INH pin switches to low (L: BD37Axx Series. BD99A41F, H: BD87AxxSeries). At that time, only the watchdog timer is turned off. Reset detection is performed normally. ⑨ The watchdog timer function turns on when the INH pin switches to high(H: BD37Axx Series. BD99A41F, L: BD87AxxSeries). The external capacitor connected to the CTW pin begins to charge at that time. ⑩ RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower. ⑪ When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Power Dissipation MSOP8 SOP8 800 800 When mounted on a glass epoxy board (70 mm × 70 mm × 1.6mm) θja = 181.8 (°C /W) POWER DISSIPATION: Pd [mW] POWER DISSIPATION: Pd [mW] When mounted on a glass epoxy board (70 mm × 70 mm × 1.6mm) θja = 212.8 (°C /W) 600 470mW 400 200 105°C 0 600 550mW 400 200 105°C 0 0 25 50 75 100 125 0 AMBIENT TEMPERATURE: Ta [°C] 25 50 75 100 125 AMBIENT TEMPERATURE: Ta [°C] Figure 16. Power Dissipation I/O Equivalence Circuit CLK INH CT VDD VDD VDD VDD 10MΩ(Typ) INH CLK CTW VDD CT RESET VDD RESET CTW Figure 17. I/O equivalence circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F External Settings for Pins and Precautions 1. Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high. Use of the IC when the power line impedance is high may result in oscillation. 2. External capacitance A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a CTW discharge time of at least 2 ms. The power-on reset time is given by equation [1] on page 8. The WDT time is given by equations [2] and [3] on page 8. The setting times are proportional to the capacitance value from the equations, so the maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance. Note however that the electrical characteristics do not include the external capacitor's temperature characteristics. Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B E Pin A N P+ P N N P+ N Pin B B C Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 18. Example of monolithic IC structure 12. Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed from their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance of 1000 µF or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a diode for preventing back current flow in series with VDD or bypass diodes between VDD and each pin. Back current prevention diode Bypass diode VDD Pin Figure 19. 13. When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input, output will be equivalent to VDD. 14. Regarding the CLK and INH pins The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input the trigger to the CLK pin within the tWH time. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series BD99A41F Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 MSOP8 12/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Physical Dimension, Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Marking Diagrams MSOP8(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Part Number Marking Package Part Number D3719 MSOP8 Reel of 3000 BD37A19FVM-TR D3741 MSOP8 Reel of 3000 BD37A41FVM-TR D8728 MSOP8 Reel of 3000 BD87A28FVM-TR D8729 MSOP8 Reel of 3000 BD87A29FVM-TR D8734 MSOP8 Reel of 3000 BD87A34FVM-TR D8741 MSOP8 Reel of 3000 BD87A41FVM-TR 99A41 SOP8 Reel of 2500 BD99A41F-E2 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 BD37Axx Series BD87Axx Series Datasheet BD99A41F Revision History Date Revision 12.Apr.2013 001 25.Apr.2013 002 05.Sep.2014 003 Changes New Release P.8 Explanation ⑨ modified. P.9 Figure 17. I/O equivalence circuit the error in writing of the part of CLK was corrected. Applied the ROHM Standard Style www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/15 TSZ02201-0G1G0AN00130-1-2 05.Sep.2014 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD37A19FVM - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD37A19FVM MSOP8 3000 3000 Taping inquiry Yes