TDK CGJ3E3X7R1E334K080AB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : December 10, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ3E3X7R1E334K080AB
TDK item description CGJ3E3X7R1E334KT****
Applications
Feature
Series
High Reliability Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
CGJ3(1608) [EIA 0603]
Status
Production
Size
Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
Thickness(T)
0.80mm ±0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PA)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PB)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
330nF ±10%
Rated Voltage
25VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
1515MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : December 10, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ3E3X7R1E334K080AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
CGJ3E3X7R1E334K080AB
ESR
CGJ3E3X7R1E334K080AB
Capacitance
CGJ3E3X7R1E334K080AB
CGJ3E3X7R1E334K080AB
Temperature Characteristic
CGJ3E3X7R1E334K080AB(No Bias)
DC Bias Characteristic
CGJ3E3X7R1E334K080AB(DC Bias =
12.5V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
CGJ3E3X7R1E334K080AB(100kHz)
CGJ3E3X7R1E334K080AB(500kHz)
CGJ3E3X7R1E334K080AB(1MHz)
Multilayer Ceramic Chip Capacitors
CGJ3E3X7R1E334K080AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : December 10, 2017 (GMT)
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