1 of 3 Creation Date : December 10, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ3E3X7R1E334K080AB TDK item description CGJ3E3X7R1E334KT**** Applications Feature Series High Reliability Grade General General (Up to 50V) AEC-Q200 AEC-Q200 CGJ3(1608) [EIA 0603] Status Production Size Length(L) 1.60mm ±0.10mm Width(W) 0.80mm ±0.10mm Thickness(T) 0.80mm ±0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 330nF ±10% Rated Voltage 25VDC Temperature Characteristic X7R(±15%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 1515MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : December 10, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ3E3X7R1E334K080AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGJ3E3X7R1E334K080AB ESR CGJ3E3X7R1E334K080AB Capacitance CGJ3E3X7R1E334K080AB CGJ3E3X7R1E334K080AB Temperature Characteristic CGJ3E3X7R1E334K080AB(No Bias) DC Bias Characteristic CGJ3E3X7R1E334K080AB(DC Bias = 12.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGJ3E3X7R1E334K080AB(100kHz) CGJ3E3X7R1E334K080AB(500kHz) CGJ3E3X7R1E334K080AB(1MHz) Multilayer Ceramic Chip Capacitors CGJ3E3X7R1E334K080AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : December 10, 2017 (GMT)