Material Content Data Sheet Sales Product Name IFX25001TS V50 MA# MA000714730 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2070.05 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 2.945 0.14 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.14 1423 1423 394 0.245 0.01 815.335 39.38 39.43 393872 118 394384 0.169 0.01 0.01 82 82 1.268 0.06 613 58.330 2.82 574.419 27.75 30.63 277491 306282 21.462 1.04 1.04 10368 10368 0.244 0.01 0.001 0.00 0.115 0.01 0.092 0.00 4.377 0.21 0.177 0.01 0.590 0.03 589.466 28.48 28178 118 0.01 0 44 0.22 2114 2. 3. 285 28.52 284759 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2213 86 Important Remarks: 1. 118 55 285130 1000000