TI1 MSP430F5219 Mixed signal microcontroller Datasheet

MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
MSP430F522x, MSP430F521x Mixed Signal Microcontroller
Check for
Samples: MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222, MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
FEATURES
1
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Dual-Supply Voltage Device
– Primary Supply (AVCC, DVCC):
– Powered From External Supply:
3.6 V Down to 1.8 V
– Up to 22 General-Purpose I/O With up to
Four External Interrupts
– Low-Voltage Interface Supply (DVIO):
– Powered From Separate External
Supply: 1.62 V to 1.98 V
– Up to 31 General-Purpose I/O With up to
12 External Interrupts
– Serial Communications
Ultralow-Power Consumption
– Active Mode (AM):
All System Clocks Active
290 µA/MHz at 8 MHz, 3.0 V, Flash Program
Execution (Typical)
150 µA/MHz at 8 MHz, 3.0 V, RAM Program
Execution (Typical)
– Standby Mode (LPM3):
Real-Time Clock (RTC) With Crystal,
Watchdog, and Supply Supervisor
Operational, Full RAM Retention, Fast Wake
Up:
1.9 µA at 2.2 V, 2.1 µA at 3.0 V (Typical)
Low-Power Oscillator (VLO), GeneralPurpose Counter, Watchdog, and Supply
Supervisor Operational, Full RAM
Retention, Fast Wake Up:
1.4 µA at 3.0 V (Typical)
– Off Mode (LPM4):
Full RAM Retention, Supply Supervisor
Operational, Fast Wake Up:
1.1 µA at 3.0 V (Typical)
– Shutdown Mode (LPM4.5):
0.18 µA at 3.0 V (Typical)
Wake Up From Standby Mode in 3.5 µs
(Typical)
16-Bit RISC Architecture, Extended Memory,
up to 25-MHz System Clock
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Flexible Power Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring,
and Brownout
Unified Clock System
– FLL Control Loop for Frequency
Stabilization
– Low-Power Low-Frequency Internal Clock
Source (VLO)
– Low Frequency Trimmed Internal Reference
Source (REFO)
– 32-kHz Watch Crystals (XT1)
– High-Frequency Crystals up to 32 MHz
(XT2)
16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TA2, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TB0, Timer_B With Seven
Capture/Compare Shadow Registers
Two Universal Serial Communication
Interfaces
– USCI_A0 and USCI_A1 Each Support:
– Enhanced UART With Auto-Baudrate
Detection
– IrDA Encoder and Decoder
– Synchronous SPI
– USCI_B0 and USCI_B1 Each Support:
– I2C
– Synchronous SPI
10-Bit Analog-to-Digital Converter (ADC) With
Internal Reference, Sample-and-Hold
Comparator
Hardware Multiplier Supports 32-Bit
Operations
Serial Onboard Programming, No External
Programming Voltage Needed
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP430, Code Composer Studio are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
•
•
www.ti.com
Three Channel Internal DMA
Basic Timer With Real-Time Clock (RTC)
Feature
Table 1 Summarizes Available Family
Members
For Complete Module Descriptions, See the
MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208)
•
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For Design Guidelines, See Designing With
MSP430F522x Devices (SLAA558)
APPLICATIONS
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Analog and Digital Sensor Systems
Data Loggers
General-Purpose Applications
DESCRIPTION
The Texas Instruments MSP430™ family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with extensive lowpower modes, is optimized to achieve extended battery life in portable measurement applications. The device
features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active
mode in 3.5 µs (typical).
The MSP430F522x series are microcontroller configurations with four 16-bit timers, a high-performance 10-bit
analog-to-digital converter (ADC), two universal serial communication interfaces (USCIs), a hardware multiplier,
DMA, a comparator, and a real-time clock (RTC) module with alarm capabilities. The MSP430F521x series
include all of the peripherals of the MSP430F522x series with the exception of the ADC. All devices have a split
I/O supply system that allows for a seamless interface to other devices that have a nominal 1.8-V I/O interface
without the need for external level translation.
Typical applications include analog and digital sensor systems, data loggers, and various general-purpose
applications.
Table 1 summarizes the available family members.
Table 1. Family Members (1) (2)
USCI
Device
Flash
(KB)
SRAM
(KB)
MSP430F5229
128
8
5, 3, 3
MSP430F5227
64
8
MSP430F5224
128
MSP430F5222
64
Channel B:
SPI, I2C
ADC10_A
(Ch)
Comp_B
(Ch)
I/O
DVCC (5)
I/O
DVIO (6)
Package
Type
7
2
2
10 ext,
2 int
8
22
31
64 RGC
64 YFF
80 ZQE
5, 3, 3
7
2
2
10 ext,
2 int
8
22
31
64 RGC
64 YFF
80 ZQE
8
5, 3, 3
7
2
2
8 ext, 2 int
6
20
17
48 RGZ
8
5, 3, 3
7
2
2
8 ext, 2 int
6
20
17
48 RGZ
Timer_A
Timer_B
(4)
MSP430F5219
128
8
5, 3, 3
7
2
2
-
8
22
31
64 RGC
64 YFF
80 ZQE
MSP430F5217
64
8
5, 3, 3
7
2
2
-
8
22
31
64 RGC
64 YFF
80 ZQE
MSP430F5214
128
8
5, 3, 3
7
2
2
-
6
20
17
48 RGZ
MSP430F5212
64
8
5, 3, 3
7
2
2
-
6
20
17
48 RGZ
(1)
(2)
(3)
(4)
(5)
(6)
2
Channel A:
UART, IrDA,
SPI
(3)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/packaging.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
All of these I/O reside on a single voltage rail supplied by DVCC.
All of these I/O reside on a single voltage rail supplied by DVIO.
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MSP430F5214 MSP430F5212
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Functional Block Diagram – F5229, F5227 – RGC, ZQE, YFF Packages
XIN XOUT
XT2IN
XT2OUT
Unified
Clock
System
RSTDVCC RST/NMI BSLEN
ACLK
8KB
Power
Management
Flash
RAM
LDO
SVM/SVS
Brownout
PA
DVIO VCORE
P1.x
P2.x
SYS
P1
P1
P2
1×4 I/Os 1×4 I/Os 1×8 I/Os
Watchdog
PA
1×16 I/Os
Port Map
Control
(P4)
I/O Ports
Interrupt and Wakeup
SMCLK
MCLK
CPUXV2
and
Working
Registers
128KB
64KB
DVCC AVCC
DVSS AVSS
P3.x
PB
P4.x
P5.x
PC
P6.x
PJ
PD
P7.x PJ.x
P3
P4
P5
P6
P7
1×5 I/Os 1×8 I/Os 1×6 I/Os 1×8 I/Os 1×6 I/Os
PB
1×13 I/Os
PC
1×14 I/Os
USCI0,1
PD
PJ
1×6 I/Os 1×4 I/Os
I/O Ports
USCI_Ax:
UART,
IrDA, SPI
USCI_Bx:
SPI, I2C
MAB
DMA
MDB
3 Channel
EEM
(S: 3+1)
ADC10_A
JTAG,
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
10 Bit
200 KSPS
12 Channels
(10 ext,2 int)
COMP_B
REF
8 Channels
I/O are supplied by DVIO
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5214 MSP430F5212
3
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
P7.0/TB0.0
P7.1/TB0.1
P7.2/TB0.2
P7.3/TB0.3
P7.4/TB0.4
P7.5/TB0.5
BSLEN
RST/NMI
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RSTDVCC/SBWTDIO
Pin Designation – F5229, F5227 – RGC Package
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P6.0/A0/CB0
1
48
P4.7/PM_NONE
P6.1/A1/CB1
2
47
P4.6/PM_NONE
P6.2/A2/CB2
3
46
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/A3/CB3
4
45
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P6.4/A4/CB4
5
44
P4.3/PM_UCB1CLK/PM_UCA1STE
P6.5/A5/CB5
6
43
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P6.6/A6/CB6
7
42
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P6.7/A7/CB7
8
MSP430F5229IRGC
41
P4.0/PM_UCB1STE/PM_UCA1CLK
P5.0/A8/VeREF+
9
MSP430F5227IRGC
40
DVIO
P5.1/A9/VeREF-
10
39
DVSS
AVCC
11
38
P3.4/UCA0RXD/UCA0SOMI
P2.5/TA2.2
P2.7/UCB0STE/UCA0CLK
P2.6/RTCCLK/DMAE0
P2.4/TA2.1
P2.3/TA2.0
P3.0/UCB0SIMO/UCB0SDA
P2.2/TA2CLK/SMCLK
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P2.1/TA1.2
15
DVSS
P2.0/TA1.1
DVCC
P1.7/TA1.0
P3.1/UCB0SOMI/UCB0SCL
P1.6/TA1CLK/CBOUT
35
P1.5/TA0.4
14
P1.4/TA0.3
AVSS
P1.3/TA0.2
P3.2/UCB0CLK/UCA0STE
P1.2/TA0.1
P3.3/UCA0TXD/UCA0SIMO
36
P1.1/TA0.0
37
13
P1.0/TA0CLK/ACLK
12
VCORE
P5.4/XIN
P5.5/XOUT
NOTE: Connection of exposed thermal pad to VSS is recommended.
4
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Product Folder Links: MSP430F5229 MSP430F5227 MSP430F5224 MSP430F5222 MSP430F5219 MSP430F5217
MSP430F5214 MSP430F5212
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Functional Block Diagram – F5224, F5222 – RGZ Package
XIN XOUT
RSTDVCC RST/NMI BSLEN
DVCC AVCC
DVSS AVSS
PA
DVIO VCORE
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
8KB
Power
Management
SYS
P1
P1
P2
1×4 I/Os 1×4 I/Os 1×1 I/Os
Watchdog
PA
1×9 I/Os
Port Map
Control
(P4)
I/O Ports
Interrupt and Wakeup
SMCLK
MCLK
CPUXV2
and
Working
Registers
128KB
64KB
Flash
RAM
LDO
SVM,SVS
Brownout
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
PJ
PJ.x
P3
P4
P5
P6
1×5 I/Os 1×7 I/Os 1×6 I/Os 1×6 I/Os
PB
1×12 I/Os
PC
1×12 I/Os
USCI0,1
PJ
1×4 I/Os
USCI_Ax:
UART,
IrDA, SPI
I/O Ports
USCI_Bx:
SPI, I2C
MAB
DMA
MDB
3 Channel
EEM
(S: 3+1)
ADC10_A
JTAG,
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
10 Bit
200 KSPS
10 Channels
(8 ext, 2 int)
COMP_B
REF
6 Channels
I/O are supplied by DVIO
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5214 MSP430F5212
5
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
RST/NMI
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RSTDVCC/SBWTDIO
P6.0/A0/CB0
P6.1/A1/CB1
P6.2/A2/CB2
Pin Designation – F5224, F5222 – RGZ Package
48 47 46 45 44 43 42 41 40 39 38 37
P6.3/A3/CB3
1
36
BSLEN
P6.4/A4/CB4
2
35
P4.6/PM_NONE
P6.5/A5/CB5
3
34
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P5.0/A8/VeREF+
4
33
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P5.1/A9/VeREF-
5
32
P4.3/PM_UCB1CLK/PM_UCA1STE
AVCC
6
MSP430F5224IRGZ
31
P4.2/PM_UCB1SOMI/PM_UCB1SCL
MSP430F5222IRGZ
27
DVSS
11
26
P3.4/UCA0RXD/UCA0SOMI
12
25
13 14 15 16 17 18 19 20 21 22 23 24
P3.3/UCA0TXD/UCA0SIMO
P1.0/TA0CLK/ACLK
VCORE
P3.2/UCB0CLK/UCA0STE
10
DVSS
P3.1/UCB0SOMI/UCB0SCL
DVCC
P2.7/UCB0STE/UCA0CLK
DVIO
P3.0/UCB0SIMO/UCB0SDA
28
P1.7/TA1.0
9
P1.5/TA0.4
AVSS
P1.6/TA1CLK/CBOUT
P4.0/PM_UCB1STE/PM_UCA1CLK
P1.4/TA0.3
P4.1/PM_UCB1SIMO/PM_UCB1SDA
29
P1.3/TA0.2
30
8
P1.2/TA0.1
7
P1.1/TA0.0
P5.4/XIN
P5.5/XOUT
NOTE: Connection of exposed thermal pad to VSS is recommended.
6
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MSP430F5214 MSP430F5212
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Functional Block Diagram – F5219, F5217 – RGC, ZQE, YFF Packages
XIN XOUT
XT2IN
XT2OUT
Unified
Clock
System
RSTDVCC RST/NMI BSLEN
ACLK
8KB
Power
Management
Flash
RAM
LDO
SVM/SVS
Brownout
PA
DVIO VCORE
P1.x
P2.x
SYS
P1
P1
P2
1×4 I/Os 1×4 I/Os 1×8 I/Os
Watchdog
PA
1×16 I/Os
Port Map
Control
(P4)
I/O Ports
Interrupt and Wakeup
SMCLK
MCLK
CPUXV2
and
Working
Registers
128KB
64KB
DVCC AVCC
DVSS AVSS
P3.x
PB
P4.x
P5.x
PC
P6.x
PJ
PD
P7.x PJ.x
P3
P4
P5
P6
P7
1×5 I/Os 1×8 I/Os 1×6 I/Os 1×8 I/Os 1×6 I/Os
PB
1×13 I/Os
PC
1×14 I/Os
USCI0,1
PD
PJ
1×6 I/Os 1×4 I/Os
I/O Ports
USCI_Ax:
UART,
IrDA, SPI
USCI_Bx:
SPI, I2C
MAB
DMA
MDB
3 Channel
EEM
(S: 3+1)
JTAG,
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
COMP_B
RTC_A
CRC16
REF
8 Channels
I/O are supplied by DVIO
Copyright © 2012–2013, Texas Instruments Incorporated
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7
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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P7.0/TB0.0
P7.1/TB0.1
P7.2/TB0.2
P7.3/TB0.3
P7.4/TB0.4
P7.5/TB0.5
BSLEN
RST/NMI
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RSTDVCC/SBWTDIO
Pin Designation – F5219, F5217 – RGC Package
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P6.0/CB0
1
48
P4.7/PM_NONE
P6.1/CB1
2
47
P4.6/PM_NONE
P6.2/CB2
3
46
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3
4
45
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P6.4/CB4
5
44
P4.3/PM_UCB1CLK/PM_UCA1STE
P6.5/CB5
6
43
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P6.6/CB6
7
42
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P6.7/CB7
8
MSP430F5219IRGC
41
P4.0/PM_UCB1STE/PM_UCA1CLK
P5.0
9
MSP430F5217IRGC
40
DVIO
P5.1
10
39
DVSS
AVCC
11
38
P3.4/UCA0RXD/UCA0SOMI
P2.7/UCB0STE/UCA0CLK
P2.6/RTCCLK/DMAE0
P2.5/TA2.2
P2.4/TA2.1
P2.3/TA2.0
P3.0/UCB0SIMO/UCB0SDA
P2.1/TA1.2
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P2.2/TA2CLK/SMCLK
15
DVSS
P2.0/TA1.1
DVCC
P1.7/TA1.0
P3.1/UCB0SOMI/UCB0SCL
P1.6/TA1CLK/CBOUT
35
P1.5/TA0.4
14
P1.4/TA0.3
AVSS
P1.3/TA0.2
P3.2/UCB0CLK/UCA0STE
P1.2/TA0.1
P3.3/UCA0TXD/UCA0SIMO
36
P1.1/TA0.0
37
13
VCORE
12
P1.0/TA0CLK/ACLK
P5.4/XIN
P5.5/XOUT
NOTE: Connection of exposed thermal pad to VSS is recommended.
8
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MSP430F5214 MSP430F5212
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Functional Block Diagram – F5214, F5212 – RGZ Package
XIN XOUT
XT2IN
XT2OUT
Unified
Clock
System
RSTDVCC RST/NMI BSLEN
ACLK
8KB
Power
Management
Flash
RAM
LDO
SVM, SVS
Brownout
PA
DVIO VCORE
P1.x
P2.x
SYS
P1
P1
P2
1×4 I/Os 1×4 I/Os 1×1 I/Os
Watchdog
PA
1×9 I/Os
Port Map
Control
(P4)
I/O Ports
Interrupt and Wakeup
SMCLK
MCLK
CPUXV2
and
Working
Registers
128KB
64KB
DVCC AVCC
DVSS AVSS
P3.x
PB
P4.x
P5.x
PC
P6.x
PJ
PJ.x
P3
P4
P5
P6
1×5 I/Os 1×7 I/Os 1×6 I/Os 1×6 I/Os
PB
1×12 I/Os
PC
1×12 I/Os
USCI0,1
PJ
1×4 I/Os
USCI_Ax:
UART,
IrDA, SPI
I/O Ports
USCI_Bx:
SPI, I2C
MAB
DMA
MDB
3 Channel
EEM
(S: 3+1)
JTAG,
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
COMP_B
RTC_A
CRC16
REF
6 Channels
I/O are supplied by DVIO
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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RST/NMI
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RSTDVCC/SBWTDIO
P6.0/CB0
P6.1/CB1
P6.2/CB2
Pin Designation – F5214, F5212 – RGZ Package
48 47 46 45 44 43 42 41 40 39 38 37
P6.3/CB3
1
36
BSLEN
P6.4/CB4
2
35
P4.6/PM_NONE
P6.5/CB5
3
34
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P5.0
4
33
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P5.1
5
32
P4.3/PM_UCB1CLK/PM_UCA1STE
AVCC
6
MSP430F5214IRGZ
31
P4.2/PM_UCB1SOMI/PM_UCB1SCL
MSP430F5212IRGZ
27
DVSS
11
26
P3.4/UCA0RXD/UCA0SOMI
12
25
13 14 15 16 17 18 19 20 21 22 23 24
P3.3/UCA0TXD/UCA0SIMO
P1.0/TA0CLK/ACLK
VCORE
P3.2/UCB0CLK/UCA0STE
10
DVSS
P3.1/UCB0SOMI/UCB0SCL
DVCC
P2.7/UCB0STE/UCA0CLK
DVIO
P3.0/UCB0SIMO/UCB0SDA
28
P1.7/TA1.0
9
P1.6/TA1CLK/CBOUT
AVSS
P1.5/TA0.4
P4.0/PM_UCB1STE/PM_UCA1CLK
P1.4/TA0.3
P4.1/PM_UCB1SIMO/PM_UCB1SDA
29
P1.3/TA0.2
30
8
P1.2/TA0.1
7
P1.1/TA0.0
P5.4/XIN
P5.5/XOUT
NOTE: Connection of exposed thermal pad to VSS is recommended.
10
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Pin Designation – F5229, F5227, F5219, F5217 – ZQE Package
ZQE PACKAGE
(TOP VIEW)
P6.0 RSTDVCC PJ.2
TEST RST/NMI P7.5
P7.1
A7
A8
A9
A2
P6.2
P6.1
PJ.3
P5.3
P5.2
B1
B2
B3
B4
B5
P6.4
P6.3
PJ.1
PJ.0
C1
C2
C4
C5
C6
P6.6
P6.5
P6.7
D1
D2
D3
D4
D5
D6
P5.0
P5.1
E1
E2
E3
E4
E5
E6
E7
E8
P5.4
AVCC
F1
F2
F3
F4
F5
F6
F7
F8
F9
P5.5
AVSS
P1.3
P1.6
P2.1
P3.4
P3.2
P3.3
G1
G2
G3
G4
G5
G6
G7
G8
G9
DVCC
P1.0
P1.1
P1.4
P1.7
P2.3
P2.7
P3.0
P3.1
H1
H2
H3
H4
H5
H6
H7
H8
H9
P1.5
P2.0
P2.2
P2.4
P2.5
P2.6
J4
J5
J6
J7
J8
J9
Copyright © 2012–2013, Texas Instruments Incorporated
BSLEN P7.2
B6
P7.0
B7
B8
B9
P4.7
P4.6
P4.5
C7
C8
C9
P4.4
P4.3
P4.2
D7
D8
D9
P4.1
P4.0
DVIO
E9
DVSS
DVSS VCORE P1.2
J2
A6
P7.3
A1
J1
A4
A5
P7.4
A3
J3
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Pin Designation – F5229, F5227, F5219, F5217 – YFF Package
YFF PACKAGE
(BALL-SIDE VIEW)
YFF PACKAGE
(TOP VIEW)
D
H8
P3.0
H7
P3.3
H6
DVSS
H5
DVIO
H4
P4.1
H3
P4.4
H2
P4.6
H1
P7.0
H1
P7.0
H2
P4.6
H3
P4.4
H4
P4.1
H5
DVIO
H6
DVSS
H7
P3.3
H8
P3.0
G8
P2.6
G7
P3.1
G6
P3.2
G5
P3.4
G4
P4.3
G3
P4.7
G2
P7.1
G1
P7.3
G1
P7.3
G2
P7.1
G3
P4.7
G4
P4.3
G5
P3.4
G6
P3.2
G7
P3.1
G8
P2.6
F8
P2.3
F7
P2.5
F6
P2.7
F5
P4.0
F4
P4.5
F3
P7.2
F2
P7.4
F1
P7.5
F1
P7.5
F2
P7.4
F3
P7.2
F4
P4.5
F5
P4.0
F6
P2.7
F7
P2.5
F8
P2.3
E4
E3
E2
E1
E1
E2
E3
E4
E8
E7
E6
E5
P2.0
P2.2
P2.4
P4.2
D8
P1.5
D7
P1.6
D6
D5
C8
P1.2
TEST RST/NMI BSLEN P5.2
P5.2 BSLEN RST/NMI TEST
D
E5
E6
E7
E8
P4.2
P2.4
P2.2
P2.0
D6
P1.7
D3
D4
P2.1 RSTDVCC PJ.2
D2
PJ.0
D1
P5.3
D1
P5.3
D2
PJ.0
D5
D3
D4
PJ.2 RSTDVCC P2.1
P1.7
D7
P1.6
D8
P1.5
C7
P1.1
C6
P1.3
C5
P1.4
C4
P6.6
C3
P6.3
C2
P6.0
C1
PJ.1
C1
PJ.1
C2
P6.0
C3
P6.3
C4
P6.6
C5
P1.4
C6
P1.3
C7
P1.1
C8
P1.2
B8
B7
VCORE P1.0
B6
AVSS
B5
AVCC
B4
P5.0
B3
P6.5
B2
P6.2
B1
PJ.3
B1
PJ.3
B2
P6.2
B3
P6.5
B4
P5.0
B5
AVCC
B6
AVSS
B8
B7
P1.0 VCORE
A6
P5.5
A5
P5.4
A4
P5.1
A3
P6.7
A2
P6.4
A1
P6.1
A1
P6.1
A2
P6.4
A3
P6.7
A4
P5.1
A5
P5.4
A6
P5.5
A8
A7
DVSS DVCC
E
A8
A7
DVCC DVSS
E
Package Dimensions: The package dimensions for the YFF package are shown in Table 2. See the package
drawing at the end of this data sheet for more details.
Table 2. YFF Package Dimensions
PACKAGED DEVICES
D
E
3.415 ± 0.03
3.535 ± 0.03
MSP430F5229IYFF
MSP430F5227IYFF
MSP430F5219IYFF
MSP430F5217IYFF
12
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 3. Terminal Functions
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
RGC
ZQE
YFF
RGZ
P6.4/CB4/A4
5
C1
A2
2
I/O
General-purpose digital I/O
Comparator_B input CB4
Analog input A4 – ADC (not available on all device types)
P6.5/CB5/A5
6
D2
B3
3
I/O
General-purpose digital I/O
Comparator_B input CB5
Analog input A5 – ADC (not available on all device types)
P6.6/CB6/A6
7
D1
C4
N/A
I/O
General-purpose digital I/O (not available on all device types)
Comparator_B input CB6 (not available on all device types)
Analog input A6 – ADC (not available on all device types)
P6.7/CB7/A7
8
D3
A3
N/A
I/O
General-purpose digital I/O (not available on all device types)
Comparator_B input CB7 (not available on all device types)
Analog input A7 – ADC (not available on all device types)
P5.0/A8/VeREF+
9
E1
B4
4
I/O
General-purpose digital I/O
Analog input A8 – ADC (not available on all device types)
Input for an external reference voltage to the ADC (not available on all
device types)
P5.1/A9/VeREF-
10
E2
A4
5
I/O
General-purpose digital I/O
Analog input A9 – ADC (not available on all device types)
Negative terminal for the ADC's reference voltage for an external applied
reference voltage (not available on all device types)
AVCC
11
F2
B5
6
P5.4/XIN
12
F1
A5
7
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT1 (2)
P5.5/XOUT
13
G1
A6
8
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT1
AVSS
14
G2
B6
9
Analog ground supply
DVCC
15
H1
A7
10
Digital power supply
DVSS
16
J1
A8
11
Digital ground supply
VCORE (3)
17
J2
B8
12
Regulated core power supply output (internal use only, no external
current loading)
P1.0/TA0CLK/ACLK
18
H2
B7
13
I/O
General-purpose digital I/O with port interrupt
TA0 clock signal TA0CLK input
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
P1.1/TA0.0
19
H3
C7
14
I/O
General-purpose digital I/O with port interrupt
TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
P1.2/TA0.1
20
J3
C8
15
I/O
General-purpose digital I/O with port interrupt
TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
P1.3/TA0.2
21
G4
C6
16
I/O
General-purpose digital I/O with port interrupt
TA0 CCR2 capture: CCI2A input, compare: Out2 output
(1)
(2)
(3)
Analog power supply
I = input, O = output, N/A = not available
When in crystal bypass mode, XIN can be configured so that it can support an input digital waveform with swing levels from DVSS to
DVCC or DVSS to DVIO. In this case, it is required that the pin be configured properly for the intended input swing.
VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 3. Terminal Functions (continued)
TERMINAL
I/O (1)
NO.
NAME
DESCRIPTION
RGC
ZQE
YFF
RGZ
P1.4/TA0.3 (4)
22
H4
C5
17
I/O
General-purpose digital I/O with port interrupt
TA0 CCR3 capture: CCI3A input compare: Out3 output
P1.5/TA0.4 (4)
23
J4
D8
18
I/O
General-purpose digital I/O with port interrupt
TA0 CCR4 capture: CCI4A input, compare: Out4 output
P1.6/TA1CLK/CBOUT (4)
24
G5
D7
19
I/O
General-purpose digital I/O with port interrupt
TA1 clock signal TA1CLK input
Comparator_B output
P1.7/TA1.0 (4)
25
H5
D6
20
I/O
General-purpose digital I/O with port interrupt
TA1 CCR0 capture: CCI0A input, compare: Out0 output
(4)
26
J5
E8
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA1 CCR1 capture: CCI1A input, compare: Out1 output (not available on
all device types)
P2.1/TA1.2 (4)
27
G6
D5
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA1 CCR2 capture: CCI2A input, compare: Out2 output (not available on
all device types)
P2.0/TA1.1
P2.2/TA2CLK/SMCLK
(5)
P2.3/TA2.0 (5)
28
J6
E7
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA2 clock signal TA2CLK input ; SMCLK output (not available on all
device types)
29
H6
F8
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA2 CCR0 capture: CCI0A input, compare: Out0 output (not available on
all device types)
(5)
30
J7
E6
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA2 CCR1 capture: CCI1A input, compare: Out1 output (not available on
all device types)
P2.5/TA2.2 (5)
31
J8
F7
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
TA2 CCR2 capture: CCI2A input, compare: Out2 output (not available on
all device types)
P2.6/RTCCLK/DMAE0 (5)
32
J9
G8
N/A
I/O
General-purpose digital I/O with port interrupt (not available on all device
types)
RTC clock output for calibration (not available on all device types)
DMA external trigger input (not available on all device types)
P2.4/TA2.1
33
H7
F6
21
I/O
General-purpose digital I/O
Slave transmit enable – USCI_B0 SPI mode
Clock signal input – USCI_A0 SPI slave mode
Clock signal output – USCI_A0 SPI master mode
P3.0/UCB0SIMO/UCB0SDA (5)
34
H8
H8
22
I/O
General-purpose digital I/O
Slave in, master out – USCI_B0 SPI mode
I2C data – USCI_B0 I2C mode
P3.1/UCB0SOMI/UCB0SCL (5)
35
H9
G7
23
I/O
General-purpose digital I/O
Slave out, master in – USCI_B0 SPI mode
I2C clock – USCI_B0 I2C mode
P2.7/UCB0STE/UCA0CLK
(4)
(5)
14
(5)
This pin function is supplied by DVIO. See Electrical Characteristics for input and output requirements.
This pin function is supplied by DVIO. See Electrical Characteristics for input and output requirements.
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 3. Terminal Functions (continued)
TERMINAL
I/O (1)
NO.
NAME
RGC
ZQE
YFF
DESCRIPTION
RGZ
36
G8
G6
24
I/O
General-purpose digital I/O
Clock signal input – USCI_B0 SPI slave mode
Clock signal output – USCI_B0 SPI master mode
Slave transmit enable – USCI_A0 SPI mode
P3.3/UCA0TXD/UCA0SIMO (5)
37
G9
H7
25
I/O
General-purpose digital I/O
Transmit data – USCI_A0 UART mode
Slave in, master out – USCI_A0 SPI mode
P3.4/UCA0RXD/UCA0SOMI (5)
38
G7
G5
26
I/O
General-purpose digital I/O
Receive data – USCI_A0 UART mode
Slave out, master in – USCI_A0 SPI mode
DVSS
39
F9
H6
27
Digital ground supply
DVIO (6)
40
E9
H5
28
Digital I/O power supply
P3.2/UCB0CLK/UCA0STE
(5)
P4.0/PM_UCB1STE/
PM_UCA1CLK (5)
41
E8
F5
29
I/O
General-purpose
function
Default mapping:
Default mapping:
Default mapping:
P4.1/PM_UCB1SIMO/
PM_UCB1SDA (7)
42
E7
H4
30
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: Slave in, master out – USCI_B1 SPI mode
Default mapping: I2C data – USCI_B1 I2C mode
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: Slave out, master in – USCI_B1 SPI mode
Default mapping: I2C clock – USCI_B1 I2C mode
P4.2/PM_UCB1SOMI/
PM_UCB1SCL (7)
43
D9
E5
31
digital I/O with reconfigurable port mapping secondary
Slave transmit enable – USCI_B1 SPI mode
Clock signal input – USCI_A1 SPI slave mode
Clock signal output – USCI_A1 SPI master mode
P4.3/PM_UCB1CLK/
PM_UCA1STE (7)
44
D8
G4
32
I/O
General-purpose
function
Default mapping:
Default mapping:
Default mapping:
P4.4/PM_UCA1TXD/
PM_UCA1SIMO (7)
45
D7
H3
33
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: Transmit data – USCI_A1 UART mode
Default mapping: Slave in, master out – USCI_A1 SPI mode
P4.5/PM_UCA1RXD/
PM_UCA1SOMI (7)
46
C9
F4
34
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: Receive data – USCI_A1 UART mode
Default mapping: Slave out, master in – USCI_A1 SPI mode
P4.6/PM_NONE (7)
47
C8
H2
35
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: no secondary function
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function (not available on all device types)
Default mapping: no secondary function (not available on all device
types)
P4.7/PM_NONE
(6)
(7)
(7)
48
C7
G3
N/A
digital I/O with reconfigurable port mapping secondary
Clock signal input – USCI_B1 SPI slave mode
Clock signal output – USCI_B1 SPI master mode
Slave transmit enable – USCI_A1 SPI mode
The voltage on DVIO is not supervised or monitored.
This pin function is supplied by DVIO. See Electrical Characteristics for input and output requirements.
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15
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 3. Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
RGC
ZQE
YFF
RGZ
P7.0/TB0.0 (7)
49
B8,
B9
H1
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR0 capture: CCI0A input, compare: Out0 output (not available on
all device types)
P7.1/TB0.1 (7)
50
A9
G2
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR1 capture: CCI1A input, compare: Out1 output (not available on
all device types)
P7.2/TB0.2 (7)
51
B7
F3
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR2 capture: CCI2A input, compare: Out2 output (not available on
all device types)
P7.3/TB0.3 (7)
52
A8
G1
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR3 capture: CCI3A input, compare: Out3 output (not available on
all device types)
P7.4/TB0.4 (7)
53
A7
F2
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR4 capture: CCI4A input, compare: Out4 output (not available on
all device types)
P7.5/TB0.5 (7)
54
A6
F1
N/A
I/O
General-purpose digital I/O (not available on all device types)
TB0 CCR5 capture: CCI5A input, compare: Out5 output (not available on
all device types)
BSLEN (8)
55
B6
E2
36
I
BSL enable with internal pulldown
RST/NMI (8)
56
A5
E3
37
I
Reset input active low (9) (10)
Non-maskable interrupt input (9)
P5.2/XT2IN
57
B5
E1
38
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT2 (11)
P5.3/XT2OUT
58
B4
D1
39
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT2
TEST/SBWTCK (12)
59
A4
E4
40
I
PJ.0/TDO (13)
60
C5
D2
41
I/O
General-purpose digital I/O
JTAG test data output port
PJ.1/TDI/TCLK (13)
61
C4
C1
42
I/O
General-purpose digital I/O
JTAG test data input or test clock input
PJ.2/TMS (13)
62
A3
D3
43
I/O
General-purpose digital I/O
JTAG test mode select
PJ.3/TCK (13)
63
B3
B1
44
I/O
General-purpose digital I/O
JTAG test clock
RSTDVCC/SBWTDIO (13)
64
A2
D4
45
I/O
Reset input active low (14)
Spy-Bi-Wire data input/output when Spy-Bi-Wire operation activated
(8)
(9)
(10)
(11)
(12)
(13)
(14)
16
Test mode pin – Selects four wire JTAG operation
Spy-Bi-Wire input clock when Spy-Bi-Wire operation activated
This pin function is supplied by DVIO. See Electrical Characteristics for input and output requirements.
This pin is configurable as reset or NMI and resides on the DVIO supply domain. When driven from external, the input swing levels from
DVSS to DVIO are required.
When this pin is configured as reset, the internal pullup resistor is enabled by default.
When in crystal bypass mode, XT2IN can be configured so that it can support an input digital waveform with swing levels from DVSS to
DVCC or DVSS to DVIO. In this case, it is required that the pin be configured properly for the intended input swing.
See Bootstrap Loader (BSL) and JTAG Operation for use with BSL and JTAG functions.
See JTAG Operation for use with JTAG function.
This non-configurable reset resides on the DVCC supply domain and has an internal pullup to DVCC. When driven from external, input
swing levels from DVSS to DVCC are required. This reset must be used for Spy-Bi-Wire communication and is not the same RST/NMI
reset as found on other devices in the MSP430 family. See Bootstrap Loader (BSL) and JTAG Operation for details regarding the use of
this pin.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 3. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
RGC
ZQE
YFF
RGZ
P6.0/CB0/A0
1
A1
C2
46
I/O
General-purpose digital I/O
Comparator_B input CB0
Analog input A0 – ADC (not available on all device types)
P6.1/CB1/A1
2
B2
A1
47
I/O
General-purpose digital I/O
Comparator_B input CB1
Analog input A1 – ADC (not available on all device types)
P6.2/CB2/A2
3
B1
B2
48
I/O
General-purpose digital I/O
Comparator_B input CB2
Analog input A2 – ADC (not available on all device types)
P6.3/CB3/A3
4
C2
C3
1
I/O
General-purpose digital I/O
Comparator_B input CB3
Analog input A3 – ADC (not available on all device types)
Reserved
N/A
(15)
N/A
N/A
Reserved
QFN Pad
Pad
N/A
N/A
Pad
QFN package pad. Connection to VSS recommended.
(15) C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
Copyright © 2012–2013, Texas Instruments Incorporated
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Development Tools Support
All MSP430™ microcontrollers are supported by a wide variety of software and hardware development tools.
Tools are available from TI and various third parties. See them all at www.ti.com/msp430tools.
Hardware Features
See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.
MSP430
Architecture
4-Wire
JTAG
2-Wire
JTAG
Breakpoints
(N)
Range
Breakpoints
Clock
Control
State
Sequencer
Trace
Buffer
LPMx.5
Debugging
Support
MSP430Xv2
Yes
Yes
8
Yes
Yes
Yes
Yes
No
Recommended Hardware Options
Target Socket Boards
The target socket boards allow easy programming and debugging of the device using JTAG. They also feature
header pin outs for prototyping. Target socket boards are orderable individually or as a kit with the JTAG
programmer and debugger included. The following table shows the compatible target boards and the supported
packages.
Package
Target Board and Programmer Bundle
Target Board Only
64-pin VQFN (RGC)
MSP-FET430U64C
MSP-TS430RGC64C
Experimenter Boards
Experimenter Boards and Evaluation kits are available for some MSP430 devices. These kits feature additional
hardware components and connectivity for full system evaluation and prototyping. See www.ti.com/msp430tools
for details.
Debugging and Programming Tools
Hardware programming and debugging tools are available from TI and from its third party suppliers. See the full
list of available tools at www.ti.com/msp430tools.
Production Programmers
The production programmers expedite loading firmware to devices by programming several devices
simultaneously.
Part Number
PC Port
MSP-GANG
Serial and USB
Features
Provider
Program up to eight devices at a time. Works with PC or standalone.
Texas Instruments
Recommended Software Options
Integrated Development Environments
Software development tools are available from TI or from third parties. Open source solutions are also available.
This device is supported by Code Composer Studio™ IDE (CCS).
MSP430Ware
MSP430Ware is a collection of code examples, data sheets, and other design resources for all MSP430 devices
delivered in a convenient package. In addition to providing a complete collection of existing MSP430 design
resources, MSP430Ware also includes a high-level API called MSP430 Driver Library. This library makes it easy
to program MSP430 hardware. MSP430Ware is available as a component of CCS or as a standalone package.
18
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SYS/BIOS
SYS/BIOS is an advanced real-time operating system for the MSP430 microcontrollers. It features preemptive
deterministic multi-tasking, hardware abstraction, memory management, and real-time analysis. SYS/BIOS is
available free of charge and is provided with full source code.
Command-Line Programmer
MSP430 Flasher is an open-source, shell-based interface for programming MSP430 microcontrollers through a
FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher can be used to
download binary files (.txt or .hex) files directly to the MSP430 microcontroller without the need for an IDE.
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you
can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
Device and Development Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430™ MCU devices and support tools. Each MSP430™ MCU commercial family member has one of two
prefixes: MSP or XMS (for example, MSP430F5259). Texas Instruments recommends two of three possible
prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product
development from engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified
production devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed Texas Instruments internal qualification
testing.
MSP – Fully-qualified development-support product
XMS devices and MSPX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of
the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.
Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PZP) and temperature range (for example, T). Figure 1 provides a legend for reading the complete
device name for any family member.
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Part Number Decoder
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Optional: Temperature Range
Optional: A = Revision
Processor Family
CC = Embedded RF Radio
MSP = Mixed Signal Processor
XMS = Experimental Silicon
430 MCU Platform
TI’s Low Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash/FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz w/ LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz w/ LCD
0 = Low Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = -40°C to 85°C
T = -40°C to 105°C
Packaging
www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel (7 inch)
R = Large Reel (11 inch)
No Markings = Tube or Tray
Optional: Additional Features *-EP = Enhanced Product (-40°C to 105°C)
*-HT = Extreme Temperature Parts (-55°C to 150°C)
Figure 1. Device Nomenclature
20
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Short-Form Description
CPU (Link to user's guide)
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
SR/CG1/R2
CG2/R3
The CPU is integrated with 16 registers that provide
reduced instruction execution time. The register-toregister operation execution time is one cycle of the
CPU clock.
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator, respectively. The remaining
registers are general-purpose registers.
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
Peripherals are connected to the CPU using data,
address, and control buses and can be handled with
all instructions.
General-Purpose Register
R10
General-Purpose Register
R11
The instruction set consists of the original 51
instructions with three formats and seven address
modes and additional instructions for the expanded
address range. Each instruction can operate on word
and byte data.
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Operating Modes
The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt event
can wake up the device from any of the low-power modes, service the request, and restore back to the lowpower mode on return from the interrupt program.
The following seven operating modes can be configured by software:
• Low-power mode 3 (LPM3)
• Active mode (AM)
– CPU is disabled
– All clocks are active
– MCLK, FLL loop control, and DCOCLK are
• Low-power mode 0 (LPM0)
disabled
– CPU is disabled
– DCO's dc generator is disabled
– ACLK and SMCLK remain active, MCLK is
– ACLK remains active
disabled
• Low-power mode 4 (LPM4)
– FLL loop control remains active
– CPU is disabled
• Low-power mode 1 (LPM1)
– ACLK is disabled
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are
– FLL loop control is disabled
disabled
– ACLK and SMCLK remain active, MCLK is
– DCO's dc generator is disabled
disabled
– Crystal oscillator is stopped
• Low-power mode 2 (LPM2)
– Complete data retention
– CPU is disabled
• Low-power mode 4.5 (LPM4.5)
– MCLK, FLL loop control, and DCOCLK are
– Internal regulator disabled
disabled
– No data retention
– DCO's dc-generator remains enabled
– Wakeup from RST/NMI, P1, and P2
– ACLK remains active
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 4. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
System Reset
Power-Up
External Reset
Watchdog Timeout, Password
Violation
Flash Memory Password Violation
PMM Password Violation
WDTIFG, KEYV (SYSRSTIV) (1) (2)
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG, BUSIFG
(SYSUNIV) (1) (2)
(Non)maskable
0FFFAh
61
COMP_B
Comparator B interrupt flags (CBIV) (1) (3)
Maskable
0FFF8h
60
Maskable
0FFF6h
59
TB0
TB0CCR0 CCIFG0
(3)
TB0
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TB0IV) (1) (3)
Maskable
0FFF4h
58
Watchdog Timer_A Interval Timer
Mode
WDTIFG
Maskable
0FFF2h
57
USCI_A0 Receive or Transmit
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1) (3)
Maskable
0FFF0h
56
USCI_B0 Receive or Transmit
UCB0RXIFG, UCB0TXIFG (UCB0IV) (1) (3)
Maskable
0FFEEh
55
ADC10_A
ADC10IFG0 (1) (3) (4)
Maskable
0FFECh
54
TA0
Maskable
0FFEAh
53
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
Maskable
0FFE8h
52
Reserved
Reserved
Maskable
0FFE6h
51
DMA
DMA0IFG, DMA1IFG, DMA2IFG (DMAIV) (1) (3)
Maskable
0FFE4h
50
TA1
TA1CCR0 CCIFG0 (3)
Maskable
0FFE2h
49
TA1
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
Maskable
0FFE0h
48
TA0
TA0CCR0 CCIFG0
I/O Port P1
(1)
(2)
(3)
(4)
22
(3)
P1IFG.0 to P1IFG.7 (P1IV)
(1) (3)
Maskable
0FFDEh
47
USCI_A1 Receive or Transmit
UCA1RXIFG, UCA1TXIFG (UCA1IV) (1) (3)
Maskable
0FFDCh
46
USCI_B1 Receive or Transmit
(1) (3)
Maskable
0FFDAh
45
TA2
UCB1RXIFG, UCB1TXIFG (UCB1IV)
TA2CCR0 CCIFG0 (3)
Maskable
0FFD8h
44
TA2
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,
TA2IFG (TA2IV) (1) (3)
Maskable
0FFD6h
43
I/O Port P2
P2IFG.0 to P2IFG.7 (P2IV) (1) (3)
Maskable
0FFD4h
42
RTC_A
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG (RTCIV) (1) (3)
Maskable
0FFD2h
41
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Only on devices with ADC, otherwise reserved
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Table 4. Interrupt Sources, Flags, and Vectors (continued)
(5)
INTERRUPT SOURCE
INTERRUPT FLAG
Reserved
Reserved (5)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
0FFD0h
40
⋮
⋮
0FF80h
0, lowest
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, it is recommended to reserve these locations.
Memory Organization
Table 5. Memory Organization (1)
Memory (flash)
Main: interrupt vector
MSP430F5227
MSP430F5222
MSP430F5217
MSP430F5212
MSP430F5229
MSP430F5224
MSP430F5219
MSP430F5214
64 KB
00FFFFh–00FF80h
128 KB
00FFFFh–00FF80h
N/A
32 KB
0243FFh–01C400h
N/A
32 KB
01C3FFh–014400h
Bank B
32 KB
0143FFh–00C400h
32 KB
0143FFh–00C400h
Bank A
32 KB
00C3FFh–004400h
32 KB
00C3FFh–004400h
Sector 3
2 KB
0043FFh–003C00h
2 KB
0043FFh–003C00h
Sector 2
2 KB
003BFFh–003400h
2 KB
003BFFh–003400h
Sector 1
2 KB
0033FFh–002C00h
2 KB
0033FFh–002C00h
Sector 0
2 KB
002BFFh–002400h
2 KB
002BFFh–002400h
A
128 B
001BFFh–001B80h
128 B
001BFFh–001B80h
B
128 B
001B7Fh–001B00h
128 B
001B7Fh–001B00h
C
128 B
001AFFh–001A80h
128 B
001AFFh–001A80h
D
128 B
001A7Fh–001A00h
128 B
001A7Fh–001A00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
Total Size
Bank D
Bank C
Main: code memory
RAM
TI factory memory (ROM)
Information memory (flash)
(1)
N/A = Not available
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Table 5. Memory Organization(1) (continued)
Bootstrap loader (BSL) memory (flash)
Peripherals
24
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MSP430F5227
MSP430F5222
MSP430F5217
MSP430F5212
MSP430F5229
MSP430F5224
MSP430F5219
MSP430F5214
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
4 KB
000FFFh–0h
4 KB
000FFFh–0h
Size
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using a UART serial interface. Access to the
device memory via the BSL is protected by an user-defined password. Because the F522x and F521x have split
I/O power domains, it is possible to interface with the BSL from either the DVCC or DVIO supply domains. This is
useful when the MSP430 is interfacing to a host on the DVIO supply domain. The BSL interface on the DVIO
supply domain (see Table 6) uses the USCI_A0 module configured as a UART. The BSL interface on the DVCC
supply domain (see Table 7) uses a timer-based UART.
NOTE
Devices from TI come factory programmed with the timer-based UART BSL only. If the
USCI-based BSL is preferred, it is also available, but it must be programmed by the user.
When using the DVIO supply domain for the BSL, entry to the BSL requires a specific sequence on the RST/NMI
and BSLEN pins. Table 6 shows the required pins and their functions. For further details on interfacing to
development tools and device programmers, see the MSP430™ Hardware Tools User's Guide (SLAU278). For a
complete description of the features of the BSL and its implementation, see the MSP430™ Programming Via the
Bootstrap Loader User's Guide (SLAU319). The BSL on the DVIO supply domain uses the USCI_A0 module
configured as a UART.
Table 6. DVIO BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RST/NMI
External reset
BSLEN
Enable BSL
P3.3
Data transmit
P3.4
Data receive
DVCC, AVCC
Device power supply
DVIO
I/O power supply
DVSS
Ground supply
NOTE
To invoke the BSL from the DVIO domain, the RST/NMI and BSLEN pins must be used
for the entry sequence (see DVIO BSL Entry). It is critical not to confuse the RST/NMI pin
with the RSTDVCC/SBWTDIO pin. In other MSP430 devices, SBWTDIO is shared with
the RST/NMI pin and RSTDVCC does not exist. Additional information can be found in
Designing with MSP430F522x and MSP430F521x Devices (SLAA558).
For applications in which it is desirable to have BSL communication based on the DVCC supply domain, entry to
the BSL requires a specific sequence on the RSTDVCC/SBWTDIO and TEST/SBWTCK pins. Table 7 shows the
required pins and their function.
Table 7. DVCC BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RSTDVCC/SBWTDIO
External reset
TEST/SBWTCK
Enable BSL
P1.1
Data transmit
P1.2
Data receive
DVCC, AVCC
Device power supply
DVIO
I/O power supply
DVSS
Ground supply
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NOTE
To invoke the BSL from the DVCC domain, the RSTDVCC/SBWTDIO and
TEST/SBWTCK pins must be used for the entry sequence. It is critical not to confuse the
RST/NMI pin with the RSTDVCC/SBWTDIO pin. In other MSP430 devices, SBWTDIO is
shared with the RST/NMI pin and RSTDVCC does not exist. Additional information can be
found in Designing with MSP430F522x and MSP430F521x Devices (SLAA558).
JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface which requires four signals for sending and receiving
data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the
JTAG signals. In addition to these signals, the RSTDVCC/SBWTDIO is required to interface with MSP430
development tools and device programmers. The JTAG pin requirements are shown in Table 8. For further
details on interfacing to development tools and device programmers, see the MSP430™ Hardware Tools User's
Guide (SLAU278). For a complete description of the features of the JTAG interface and its implementation, see
MSP430™ Programming Via the JTAG Interface (SLAU320). Additional information can be found in Designing
with MSP430F522x and MSP430F521x Devices (SLAA558).
Table 8. JTAG Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input, TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RSTDVCC/SBWTDIO
IN
External reset
DVCC, AVCC
Device power supply
DVIO
I/O power supply
DVSS
Ground supply
NOTE
Traditionally, on other MSP430 devices, the RST/NMI pin is used for SBWTDIO, so care
must be taken not to mistakenly use the incorrect pin. On the F522x and F521x series of
devices, it is required to use RSTDVCC for SBWTDIO as shown in Table 8. Additional
information can be found in Designing with MSP430F522x and MSP430F521x Devices
(SLAA558).
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Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface. SpyBi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire
interface pin requirements are shown in Table 9. For further details on interfacing to development tools and
device programmers, see the MSP430™ Hardware Tools User's Guide (SLAU278). For a complete description
of the features of the JTAG interface and its implementation, see MSP430 Programming Via the JTAG Interface
(SLAU320).Additional information can be found in Designing with MSP430F522x and MSP430F521x Devices
(SLAA558).
Table 9. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RSTDVCC/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
DVCC, AVCC
Device power supply
DVIO
I/O power supply
DVSS
Ground supply
NOTE
Traditionally, on other MSP430 devices, the RST/NMI pin is used for SBWTDIO, so care
must be taken not to mistakenly use the incorrect pin. On the F522x and F521x series of
devices, it is required to use RSTDVCC for SBWTDIO as shown in Table 9. Additional
information can be found in Designing with MSP430F522x and MSP430F521x Devices
(SLAA558).
Flash Memory (Link to user's guide)
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the
flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually. Segments A to D are also called information memory.
• Segment A can be locked separately.
RAM Memory (Link to user's guide)
The RAM memory is made up of n sectors. Each sector can be completely powered down to reduce leakage;
however, all data is lost during power down. Features of the RAM memory include:
• RAM memory has n sectors. The sizes of the sectors can be found in Memory Organization.
• Each sector 0 to n can be complete disabled; however, all data in a sector is lost when it is disabled.
• Each sector 0 to n automatically enters low-power retention mode when possible.
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Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x5xx and MSP430x6xx Family User's Guide
(SLAU208).
Digital I/O (Link to user's guide)
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Pullup or pulldown on all ports is programmable.
• Drive strength on all ports is programmable.
• Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and P2.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise or word-wise in pairs.
Port Mapping Controller (Link to user's guide)
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4.
Table 10. Port Mapping Mnemonics and Functions
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT0
-
COMP_B output
PM_TB0CLK
TB0 clock input
PM_ADC10CLK
-
PM_DMAE0
DMAE0 input
1
2
PM_SVMOUT
-
PM_TB0OUTH
TB0 high-impedance input TB0OUTH
4
PM_TB0CCR0A
TB0 CCR0 capture input CCI0A
TB0 CCR0 compare output Out0
5
PM_TB0CCR1A
TB0 CCR1 capture input CCI1A
TB0 CCR1 compare output Out1
6
PM_TB0CCR2A
TB0 CCR2 capture input CCI2A
TB0 CCR2 compare output Out2
7
PM_TB0CCR3A
TB0 CCR3 capture input CCI3A
TB0 CCR3 compare output Out3
8
PM_TB0CCR4A
TB0 CCR4 capture input CCI4A
TB0 CCR4 compare output Out4
9
PM_TB0CCR5A
TB0 CCR5 capture input CCI5A
TB0 CCR5 compare output Out5
10
PM_TB0CCR6A
TB0 CCR6 capture input CCI6A
TB0 CCR6 compare output Out6
3
11
12
13
14
15
16
17
SVM output
PM_UCA1RXD
USCI_A1 UART RXD (direction controlled by USCI - input)
PM_UCA1SOMI
USCI_A1 SPI slave out master in (direction controlled by USCI)
PM_UCA1TXD
USCI_A1 UART TXD (direction controlled by USCI - output)
PM_UCA1SIMO
USCI_A1 SPI slave in master out (direction controlled by USCI)
PM_UCA1CLK
USCI_A1 clock input/output (direction controlled by USCI)
PM_UCB1STE
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
PM_UCB1SOMI
USCI_B1 SPI slave out master in (direction controlled by USCI)
PM_UCB1SCL
USCI_B1 I2C clock (open drain and direction controlled by USCI)
PM_UCB1SIMO
USCI_B1 SPI slave in master out (direction controlled by USCI)
PM_UCB1SDA
USCI_B1 I2C data (open drain and direction controlled by USCI)
PM_UCB1CLK
USCI_B1 clock input/output (direction controlled by USCI)
PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
PM_CBOUT1
None
18
PM_MCLK
None
MCLK
19
PM_RTCCLK
None
RTCCLK output
20
28
ADC10CLK
COMP_B output
PM_UCA0RXD
USCI_A0 UART RXD (direction controlled by USCI - input)
PM_UCA0SOMI
USCI_A0 SPI slave out master in (direction controlled by USCI)
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Table 10. Port Mapping Mnemonics and Functions (continued)
VALUE
PxMAPy MNEMONIC
21
22
23
24
25
(1)
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
PM_UCA0TXD
USCI_A0 UART TXD (direction controlled by USCI - output)
PM_UCA0SIMO
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK
USCI_A0 clock input/output (direction controlled by USCI)
PM_UCB0STE
USCI_B0 SPI slave transmit enable (direction controlled by USCI)
PM_UCB0SOMI
USCI_B0 SPI slave out master in (direction controlled by USCI)
PM_UCB0SCL
USCI_B0 I2C clock (open drain and direction controlled by USCI)
PM_UCB0SIMO
USCI_B0 SPI slave in master out (direction controlled by USCI)
PM_UCB0SDA
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK
USCI_B0 clock input/output (direction controlled by USCI)
PM_UCA0STE
USCI_A0 SPI slave transmit enable (direction controlled by USCI)
26 - 30
Reserved
31 (0FFh) (1)
PM_ANALOG
None
DVSS
Disables the output driver and the input Schmitt trigger to prevent parasitic
cross currents when applying analog signals
The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored
resulting in a read out value of 31.
Table 11. Default Mapping
PIN
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
P4.0/P4MAP0
PM_UCB1STE/PM_UCA1CLK
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
USCI_A1 clock input/output (direction controlled by USCI)
P4.1/P4MAP1
PM_UCB1SIMO/PM_UCB1SDA
USCI_B1 SPI slave in master out (direction controlled by USCI)
USCI_B1 I2C data (open drain and direction controlled by USCI)
P4.2/P4MAP2
PM_UCB1SOMI/PM_UCB1SCL
USCI_B1 SPI slave out master in (direction controlled by USCI)
USCI_B1 I2C clock (open drain and direction controlled by USCI)
P4.3/P4MAP3
PM_UCB1CLK/PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
USCI_B1 clock input/output (direction controlled by USCI)
P4.4/P4MAP4
PM_UCA1TXD/PM_UCA1SIMO
USCI_A1 UART TXD (Direction controlled by USCI - output)
USCI_A1 SPI slave in master out (direction controlled by USCI)
P4.5/P4MAP5
PM_UCA1RXD/PM_UCA1SOMI
USCI_A1 UART RXD (Direction controlled by USCI - input)
USCI_A1 SPI slave out master in (direction controlled by USCI)
P4.6/P4MAP6
PM_NONE
None
DVSS
PM_NONE
None
DVSS
P4.7/P4MAP7
(1)
PxMAPy MNEMONIC
(1)
Not available on all devices
Oscillator and System Clock (Link to user's guide)
The clock system in the MSP430F522x and MSP430F521x family of devices is supported by the Unified Clock
System (UCS) module, which includes support for a 32-kHz watch crystal oscillator (XT1 LF mode) (XT1 HF
mode is not supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed lowfrequency oscillator (REFO), an integrated internal digitally controlled oscillator (DCO), and a high-frequency
crystal oscillator (XT2). The UCS module is designed to meet the requirements of both low system cost and low
power consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction
with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the selected FLL reference
frequency. The internal DCO provides a fast turn-on clock source and stabilizes in 3.5 µs (typical). The UCS
module provides the following clock signals:
• Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal digitally
controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
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Power Management Module (PMM) (Link to user's guide)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
(SVS) and supply voltage monitoring (SVM) circuitry, and brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The SVS
and SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
Hardware Multiplier (Link to user's guide)
The multiplication operation is supported by a dedicated peripheral module. The module performs operations with
32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations.
Real-Time Clock (RTC_A) (Link to user's guide)
The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated realtime clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers that
can be cascaded to form a 16-bit timer or counter. Both timers can be read and written by software. Calendar
mode integrates an internal calendar that compensates for months with less than 31 days and includes leap year
correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware.
Watchdog Timer (WDT_A) (Link to user's guide)
The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
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System Module (SYS) (Link to user's guide)
The SYS module handles many of the system functions within the device. These include power-on reset (POR)
and power-up clear (PUC) handling, NMI source selection and management, reset interrupt vector generators,
bootstrap loader (BSL) entry mechanisms, and configuration management (device descriptors). It also includes a
data exchange mechanism when using JTAG that is called a JTAG mailbox and that can be used in the
application.
Table 12. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
019Eh
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (BOR)
04h
PMMSWBOR (BOR)
06h
SYSRSTIV, System Reset
019Ch
SYSSNIV, System NMI
019Ah
SYSUNIV, User NMI
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Wakeup from LPMx.5
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
10h
SVMH_OVP (POR)
12h
PMMSWPOR (POR)
14h
WDT timeout (PUC)
16h
WDT password violation (PUC)
18h
KEYV flash password violation (PUC)
1Ah
Reserved
1Ch
Peripheral area fetch (PUC)
1Eh
PMM password violation (PUC)
20h
Reserved
22h to 3Eh
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
SVSMLDLYIFG
06h
SVSMHDLYIFG
08h
VMAIFG
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
SVMLVLRIFG
10h
SVMHVLRIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIFG
02h
OFIFG
04h
ACCVIFG
06h
Reserved
08h
Reserved
0Ah to 1Eh
PRIORITY
Highest
Lowest
Highest
Lowest
Highest
Lowest
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DMA Controller (Link to user's guide)
The DMA controller allows movement of data from one memory address to another without CPU intervention. For
example, the DMA controller can be used to move data from the ADC10_A conversion memory to RAM. Using
the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system
power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or
from a peripheral.
Table 13. DMA Trigger Assignments (1)
CHANNEL
TRIGGER
(1)
(2)
32
0
1
2
0
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
6
TA2CCR2 CCIFG
TA2CCR2 CCIFG
TA2CCR2 CCIFG
7
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
8
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
Reserved
Reserved
Reserved
15
Reserved
Reserved
Reserved
16
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
17
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
18
UCB0RXIFG
UCB0RXIFG
UCB0RXIFG
19
UCB0TXIFG
UCB0TXIFG
UCB0TXIFG
20
UCA1RXIFG
UCA1RXIFG
UCA1RXIFG
21
UCA1TXIFG
UCA1TXIFG
UCA1TXIFG
22
UCB1RXIFG
UCB1RXIFG
UCB1RXIFG
23
UCB1TXIFG
UCB1TXIFG
UCB1TXIFG
24
ADC10IFG0 (2)
ADC10IFG0 (2)
ADC10IFG0 (2)
25
Reserved
Reserved
Reserved
26
Reserved
Reserved
Reserved
27
Reserved
Reserved
Reserved
28
Reserved
Reserved
Reserved
29
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
31
DMAE0
DMAE0
DMAE0
If a reserved trigger source is selected, no trigger is generated.
Only on devices with ADC; reserved on devices without ADC
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Universal Serial Communication Interface (USCI) (Links to user's guide: UART Mode, SPI Mode,
I2C Mode)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 pin or 4 pin) or I2C.
The MSP430F522x and MSP430F521x series include two complete USCI modules (n = 0, 1).
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MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
TA0 (Link to user's guide)
TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple captures
or compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be
generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 14. TA0 Signal Connections
INPUT PIN NUMBER
RGC, ZQE,
YFF
18, H2, G2P1.0
RGZ
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
13-P1.0
TA0CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
18, H2, G2P1.0
13-P1.0
TA0CLK
TACLK
19, H3, G3P1.1
14-P1.1
TA0.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
TA0.1
CCI1A
CBOUT
(internal)
CCI1B
20, J3, H3P1.2
21, G4, F3P1.3
22, H4, E3P1.4
23, J4, H4P1.5
34
15-P1.2
16-P1.3
17-P1.4
18-P1.5
DVSS
GND
DVCC
VCC
TA0.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
TA0.3
CCI3A
DVSS
CCI3B
DVSS
GND
DVCC
VCC
TA0.4
CCI4A
DVSS
CCI4B
DVSS
GND
DVCC
VCC
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MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
CCR3
CCR4
TA0
TA1
TA2
TA3
TA4
OUTPUT PIN NUMBER
RGC, ZQE, YFF
RGZ
19, H3, G3-P1.1
14-P1.1
20, J3, H3-P1.2
15-P1.2
ADC10 (internal)
ADC10SHSx =
{1}
ADC10 (internal)
ADC10SHSx =
{1}
21, G4, F3-P1.3
16-P1.3
22, H4, E3-P1.4
17-P1.4
23, J4, H4-P1.5
18-P1.5
TA0.0
TA0.1
TA0.2
TA0.3
TA0.4
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
TA1 (Link to user's guide)
TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
captures or compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 15. TA1 Signal Connections
INPUT PIN NUMBER
RGC, ZQE,
YFF
24, G5, G4P1.6
RGZ
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
19-P1.6
TA1CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
24, G5, G4P1.6
19-P1.6
TA1CLK
TACLK
25, H5, F4P1.7
20-P1.7
TA1.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
TA1.1
CCI1A
CBOUT
(internal)
CCI1B
26, J5, H5P2.0
27, G6, E4P2.1
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
Copyright © 2012–2013, Texas Instruments Incorporated
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
RGC, ZQE,
YFF
RGZ
25, H5, F4P1.7
20-P1.7
TA1.0
26, J5, H5P2.0
CCR1
TA1
TA1.1
27, G6, E4P2.1
CCR2
TA2
TA1.2
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
TA2 (Link to user's guide)
TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
captures or compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 16. TA2 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TA2CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
28, J6, G5P2.2
TA2CLK
TACLK
29, H6, H6P2.3
TA2.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
RGC, ZQE,
YFF
28, J6, G5P2.2
30, J7, F5P2.4
31, J8, G6P2.5
36
RGZ
DVSS
GND
DVCC
VCC
TA2.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
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MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
RGC, ZQE,
YFF
RGZ
29, H6, H6P2.3
CCR0
TA0
TA2.0
30, J7, F5P2.4
CCR1
TA1
TA2.1
31, J8, G6P2.5
CCR2
TA2
TA2.2
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
TB0 (Link to user's guide)
TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It can support multiple
captures or compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 17. TB0 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TB0CLK
TBCLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
(1)
TB0CLK
TBCLK
49, B8(9), A8P7.0 (1)
(1)
TB0.0
CCI0A
49, B8(9), A8P7.0 (1)
(1)
TB0.0
CCI0B
RGC, ZQE,
YFF
(1)
(1)
(1)
50, A9, C6P7.1 (1)
(1)
DVSS
GND
DVCC
VCC
TB0.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
51, B7, B7P7.2 (1)
(1)
TB0.2
CCI2A
51, B7, B7P7.2 (1)
(1)
TB0.2
CCI2B
DVSS
GND
DVCC
VCC
52, A8, B6P7.3 (1)
(1)
TB0.3
CCI3A
52, A8, B6P7.3 (1)
(1)
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
53, A7, A7P7.4 (1)
(1)
TB0.4
CCI4A
53, A7, A7P7.4 (1)
(1)
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
54, A6, D5P7.5 (1)
(1)
TB0.5
CCI5A
54, A6, D5P7.5 (1)
(1)
TB0.5
CCI5B
DVSS
GND
(1)
(1)
RGZ
(1)
DVCC
VCC
TB0.6
CCI6A
ACLK
(internal)
CCI6B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
CCR3
CCR4
CCR5
CCR6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TB0.0
TB0.1
OUTPUT PIN NUMBER
RGC, ZQE, YFF
RGZ
49, B8(9), A8P7.0 (1)
(1)
ADC10 (internal)
ADC10SHSx = {2}
ADC10 (internal)
ADC10SHSx = {2}
50, A9, C6-P7.1 (1)
(1)
ADC10 (internal)
ADC10SHSx = {3}
ADC10 (internal)
ADC10SHSx = {3}
51, B7, B7-P7.2 (1)
(1)
52, A8, B6-P7.3 (1)
(1)
53, A7, A7-P7.4 (1)
(1)
54, A6, D5-P7.5 (1)
(1)
(1)
(1)
TB0.2
TB0.3
TB0.4
TB0.5
TB0.6
Timer functions available via the port mapping controller.
Copyright © 2012–2013, Texas Instruments Incorporated
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
Comparator_B (Link to user's guide)
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
ADC10_A (Link to user's guide)
The ADC10_A module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit SAR
core, sample select control, reference generator, and a conversion result buffer. A window comparator with lower
and upper limits allows CPU-independent result monitoring with three window comparator interrupt flags.
CRC16 (Link to user's guide)
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
REF Voltage Reference (Link to user's guide)
The reference module (REF) is responsible for generation of all critical reference voltages that can be used by
the various analog peripherals in the device.
Embedded Emulation Module (EEM) (S Version) (Link to user's guide)
The EEM supports real-time in-system debugging. The S version of the EEM has the following features:
• Three hardware triggers or breakpoints on memory access
• One hardware trigger or breakpoint on CPU register write access
• Up to four hardware triggers can be combined to form complex triggers or breakpoints
• One cycle counter
• Clock control on module level
38
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MSP430F5214 MSP430F5212
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Peripheral File Map
Table 18. Peripherals
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 19)
0100h
000h-01Fh
PMM (see Table 20)
0120h
000h-010h
Flash Control (see Table 21)
0140h
000h-00Fh
CRC16 (see Table 22)
0150h
000h-007h
RAM Control (see Table 23)
0158h
000h-001h
Watchdog (see Table 24)
015Ch
000h-001h
UCS (see Table 25)
0160h
000h-01Fh
SYS (see Table 26)
0180h
000h-01Fh
Shared Reference (see Table 27)
01B0h
000h-001h
Port Mapping Control (see Table 28)
01C0h
000h-002h
Port Mapping Port P4 (see Table 28)
01E0h
000h-007h
Port P1, P2 (see Table 29)
0200h
000h-01Fh
Port P3, P4 (see Table 30)
0220h
000h-00Bh
Port P5, P6 (see Table 31)
0240h
000h-00Bh
Port P7 (see Table 32)
0260h
000h-00Bh
Port PJ (see Table 33)
0320h
000h-01Fh
TA0 (see Table 34)
0340h
000h-02Eh
TA1 (see Table 35)
0380h
000h-02Eh
TB0 (see Table 36)
03C0h
000h-02Eh
TA2 (see Table 37)
0400h
000h-02Eh
Real-Time Clock (RTC_A) (see Table 38)
04A0h
000h-01Bh
32-Bit Hardware Multiplier (see Table 39)
04C0h
000h-02Fh
DMA General Control (see Table 40)
0500h
000h-00Fh
DMA Channel 0 (see Table 40)
0510h
000h-00Ah
DMA Channel 1 (see Table 40)
0520h
000h-00Ah
DMA Channel 2 (see Table 40)
0530h
000h-00Ah
USCI_A0 (see Table 41)
05C0h
000h-01Fh
USCI_B0 (see Table 42)
05E0h
000h-01Fh
USCI_A1 (see Table 43)
0600h
000h-01Fh
USCI_B1 (see Table 44)
0620h
000h-01Fh
ADC10_A (see Table 45)
0740h
000h-01Fh
Comparator_B (see Table 46)
08C0h
000h-00Fh
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39
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 19. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 20. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
PMM power mode 5 control
PM5CTL0
10h
Table 21. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 22. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 23. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 24. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 25. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
UCS control 8
UCSCTL8
10h
UCS control 9
UCSCTL9
12h
40
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MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 26. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 27. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 28. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping key/ID register
PMAPKEYID
00h
Port mapping control register
PMAPCTL
02h
Port P4.0 mapping register
P4MAP0
00h
Port P4.1 mapping register
P4MAP1
01h
Port P4.2 mapping register
P4MAP2
02h
Port P4.3 mapping register
P4MAP3
03h
Port P4.4 mapping register
P4MAP4
04h
Port P4.5 mapping register
P4MAP5
05h
Port P4.6 mapping register
P4MAP6
06h
Port P4.7 mapping register
P4MAP7
07h
Table 29. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup or pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup or pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
Port P2 selection
P2SEL
0Bh
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 29. Port P1, P2 Registers (Base Address: 0200h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 30. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup or pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup or pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
Table 31. Port P5, P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup or pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup or pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
Table 32. Port P7 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 pullup or pulldown enable
P7REN
06h
Port P7 drive strength
P7DS
08h
Port P7 selection
P7SEL
0Ah
42
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MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 33. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup or pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Table 34. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Table 35. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Table 36. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
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Table 36. TB0 Registers (Base Address: 03C0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 37. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
Capture/compare control 2
TA2CCTL2
06h
TA2 counter register
TA2R
10h
Capture/compare register 0
TA2CCR0
12h
Capture/compare register 1
TA2CCR1
14h
Capture/compare register 2
TA2CCR2
16h
TA2 expansion register 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
Table 38. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
RTC control 1
RTCCTL1
01h
RTC control 2
RTCCTL2
02h
RTC control 3
RTCCTL3
03h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds/counter register 1
RTCSEC/RTCNT1
10h
RTC minutes/counter register 2
RTCMIN/RTCNT2
11h
RTC hours/counter register 3
RTCHOUR/RTCNT3
12h
RTC day of week/counter register 4
RTCDOW/RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
44
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Table 39. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
Table 40. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
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Table 40. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Eh
Table 41. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA0CTL1
00h
USCI control 0
UCA0CTL0
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
Table 42. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB0CTL1
00h
USCI synchronous control 0
UCB0CTL0
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
Table 43. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA1CTL1
00h
USCI control 0
UCA1CTL0
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
46
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Table 43. USCI_A1 Registers (Base Address: 0600h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
Table 44. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB1CTL1
00h
USCI synchronous control 0
UCB1CTL0
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
Table 45. ADC10_A Registers (Base Address: 0740h)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC10_A Control register 0
ADC10CTL0
00h
ADC10_A Control register 1
ADC10CTL1
02h
ADC10_A Control register 2
ADC10CTL2
04h
ADC10_A Window Comparator Low Threshold
ADC10LO
06h
ADC10_A Window Comparator High Threshold
ADC10HI
08h
ADC10_A Memory Control Register 0
ADC10MCTL0
0Ah
ADC10_A Conversion Memory Register
ADC10MEM0
12h
ADC10_A Interrupt Enable
ADC10IE
1Ah
ADC10_A Interrupt Flags
ADC10IGH
1Ch
ADC10_A Interrupt Vector Word
ADC10IV
1Eh
Table 46. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
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Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
-0.3 V to 4.1 V
Voltage applied at VIO to VSS
-0.3 V to 2.2 V
Voltage applied to any pin (excluding VCORE and VIO pins) (2)
-0.3 V to (VCC + 0.3 V)
Voltage applied to VIO pins
-0.3 V to (VIO + 0.2 V)
Diode current at any device pin
Storage temperature range, Tstg
(1)
(2)
(3)
±2 mA
(3)
-55°C to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Supply voltage during program execution and flash
programming(AVCC = DVCC) (1) (2) (3)
VCC
VIO
Supply voltage applied to DVIO referenced to VSS (2)
VSS
Supply voltage (AVSS = DVSS)
TA
Operating free-air temperature
TJ
Operating junction temperature
CVCORE
Recommended capacitor at VCORE
CDVCC/
CVCORE
Capacitor ratio of DVCC to VCORE
fSYSTEM
(1)
(2)
(3)
(4)
(5)
48
NOM
MAX
1.8
3.6
V
PMMCOREVx = 0, 1
2.0
3.6
V
PMMCOREVx = 0, 1, 2
2.2
3.6
V
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
V
1.62
1.98
V
0
V
I version
-40
85
°C
I version
-40
85
°C
(4)
Processor frequency (maximum MCLK frequency) (5)
(see Figure 4)
UNIT
PMMCOREVx = 0
470
nF
10
PMMCOREVx = 0 (default
condition),
1.8 V ≤ VCC ≤ 3.6 V
0
8
PMMCOREVx = 1,
2.0 V ≤ VCC ≤ 3.6 V
0
12
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
0
20
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
25
MHz
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
During VCC and VIO power up, it is required that VIO ≥ VCC during the ramp up phase of VIO. During VCC and VIO power down, it is
required that VIO ≥ VCC during the ramp down phase of VIO (see Figure 2).
The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the PMM, SVS High Side threshold
parameters for the exact values and further details.
A capacitor tolerance of ±20% or better is required.
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
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VCC
VIO
VIO,min
VSS
t
VCC ≤ VIO
while VIO < VIO,min
VIO ≤ VCC
VCC ≤ VIO
while VIO < VIO,min
NOTE: The device supports continuous operation with VCC = VSS while VIO is fully within its specification. During this time, the
general-purpose I/Os that reside on the VIO supply domain are configured as inputs and pulled down to VSS through
their internal pulldown resistors. RST/NMI is high impedance. BSLEN is configured as an input and is pulled down to
VSS through its internal pulldown resistor. When VCC reaches above the BOR threshold, the general-purpose I/Os
become high-impedance inputs (no pullup or pulldown enabled), RST/NMI becomes an input pulled up to VIO through
its internal pullup resistor, and BSLEN remains pulled down to VSS through its internal pulldown resistor.
Figure 2. VCC and VIO Power Sequencing
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VCC
V(SVSH_+), min
tWAKE_UP_RESET
tWAKE_UP_RESET
DVCC
tWAKE_UP_RESET
VCC
VIT+
RSTDVCC
VCC ≥ VRSTDVCC
VRSTDVCC = VCC
VIO
tWAKE_UP_RESET
DVIO
tWAKE_UP_RESET
VIO
VIT+
RST
VIO ≥ VRST
VRST = VIO
t
NOTE: The device remains in reset based on the conditions of the RSTDVCC and RST pins and the voltage present on
DVCC voltage supply. If RSTDVCC or RST is held at a logic low or if DVCC is below the SVSH_+ minimum
threshold, the device remains in its reset condition; that is, these conditions form a logical OR with respect to device
reset.
Figure 3. Reset Timing
50
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25
System Frequency - MHz
3
20
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 4. Maximum System Frequency
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Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
EXECUTION
MEMORY
VCC
PMMCOREVx
1 MHz
TYP
IAM,
IAM,
(1)
(2)
(3)
52
Flash
RAM
Flash
RAM
3.0 V
3.0 V
MAX
0.47
8 MHz
TYP
2.32
MAX
12 MHz
TYP
20 MHz
MAX
TYP
0
0.36
1
0.40
2.65
4.0
2
0.44
2.90
4.3
7.1
3
0.46
4.6
7.6
0
0.20
1
0.22
1.35
2.0
2
0.24
1.50
2.2
3.7
3
0.26
1.60
2.4
3.9
1.20
TYP
UNIT
MAX
2.60
3.10
0.29
25 MHz
MAX
4.4
mA
7.7
10.1
11.0
1.30
2.2
mA
4.2
5.3
6.2
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing.
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
PARAMETER
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
85°C
0
73
77
91
80
85
97
3.0 V
3
79
83
99
88
95
107
2.2 V
0
6.5
6.5
12
10
11
17
3.0 V
3
7.0
7.0
13
11
12
18
0
1.60
1.90
2,8
6.0
1
1.65
2.00
3.0
6.3
2
1.75
2.15
3.2
6.6
0
1.8
2.1
3.0
6.2
1
1.9
2.3
3.2
6.5
2
2.0
2.4
3.3
6.8
3
2.0
2.5
3.9
3.4
6.8
10.9
0
1.1
1.4
2.7
2.0
6.1
9.7
1
1.1
1.4
2.2
6.4
2
1.2
1.5
2.3
6.8
3
1.3
1.6
3.0
2.3
6.8
10.9
0
0.9
1.1
1.5
2.0
5.1
8.8
1
1.1
1.2
2.1
5.3
2
1.2
1.2
2.2
5.5
3.0 V
ILPM3,VLO
60 °C
2.2 V
Low-power mode 3, crystal
mode (6) (4)
Low-power mode 3,
VLO mode (7) (4)
25 °C
PMMCOREVx
2.2 V
ILPM3,XT1LF
-40 °C
VCC
3.0 V
TYP
MAX
TYP
MAX
2.9
TYP
MAX
TYP
MAX
9.4
Low-power mode 4 (8) (4)
3.0 V
1.3
1.3
1.6
2.2
5.5
9.8
ILPM4.5
Low-power mode 4.5 (9)
3.0 V
0.15
0.18
0.35
0.26
0.5
1.0
IDVIO_START
Current supplied from
DVIO while DVCC = AVCC
= 0 V,
DVIO = 1.62 V to 1.98 V,
All DVIO I/O floating
including BSLEN and
RST/NMI
0V
1.8
1.8
1.8
1.8
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
µA
µA
µA
µA
ILPM4
3
UNIT
µA
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Current for the watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
Current for brownout and high-side supervisor (SVSH) normal mode included. Low-side supervisor (SVSL) and low-side monitor (SVML)
disabled. High-side monitor (SVMH) disabled. RAM retention enabled.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1
MHz operation, DCO bias generator enabled.)
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
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Schmitt-Trigger Inputs – General-Purpose I/O DVCC Domain (1)
(P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RSTDVCC)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup or pulldown resistor
For pullup: VIN = VSS,
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
VCC
MIN
1.8 V
0.80
TYP
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.8
3V
0.4
1.0
20
35
MAX
50
5
UNIT
V
V
V
kΩ
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Schmitt-Trigger Inputs – General-Purpose I/O DVIO Domain
(P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5, RST/NMI, BSLEN)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VCC = 3.0 V
VIT–
Negative-going input threshold voltage
VCC = 3.0 V
Vhys
Input voltage hysteresis (VIT+ – VIT–)
VCC = 3.0 V
RPull
Pullup or pulldown resistor
For pullup: VIN = VSS,
For pulldown: VIN = VIO
CI
Input capacitance
VIN = VSS or VIO
VIO
MIN
TYP
1.62 V
0.8
1.25
1.98 V
1.1
1.40
1.62 V
0.3
0.7
1.98 V
0.5
1.0
1.62 V to 1.98 V
0.3
0.8
V
50
kΩ
20
MAX
35
5
UNIT
V
V
pF
Inputs – Interrupts DVCC Domain Port P1
(P1.0 to P1.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
t(int)
(1)
External interrupt timing (1)
TEST CONDITIONS
VCC
External trigger pulse duration to set interrupt flag
1.8 V, 3 V
MIN
MAX
20
UNIT
ns
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
Inputs – Interrupts DVIO Domain Ports P1 and P2
(P1.4 to P1.7, P2.0 to P2.7)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
t(int)
(1)
(2)
54
External interrupt timing (2)
VIO (1)
TEST CONDITIONS
External trigger pulse duration to set interrupt flag,
VCC = 1.8 V or 3.0 V
1.62 V to 1.98 V
MIN
MAX
20
UNIT
ns
In all test conditions, VIO ≤ VCC.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Leakage Current – General-Purpose I/O DVCC Domain
(P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.y)
(1)
(2)
High-impedance leakage current
TEST CONDITIONS
(1) (2)
VCC
MIN
MAX
1.8 V, 3 V
-50
50
UNIT
nA
The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
Leakage Current – General-Purpose I/O DVIO Domain
(P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.y)
(1)
(2)
(3)
High-impedance leakage current
TEST CONDITIONS
VIO
(2) (3)
(1)
MIN
MAX
-50
50
1.62 V to 1.98 V
UNIT
nA
In all test conditions, VIO ≤ VCC.
The leakage current is measured with VSS or VIO applied to the corresponding pins, unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
Outputs – General-Purpose I/O DVCC Domain (Full Drive Strength)
(P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA (1)
VOH
High-level output voltage
I(OHmax) = –10 mA (2)
VCC
1.8 V
I(OHmax) = –5 mA (1)
3V
I(OHmax) = –15 mA (2)
I(OLmax) = 3 mA
VOL
Low-level output voltage
(1)
1.8 V
I(OLmax) = 10 mA (2)
I(OLmax) = 5 mA (1)
3V
I(OLmax) = 15 mA (2)
(1)
(2)
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
UNIT
V
V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
Outputs – General-Purpose I/O DVCC Domain (Reduced Drive Strength)
(P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (2)
VOH
High-level output voltage
I(OHmax) = –3 mA (3)
I(OHmax) = –2 mA
I(OLmax) = 1 mA (2)
Low-level output voltage
I(OLmax) = 3 mA (3)
I(OLmax) = 2 mA (2)
I(OLmax) = 6 mA (3)
(1)
(2)
(3)
1.8 V
(2)
I(OHmax) = –6 mA (3)
VOL
VCC
3.0 V
1.8 V
3.0 V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
UNIT
V
V
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
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Outputs – General-Purpose I/O DVIO Domain (Full Drive Strength)
(P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
(1)
(2)
TEST CONDITIONS
I(OHmax) = –3 mA
VIO (1)
(2)
I(OHmax) = –6 mA (2)
I(OLmax) = 3 mA (2)
I(OLmax) = 6 mA (2)
1.62 V to 1.98 V
1.62 V to 1.98 V
MIN
MAX
VIO – 0.25
VIO
VIO – 0.50
VIO
VSS VSS + 0.25
VSS VSS + 0.50
UNIT
V
V
In all test conditions, VIO ≤ VCC.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
Outputs – General-Purpose I/O DVIO Domain (Reduced Drive Strength)
(P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
(1)
(2)
(3)
56
TEST CONDITIONS
I(OHmax) = –1 mA
VIO (2)
(3)
I(OHmax) = –2 mA (3)
I(OLmax) = 1 mA (3)
I(OLmax) = 2 mA (3)
1.62 V to 1.98 V
1.62 V to 1.98 V
MIN
MAX
VIO – 0.25
VIO
VIO – 0.50
VIO
VSS VSS + 0.25
VSS VSS + 0.50
UNIT
V
V
Selecting reduced drive strength may reduce EMI.
In all test conditions, VIO ≤ VCC.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Output Frequency – General-Purpose I/O DVCC Domain
(P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Port output frequency
(with load)
fPx.y
fPort_CLK
(1)
(2)
Clock output frequency
TEST CONDITIONS
(1) (2)
ACLK, SMCLK, or MCLK,
CL = 20 pF (2)
MIN
MAX
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 3
25
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 3
25
UNIT
MHz
MHz
A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Output Frequency – General-Purpose I/O DVIO Domain
(P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Port output frequency
(with load)
fPx.y
fPort_CLK
(1)
(2)
(3)
Clock output frequency
TEST CONDITIONS
(1) (2)
ACLK, SMCLK, or MCLK,
CL = 20 pF (2)
MIN
VIO = 1.62 V to 1.98 V
PMMCOREVx = 0
(3)
VIO = 1.62 V to 1.98 V
PMMCOREVx = 3
(3)
,
,
VIO = 1.62 V to 1.98 V (3),
PMMCOREVx = 0
VIO = 1.62 V to 1.98 V
PMMCOREVx = 3
MAX
16
MHz
25
16
MHz
(3)
,
UNIT
25
A resistive divider with 2 × R1 between VIO and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VIO at the specified toggle frequency.
In all test conditions, VIO ≤ VCC.
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Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
8.0
VCC = 3.0 V
Px.y
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
25.0
TA = 25°C
20.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
7.0
TA = 85°C
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0.0
3.5
2.0
0.0
VCC = 3.0 V
Px.y
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
1.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0.0
-5.0
-10.0
TA = 85°C
TA = 25°C
VCC = 1.8 V
Px.y
-1.0
-2.0
-3.0
-4.0
TA = 85°C
-5.0
-6.0
TA = 25°C
-7.0
-8.0
-25.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOH – High-Level Output Voltage – V
Figure 7.
58
1.0
Figure 6.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
-20.0
0.5
VOL – Low-Level Output Voltage – V
VOL – Low-Level Output Voltage – V
Figure 5.
-15.0
TA = 25°C
VCC = 1.8 V
Px.y
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3.5
0.0
0.5
1.0
1.5
VOH – High-Level Output Voltage – V
2.0
Figure 8.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TA = 25°C
VCC = 3.0 V
Px.y
55.0
50.0
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
60.0
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TA = 85°C
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
24
VCC = 1.8 V
Px.y
TA = 85°C
16
12
8
4
0
0.0
3.5
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
2.0
0
VCC = 3.0 V
Px.y
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
TA = 85°C
-55.0
TA = 25°C
0.0
1.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0.0
-60.0
1.0
Figure 10.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
-50.0
0.5
VOL – Low-Level Output Voltage – V
VOL – Low-Level Output Voltage – V
Figure 9.
-5.0
TA = 25°C
20
0.5
VCC = 1.8 V
Px.y
-4
-8
-12
TA = 85°C
-16
TA = 25°C
-20
1.0
1.5
2.0
2.5
3.0
VOH – High-Level Output Voltage – V
Figure 11.
Copyright © 2012–2013, Texas Instruments Incorporated
3.5
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 12.
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Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
ΔIDVCC.LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
0.170
32768
XTS = 0, XT1BYPASS = 0
fXT1,LF,SW
XT1 oscillator logic-level squarewave input frequency, LF mode
XTS = 0, XT1BYPASS = 1 (2) (3)
XT1BYPASSLV = 0 or 1
OALF
3.0 V
0.290
XT1 oscillator crystal frequency,
LF mode
10
CL,eff
fFault,LF
tSTART,LF
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
60
32.768
XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
210
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
UNIT
300
µA
Hz
50
kHz
kΩ
XTS = 0, XCAPx = 0 (6)
Integrated effective load
capacitance, LF mode (5)
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
fXT1,LF0
Oscillation allowance for
LF crystals (4)
TYP
2
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
pF
Duty cycle, LF mode
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
30
70
%
Oscillator fault frequency,
LF mode (7)
XTS = 0, XT1BYPASS = 1 (8),
XT1BYPASSLV = 0 or 1
10
10000
Hz
Startup time, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C, CL,eff = 12 pF
1000
3.0 V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and techniques that avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-Trigger Inputs section of this data sheet. When in crystal bypass mode, XIN can be configured so that it can support an
input digital waveform with swing levels from DVSS to DVCC (XT1BYPASSLV = 0) or DVSS to DVIO (XT1BYPASSLV = 1). In this case,
it is required that the pin be configured properly for the intended input swing.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but each application should be evaluated based on the actual crystal selected:
(a) For XT1DRIVEx = 0, CL,eff ≤ 6 pF
(b) For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF
(c) For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF
(d) For XT1DRIVEx = 3, CL,eff ≥ 6 pF
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
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Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C
IDVCC.XT2
XT2 oscillator crystal current
consumption
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C
TYP
MAX
UNIT
200
260
3.0 V
µA
325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal frequency,
mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal frequency,
mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal frequency,
mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal frequency,
mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level squarewave input frequency, bypass
mode
XT2BYPASS = 1 (4) (3)
XT2BYPASSLV = 0 or 1
0.7
32
MHz
OAHF
tSTART,HF
CL,eff
Oscillation allowance for
HF crystals (5)
Startup time
Integrated effective load
capacitance, HF mode (6)
Duty cycle
(1)
(2)
(3)
(4)
(5)
(6)
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
0.5
fOSC = 20 MHz,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF
Ω
3.0 V
ms
0.3
1
(1)
Measured at ACLK, fXT2,HF2 = 20 MHz
40
50
pF
60
%
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and techniques that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this data sheet. When in crystal bypass mode, XT2IN can be configured so that it can support an
input digital waveform with swing levels from DVSS to DVCC (XT2BYPASSLV = 0) or DVSS to DVIO (XT2BYPASSLV = 1). In this case,
it is required that the pin be configured properly for the intended input swing.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
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Crystal Oscillator, XT2 (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)(2)
PARAMETER
Oscillator fault frequency (7)
fFault,HF
(7)
(8)
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
300
kHz
(8)
XT2BYPASS = 1 ,
XT2BYPASSLV = 0 or 1
30
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals. In general, an effective load capacitance of up to
18 pF can be supported.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
6
9.4
14
UNIT
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.5
%/°C
Measured at ACLK (2)
1.8 V to 3.6 V
4
%/V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
40
50
60
TYP
MAX
kHz
%
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IREFO
fREFO
TEST CONDITIONS
VCC
MIN
UNIT
REFO oscillator current consumption TA = 25°C
1.8 V to 3.6 V
3
µA
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
32768
Hz
Full temperature range
1.8 V to 3.6 V
-3.5
3.5
3V
-1.5
1.5
REFO absolute tolerance calibrated
TA = 25°C
%
%
dfREFO/dT
REFO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.01
%/°C
dfREFO/dVCC
REFO frequency supply voltage drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
%/V
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO startup time
40%/60% duty cycle
1.8 V to 3.6 V
tSTART
(1)
(2)
62
40
50
60
25
%
µs
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
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DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31) (1)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0) (1)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31) (1)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
(1)
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31) (1)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0) (1)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
(1)
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0) (1)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31) (1)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
(1)
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31) (1)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0) (1)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31) (1)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
(1)
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31) (1)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
DCO frequency temperature
drift (2)
dfDCO/dT
dfDCO/dVCC
(1)
(2)
(3)
DCO frequency voltage drift
(3)
40
50
60
%
fDCO = 1 MHz
0.1
%/°C
fDCO = 1 MHz
1.9
%/V
When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, fDCO, should be set to reside within the
range of fDCO(n, 0),MAX ≤ fDCO ≤ fDCO(n, 31),MIN, where fDCO(n, 0),MAX represents the maximum frequency specified for the DCO frequency,
range n, tap 0 (DCOx = 0) and fDCO(n,31),MIN represents the minimum frequency specified for the DCO frequency, range n, tap 31 (DCOx
= 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual fDCO
frequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the
selected range is at its minimum or maximum tap setting.
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 13. Typical DCO frequency
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PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VDVCC_BOR_IT–
BORH on voltage, DVCC falling level
| dDVCC/dt | < 3 V/s
VDVCC_BOR_IT+
BORH off voltage, DVCC rising level
| dDVCC/dt | < 3 V/s
VDVCC_BOR_hys
BORH hysteresis
tRESET
Pulse duration required at RST/NMI pin to accept a reset
MIN
TYP MAX UNIT
0.80
1.30
1.45
V
1.50
V
250
mV
60
2
µs
PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active mode,
PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE2(AM)
Core voltage, active mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.80
V
VCORE1(AM)
Core voltage, active mode,
PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.60
V
VCORE0(AM)
Core voltage, active mode,
PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.40
V
VCORE3(LPM)
Core voltage, low-current mode,
PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.94
V
VCORE2(LPM)
Core voltage, low-current mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.84
V
VCORE1(LPM)
Core voltage, low-current mode,
PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.64
V
VCORE0(LPM)
Core voltage, low-current mode,
PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.44
V
64
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PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
V(SVSH_IT–)
V(SVSH_IT+)
tpd(SVSH)
t(SVSH)
dVDVCC/dt
(1)
SVS current consumption
SVSH on voltage level (1)
SVSH off voltage level (1)
SVSH propagation delay
SVSH on or off delay time
TYP
MAX
0
UNIT
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
200
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
1.5
µA
SVSHE = 1, SVSHRVL = 0
1.57
1.68
1.78
SVSHE = 1, SVSHRVL = 1
1.79
1.88
1.98
SVSHE = 1, SVSHRVL = 2
1.98
2.08
2.21
SVSHE = 1, SVSHRVL = 3
2.10
2.18
2.31
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVSHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVSHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVSHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVSHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVSHE = 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
20
V
µs
SVSHE = 0 → 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
12.5
SVSHE = 0 → 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
100
DVCC rise time
V
µs
0
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
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PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
SVMH current consumption
V(SVMH)
SVMH on or off voltage level
(1)
0
t(SVMH)
(1)
SVMH propagation delay
SVMH on or off delay time
UNIT
nA
SVMHE= 1, DVCC = 3.6 V, SVMHFP = 0
200
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
1.5
µA
SVMHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVMHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVMHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVMHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVMHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVMHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVMHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVMHE = 1, SVMHOVPE = 1
tpd(SVMH)
MAX
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
2.5
SVMHE = 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
20
µs
SVMHE = 0 → 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
12.5
SVMHE = 0 → 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
100
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSLE = 0, PMMCOREV = 2
I(SVSL)
SVSL current consumption
tpd(SVSL)
t(SVSL)
66
SVSL propagation delay
SVSL on or off delay time
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TYP
MAX
0
UNIT
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
1.5
µA
SVSLE = 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
20
µs
SVSLE = 0 → 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
12.5
SVSLE = 0 → 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
100
µs
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMLE = 0, PMMCOREV = 2
I(SVML)
tpd(SVML)
t(SVML)
SVML current consumption
SVML propagation delay
SVML on or off delay time
TYP
MAX
UNIT
0
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 0
200
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 1
1.5
µA
SVMLE = 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
20
µs
SVMLE = 0 → 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
12.5
SVMLE = 0 → 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
100
µs
Wake-Up From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
MAX
fMCLK ≥ 4.0 MHz
MIN
3.5
7.5
UNIT
1.0 MHz < fMCLK <
4.0 MHz
4.5
9
150
175
µs
tWAKE-UP-FAST
Wake-up time from LPM2,
LPM3, or LPM4 to active
mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
tWAKE-UP-SLOW
Wake-up time from LPM2,
LPM3 or LPM4 to active
mode (2)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 0
tWAKE-UP-LPM5
Wake-up time from LPM4.5
to active mode (3)
2
3
ms
tWAKE-UP-RESET
Wake-up time from RST or
BOR event to active mode (3)
2
3
ms
(1)
(2)
(3)
µs
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
and MSP430x6xx Family User's Guide (SLAU208).
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
This value represents the time from the wakeup event to the reset vector execution.
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Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VIO
MIN
TYP
MAX UNIT
1.62 V to 1.8 V
25
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK
Duty cycle = 50% ± 10%
1.8 V
fTA
3.0 V
1.62 V to 1.98 V
25
Timer_A capture timing (1)
All capture inputs,
Minimum pulse duration
required for capture
1.8 V
1.62 V to 1.8 V
20
tTA,cap
3.0 V
1.62 V to 1.98 V
20
(1)
MHz
ns
The external signal sets the interrupt flag every time the minimum parameters are met. It may be set even with trigger signals shorter
than tTA,cap.
Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTB
Timer_B input clock frequency
Internal: SMCLK, ACLK
External: TBCLK
Duty cycle = 50% ± 10%
tTB,cap
Timer_B capture timing (1)
All capture inputs,
Minimum pulse duration
required for capture
(1)
68
VCC
VIO
1.8 V
1.62 V to 1.8 V
MIN
TYP
MAX UNIT
25
3.0 V
1.62 V to 1.98 V
25
1.8 V
1.62 V to 1.8 V
20
3.0 V
1.62 V to 1.98 V
20
MHz
ns
The external signal sets the interrupt flag every time the minimum parameters are met. It may be set even with trigger signals shorter
than tTB,cap.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
USCI (UART Mode), Recommended Operating Conditions
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
1
MHz
MAX
UNIT
USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
UART receive deglitch time (1)
tτ
(1)
TEST CONDITIONS
VCC
VIO
1.8 V
1.62 V to 1.80 V
MIN
50
TYP
600
3.0 V
1.62 V to 1.98 V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized, their duration should exceed the maximum specification of the deglitch time.
USCI (SPI Master Mode), Recommended Operating Conditions
PARAMETER
fUSCI
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK or ACLK,
Duty cycle = 50% ± 10%
USCI input clock frequency
MAX
UNIT
fSYSTEM
MHz
MAX
UNIT
fSYSTEM
MHz
USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 14 and Figure 15)
PARAMETER
fUSCI
USCI input clock frequency
TEST CONDITIONS
55
3.0 V
1.62 V to 1.98 V
55
2.4 V
1.62 V to 1.98 V
35
3.0 V
1.62 V to 1.98 V
35
1.8 V
1.62 V to 1.80 V
0
3.0 V
1.62 V to 1.98 V
0
2.4 V
1.62 V to 1.98 V
0
3.0 V
1.62 V to 1.98 V
0
UCLK edge to SIMO valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
1.62 V to 1.80 V
20
3.0 V
1.62 V to 1.98 V
20
UCLK edge to SIMO valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
1.62 V to 1.98 V
16
3.0 V
1.62 V to 1.98 V
16
CL = 20 pF,
PMMCOREV = 0
1.8 V
1.62 V to 1.80 V
-10
3.0 V
1.62 V to 1.98 V
-10
CL = 20 pF,
PMMCOREV = 3
2.4 V
1.62 V to 1.98 V
-10
3.0 V
1.62 V to 1.98 V
-10
PMMCOREV = 0
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
tHD,MO
(1)
(2)
(3)
SIMO output data hold
time (3)
TYP
1.62 V to 1.80 V
SOMI input data setup time
SIMO output data valid
time (2)
MIN
1.8 V
PMMCOREV = 3
tHD,MI
VIO
SMCLK or ACLK,
Duty cycle = 50% ± 10%
PMMCOREV = 0
tSU,MI
VCC
ns
ns
ns
ns
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 14 and Figure 15.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in
Figure 14 and Figure 15.
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1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 14. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,MI
tSU,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 15. SPI Master Mode, CKPH = 1
70
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 16 and Figure 17)
PARAMETER
TEST CONDITIONS
VCC
VIO
1.8 V
1.62 V to 1.80 V
12
3.0 V
1.62 V to 1.98 V
12
2.4 V
1.62 V to 1.98 V
10
3.0 V
1.62 V to 1.98 V
10
1.8 V
1.62 V to 1.80 V
6
3.0 V
1.62 V to 1.98 V
6
2.4 V
1.62 V to 1.98 V
6
3.0 V
1.62 V to 1.98 V
6
1.8 V
1.62 V to 1.80 V
65
3.0 V
1.62 V to 1.98 V
65
2.4 V
1.62 V to 1.98 V
45
3.0 V
1.62 V to 1.98 V
45
1.8 V
1.62 V to 1.80 V
35
3.0 V
1.62 V to 1.98 V
35
2.4 V
1.62 V to 1.98 V
25
3.0 V
1.62 V to 1.98 V
25
1.8 V
1.62 V to 1.80 V
5
3.0 V
1.62 V to 1.98 V
5
2.4 V
1.62 V to 1.98 V
5
3.0 V
1.62 V to 1.98 V
5
1.8 V
1.62 V to 1.80 V
5
3.0 V
1.62 V to 1.98 V
5
2.4 V
1.62 V to 1.98 V
5
3.0 V
1.62 V to 1.98 V
5
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
1.62 V to 1.80 V
75
3.0 V
1.62 V to 1.98 V
75
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
1.62 V to 1.98 V
50
3.0 V
1.62 V to 1.98 V
50
CL = 20 pF,
PMMCOREV = 0
1.8 V
1.62 V to 1.80 V
18
3.0 V
1.62 V to 1.98 V
18
CL = 20 pF,
PMMCOREV = 3
2.4 V
1.62 V to 1.98 V
10
3.0 V
1.62 V to 1.98 V
10
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE
high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to
SOMI data out
PMMCOREV = 3
PMMCOREV = 0
tSTE,DIS
STE disable time, STE high to
SOMI high impedance
PMMCOREV = 3
PMMCOREV = 0
tSU,SI
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
tHD,SO
(1)
(2)
(3)
SOMI output data valid time
(2)
SOMI output data hold time (3)
MIN
TYP
MAX
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 14 and Figure 15.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 14
and Figure 15.
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 16. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 17. SPI Slave Mode, CKPH = 1
72
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 18)
PARAMETER
TEST CONDITIONS
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated
START
tHD,DAT
tSU,DAT
MIN
TYP
Internal: SMCLK or ACLK,
External: UCLK
Duty cycle = 50% ± 10%
UNIT
fSYSTEM
MHz
400
kHz
1.62 V to 1.98 V
2.2 V, 3 V
1.62 V to 1.98 V
2.2 V, 3 V
1.62 V to 1.98 V
Data hold time
2.2 V, 3 V
1.62 V to 1.98 V
0
ns
Data setup time
2.2 V, 3 V
1.62 V to 1.98 V
250
ns
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
Setup time for STOP
tSP
Pulse duration of spikes
suppressed by input filter
fSCL > 100 kHz
2.2 V, 3 V
1.62 V to 1.98 V
2.2 V, 3 V
1.62 V to 1.98 V
0
MAX
2.2 V, 3 V
tSU,STO
(1)
VIO (1)
VCC
4.0
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
50
600
ns
In all test conditions, VIO ≤ VCC
tSU,STA
tHD,STA
tHD,STA
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 18. I2C Mode Timing
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10-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC10_A pins: P1.0 to P1.5 and P3.6 and
P3.7 terminals
Operating supply current into
AVCC terminal, REF module
and reference buffer off
fADC10CLK = 5.0 MHz, ADC10ON = 1,
REFON = 0, SHT0 = 0, SHT1 = 0,
ADC10DIV = 0, ADC10SREF = 00
Operating supply current into
AVCC terminal, REF module
on, reference buffer on
VCC
MIN
TYP
MAX
UNIT
1.8
3.6
V
0
AVCC
V
2.2 V
60
100
3V
75
110
fADC10CLK = 5.0 MHz, ADC10ON = 1,
REFON = 1, SHT0 = 0, SHT1 = 0,
ADC10DIV = 0, ADC10SREF = 01
3V
113
150
µA
Operating supply current into
AVCC terminal, REF module
off, reference buffer on
fADC10CLK = 5.0 MHz, ADC10ON = 1,
REFON = 0, SHT0 = 0, SHT1 = 0,
ADC10DIV = 0, ADC10SREF = 10,
VEREF = 2.5 V
3V
105
140
µA
Operating supply current into
AVCC terminal, REF module
off, reference buffer off
fADC10CLK = 5.0 MHz, ADC10ON = 1,
REFON = 0, SHT0 = 0, SHT1 = 0,
ADC10DIV = 0, ADC10SREF = 11,
VEREF = 2.5 V
3V
70
110
µA
CI
Input capacitance
Only one terminal Ax can be selected at one
time from the pad to the ADC10_A capacitor
array including wiring and pad
2.2 V
3.5
RI
Input MUX ON resistance
IADC10_A
(1)
(2)
µA
pF
AVCC > 2 V, 0 V ≤ VAx ≤ AVCC
36
1.8 V < AVCC < 2 V, 0 V ≤ VAx ≤ AVCC
96
kΩ
The leakage current is defined in the leakage current table with P6.x/Ax parameter.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. The external
reference voltage requires decoupling capacitors. See ().
10-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
2.2 V, 3 V
0.45
5
5.5
MHz
4.8
5.4
MHz
fADC10CLK
Input clock frequency
For specified performance of ADC10_A linearity
parameters
fADC10OSC
Internal ADC10_A
oscillator (1)
ADC10DIV = 0, fADC10CLK = fADC10OSC
2.2 V, 3 V
4.2
2.2 V, 3 V
2.4
Conversion time
REFON = 0, Internal oscillator, 12 ADC10CLK
cycles, 10-bit mode
fADC10OSC = 4 MHz to 5 MHz
tCONVERT
µs
External fADC10CLK from ACLK, MCLK or SMCLK,
ADC10SSEL ≠ 0
tADC10ON
Turn on settling time of
the ADC
See
tSample
Sampling time
RS = 1000 Ω, RI = 96 k Ω, CI = 3.5 pF (4)
(1)
(2)
(3)
(4)
74
3.0
(2)
(3)
100
ns
1.8 V
3
µs
3.0 V
1
µs
The ADC10OSC is sourced directly from MODOSC inside the UCS.
12 × ADC10DIV × 1/fADC10CLK
The condition is that the error in a conversion started after tADC10ON is less than ±0.5 LSB. The reference and input signal are already
settled.
Approximately eight Tau (τ) are needed to get an error of less than ±0.5 LSB
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10-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
EI
Integral
linearity error
1.4 V ≤ (VeREF+ – VREF–/VeREF–)min ≤ 1.6 V
ED
Differential
linearity error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
2.2 V, 3 V
±1.0
LSB
EO
Offset error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
Internal impedance of source RS < 100 Ω, CVREF+ = 20 pF
2.2 V, 3 V
±1.0
LSB
EG
Gain error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
2.2 V, 3 V
±1.0
LSB
ET
Total unadjusted
error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
2.2 V, 3 V
±2.0
LSB
MAX
UNIT
1.6 V < (VeREF+ – VREF–/VeREF–)min ≤ VAVCC
±1.0
2.2 V, 3 V
±1.0
±1.0
LSB
REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VeREF+
Positive external
reference voltage input
VeREF–
(VeREF+ –
VeREF–)
IVeREF+,
IVeREF–
CVREF+,
CVREF(1)
(2)
(3)
(4)
(5)
TEST CONDITIONS
VCC
MIN
TYP
VeREF+ > VREF–/VeREF–
(2)
1.4
AVCC
V
Negative external
reference voltage input
VeREF+ > VREF–/VeREF–
(3)
0
1.2
V
Differential external
reference voltage input
VeREF+ > VREF–/VeREF–
(4)
1.4
AVCC
V
Static input current
Capacitance at VeREF+
or VeREF- terminal
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC10CLK = 5 MHz, ADC10SHTx = 0x0001,
Conversion rate 200 ksps
2.2 V, 3 V
-26
26
µA
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC10CLK = 5 MHZ, ADC10SHTX = 0x1000,
Conversion rate 20 ksps
2.2 V, 3 V
-1
1
µA
(5)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 10-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC10_A. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
Copyright © 2012–2013, Texas Instruments Incorporated
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REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
Positive built-in reference
voltage
VREF+
AVCC minimum voltage,
Positive built-in reference
active
AVCC(min)
Operating supply current
into AVCC terminal (2)
IREF+
TEST CONDITIONS
VCC
MIN
TYP
MAX
REFVSEL = {2} for 2.5 V
REFON = 1
3V
2.472
2.51
2.548
REFVSEL = {1} for 2.0 V
REFON = 1
3V
1.96
1.99
2.02
REFVSEL = {0} for 1.5 V
REFON = 1
2.2 V, 3 V
1.472
1.495
1.518
REFVSEL = {0} for 1.5 V
2.2
REFVSEL = {1} for 2.0 V
2.2
REFVSEL = {2} for 2.5 V
2.7
UNIT
V
V
fADC10CLK = 5.0 MHz
REFON = 1, REFBURST = 0,
REFVSEL = {2} for 2.5 V
3V
18
24
µA
fADC10CLK = 5.0 MHz
REFON = 1, REFBURST = 0,
REFVSEL = {1} for 2.0 V
3V
15.5
21
µA
fADC10CLK = 5.0 MHz
REFON = 1, REFBURST = 0,
REFVSEL = {0} for 1.5 V
3V
13.5
21
µA
30
50
ppm/
°C
TCREF+
Temperature coefficient of
built-in reference (3)
IVREF+ = 0 A
REFVSEL = (0, 1, 2}, REFON = 1
ISENSOR
Operating supply current
into AVCC terminal (4)
REFON = 0, INCH = 0Ah,
ADC10ON = N A, TA = 30°C
2.2 V
20
22
3V
20
22
VSENSOR
See
ADC10ON = 1, INCH = 0Ah,
TA = 30°C
2.2 V
770
3V
770
VMID
AVCC divider at channel 11
ADC10ON = 1, INCH = 0Bh,
VMID ≈ 0.5 × VAVCC
2.2 V
1.06
1.1
1.14
3V
1.46
1.5
1.54
tSENSOR(sample)
Sample time required if
channel 10 is selected (6)
ADC10ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
30
µs
tVMID(sample)
Sample time required if
channel 11 is selected (7)
ADC10ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
1
µs
PSRR_DC
Power supply rejection ratio
(dc)
AVCC = AVCC (min) - AVCC(max)
TA = 25 °C
REFVSEL = (0, 1, 2}, REFON = 1
120
µV/V
PSRR_AC
Power supply rejection ratio
(ac)
AVCC = AVCC (min) - AVCC(max)
TA = 25 °C
f = 1 kHz, ΔVpp = 100 mV
REFVSEL = (0, 1, 2}, REFON = 1
6.4
mV/V
tSETTLE
Settling time of reference
voltage (8)
AVCC = AVCC (min) - AVCC(max)
REFVSEL = (0, 1, 2}, REFON = 0 → 1
75
µs
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
76
(5)
µA
mV
V
The leakage current is defined in the leakage current table with P6.x/Ax parameter.
The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC10ON control bit, unless a
conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C – (–40°C)).
The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is
high). When REFON = 1, ISENSOR is already included in IREF+.
The temperature sensor offset can be significant. A single-point calibration is recommended to minimize the offset error of the built-in
temperature sensor.
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
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Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
MIN
Supply voltage
TYP
1.8
MAX
3.6
1.8 V
IAVCC_COMP
VREF
IAVCC_REF
CBPWRMD = 00, CBON = 1, CBRSx = 00
Comparator operating
supply current into
AVCC, Excludes
CBPWRMD = 01, CBON = 1, CBRSx = 00
reference resistor ladder
Reference voltage level
Quiescent current of
resistor ladder into
AVCC, Including REF
module current
VIC
Common mode input
range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
tPD
tPD,filter
Series input resistance
Propagation delay,
response time
Propagation delay with
filter active
UNIT
V
38
2.2 V
31
38
3V
32
39
2.2 V,
3V
10
17
CBPWRMD = 10, CBON = 1, CBRSx = 00
2.2 V,
3V
0.2
0.85
CBREFLx = 01, CBREFACC = 0
≥ 1.8V
1.44
±2.5%
CBREFLx = 10, CBREFACC = 0
≥ 2.2V
1.92
±2.5%
CBREFLx = 11, CBREFACC = 0
≥ 3.0V
2.39
±2.5%
CBREFACC = 1, CBREFLx = 01, CBRSx = 10,
REFON = 0, CBON = 0
2.2 V,
3V
17
22
µA
CBREFACC = 0, CBREFLx = 01, CBRSx = 10,
REFON = 0, CBON = 0
2.2 V,
3V
33
40
µA
0
VCC-1
V
CBPWRMD = 00
-20
20
mV
CBPWRMD = 01, 10
-10
10
mV
4
kΩ
µA
5
ON - switch closed
OFF - switch opened
V
pF
3
50
MΩ
CBPWRMD = 00, CBF = 0
450
CBPWRMD = 01, CBF = 0
600
ns
ns
CBPWRMD = 10, CBF = 0
50
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 00
0.35
0.6
1.5
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 01
0.6
1.0
1.8
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 10
1.0
1.8
3.4
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 11
1.8
3.4
6.5
µs
1
2
µs
1.0
1.5
µs
50
ppm/
°C
tEN_CMP
Comparator enable time
CBON = 0 to CBON = 1, CBPWRMD = 00, 01
tEN_REF
Resistor reference
enable time
CBON = 0 to CBON = 1
TCCB_REF
Temperature coefficient
reference of VCB_REF
VCB_REF
Reference voltage for a
given tap
VIN = reference into resistor ladder,
n = 0 to 31
Copyright © 2012–2013, Texas Instruments Incorporated
VIN ×
(n+0.5)
/ 32
VIN ×
(n+1)
/ 32
VIN ×
(n+1.5)
/ 32
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Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
DVCC(PGM/ERASE) Program and erase supply voltage
MIN
TYP
1.8
MAX
3.6
UNIT
V
IPGM
Average supply current from DVCC during program
3
5
mA
IERASE
Average supply current from DVCC during erase
6
11
mA
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank
erase
6
11
mA
16
ms
tCPT
Cumulative program time
See
(1)
4
Program and erase endurance
10
5
10
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
See
(2)
64
85
µs
tBlock,
0
Block program time for first byte or word
See
(2)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(2)
37
49
µs
Block program time for last byte or word
See
(2)
55
73
µs
tErase
Erase time for segment, mass erase, and bank erase when
available
See
(2)
23
32
ms
fMCLK,MGR
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
0
1
MHz
tBlock,
(1)
(2)
N
100
years
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word or byte write mode and block write mode.
These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
VIO
MIN
TYP
MAX
UNIT
0
20
MHz
0.025
15
µs
1
µs
µs
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
1.62 V to
1.98 V
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V, 3 V
1.62 V to
1.98 V
tSBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first
clock edge) (1)
2.2 V, 3 V
1.62 V to
1.98 V
tSBW,Rst
Spy-Bi-Wire return to normal operation time
2.2 V, 3 V
1.62 V to
1.98 V
15
100
2.2 V
1.62 V to
1.98 V
0
5
MHz
3V
1.62 V to
1.98 V
0
10
MHz
2.2 V, 3 V
1.62 V to
1.98 V
45
80
kΩ
fTCK
TCK input frequency for 4-wire JTAG
Rinternal
(1)
(2)
78
(2)
Internal pulldown resistance on TEST
60
Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
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DVIO BSL Entry
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
VIO
MIN
TYP
MAX
UNIT
tSU, BSLEN
Setup time BSLEN to RST/NMI (1)
2.2 V, 3 V
1.62 V to
1.98 V
100
ns
tHO,
Hold time BSLEN to RST/NMI (2)
2.2 V, 3 V
1.62 V to
1.98 V
350
µs
(1)
(2)
BSLEN
AVCC, DVCC, DVIO stable and within specification.
BSLEN must remain logically high long enough for the boot code to detect its level and enter the BSL sequence. After the minimum hold
time is achieved, BSLEN is a don't care.
BSLEN
VIT+
VITtHO,BSLEN
VIT+
VITRST/NMI
(DVIO domain)
t
tSU,BSLEN
Figure 19. DVIO BSL Entry Timing
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INPUT/OUTPUT SCHEMATICS
Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
P1DIR.x
0
From module
1
P1OUT.x
0
From module
1
0
(P1.0 to P1.3) DVCC
(P1.4 to P1.7) DVIO
1
1
Direction
0: Input
1: Output
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
EN
To module
DVSS
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
80
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Interrupt
Edge
Select
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 47. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
x
0
1
2
3
4
FUNCTION
P1DIR.x
P1SEL.x
P1.0 (I/O)
I: 0; O: 1
0
TA0CLK
0
1
ACLK
1
1
I: 0; O: 1
0
TA0.CCI0A
0
1
TA0.0
1
1
I: 0; O: 1
0
TA0.CCI1A
0
1
TA0.1
1
1
I: 0; O: 1
0
TA0.CCI2A
0
1
TA0.2
1
1
I: 0; O: 1
0
0
1
P1.1 (I/O)
P1.2 (I/O)
P1.3 (I/O)
P1.4 (I/O)
TA0.CCI3A
TA0.3
P1.5/TA0.4
5
P1.5 (I/O)
TA0.CCI4A
TA0.4
P1.6/TA1CLK/CBOUT
6
7
1
1
I: 0; O: 1
0
0
1
1
1
P1.6 (I/O)
I: 0; O: 1
0
TA1CLK
0
1
CBOUT comparator B
P1.7/TA1.0
CONTROL BITS AND SIGNALS
1
1
I: 0; O: 1
0
TA1.CCI0A
0
1
TA1.0
1
1
P1.7 (I/O)
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Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
P2REN.x
P2DIR.x
0
From module
1
P2OUT.x
0
From module
1
0
DVIO
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
To module
DVSS
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UB0STE/UCA0CLK
D
P2IE.x
EN
To module
Q
P2IFG.x
P2SEL.x
P2IES.x
82
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Interrupt
Edge
Select
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 48. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/TA1.1
P2.1/TA1.2
(2)
0
(2)
P2.2/TA2CLK/SMCLK
x
1
(2)
P2.3/TA2.0 (2)
P2.4/TA2.1 (2)
P2.5/TA2.2 (2)
P2.6/RTCCLK/DMAE0 (2)
2
3
4
5
6
FUNCTION
P2.0 (I/O)
7
P2SEL.x
I: 0; O: 1
0
0
1
TA1.1
1
1
P2.1 (I/O)
I: 0; O: 1
0
TA1.CCI2A
0
1
TA1.2
1
1
P2.2 (I/O)
I: 0; O: 1
0
TA2CLK
0
1
SMCLK
1
1
I: 0; O: 1
0
TA2.CCI0A
0
1
TA2.0
1
1
I: 0; O: 1
0
TA2.CCI1A
0
1
TA2.1
1
1
I: 0; O: 1
0
TA2.CCI2A
0
1
TA2.2
1
1
I: 0; O: 1
0
0
1
RTCCLK
1
1
P2.7 (I/O)
I: 0; O: 1
0
X
1
P2.3 (I/O)
P2.4 (I/O)
P2.5 (I/O)
P2.6 (I/O)
UCB0STE/UCA0CLK (3)
(1)
(2)
(3)
(4)
P2DIR.x
TA1.CCI1A
DMAE0
P2.7/UCB0STE/UCA0CLK
CONTROL BITS AND
SIGNALS (1)
(4)
X = Don't care
Not available on RGZ package types.
The pin direction is controlled by the USCI module.
UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI B0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
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Port P3, P3.0 to P3.4, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
From module
1
P3OUT.x
0
From module
1
DVSS
0
DVIO
1
1
Direction
0: Input
1: Output
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
EN
To module
D
Table 49. Port P3 (P3.0 to P3.4) Pin Functions
PIN NAME (P3.x)
P3.0/UCB0SIMO/UCB0SDA
x
0
FUNCTION
P3.0 (I/O)
UCB0SIMO/UCB0SDA (2)
P3.1/UCB0SOMI/UCB0SCL
1
P3.1 (I/O)
UCB0SOMI/UCB0SCL (2)
P3.2/UCB0CLK/UCA0STE
2
3
4
(4)
P3.3 (I/O)
UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
(2)
P3.4 (I/O)
UCA0RXD/UCA0SOMI (2)
(1)
(2)
(3)
(4)
84
(3)
P3.2 (I/O)
UCB0CLK/UCA0STE (2)
P3.3/UCA0TXD/UCA0SIMO
(3)
CONTROL BITS AND
SIGNALS (1)
P3DIR.x
P3SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
X = Don't care
The pin direction is controlled by the USCI module.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI A0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
P4DIR.x
0
from Port Mapping Control
1
P4OUT.x
0
from Port Mapping Control
1
DVSS
0
DVIO
1
1
Direction
0: Input
1: Output
P4.0/P4MAP0
P4.1/P4MAP1
P4.2/P4MAP2
P4.3/P4MAP3
P4.4/P4MAP4
P4.5/P4MAP5
P4.6/P4MAP6
P4.7/P4MAP7
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
D
to Port Mapping Control
Table 50. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/P4MAP0
x
0
FUNCTION
P4.0 (I/O)
Mapped secondary digital function
P4.1/P4MAP1
1
P4.2/P4MAP2
2
P4.1 (I/O)
Mapped secondary digital function
P4.2 (I/O)
Mapped secondary digital function
P4.3/P4MAP3
3
P4.3 (I/O)
Mapped secondary digital function
P4.4/P4MAP4
4
P4.5/P4MAP5
5
P4.4 (I/O)
Mapped secondary digital function
P4.5 (I/O)
Mapped secondary digital function
P4.6/P4MAP6
6
P4.7/P4MAP7 (3)
7
P4.6 (I/O)
Mapped secondary digital function
P4.7 (I/O)
Mapped secondary digital function
(1)
(2)
(3)
CONTROL BITS AND SIGNALS (1)
P4DIR.x (2)
P4SEL.x
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
≤ 30
P4MAPx
X
1
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
≤ 30
X
1
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
≤ 30
X
1
I: 0; O: 1
0
X
X
1
≤ 30
X = Don't care
The direction of some mapped secondary functions are controlled directly by the module. See Table 10 for specific direction control
information of mapped secondary functions.
Not available on RGZ package types.
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Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
to/from Reference
(n/a MSP430F521x)
(n/a MSPF430F521x)
to ADC10
(n/a MSPF430F521x)
INCHx = x
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
From module
1
P5.0/(A8/VeREF+)
P5.1/(A9/VeREF–)
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
To module
D
Table 51. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/A8/VeREF+
x
0
FUNCTION
P5.0 (I/O)
(3)
A8/VeREF+ (4)
P5.1/A9/VeREF–
1
P5.1 (I/O) (3)
A9/VeREF– (5)
(1)
(2)
(3)
(4)
(5)
86
CONTROL BITS AND SIGNALS (1)
P5DIR.x
P5SEL.x
REFOUT (2)
I: 0; O: 1
0
X
X
1
0
I: 0; O: 1
0
X
X
1
0
X = Don't care
REFOUT resides in the REF module.
Default condition
Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC10_A. Channel A8, when selected with
the INCHx bits, is connected to the VeREF+ pin.
Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF- and used as the reference for the ADC10_A. Channel A9, when selected with the
INCHx bits, is connected to the VeREF- pin.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Port P5, P5.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.2
P5DIR.2
DVSS
0
DVCC
1
1
0
1
P5OUT.2
0
Module X OUT
1
P5DS.2
0: Low drive
1: High drive
P5SEL.2
P5.2/XT2IN
P5IN.2
EN
Module X IN
Bus
Keeper
D
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Port P5, P5.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.3
P5DIR.3
DVSS
0
DVCC
1
1
0
1
P5OUT.3
0
Module X OUT
1
P5.3/XT2OUT
P5DS.3
0: Low drive
1: High drive
P5SEL.3
P5IN.3
Bus
Keeper
EN
Module X IN
D
Table 52. Port P5 (P5.2, P5.3) Pin Functions
PIN NAME (P5.x)
P5.2/XT2IN
P5.3/XT2OUT
(1)
(2)
(3)
88
x
2
3
FUNCTION
P5.2 (I/O)
CONTROL BITS AND SIGNALS (1)
P5DIR.x
P5SEL.2
P5SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
XT2IN crystal mode (2)
X
1
X
0
XT2IN bypass mode (2)
X
1
X
1
I: 0; O: 1
0
X
X
XT2OUT crystal mode (3)
X
1
X
0
P5.3 (I/O) (3)
X
1
X
1
P5.3 (I/O)
X = Don't care
Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal
mode or bypass mode.
Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as
general-purpose I/O.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
Pad Logic
to XT1
P5REN.4
P5DIR.4
DVSS
0
DVCC
1
1
0
1
P5OUT.4
0
Module X OUT
1
P5DS.4
0: Low drive
1: High drive
P5SEL.4
P5.4/XIN
P5IN.4
EN
Module X IN
Bus
Keeper
D
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Pad Logic
to XT1
P5REN.5
P5DIR.5
DVSS
0
DVCC
1
1
0
1
P5OUT.5
0
Module X OUT
1
P5.5/XOUT
P5DS.5
0: Low drive
1: High drive
P5SEL.5
XT1BYPASS
P5IN.5
Bus
Keeper
EN
Module X IN
D
Table 53. Port P5 (P5.4 and P5.5) Pin Functions
PIN NAME (P5.x)
P5.4/XIN
x
4
FUNCTION
P5DIR.x
P5SEL.4
P5SEL.5
XT1BYPASS
I: 0; O: 1
0
X
X
X
1
X
0
X
1
X
1
I: 0; O: 1
0
X
X
XOUT crystal mode (3)
X
1
X
0
P5.5 (I/O) (3)
X
1
X
1
P5.4 (I/O)
XIN crystal mode
(2)
XIN bypass mode (2)
P5.5/XOUT
(1)
(2)
(3)
90
5
CONTROL BITS AND SIGNALS (1)
P5.5 (I/O)
X = Don't care
Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal
mode or bypass mode.
Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as
general-purpose I/O.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
to ADC10
(n/a MSPF430F521x)
INCHx = x
(n/a MSPF430F521x)
to Comparator_B
from Comparator_B
CBPD.x
P6REN.x
P6DIR.x
0
0
From module
1
0
DVCC
1
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
EN
To module
1
Direction
0: Input
1: Output
1
P6OUT.x
DVSS
D
Copyright © 2012–2013, Texas Instruments Incorporated
Bus
Keeper
P6.0/CB0/(A0)
P6.1/CB1/(A1)
P6.2/CB2/(A2)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
P6.7/CB7/(A7)
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Table 54. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/CB0/(A0)
x
0
FUNCTION
P6.0 (I/O)
A0
CB0 (1)
P6.1/CB1/(A1)
1
P6.2/CB2/(A2)
2
P6.3/CB3/(A3)
3
P6.4/CB4/(A4)
4
P6.1 (I/O)
6
(1)
(2)
92
7
X
X
X
1
I: 0; O: 1
0
0
1
X
1
I: 0; O: 1
0
0
P6.2 (I/O)
A2
X
1
X
CB2 (1)
X
X
1
I: 0; O: 1
0
0
P6.3 (I/O)
A3
X
1
X
CB3 (1)
X
X
1
I: 0; O: 1
0
0
X
1
X
1
P6.4 (I/O)
P6.5 (I/O)
P6.6 (I/O)
CB6 (1)
P6.7/CB7/(A7)
0
1
X
A6
(2)
0
X
X
CB5 (1)
P6.6/CB6/(A6)
I: 0; O: 1
X
A5
(2)
CBPD
CB1 (1)
CB4 (1)
5
P6SEL.x
A1
A4
P6.5/CB5/(A5)
CONTROL BITS AND SIGNALS
P6DIR.x
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
I: 0; O: 1
0
0
A7
X
1
X
CB7 (1)
X
X
1
P6.7 (I/O)
Setting the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer
for that pin, regardless of the state of the associated CBPD.x bit.
Not available on RGZ package types.
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Port P7, P7.0 to P7.5, Input/Output With Schmitt Trigger
Pad Logic
P7REN.x
P7DIR.x
0
From module
1
P7OUT.x
0
DVSS
0
DVIO
1
1
Direction
0: Input
1: Output
1
P7.0/TB0.0
P7.1/TB0.1
P7.2/TB0.2
P7.3/TB0.3
P7.4/TB0.4
P7.5/TB0.5
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7IN.x
EN
D
To module
Table 55. Port P7 (P7.0 to P7.5) Pin Functions
PIN NAME (P7.x)
P7.0/TB0.0
P7.1/TB0.1
P7.2/TB0.2
(1)
(1)
(1)
P7.3/TB0.3 (1)
P7.4/TB0.4 (1)
P7.5/TB0.5 (1)
(1)
x
0
1
2
3
4
5
FUNCTION
P7.0 (I/O)
CONTROL BITS AND SIGNALS
P7DIR.x
P7SEL.x
I: 0; O: 1
0
TB0.CCI0A
0
1
TB0.0
1
1
P7.1 (I/O)
I: 0; O: 1
0
TB0.CCI1A
0
1
TB0.1
1
1
P7.2 (I/O)
I: 0; O: 1
0
TB0.CCI2A
0
1
TB0.2
1
1
I: 0; O: 1
0
TB0.CCI3A
0
1
TB0.3
1
1
I: 0; O: 1
0
TB0.CCI4A
0
1
TB0.4
1
1
I: 0; O: 1
0
TB0.CCI5A
0
1
TB0.5
1
1
P7.3 (I/O)
P7.4 (I/O)
P7.5 (I/O)
Not available on RGZ package types.
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Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.x
0: Low drive
1: High drive
From JTAG
1
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
94
D
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 56. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS
AND SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
(2)
I: 0; O: 1
PJ.1 (I/O) (2)
I: 0; O: 1
PJ.0 (I/O)
TDO (3)
PJ.1/TDI/TCLK
1
X
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
(1)
(2)
(3)
(4)
X
I: 0; O: 1
(4)
PJ.3 (I/O)
TCK (3)
(4)
(2)
X
(2)
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
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DEVICE DESCRIPTORS
Table 57 and Table 58 list the complete contents of the device descriptor tag-length-value (TLV) structure for
each device type.
Table 57. MSP430F522x Device Descriptor Table (1)
Info Block
Die Record
ADC10
Calibration
REF Calibration
Peripheral
Descriptor
(1)
96
Description
Address
Size
(bytes)
F5229
F5227
F5224
F5222
Value
Value
Value
Value
06h
Info length
01A00h
1
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
Device ID
01A04h
1
51h
4Fh
4Ch
4Ah
Device ID
01A05h
1
81h
81h
81h
81h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
ADC10 Calibration Tag
01A14h
1
13h
13h
13h
13h
ADC10 Calibration length
01A15h
1
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
per unit
per unit
per unit
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
REF 1.5-V Reference Factor
01A28h
2
per unit
per unit
per unit
per unit
REF 2.0-V Reference Factor
01A2Ah
2
per unit
per unit
per unit
per unit
REF 2.5-V Reference Factor
01A2Ch
2
per unit
per unit
per unit
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
Peripheral Descriptor Length
01A2Fh
1
5Fh
5Fh
5Dh
5Dh
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
12h
2Eh
12h
2Eh
12h
2Eh
12h
2Eh
NA = Not applicable, blank = unused and reads FFh.
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 57. MSP430F522x Device Descriptor Table(1) (continued)
Description
Address
Size
(bytes)
F5229
F5227
F5224
F5222
Value
Value
Value
Value
Memory 4
2
22h
96h
22h
94h
22h
96h
22h
94h
Memory 5
2
N/A
N/A
N/A
N/A
Memory 6
1/2
N/A
N/A
N/A
N/A
delimiter
1
00h
00h
00h
00h
Peripheral count
1
20h
20h
1Fh
1Fh
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-S
2
00h
03h
00h
03h
00h
03h
00h
05h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
Port 7/8
2
02h
54h
02h
54h
N/A
N/A
JTAG
2
0Ch
5Fh
0Ch
5Fh
0Eh
5Fh
0Eh
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
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97
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 57. MSP430F522x Device Descriptor Table(1) (continued)
Description
Interrupts
98
Address
Size
(bytes)
F5229
F5227
F5224
F5222
Value
Value
Value
Value
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
USCI_A/B
2
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
ADC10_A
2
14h
D3h
14h
D3h
14h
D3h
14h
D3h
COMP_B
2
18h
A8h
18h
A8h
18h
A8h
18h
A8h
COMP_B
1
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
USCI_B0
1
91h
91h
91h
91h
ADC10_A
1
D0h
D0h
D0h
D0h
TA0.CCIFG0
1
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
Reserved
1
01h
01h
01h
01h
DMA
1
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
USCI_A1
1
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
TA1.CCIFG0
1
66h
66h
66h
66h
TA1.CCIFG1..2
1
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
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SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 58. MSP430F521x Device Descriptor Table (1)
Info Block
Die Record
ADC10
Calibration
REF Calibration
Peripheral
Descriptor
(1)
Description
Address
Size
(bytes)
F5219
F5217
F5214
F5212
Value
Value
Value
Value
06h
Info length
01A00h
1
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
Device ID
01A04h
1
47h
45h
42h
40h
Device ID
01A05h
1
81h
81h
81h
81h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
ADC10 Calibration Tag
01A14h
1
13h
13h
13h
13h
ADC10 Calibration length
01A15h
1
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
blank
blank
blank
blank
ADC Offset
01A18h
2
blank
blank
blank
blank
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
blank
blank
blank
blank
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
blank
blank
blank
blank
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
blank
blank
blank
blank
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
blank
blank
blank
blank
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
blank
blank
blank
blank
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
blank
blank
blank
blank
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
REF 1.5-V Reference Factor
01A28h
2
per unit
per unit
per unit
per unit
REF 2.0-V Reference Factor
01A2Ah
2
per unit
per unit
per unit
per unit
REF 2.5-V Reference Factor
01A2Ch
2
per unit
per unit
per unit
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
Peripheral Descriptor Length
01A2Fh
1
5Dh
5Dh
5Bh
5Bh
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
12h
2Eh
12h
2Eh
12h
2Eh
12h
2Eh
Memory 4
2
22h
96h
22h
94h
22h
96h
22h
94h
Memory 5
2
N/A
N/A
N/A
N/A
Memory 6
1/2
N/A
N/A
N/A
N/A
delimiter
1
00h
00h
00h
00h
NA = Not applicable, blank = unused and reads FFh.
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99
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
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Table 58. MSP430F521x Device Descriptor Table(1) (continued)
Size
(bytes)
F5219
F5217
F5214
F5212
Value
Value
Value
Value
1
1Fh
1Fh
1Eh
1Eh
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-S
2
00h
03h
00h
03h
00h
03h
00h
05h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
Port 7/8
2
02h
54h
02h
54h
N/A
N/A
JTAG
2
0Ch
5Fh
0Ch
5Fh
0Eh
5Fh
0Eh
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
Description
Peripheral count
100
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MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
Table 58. MSP430F521x Device Descriptor Table(1) (continued)
Description
Interrupts
Address
Size
(bytes)
F5219
F5217
F5214
F5212
Value
Value
Value
Value
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
USCI_A/B
2
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
ADC10_A
2
N/A
N/A
N/A
N/A
COMP_B
2
2Ch
A8h
2Ch
A8h
2Ch
A8h
2Ch
A8h
COMP_B
1
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
USCI_B0
1
91h
91h
91h
91h
Reserved
1
01h
01h
01h
01h
TA0.CCIFG0
1
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
Reserved
1
01h
01h
01h
01h
DMA
1
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
USCI_A1
1
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
TA2.CCIFG0
1
66h
66h
66h
66h
TA2.CCIFG1..2
1
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
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101
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D – NOVEMBER 2012 – REVISED OCTOBER 2013
www.ti.com
REVISION HISTORY
REVISION
SLAS718
DESCRIPTION
Initial release
SLAS718A
DCO Frequency, Added note (1).
SLAS718B
Pin Designation – F5229, F5227, F5219, F5217 – YFF Package, Added ball-side view and changed orientation of topside view.
REF, External Reference, Changed note (1) (changed from "12-bit accuracy" to "10-bit accuracy").
SLAS718C
Table 3, Added note about internal pullup resistor to RST/NMI pin.
Absolute Maximum Ratings, Added information for DVIO pin.
SLAS718D
Production Data release of YFF (DSBGA) package options.
Added Applications, Development Tools Support, and Device and Development Tool Nomenclature.
Recommended Operating Conditions, Added note about CVCORE tolerance.
Comparator_B, Corrected test conditions for IAVCC_REF.
102
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
MSP430F5212IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5212
MSP430F5212IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5212
MSP430F5214IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5214
MSP430F5214IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5214
MSP430F5217IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5217
MSP430F5217IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
F5217
MSP430F5217IYFFR
PREVIEW
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
M430F5217
MSP430F5217IYFFT
PREVIEW
DSBGA
YFF
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
M430F5217
MSP430F5217IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
F5217
MSP430F5217IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
F5217
MSP430F5219IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5219
MSP430F5219IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5219
MSP430F5219IYFFR
ACTIVE
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5219
MSP430F5219IYFFT
ACTIVE
DSBGA
YFF
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5219
MSP430F5219IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
F5219
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
2-Oct-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
MSP430F5219IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
F5219
MSP430F5222IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5222
MSP430F5222IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5222
MSP430F5224IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5224
MSP430F5224IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5224
MSP430F5227IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5227
MSP430F5227IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5227
MSP430F5227IYFFR
PREVIEW
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5227
MSP430F5227IYFFT
PREVIEW
DSBGA
YFF
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5227
MSP430F5227IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
F5227
MSP430F5227IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
F5227
MSP430F5229IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5229
MSP430F5229IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
F5229
MSP430F5229IYFFR
ACTIVE
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5229
MSP430F5229IYFFT
ACTIVE
DSBGA
YFF
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
M430F5229
MSP430F5229IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
F5229
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
2-Oct-2013
Status
(1)
MSP430F5229IZQER
ACTIVE
Package Type Package Pins Package
Drawing
Qty
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
SNAGCU
Level-3-260C-168 HR
(4/5)
F5229
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
Samples
D: Max = 3.565 mm, Min =3.505 mm
E: Max = 3.445 mm, Min =3.385 mm
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