PRELIMINARY
CYW20732Y
Bluetooth Low Energy SiP Module
General Description
The Cypress CYW20732Y is a Bluetooth Low-Energy (BLE)-only System-in-Package (SiP). The CYW20732Y radio has been
designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz
unlicensed Industrial, Scientific, and Medical (ISM) band.
The highly integrated module requires minimal external components to make a standalone 32-bit ARM™ Cortex™ M3 and 1 Mbit
EEPROM BLE SiP module. The CYW20732Y is available in a 27-pin 3.5 mm × 3.2 mm x 1.0 mm maximum 27-LGA package.
Features
■
Bluetooth Low-Energy (BLE)-compliant
■
Infrared modulator
■
IR learning
■
Supports Adaptive Frequency Hopping (AFH)
■
Excellent receiver sensitivity
■
10-bit auxiliary ADC with nine analog channels
■
On-chip support for serial peripheral interface
(master and slave modes)
■
Broadcom Serial Control (BSC) interface (compatible with NXP I2C slaves)
32-bit ARM™ Cortex™ M3 microcontroller unit
(MCU)
■
Embedded 1 Mbit I2C Memory capacity
EEPROM memory capacity
■
UART diverse serial interface
■
Sensor applications support for I2C, GPIO, and
PCM
■
■
MAC/BB/RF functionality on a single chip
■
2.4 GHz frequency band support
■
BLE network standard compliance with Bluetooth
Special Interest Group (SIG) requirements
■
Compliance with Moisture Sensitivity Level
(MSL) 3 for semiconductor packaging and handling precautions
■
Programmable output power control
■
Integrated ARM Cortex-M3 based microprocessor core
■
On-chip power-on reset (POR)
■
FCC and CE certification and compliance
■
Support for EEPROM and serial flash interfaces
■
RoHS compliant
■
Integrated Low Drop Out (LDO) regulator
■
■
On-chip, software controlled power management
unit
Satisfies MSL3 and J-STD-020 specification
requirements (peak temperature 260° C) and is
capable of 260° C peak reflow.
■
Programmable key scan matrix interface, up to
8 × 20 key-scanning matrix
■
Satisfies Restriction of Hazardous Substances
(RoHS) Directive 2002/95/EC and 2011/65/EU.
■
27-pin 27-Land Grid Array (LGA) (3.5 mm × 3.2
mm x 1.0 mm) package.
Cypress Semiconductor Corporation
Document No. 002-14838 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised November 3, 2016
PRELIMINARY
CYW20732Y
Figure 1. Functional Block Diagram
VBAT
VDDC
VDBL
UART interface
BT_RF
I2 C
CYW20732Y
GPIOs
with ARM Cortex M 3
microprocessor core
2.4 MHz
VDBL_EE
PCM
XTAL
Flash
1 Mbit I2C
Introduction
This data sheet provides a description of the major blocks, interfaces, pin assignments, and specifications of the CYW20732Y singlechip Bluetooth low energy (BLE) SoC. This is a required document for designers responsible for adding the CYW20732Y BLE SoC
to wireless input device applications including heart-rate monitors, blood-pressure monitors, proximity sensors, temperature sensors,
and battery monitors.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Cypress to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
Cypress Part Number
BCM20732Y
CYW20732Y
BCM20732YB3ISLGH (T)
CYW20732YB3ISLGH (T)
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined upon first use. For a more complete list of acronyms and other terms used in
Cypress documents, go to: http://www.cypress.com/glossary.
IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website
(https://community.cypress.com/).
Document No. 002-14838 Rev. *B
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PRELIMINARY
CYW20732Y
Contents
1. Functional Description ..................................... 4
1.1
4.2
RF Transmitter Specifications ............................10
Bluetooth Baseband Core ................................... 4
1.1.1 Frequency Hopping Generator ................ 4
1.1.2 E0 Encryption .......................................... 4
1.1.3 Link Control Layer ................................... 4
1.1.4 Adaptive Frequency Hopping .................. 4
1.1.5 Bluetooth Low Energy Profiles ................ 4
1.1.6 Test Mode Support .................................. 5
5. Timing Specifications..................................... 11
1.2
Infrared Modulator ............................................... 5
5.2.4 Crystal Oscillator ....................................14
1.3
Infrared Learning ................................................. 5
6. Mechanical ...................................................... 15
1.4
Serial Peripheral Interface ................................... 5
6.1
Dimensions ........................................................15
1.5
Microprocessor Unit ............................................ 6
1.5.1 EEPROM Interface .................................. 6
1.5.2 Serial Flash Interface ............................... 6
6.2
Recommended Footprint ....................................16
6.3
Recommended Stencil .......................................17
6.4
Recommended Reflow Profile ............................18
2. Pin Assignments............................................... 7
2.1
Pin Descriptions .................................................. 7
2.2
Pin Definition ....................................................... 8
3. Electrical Specifications................................... 9
3.1
Absolute Maximum Ratings ................................ 9
3.2
Recommended Operating Conditions ................. 9
3.2.1 Temperature and Humidity ...................... 9
5.1
External Reset ....................................................11
5.2
Timing and AC Characteristics ...........................12
5.2.1 SPI Timing ..............................................12
5.2.2 BSC Interface Timing .............................13
5.2.3 UART Timing ..........................................14
7. Packaging and Storage .................................. 19
7.1
Package Dimensioning ......................................19
7.2
Laser Mark .........................................................20
7.3
Pin 1 Location in the Tape/Reel .........................20
7.4
Moisture Sensitive Level (MSL) .........................21
7.5
SiP Module Tray .................................................22
7.6
Product Qualification Report ..............................23
3.2.2 Voltage .................................................... 9
3.2.3 Current Consumption .............................. 9
8. Ordering Information...................................... 24
4. RF Specifications............................................ 10
Document History Page ................................................. 25
4.1
RF Performance ................................................ 10
Document No. 002-14838 Rev. *B
Sales, Solutions, and Legal Information ...................... 26
Page 3 of 50
PRELIMINARY
CYW20732Y
1. Functional Description
1.1 Bluetooth Baseband Core
The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high performance Bluetooth operation.
The BBC manages the buffering, segmentation, and data routing for all connections. It also buffers data that passes through it, handles
data flow control, schedules ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into
baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it
independently handles HCI event types and HCI command types.
The following transmit and receive functions are also implemented in the BBC hardware to increase TX/RX data reliability and security
before sending over the air:
■
Receive Functions: symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic
redundancy check (CRC), data decryption, and data dewhitening.
■
Transmit Functions: data framing, FEC generation, HEC generation, CRC generation, link key generation, data encryption, and
data whitening.
1.1.1 Frequency Hopping Generator
The frequency hopping sequence generator selects the correct hopping channel number depending on the link controller state,
Bluetooth clock, and device address.
1.1.2 E0 Encryption
The encryption key and the encryption engine are implemented using dedicated hardware to reduce software complexity and provide
minimal processor intervention.
1.1.3 Link Control Layer
The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit (LCU).
This layer consists of the Command Controller, which takes software commands, and other controllers that are activated or configured
by the Command Controller to perform the link control tasks. Each task performs a different Bluetooth link controller state. STANDBY
and CONNECTION are the two major states. In addition, there are five substates: page, page scan, inquiry, and inquiry scan.
1.1.4 Adaptive Frequency Hopping
The CYW20732Y gathers link quality statistics on a channel-by-channel basis to facilitate channel assessment and channel map
selection. The link quality is determined by using both RF and baseband signal processing to provide a more accurate frequency hop
map.
1.1.5 Bluetooth Low Energy Profiles
The CYW20732Y supports Bluetooth low-energy, including the following profiles that are supported1 in ROM:
■
Battery status
■
Blood pressure monitor
■
Find me
■
Heart rate monitor
■
Proximity
■
Thermometer
■
Weight scale
■
Time
1.Full qualification and use of these profiles may require firmware updates from Cypress. Some of these profiles are under development/approval at the
Bluetooth SIG and conformity with the final approved version is pending. Contact your supplier for updates and the latest list of profiles.
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PRELIMINARY
CYW20732Y
The following additional profiles can be supported1 from RAM:
■
Blood glucose monitor
■
Temperature alarm
■
Location
■
Custom profile
1.1.6 Test Mode Support
The CYW20732Y fully supports Bluetooth Test mode, as described in the Bluetooth low energy specification.
1.2 Infrared Modulator
The CYW20732Y includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated
waveforms. For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced
from firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter.
If descriptors are used, they include IR on/off state and the duration between 1 and 32,767 µsec. The CYW20732Y IR TX firmware
driver inserts this information in a hardware FIFO and makes sure that all descriptors are played out without a glitch due to underrun.
1.3 Infrared Learning
The CYW20732Y includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals.
For modulated signals, the CYW20732Y can detect carrier frequencies between 10 kHz– 500 kHz and the duration that the signal is
present or absent. The CYW20732Y firmware driver supports further analysis and compression of learned signal. The learned signal
can then be played back through the CYW20732Y IR TX subsystem.
1.4 Serial Peripheral Interface
The CYW20732Y has two independent SPI interfaces. One is a master-only interface and the other can be either a master or a slave.
Each interface has a 16-byte transmit buffer and a 16-byte receive buffer. To support more flexibility for user applications, the
CYW20732Y has optional I/O ports that can be configured individually and separately for each functional pin.
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CYW20732Y
1.5 Microprocessor Unit
The CYW20732Y microprocessor unit (µPU) executes software from the link control (LC) layer up to the application layer components.
The microprocessor is based on an ARM Cortex-M3, 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units.
The µPU has 320 KB of ROM for program storage and boot-up, 60 KB of RAM for scratch-pad data, and patch RAM code. The SoC
has a total storage of 380 KB, including RAM and ROM.
The internal boot ROM provides power-on reset flexibility, which enables the same device to be used in different HID applications with
an external serial EEPROM or with an external serial flash memory. At power-up, the lowest layer of the protocol stack is executed
from the internal ROM memory.
External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device can
also support the integration of user applications.
1.5.1 EEPROM Interface
The CYW20732Y provides a Broadcom Serial Control (BSC) master interface. BSC is programmed by the CPU to generate four types
of bus transfers: read-only, write-only, combined read/write, and combined write/read. BSC supports both low-speed and fast mode
devices. BSC is compatible with an NXP I2C slave device, except that master arbitration (multiple I2C masters contending for the bus)
is not supported.
The EEPROM can contain customer application configuration information including application code, configuration data, patches,
pairing information, BD_ADDR, baud rate, SDP service record, and file system information used for code.
Native support for the Microchip 24LC128, Microchip 24AA128, and the STMicroelectronics M24128-BR is included.
1.5.2 Serial Flash Interface
The CYW20732Y includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB
slave interface, transmit and receive FIFOs, and the SPI core PHY logic.
Devices natively supported include the following:
■
Atmel® AT25BCM512B
■
MXIC MX25V512ZUI-20G
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PRELIMINARY
CYW20732Y
2. Pin Assignments
2.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Number
Pin Name
I/O Type
Description
1
VBAT
I
RF Power Supply
2
GND
GND
GND
3
GND
GND
GND
4
BT _RF
I/O
Antenna Port for Bluetooth Tx/Rx.
5
GND
GND
GND
6
XIN
I
Crystal oscillator input. See Table 11 for options.
7
XOUT
O
Crystal oscillator output.
8
VDDC_input
I
Baseband power supply
9
VDBL
I
IO pad and core supply
10
SCL
I/O PU
Clock signal for an external I2C device
11
SDA
I/O PU
Data signal for an external I2C device
12
UART_TX
O PU
UART_TX
13
UART_RX
I
UART_RX
14
RESET_N
I/O PU
Active-low system reset with open-drain output and internal pull-up resistor.
15
PUART_RX
GPIO: P0
–
Peripheral UART: puart_tx
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. A/D converter input
2. SPI_2: MOSI (master and slave)
3. IR_RX
4. 60Hz_main
5. GPIO: P0
Not available during TMC=1
16
PUART_TX
GPIO: P33
–
Peripheral UART: puart_rx
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. A/D converter input
2. SPI_2: MOSI (slave only)
3. Auxiliary clock output: ACLK1
4. GPIO: P33
17
VDBL_EE
I
EEPORM power supply
18
PCM_SERO
GPIO: P25
–
SPI_2: MISO (master and slave)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. Peripheral UART: puart_rx
2. GPIO: P25
19
PCM_CLK
GPIO: P24
–
SPI_2: SPI_CLK (master and slave)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. SPI_2: SPI_CLK (master and slave)
2. SPI_1: MISO (master only)
3. Peripheral UART: puart_tx
4. GPIO: P25
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PRELIMINARY
CYW20732Y
Table 1. Pin Descriptions (Cont.)
Pin Number
Pin Name
I/O Type
Description
20
PCM_SERI
P GPIO: P4
–
SPI_2: MOSI (master and slave)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. Peripheral UART: puart_rx
2. IR_TX
3. GPIO: P4
21
PCM_FR
GPIO: P26
PWM0
–
SPI_2: SPI_CS (slave only)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
1. SPI_1: MISO (master only)
2. GPIO: P26
Provides 16 mA drive strength at 3.3V supply
22
GPIO: P11
–
Default Direction: Input
After POR State: Input Floating
Alternate Function Description: 1.A/D converter input
23
GND
GND
Ground
24
GND
GND
Ground
25
GND
GND
Ground
26
GND
GND
Ground
27
EEWEN
I
2.2 Pin Definition
Figure 1 shows the 27-pin number land grid array (LGA) sequence definition.
Figure 1. 27-Pin LGA Sequence Definition
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PRELIMINARY
CYW20732Y
3. Electrical Specifications
3.1 Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
Requirement
Power
Storage Temperature
–
Min
Max
–40° C
125°C
Voltage ripple
–
Max. Values not exceeding Operating voltage (+/- 2%)
Power Supply Absolute Maximum Ratings
VBAT
-
1.4V
Power Supply Absolute Maximum Ratings
VDDC_Input
-
1.4V
Power Supply Absolute Maximum Ratings
VDBL
-
3.8V
Power Supply Absolute Maximum Ratings
VDBL_EE
-
3.8V
3.2 Recommended Operating Conditions
3.2.1 Temperature and Humidity
The CYW20732Y module must withstand the operational requirements shown in Table 3.
Table 3. Temperature and Humidity
Condition
Rating
Description
Operating Temperature
–30°C to 85°C
–
Humidity range
Maximum 95%
Non condensing, relative humidity
3.2.2 Voltage
The power supply for the CYW20732Y module is provided by the host via the power pins.
Table 4. Recommended Voltages
Symbol
Parameter
Min
Typ
Max
Unit
VBAT
–
1.14
1.2
1.26
V
VDDC_Input
–
1.14
1.2
1.26
–
VDBL
–
1.62
–
3.63
–
VDBL_EE
–
1.70
–
3.63
V
3.2.3 Current Consumption
The current consumption ratings will be based on an operating temperature condition of 25°C.
Table 5. Current Consumption
Item
Condition
Min
Nom
Max
Unit
Receive
Receiver and baseband are both operating at 100%
19.0
–
20.8
mA
Transmit
Transmitter and baseband are both operating at 100%
19.0
–
19.7
mA
Sleep
–
1.2
–
1.5
μA
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CYW20732Y
4. RF Specifications
4.1 RF Performance
Table 6. RF Performance
Parameter
Mode and Conditions
Min.
Typ.
Max.
Unit
Receiver Section
Frequency range
RX sensitivity (standard)
Packets: 200, Payload: PRBS 9, Length: 37 Bytes, Dirty
Transmitter: off. PER: 30.8%
Maximum input
2402
–
2480
MHz
–92
–
–
dBm
–10
–
–
dBm
4.2 RF Transmitter Specifications
Table 7. RF Transmitter Specifications
Parameter
Mode and Conditions
Min.
Typ.
Max.
Unit
Transmitter Section
Frequency range
–
2402
–
2480
MHz
Output power adjustment range
–
Output power
–
-20
–
4
dBm
–
3
–
Output power variation
dBm
–
–
2
–
dB
-
–
–
±150
KHz
Frequency drift
–
–
–
±50
kHz
Drift rate
–
–
–
20
kHz/50 µs
Average deviation in payload
(sequence used is 00001111)
–
225
–
275
kHz
Average deviation in payload
(sequence used is 10101010)
–
185
–
–
kHz
Channel spacing
–
–
2
–
MHz
LO Performance
Initial carrier frequency tolerance
Frequency Drift
Frequency Deviation
Note: The RF transmitter specification compliance is to the BT 4.0 standard with conductive measurements.
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CYW20732Y
5. Timing Specifications
5.1 External Reset
Figure 2. External Reset Timing
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CYW20732Y
5.2 Timing and AC Characteristics
5.2.1 SPI Timing
Figure 3. SPI Timing: Modes 0 and 2
Figure 4. SPI Timing: Modes 1 and 3
Table 8. SPI Interface Timing Specifications
Reference
Characteristics
Min
Typ
Max
1
Time from CSN asserted to first clock edge
1 SCK
100
∞
2
Master setup time
–
1/2SCK
–
3
Master hold time
1/2SCK
–
–
4
Slave setup time
–
1/2 SCK
–
5
Slave hold time
1/2 SCK
–
–
6
Time from last clock edge to CSN deasserted
SCK
10 SCK
100
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CYW20732Y
5.2.2 BSC Interface Timing
Figure 5. BSC Interface Timing
Table 9. BSC Interface Timing Specifications
Reference
1
Characteristics
Clock frequencies
Min
Max
Unit
–
100
KHz
–
400
KHz
–
800
KHz
–
1000
KHz
2
START condition setup time
650
–
ns
3
START condition hold time
280
–
ns
4
Clock low time
650
–
ns
5
Clock high time
280
–
ns
6
Data input hold time
0
–
ns
7
Data input setup time
100
–
ns
8
STOP condition setup time
280
–
ns
9
Output valid from clock
–
400
ns
10
Bus free time
650
–
ns
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CYW20732Y
5.2.3 UART Timing
Figure 6. UART Timing
Table 10. UART Timing Specifications
Reference
Characteristics
Min
Max
Unit
1
Delay time, UART_CTS_N low to UART_TXD valid
–
24
Baudout cycles
2
Setup time, UART_CTS_N high before midpoint of stop bit
–
10
ns
3
Delay time, midpoint of stop bit to UART_RTS_N high
–
2
Baudout cycles
5.2.4 Crystal Oscillator
The CYW20732Y is set with a crystal frequency of 24 MHz. The crystal oscillator requires a crystal with an accuracy of ±20 ppm as
defined by the Bluetooth specification. Two external load capacitors in the range of 5 pF to 30 pF are required to function with the
crystal oscillator. The selection of the load capacitors is crystal dependent. Table 11 shows the recommended crystal specification.
Table 11. Crystal Oscillator
Parameter
Symbol
Conditions
Min
Typ
Max
Frequency
–
–
–
24.000
–
Oscillation Mode
–
Fundamental
–
–
–
Unit
MHz
Frequency tolerance
@25°C
–
–
±10
–
ppm
Tolerance stability over temp
@-20°C to +85°C
–
–
±10
–
ppm
Equivalent series resistance
–
–
–
–
50
Ω
Load Capacitance
–
–
–
12
–
pF
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CYW20732Y
6. Mechanical
6.1 Dimensions
The physical dimensions of the CYW20732Y module are 3.5 mm (W) x 3.2 mm (L) x 1.0 mm (H).
Tolerance: ± 0.1 mm
The mechanical dimensions of the CYW20732Y module are 3.5 x 3.2 x 1.0 mm3.
Figure 7. BCM20732Y Mechanical Drawing
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CYW20732Y
6.2 Recommended Footprint
The CYW20732Y module dimension measurement is in mm.
Figure 8. BCM20732Y Recommended Footprint
Notes:
1. Use the NCMD standard to design the main board footprint.
2. There are three types of pads in the module:
a. Type A: pad size: 0.275 x 0.25 mm with a solder mask opening of 0.375 x 0.35 mm.
b. Type B: pad size: 0.3 x 0.25 mm with a solder mask opening of 0.4 x 0.35 mm.
c. Type C: pad size: 0.25 x 0.25 mm with a solder mask opening of 0.35 x 0.35 mm.
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6.3 Recommended Stencil
The CYW20732Y module dimension measurement is in mm.
Figure 9. BCM20732Y Recommended Stencil
Notes:
1. Stencil thickness is 0.08~0.1 mm
2. Type 4 solder paste is recommended.
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CYW20732Y
6.4 Recommended Reflow Profile
Figure 10. Recommended Reflow Profile
0
245 C
Temperature
0
217 C
0
200 C
0
150 C
Pre- heating
Time
Document No. 002-14838 Rev. *B
90~120 sec
Soldering
60~90 sec
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7. Packaging and Storage
7.1 Package Dimensioning
Figure 11. Package Dimensioning
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CYW20732Y
7.2 Laser Mark
Figure 12. Laser Mark
7.3 Pin 1 Location in the Tape/Reel
Figure 13. Pin 1 Location in the Tape/Reel
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CYW20732Y
7.4 Moisture Sensitive Level (MSL)
Figure 14. Moisture Sensitive Level (MSL)
Level 3 䫱䳂3
260ɗ!㓅㮷!371⹎
168 hours 168⮷㗪
MMMDDYYYY 㚰+㖍+大⃫⸜
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CYW20732Y
7.5 SiP Module Tray
The CYW20732Y SiP module tray is shown in Figure 15. The tray dimensions are 3.2 mm x 3.5 mm.
Figure 15. SiP Module Tray
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CYW20732Y
7.6 Product Qualification Report
Table 12 shows the official results for CYW20732Y Bluetooth Connectivity product qualification. The package type is a 3.2 mm x 3.5
mm 27-pin SLG.
Table 12. Product Qualification Report
Test
Specification
Conditions
Sample
Size
Read Point in
hours/cycles
Results
Biased Highly Accelerated Stress Test
(BHAST)
JESD22-A110
130°C, 85% RH
77
96 hours
Pass
Unbiased Highly Accelerated Stress Test
(UHAST)
JESD22-A118
130°C, 85% RH, No bias
77
96 hours
Pass
Temperature Cycle (TC)
JESD22-A104
–55°C to 125°C air-to-air
77
300 cycles
Pass
500 cycles
Pass
1000 cycles
Pass
1500 cycles
Pass
2000 cycles
Pass
500 hours
Pass
1000 hours
Pass
1500 cycles
Pass
High Temperature Storage Life (HTSL)
Thermal Shock (TS)
Moisture Sensitivity Level (MSL)
JESD22-A103
JESD22-A106
JESD22-A113
TA=+150°C
77
–55°C to 125°C liquid-to-liquid 77
Level 3 (30°C, 85% RH)
308
2000 cycles
Pass
300 cycles
Pass
500 cycles
Pass
192 hours
Pass
Note: This is a turn-key module and qualification for this device was completed by the module partner.
Document No. 002-14838 Rev. *B
Page 23 of 26
PRELIMINARY
CYW20732Y
8. Ordering Information
Table 13. Ordering Information
Part Number
CYW20732YB3ISLGH (T)
Note: T represents Tape and Reel.
Document No. 002-14838 Rev. *B
Package
27-pin 27-LGA
(3.5 mm × 3.2 mm x 1.0 mm) package
Description
Bluetooth Low Energy SiP Module
Ambient Operating
Temperature
–55°C to +125°C°
Page 24 of 26
PRELIMINARY
CYW20732Y
Document History Page
Document Title: CYW20732Y Bluetooth Low Energy SiP Module
Document Number: 002-14838
Revision
**
ECN
-
Orig. of
Change
-
Submission
Date
06/10/2015
Description of Change
20732Y-DS100-R
Initial release
*A
-
-
03/07/2016
20732Y-DS101-R
Updated:
• “Features” on cover page.
• Table5. “Current Consumption"
Added:
• “Features” on cover page.
• “SiP Module Tray”.
• “Product Qualification Report”.
• Section 8. “Ordering Information”
*B
5484081
Document No.002-14838 Rev. *B
UTSAV
10/20/2016
Added Cypress Part Numbering Scheme and Mapping Table on Page 1.
Updated to Cypress template.
Page 25 of 26
PRELIMINARY
CYW20732Y
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC®Solutions
Products
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Automotive
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cypress.com/arm
cypress.com/automotive
cypress.com/clocks
cypress.com/interface
cypress.com/iot
cypress.com/powerpsoc
cypress.com/memory
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
Forums | WICED IOT Forums | Projects | Video | Blogs | Training
| Components
Technical Support
cypress.com/support
cypress.com/psoc
cypress.com/touch
cypress.com/usb
cypress.com/wireless
26
© Cypress Semiconductor Corporation, 2015-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document No. 002-14838 Rev. *B
Revised November 3, 2016
Page 26 of 26