MOLEX 73780-1245

This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0737800123
Active
hdm
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal
Module, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.50mm (.098"),
Solder Tail
Documents:
3D Model
Drawing (PDF)
Test Summary (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
Style
Backplane Connectors
73780
Daughtercard, Mezzanine
Solder Tail
PCB Receptacle
hdm
HDM®
N/A
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Series
image - Reference only
72
72
Black
250
No
No
None
Copper-Nickel-Tin
Gold
Tin
High Temperature Thermoplastic
12
Open Pin Field
6
Vertical
0.079 In
2.00 mm
No
None
0.063 In
1.60 mm
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
100
2.5
No
Yes
Yes
EU RoHS
China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Halogen-Free
Need more information on product
environmental compliance?
Email [email protected]
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73780Series
Mates With
HDM® Board-to-Board Backplane Header
73642 , 73643 , 73644 , 73942 , 73943 ,
73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 ,
73782 , 73783 , 73771
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
Voltage - Maximum
15A, 1A
1.0 Gbps
75
No
250V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
5
Wave Capable (TH only)
1
260
Material Info
Reference - Drawing Numbers
Product Specification
PS-73780-999
Sales Drawing
SD-73780-004
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION