PCI Express* Connectors FEATURES AND SPECIFICATIONS Molex’s PCI Express* connector offers greater signaling bandwidths for today’s workstation and server applications PCI Express is a third generation I/O architecture. PCI-SIG* recently updated PCI Express specifications to greater signaling bandwidth. Unlike the previous version in which the PCI bus is implemented via a multi-drop parallel architecture, PCI Express now incorporates a point-to-point signaling using differential pairs operating at 2.5 Gbps. PCI Express provides adequate bandwidth to support developing I/O such as Infiniband and 10G fiber channel. 78028 Vertical Press fit Molex’s press fit version of PCI Express provides an alternative for customers who require solderless termination on PCBs which have a high layer count. All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For more information on these specifications please see www.pcisig.com Features and Benefits High-temperature thermoplastic housing for lead-free processing Complies with PCI-SIG industry specifications ensure connectors Keying design ensures correct mating of card module to edge card support all PCI Express module cards available in the market connector Ridge design will be compatible with module cards that require a retention clip for secure retention Press fit termination allows solderless termination on high layer count PCBs SPECIFICATIONS Reference Information Packaging: Tray UL File No.: Pending CSA File No.: Pending Mates With : PCI Express®* module card Designed In: mm Electrical Voltage: 50 Volts AC (RMS)/DC Current: 1.1 Amps/pin Contact Resistance: 30 milliohms max Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms min Mechanical Max Terminal Retention Force: 2.94 N min/Terminal Mating Force: 1.15 N max/contact pair Un-Mating Force: 0.15 N min/contact pair Durability: 50 Cycles Physical Housing: High Temperature Nylon, Black, UL 94V-0 Contact: Copper Alloy Plating: Contact Area —0.76 µm Gold or 0.38 µm Gold Solder Tail Area — Tin Underplating — Nickel PCB Thickness: See Ordering Tables Operating Temperature: - 55 ºC to +85 ºC *PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG PCI Express EdgeCard Connector Markets and Applications Servers 78028 Vertical Press fit Desktop Mobile Networking and Communications Ordering Information Lead Free Order Number PC Tail Length Recommended PCB Thickness 2.54mm (.100”) 2.3mm (.090”) 2.79mm (.110”) 2.6mm (.100”) 3.43mm (135”) 3.2mm (.125”) 2.54mm (.100”) 2.3mm (.090”) 2.79mm (.110”) 2.6mm (.100”) 78028-1118 3.43mm (135”) 3.2mm (.125”) 78028-0016 2.54mm (.100”) 2.3mm (.090”) 2.79mm (.110”) 2.6mm (.100”) 3.43mm (135”) 3.2mm (.125”) 2.54mm (.100”) 2.3mm (.090”) 2.79mm (.110”) 2.6mm (.100”) 3.43mm (135”) 3.2mm (.125”) Circuits Plating Thickness 78028-0008 0.76µm (30µ") 78028-0108 78028-1108 98 78028-0018 0.38µm (15µ") 78028-0118 0.76µm (30µ") 78028-0116 78028-1116 78028-0026 164 78028-0126 0.38µm (15µ") 78028-1126 Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX [email protected] Order No. SNG-041 Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] Visit our Web site at http://molex.com European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550