Allegro A1120 Chopper stabilized precision hall effect switch Datasheet

A1120, A1121, A1122, and A1125
Chopper Stabilized Precision Hall Effect Switches
Features and Benefits
Description
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The A1120, A1121, A1122, and A1125 Hall-effect, unipolar
switches are extremely temperature-stable and stress-resistant
sensor ICs, especially suited for operation over extended
temperature ranges to 150°C. Superior high-temperature
performance is made possible through dynamic offset
cancellation, which reduces the residual offset voltage normally
caused by device overmolding, temperature dependencies, and
thermal stress.
Unipolar switchpoints
Resistant to physical stress
Superior temperature stability
Output short-circuit protection
Operation from unregulated supply
Reverse battery protection
Solid-state reliability
Small package sizes
Each device includes on a single silicon chip a voltage regulator,
Hall-voltage generator, small-signal amplifier, chopper
stabilization, Schmitt trigger, and a short-circuit protected
open-drain output to sink up to 25 mA.
Packages:
An on-board regulator permits operation with supply voltages
of 3 to 24 V. The advantage of operating down to 3 V is that
the device can be used in 3 V applications or with additional
external resistance in series with the supply pin for greater
protection against high voltage transient events.
3-pin SOT23W (suffix LH)
3-pin SIP (suffix UA)
For the A1120, A1121, and A1122, a south pole of sufficient
strength turns the output on. Removal of the magnetic field
turns the output off. The A1125 is complementary, in that for
these devices, a south pole turns the A1125 output off, and
removal of the magnetic field turns the output on.
Two package styles provide a magnetically optimized package
for most applications. Package type LH is a modified SOT23W,
surface mount package, while UA is a three-lead ultra-mini SIP
for through-hole mounting. Each package type is lead (Pb) free
(suffix, –T), with a 100% matte tin plated leadframe.
Not to scale
Functional Block Diagram
VCC
Amp
Sample and Hold
Dynamic Offset
Cancellation
Regulator
Low-Pass
Filter
To All Subcircuits
VOUT
Control
Current Limit
GND
A1120-DS, Rev. 12
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Selection Guide
Packing1
Mounting
A1120ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1120ELHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
Part Number
A1120EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1120LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1120LLHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1120LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1121ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1121ELHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1121EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1121LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1121LLHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1121LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1122ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1122ELHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1122EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1122LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1122LLHLT-T2
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1122LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1125ELHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1125EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1125LLHLX-T
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
A1125LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
Ambient, TA
Switchpoints
(Typ.)
BOP
BRP
35
25
95
70
150
125
35
25
Output In South (Positive)
Magnetic Field
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
On (logic low)
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
Off (logic high)
–40ºC to 150ºC
*Contact Allegro
2Available
for additional packing options.
through authorized Allegro distributors only.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Absolute Maximum Ratings
Rating
Units
Forward Supply Voltage
Characteristic
Symbol
VCC
Notes
26.5
V
Reverse Supply Voltage
VRCC
–30
V
Output Off Voltage
VOUT
26
V
Continuous Output Current
IOUT
25
mA
Reverse Output Current
IROUT
–50
mA
Range E
–40 to 85
ºC
Range L
–40 to 150
ºC
TJ(max)
165
ºC
Tstg
–65 to 170
ºC
Operating Ambient Temperature
TA
Maximum Junction Temperature
Storage Temperature
GND
Pin-out Diagrams
3
1
2
3
GND
VOUT
2
VCC
1
VOUT
Package UA
VCC
Package LH
Terminal List
Name
VCC
VOUT
GND
Description
Connects power supply to chip
Output from circuit
Ground
Number
Package LH Package UA
1
1
2
3
3
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
ELECTRICAL CHARACTERISTICS Valid valid over full operating voltage and ambient temperature ranges; unless otherwise noted
Characteristics
Min.
Typ.1
Max.
Unit2
Operating, TJ < 165°C
3
–
24
V
A1120,
A1121,
A1122
VOUT = 24 V, B < BRP
–
–
10
μA
A1125
VOUT = 24 V, B > BOP
–
–
10
μA
VOUT(SAT)
A1120,
A1121,
A1122
IOUT = 20 mA, B > BOP
–
185
500
mV
A1125
IOUT = 20 mA, B < BRP
–
185
500
mV
IOM
A1120,
A1121,
A1122
B > BOP
30
–
60
mA
A1125
B < BRP
30
–
60
mA
–
–
25
μs
–
800
–
kHz
Symbol
Test Conditions
Electrical Characteristics
Forward Supply Voltage
Output Leakage Current
Output Saturation Voltage
Output Current Limit
VCC
IOUTOFF
VCC > 3.0 V, B < BRP(min) – 10 G,
B > BOP(max) + 10 G
Power-On Time3
tPO
Chopping Frequency
fC
Output Rise Time3,4
tr
RL = 820 Ω, CS = 20 pF
–
0.2
2
μs
Output Fall Time3,4
tf
RL = 820 Ω, CS = 20 pF
–
0.1
2
μs
ICC(ON)
A1120,
A1121,
A1122
VCC = 12 V, B > BOP
–
–
4
mA
A1125
VCC = 12 V, B < BRP
–
–
4
mA
ICC(OFF)
A1120,
A1121,
A1122
VCC = 12 V, B < BRP
–
–
4
mA
A1125
VCC = 12 V, B > BOP
Supply Current
Reverse Supply Current
IRCC
–
–
4
mA
VRCC = –30 V
–
–
–5
mA
Supply Zener Clamp Voltage
VZ
ICC = 5 mA; TA = 25°C
28
–
–
V
Zener Impedance
IZ
ICC = 5 mA; TA = 25°C
–
50
–
Ω
Magnetic Characteristics
Operate Point
Release Point
Hysteresis
BOP
BRP
BHYS
A1120
–
35
50
G
A1121
50
95
135
G
A1122
120
150
200
G
A1125
–
35
50
G
A1120
5
25
–
G
A1121
40
70
110
G
A1122
110
125
190
G
A1125
5
25
–
G
–
10
–
G
10
25
42
G
A1120,
A1125
(BOP – BRP)
A1121,
A1122
1Typical
data are are at TA = 25°C and VCC = 12 V, and are for initial design estimations only.
G (gauss) = 0.1 mT (millitesla).
3Guaranteed by device design and characterization.
4C = oscilloscope probe capacitance.
S
21
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions
RθJA
Maximum Allowable VCC (V)
Package Thermal Resistance
Value Units
Package LH, 1-layer PCB with copper limited to solder pads
228
ºC/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each
side connected by thermal vias
110
ºC/W
Package UA, 1-layer PCB with copper limited to solder pads
165
ºC/W
Power Derating Curve
TJ(max) = 165ºC; ICC = ICC(max)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
Package LH, 2-layer PCB
(RQJA = 110 ºC/W)
Package UA, 1-layer PCB
(RQJA = 165 ºC/W)
Package LH, 1-layer PCB
(RQJA = 228 ºC/W)
VCC(min)
20
40
60
80
100
120
140
160
180
Power Dissipation, PD (mW)
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Pa
(R cka
ge
QJ
A =
L
11 H, 2
0 º -la
Pac
C/ ye
W
(R kage
) r PC
UA
QJA =
B
165 , 1-la
y
ºC/
W) er PC
B
Pac
k
(R age LH
,
QJA =
228 1-laye
ºC/W r PC
B
)
20
40
60
80
100
120
Temperature (°C)
140
160
180
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Characteristic Performance
A1120, A1121, and A1125 Electrical Characteristics
Average Supply Current (On) versus Ambient Temperature
Average Supply Current (On) versus Average Supply Voltage
6.0
6.0
5.5
5.5
5.0
5.0
4.5
4.0
VCC (V)
3.5
3.0
12
24
3.0
2.5
2.0
ICC(av) (mA)
ICC(av) (mA)
4.5
4.0
–40
3.0
25
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
150
0
0
- 60
TA (°C)
3.5
- 40
- 20
0
20
40
60
80
2
100 120 140 160
6
10
TA (°C)
Average Supply Current (Off) versus Ambient Temperature
6.0
5.5
5.0
5.0
VCC (V)
4.0
3.5
3.0
12
24
3.0
2.5
2.0
ICC(av) (mA)
ICC(av) (mA)
26
4.5
4.5
TA (°C)
4.0
3.5
–40
3.0
2.5
25
2.0
150
1.5
1.5
1.0
1.0
0.5
0.5
0
0
- 40
- 20
0
20
40
60
80
2
100 120 140 160
6
10
TA (°C)
14
18
22
26
VCC (V)
Average Output Saturation Voltage versus Supply Voltage
Average Output Saturation Voltage versus Ambient Temperature
300
300
250
250
200
VCC (V)
3.0
3.8
4.2
12
24
150
100
VOUT(sat) (V)
VOUT(sat) (V)
22
Average Supply Current (Off) versus Average Supply Voltage
5.5
200
TA (°C)
–40
150
25
100
150
50
50
0
0
- 60
18
VCC (V)
6.0
- 60
14
- 40
- 20
0
20
40
60
TA (°C)
80
100 120 140 160
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
A1120 and A1125 Magnetic Characteristics
Average Operate Point versus Ambient Temperature
50
50
45
45
40
40
VCC (V)
30
3.0
25
24
20
35
BOP (G)
35
BOP (G)
Average Operate Point versus Average Supply Voltage
–40
25
25
20
150
15
15
10
10
5
5
0
TA (°C)
30
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
2
6
10
TA (°C)
22
26
Average Release Point versus Average Supply Voltage
50
50
45
45
40
40
35
35
30
VCC (V)
25
3.0
20
BRP (G)
BRP (G)
18
VCC (V)
Average Release Point versus Ambient Temperature
24
15
30
TA (°C)
25
–40
20
25
15
150
10
10
5
5
0
0
-60 -40 -20
0
20
40
60
80
2
100 120 140 160
6
10
TA (°C)
14
18
22
26
VCC (V)
Average Switchpoint Hysteresis versus Supply Voltage
Average Switchpoint Hysteresis versus Ambient Temperature
20
20
18
18
16
16
12
VCC (V)
10
3.0
8
24
BHYS (G)
14
BHYS (G)
14
14
12
TA (°C)
10
–40
25
8
6
6
4
4
2
2
150
0
0
-60
-40
-20
0
20
40
60
TA (°C)
80
100 120 140 160
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
A1121 Magnetic Characteristics
Operate Point versus Average Supply Voltage
140
140
130
130
120
120
110
VCC (V)
100
3.0
12
24
90
BOP (G)
BOP (G)
Operate Point versus Ambient Temperature
110
TA (°C)
100
–40
80
80
70
70
60
60
50
- 60 - 40 - 20
50
0
20
40
60
80
25
90
100 120 140 160
150
2
6
10
TA (°C)
110
100
100
90
90
80
VCC (V)
70
3.0
12
24
BRP (G)
BRP (G)
22
26
Release Point versus Average Supply Voltage
110
60
TA (°C)
80
–40
70
25
150
60
50
50
- 60 - 40 - 20
0
20
40
60
80
40
100 120 140 160
2
6
10
TA (°C)
18
22
26
Switchpoint Hysteresis versus Supply Voltage
40
35
35
30
VCC (V)
3.0
12
24
25
20
15
BHYS (G)
40
10
- 60 - 40 - 20
14
VCC (V)
Switchpoint Hysteresis versus Ambient Temperature
BHYS (G)
18
VCC (V)
Release Point versus Ambient Temperature
40
14
30
TA (°C)
25
–40
20
150
25
15
0
20
40
60
TA (°C)
80
100 120 140 160
10
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
A1122 Magnetic Characteristics
Operate Point versus Ambient Temperature
Operate Point versus Average Supply Voltage
200
200
190
190
180
VCC (V)
170
3.0
12
24
160
150
BOP (G)
BOP (G)
180
–40
160
25
150
150
140
140
130
130
120
- 60 - 40 - 20
TA (°C)
170
120
0
20
40
60
80
100 120 140 160
2
6
10
TA (°C)
180
170
170
160
VCC (V)
150
3.0
12
24
BRP (G)
BRP (G)
190
180
140
26
160
TA (°C)
150
–40
25
140
130
130
120
120
150
110
0
20
40
60
80
100 120 140 160
2
6
10
TA (°C)
14
18
22
26
VCC (V)
Switchpoint Hysteresis versus Supply Voltage
Switchpoint Hysteresis versus Ambient Temperature
40
40
35
35
30
VCC (V)
3.0
12
24
25
20
BHYS (G)
BHYS (G)
22
Release Point versus Average Supply Voltage
190
30
TA (°C)
25
–40
20
150
25
15
15
10
- 60 - 40 - 20
18
VCC (V)
Release Point versus Ambient Temperature
110
- 60 - 40 - 20
14
0
20
40
60
TA (°C)
80
100 120 140 160
10
2
6
10
14
18
22
26
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Functional Description
Operation
The output of the A1120, A1121, and A1122 devices switches
low (turns on) when a magnetic field perpendicular to the Hall
element exceeds the operate point threshold, BOP (see panel A of
figure 1). When the magnetic field is reduced below the release
point, BRP , the device output goes high (turns off). The output
of the A1125 devices switches high (turns off) when a magnetic
field perpendicular to the Hall element exceeds the operate point
threshold, BOP (see panel B of figure 1). When the magnetic field
is reduced below the release point, BRP , the device output goes
low (turns on).
After turn-on, the output voltage is VOUT(SAT) . The output transistor is capable of sinking current up to the short circuit current
limit, IOM, which is a minimum of 30 mA.
The difference in the magnetic operate and release points is the
hysteresis, BHYS , of the device. This built-in hysteresis allows
clean switching of the output even in the presence of external
mechanical vibration and electrical noise. Powering-on the device
in the hysteresis range (less than BOP and higher than BRP) will
Extensive applications information for Hall effect devicers is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Guidelines for Designing Subassemblies Using Hall-Effect
Devices, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and ThroughHole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702, and
the Allegro Web site, www.allegromicro.com.
VS
VCC
VOUT
VOUT
It is strongly recommended that an external bypass capacitor be
connected (in close proximity to the Hall element) between the
supply and ground of the device to reduce external noise in the
application. As is shown in panel B of figure 1, a 0.1 μF capacitor
is typical.
V+
Switch to Low
Switch to Low
Switch to High
VCC
Applications
Switch to High
V+
give an indeterminate output state. The correct state is attained
after the first excursion beyond BOP or BRP .
VOUT(SAT)
0
BRP
B+
BHYS
BHYS
(A)
(B)
RL
VOUT
VOUT(SAT)
0
BOP
BOP
0
BRP
0
VCC
A112x
CBYP
0.1 μF
Output
GND
B+
(C)
Figure 1. Device switching behavior. In panels A and B, on the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength.
This behavior can be exhibited when using an electrical circuit such as that shown in panel C.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Chopper Stabilization Technique
When using Hall effect technology, a limiting factor for
switchpoint accuracy is the small signal voltage developed across
the Hall element. This voltage is disproportionally small relative
to the offset that can be produced at the output of the Hall element. This makes it difficult to process the signal while maintaining an accurate, reliable output over the specified operating
temperature and voltage ranges.
Chopper stabilization is a unique approach used to minimize
Hall offset on the chip. The patented Allegro technique, namely
Dynamic Quadrature Offset Cancellation, removes key sources
of the output drift induced by thermal and mechanical stresses.
This offset reduction technique is based on a signal modulationdemodulation process. The undesired offset signal is separated
from the magnetic field-induced signal in the frequency domain,
through modulation. The subsequent demodulation acts as a
modulation process for the offset, causing the magnetic field
induced signal to recover its original spectrum at baseband, while
the dc offset becomes a high-frequency signal. The magnetic
sourced signal then can pass through a low-pass filter, while the
modulated DC offset is suppressed. This configuration is illustrated in figure 2.
The chopper stabilization technique uses a 400 kHz high frequency clock. For demodulation process, a sample and hold
technique is used, where the sampling is performed at twice the
chopper frequency (800 kHz). This high-frequency operation
allows a greater sampling rate, which results in higher accuracy
and faster signal-processing capability. This approach desensitizes the chip to the effects of thermal and mechanical stresses,
and produces devices that have extremely stable quiescent Hall
output voltages and precise recoverability after temperature
cycling. This technique is made possible through the use of a
BiCMOS process, which allows the use of low-offset, low-noise
amplifiers in combination with high-density logic integration and
sample-and-hold circuits.
The repeatability of magnetic field-induced switching is affected
slightly by a chopper technique. However, the Allegro high
frequency chopping approach minimizes the affect of jitter and
makes it imperceptible in most applications. Applications that are
more likely to be sensitive to such degradation are those requiring
precise sensing of alternating magnetic fields; for example, speed
sensing of ring-magnet targets. For such applications, Allegro
recommends its digital device families with lower sensitivity
to jitter. For more information on those devices, contact your
Allegro sales representative.
Regulator
Hall Element
Amp
Sample and
Hold
Clock/Logic
Low-Pass
Filter
Figure 2. Model of chopper stabilization technique
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RJC, is relatively
small component of RJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × IIN

T = PD × RJA
TJ = TA + ΔT
(1)
(2)
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 1.6 mA, and RJA = 165 °C/W, then:
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
Example: Reliability for VCC at TA = 150°C, package LH, using a
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RJA = 228°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and
ICC(max) = 4 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax ÷ RJA = 15°C ÷ 228 °C/W = 66 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 66 mW ÷ 4 mA = 16.5 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est)
and VCC(max) is reliable under these conditions.
PD = VCC × ICC = 12 V × 1.6 mA = 19 mW

T = PD × RJA = 19 mW × 165 °C/W = 3°C
TJ = TA + T = 25°C + 3°C = 28°C
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Package LH, 3-Pin (SOT-23W)
+0.12
2.98 –0.08
1.49 D
4°±4°
3
A
+0.020
0.180–0.053
0.96 D
+0.10
2.90 –0.20
+0.19
1.91 –0.06
2.40
0.70
D
0.25 MIN
1.00
2
1
0.55 REF
0.25 BSC
0.95
Seating Plane
Gauge Plane
8X 10° REF
B
PCB Layout Reference View
Branded Face
1.00 ±0.13
+0.10
0.05 –0.05
0.95 BSC
0.40 ±0.10
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
Active Area Depth, 0.28 mm REF
B
Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
C
Branding scale and appearance at supplier discretion
D
Hall element, not to scale
NNT
1
C
Standard Branding Reference View
N = Last two digits of device part number
T = Temperature code
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13
A1120, A1121, A1122
and A1125
Chopper Stabilized Precision Hall Effect Switches
Package UA, 3-Pin SIP
+0.08
4.09 –0.05
45°
B
C
E
2.04
1.52 ±0.05
1.44 E
Mold Ejector
Pin Indent
+0.08
3.02 –0.05
E
Branded
Face
45°
1
2.16
MAX
D Standard Branding Reference View
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
0.79 REF
A
0.51
REF
NNT
1
2
3
+0.03
0.41 –0.06
15.75 ±0.51
For Reference Only; not for tooling use (reference DWG-9049)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
Dambar removal protrusion (6X)
B Gate burr area
C Active Area Depth, 0.50 mm REF
+0.05
0.43 –0.07
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
1.27 NOM
Copyright ©2009-2010, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
14