A705 200mA ~ 300mA ADVANCED CURRENT REGULATOR www.addmtek.com DESCRIPTION FEATURES The A705 is a low dropout current regulator rated for 210mA, 230mA, 250mA, 270mA, and 290mA constant sink current. The low quiescent current and low dropout voltage are achieved by advanced Bi-CMOS process. Only bypass capacitor is required. 210/230/250/270/290mA constant sink current. Output short / open circuit protection. Low dropout voltage. Low quiescent current. Supply voltage range 2.7V ~ 12V. 2KV HBM ESD protection. Advanced Bi-CMOS process. SOT-89 and TO-252 package available. TYPICAL APPLICATION CIRCUIT APPLICATIONS V LED+ Power LED Driver LED Cap-Lamp C BP PACKAGE PIN OUT VDD VDD V DD VDD OUT GND A705X OUT GND OUT C IN GND SOT-89 TO-252 (Top View) ORDER INFORMATION Output Current 200mA ~ 220mA 220mA ~ 240mA 240mA ~ 260mA 260mA ~ 280mA 280mA ~ 300mA N SOT-89 3-pin A705NFT-210 A705NFT-230 A705NFT-250 A705NFT-270 A705NFT-290 S TO-252 3-pin A705SFT-210 A705SFT-230 A705SFT-250 A705SFT-270 A705SFT-290 Note: The letter ”F” is marked for Lead Free process, and letter “T” is marked for Tape & Reel. Copyright © 2007 ADDtek Corp. 1 DD077_A -- AUGUST 2007 A705 ABSOLUTE MAXIMUM RATINGS (Note) -0.3V to 13.2V -0.3V to 17V 150°C -40°C to 150°C 260°C Input Voltage, VDD Output Voltage, VOUT Maximum Junction Temperature, TJ Storage Temperature Range Lead Temperature (Soldering, 10 seconds) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. BLOCK DIAGRAM A705 OUT Band-gap Reference VDD Control Circuit GND PIN DESCRIPTION Pin Name Pin Function VDD Power supply. OUT Output pins. Connected to load. GND Ground. THERMAL RESISTANCE Package θJT (°C /W) N SOT-89 35 S TO-252 7 Copyright © 2007 ADDtek Corp. Note: TJ = TC + (PD × θJT) θJT: Thermal Resistance - Junction to Tab. TC: Case (Tab) Temperature. TJ: Junction Temperature. PD: Power Consumption. 2 DD077_A -- AUGUST 2007 A705 RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Sink Current Operating Free-air Temperature Range Symbol Min VDD IOUT TA 2.7 Typ -40 Max Unit 12 260 +85 V mA °C DC ELECTRICAL CHARACTERISTICS VDD=3.7V, TA=25°C, No Load (Unless otherwise noted) Parameter Output Sink Current Symbol IOUT Condition VOUT=0.2V Min Typ Max A705P 200 210 220 A705Q 220 230 240 A705R 240 250 260 A705S 260 270 280 A705T 280 290 300 Unit Apply Pin mA OUT Load Regulation VOUT=0.2V to 3V 2 mA/V Line Regulation VDD= 3V to 12V, VOUT=0.2V 2 mA/V Output Dropout Voltage (Note) VOUTL 120 mV Supply Current Consumption IDD 200 uA VDD Note: Output dropout voltage: 90% x IOUT @ VOUT=200mV Copyright © 2007 ADDtek Corp. 3 DD077_A -- AUGUST 2007 A705 APPLICATION INFORMATION The Maximum Power Dissipation on Regulator: PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ VOUT(MAX) = the maximum voltage on output pin; IOUT(NOM) = the nominal output current; IQ = the quiescent current the regulator consumes at IOUT(MAX); VIN(MAX) = the maximum input voltage. Thermal Consideration: The A705 has internal power and thermal limiting circuitry designed to protect the device under overload conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of A705 prevents the device from damage due to excessive power dissipation. When the device temperature rises to approximately 150°C, the regulator will be turned off. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252 package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C. The junction temperature is: TJ = PD (θJT +θCS +θSA ) + TA PD : Dissipated power. θJT : T hermal resistance from the junction to the mounting tab of the package. hermal resistance through the interface between the IC and the surface on which it is mounted. θCS : T (typically, θCS < 1.0°C /W) θSA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through-hole vias. PCB θSA (°C /W) 2 PCB heat sink size (mm ) Copyright © 2007 ADDtek Corp. 59 500 45 1000 38 1500 4 33 2000 27 3000 24 4000 DD077_A 21 5000 -- AUGUST 2007 A705 PACKAGE Top Marking for SOT-89 X : Output Current Options P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA A705X YWWVV Y : Year Code WW : Week Code V : Vendor Code 3-Pin Surface Mount SOT-89 INCHES A C D L B K N E M F J G H MIN TYP MAX MIN TYP MAX A 0.173 - 0.181 4.39 - 4.59 B 0.090 - 0.102 2.28 - 2.59 C 0.055 - 0.063 1.39 - 1.60 D 0.015 - 0.017 0.38 - 0.43 E 0.084 - 0.090 2.13 - 2.28 F 0.016 - 0.019 0.33 - 0.48 G 0.059 BSC 1.49 BSC H 0.118 BSC 2.99 BSC J 0.018 - 0.022 0.45 - 0.55 K 0.155 - 0.167 3.94 - 4.24 L 0.067 - 0.072 1.70 - 1.82 M 0° N 0.035 Copyright © 2007 ADDtek Corp. 5 MILLIMETERS - 8° 0° - 8° - 0.047 0.89 - 1.19 DD077_A -- AUGUST 2007 A705 Top Marking for TO-252 X : Output Current Options P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA A705X YWWVV LLLLL.L Y : Year Code WW : Week Code V : Vendor Code LLLLL.L : Lot Number 3-Pin Surface Mount TO-252 INCHES MIN TYP MAX MIN TYP MAX 0.086 - 0.094 2.18 - 2.39 A1 0.040 - 0.050 1.02 - 1.27 0.024 - - 0.61 - - 0.215 5.21 - 5.46 0.018 - 0.023 0.46 - 0.58 c1 0.018 - 0.023 0.46 - 0.58 D 0.210 - 0.220 5.33 - 5.59 E - 0.265 6.35 - 6.73 A E b2 A1 c1 A L2 SEATING PLAN b - b2 0.205 D L1 b e c H L c e1 Copyright © 2007 ADDtek Corp. MILLIMETERS 6 0.250 e 0.090 BSC 2.29 BSC e1 0.180 BSC 4.58 BSC H 0.370 - 0.410 9.40 - 10.41 L 0.020 - - 0.51 - - L1 0.025 - 0.040 0.64 - 1.02 L2 0.060 - 0.080 1.52 - 2.03 DD077_A -- AUGUST 2007 A705 IMPORTANT NOTICE ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale. ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196 Copyright © 2007 ADDtek Corp. 7 DD077_A -- AUGUST 2007