Data Sheet Dual, 10-Bit nanoDAC with 2 ppm/°C Reference, SPI Interface AD5313R FEATURES FUNCTIONAL BLOCK DIAGRAM VDD Low drift 2.5 V reference: 2 ppm/°C typical Tiny package: 3 mm × 3 mm, 16-lead LFCSP Total unadjusted error (TUE): ±0.1% of FSR maximum VLOGIC VREF GND AD5313R 2.5V REFERENCE SYNC SDIN INTERFACE LOGIC SCLK Offset error: ±1.5 mV maximum Gain error: ±0.1% of FSR maximum High drive capability: 20 mA, 0.5 V from supply rails User selectable gain of 1 or 2 (GAIN pin) Reset to zero scale or midscale (RSTSEL pin) 1.8 V logic compatibility 50 MHz SPI with readback or daisy chain Low glitch: 0.5 nV-sec Robust 4 kV HBM and 1.5 kV FICDM ESD ratings Low power: 3.3 mW at 3 V 2.7 V to 5.5 V power supply −40°C to +105°C temperature range INPUT REGISTER DAC REGISTER STRING DAC A VOUTA BUFFER INPUT REGISTER DAC REGISTER STRING DAC B VOUTB BUFFER POWER-ON RESET GAIN = ×1/×2 RSTSEL GAIN LDAC RESET POWERDOWN LOGIC 11254-001 SDO Figure 1. APPLICATIONS Optical transceivers Base station power amplifiers Process control (PLC I/O cards) Industrial automation Data acquisition systems GENERAL DESCRIPTION Table 1. Related Devices The AD5313R, a member of the nanoDAC® family, is a low power, dual, 10-bit buffered voltage output digital-to-analog converter (DAC). The device includes a 2.5 V, 2 ppm/°C internal reference (enabled by default) and a gain select pin giving a full-scale output of 2.5 V (gain = 1) or 5 V (gain = 2). The AD5313R operates from a single 2.7 V to 5.5 V supply, is guaranteed monotonic by design, and exhibits less than 0.1% FSR gain error and 1.5 mV offset error performance. The device is available in a 3 mm × 3 mm LFCSP package and a TSSOP package. Interface SPI The AD5313R also incorporates a power-on reset circuit and a RSTSEL pin that ensures that the DAC outputs power up to zero scale or midscale and remain there until a valid write occurs. The part contains a per channel power-down feature that reduces the current consumption of the device to 4 µA at 3 V while in power-down mode. The AD5313R employs a versatile serial peripheral interface (SPI) that operates at clock rates up to 50 MHz, and the device contains a VLOGIC pin that is intended for 1.8 V/3 V/5 V logic. Rev. 0 I2 C 1 Reference Internal External Internal External 12-Bit AD5687R AD5687 AD5697R N/A 10-Bit N/A AD53131 AD5338R1 AD53381 The AD5313R and the AD5313 are not pin-to-pin or software compatible; likewise, the AD5338R and the AD5338 are not pin-to-pin or software compatible. PRODUCT HIGHLIGHTS 1. 2. 3. Precision DC Performance. Total unadjusted error: ±0.1% of FSR maximum Offset error: ±1.5 mV maximum Gain error: ±0.1% of FSR maximum Low Drift 2.5 V On-Chip Reference. 2 ppm/°C typical temperature coefficient 5 ppm/°C maximum temperature coefficient Two Package Options. 3 mm × 3 mm, 16-lead LFCSP 16-lead TSSOP Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD5313R Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Write and Update Commands .................................................. 20 Applications ....................................................................................... 1 Daisy-Chain Operation ............................................................. 20 Functional Block Diagram .............................................................. 1 Readback Operation .................................................................. 21 General Description ......................................................................... 1 Power-Down Operation ............................................................ 21 Product Highlights ........................................................................... 1 Load DAC (Hardware LDAC Pin) ........................................... 22 Revision History ............................................................................... 2 LDAC Mask Register ................................................................. 22 Specifications..................................................................................... 3 Hardware Reset (RESET) .......................................................... 23 AC Characteristics ........................................................................ 4 Reset Select Pin (RSTSEL) ........................................................ 23 Timing Characteristics ................................................................ 5 Internal Reference Setup ........................................................... 23 Daisy-Chain and Readback Timing Characteristics................ 6 Solder Heat Reflow ..................................................................... 23 Absolute Maximum Ratings ............................................................ 8 Long-Term Temperature Drift ................................................. 23 ESD Caution .................................................................................. 8 Thermal Hysteresis .................................................................... 24 Pin Configurations and Function Descriptions ........................... 9 Applications Information .............................................................. 25 Typical Performance Characteristics ........................................... 10 Microprocessor Interfacing ....................................................... 25 Terminology .................................................................................... 16 AD5313R to ADSP-BF531 Interface ....................................... 25 Theory of Operation ...................................................................... 18 AD5313R to SPORT Interface .................................................. 25 Digital-to-Analog Converter (DAC) ....................................... 18 Layout Guidelines....................................................................... 25 Transfer Function ....................................................................... 18 Galvanically Isolated Interface ................................................. 25 DAC Architecture ....................................................................... 18 Outline Dimensions ....................................................................... 26 Serial Interface ............................................................................ 19 Ordering Guide .......................................................................... 26 Standalone Operation ................................................................ 20 REVISION HISTORY 2/13—Revision 0: Initial Version Rev. 0 | Page 2 of 28 Data Sheet AD5313R SPECIFICATIONS VDD = 2.7 V to 5.5 V; 1.8 V ≤ VLOGIC ≤ 5.5 V; all specifications TMIN to TMAX, unless otherwise noted. RL = 2 kΩ; CL = 200 pF. Table 2. Parameter STATIC PERFORMANCE 1 Resolution Relative Accuracy Differential Nonlinearity Zero-Code Error Offset Error Full-Scale Error Gain Error Total Unadjusted Error Min Short-Circuit Current 4 Load Impedance at Rails 5 Power-Up Time REFERENCE OUTPUT Output Voltage 6 Reference Temperature Coefficient 7, 8 Output Impedance2 Output Voltage Noise2 Output Voltage Noise Density2 Load Regulation Sourcing2 Load Regulation Sinking2 Output Current Load Capability2 Line Regulation2 Long-Term Stability/Drift2 Thermal Hysteresis2 LOGIC INPUTS2 Input Current Input Low Voltage (VINL) Input High Voltage (VINH) Pin Capacitance ±0.12 ±0.5 ±0.5 1.5 ±1.5 ±0.1 ±0.1 ±0.1 ±0.2 Unit Test Conditions/Comments ±1 ±1 0.15 Bits LSB LSB mV mV % of FSR % of FSR % of FSR % of FSR µV/°C ppm mV/V ±2 ±3 ±2 µV µV/mA µV Due to single-channel, full-scale output change Due to load current change Due to powering down (per channel) Gain = 1 Gain = 2; see Figure 29 RL = ∞ RL = 1 kΩ 80 V V nF nF kΩ µV/mA 80 µV/mA 40 25 2.5 mA Ω µs 0.4 +0.1 +0.01 ±0.02 ±0.01 0 0 Capacitive Load Stability Resistive Load 3 Load Regulation Max 10 Offset Error Drift 2 Gain Temperature Coefficient2 DC Power Supply Rejection Ratio2 DC Crosstalk2 OUTPUT CHARACTERISTICS2 Output Voltage Range Typ VREF 2 × VREF 2 10 1 2.4975 2 0.04 12 240 2.5025 5 20 40 ±5 100 12 125 25 ±2 0.3 × VLOGIC 0.7 × VLOGIC 2 Rev. 0 | Page 3 of 28 Guaranteed monotonic by design All 0s loaded to DAC register All 1s loaded to DAC register External reference; gain = 2; TSSOP Internal reference; gain = 1; TSSOP Of FSR/°C DAC code = midscale; VDD = 5 V ± 10% 5 V ± 10%, DAC code = midscale; −30 mA ≤ IOUT ≤ 30 mA 3 V ± 10%, DAC code = midscale; −20 mA ≤ IOUT ≤ 20 mA See Figure 29 Coming out of power-down mode; VDD = 5 V V ppm/°C Ω µV p-p nV/√Hz µV/mA µV/mA mA µV/V ppm ppm ppm At ambient See the Terminology section µA V V pF Per pin 0.1 Hz to 10 Hz At ambient; f = 10 kHz, CL = 10 nF At ambient At ambient VDD ≥ 3 V At ambient After 1000 hours at 125°C First cycle Additional cycles AD5313R Parameter LOGIC OUTPUTS (SDO)2 Output Low Voltage (VOL) Output High Voltage (VOH) Floating State Output Capacitance POWER REQUIREMENTS VLOGIC ILOGIC VDD Data Sheet Min Typ Max Unit Test Conditions/Comments 0.4 V V pF ISINK = 200 µA ISOURCE = 200 µA 5.5 3 5.5 5.5 V µA V V 0.7 1.3 4 6 mA mA µA µA VLOGIC − 0.4 4 1.8 2.7 VREF + 1.5 IDD Normal Mode 9 0.59 1.1 1 All Power-Down Modes 10 Gain = 1 Gain = 2 VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V Internal reference off Internal reference on, at full scale −40°C to +85°C −40°C to +105°C DC specifications tested with the outputs unloaded, unless otherwise noted. Upper dead band = 10 mV; it exists only when VREF = VDD with gain = 1 or when VREF/2 = VDD with gain = 2. Linearity calculated using a reduced code range of 4 to 1020. 2 Guaranteed by design and characterization; not production tested. 3 Channel A can have an output current of up to 30 mA. Similarly, Channel B can have an output current of up to 30 mA, up to a junction temperature of 110°C. 4 VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature may be exceeded during current limit, but operation above the specified maximum operation junction temperature can impair device reliability. 5 When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output devices. For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 29). 6 Initial accuracy presolder reflow is ±750 µV; output voltage includes the effects of preconditioning drift. See the Internal Reference Setup section. 7 Reference is trimmed and tested at two temperatures and is characterized from −40°C to +105°C. 8 Reference temperature coefficient is calculated as per the box method. See the Terminology section for more information. 9 Interface is inactive, both DACs are active, and DAC outputs are unloaded. 10 Both DACs are powered down. 1 AC CHARACTERISTICS VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; 1.8 V ≤ VLOGIC ≤ 5.5 V; all specifications TMIN to TMAX, unless otherwise noted. Temperature range = −40°C to +105°C, typical at 25°C. Guaranteed by design and characterization; not production tested. Table 3. Parameter 1 Output Voltage Settling Time Slew Rate Digital-to-Analog Glitch Impulse Digital Feedthrough Digital Crosstalk Analog Crosstalk DAC-to-DAC Crosstalk Total Harmonic Distortion (THD) 2 Output Noise Spectral Density (NSD) Output Noise Signal-to-Noise Ratio (SNR) Spurious Free Dynamic Range (SFDR) Signal-to-Noise-and-Distortion Ratio (SINAD) 1 2 Min Typ 5 0.8 0.5 0.13 0.1 0.2 0.3 −80 300 6 90 83 80 Max 7 See the Terminology section. Digitally generated sine wave at 1 kHz. Rev. 0 | Page 4 of 28 Unit µs V/µs nV-sec nV-sec nV-sec nV-sec nV-sec dB nV/√Hz µV p-p dB dB dB Test Conditions/Comments ¼ to ¾ scale settling to ±2 LSB 1 LSB change around major carry At ambient, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz DAC code = midscale, 10 kHz; gain = 2 0.1 Hz to 10 Hz At ambient, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz At ambient, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz At ambient, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz Data Sheet AD5313R TIMING CHARACTERISTICS All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 2. VDD = 2.7 V to 5.5 V, 1.8 V ≤ VLOGIC ≤ 5.5 V, VREF = 2.5 V. All specifications TMIN to TMAX, unless otherwise noted. Table 4. Parameter 1 t1 t2 t3 t4 t5 t6 t7 t8 1.8 V ≤ VLOGIC < 2.7 V Min Max 33 16 16 15 5 5 15 20 2.7 V ≤ VLOGIC ≤ 5.5 V Min Max 20 10 10 10 5 5 10 20 Unit ns ns ns ns ns ns ns ns t9 t10 t11 t12 t13 t14 Power-Up Time 16 25 30 20 30 30 4.5 10 15 20 20 30 30 4.5 ns ns ns ns ns ns µs Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V, 2.7 V ≤ VLOGIC ≤ VDD. Guaranteed by design and characterization; not production tested. t9 t1 SCLK t8 t3 t4 t2 t7 SYNC t6 t5 SDIN DB23 DB0 t12 t10 LDAC1 t11 LDAC2 RESET VOUTX t13 t14 11254-002 1 Description SCLK cycle time SCLK high time SCLK low time SYNC to SCLK falling edge setup time Data setup time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time (update single channel or both channels) SYNC falling edge to SCLK fall ignore LDAC pulse width low SCLK falling edge to LDAC rising edge SCLK falling edge to LDAC falling edge RESET minimum pulse width low RESET pulse activation time Time that is required to exit power-down mode and enter the normal mode of operation; 24th clock edge to 90% of DAC midscale value with output unloaded 1ASYNCHRONOUS LDAC UPDATE MODE. 2SYNCHRONOUS LDAC UPDATE MODE. Figure 2. Serial Write Operation Rev. 0 | Page 5 of 28 AD5313R Data Sheet DAISY-CHAIN AND READBACK TIMING CHARACTERISTICS All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 4 and Figure 5. VDD = 2.7 V to 5.5 V, 1.8 V ≤ VLOGIC ≤ 5.5 V, VREF = 2.5 V. All specifications TMIN to TMAX, unless otherwise noted. VDD = 2.7 V to 5.5 V. Table 5. Parameter 1 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 1.8 V ≤ VLOGIC < 2.7 V Min Max 66 33 33 33 5 5 15 60 60 36 15 2.7 V ≤ VLOGIC ≤ 5.5 V Min Max 40 20 20 20 5 5 10 30 30 25 10 Unit ns ns ns ns ns ns ns ns ns ns ns Description SCLK cycle time SCLK high time SCLK low time SYNC to SCLK falling edge Data setup time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time Minimum SYNC high time SDO data valid from SCLK rising edge SCLK falling edge to SYNC rising edge t12 15 10 ns SYNC rising edge to SCLK rising edge 1 Maximum SCLK frequency is 25 MHz or 15 MHz at VDD = 2.7 V to 5.5 V, 1.8 V ≤ VLOGIC ≤ VDD. Guaranteed by design and characterization; not production tested. Circuit and Timing Diagrams 200µA VOH (MIN) CL 20pF 200µA 11254-003 TO OUTPUT PIN IOL IOH Figure 3. Load Circuit for Digital Output (SDO) Timing Specifications SCLK 24 48 t11 t8 t12 t4 SYNC SDIN t6 DB23 DB0 INPUT WORD FOR DAC N DB23 DB0 t10 INPUT WORD FOR DAC N + 1 DB23 SDO UNDEFINED DB0 INPUT WORD FOR DAC N Figure 4. Daisy-Chain Timing Diagram Rev. 0 | Page 6 of 28 11254-004 t5 Data Sheet AD5313R t1 SCLK 24 1 t8 t4 t3 24 1 t7 t2 t9 SYNC t6 t5 DB23 DB0 DB23 INPUT WORD SPECIFIES REGISTER TO BE READ SDO DB23 DB0 NOP CONDITION t10 DB0 DB23 UNDEFINED DB0 SELECTED REGISTER DATA CLOCKED OUT Figure 5. Readback Timing Diagram Rev. 0 | Page 7 of 28 11254-005 SDIN AD5313R Data Sheet ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Parameter VDD to GND VLOGIC to GND VOUT to GND VREF to GND Digital Input Voltage to GND Operating Temperature Range Storage Temperature Range Junction Temperature 16-Lead TSSOP, θJA Thermal Impedance, 0 Airflow (4-Layer Board) 16-Lead LFCSP, θJA Thermal Impedance, 0 Airflow (4-Layer Board) Reflow Soldering Peak Temperature, Pb Free (J-STD-020) ESD1 FICDM 1 Rating −0.3 V to +7 V −0.3 V to +7 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to VLOGIC + 0.3 V −40°C to +105°C −65°C to +150°C 125°C 112.6°C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION 70°C/W 260°C 4 kV 1.5 kV Human body model (HBM) classification. Rev. 0 | Page 8 of 28 Data Sheet AD5313R 13 RESET 14 RSTSEL 16 NC 15 VREF PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS VOUTA 1 AD5313R RSTSEL 15 RESET VOUTA 3 14 SDIN NC 10 SCLK 9 VLOGIC GND 4 AD5313R 13 SYNC TOP VIEW (Not to Scale) 12 SCLK 11 VLOGIC VOUTB 7 10 GAIN SDO 8 9 LDAC LDAC 7 NC 6 TOP VIEW (Not to Scale) SDO 6 VDD 5 VOUTB 5 GAIN 8 NC 4 16 2 VREF 1 NOTES 1. THE EXPOSED PAD MUST BE TIED TO GND. 2. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 11254-007 VDD 3 12 SDIN 11 SYNC 11254-006 GND 2 Figure 7. 16-Lead TSSOP Pin Configuration Figure 6. 16-Lead LFCSP Pin Configuration Table 7. Pin Function Descriptions LFCSP 1 2 3 Pin No. TSSOP 3 4 5 Mnemonic VOUTA GND VDD 4 5 6 6 7 8 NC VOUTB SDO 7 9 LDAC 8 10 GAIN 9 10 11 12 VLOGIC SCLK 11 13 SYNC 12 14 SDIN 13 15 RESET 14 16 RSTSEL 15 1 VREF 16 17 2 N/A NC EPAD Description Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation. Ground Reference Point for All Circuitry on the AD5313R. Power Supply Input. The AD5313R can be operated from 2.7 V to 5.5 V. Decouple the supply with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND. No Connect. Do not connect to this pin. Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation. Serial Data Output. SDO can be used to daisy-chain a number of AD5313R devices together, or it can be used for readback. The serial data is transferred on the rising edge of SCLK and is valid on the falling edge of the clock. LDAC can be operated in two modes: asynchronous and synchronous. Pulsing this pin low allows either or both DAC registers to be updated if the input registers have new data; both DAC outputs can be updated simultaneously. This pin can also be tied permanently low. Gain Select. When this pin is tied to GND, both DACs output a span from 0 V to VREF. If this pin is tied to VLOGIC, both DACs output a span of 0 V to 2 × VREF. Digital Power Supply. Voltage ranges from 1.8 V to 5.5 V. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates of up to 50 MHz. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, data is transferred in on the falling edges of the next 24 clocks. Serial Data Input. This device has a 24-bit input shift register. Data is clocked into the register on the falling edge of the serial clock input. Asynchronous Reset Input. The RESET input is falling edge sensitive. When RESET is low, all LDAC pulses are ignored. When RESET is activated, the input register and the DAC register are updated with zero scale or midscale, depending on the state of the RSTSEL pin. Power-On Reset Select. Tying this pin to GND powers up both DACs to zero scale. Tying this pin to VLOGIC powers up both DACs to midscale. Reference Voltage. The AD5313R has a common reference pin. When using the internal reference, this is the reference output pin. When using an external reference, this is the reference input pin. The default for this pin is as a reference output. No Connect. Do not connect to this pin. Exposed Pad. The exposed pad must be tied to GND. Rev. 0 | Page 9 of 28 AD5313R Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 1600 DEVICE 1 DEVICE 2 DEVICE 3 DEVICE 4 DEVICE 5 2.5015 2.5010 1400 1200 1000 NSD (nV/ Hz) 2.5005 VREF (V) VDD = 5V TA = 25°C VDD = 5V 2.5000 2.4995 800 600 2.4990 400 2.4985 200 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 0 10 11254-008 2.4980 –40 1k 10k 100k 1M FREQUENCY (MHz) Figure 8. Internal Reference Voltage vs. Temperature 90 100 11254-012 2.5020 Figure 11. Internal Reference Noise Spectral Density vs. Frequency VDD = 5V VDD = 5V TA = 25°C 80 T NUMBER OF UNITS 70 60 50 1 40 30 20 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 11254-010 0 5.0 TEMPERATURE DRIFT (ppm/°C) CH1 10µV 160mV 2.5000 VDD = 5.5V 0 HOUR 168 HOURS 500 HOURS 1000 HOURS A CH1 Figure 12. Internal Reference Noise, 0.1 Hz to 10 Hz Figure 9. Reference Output Temperature Drift Histogram 60 M1.0s 11254-013 10 VDD = 5V TA = 25°C 2.4999 50 2.4998 VREF (V) 30 20 2.4997 2.4996 2.4995 10 0 2.498 2.499 2.500 2.501 2.502 VREF (V) 2.4993 –0.005 –0.003 –0.001 0.001 0.003 ILOAD (A) Figure 13. Internal Reference Voltage vs. Load Current Figure 10. Reference Long-Term Stability/Drift Rev. 0 | Page 10 of 28 0.005 11254-014 2.4994 11254-011 HITS 40 Data Sheet AD5313R 2.5002 10 TA = 25°C D1 8 2.5000 6 4 ERROR (LSB) D3 2.4996 2.4994 2 INL 0 DNL –2 –4 –6 2.4992 D2 3.0 3.5 4.0 4.5 5.0 –10 –40 11254-015 2.4990 2.5 VDD = 5V TA = 25°C REFERENCE = 2.5V –8 5.5 VDD (V) 10 60 11254-018 VREF (V) 2.4998 110 TEMPERATURE (°C) Figure 17. INL Error and DNL Error vs. Temperature Figure 14. Internal Reference Voltage vs. Supply Voltage 10 0.5 8 6 0.3 ERROR (LSB) INL (LSB) 4 0.1 –0.1 2 INL 0 DNL –2 –4 –6 VDD = 5V TA = 25°C REFERENCE = 2.5V –8 0 156 312 468 625 781 938 CODE –10 11254-016 –0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VREF (V) 5.0 11254-019 –0.3 Figure 18. INL Error and DNL Error vs. VREF Figure 15. Integral Nonlinearity (INL) vs. Code 10 0.5 8 6 0.3 ERROR (LSB) 0.1 –0.1 2 INL 0 DNL –2 –4 –6 –8 –0.5 0 156 312 468 625 781 938 CODE VDD = 5V TA = 25°C REFERENCE = 2.5V –10 2.7 3.2 3.7 4.2 4.7 5.2 SUPPLY VOLTAGE (V) Figure 19. INL Error and DNL Error vs. Supply Voltage Figure 16. Differential Nonlinearity (DNL) vs. Code Rev. 0 | Page 11 of 28 11254-020 –0.3 11254-017 DNL (LSB) 4 AD5313R Data Sheet 1.5 0.10 0.08 1.0 0.04 0.5 FULL-SCALE ERROR 0.02 0 ERROR (mV) GAIN ERROR –0.02 ZERO-CODE ERROR 0 OFFSET ERROR –0.5 –0.06 –1.0 40 60 80 100 120 TEMPERATURE (°C) 0.8 0.6 ZERO-CODE ERROR 0.2 20 40 60 80 100 120 TEMPERATURE (°C) 11254-022 OFFSET ERROR 5.2 VDD = 5V 0.09 TA = 25°C INTERNAL REFERENCE = 2.5V 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 –40 0.08 TOTAL UNADJUSTED ERROR (% of FSR) 0.10 0.08 0.06 0.04 0.02 GAIN ERROR 0 FULL-SCALE ERROR –0.04 4.7 5.2 SUPPLY VOLTAGE (V) 11254-023 –0.06 VDD = 5V –0.08 T = 25°C A INTERNAL REFERENCE = 2.5V –0.10 2.7 3.2 3.7 4.2 0 20 40 60 80 100 120 Figure 24. Total Unadjusted Error vs. Temperature 0.10 –0.02 –20 TEMPERATURE (°C) Figure 21. Zero-Code Error and Offset Error vs. Temperature ERROR (% of FSR) 4.7 11254-025 TOTAL UNADJUSTED ERROR (% of FSR) ERROR (mV) 1.0 0 4.2 0.10 1.2 –20 3.7 Figure 23. Zero-Code Error and Offset Error vs. Supply VDD = 5V 1.4 T = 25°C A REFERENCE = 2.5V 0 –40 3.2 SUPPLY VOLTAGE (V) Figure 20. Gain Error and Full-Scale Error vs. Temperature 0.4 VDD = 5V TA = 25°C INTERNAL REFERENCE = 2.5V –1.5 2.7 11254-021 VDD = 5V –0.08 T = 25°C A REFERENCE = 2.5V –0.10 –40 –20 0 20 11254-024 –0.04 0.06 0.04 0.02 0 –0.02 –0.04 –0.06 VDD = 5V –0.08 T = 25°C A INTERNAL REFERENCE = 2.5V –0.10 2.7 3.2 3.7 4.2 4.7 5.2 SUPPLY VOLTAGE (V) Figure 25. Total Unadjusted Error vs. Supply Voltage, Gain = 1 Figure 22. Gain Error and Full-Scale Error vs. Supply Rev. 0 | Page 12 of 28 11254-026 ERROR (% of FSR) 0.06 AD5313R 0 1.0 –0.01 0.8 –0.02 0.6 –0.03 0.4 –0.04 0.2 ΔVOUT (V) SINKING 2.7V –0.05 –0.06 –0.2 –0.4 –0.08 –0.6 SOURCING 2.7V –0.8 40000 50000 60000 65535 CODE –1.0 0 5 10 20 25 30 Figure 29. Headroom/Footroom vs. Load Current 7 VDD = 5V TA = 25°C EXTERNAL REFERENCE = 2.5V VDD = 5V 6 TA = 25°C GAIN = 2 INTERNAL 5 REFERENCE = 2.5V 20 4 15 VOUT (V) HITS 15 LOAD CURRENT (mA) Figure 26. Total Unadjusted Error vs. Code 25 SOURCING 5V 11254-030 VDD = 5V –0.09 T = 25°C A INTERNAL REFERENCE = 2.5V –0.10 0 10000 20000 30000 SINKING 5V 0 –0.07 11254-027 TOTAL UNADJUSTED ERROR (% of FSR) Data Sheet 10 FULL SCALE THREE-QUARTER SCALE 3 MIDSCALE 2 ONE-QUARTER SCALE 1 ZERO SCALE 0 5 580 600 620 640 IDD FULL SCALE (V) –2 –0.06 –0.04 –0.02 0 0.02 0.04 0.06 11254-031 560 11254-028 540 0.06 11254-032 –1 0 LOAD CURRENT (A) Figure 27. IDD Histogram with External Reference, VDD = 5 V Figure 30. Source and Sink Capability at VDD = 5 V 5 VDD = 5V 30 T = 25°C A INTERNAL REFERENCE = 2.5V 25 VDD = 3V TA = 25°C 4 EXTERNAL REFERENCE = 2.5V GAIN = 1 3 FULL SCALE VOUT (V) HITS 20 15 2 THREE-QUARTER SCALE MIDSCALE 1 ONE-QUARTER SCALE 10 0 ZERO SCALE 5 –1 1000 1020 1040 1060 1080 IDD FULL SCALE (V) 1100 1120 1140 11254-029 0 Figure 28. IDD Histogram with Internal Reference, VREF = 2.5 V, Gain = 2 Rev. 0 | Page 13 of 28 –2 –0.06 –0.04 –0.02 0 0.02 0.04 LOAD CURRENT (A) Figure 31. Source and Sink Capability at VDD = 3 V AD5313R Data Sheet 1.4 T FULL SCALE 1.0 ZERO CODE 0.8 1 EXTERNAL REFERENCE, FULL-SCALE 0.6 0.4 0.2 10 60 110 TEMPERATURE (°C) CH1 10µV Figure 32. Supply Current vs. Temperature A CH1 802mV Figure 35. 0.1 Hz to 10 Hz Output Noise Plot, 2.5 V Internal Reference 2.5008 1600 VDD = 5V TA = 25°C 1400 INTERNAL REFERENCE = 2.5V FULL SCALE MIDSCALE ZERO SCALE 1200 NSD (nV/ Hz) 2.5003 VOUT (V) M1.0s 11254-036 0 –40 11254-033 VDD = 5V TA = 25°C INTERNAL REFERENCE = 2.5V 2.4998 CHANNEL B TA = 25°C VDD = 5.25V REFERENCE = 2.5V POSITIVE MAJOR CODE TRANSITION ENERGY = 0.227206nV-sec 2.4988 0 2 4 6 800 600 400 200 8 10 0 10 11254-034 2.4993 1000 12 TIME (µs) 100 1k 10k 100k 1M FREQUENCY (Hz) Figure 33. Digital-to-Analog Glitch Impulse 11254-037 SUPPLY CURRENT (mA) 1.2 Figure 36. Noise Spectral Density 20 T VDD = 5V TA = 25°C REFERENCE = 2.5V 0 –20 THD (dBV) –40 1 –60 –80 –100 –120 –140 VDD = 5V TA = 25°C REFERENCE = 2.5V A CH1 802mV 0 2000 4000 6000 8000 10000 12000 14000 16000 18000 20000 FREQUENCY (Hz) Figure 37. Total Harmonic Distortion at 1 kHz Figure 34. 0.1 Hz to 10 Hz Output Noise Plot, External Reference Rev. 0 | Page 14 of 28 11254-038 M1.0s –180 11254-035 CH1 10µV –160 Data Sheet AD5313R 0 –20 –30 –40 –50 VDD = 5V TA = 25°C REFERENCE = 2.5V, ±0.1V p-p –60 10k 100k FREQUENCY (Hz) 1M 10M 11254-039 BANDWIDTH (dB) –10 Figure 38. Multiplying Bandwidth, External Reference = 2.5 V, ±0.1 V p-p, 10 kHz to 10 MHz Rev. 0 | Page 15 of 28 AD5313R Data Sheet TERMINOLOGY Relative Accuracy or Integral Nonlinearity (INL) For the DAC, relative accuracy or integral nonlinearity is a measurement of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot is shown in Figure 15. Differential Nonlinearity (DNL) Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical DNL vs. code plot is shown in Figure 16 Zero-Code Error Zero-code error is a measurement of the output error when zero code (0x0000) is loaded to the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5313R because the output of the DAC cannot go below 0 V due to a combination of the offset errors in the DAC and the output amplifier. Zero-code error is expressed in mV. A plot of zero-code error vs. temperature is shown in Figure 21. Full-Scale Error Full-scale error is a measurement of the output error when fullscale code (0xFFFF) is loaded to the DAC register. Ideally, the output should be VDD − 1 LSB. Full-scale error is expressed in percent of full-scale range (% of FSR). A plot of full-scale error vs. temperature is shown in Figure 20. Gain Error Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal and is expressed as % of FSR. Offset Error Drift Offset error drift is a measurement of the change in offset error with a change in temperature. It is expressed in µV/°C. Gain Temperature Coefficient Gain temperature coefficient is a measurement of the change in gain error with changes in temperature. It is expressed in ppm of FSR/°C. Offset Error Offset error is a measure of the difference between VOUT (actual) and VOUT (ideal) expressed in mV in the linear region of the transfer function. Offset error is measured on the AD5313R with Code 8 loaded in the DAC register. It can be negative or positive. DC Power Supply Rejection Ratio (PSRR) PSRR indicates how the output of the DAC is affected by changes in the supply voltage. It is the ratio of the change in VOUT to a change in VDD for the full-scale output of the DAC. It is measured in mV/V. VREF is held at 2 V, and VDD is varied by ±10%. Output Voltage Settling Time Output voltage settling time is the amount of time it takes for the output of a DAC to settle to a specified level for a ¼ to ¾ fullscale input change and is measured from the rising edge of SYNC. Digital-to-Analog Glitch Impulse Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-sec and is measured when the digital input code is changed by 1 LSB at the major carry transition, that is, 0x7FFF to 0x8000 (see Figure 33). Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC; it is measured when the DAC output is not updated. It is specified in nV-sec and measured with a full-scale code change on the data bus, that is, from all 0s to all 1s and vice versa. Reference Feedthrough Reference feedthrough is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated. It is expressed in dB. Noise Spectral Density (NSD) NSD is a measurement of the internally generated random noise. Random noise is characterized as a spectral density. It is measured, in nV/√Hz, by loading the DAC to midscale and measuring noise at the output. A plot of noise spectral density is shown in Figure 36. DC Crosstalk DC crosstalk is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change (or soft power-down and powerup) on one DAC while monitoring another DAC kept at midscale. It is expressed in μV. DC crosstalk due to load current change is a measure of the impact that a change in load current on one DAC has to another DAC kept at midscale. It is expressed in μV/mA. Digital Crosstalk Digital crosstalk is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s and vice versa) in the input register of another DAC. It is measured in standalone mode and expressed in nV-sec. Analog Crosstalk Analog crosstalk is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s and vice versa). Then execute a software LDAC and monitor the output of the DAC whose digital code was not changed. The area of the glitch is expressed in nV-sec. Rev. 0 | Page 16 of 28 Data Sheet AD5313R DAC-to-DAC Crosstalk DAC-to-DAC crosstalk is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent analog output change of another DAC. It is measured by loading the attack channel with a full-scale code change (all 0s to all 1s and vice versa), using the write to and update commands while monitoring the output of the victim channel that is at midscale. The energy of the glitch is expressed in nV-sec. Multiplying Bandwidth The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input. Total Harmonic Distortion (THD) THD is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measurement of the harmonics present on the DAC output. It is measured in dB. Voltage Reference Temperature Coefficient Voltage reference TC is a measure of the change in the reference output voltage with a change in temperature. The reference TC is calculated using the box method, which defines the TC as the maximum change in the reference output over a given temperature range expressed in ppm/°C, as follows: VREFmax − VREFmin 6 TC = × 10 V TempRange × REFnom where: VREFmax is the maximum reference output measured over the total temperature range. VREFmin is the minimum reference output measured over the total temperature range. VREFnom is the nominal reference output voltage, 2.5 V. TempRange is the specified temperature range of −40°C to +105°C. Rev. 0 | Page 17 of 28 AD5313R Data Sheet THEORY OF OPERATION DIGITAL-TO-ANALOG CONVERTER (DAC) The AD5313R is a dual 10-bit, serial input, voltage output DAC with an internal reference. The part operates from supply voltages of 2.7 V to 5.5 V. Data is written to the AD5313R in a 24-bit word format via a 3-wire serial interface. The AD5313R incorporates a power-on reset circuit to ensure that the DAC output powers up to a known output state. The device also has a software power-down mode that reduces the typical current consumption to 4 µA. by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic. VREF R R TRANSFER FUNCTION R The internal reference is on by default. To use an external reference, only a nonreference option is available. Because the input coding to the DAC is straight binary, the ideal output voltage when using an external reference is given by D VOUT = VREF × Gain N 2 R DAC ARCHITECTURE The DAC architecture consists of a string DAC followed by an output amplifier. Figure 39 shows a block diagram of the DAC architecture. VREF 2.5V REF REF (+) RESISTOR STRING REF (–) GND VOUTX GAIN (GAIN = 1 OR 2) 11254-040 DAC REGISTER Figure 39. Single DAC Channel Architecture Block Diagram The resistor string structure is shown in Figure 40. It is a string of resistors, each of Value R. The code loaded to the DAC register determines the node on the string where the voltage is to be tapped off and fed into the output amplifier. The voltage is tapped off R 11254-041 where: Gain is the output amplifier gain and is set to 1 by default. It can be set to ×1 or ×2 using the gain select pin. When the GAIN pin is tied to GND, both DAC outputs have a span from 0 V to VREF. If the GAIN pin is tied to VLOGIC, both DACs output a span of 0 V to 2 × VREF. D is the decimal equivalent of the binary code that is loaded to the DAC register as follows: 0 to 1,024 for the 10-bit device. N is the DAC resolution. INPUT REGISTER TO OUTPUT AMPLIFIER Figure 40. Resistor String Structure Internal Reference The AD5313R on-chip reference is on at power-up but can be disabled via a write to a control register. See the Internal Reference Setup section for details. The AD5313R has a 2.5 V, 2 ppm/°C reference, giving a fullscale output of 2.5 V or 5 V, depending on the state of the GAIN pin. The internal reference associated with the device is available at the VREF pin. This buffered reference is capable of driving external loads of up to 10 mA. Output Amplifiers The output buffer amplifier can generate rail-to-rail voltages on its output, which gives an output range of 0 V to VDD. The actual range depends on the value of VREF, the GAIN pin, the offset error, and the gain error. The GAIN pin selects the gain of the output, as follows: • • If the GAIN pin is tied to GND, both DAC outputs have a gain of 1, and the output range is 0 V to VREF. If the GAIN pin is tied to VLOGIC, both DAC outputs have a gain of 2, and the output range is 0 V to 2 × VREF. These amplifiers are capable of driving a load of 1 kΩ in parallel with 2 nF to GND. The slew rate is 0.8 V/µs with a ¼ to ¾ scale settling time of 5 µs. Rev. 0 | Page 18 of 28 Data Sheet AD5313R SERIAL INTERFACE The data-word comprises 10-bit input code, followed by six don’t care bits (see Figure 41). These data bits are transferred to the input shift register on the 24 falling edges of SCLK and are updated on the rising edge of SYNC. The AD5313R has a 3-wire serial interface (SYNC, SCLK, and SDIN) that is compatible with SPI, QSPI™, and MICROWIRE® interface standards as well as most DSPs. See Figure 2 for a timing diagram of a typical write sequence. The AD5313R contains an SDO pin that allows the user to daisy-chain multiple devices together (see the Daisy-Chain Operation section) or read back data. Commands can be executed on individual DAC channels or on both DAC channels, depending on the address bits selected. Table 8. Address Commands Input Shift Register DAC B 0 1 1 The input shift register of the AD5313R is 24 bits wide, and data is loaded MSB first (DB23). The first four bits are the command bits (C3 to C0, as listed in Table 9), followed by the 4-bit DAC address bits listed in Table 8 (DAC B, two don’t care bits set to 0, and DAC A). Finally, the data-word completes the input shift register. 0 0 0 0 Address (n) 0 0 0 0 DAC A 1 0 1 Selected DAC Channel DAC A DAC B DAC A and DAC B Table 9. Command Definitions C2 0 0 0 0 1 1 1 1 0 0 0 … 1 C0 0 1 0 1 0 1 0 1 0 1 0 … 1 Description No operation Write to Input Register n (dependent on LDAC) Update DAC Register n with contents of Input Register n Write to and update DAC Channel n Power down/power up DAC Hardware LDAC mask register Software reset (power-on reset) Internal reference setup register Set up DCEN register (daisy-chain enable) Set up readback register (readback enable) Reserved Reserved Reserved DB23 (MSB) C3 C2 DB0 (LSB) C1 C0 DAC B 0 0 DAC D9 A D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X DATA BITS COMMAND BITS 11254-042 C3 0 0 0 0 0 0 0 0 1 1 1 … 1 Command C1 0 0 1 1 0 0 1 1 0 0 1 … 1 ADDRESS BITS Figure 41. Input Shift Register Content Rev. 0 | Page 19 of 28 AD5313R Data Sheet STANDALONE OPERATION AD5313R 68HC11* The write sequence begins by bringing the SYNC line low. Data from the SDIN line is clocked into the 24-bit input shift register on the falling edge of SCLK. After the last of 24 data bits is clocked in, SYNC is brought high. The programmed function is then executed; that is, an LDAC-dependent change in DAC register contents and/or a change in the mode of operation occurs. If SYNC is taken high before the 24th clock, it is considered a valid frame, and invalid data may be loaded to the DAC. SYNC must be brought high for a minimum of 20 ns (single channel, see t8 in Figure 2) before the next write sequence so that a falling edge of SYNC can initiate the next write sequence. Idle SYNC at the rails between write sequences for an even lower power operation of the part. The SYNC line is kept low for 24 falling edges of SCLK, and the DAC is updated on the rising edge of SYNC. MOSI SDIN SCK SCLK PC7 SYNC PC6 LDAC SDO MISO SDIN AD5313R SCLK SYNC LDAC SDO When the data has been transferred into the input register of the addressed DAC, both DAC registers and outputs can be updated by taking LDAC low while the SYNC line is high. SDIN AD5313R WRITE AND UPDATE COMMANDS SCLK Write to Input Register n (Dependent on LDAC) SYNC Command 0001 allows the user to write to the dedicated input register of each DAC individually. When LDAC is low, the input register is transparent (if not controlled by the LDAC mask register). LDAC *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 42. Daisy-Chaining Multiple AD5313R Devices Update DAC Register n with Contents of Input Register n Command 0010 loads the DAC registers/outputs with the contents of the input registers selected and updates the DAC outputs directly. Write to and Update DAC Channel n (Independent of LDAC) Command 0011 allows the user to write to the DAC registers and update the DAC outputs directly. DAISY-CHAIN OPERATION For systems that contain several DACs, the SDO pin can be used to daisy-chain several devices together. SDO is enabled through a software executable daisy-chain enable (DCEN) command. Command 1000 is reserved for this DCEN function (see Table 9). The daisy-chain mode is enabled by setting Bit DB0 in the DCEN register. The default setting is standalone mode, where DB0 (LSB) = 0. Table 10 shows how the state of the bit corresponds to the mode of operation of the device. Table 10. Daisy-Chain Enable (DCEN) Register DB0 (LSB) 0 1 Description Standalone mode (default) DCEN mode 11254-043 SDO The SCLK pin is continuously applied to the input shift register when SYNC is low. If more than 24 clock pulses are applied, the data ripples out of the input shift register and appears on the SDO line. This data is clocked out on the rising edge of SCLK and is valid on the falling edge. By connecting this line to the SDIN input on the next DAC in the chain, a daisy-chain interface is constructed. Each DAC in the system requires 24 clock pulses. Therefore, the total number of clock cycles must equal 24 × N, where N is the total number of devices that are updated. If SYNC is taken high at a clock that is not a multiple of 24, it is considered a valid frame, and invalid data may be loaded to the DAC. When the serial transfer to all devices is complete, SYNC is taken high. This latches the input data in each device in the daisy chain and prevents any further data from being clocked into the input shift register. The serial clock can be continuous or a gated clock. A continuous SCLK source can be used only if SYNC can be held low for the correct number of clock cycles. In gated clock mode, a burst clock containing the exact number of clock cycles must be used, and SYNC must be taken high after the final clock to latch the data. Rev. 0 | Page 20 of 28 Data Sheet AD5313R Readback mode is invoked through a software executable readback command. If the SDO output is disabled via the daisy-chain mode disable bit in the control register, it is automatically enabled for the duration of the read operation, after which it is disabled again. Command 1001 is reserved for the readback function. This command, in association with selecting one of the address bits, DAC B or DAC A, determines the register to be read. Note that only one DAC register can be selected during readback. The remaining three address bits (which includes the two don’t care bits) must be set to Logic 0. The remaining data bits in the write sequence are ignored. If more than one address bit is selected or no address bits are selected, DAC Channel A is read back by default. During the next SPI write, the data appearing on the SDO output contains the data from the previously addressed register. For example, to read back the DAC register for Channel A, implement the following sequence: 1. 2. Either DAC or both DACs (DAC A and DAC B) can be powered down to the selected mode by setting the corresponding bits. See Table 12 for the contents of the input shift register during the power-down/power-up operation. When both Bit PDx1 and Bit PDx0 (where x is the channel that is selected) in the input shift register are set to 0, the AD5313R works normally, with a normal power consumption of 4 mA at 5 V. However, for the three power-down modes of the AD5313R, the supply current falls to 4 μA at 5 V. Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This switchover has the advantage that the output impedance of the part is known while the part is in power-down mode. The three power-down options are as follows: • • Write 0x900000 to the AD5313R input register. This setting configures the part for read mode with the Channel A DAC register selected. Note that all data bits, DB15 to DB0, are don’t care bits. Follow this write operation with a second write, a NOP condition, 0x000000. During this write, the data from the register is clocked out on the SDO line. DB23 to DB20 contain undefined data, and the last 16 bits contain the DB19 to DB4 DAC register contents. • The output is connected internally to GND through a 1 kΩ resistor. The output is connected internally to GND through a 100 kΩ resistor. The output is left open-circuited (three-state). The output stage is illustrated in Figure 43. AMPLIFIER DAC POWER-DOWN CIRCUITRY POWER-DOWN OPERATION The AD5313R contains three separate power-down modes. Command 0100 controls the power-down function (see Table 9). These power-down modes are software-programmable by setting eight bits, Bit DB7 to Bit DB0, in the input shift register. There are two bits associated with each DAC channel. Table 11 explains how the state of the two bits corresponds to the mode of operation of the device. Table 11. Modes of Operation Operating Mode Normal Operation Mode Power-Down Modes 1 kΩ to GND 100 kΩ to GND Three-State VOUTX PDx1 0 PDx0 0 0 1 1 1 0 1 RESISTOR NETWORK 11254-044 READBACK OPERATION Figure 43. Output Stage During Power-Down The bias generator, output amplifier, resistor string, and other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down, and the DAC register can be updated while the device is in power-down mode. The time that is required to exit power-down is typically 4.5 µs for VDD = 5 V. To further reduce the current consumption, the on-chip reference can be powered off (see the Internal Reference Setup section). Table 12. 24-Bit Input Shift Register Contents of Power-Down/Power-Up Operation 1 DB23 (MSB) 0 DB22 1 DB21 0 DB20 0 Command bits (C3 to C0) 1 DB19 to DB16 X DB15 to DB8 X Address bits; don’t care DB7 PDB1 DB6 PDB0 Power-down, select DAC B X = don’t care. Rev. 0 | Page 21 of 28 DB5 1 DB4 1 Set to 1 DB3 1 DB2 1 Set to 1 DB1 PDA1 DB0 (LSB) PDA0 Power-down, select DAC A AD5313R Data Sheet LOAD DAC (HARDWARE LDAC PIN) Deferred DAC Updating (LDAC Pulsed Low) The AD5313R DACs have double buffered interfaces consisting of two banks of registers: input registers and DAC registers. The user can write to any combination of the input registers. Updates to the DAC register are controlled by the LDAC pin. LDAC is held high while data is clocked into the input register using Command 0001. Both DAC outputs are asynchronously updated by taking LDAC low after SYNC is taken high. The update then occurs on the falling edge of LDAC. LDAC MASK REGISTER OUTPUT AMPLIFIER VREF 10-BIT DAC LDAC DAC REGISTER Command 0101 is reserved for a software LDAC mask function, which allows the address bits to be ignored. A write to the DAC using Command 0101 loads the 4-bit LDAC mask register (DB3 to DB0). The default setting for each channel is 0; that is, the LDAC pin works normally. Setting the selected bit to 1 forces the DAC channel to ignore transitions on the LDAC pin, regardless of the state of the hardware LDAC pin. This flexibility is useful in applications where the user wishes to select which channels respond to the LDAC pin. VOUTX INPUT REGISTER INTERFACE LOGIC SDO The LDAC mask register gives the user extra flexibility and control over the hardware LDAC pin (see Table 13). Setting an LDAC bit (DB3, DB0) to 0 for a DAC channel means that the update of this channel is controlled by the hardware LDAC pin. 11254-045 SCLK SYNC SDIN Figure 44. Simplified Diagram of Input Loading Circuitry for a Single DAC Instantaneous DAC Updating (LDAC Held Low) Table 13. LDAC Overwrite Definition LDAC is held low while data is clocked into the input register using Command 0001. Both the addressed input register and the DAC register are updated on the rising edge of SYNC, and then the output begins to change (see Table 14 and Table 15). Load LDAC Register LDAC Bits (DB3, DB0) 0 1 1 Table 14. 24-Bit Input Shift Register Contents for LDAC Operation DB23 (MSB) 0 DB22 0 DB21 0 DB20 1 DB19 X Command bits (C3 to C0) 1 DB18 X DB17 X DB16 X Address bits, don’t care LDAC Pin LDAC Operation 1 or 0 X1 Determined by the LDAC pin. DAC channels update and override the LDAC pin. DAC channels see the LDAC pin as set to 1. X = don’t care. 1 DB2 0 DB1 0 DB0 (LSB) DAC A DB15 to DB4 X DB3 DAC B Don’t care Setting the LDAC bit to 1 overrides the LDAC pin X = don’t care. Table 15. Write Commands and LDAC Pin Truth Table 1 Command 0001 Description Write to Input Register n (dependent on LDAC) 0010 Update DAC Register n with contents of Input Register n 0011 Write to and update DAC Channel n Hardware LDAC Pin State VLOGIC GND 2 VLOGIC GND VLOGIC GND Input Register Contents Data update Data update No change No change Data update Data update DAC Register Contents No change (no update) Data update Updated with input register contents Updated with input register contents Data update Data update A high-to-low hardware LDAC pin transition always updates the contents of the DAC register with the contents of the input register on channels that are not masked (blocked) by the LDAC mask register. 2 When the LDAC pin is permanently tied low, the LDAC mask bits are ignored. 1 Rev. 0 | Page 22 of 28 Data Sheet AD5313R HARDWARE RESET (RESET) SOLDER HEAT REFLOW RESET is an active low reset that allows the outputs to be cleared to either zero scale or midscale. The clear code value is user selectable via the power-on reset select pin (RSTSEL). RESET must be kept low for a minimum amount of time to complete the operation (see Figure 2). When the RESET signal is returned high, the output remains at the cleared value until a new value is programmed. The outputs cannot be updated with a new value while the RESET pin is low. There is also a software executable reset function that resets the DAC to the power-on reset code. Command 0110 is designated for this software reset function (see Table 9). Any events on LDAC or RESET during a poweron reset are ignored. As with all IC reference voltage circuits, the reference value experiences a shift induced by the soldering process. Analog Devices, Inc., performs a reliability test, called precondition, that mimics the effect of soldering a device to a board. The output voltage specification that is listed in Table 2 includes the effect of this reliability test. Figure 45 shows the effect of solder heat reflow (SHR) as measured through the reliability test (precondition). POSTSOLDER HEAT REFLOW 60 PRESOLDER HEAT REFLOW 50 RESET SELECT PIN (RSTSEL) 40 HITS The AD5313R contains a power-on reset circuit that controls the output voltage during power-up. When the RSTSEL pin is connected low (to GND), the output powers up to zero scale. Note that this is outside the linear region of the DAC. When the RSTSEL pin is connected high (to VLOGIC), VOUTX powers up to midscale. The output remains powered up at this level until a valid write sequence is sent to the DAC. 30 20 0 2.498 2.500 2.501 2.502 VREF (V) INTERNAL REFERENCE SETUP Command 0111 is reserved for setting up the internal reference (see Table 9). By default, the on-chip reference is on at power-up. To reduce the supply current, this reference can be turned off by setting the software-programmable bit, DB0, as shown in Table 17. Table 16 shows how the state of the bit corresponds to the mode of operation. Figure 45. SHR Reference Voltage Shift LONG-TERM TEMPERATURE DRIFT Figure 46 shows the change in VREF value after 1000 hours in life test at 150°C. 0 HOUR 168 HOURS 500 HOURS 1000 HOURS 60 Table 16. Internal Reference Setup Register 50 Action Reference on (default) Reference off 40 HITS Internal Reference Setup Register (DB0) 0 1 2.499 11254-046 10 30 20 0 2.498 2.499 2.500 2.501 2.502 VREF (V) 11254-047 10 Figure 46. Reference Drift Through to 1000 Hours Table 17. 24-Bit Input Shift Register Contents for Internal Reference Setup Command 1 DB23 (MSB) 0 DB22 1 DB21 1 Command bits (C3 to C0) 1 DB20 1 DB19 X DB18 X DB17 X Address bits (A3 to A0) X = don’t care Rev. 0 | Page 23 of 28 DB16 X DB15 to DB1 X DB0 (LSB) 0 or 1 Don’t care Reference setup register AD5313R Data Sheet THERMAL HYSTERESIS 9 Thermal hysteresis is the voltage difference induced on the reference voltage by sweeping the temperature from ambient to cold, then to hot, and then back to ambient. 8 7 6 5 4 3 2 1 0 –200 –150 –100 –50 DISTORTION (ppm) Figure 47. Thermal Hysteresis Rev. 0 | Page 24 of 28 0 50 11254-048 HITS Thermal hysteresis data is shown in Figure 47. It is measured by sweeping the temperature from ambient to −40°C, next to +105°C, and then returning to ambient. The VREF delta is then measured between the two ambient measurements and shown in blue in Figure 47. The same temperature sweep and measurements are immediately repeated, and the results are shown in red in Figure 47. FIRST TEMPERATURE SWEEP SUBSEQUENT TEMPERATURE SWEEPS Data Sheet AD5313R APPLICATIONS INFORMATION MICROPROCESSOR INTERFACING Microprocessor interfacing to the AD5313R is achieved via a serial bus using a standard protocol that is compatible with DSP processors and microcontrollers. The communications channel requires a 3-wire or 4-wire interface consisting of a clock signal, a data signal, and a synchronization signal. The device requires a 24-bit data-word with data valid on the rising edge of SYNC. AD5313R TO ADSP-BF531 INTERFACE The SPI interface of the AD5313R is designed to be easily connected to industry-standard DSPs and microcontrollers. Figure 48 shows the AD5313R connected to an Analog Devices Blackfin® DSP. The Blackfin has an integrated SPI port that can be connected directly to the SPI pins of the AD5313R. In systems where there are many devices on one board, it is often useful to provide some heat sinking capability to allow the power to dissipate easily. The AD5313R has an exposed paddle beneath the device. Connect this paddle to the GND supply for the part. For optimum performance, use special considerations to design the motherboard and to mount the package. For enhanced thermal, electrical, and board level performance, solder the exposed paddle on the bottom of the package to the corresponding thermal land paddle on the PCB. Design thermal vias into the PCB land paddle area to further improve heat dissipation. The GND plane on the device can be increased (as shown in Figure 50) to provide a natural heat sinking effect. AD5313R AD5313R ADSP-BF531 BOARD Figure 48. AD5313R to ADSP-BF531 Interface AD5313R TO SPORT INTERFACE Figure 50. Paddle Connection to Board The Analog Devices ADSP-BF527 has one SPORT serial port. Figure 49 shows how one SPORT interface can be used to control the AD5313R. AD5313R ADSP-BF527 GPIO0 GPIO1 SYNC SCLK SDIN LDAC RESET 11254-050 SPORT_TFS SPORT_TSCK SPORT_DTO Figure 49. AD5313R to SPORT Interface GALVANICALLY ISOLATED INTERFACE In many process control applications, it is necessary to provide an isolation barrier between the controller and the unit being controlled to protect and isolate the controlling circuitry from any hazardous common-mode voltages that may occur. The iCoupler® products from Analog Devices provide voltage isolation in excess of 2.5 kV. The serial loading structure of the AD5313R makes the part ideal for isolated interfaces because the number of interface lines is kept to a minimum. Figure 51 shows a 4-channel isolated interface to the AD5313R using an ADuM1400. For more information, visit http://www.analog.com/icouplers. CONTROLLER LAYOUT GUIDELINES SERIAL CLOCK IN In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. Design the PCB on which the AD5313R is mounted such that the AD5313R lies on the analog plane. Provide the AD5313R with ample supply bypassing of 10 µF in parallel with 0.1 µF on each supply, located as close to the package as possible, ideally right up against the device. The 10 µF capacitors are of the tantalum bead type. Use a 0.1 µF capacitor with low effective series resistance (ESR) and low effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. SERIAL DATA OUT ADuM14001 VOA VIA ENCODE DECODE ENCODE DECODE ENCODE DECODE ENCODE DECODE VIB VOB VIC SYNC OUT LOAD DAC OUT 1 VOC VOD VID ADDITIONAL PINS OMITTED FOR CLARITY. Rev. 0 | Page 25 of 28 Figure 51. Isolated Interface TO SCLK TO SDIN TO SYNC TO LDAC 11254-052 LDAC RESET GND PLANE 11254-051 PF9 PF8 SYNC SCLK SDIN 11254-049 SPISELx SCK MOSI AD5313R Data Sheet OUTLINE DIMENSIONS 3.10 3.00 SQ 2.90 0.50 BSC 13 PIN 1 INDICATOR 16 1 12 EXPOSED PAD 1.75 1.60 SQ 1.45 9 TOP VIEW 0.80 0.75 0.70 4 5 8 0.50 0.40 0.30 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 0.25 MIN BOTTOM VIEW 08-16-2010-E PIN 1 INDICATOR 0.30 0.23 0.18 COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6. Figure 52. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-22) Dimensions shown in millimeters 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.20 0.09 0.30 0.19 0.65 BSC COPLANARITY 0.10 0.75 0.60 0.45 8° 0° SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 53. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD5313RBCPZ-RL7 AD5313RBRUZ AD5313RBRUZ-RL7 1 Resolution 10 Bits 10 Bits 10 Bits Temperature Range −40°C to +105°C −40°C to +105°C −40°C to +105°C Accuracy ±2 LSB INL ±2 LSB INL ±2 LSB INL Reference Tempco (ppm/°C) ±5 (max) ±5 (max) ±5 (max) Z = RoHS Compliant Part. Rev. 0 | Page 26 of 28 Package Description 16-Lead LFCSP_WQ 16-Lead TSSOP 16-Lead TSSOP Package Option CP-16-22 RU-16 RU-16 Branding DKZ Data Sheet AD5313R NOTES Rev. 0 | Page 27 of 28 AD5313R Data Sheet NOTES ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11254-0-2/13(0) Rev. 0 | Page 28 of 28