AD AD7545GUQ Cmos 12-bit buffered multiplying dac Datasheet

a
CMOS 12-Bit
Buffered Multiplying DAC
AD7545
FEATURES
12-Bit Resolution
Low Gain TC: 2 ppm/ⴗC typ
Fast TTL Compatible Data Latches
Single +5 V to +15 V Supply
Small 20-Lead 0.3" DIP and 20-Terminal Surface Mount
Packages
Latch Free (Schottky Protection Diode Not Required)
Low Cost
Ideal for Battery Operated Equipment
FUNCTIONAL BLOCK DIAGRAM
RFB
20
AD7545
VREF 19
R
12-BIT
MULTIPLYING DAC
1
OUT 1
2
AGND
12
WR 17
CS 16
18 VDD
INPUT DATA LATCHES
3
DGND
12
DB11–DB0
(PINS 4–15)
The AD7545 is particularly suitable for single supply operation
and applications with wide temperature variations.
GENERAL DESCRIPTION
The AD7545 is a monolithic 12-bit CMOS multiplying DAC
with onboard data latches. It is loaded by a single 12-bit wide
word and directly interfaces to most 12- and 16-bit bus systems.
Data is loaded into the input latches under the control of the CS
and WR inputs; tying these control inputs low makes the input
latches transparent, allowing direct unbuffered operation of the
DAC.
The AD7545 can be used with any supply voltage from +5 V to
+15 V. With CMOS logic levels at the inputs the device dissipates less than 0.5 mW for VDD = +5 V.
PIN CONFIGURATIONS
DB11 (MSB) 4
18 VDD
16 CS
DB10 5
AD7545
17 WR
DB10 5
DB9 6
TOP VIEW
(Not to Scale)
16 CS
DB9 6
15 DB0 (LSB)
DB8 7
16 CS
15 DB0 (LSB)
DB7 8
14 DB1
9
10 11 12 13
DB2
9 10 11 12 13
DB3
11 DB4
18 VDD
17 WR
AD7545
TOP VIEW
(Not to Scale)
DB4
12 DB3
DB5 10
20 19
PIN 1
IDENTIFIER
DB6
13 DB2
DB6 9
14 DB1
DB7 8
DB2
DB7 8
DB8 7
DB3
TOP VIEW 15 DB0 (MSB)
(Not to Scale)
14 DB1
DB4
DB8 7
1
DB11 (MSB) 4
DB6
DB9 6
AD7545
DB5
DB10 5
2
VREF
17 WR
RFB
DB11 (MSB) 4
3
AGND
18 VDD
RFB
19 VREF
DGND 3
OUT 1
1 20 19
20 RFB
AGND 2
DB5
2
OUT 1 1
DGND
3
VREF
AGND
PLCC
OUT 1
LCCC
DGND
DIP
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
© Analog Devices, Inc., 1997
AD7545* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
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DOCUMENTATION
• Quality And Reliability
Application Notes
• Symbols and Footprints
• AN-225: 12-Bit Voltage-Output DACs for Single-Supply 5V
and 12V Systems
DISCUSSIONS
Data Sheet
View all AD7545 EngineerZone Discussions.
• AD7545: CMOS 12-Bit Buffered Multiplying DAC Data
Sheet
• AD7545: Military Data Sheet
REFERENCE MATERIALS
Solutions Bulletins & Brochures
• Digital to Analog Converters ICs Solutions Bulletin
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AD7545–SPECIFICATIONS (V
Parameter
STATIC PERFORMANCE
Resolution
Differential Nonlinearity
Gain Error (Using Internal RFB) 2
Gain Temperature Coefficient 3
∆Gain/∆Temperature
DC Supply Rejection 3
∆Gain/∆VDD
Output Leakage Current at OUT1
DYNAMIC PERFORMANCE
Current Settling Time 3
Propagation Delay 3 (from Digital
Input Change to 90%
of Final Analog Output)
Digital-to-Analog Glitch Inpulse
AC Feedthrough5
At OUT1
REFERENCE INPUT
Input Resistance
(Pin 19 to GND)
ANALOG OUTPUT
Output Capacitance 3
COUT1
COUT1
DIGITAL INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
Input Current6
IIN
Input Capacitance3
DB0–DB11
WR, CS
SWITCHING CHARACTERISTICS 7
Chip Select to Write Setup Time
tCS
Chip Select to Write Hold Time
tCH
Write Pulse Width
tWR
Data Setup Time
tDS
Data Hold Time
tDH
POWER SUPPLY
IDD
REF
= +10 V, VOUT1 = O V, AGND = DGND unless otherwise noted)
Version
VDD = +5 V
Limits
TA = + 25ⴗC TMIN, TMAX1
VDD = +15 V
Limits
TA = + 25ⴗC TMIN, TMAX1
Units
Test Conditions/Comments
All
J, A, S
K, B, T
L, C, U
GL, GC, GU
J, A, S
K, B, T
L, C, U
GL, GC, GU
J, A, S
K, B, T
L, C, U
GL, GC, GU
12
±2
±1
± 1/2
± 1/2
±4
±1
±1
±1
± 20
± 10
±5
±1
12
±2
±1
± 1/2
± 1/2
±4
±1
±1
±1
± 20
± 10
±6
±2
12
±2
±1
± 1/2
± 1/2
±4
±1
±1
±1
± 25
± 15
± 10
±6
12
±2
±1
± 1/2
± 1/2
±4
±1
±1
±1
± 25
± 15
± 10
±7
Bits
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
LSB max
10-Bit Monotonic TMIN to TMAX
12-Bit Monotonic TMIN to TMAX
12-Bit Monotonic TMIN to TMAX
12-Bit Monotonic TMIN to TMAX
DAC Register Loaded with
1111 1111 1111
Gain Error Is Adjustable Using
the Circuits of Figures 4, 5, and 6
All
±5
±5
± 10
± 10
ppm/°C max
Typical Value is 2 ppm/°C for VDD = +5 V
All
J, K, L, GL
A, B, C, GC
S, T, U, GU
0.015
10
10
10
0.03
50
50
200
0.01
10
10
10
0.02
50
50
200
% per % max
nA max
nA max
nA max
∆VDD = ± 5%
DB0–DB11 = 0 V; WR, CS = 0 V
All
2
2
2
2
µs max
To 1/2 LSB. OUT1 Load = 100 Ω. DAC
Output Measured from Falling Edge of
WR, CS = 0.
All
All
300
400
–
–
250
250
–
–
ns max
nV sec typ
OUT1 Load = 100 Ω, CEXT = 13 pF4
VREF = AGND
All
5
5
5
5
mV p-p typ
VREF = ± 10 V, 10 kHz Sinewave
All
7
25
7
25
7
25
7
25
kΩ min
kΩ max
Input Resistance TC = –300 ppm/°C typ
Typical Input Resistance = 11 kΩ
All
70
200
70
200
70
200
70
200
pF max
pF max
DB0–DB11 = 0 V, WR, CS = 0 V
DB0–DB11 = VDD, WR, CS = 0 V
All
2.4
2.4
13.5
13.5
V min
All
0.8
0.8
1.5
1.5
V max
All
±1
± 10
±1
± 10
µA max
VIN = 0 or VDD
All
All
5
20
5
20
5
20
5
20
pF max
pF max
VIN = 0
VIN = 0
All
280
200
380
270
180
120
200
150
ns min
ns typ
See Timing Diagram
All
0
0
0
0
ns min
All
250
175
140
100
400
280
210
150
160
100
90
60
240
170
120
80
ns min
ns typ
ns min
ns typ
All
10
10
10
10
ns min
All
2
100
10
2
500
10
2
100
10
2
500
10
mA max
µA max
µA typ
All
tCS ≥ tWR, tCH ≥ 0
All Digital Inputs VIL or VIH
All Digital Inputs 0 V to VDD
All Digital Inputs 0 V to VDD
NOTES
1
Temperature range as follows: J, K, L, GL versions, 0°C to +70°C; A, B, C, GC versions, –25°C to +85°C; S, T, U GU versions, –55°C to +125°C.
2
This includes the effect of 5 ppm max gain TC.
3
Guaranteed but not tested.
4
DB0–DB11 = 0 V to VDD or VDD to 0 V.
5
Feedthrough can be further reduced by connecting the metal lid on the ceramic package (Suffix D) to DGND.
6
Logic inputs are MOS gates. Typical input current (+25°C) is less than 1 nA.
7
Sample tested at +25°C to ensure compliance.
Specifications subject to change without notice.
–2–
REV. A
AD7545
tCH
tCS
MODE SELECTION
VDD
CHIP
SELECT
0
tWR
WRITE MODE:
HOLD MODE:
CS AND WR LOW, DAC RESPONDS
TO DATA BUS (DB0–DB11) INPUTS.
EITHER CS OR WR HIGH, DATA BUS
(DB0–DB11) IS LOCKED OUT; DAC
HOLDS LAST DATA PRESENT WHEN
WR OR CS ASSUMED HIGH STATE.
VDD
WRITE
NOTES:
VDD = +5V; tr = tf = 20ns
VDD = +15V; tr = tf = 40ns
ALL INPUT SIGNAL RISE AND FALL TIMES MEASURED FROM 10% TO
90% OF VDD.
TIMING MEASUREMENT REFERENCE LEVEL IS VIH + VIL/2.
0
tDS
VIH
VIL
DATA IN
(DB0–DB11)
tDH
VDD
DATA VALID
0
Write Cycle Timing Diagram
Commercial (J, K, L, GL) Grades . . . . . . . . 0°C to +70°C
Industrial (A, B, C, GC) Grades . . . . . . . . –25°C to +85°C
Extended (S, T, U, GU) Grades . . . . . . . –55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C
ABSOLUTE MAXIMUM RATINGS*
(TA = + 25°C unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3, +17 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . ± 25 V
VPIN1 to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Power Dissipation (Any Package) to +75°C . . . . . . . 450 mW
Derates above +75°C . . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
Operating Temperature
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7545 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TERMINOLOGY
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE1
RELATIVE ACCURACY
The amount by which the D/A converter transfer function
differs from the ideal transfer function after the zero and fullscale points have been adjusted. This is an endpoint linearity
measurement.
DIFFERENTIAL NONLINEARITY
The difference between the measured change and the ideal
change between any two adjacent codes. If a device has a differential nonlinearity of less than 1 LSB it will be monotonic, i.e.,
the output will always increase for an increase in digital code
applied to the D/A converter.
PROPAGATION DELAY
This is a measure of the internal delay of the circuit and is measured from the time a digital input changes to the point at which
the analog output at OUT1 reaches 90% of its final value.
DIGITAL-TO-ANALOG GLITCH IMPULSE
This is a measure of the amount of charge injected from the
digital inputs to the analog outputs when the inputs change
state. It is usually specified as the area of the glitch in nV secs
and is measured with VREF = AGND and an ADLH0032CG as
the output op amp, C1 (phase compensation) = 33 pF.
REV. A
Model2
Temperature
Range
Relative
Accuracy
Maximum
Gain Error
TA = +25ⴗC
VDD = +5 V
AD7545JN
AD7545AQ
AD7545SQ
AD7545KN
AD7545BQ
AD7545TQ
AD7545LN
AD7545CQ
AD7545UQ
AD7545GLN
AD7545GCQ
AD7545GUQ
AD7545JP
AD7545SE
AD7545KP
AD7545TE
AD7545LP
AD7545UE
AD7545GLP
AD7545GUE
0°C to +70°C
–25°C to +85°C
–55°C to +125°C
0°C to +70°C
–25°C to +85°C
–55°C to +125°C
0°C to +70°C
–25°C to +85°C
–55°C to +125°C
0°C to +70°C
–25°C to +85°C
–55°C to +125°C
0°C to +70°C
–55°C to +125°C
0°C to +70°C
–55°C to +125°C
0°C to +70°C
–55°C to +125°C
0°C to +70°C
–55°C to +125°C
± 2 LSB
± 2 LSB
± 2 LSB
± 1 LSB
± 1 LSB
± 1 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 2 LSB
± 2 LSB
± 1 LSB
± 1 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 1/2 LSB
± 20 LSB
± 20 LSB
± 20 LSB
± 10 LSB
± 10 LSB
± 10 LSB
± 5 LSB
± 5 LSB
± 5 LSB
± 1 LSB
± 1 LSB
± 1 LSB
± 20 LSB
± 20 LSB
± 10 LSB
± 10 LSB
± 5 LSB
± 5 LSB
± 1 LSB
± 1 LSB
Package
Options3
N-20
Q-20
Q-20
N-20
Q-20
Q-20
N-20
Q-20
Q-20
N-20
Q-20
Q-20
P-20A
E-20A
P-20A
E-20A
P-20A
E-20A
P-20A
E-20A
NOTES
1
Analog Devices reserves the right to ship either ceramic (D-20) in lieu of cerdip
packages (Q-20).
2
To order MIL-STD-883, Class B process parts, add /883B to part number.
Contact local sales office for military data sheet. For U.S. Standard Military
DRAWING (SMD) see DESC drawing 5962-87702.
3
E = Leadless Ceramic Chip Carrier; N = Plastic DIP; P = Plastic Leaded Chip
Carrier; Q = Cerdip.
–3–
AD7545
power supply. To minimize power supply currents it is recommended that the digital input voltages be as close as practicably
possible to the supply rails (VDD and DGND).
CIRCUIT INFORMATION—D/A CONVERTER SECTION
Figure 1 shows a simplified circuit of the D/A converter section
of the AD7545 and Figure 2 gives an approximate equivalent
circuit. Note that the ladder termination resistor is connected to
AGND. R is typically 11 kΩ.
VREF
R
R
2R
R
2R
The AD7545 may be operated with any supply voltage in the
range 5 ≤ VDD ≤ 15 volts. With VDD = +15 V the input logic
levels are CMOS compatible only, i.e., 1.5 V and 13.5 V.
R
2R
2R
2R
2R
BASIC APPLICATIONS
Figures 4 and 5 show simple unipolar and bipolar circuits using
the AD7545. Resistor R1 is used to trim for full scale. The
“G” versions (AD7545GLN, AD7545GCQ, AD7545GUD)
have a guaranteed maximum gain error of ± 1 LSB at +25°C
(VDD = +5 V), and in many applications it should be possible to
dispense with gain trim resistors altogether. Capacitor C1 provides
phase compensation and helps prevent overshoot and ringing when
using high speed op amps. Note that all the circuits of Figures 4, 5
and 6 have constant input impedance at the VREF terminal.
RFB
OUT 1
AGND
DB11
(MSB)
DB10
DB9
DB1
DB0
(LSB)
Figure 1. Simplified D/A Circuit of AD7545
The binary weighted currents are switched between the OUT1
bus line and AGND by N-channel switches, thus maintaining a
constant current in each ladder leg independent of the switch
state.
The circuit of Figure 1 can either be used as a fixed reference
D/A converter so that it provides an analog output voltage in the
range 0 to –VIN (note the inversion introduced by the op amp),
or VIN can be an ac signal in which case the circuit behaves as
an attenuator (2-Quadrant Multiplier). VIN can be any voltage
in the range –20 ≤ VIN + 20 volts (provided the op amp can
handle such voltages) since VREF is permitted to exceed VDD.
Table II shows the code relationship for the circuit of Figure 4.
The capacitance at the OUT1 bus line, COUT1, is code dependent and varies from 70 pF (all switches to AGND) to 200 pF
(all switches to OUT1).
One of the current switches is shown in Figure 2. The input
resistance at VREF (Figure 1) is always equal to RLDR (RLDR is
the R/2R ladder characteristic resistance and is equal to value
“R”). Since RIN at the VREF pin is constant, the reference terminal can be driven by a reference voltage or a reference current,
ac or dc, of positive or negative polarity. (If a current source is
used, a low temperature coefficient external RFB is recommended
to define scale factor.)
VDD
VIN
R1*
R2*
18
20
VDD
RFB
19 VREF
C1
33pF
OUT1 1
VOUT
AD7545
AGND
2
AD544L
(SEE TEXT)
DGND
3
ANALOG
COMMON
TO LADDER
DB11–DB0
FROM
INTERFACE
LOGIC
*REFER TO TABLE I
Figure 4. Unipolar Binary Operation
AGND
Table I. Recommended Trim Resistor Values vs. Grades for
VDD = +5 V
OUT 1
Figure 2. N-Channel Current Steering Switch
Trim
Resistor
J/A/S
K/B/T
L/C/U
GL/GC/GU
R1
R2
500 Ω
150 Ω
200 Ω
68 Ω
100 Ω
33 Ω
20 Ω
6.8 Ω
CIRCUIT INFORMATION—DIGITAL SECTION
Figure 3 shows the digital structure for one bit.
The digital signals CONTROL and CONTROL are generated
from CS and WR.
Table II. Unipolar Binary Code Table for Circuit of Figure 4
TO AGND SWITCH
VIN
Binary Number in DAC Register Analog Output
TO OUT1 SWITCH
1111
1111
1111
 4095 
–VIN  4096 


Figure 3. Digital Input Structure
1000
0000
0000
The input buffers are simple CMOS inverters designed so that
when the AD7545 is operated with VDD = 5 V, the buffers convert TTL input levels (2.4 V and 0.8 V) into CMOS logic levels.
When VIN is in the region of 2.0 volts to 3.5 volts, the input
buffers operate in their linear region and draw current from the
 2048 
–VIN  4096  = –1/2 VIN


0000
0000
0001
0000
0000
0000
 1 
–VIN  4096 


0 Volts
INPUT BUFFERS
CONTROL
CONTROL
–4–
REV. A
AD7545
Figure 5 and Table III illustrate the recommended circuit and
code relationship for bipolar operation. The D/A function itself
uses offset binary code and inverter U1 on the MSB line converts twos complement input code to offset binary code. If appropriate; inversion of the MSB may be done in software using
an exclusive –OR instruction and the inverter omitted. R3, R4
and R5 must be selected to match within 0.01% and they should
be the same type of resistor (preferably wire-wound or metal
foil), so their temperature coefficients match. Mismatch of R3
value to R4 causes both offset and full-scale error. Mismatch of
R5 and R4 and R3 causes full-scale error.
VDD
R1*
VIN
R2*
C1
33pF
18
20
VDD
RFB
19 VREF
AGND
2
VOUT
ANALOG
COMMON
*FOR VALUES OF R1 AND R2
SEE TABLE I.
DATA INPUT
Figure 5. Bipolar Operation (Twos Complement Code)
Table III. Twos Complement Code Table for Circuit of
Figure 5
Data Input
1111
Analog Output
1111
 2047 
+VIN ×  2048 


0000
0000
0001
 1 
+VIN ×  2048 


0000
0000
0000
0 Volts
1111
1111
1111
 1 
–VIN ×  2048 


1000
0000
0000
 2048 
–VIN ×  2048 


R1*
19 VREF
RFB
OUT1 1
AD7545
R3
10kΩ
A1
AGND 2
DB11–DB0
10%
AD544L
3
VOUT
A2
AD544J
1/2 AD7592JN
ANALOG
COMMON
12
1
1111 1111 1111
 4095 
– VIN × 

 4096 
Another cause of digital glitches is capacitive coupling from the
digital lines to the OUT1 and AGND terminals. This should be
minimized by screening the analog pins of the AD7545 (Pins 1,
2, 19, 20) from the digital pins by a ground track run between
Pins 2 and 3 and between Pins 18 and 19 of the AD7545. Note
how the analog pins are at one end of the package and separated
from the digital pins by VDD and DGND to aid screening at
the board level. On-chip capacitive coupling can also give rise
to crosstalk from the digital-to-analog sections of the AD7545,
particularly in circuits with high currents and fast rise and
fall times. This type of crosstalk is minimized by using
R5
20kΩ
R4
20kΩ
C1
33pF
20
VDD
VIN
0000 0000 0000
0000 0000 0000
Digital Glitches: When WR and CS are both low the latches
are transparent and the D/A converter inputs follow the data
inputs. In some bus systems, data on the data bus is not always
valid for the whole period during which WR is low and as a
result invalid data can briefly occur at the D/A converter inputs
during a write cycle. Such invalid data can cause unwanted
glitches at the output of the D/A converter. The solution to this
problem, if it occurs, is to retime the write pulse WR so that it
only occurs when data is valid.
R2*
18
0
1
 4095 
+ VIN × 

 4096 
0 Volts
0 Volts
General Ground Management: AC or transient voltages
between AGND and DGND can cause noise injection into the
analog output. The simplest method of ensuring that voltages at
AGND and DGND are equal is to tie AGND and DGND
together at the AD7545. In more complex systems where the
AGND and DGND intertie is on the backplane, it is recommended that two diodes be connected in inverse parallel
between the AD7545 AGND and DGND pins (IN914 or
equivalent).
Figure 6 shows an alternative method of achieving bipolar output. The circuit operates with sign plus magnitude code and has
the advantage of giving 12-bit resolution in each quadrant, compared with 11-bit resolution per quadrant for the circuit of Figure 5. The AD7592 is a fully protected CMOS change-over
switch with data latches. R4 and R5 should match each other to
0.01% to maintain the accuracy of the D/A converter. Mismatch
between R4 and R5 introduces a gain error.
VDD
1111 1111 1111
Output Offset: (CMOS D/A converters exhibit a code dependent output resistance which, in turn, causes a code dependent
amplifier noise gain. The effect is a code dependent differential
nonlinearity term at the amplifier output that depends on VOS
where VOS is the amplifier input offset voltage. To maintain
monotonic operation it is recommended that VOS be no greater
than 25 × 10–6) (VREF) over the temperature range of operation.
Suitable op amps are AD517L and AD544L. The AD517L is
best suited for fixed reference applications with low bandwidth
requirements: it has extremely low offset (50 µV) and in most
applications will not require an offset trim. The AD544L has a
much wider bandwidth and higher slew rate and is recommended
for multiplying and other applications requiring fast settling. An
offset trim on the AD544L may be necessary in some circuits.
AD544J
11
12
0111
0
Analog Output, VOUT
APPLICATIONS HINTS
A2
R6
5kΩ
AD544L
10%
U1
(SEE TEXT)
Binary Number in DAC
MSB
LSB
A1
DB10–DB0
4
Sign
Bit
Note: Sign bit of “0” connects R3 to GND.
R5
20kΩ
R3
10kΩ
OUT1 1
AD7545
DB11
R4
20kΩ
Table IV. 12-Plus Sign Magnitude Code Table for Circuit of
Figure 6
SIGN BIT
*FOR VALUES OF R1 AND R2
SEE TABLE I.
Figure 6. 12-Bit Plus Sign Magnitude D/A Converter
REV. A
–5–
AD7545
V DD = +5 volts. However, great care should be taken to ensure
that the +5 V used to power the AD7545 is free from digitally
induced noise.
+2
Temperature Coefficients: The gain temperature coefficient
of the AD7545 has a maximum value of 5 ppm/°C and a typical
value of 2 ppm/°C. This corresponds to worst case gain shifts of
2 LSBs and 0.8 LSBs respectively over a 100°C temperature
range. When trim resistors Rl and R2 are used to adjust fullscale range, the temperature coefficient of R1 and R2 should
also be taken into account. The reader is referred to Analog
Devices Application Note “Gain Error and Gain Temperature
Coefficient of CMOS Multiplying DACs,” Publication Number
E630–10–6/81.
DNL – LSB
+1
0
–1
–2
0
SINGLE SUPPLY OPERATION
10
5
15
VDD – Volts
The ladder termination resistor of the AD7545 (Figure 1) is
connected to AGND. This arrangement is particularly suitable
for single supply operation because OUT1 and AGND may be
biased at any voltage between DGND and VDD. OUT1 and
AGND should never go more than 0.3 volts less than DGND or
an internal diode will be turned on and a heavy current may
flow which will damage the device. (The AD7545 is, however,
protected from the SCR latch-up phenomenon prevalent in
many CMOS devices.)
Figure 8. Differential Nonlinearity vs. VDD for Figure 7
Circuit. Reference Voltage = 2.5 Volts. Shaded Area Shows
Range of Values of Differential Nonlinearity that Typically
Occur for L, C and U Grades.
0.5
Figure 7 shows the AD7545 connected in a voltage switching
mode. OUT1 is connected to the reference voltage and AGND
is connected to DGND. The D/A converter output voltage is
available at the VREF pin and has a constant output impedance
equal to R. RFB is not used in this circuit.
DNL – LSB
0.0
–0.5
–1.0
+15V
18
REFERENCE
VOLTAGE
–1.5
VDD
1
OUT1
2
AGND
DGND
AD7545
3
VREF 19
VO
–2.0
DB11–DB0
0
5
VREF – Volts
10
12
Figure 9. Differential Nonlinearity vs. Reference Voltage
for Figure 7 Circuit. VDD = 15 Volts. Shaded Area Shows
Range of Values of Differential Nonlinearity that Typically
Occur for L, C and U Grades.
15 VOLT CMOS DIGITAL INPUTS
Figure 7. Single Supply Operation Using Voltage
Switching Mode
The circuits of Figures 4, 5 and 6 can all be converted to single
supply operation by biasing AGND to some voltage between
VDD and DGND. Figure 10 shows the twos complement bipolar
circuit of Figure 5 modified to give a range from +2 V to +8 V
about a “pseudo-analog ground” of 5 V. This voltage range
would allow operation from a single VDD of +10 V to +15 V.
The AD584 pin-programmable reference fixes AGND at +5 V.
VIN is set at +2 V by means of the series resistors R1 and R2.
There is no need to buffer the VREF input to the AD7545
with an amplifier because the input impedance of the D/A converter is constant. Note, however, that since the temperature
coefficient of the D/A reference input resistance is typically
–300 ppm/°C; applications that experience wide temperature
variations may require a buffer amplifier to generate the +2.0 V
at the AD7545 VREF pin. Other output voltage ranges can be
obtained by changing R4 to shift the zero point and (R1 + R2)
to change the slope, or gain, of the D/A transfer function. VDD
must be kept at least 5 V above OUT1 to ensure that linearity is
preserved.
The loading on the reference voltage source is code dependent
and the response time of the circuit is often determined by the
behavior of the reference voltage with changing load conditions.
To maintain linearity, the voltages at OUT1 and AGND should
remain within 2.5 volts of each other, for a VDD of 15 volts. If
VDD is reduced from 15 V, or the differential voltage between
OUT1 and AGND is increased to more than 2.5 V, the differential nonlinearity of the DAC will increase and the linearity of
the DAC will be degraded. Figures 8 and 9 show typical curves
illustrating this effect for various values of reference voltage and
VDD. If the output voltage is required to be offset from ground
by some value, then OUT1 and AGND may be biased up. The
effect on linearity and differential nonlinearity will be the same
as reducing VDD by the amount of the offset.
–6–
REV. A
AD7545
VDD = +10V TO +15V
18
+2V
VDD
19 VREF
R1
10KΩ
MSB
4
RFB
R3
10kΩ
OUT1 1
AD7545
DB10–DB0
R5
20kΩ
C1
33pF
20
A1
2
AGND
DGND
+5V
3
1
2
DATA
AD544J
R6
5kΩ
VDD
R2
2kΩ
AD584J
VO
A2
AD544L
R4
33.3kΩ
8
Figure 12 shows an alternative approach for use with 8-bit
processors which have a full 16-bit wide address bus such as
6800, 8080, Z80 This technique uses the 12 lower address lines
of the processor address bus to supply data to the DAC, thus
each AD7545 connected in this way uses 4k bytes of address
locations. Data is written to the DAC using a single memory
write instruction. The address field of the instruction is organized so that the lower 12 bits contain the data for the DAC and
the upper 4 bits contain the address of the 4k block at which the
DAC resides.
4
A15
CMOS DATA BUS
VDD = +10V TO +15V
16-BIT ADDRESS BUS
A0
4
Figure 10. Single Supply “Bipolar” Twos Complement
D/A Converter
ADDRESS
DECODE
CPU
MICROPROCESSOR INTERFACING OF THE AD7545
WR
DATA BUS
D0
Figure 12. Connecting the AD7545 to 8-Bit Processors via
the Address Bus
SUPPLEMENTAL APPLICATION MATERIAL
ADDRESS BUS
For further information on CMOS multiplying D/A converters
the reader is referred to the following texts:
A0
CPU
CS
Application Guide to CMOS Multiplying D/A converters
available from Analog Devices, Publication Number G479.
CS
Gain Error and Gain Temperature Coefficient of CMOS
Multiplying DACS—Application Note, Publication Number
E630–10–6/81 available from Analog Devices.
DB11
LATCH
4
4
DB8
WR
AD7545
WR
WR
DB7
8
DB0
D7
8-BIT DATA BUS
8
D0
* Q0 = DECODED ADDRESS FOR DAC
Q1 = DECODED ADDRESS FOR LATCH
Figure 11. 8-Bit Processor to AD7545 Interface
REV. A
WR
D7
A15
Q1*
AD7545
CS
A typical interface circuit for an 8-bit processor is shown in
Figure 11. This arrangement uses two memory addresses, one
for the lower eight bits of data to the DAC and one for the upper four bits of data into the DAC via the latch.
Q0*
DB0
Q0
The AD7545 can directly interface to both 8- and 16-bit microprocessors via its 12-bit wide data latch using standard CS and
WR control signals.
ADDRESS
DECODE
DB11
12
–7–
AD7545
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
20-Lead Plastic DIP
(N-20)
20-Terminal Leadless Ceramic Chip Carrier (LCCC)
(E-20A)
C670d–0–6/97
20-Lead Cerdip
(Q-20)
PRINTED IN U.S.A.
20-Lead Plastic Leaded Chip Carrier (PLCC)
(P-20A)
–8–
REV. A
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