AD ADP3304 High accuracy anycap 100 ma low dropout linear regulator Datasheet

a
High Accuracy anyCAP™*
100 mA Low Dropout Linear Regulator
ADP3301
FEATURES
High Accuracy (Over Line and Load Regulations
at +258C): 60.8%
Ultralow Dropout Voltage: 100 mV Typical @ 100 mA
Requires Only CO = 0.47 mF for Stability
anyCAP™* = Stable with All Types of Capacitors
Current and Thermal Limiting
Low Noise
Dropout Detector
Low Shutdown Current: 1 mA
Several Fixed Voltage Options
3.0 V to 12 V Supply Range
–208C to +858C Ambient Temperature Range
Thermally Enhanced SO-8 Package
Excellent Line and Load Regulations
APPLICATIONS
Cellular Telephones
Notebook, Palmtop Computers
Battery Powered Systems
Portable Instruments
Post Regulator for Switching Supplies
Bar Code Scanners
GENERAL DESCRIPTION
The ADP3301 is a member of the ADP330x family of precision
low dropout anyCAP™* voltage regulators. The ADP3301
stands out from the conventional LDOs with a novel architecture, an enhanced process and a new package. Its patented
design includes a noninverting wideband driver and a stage that
permits the use of an internal “pole splitting” capacitor to
stabilize the feedback loop with a single output capacitor as
small as 0.47 µF. This device is stable with any type of capacitor
regardless of its ESR (Equivalent Serial Resistance) value,
including ceramic types (MLCC) for space restricted applications. The ADP3301 achieves exceptional accuracy of ± 0.8% at
room temperature and ± 1.4% overall accuracy over temperature, line and load regulations. The dropout voltage of the
ADP3301 is only 100 mV (typical) at 100 mA.
FUNCTIONAL BLOCK DIAGRAM
THERMAL
PROTECTION
ERR
OUT
R1
CC
Q2
DRIVER
Gm
SD
R2
BANDGAP
REF
GND
The ADP3301 operates with a wide input voltage range from
3 V to 12 V and delivers a load current in excess of 100 mA. It
features an error flag that signals when the device is about to
lose regulation or when the short circuit or thermal overload
protection is activated. Other features include shutdown and
optional noise reduction capabilities. The ADP330x anyCAP™*
LDO family offers a wide range of output voltages and output
current levels from 50 mA to 300 mA:
ADP3300 (50 mA, SOT-23)
ADP3302 (100 mA, Dual Output)
ADP3304 (100 mA, Dual Output with Separate Grounds)
ADP3303 (200 mA)
ADP3306 (300 mA)
NR 3
ADP3301-5.0
VIN
7
1
IN
OUT
8
2
C1
0.47µF
ERR 6
VOUT = +5V
R1
330kΩ
C2
0.47µF
EOUT
4
5
In addition to the new architecture and process, ADI’s new
proprietary thermally enhanced package (Thermal Coastline)
can handle 1 W of power dissipation without external heat sink
or large copper surface on the PC board. This keeps PC board
real estate to a minimum and makes the ADP3301 very
attractive for use in portable equipment.
ADP3301
Q1
IN
ON
OFF
GND
Figure 1. Typical Application Circuit
*anyCAP is a trademark of Analog Devices Inc.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
© Analog Devices, Inc., 1997
ADP3301–xx–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS (@ T = –208C to +858C, V
A
IN
= 7 V, CIN = 0.47 mF, COUT = 0.47 mF, unless otherwise noted)1
Parameter
Symbol
Conditions
Min
OUTPUT VOLTAGE
ACCURACY
VOUT
VIN = Nom VOUT +0.3 V to 12 V
IL = 0.1 mA to 100 mA
TA = +25°C
VIN = Nom VOUT +0.3 V to 12 V
IL = 0.1 mA to 100 mA
Typ
Max
Units
–0.8
+0.8
%
–1.4
+1.4
%
∆VO
∆VIN
VIN = Nom VOUT +0.3 V to 12 V
TA = +25°C
0.024
mV/V
∆VO
∆IL
IL = 0.1 mA to 100 mA
TA = +25°C
0.014
mV/mA
GROUND CURRENT
IGND
IL = 100 mA
IL = 0.1 mA
0.85
0.18
2
0.3
mA
mA
GROUND CURRENT
IN DROPOUT
IGND
VIN = 2.5 V
IL = 0.1 mA
0.6
1.2
mA
DROPOUT VOLTAGE
VDROP
VOUT = 98% of VO Nominal
IL = 100 mA
IL = 10 mA
IL = 1 mA
0.1
0.02
0.003
0.2
0.07
0.03
V
V
V
0.9
0.9
0.3
V
V
1
22
µA
µA
1
µA
5
µA
LINE REGULATION
LOAD REGULATION
SHUTDOWN THRESHOLD
VTHSD
ON
OFF
2.0
SHUTDOWN PIN
INPUT CURRENT
ISDIN
0 < VSD < 5 V
5 ≤ VSD ≤ 12 V @ VIN = 12 V
GROUND CURRENT IN
SHUTDOWN MODE
IQ
VSD = 0, VIN = 12 V
TA = +25°C
VSD = 0, VIN = 12 V
TA = +85°C
IOSD
TA = +25°C @ VIN = 12 V
TA = +85°C @ VIN = 12 V
2
4
µA
µA
ERROR PIN OUTPUT
LEAKAGE
IEL
VEO = 5 V
13
µA
ERROR PIN OUTPUT
“LOW” VOLTAGE
VEOL
ISINK = 400 µA
0.13
0.3
V
PEAK LOAD CURRENT
ILDPK
VIN = Nom VOUT + 1 V
200
mA
THERMAL REGULATION
∆VO
VO
VIN = 12 V, IL = 100 mA
T = 10 ms
0.015
%/W
VNOISE
f = 10 Hz–100 kHz
CNR = 0
CNR = 10 nF, CL = 10 µF
100
30
µV rms
µV rms
OUTPUT CURRENT IN
SHUTDOWN MODE
OUTPUT NOISE
@ 5 V OUTPUT
NOTES
1
Ambient temperature of +85°C corresponds to a typical junction temperature of +125°C under typical full load test conditions.
Specifications subject to change without notice.
–2–
REV. 0
ADP3301
ABSOLUTE MAXIMUM RATINGS*
PIN FUNCTION DESCRIPTIONS
Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V
Error Flag Output Voltage . . . . . . . . . . . . . . . –0.3 V to +16 V
Noise Bypass Pin Voltage . . . . . . . . . . . . . . . . –0.3 V to +5 V
Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Ambient Temperature Range . . . –55°C to +125°C
Operating Junction Temperature Range . . . –55°C to +125°C
θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Pin
Mnemonic
Function
1&2
OUT
Output of the Regulator, fixed 2.7, 3.0,
3.2, 3.3 or 5 volts output voltage. Bypass to ground with a 0.47 µF or larger
capacitor. Pins 1 and 2 must be connected together for proper operation.
3
NR
Noise Reduction Pin. Used for further
reduction of the output noise. (See text
for details.) No connection if not used.
4
GND
Ground Pin.
5
SD
Active Low Shutdown Pin. Connect to
ground to disable the regulator output.
When shutdown is not used, this pin
should be connected to the input pin.
6
ERR
Open Collector Output which goes low
to indicate that the output is about to
go out of regulation.
7&8
IN
Regulator Input. Pins 7 and 8 must
be connected together for proper
operation.
*This is a stress rating only; functional operation of the device at these or any other
conditions above those indicated in the operation section of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
ORDERING GUIDE
Model
Voltage Output
Package Option*
ADP3301AR-2.7
ADP3301AR-3
ADP3301AR-3.2
ADP3301AR-3.3
ADP3301AR-5
2.7 V
3.0 V
3.2 V
3.3 V
5.0 V
SO-8
SO-8
SO-8
SO-8
SO-8
PIN CONFIGURATION
Contact the factory for the availability of other output voltage options.
*SO = Small Outline.
Other Members of anyCAP™* Family
8 IN
OUT 1
OUT 2
1
ADP3301
7 IN
TOP VIEW
6 ERR
(Not to Scale)
5 SD
GND 4
NR 3
Model
Output
Current
Package
Option2
ADP3300
ADP3302
ADP3304
50 mA
100 mA
100 mA
SOT-23
SO-8
SO-8
ADP3303
ADP3306
200 mA
300 mA
Comments
PIN FOR 5V DEVICE
High Accuracy
Dual Output
Dual Output with
Separate Grounds
SO-8
High Accuracy
SO-8,TSSOP-14 High Accuracy,
High Current
NOTES
1
See individual data sheets for detailed ordering information.
2
SO = Small Outline, SOT = Surface Mount, TSSOP = Thin Shrink Small
Outline.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADP3301 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. 0
–3–
WARNING!
ESD SENSITIVE DEVICE
ADP3301–Typical Performance Characteristics
4.9997
IL = 50mA
4.9994
4.9991
IL = 100mA
4.9988
4.9985
VOUT = 5V
4.99925
4.99850
4.99775
4.99700
4.9982
4.99625
4.9979
5.2 6
4.99550
7
8 9 10 11 12 13 14 15 16
INPUT VOLTAGE – Volts
Figure 2. Line Regulation: Output
Voltage vs. Input Voltage
40
Figure 3. Output Voltage vs. Load
Current Up to 200 mA
170
0
10 20
30 40 50 60 70 80 90 100
OUTPUT LOAD – mA
Figure 5. Quiescent Current vs. Load
Current
IL = 0
–0.1
–0.2
–0.4
–45 –25 –5
15
35
55
75
0
0
20 40
60 80 100 120 140 160 180 200
OUTPUT LOAD – mA
Figure 8. Dropout Voltage vs. Output
Current
600
400
IL = 0
TEMPERATURE – °C
Figure 6. Output Voltage Variation %
vs. Temperature
8.0
VIN
4
3
2
RL = 33Ω
1
0
5
25 45 65 85 105 125
TEMPERATURE – °C
Figure 7. Quiescent Current vs.
Temperature
INPUT-OUTPUT VOLTAGE – Volts
INPUT-OUTPUT VOLTAGE – Volts
INPUT-OUTPUT VOLTAGE – mV
40
IL = 100mA
800
0
–45 –25 –15
95 115 135
VOUT = 3.3V
80
1000
200
5
120
1.2 2.4 3.6 4.8 6 7.2 8.4 9.6 10.8 12
INPUT VOLTAGE – Volts
1200
0.0
200
160
0.2
1400
–0.3
270
0.4
0.3
Figure 4. Quiescent Current vs. Supply Voltage
GROUND CURRENT – µA
IL = 0 TO 100mA
370
OUTPUT VOLTAGE – %
GROUND CURRENT – µA
470
0.5
0
0.1
570
0.6
60 80 100 120 140 160 180 200
OUTPUT LOAD – mA
870
670
0.7
0
20
0.2
770
0.8
0.1
0
970
VOUT = 5V
IL = 0
0.9
VOUT = 5V
VIN = 7V
5.00000
IL = 10mA
OUTPUT VOLTAGE – Volts
OUTPUT VOLTAGE – Volts
5.0000
1.0
5.00075
IL = 0mA
GROUND CURRENT – mA
5.0003
7.0
6.0
5.0
4.0
1
2
3
4
3
2
INPUT VOLTAGE – Volts
1
0
Figure 9. Power-Up/Power-Down
–4–
SD = VIN OR 3V
RL = 33Ω ÷ 3.3kΩ
CL = 0.47µF
VOUT = 3.3V
2.0
1.0
0
0
VOUT
3.0
0
20
40 60
80 100 120 140 160 180 200
TIME – µs
Figure 10. Power-Up Overshoot
REV. 0
ADP3301
5.02
5.02
VOUT = 5V
VOUT = 5V
VOUT = 5V
5.01
5.01
0.02
5.00
5.00
5.01
4.99
50Ω, 0.47µF LOAD
Volts
4.98
VIN
I(VOUT)
VIN
100
1
7.0
0
20 40
60 80 100 120 140 160 180 200
TIME – µs
Figure 11. Line Transient Response
CL = 10µF
VOUT = 3.3V
0
40
0
80 120 160 200 240 280 320 360 400
TIME – µs
Figure 12. Line Transient Response
3.3V
3.5
8
400
4
3.298
300
mA
IOUT
0
100
100
5
10
0
0
mA
400
Figure 14. Load Transient for 10 mA
to 100 mA Pulse
2
3
TIME – sec
4
5
0
C = 0.47µF
R = 33Ω ON 3.3V OUTPUT
VOUT = 3.3V
–10
RIPPLE REJECTION – dB
3
2
VOUT
1
0
5
0
5 10
15
20 25 30 35 40 45
TIME – µs
Figure 17. Turn-Off
REV. 0
–20
–30
VOUT = 3.3V
a. 0.47µF, RL = 33kΩ
b. 0.47µF, RL = 33Ω
c. 10µF, RL = 33kΩ
d. 10µF, RL = 33Ω
b
–40
–50
d
a
–60
–70
c
b d
–80
–90
VSD
50
5.0V
CL = 10µF, RL = 5kΩ
0
40
Figure 15. Short Circuit Current
4
0
1
0
500
CL = 0.47µF, RL = 5kΩ
2
200
I(VOUT)
Volts
Volts
3.300
200
300
TIME – µs
1000
800
VOUT
6
100
400
600
TIME – µs
Figure 13. Load Transient for 1 mA
to 100 mA Pulse
0
3.302
0
200
VOUT = 5V
Volts
3.304
Volts
4.99
4.98
7.5
7.0
5.00
mA
7.5
5kΩ, 0.47µF LOAD
–100
10
a c
100
1k
10k 100k
FREQUENCY – Hz
1M
10M
Figure 18. Power Supply Ripple
Rejection
–5–
80
120
TIME – µs
160
200
Figure 16. Turn-On
VOLTAGE NOISE SPECTRAL DENSITY – µV/ Hz
Volts
4.99
Volts
CL = 0.47µF
10
0.47µF BYPASS
PIN 7, 8 TO PIN 3
VOUT = 5V, CL = 0.47µF,
IL = 1mA, CNR = 0
1
VOUT = 3.3V, CL = 0.47µF,
IL = 1mA, CNR = 0
0.1
0.01
100
VOUT = 2.7-5.0V, CL = 10µF,
IL = 1mA, CNR = 10nF
1k
10k
FREQUENCY – Hz
100k
Figure 19. Output Noise Density
ADP3301
APPLICATION INFORMATION
Thermal Overload Protection
anyCAP™*
The ADP3301 is very easy to use. The only external component
required for stability is a small 0.47 µF bypass capacitor on the
output. Unlike the conventional LDO designs, the ADP3301 is
stable with virtually any type of capacitors (anyCAP™*) independent of the capacitor’s ESR (Effective Series Resistance) value.
In a typical application, if the shutdown feature is not used, the
shutdown pin (Pin 5) should be tied to the input pin. Pins 7
and 8 must be tied together, as well as Pins 1 and 2, for proper
operation.
The ADP3301 is protected against damage due to excessive
power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and
high power dissipation) where die temperature starts to rise
above 165°C, the output current is reduced until die temperature has dropped to a safe level. Output current is restored when
the die temperature is reduced.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
so that junction temperatures will not exceed 125°C.
Capacitor Selection
Output Capacitors: as with any micropower device, output
transient response is a function of the output capacitance. The
ADP3301 is stable with a wide range of capacitor values, types
and ESR (anyCAP™*). A capacitor as low as 0.47 µF is all that
is needed for stability. However, larger capacitors can be used if
high output current surges are anticipated. The ADP3301 is
stable with extremely low ESR capacitors (ESR ≈ 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
Calculating Junction Temperature
Device power dissipation is calculated as follows :
PD = (VIN – VOUT) ILOAD + (VIN) IGND
Where ILOAD and IGND are load current and ground current, VIN
and VOUT are input and output voltages respectively.
Input Bypass Capacitor: an input bypass capacitor is not
required; however, for applications where the input source is
high impedance or far from the input pins, a bypass capacitor is
recommended. Connecting a 0.47 µF capacitor from the input
pins (Pins 7 and 8) to ground reduces the circuit’s sensitivity to
PC board layout. If a bigger output capacitor is used, the input
capacitor should be 1 µF minimum.
Assuming ILOAD = 100 mA, IGND = 2 mA, VIN = 9 V and
VOUT = 5.0 V, device power dissipation is:
Low ESR capacitors offer better performance on a noisy supply;
however, for less demanding requirements a standard tantalum
or aluminum electrolythic capacitor is adequate.
Junction temperature above ambient temperature will be
approximately equal to :
Noise Reduction
To limit the maximum junction temperature to 125°C, maximum ambient temperature must be lower than:
PD = (9 V – 5 V) 100 mA + (9 V) 2 mA = 418 mW
The proprietary package used in ADP3301 has a thermal
resistance of 96°C/W, significantly lower than a standard
8-pin SOIC package at 170°C/W.
0.418 W × 96°C/W = 40.1°C
A noise reduction capacitor (CNR) can be used to further reduce
the noise by 6 dB–10 dB (Figure 20). Low leakage capacitors in
the 10 nF–100 nF range provide the best performance. Since
the noise reduction pin (NR) is internally connected to a high
impedance node, any connection to this node should be carefully
done to avoid noise pickup from external sources. The pad
connected to this pin should be as small as possible. Long PC
board traces are not recommended.
TA(MAX) = 125°C – 40.1°C = 84.9°C
Printed Circuit Board Layout Consideration
All surface mount packages rely on the traces of the PC board to
conduct heat away from the package.
In standard packages the dominant component of the heat
resistance path is the plastic between the die attach pad and the
individual leads. In typical thermally enhanced packages, one or
more of the leads are fused to the die attach pad, significantly
decreasing this component. However, to make the improvement
meaningful, a significant copper area on the PCB has to be
attached to these fused pins.
NR 3
CNR
10nF
ADP3301-5.0
1
7
OUT
IN
VIN
C1 +
8
1µF
ERR
2
6
VOUT = 5V
R1
+
330kΩ
EOUT
C2
10µF
The ADP3301’s patented thermal coastline lead frame design
uniformly minimizes the value of the dominant portion of the
thermal resistance. It ensures that heat is conducted away by all
pins of the package. This yields a very low 96°C/W thermal
resistance for an SO-8 package, without any special board
layout requirements, relying on the normal traces connected to
the leads. The thermal resistance can be decreased by approximately an additional 10% by attaching a few square cm of
copper area to the VIN pin of the ADP3301 package.
4
5
ON
OFF
SD
GND
Figure 20. Noise Reduction Circuit
–6–
REV. 0
ADP3301
It is not recommended to use solder mask or silkscreen on the
PCB traces adjacent to the ADP3301’s pins since it will increase
the junction to ambient thermal resistance of the package.
VIN = 5.5V TO 12V
IN
VOUT = 5V/3.3V
OUT
ADP3301-5.0
Shutdown Mode
OUTPUT SELECT
5V
0V
Applying a TTL high signal to the shutdown pin, or tying it to
the input pin, will turn the output ON. Pulling the shutdown
pin low, or tying it to ground, will turn the output OFF. In
shutdown mode, quiescent current is reduced to less than 1 µA.
SD
GND
IN
Error Flag Dropout Detector
C1 +
1.0µF
The ADP3301 will maintain its output voltage over a wide
range of load, input voltage and temperature conditions. If, for
example, regulation is lost by reducing the supply voltage below
the combined regulated output and dropout voltages, the ERRor
flag will be activated. The ERR output is an open collector,
which will be driven low.
OUT
ADP3301-3.3
+
C2
0.47µF
SD
GND
Figure 21. Crossover Switch
Once set, the ERRor flag’s hysteresis will keep the output low
until a small margin of operating range is restored either by
raising the supply voltage or reducing the load.
MJE253*
VIN = 6V TO 8V
VOUT = 5V @ 1A
R1
50Ω
C1
47µF
APPLICATION CIRCUITS
Crossover Switch
IN
The circuit in Figure 21 shows that two ADP3301s can be used
to form a mixed supply voltage system. The output switches
between two different levels selected by an external digital input.
Output voltages can be any combination of voltages from the
Ordering Guide.
OUT
C2
10µF
ADP3301-5
SD
ERR
GND
Higher Output Current
*AAVID531002 HEAT SINK IS USED
The ADP3301 can source up to 100 mA without any heatsink
or pass transistor. If higher current is needed, an appropriate
pass transistor can be used, as in Figure 22, to increase the
output current to 1 A.
Figure 22. High Output Current Linear Regulator
Step-Up/Step-Down Post Regulator
The circuit in Figure 23 provides a high precision, low dropout
regulated output voltage. It significantly reduces the ripple from
a switching regulator. The ADP3000 used in this circuit is a
switching regulator in the step-up configuration.
L1
6.8µH
VIN = 2.5V TO 3.5V
D1
1N5817
ADP3301-3.3
IN
C1
100µF
10V
R1
120Ω
ILIM
C2
100µF
10V
VIN
R2
19.6kΩ
1%
OUT
GND
SW1
C3
2.2µF
ADP3000-ADJ
GND
SW2
FB
R3
10kΩ
1%
Figure 23. Step-Up/Step-Down Post Regulator
REV. 0
3.3V @ 100mA
–7–
ADP3301
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
8-Pin Small Outline Package
(SO-8)
0.1574 (4.00)
0.1497 (3.80)
PIN 1
SEATING
PLANE
5
1
4
0.2440 (6.20)
0.2284 (5.80)
0.0688 (1.75)
0.0532 (1.35)
0.0500 0.0192 (0.49)
(1.27) 0.0138 (0.35)
BSC
0.0196 (0.50)
x 45°
0.0099 (0.25)
0.0098 (0.25)
0.0075 (0.19)
8°
0°
0.0500 (1.27)
0.0160 (0.41)
PRINTED IN U.S.A.
0.0098 (0.25)
0.0040 (0.10)
8
C2985-12-2/97
0.1968 (5.00)
0.1890 (4.80)
–8–
REV. 0