AM26LV32E www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008 LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE RECEIVER WITH ±15-kV IEC ESD PROTECTION FEATURES 1 • • • • • 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 4B 4A 4Y G 3Y 3A 3B RGY PACKAGE (TOP VIEW) 1A 1Y G 2Y 2A 2B VCC • 1B 1A 1Y G 2Y 2A 2B GND 1 16 2 15 4B 3 4 14 4A 5 6 12 G 13 4Y 11 3Y 10 3A 7 8 9 3B • • • D, NS, OR PW PACKAGE (TOP VIEW) 1B • • Meets or Exceeds Standard TIA/EIA-422-B and ITU Recommendation V.11 Operates From a Single 3.3-V Power Supply ESD Protection for RS422 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge Switching Rates up to 32 MHz Low Power Dissipation: 27 mW Typ Open-Circuit, Short-Circuit, and Terminated Fail-Safe ±7-V Common-Mode Input Voltage Range With ±200-mV Sensitivity Accepts 5-V Logic Inputs With 3.3-V Supply (Enable Inputs) Input Hysteresis: 35 mV Typ Pin-to-Pin Compatible With AM26C32, AM26LS32 Ioff Supports Partial-Power-Down Mode Operation Package Options: SOP, SOIC, TSSOP, QFN GND • DESCRIPTION/ORDERING INFORMATION The AM26LV32E consists of quadruple differential line receivers with 3-state outputs. These differential receivers have ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection for RS422 bus pins. This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11 drivers with reduced supply voltage. The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The 3-state outputs permit connection directly to a bus-organized system. The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage signal at the receiver outputs. In the open fail-safe, shorted fail-safe, and terminated fail-safe, a high state is produced at the respective output. This device is supported for partial-power-down applications using Ioff. Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The AM26LV32EI is characterized for operation from –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated AM26LV32E SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – D Tape and reel AM26LV32EIDR AM26LV32EI SOP – NS Tape and reel AM26LV32EINSR 26LV32EI TSSOP – PW Tape and reel AM26LV32EIPWR SB32 QFN – RGY Tape and reel AM26LV32EIRGYR SB32 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE (1) (each receiver) ENABLES DIFFERENTIAL INPUT VID ≥ 0.2 V G H X H X L H H X ? X L ? H X L X L L Open, shorted, or terminated H X H X L H X L H Z –0.2 V < VID < 0.2 V VID ≤ –0.2 V (1) OUTPUT G H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate LOGIC DIAGRAM (POSITIVE LOGIC) G 4 12 G 1A 2 1B 1 2A 6 2B 7 3A 10 3B 9 4A 14 4B 15 2 3 1Y 5 2Y 11 3Y 13 4Y Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E AM26LV32E www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008 SCHEMATIC EQUIVALENT OF EACH INPUT (A, B) EQUIVALENT OF EACH ENABLE INPUT (G, G) TYPICAL OF EACH RECEIVER OUTPUT VCC VCC VCC 2.4 kΩ 5 kΩ 7 kΩ Enable G, G 1.5 kΩ A, B 200 kΩ Output 1.5 kΩ VCC(A) or GND(B) 2.4 kΩ GND GND GND All resistor values are nominal. ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 6 UNIT V A or B inputs –14 14 V Enable Inputs –0.5 6 V –14 14 V VCC Supply voltage range (3) VI Input voltage range VID Differential input voltage (4) VO Output voltage range IIK Input clamp current range VI < 0 –20 mA IOK Output clamp current range VO < 0 –20 mA lO Maximum output current ±20 mA TJ Operating virtual junction temperature 150 °C –0.5 6 D package 73 NS package 64 PW package 108 V θJA Package thermal impedance (5) (6) TA Operating free-air temperature range –40 85 °C Tstg Storage temperature range –65 150 °C RGY package (1) (2) (3) (4) (5) (6) °C/W 39 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. This device is designed to meet TIA/EIA-422-B and ITU. All voltage values except differential input voltage are with respect to the network GND. Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E 3 AM26LV32E SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 3.3 UNIT VCC Supply voltage 3 3.6 V VIH Enable high-level input voltage 2 5.5 V VIL Enable low-level input voltage 0 0.8 V VIC Common-mode input voltage –7 7 mA VID Differential input voltage –7 7 mA IOH High-level output current –5 mA IOL Low-level output current 5 mA TA Operating free-air temperature 85 °C –40 ELECTRICAL CHARACTERISTICS over recommended ranges of common-mode input, supply voltage, and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VIT+ Positive-going input threshold voltage, differential input VIT– Negative-going input threshold voltage, differential input Vhys Input hysteresis (VIT+ – VIT–) VIK Input clamp voltage, G and G VOH High-level output voltage VOL Low-level output voltage IOZ High-impedance state output current VO = VCC or GND Ioff Output current with power off VCC = 0 V, VO = 0 or 5.5 V II Line input current Other input at 0 V II Enable input current, G and G VI = VCC or GND ri Input resistance VIC = –7 V to 7 V, Other input at 0 V ICC Supply current (total package) G, G = VCC or GND, No load, Line inputs open Cpd Power dissipation capacitance (2) One channel 4 MAX 0.2 –0.2 35 VID = –200 mV, IOL = 5 mA V 0.17 VID = –200 mV, IOL = 100 µA 0.5 0.1 ±50 µA µA 1.5 VI = –10 V –2.5 ±1 17 8 150 V ±100 VI = 10 V 4 V 3.2 VCC – 0.1 VID = 200 mV, IOH = –100 µA V mV –1.5 2.4 UNIT V II = –18 mA VID = 200 mV, IOH = –5 mA (1) (2) TYP (1) mA µA kΩ 17 mA pF All typical values are at VCC = 3.3 V, TA = 25°C. Cpd determines the no-load dynamic current consumption: IS = Cpd × VCC × f + ICC Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E AM26LV32E www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 8 16 26 ns 8 16 26 ns UNIT tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tt Transition time See Figure 1 5 tPZH Output-enable time to high level See Figure 2 17 40 ns tPZL Output-enable time to low level See Figure 3 10 40 ns tPHZ Output-disable time from high level See Figure 2 20 40 ns tPLZ Output-disable time from low level See Figure 3 16 40 ns tsk(p) Pulse skew See Figure 1 (2) 4 6 ns tsk(o) Pulse skew See Figure 1 (3) 4 6 ns tsk(pp) Pulse skew (device to device) See Figure 1 (4) 6 9 f(max) Maximum operating frequency See Figure 1 (1) (2) (3) (4) See Figure 1 ns 32 ns MHz All typical values are at VCC = 3.3 V, TA = 25°C. tsk(p) is |tpLH – tpHL| of each channel of same device. tsk(o) is the maximum difference in propagation delay times between any two channels of same device switching in the same direction. tsk(pp) is the maximum difference in propagation delay times between any two channels of any two devices switching in the same direction. ESD PROTECTION PARAMETER Receiver input TEST CONDITIONS TYP HBM ±15 IEC61000-4-2, Air-Gap Discharge ±15 IEC61000-4-2, Contact Discharge ±8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E UNIT kV 5 AM26LV32E SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION A Generator (see Note B) Y VO B 50 Ω CL = 15 pF (see Note A) 50 Ω A 2V B 1V Input tPLH VCC Output G G (see Note C) tPHL 90% 50% 10% 90% VOH 50% 10% V OL tr tf A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%, tr = tf ≤ 2ns. C. To test the active-low enable G, ground G and apply an inverted waveform G. Figure 1. Test Circuit and Voltage Waveforms, tPLH and tPHL VID = 1 V A Y VO B CL = 15 pF (see Note A) RL = 2 kΩ G Generator (see Note B) 50 Ω G VCC (see Note C) VCC Input 50% 50% 0V tPZH Output tPHZ VOH VOH - 0.3 V Voff ≈ 0 A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%, tr = tf ≤ 2ns. C. To test the active-low enable G, ground G and apply an inverted waveform G. Figure 2. Test Circuit and Voltage Waveforms, tPZH and tPHZ 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E AM26LV32E www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC RL = 2 kΩ A VID = 1 V Y VO B CL = 15 pF (see Note A) G Generator (see Note B) 50 Ω G VCC (see Note C) VCC Input 50% 50% 0V tPZL tPLZ Voff ≈ V CC Output VOL + 0.3 V VOL A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%, tr = tf ≤ 2ns. C. To test the active-low enable G, ground G and apply an inverted waveform G. Figure 3. Test Circuit and Voltage Waveforms, tPZL and tPLZ Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV32E 7 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26LV32EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EINSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EINSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV32EIRGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR AM26LV32EIRGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF AM26LV32E : • Enhanced Product: AM26LV32E-EP NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device AM26LV32EIDR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26LV32EINSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 AM26LV32EIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 AM26LV32EIRGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26LV32EIDR SOIC D 16 2500 346.0 346.0 33.0 AM26LV32EINSR SO NS 16 2000 346.0 346.0 33.0 AM26LV32EIPWR TSSOP PW 16 2000 346.0 346.0 29.0 AM26LV32EIRGYR VQFN RGY 16 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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