Am29LV640D/Am29LV641D Data Sheet The following document contains information on Spansion memory products. Although the docis marked with the name of the company that originally developed the specification, Spansion will continue to offer these products to existing customers. Continuity of Specifications There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been made are the result of normal data sheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appro and changes will be noted in a revision summary. Continuity of Ordering Part Numbers Spansion continues to support existing part numbers beginning with “Am” and “MBM”. To order these products, please use only the Ordering Part Numbers listed in this document. For More Information Please contact your local sales office for additional information about Spansion memory solutions. Publication Number 22366 Revision C Amendment 6 Issue Date January 22, 2007 THIS PAGE LEFT INTENTIONALLY BLANK. DATA SHEET Am29LV640D/Am29LV641D 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileIO™ Control DISTINCTIVE CHARACTERISTICS ■ Single power supply operation — 3.0 to 3.6 volt read, erase, and program operations ■ VersatileIO™ control — Device generates output voltages and tolerates data input voltages on the DQ input/outputs as determined by the voltage on VIO ■ High performance — Access times as fast as 90 ns ■ Manufactured on 0.23 µm process technology ■ CFI (Common Flash Interface) compliant — Provides device-specific information to the system, allowing host software to easily reconfigure for different Flash devices ■ SecSi (Secured Silicon) Sector region — 128-word sector for permanent, secure identification through an 8-word random Electronic Serial Number — May be programmed and locked at the factory or by the customer — Accessible through a command sequence ■ Ultra low power consumption (typical values at 3.0 V, 5 MHz) — 9 mA typical active read current — 26 mA typical erase/program current — 200 nA typical standby mode current ■ Flexible sector architecture — One hundred twenty-eight 32 Kword sectors ■ Sector Protection — A hardware method to lock a sector to prevent program or erase operations within that sector — Sectors can be locked in-system or via programming equipment — Temporary Sector Unprotect feature allows code changes in previously locked sectors ■ Embedded Algorithms — Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors — Embedded Program algorithm automatically writes and verifies data at specified addresses ■ Compatibility with JEDEC standards — Pinout and software compatible with single-power supply Flash — Superior inadvertent write protection ■ Minimum 1 million erase cycle guarantee per sector ■ Package options — 48-pin TSOP (Am29LV641DH/DL only) — 56-pin SSOP (Am29LV640DH/DL only) — 63-ball Fine-Pitch BGA (Am29LV640DU only) — 64-ball Fortified BGA (Am29LV640DU only) ■ Erase Suspend/Erase Resume — Suspends an erase operation to read data from, or program data to, a sect27 — or that is not being erased, then resumes the erase operation ■ Data# Polling and toggle bits — Provides a software method of detecting program or erase operation completion ■ Unlock Bypass Program command — Reduces overall programming time when issuing multiple program command sequences ■ Ready/Busy# pin (RY/BY#) (Am29LV640DU in FBGA package only) — Provides a hardware method of detecting program or erase cycle completion ■ Hardware reset pin (RESET#) — Hardware method to reset the device for reading array data ■ WP# pin (Am29LV641DH/DL in TSOP, Am29LV640DH/DL in SSOP only) — At VIL, protects the first or last 32 Kword sector, regardless of sector protect/unprotect status — At VIH, allows removal of sector protection — An internal pull up to VCC is provided ■ ACC pin — Accelerates programming time for higher throughput during system production ■ Program and Erase Performance (VHH not applied to the ACC input pin) — Word program time: 11 µs typical — Sector erase time: 0.9 s typical for each 32 Kword sector This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. Publication# 22366 Rev: C Amendment 6 Issue Date: January 22, 2007 D A T A S H E E T GENERAL DESCRIPTION The Am29LV640DU/Am29LV641DU is a 64 Mbit, 3.0 Volt (3.0 V to 3.6 V) single power supply flash memory device organized as 4,194,304 words. Data appears on DQ0-DQ15. The device is designed to be programmed in-system with the standard system 3.0 volt VCC supply. A 12.0 volt VPP is not required for program or erase operations. You can also program this device in standard EPROM programmers. Access times of 90 and 120 ns are available for applications where VIO ≥ VCC. An access time 120 ns are available for applications where VIO < VCC. The device is offered in 48-pin TSOP, 56-pin SSOP, 63-ball Fine-Pitch BGA and 64-ball Fortified BGA packages. To eliminate bus contention, each device has separate chip enable (CE#), write enable (WE#), and output enable (OE#) controls. Each device requires only a single 3.0 Volt power supply (3.0 V to 3.6 V) for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timing. Register contents serve as inputs to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm — an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write cycles to program data instead of four. Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm — an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The VersatileIO™ (VIO) control allows the host system to set the voltage levels that the device generates and tolerates on CE# and DQ I/Os to the same voltage level that is asserted on V IO. V IO is available in two configurations (1.8–2.9 V and 3.0–5.0 V) for operation in various system environments. The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, by reading the DQ7 (Data# Polling), or DQ6 (tog- 2 gle) status bits. After a program or erase cycle completes, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory. Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of sectors of memory. This is achieved in-system or via programming equipment. The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved. The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin can be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read boot-up firmware from the Flash memory device. The device offers a standby mode as a power-saving feature. Once the system places the device into the standby mode, power consumption is greatly reduced. The SecSi (Secured Silicon) Sector provides an minimum 128-word area for code or data that can be permanently protected. Once this sector is protected, no further programming or erasing within the sector can occur. The Write Protect (WP#) feature protects the first or last sector by asserting a logic low on the WP# pin. The protected sector is still protected even during accelerated programming. The accelerated program (ACC) feature allows the system to program the device at a much faster rate. When ACC is pulled high to VHH, the device enters the Unlock Bypass mode, enabling the user to reduce the time needed to do the program operation. This feature is intended to increase factory throughput during system production, but may also be used in the field if desired. AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunnelling. The data is programmed using hot electron injection. Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Handling Instructions for FBGA/fBGA Packages ......... 7 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10 RY/BY#: Ready/Busy# ............................................................ 30 DQ6: Toggle Bit I .................................................................... 30 Table 1. Device Bus Operations .....................................................10 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33 VersatileIO™ (VIO) Control ..................................................... 10 Requirements for Reading Array Data ................................... 10 Writing Commands/Command Sequences ............................ 11 Figure 7. Maximum Negative Overshoot Waveform ..................... 33 Figure 8. Maximum Positive Overshoot Waveform....................... 33 Accelerated Program Operation ......................................................11 Autoselect Functions .......................................................................11 Standby Mode ........................................................................ 11 Automatic Sleep Mode ........................................................... 11 RESET#: Hardware Reset Pin ............................................... 11 Output Disable Mode .............................................................. 12 Table 2. Sector Address Table ........................................................12 Autoselect Mode ..................................................................... 16 Table 3. Autoselect Codes, (High Voltage Method) .......................16 Sector Group Protection and Unprotection ............................. 17 Table 4. Sector Group Protection/Unprotection Address Table .....17 Write Protect (WP#) ................................................................ 18 Temporary Sector Group Unprotect ....................................... 18 Figure 1. Temporary Sector Group Unprotect Operation................ 18 Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19 SecSi (Secured Silicon) Sector Flash Memory Region .......... 20 Table 5. SecSi Sector Contents ......................................................20 Hardware Data Protection ...................................................... 20 Low VCC Write Inhibit .....................................................................20 Write Pulse “Glitch” Protection ........................................................21 Logical Inhibit ..................................................................................21 Power-Up Write Inhibit ....................................................................21 Common Flash Memory Interface (CFI) . . . . . . . 21 Table 6. CFI Query Identification String .......................................... 21 System Interface String................................................................... 22 Table 8. Device Geometry Definition .............................................. 22 Table 9. Primary Vendor-Specific Extended Query ........................ 23 Command Definitions . . . . . . . . . . . . . . . . . . . . . 23 Reading Array Data ................................................................ 23 Reset Command ..................................................................... 24 Autoselect Command Sequence ............................................ 24 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24 Word Program Command Sequence ..................................... 24 Unlock Bypass Command Sequence ..............................................25 Figure 3. Program Operation .......................................................... 25 Chip Erase Command Sequence ........................................... 25 Sector Erase Command Sequence ........................................ 26 Erase Suspend/Erase Resume Commands ........................... 26 Figure 4. Erase Operation............................................................... 27 Command Definitions ............................................................. 28 Command Definitions...................................................................... 28 Write Operation Status . . . . . . . . . . . . . . . . . . . . . 29 DQ7: Data# Polling ................................................................. 29 Figure 6. Toggle Bit Algorithm........................................................ 30 DQ2: Toggle Bit II ................................................................... 31 Reading Toggle Bits DQ6/DQ2 ............................................... 31 DQ5: Exceeded Timing Limits ................................................ 31 DQ3: Sector Erase Timer ....................................................... 31 Table 11. Write Operation Status ................................................... 32 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ........................................... 35 Figure 10. Typical ICC1 vs. Frequency ............................................ 35 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 11. Test Setup.................................................................... 36 Table 12. Test Specifications ......................................................... 36 Key to Switching Waveforms. . . . . . . . . . . . . . . . 36 Figure 12. Input Waveforms and Measurement Levels...................................................................... 36 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 Read-Only Operations ........................................................... 37 Figure 13. Read Operation Timings ............................................... 37 Hardware Reset (RESET#) .................................................... 38 Figure 14. Reset Timings ............................................................... 38 Erase and Program Operations .............................................. 39 Figure 15. Program Operation Timings.......................................... Figure 16. Accelerated Program Timing Diagram.......................... Figure 17. Chip/Sector Erase Operation Timings .......................... Figure 18. Data# Polling Timings (During Embedded Algorithms)...................................................... Figure 19. Toggle Bit Timings (During Embedded Algorithms)...................................................... Figure 20. DQ2 vs. DQ6................................................................. 40 40 41 42 43 43 Temporary Sector Unprotect .................................................. 44 Figure 21. Temporary Sector Group Unprotect Timing Diagram ... 44 Figure 22. Sector Group Protect and Unprotect Timing Diagram .. 45 Alternate CE# Controlled Erase and Program Operations ..... 46 Figure 23. Alternate CE# Controlled Write (Erase/Program) Operation Timings .............................................. 47 Erase And Programming Performance . . . . . . . 48 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 48 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49 SSO056—56-Pin Shrink Small Outline Package (SSOP) ...... 49 FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 12 x 11 mm package ................................................. 50 LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm package ................................................. 51 TS 048—48-Pin Standard TSOP ............................................ 52 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 5. Data# Polling Algorithm ................................................... 29 January 22, 2007 22366C6 Am29LV640D/Am29LV641D 3 D A T A S H E E T PRODUCT SELECTOR GUIDE Part Number Am29LV640D/Am29LV641D VCC = 3.0–3.6 V, VIO = 3.0–5.0 V Speed Option 90R 120R VCC = 3.0–3.6 V, VIO = 1.8–2.9 V 121R Max Access Time (ns) 90 120 CE# Access Time (ns) 90 120 OE# Access Time (ns) 35 50 Note: See “AC Characteristics” for full specifications. BLOCK DIAGRAM DQ0–DQ15 RY/BY# (Note 1) VCC Sector Switches VSS WE# WP# (Note 2) ACC VIO Erase Voltage Generator RESET# Input/Output Buffers State Control Command Register PGM Voltage Generator Chip Enable Output Enable Logic CE# OE# VCC Detector Timer A0–A21 Address Latch STB STB Data Latch Y-Decoder Y-Gating X-Decoder Cell Matrix Notes: 1. RY/BY# is only available in the FBGA package. 2. WP# is only available in the TSOP and SSOP packages. 4 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T CONNECTION DIAGRAMS A15 A14 A13 A12 A11 A10 A9 A8 A21 A20 WE# RESET# ACC WP# A19 A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 ACC WP# A19 A18 A17 A7 A6 A5 A4 A3 A2 A1 NC NC NC NC A0 CE# VSS OE# DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 January 22, 2007 22366C6 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 48-Pin Standard TSOP (Am29LV641DH/DL only) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56-Pin SSOP (Am29LV640DH/DL only) Am29LV640D/Am29LV641D 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 A16 VIO VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 RESET# WE# A20 A21 A8 A9 A10 A11 A12 A13 A14 A15 NC NC NC NC A16 VIO VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC 5 D A T A S H E E T CONNECTION DIAGRAM 63-Ball Fine-Pitch BGA (FBGA) Top View, Balls Facing Down (Am29LV640DU only) A8 B8 L8 M8 NC NC NC* NC* A7 B7 C7 D7 E7 F7 G7 H7 J7 K7 L7 M7 NC NC A13 A12 A14 A15 A16 VIO DQ15 VSS NC* NC* C6 D6 E6 F6 G6 H6 J6 K6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 A2 D5 E5 F5 G5 H5 J5 K5 RESET# A21 A19 DQ5 DQ12 VCC DQ4 C4 D4 E4 F4 G4 H4 J4 K4 RY/BY# ACC A18 A20 DQ2 DQ10 DQ11 DQ3 C3 D3 E3 F3 G3 H3 J3 K3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 C2 D2 E2 F2 G2 H2 J2 K2 L2 M2 OE# VSS NC* NC* L1 M1 NC* NC* A3 NC* A1 C5 WE# A4 A2 A1 A0 CE# B1 * Balls are shorted together via the substrate but not connected to the die. NC* 6 NC* Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T CONNECTION DIAGRAMS 64-Ball Fortified BGA (FBGA) Top View, Balls Facing Down (Am29LV640DU only) A8 B8 C8 D8 E8 F8 G8 H8 RFU RFU RFU VIO VSS RFU RFU RFU A7 B7 C7 D7 E7 F7 G7 H7 A13 A12 A14 A15 A16 NC DQ15 VSS A6 B6 C6 D6 E6 F6 G6 H6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 A5 B5 C5 D5 E5 F5 G5 H5 WE# RESET# A21 A19 DQ5 DQ12 VCC DQ4 A4 B4 C4 D4 E4 F4 G4 H4 RY/BY# ACC A18 A20 DQ2 DQ10 DQ11 DQ3 A3 B3 C3 D3 E3 F3 G3 H3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 A2 B2 C2 D2 E2 F2 G2 H2 A3 A4 A2 A1 A0 CE# OE# VSS A1 B1 C1 D1 E1 F1 G1 H1 RFU RFU RFU RFU RFU VIO RFU RFU Special Handling Instructions for FBGA/fBGA Packages Special handling is required for Flash Memory products in BGA packages. January 22, 2007 22366C6 Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. Am29LV640D/Am29LV641D 7 D A T A PIN DESCRIPTION A0–A21 S H E E T LOGIC SYMBOL = 22 Addresses inputs 22 DQ0–DQ15 = 16 Data inputs/outputs A0–A21 CE# = Chip Enable input OE# = Output Enable input WE# = Write Enable input WP# = Hardware Write Protect input (N/A on FBGA) WP# ACC = Acceleration Input ACC RESET# = Hardware Reset Pin input RESET# RY/BY# = Ready/Busy output (FBGA only) VIO VCC = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) CE# 16 DQ0–DQ15 OE# WE# VIO = Output Buffer power VSS = Device Ground NC = Pin Not Connected Internally RFU = Reserved for Future Use 8 RY/BY# Note: WP# is not available on the FBGA package. RY/BY# is not available on the TSOP and SSOP packages. Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29LV640D Am29LV641D H 90R E I N OPTIONAL PROCESSING Blank = Standard Processing N = 32-byte ESN devices (Contact an AMD representative for more information) TEMPERATURE RANGE I F = = Industrial (–40°C to +85°C) Industrial (–40°C to +85°C) with Pb-Free Package PACKAGE TYPE E Z PC = = = WH = 48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048) 56-Pin Shrink Small Outline Package (SSO056) 64-Ball Fortified Ball Grid Array 1.0 mm pitch, 13 x 11 mm package (LAA064) 63-Ball Fine-Pitch Ball Grid Array 0.80 mm pitch, 11 x 12 mm package (FBE063) SPEED OPTION See Product Selector Guide and Valid Combinations SECTOR ARCHITECTURE AND SECTOR WRITE PROTECTION (WP# = 0) H L U = = = Uniform sector device, highest address sector protected Uniform sector device, lowest address sector protected Uniform sector device (WP# not available) DEVICE NUMBER/DESCRIPTION Am29LV640DU/DH/DL, Am29LV641DH/DL 64 Megabit (4 M x 16-Bit) CMOS Uniform Sector Flash Memory with VersatileIO™ Control 3.0 Volt-only Read, Program, and Erase Valid Combinations for TSOP and SSOP Packages Speed/VIO Range AM29LV640DH90R, ZI, ZF AM29LV640DL90R 90 ns, VIO = 3.0 V – 5.0 V AM29LV641DH90R, EI, FI, EF AM29LV641DL90R AM29LV640DH120R, ZI, ZF AM29LV640DL120R 120 ns, VIO = 3.0 V – 5.0 V AM29LV641DH120R, EI, FI, EF AM29LV641DL120R AM29LV640DH121R, ZI, ZF AM29LV640DL121R 120 ns, VIO = 1.8 V – 2.9 V AM29LV641DH121R, EI, FI, EF AM29LV641DL121R Note: LV640/641DH & DL have WP#, but no RY/BY#. U designator in base part number replaced by H or L. Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. January 22, 2007 22366C6 Valid Combinations for BGA Packages Order Number Package Marking PCI, L640DU90N PCF I, F AM29LV640DU90R WHI, L640DU90R WHF PCI, L640DU12N PCF AM29LV640DU120R WHI, L640DU12R WHF I, F PCI, L640DU21N PCF AM29LV640DU121R WHI, L640DU21R WHF Note: LV640DU has RY/BY#, but no WP#. Speed/ VIO Range 90 ns, VIO = 3.0 V – 5.0 V 120 ns, VIO = 3.0 V – 5.0 V 120 ns, VIO = 1.8 V – 2.9 V Note: Reverse pinout TSOP (TSR048) packages are not Note: offered for new designs. For 128 Mb requirements, the S29GL128N product is recommended as a single-device substitute for the 64 Mb + 64 Mb clamshell design; please refer to the S29GL128N data sheet for specifications and ordering information. Am29LV640D/Am29LV641D 9 D A T A S H E E T DEVICE BUS OPERATIONS This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information needed to execute the command. The contents of the Table 1. register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. Table 1 lists the device bus operations, the inputs and control levels they require, and the resulting output. The following subsections describe each operation in further detail. Device Bus Operations CE# OE# WE# RESET# WP# ACC Addresses (Note 2) DQ0– DQ15 Read L L H H X X AIN DOUT Write (Program/Erase) L H L H (Note 3) X AIN (Note 4) Accelerated Program L H L H (Note 3) VHH AIN (Note 4) VCC ± 0.3 V X X VCC ± 0.3 V X H X High-Z Output Disable L H H H X X X High-Z Reset X X X L X X X High-Z Sector Group Protect (Note 2) L H L VID H X SA, A6 = L, A1 = H, A0 = L (Note 4) Sector Group Unprotect (Note 2) L H L VID H X SA, A6 = H, A1 = H, A0 = L (Note 4) Temporary Sector Group Unprotect X X X VID H X AIN (Note 4) Operation Standby Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 8.5–12.5 V, VHH = 11.5–12.5 V, X = Don’t Care, SA = Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out Notes: 1. Addresses are A21:A0. Sector addresses are A21:A15. 2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Group Protection and Unprotection” section. 3. If WP# = VIL, the first or last sector remains protected. If WP# = VIH, the first or last sector is protected or unprotected as determined by the method described in “Sector Group Protection and Unprotection”. All sectors are unprotected when shipped from the factory (The SecSi Sector may be factory protected depending on version ordered.) 4. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm (see Figure 2, on page 19). VersatileIO™ (VIO) Control Requirements for Reading Array Data The VersatileIO™ (VIO) control allows the host system to set the voltage levels that the device generates and tolerates on CE# and DQ I/Os to the same voltage level that is asserted on V IO. V IO is available in two configurations (1.8–2.9 V and 3.0–5.0 V) for operation in various system environments. To read array data from the outputs, the system must drive the CE# and OE# pins to VIL. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at VIH. For example, a VIO of 4.5–5.0 volts allows for I/O at the 5 volt level, driving and receiving signals to and from other 5 V devices on the same data bus. 10 The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A data on the device data outputs. The device remains enabled for read access until the command register contents are altered. See “Requirements for Reading Array Data” on page 10 for more infor mation. Refer to the AC “Read-Only Operations” on page 37 table for timing specifications and to Figure 13, on page 37 for the timing diagram. I CC1 in the “DC Characteristics” on page 34 table represents the active current specification for reading array data. Writing Commands/Command Sequences To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE# and CE# to VIL, and OE# to VIH. The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a word instead of four. The “Word Program Command Sequence” on page 24 has details on programming data to the device using both standard and Unlock Bypass command sequences. An erase operation can erase one sector, multiple sectors, or the entire device. Table 2 on page 12 indicates the address space that each sector occupies. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC Characteristics section contains timing specification tables and timing diagrams for write operations. Accelerated Program Operation The device offers accelerated program operations through the ACC function. This function is primarily intended to allow faster manufacturing throughput during system production. If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time required for program operations. The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the ACC pin returns the device to normal operation. Note that the ACC pin must not be at VHH for operations other than accelerated programming, or device damage may result. Autoselect Functions If the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the “Autoselect Mode” on page 16 January 22, 2007 22366C6 S H E E T and “Autoselect Command Sequence” on page 24 for more information. Standby Mode When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE# input. The device enters the CMOS standby mode when the CE# and RESET# pins are both held at VCC ± 0.3 V. (Note that this is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within VCC ± 0.3 V, the device is in the standby mode, but the standby current is greater. The device requires standard access time (tCE) for read access when the device is in either of these standby modes before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3 in the table “DC Characteristics” on page 34 represents the standby current specification. Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for t ACC + 30 ns. The automatic sleep mode is independent of the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC4 in the table “DC Characteristics” on page 34 represents the automatic sleep mode current specification. RESET#: Hardware Reset Pin The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. To ensure data integrity, the operation that was interrupted should be reinitiated once the device is ready to accept another command sequence. Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS±0.3 V, the standby current is greater. Am29LV640D/Am29LV641D 11 D A T A S H E E T within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET# pin returns to VIH. The RESET# pin can be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. Refer to the table “AC Characteristics” on page 37 for RESET# parameters and to Figure 14, on page 38 for the timing diagram. If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed Table 2. 12 Output Disable Mode When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state. Sector Address Table (Sheet 1 of 4) Sector A21 A20 A19 A18 A17 A16 A15 16-bit Address Range (in hexadecimal) SA0 0 0 0 0 0 0 0 000000–007FFF SA1 0 0 0 0 0 0 1 008000–00FFFF SA2 0 0 0 0 0 1 0 010000–017FFF SA3 0 0 0 0 0 1 1 018000–01FFFF SA4 0 0 0 0 1 0 0 020000–027FFF SA5 0 0 0 0 1 0 1 028000–02FFFF SA6 0 0 0 0 1 1 0 030000–037FFF SA7 0 0 0 0 1 1 1 038000–03FFFF SA8 0 0 0 1 0 0 0 040000–047FFF SA9 0 0 0 1 0 0 1 048000–04FFFF SA10 0 0 0 1 0 1 0 050000–057FFF SA11 0 0 0 1 0 1 1 058000–05FFFF SA12 0 0 0 1 1 0 0 060000–067FFF SA13 0 0 0 1 1 0 1 068000–06FFFF SA14 0 0 0 1 1 1 0 070000–077FFF SA15 0 0 0 1 1 1 1 078000–07FFFF SA16 0 0 1 0 0 0 0 080000–087FFF SA17 0 0 1 0 0 0 1 088000–08FFFF SA18 0 0 1 0 0 1 0 090000–097FFF SA19 0 0 1 0 0 1 1 098000–09FFFF SA20 0 0 1 0 1 0 0 0A0000–0A7FFF SA21 0 0 1 0 1 0 1 0A8000–0AFFFF SA22 0 0 1 0 1 1 0 0B0000–0B7FFF SA23 0 0 1 0 1 1 1 0B8000–0BFFFF SA24 0 0 1 1 0 0 0 0C0000–0C7FFF SA25 0 0 1 1 0 0 1 0C8000–0CFFFF Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A Table 2. S H E E T Sector Address Table (Sheet 2 of 4) Sector A21 A20 A19 A18 A17 A16 A15 16-bit Address Range (in hexadecimal) SA26 0 0 1 1 0 1 0 0D0000–0D7FFF SA27 0 0 1 1 0 1 1 0D8000–0DFFFF SA28 0 0 1 1 1 0 0 0E0000–0E7FFF SA29 0 0 1 1 1 0 1 0E8000–0EFFFF SA30 0 0 1 1 1 1 0 0F0000–0F7FFF SA31 0 0 1 1 1 1 1 0F8000–0FFFFF SA32 0 1 0 0 0 0 0 100000–107FFF SA33 0 1 0 0 0 0 1 108000–10FFFF SA34 0 1 0 0 0 1 0 110000–117FFF SA35 0 1 0 0 0 1 1 118000–11FFFF SA36 0 1 0 0 1 0 0 120000–127FFF SA37 0 1 0 0 1 0 1 128000–12FFFF SA38 0 1 0 0 1 1 0 130000–137FFF SA39 0 1 0 0 1 1 1 138000–13FFFF SA40 0 1 0 1 0 0 0 140000–147FFF SA41 0 1 0 1 0 0 1 148000–14FFFF SA42 0 1 0 1 0 1 0 150000–157FFF SA43 0 1 0 1 0 1 1 158000–15FFFF SA44 0 1 0 1 1 0 0 160000–167FFF SA45 0 1 0 1 1 0 1 168000–16FFFF SA46 0 1 0 1 1 1 0 170000–177FFF SA47 0 1 0 1 1 1 1 178000–17FFFF SA48 0 1 1 0 0 0 0 180000–187FFF SA49 0 1 1 0 0 0 1 188000–18FFFF SA50 0 1 1 0 0 1 0 190000–197FFF SA51 0 1 1 0 0 1 1 198000–19FFFF SA52 0 1 1 0 1 0 0 1A0000–1A7FFF SA53 0 1 1 0 1 0 1 1A8000–1AFFFF SA54 0 1 1 0 1 1 0 1B0000–1B7FFF SA55 0 1 1 0 1 1 1 1B8000–1BFFFF SA56 0 1 1 1 0 0 0 1C0000–1C7FFF SA57 0 1 1 1 0 0 1 1C8000–1CFFFF SA58 0 1 1 1 0 1 0 1D0000–1D7FFF SA59 0 1 1 1 0 1 1 1D8000–1DFFFF SA60 0 1 1 1 1 0 0 1E0000–1E7FFF January 22, 2007 22366C6 Am29LV640D/Am29LV641D 13 D A T A Table 2. 14 S H E E T Sector Address Table (Sheet 3 of 4) Sector A21 A20 A19 A18 A17 A16 A15 16-bit Address Range (in hexadecimal) SA61 0 1 1 1 1 0 1 1E8000–1EFFFF SA62 0 1 1 1 1 1 0 1F0000–1F7FFF SA63 0 1 1 1 1 1 1 1F8000–1FFFFF SA64 1 0 0 0 0 0 0 200000–207FFF SA65 1 0 0 0 0 0 1 208000–20FFFF SA66 1 0 0 0 0 1 0 210000–217FFF SA67 1 0 0 0 0 1 1 218000–21FFFF SA68 1 0 0 0 1 0 0 220000–227FFF SA69 1 0 0 0 1 0 1 228000–22FFFF SA70 1 0 0 0 1 1 0 230000–237FFF SA71 1 0 0 0 1 1 1 238000–23FFFF SA72 1 0 0 1 0 0 0 240000–247FFF SA73 1 0 0 1 0 0 1 248000–24FFFF SA74 1 0 0 1 0 1 0 250000–257FFF SA75 1 0 0 1 0 1 1 258000–25FFFF SA76 1 0 0 1 1 0 0 260000–267FFF SA77 1 0 0 1 1 0 1 268000–26FFFF SA78 1 0 0 1 1 1 0 270000–277FFF SA79 1 0 0 1 1 1 1 278000–27FFFF SA80 1 0 1 0 0 0 0 280000–287FFF SA81 1 0 1 0 0 0 1 288000–28FFFF SA82 1 0 1 0 0 1 0 290000–297FFF SA83 1 0 1 0 0 1 1 298000–29FFFF SA84 1 0 1 0 1 0 0 2A0000–2A7FFF SA85 1 0 1 0 1 0 1 2A8000–2AFFFF SA86 1 0 1 0 1 1 0 2B0000–2B7FFF SA87 1 0 1 0 1 1 1 2B8000–2BFFFF SA88 1 0 1 1 0 0 0 2C0000–2C7FFF SA89 1 0 1 1 0 0 1 2C8000–2CFFFF SA90 1 0 1 1 0 1 0 2D0000–2D7FFF SA91 1 0 1 1 0 1 1 2D8000–2DFFFF SA92 1 0 1 1 1 0 0 2E0000–2E7FFF SA93 1 0 1 1 1 0 1 2E8000–2EFFFF SA94 1 0 1 1 1 1 0 2F0000–2F7FFF SA95 1 0 1 1 1 1 1 2F8000–2FFFFF Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A Table 2. S H E E T Sector Address Table (Sheet 4 of 4) Sector A21 A20 A19 A18 A17 A16 A15 16-bit Address Range (in hexadecimal) SA96 1 1 0 0 0 0 0 300000–307FFF SA97 1 1 0 0 0 0 1 308000–30FFFF SA98 1 1 0 0 0 1 0 310000–317FFF SA99 1 1 0 0 0 1 1 318000–31FFFF SA100 1 1 0 0 1 0 0 320000–327FFF SA101 1 1 0 0 1 0 1 328000–32FFFF SA102 1 1 0 0 1 1 0 330000–337FFF SA103 1 1 0 0 1 1 1 338000–33FFFF SA104 1 1 0 1 0 0 0 340000–347FFF SA105 1 1 0 1 0 0 1 348000–34FFFF SA106 1 1 0 1 0 1 0 350000–357FFF SA107 1 1 0 1 0 1 1 358000–35FFFF SA108 1 1 0 1 1 0 0 360000–367FFF SA109 1 1 0 1 1 0 1 368000–36FFFF SA110 1 1 0 1 1 1 0 370000–377FFF SA111 1 1 0 1 1 1 1 378000–37FFFF SA112 1 1 1 0 0 0 0 380000–387FFF SA113 1 1 1 0 0 0 1 388000–38FFFF SA114 1 1 1 0 0 1 0 390000–397FFF SA115 1 1 1 0 0 1 1 398000–39FFFF SA116 1 1 1 0 1 0 0 3A0000–3A7FFF SA117 1 1 1 0 1 0 1 3A8000–3AFFFF SA118 1 1 1 0 1 1 0 3B0000–3B7FFF SA119 1 1 1 0 1 1 1 3B8000–3BFFFF SA120 1 1 1 1 0 0 0 3C0000–3C7FFF SA121 1 1 1 1 0 0 1 3C8000–3CFFFF SA122 1 1 1 1 0 1 0 3D0000–3D7FFF SA123 1 1 1 1 0 1 1 3D8000–3DFFFF SA124 1 1 1 1 1 0 0 3E0000–3E7FFF SA125 1 1 1 1 1 0 1 3E8000–3EFFFF SA126 1 1 1 1 1 1 0 3F0000–3F7FFF SA127 1 1 1 1 1 1 1 3F8000–3FFFFF Note: All sectors are 32 Kwords in size. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 15 D A T A Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register. When using programming equipment, the autoselect mode requires VID (8.5 V to 12.5 V) on address pin A9. Address pins A6, A1, and A0 must be as shown in Table 3. In addition, when verifying sector protection, Table 3. Description S H E E T the sector address must appear on the appropriate highest order address bits (see Table 2 on page 12). Table 3 shows the remaining address bits that are don’t care. When all necessary bits are set as required, the programming equipment may then read the corresponding identifier code on DQ7–DQ0. To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in Table 10 on page 28. This method does not require VID. Refer to “Autoselect Command Sequence” on page 24 for more information. Autoselect Codes, (High Voltage Method) CE# OE# WE# A21 to A15 A14 to A10 A9 A8 to A7 A6 A5 to A2 A1 A0 DQ15 to DQ0 Manufacturer ID: AMD L L H X X VID X L X L L 0001h Device ID: LV640DU/H/L, LV641DH/L L L H X X VID X L X L H 22D7h Sector Protection Verification L L H SA X VID X L X H L XX01h (protected), XX00h (unprotected) SecSi Sector Indicator Bit (DQ7), WP# protects highest address sector (LV640DH/641DH), or no WP# (LV640DU) L L H X X VID X L X H H XX98h (factory locked), XX18h (not factory locked) SecSi Sector Indicator Bit (DQ7), WP# protects lowest address sector (LV640DL/641DL) L L H X X VID X L X H H XX88h (factory locked), XX08h (not factory locked) Legend: L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care. 16 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A Sector Group Protection and Unprotection S H E E T Table 4. Sector Group Protection/Unprotection Address Table The hardware sector group protection feature disables both program and erase operations in any sector group. In this device, a sector group consists of four adjacent sectors that are protected or unprotected at the same time (see Table 4). The hardware sector group unprotection feature re-enables both program and erase operations in previously protected sector groups. Sector group protection/unprotection is implemented via two methods. Sector Group A21–A17 SA0–SA3 00000 Sector protection/unprotection requires VID on the RESET# pin only, and can be implemented either in-system or via programming equipment. Figure 2, on page 19 shows the algorithms and Figure 22, on page 45 shows the timing diagram. This method uses standard microprocessor bus cycle timing. For sector group unprotect, all unprotected sector groups must first be protected prior to the first sector group unprotect write cycle. The device is shipped with all sector groups unprotected. AMD offers the option of programming and protecting sector groups at its factory prior to shipping the device through AMD’s ExpressFlash™ Service. Contact an AMD representative for details. It is possible to determine whether a sector group is protected or unprotected. See “Autoselect Mode” on page 16 for details. SA4–SA7 00001 SA8–SA11 00010 SA12–SA15 00011 SA16–SA19 00100 SA20–SA23 00101 SA24–SA27 00110 SA28–SA31 00111 SA32–SA35 01000 SA36–SA39 01001 SA40–SA43 01010 SA44–SA47 01011 SA48–SA51 01100 SA52–SA55 01101 SA56–SA59 01110 SA60–SA63 01111 SA64–SA67 10000 SA68–SA71 10001 SA72–SA75 10010 SA76–SA79 10011 SA80–SA83 10100 SA84–SA87 10101 SA88–SA91 10110 SA92–SA95 10111 SA96–SA99 11000 SA100–SA103 11001 SA104–SA107 11010 SA108–SA111 11011 SA112–SA115 11100 SA116–SA119 11101 SA120–SA123 11110 SA124–SA127 11111 Note: All sector groups are 128 Kwords in size. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 17 D A T A S H E E T Write Protect (WP#) The Write Protect function provides a hardware method of protecting the first or last sector without using VID. START If the system asserts VIL on the WP# pin, the device disables program and erase functions in the first or last sector independently of whether those sectors were protected or unprotected using the method described in “Sector Group Protection and Unprotection”. Note that if WP# is at VIL when the device is in the standby mode, the maximum input load current is increased. See the table in “DC Characteristics” on page 34. RESET# = VID (Note 1) Perform Erase or Program Operations If the system asserts VIH on the WP# pin, the device reverts to whether the first or last sector was previously set to be protected or unprotected using the method described in “Sector Group Protection and Unprotection” on page 17. RESET# = VIH Temporary Sector Group Unprotect Completed (Note 2) Temporary Sector Group Unprotect (Note: In this device, a sector group consists of four adjacent sectors that are protected or unprotected at the same time (see Table 4 on page 17)). This feature allows temporary unprotection of previously protected sector groups to change data in-system. The Sector Group Unprotect mode is activated by setting the RESET# pin to VID (8.5 V – 12.5 V). During this mode, formerly protected sector groups can be programmed or erased by selecting the sector group addresses. Once VID is removed from the RESET# pin, all the previously protected sector groups are protected again. Figure 1, on page 18 shows the algorithm, and Figure 21, on page 44 shows the timing diagrams, for this feature. 18 Notes: 1. All protected sector groups unprotected (If WP# = VIL, the first or last sector remains protected). 2. All previously protected sector groups are protected once again. Figure 1. Temporary Sector Group Unprotect Operation Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T START START PLSCNT = 1 RESET# = VID Wait 1 μs Temporary Sector Group Unprotect Mode No PLSCNT = 1 Protect all sector groups: The indicated portion of the sector group protect algorithm must be performed for all unprotected sector groups prior to issuing the first sector group unprotect address RESET# = VID Wait 1 μs First Write Cycle = 60h? First Write Cycle = 60h? Temporary Sector Group Unprotect Mode Yes Yes Set up sector group address No Sector Group Protect: Write 60h to sector group address with A6 = 0, A1 = 1, A0 = 0 All sector groups protected? Yes Set up first sector group address Sector Group Unprotect: Write 60h to sector group address with A6 = 1, A1 = 1, A0 = 0 Wait 150 µs Increment PLSCNT No Verify Sector Group Protect: Write 40h to sector group address twith A6 = 0, A1 = 1, A0 = 0 Reset PLSCNT = 1 Read from sector group address with A6 = 0, A1 = 1, A0 = 0 Wait 15 ms Verify Sector Group Unprotect: Write 40h to sector group address with A6 = 1, A1 = 1, A0 = 0 Increment PLSCNT No No PLSCNT = 25? Read from sector group address with A6 = 1, A1 = 1, A0 = 0 Data = 01h? Yes No Yes Protect another sector group? Device failed Yes PLSCNT = 1000? No Yes Remove VID from RESET# Device failed Write reset command Sector Group Protect Algorithm Set up next sector group address No Data = 00h? Yes Last sector group verified? No Yes Sector Group Protect complete Sector Group Unprotect Algorithm Remove VID from RESET# Write reset command Sector Group Unprotect complete Figure 2. January 22, 2007 22366C6 In-System Sector Group Protect/Unprotect Algorithms Am29LV640D/Am29LV641D 19 D A T A SecSi (Secured Silicon) Sector Flash Memory Region The SecSi (Secured Silicon) Sector feature provides a Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN). The SecSi Sector is 128 words in length, and uses a SecSi Sector Indicator Bit (DQ7) to indicate whether or not the SecSi Sector is locked when shipped from the factory. This bit is permanently set at the factory and cannot be changed, which prevents cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field. AMD offers the device with the SecSi Sector either factor y locke d or custom er lockable. The factory-locked version is always protected when shipped from the factory, and has the SecSi (Secured Silicon) Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the SecSi Sector unprotected, allowing customers to utilize that sector in any manner they choose. The customer-lockable version also has the SecSi Sector Indicator Bit permanently set to a “0.” Thus, the SecSi Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked. The SecSi sector address space in this device is allocated as shown in Table 5: Table 5. SecSi Sector Address Range 000000h–000007h 000008h–00007Fh SecSi Sector Contents Standard ExpressFlash Factory Locked Factory Locked ESN ESN or determined by customer Unavailable Determined by customer Customer Lockable Determined by customer SecSi Sector permanently locked. Contact an AMD representative for details on using AMD’s ExpressFlash service. Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory As an alternative to the factory-locked version, the device can be ordered such that the customer may progra m and p rote ct the 128 -wo rd SecSi sector. Programming and protecting the SecSi Sector must be used with caution since, once protected, there is no procedure available for unprotecting the SecSi Sector area and none of the bits in the SecSi Sector memory space can be modified in any way. You can protect the SecSi Sector area using one of the following procedures: ■ Write the three-cycle Enter SecSi Sector Region command sequence, and then follow the in-system sector protect algorithm as shown in Figure 2, on page 19, except that RESET# may be at either VIH or VID. This allows in-system protection of the SecSi Sector without raising any device pin to a high voltage. Note that this method is only applicable to the SecSi Sector. ■ Write the three-cycle Enter SecSi Sector Region command sequence, then use the alternate method of sector protection described in the “Sector Group Protection and Unprotection” on page 17. Once the SecSi Sector is programmed, locked, and verified, the system must write the Exit SecSi Sector Region command sequence to return to reading and writing within the remainder of the array. Hardware Data Protection The system accesses the SecSi Sector through a command sequence (see “Enter SecSi Sector/Exit SecSi Sector Command Sequence” on page 24). After the system writes the Enter SecSi Sector command sequence, it may read the SecSi Sector by using the addresses normally occupied by the first sector (SA0). This mode of operation continues until the system issues the Exit SecSi Sector command sequence, or until power is removed from the device. On power-up, or following a hardware reset, the device reverts to sending commands to sector SA0. Factory Locked: SecSi Sector Programmed and Protected At the Factory In devices with an ESN, the SecSi Sector is protected when the device is shipped from the factory. The SecSi Sector cannot be modified in any way. A factory locked device has an 8-word random ESN at addresses 000000h–000007h. Customers may opt to have their code programmed by AMD through the AMD ExpressFlash service. The devices are then shipped from AMD’s factory with the 20 S H E E T The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadver tent writes (refer to Table 10 on page 28 for command definitions). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up and power-down transitions, or from system noise. Low VCC Write Inhibit When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets to the read mode. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional writes when V CC is greater than VLKO. Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T Write Pulse “Glitch” Protection Noise pulses of less than 5 ns (typical) on OE#, CE# or WE#, do not initiate a write cycle. Logical Inhibit Write cycles are inhibited by holding any one of OE# = VIL, CE# = VIH or WE# = VIH. To initiate a write cycle, CE# and WE# must be a logical zero while OE# is a logical one. Power-Up Write Inhibit If WE# = CE# = VIL and OE# = VIH during power up, the device does not accept commands on the rising edge of WE#. The internal state machine is automatically reset to the read mode on power-up. COMMON FLASH MEMORY INTERFACE (CFI) The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-independent, JEDEC ID-independent, and forward-and backward-compatible for the specified flash device families. Flash vendors can standardize their existing interfaces for long-term compatibility. This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h, any time the device is ready to read array data. The system reads CFI information at the addresses given in Table 6 on page 21 to Table 9 on page 23. To Table 6. terminate reading CFI data, the system must write the reset command. The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query mode, and the system can read CFI data at the addresses given in Table 6 on page 21 to Table 9 on page 23 The system must write the reset command to return the device to the autoselect mode. For further information, please refer to the CFI Specification and CFI Publication 100, available via the World Wide Web at http://www.amd.com/products/nvd/overview/cfi.html. Alternatively, contact an AMD representative for copies of these documents. CFI Query Identification String Addresses (x16) Data 10h 11h 12h 0051h 0052h 0059h Query Unique ASCII string “QRY” 13h 14h 0002h 0000h Primary OEM Command Set 15h 16h 0040h 0000h Address for Primary Extended Table 17h 18h 0000h 0000h Alternate OEM Command Set (00h = none exists) 19h 1Ah 0000h 0000h Address for Alternate OEM Extended Table (00h = none exists) January 22, 2007 22366C6 Description Am29LV640D/Am29LV641D 21 D A T A Table 7. S H E E T System Interface String Addresses (x16) Data Description 1Bh 0027h VCC Min. (write/erase) D7–D4: volt, D3–D0: 100 millivolt 1Ch 0036h VCC Max. (write/erase) D7–D4: volt, D3–D0: 100 millivolt 1Dh 0000h VPP Min. voltage (00h = no VPP pin present) 1Eh 0000h VPP Max. voltage (00h = no VPP pin present) 1Fh 0004h Typical timeout per single word write 2N µs 20h 0000h Typical timeout for Min. size buffer write 2N µs (00h = not supported) 21h 000Ah Typical timeout per individual block erase 2N ms 22h 0000h Typical timeout for full chip erase 2N ms (00h = not supported) 23h 0005h Max. timeout for word write 2N times typical 24h 0000h Max. timeout for buffer write 2N times typical 25h 0004h Max. timeout per individual block erase 2N times typical 26h 0000h Max. timeout for full chip erase 2N times typical (00h = not supported) Table 8. Device Geometry Definition Addresses (x16) Data 27h 0017h Device Size = 2N byte 28h 29h 0001h 0000h Flash Device Interface description (refer to CFI publication 100) 2Ah 2Bh 0000h 0000h Max. number of byte in multi-byte write = 2N (00h = not supported) 2Ch 0001h Number of Erase Block Regions within device 2Dh 2Eh 2Fh 30h 007Fh 0000h 0000h 0001h Erase Block Region 1 Information (refer to the CFI specification or CFI publication 100) 31h 32h 33h 34h 0000h 0000h 0000h 0000h Erase Block Region 2 Information (refer to CFI publication 100) 35h 36h 37h 38h 0000h 0000h 0000h 0000h Erase Block Region 3 Information (refer to CFI publication 100) 39h 3Ah 3Bh 3Ch 0000h 0000h 0000h 0000h Erase Block Region 4 Information (refer to CFI publication 100) 22 Description Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A Table 9. S H E E T Primary Vendor-Specific Extended Query Addresses (x16) Data Description 40h 41h 42h 0050h 0052h 0049h Query-unique ASCII string “PRI” 43h 0031h Major version number, ASCII 44h 0033h Minor version number, ASCII 45h 0000h Address Sensitive Unlock (Bits 1-0) 00b = Required, 01b = Not Required Silicon Revision Number (Bits 7-2) 000000b = 0.23 µm Process Technology 46h 0002h Erase Suspend 00 = Not Supported, 01 = To Read Only, 02 = To Read & Write 47h 0004h Sector Protect 00 = Not Supported, X = Number of sectors per group 48h 0001h Sector Temporary Unprotect 00 = Not Supported, 01 = Supported 49h 0004h Sector Protect/Unprotect scheme 04 = 29LV800A mode 4Ah 0000h Simultaneous Operation 00 = Not Supported, XX = Number of Sectors in Bank 4Bh 0000h Burst Mode Type 00 = Not Supported, 01 = Supported 4Ch 0000h Page Mode Type 00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page 4Dh 00B5h 4Eh 00C5h ACC (Acceleration) Supply Minimum Bits 7–4 = Hex Value in Volts, Bits 0–3 = BCD Value in 100 mV ACC (Acceleration) Supply Maximum Bits 7–4 = Hex Value in Volts, Bits 0–3 = BCD Value in 100 mV Top/Bottom Boot Sector Flag 4Fh 000Xh 00h = Uniform Sector, No WP# Control 04h = Uniform Sector, WP# Protects Bottom Sector 05h = Uniform Sector, WP# Protects Top Sector COMMAND DEFINITIONS Writing specific address and data commands or sequences into the command register initiates device operations. Table 10 on page 28 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence, resets the device to reading array data. All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to “AC Characteristics” on page 37 for timing diagrams. January 22, 2007 22366C6 Reading Array Data The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the device enters the erase-suspend-read mode, after which the system can read data from any non-erase-suspended sector. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See “Erase Suspend/Erase Resume Commands” on page 26, for more information. Am29LV640D/Am29LV641D 23 D A T A S H E E T The system must issue the reset command to return the device to the read (or erase-suspend-read) mode if DQ5 goes high during an active program or erase operation, or if the device is in the autoselect mode. See the next section, Reset Command, for more information. The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains the autoselect command. The device then enters the autoselect mode. The system may read at any address any number of times without initiating another autoselect command sequence: See also “Requirements for Reading Array Data” on page 10 in the Device Bus Operations section for more information. The “Read-Only Operations” on page 37 table provides the read parameters, and Figure 13, on page 37 shows the timing diagram. ■ A read cycle at address XX00h returns the manufacturer code. Reset Command Writing the reset command resets the device to the read or erase-suspend-read mode. Address bits are don’t cares for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to the read mode. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to the read mode. If the program command sequence is written while the device is in the Erase Suspend mode, writing the reset command returns the device to the erase-suspend-read mode. Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to the read mode. If the device entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns the device to the erase-suspend-read mode. If DQ5 goes high during a program or erase operation, writing the reset command returns the device to the read mode (or erase-suspend-read mode if the device was in Erase Suspend). Autoselect Command Sequence The autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected. Table 10 on page 28 shows the address and data requirements. This method is an alternative to that shown in Table 3 on page 16, which is intended for PROM programmers and requires VID on address pin A9. The autoselect command sequence may be written to an address that is either in the read or erase-suspend-read mode. The autoselect command cannot be written while the device is actively programming or erasing. 24 ■ A read cycle at address XX01h returns the device code. ■ A read cycle to an address containing a sector group address (SA), and the address 02h on A7–A0 returns 01h if the sector group is protected, or 00h if it is unprotected. (Refer to Table 4 on page 17 for valid sector addresses). The system must write the reset command to return to the read mode (or erase-suspend-read mode if the device was previously in Erase Suspend). Enter SecSi Sector/Exit SecSi Sector Command Sequence The SecSi Sector region provides a secured data area containing an 8-word random Electronic Serial Number (ESN). The system can access the SecSi Sector region by issuing the three-cycle Enter SecSi Sector command sequence. The device continues to access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence returns the device to normal operation. Table 10 on page 28 shows the address and data requirements for both command sequences. See also “SecSi (Secured Silicon) Sector Flash Memory Region” on page 20 for further information. Word Program Command Sequence Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verifies the programmed cell margin. The “Command Definitions” on page 28 shows the address and data requirements for the word program command sequence. When the Embedded Program algorithm is complete, the device returns to the read mode and addresses are no longer latched. The system determines the status of the program operation by using DQ7, DQ6, or RY/BY#. Refer to “Write Operation Status” on page 29 for information on these status bits. Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the program operation. The program command sequence should be reinitiated once the device returns to the read mode, to ensure data integrity. S H E E T page 39 table in the AC Characteristics section for parameters, and Figure 15, on page 40 for timing diagrams. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from “0” back to a “1.” Attempting to do so may cause the device to set DQ5 = 1, or cause the DQ7 and DQ6 status bits to indicate the operation was successful. However, a succeeding read shows that the data is still “0.” Only erase operations can convert a “0” to a “1.” START Write Program Command Sequence Unlock Bypass Command Sequence The unlock bypass feature allows the system to program words to the device faster than using the standard program command sequence. The unlock bypass command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. The device then enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total programming time. Table 10 on page 28 shows the requirements for the command sequence. During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command sequence. The first cycle must contain the data 90h. The second cycle must contain the data 00h. The device then returns to the read mode. The device offers accelerated program operations through the ACC pin. When the system asserts VHH on the ACC pin, the device automatically enters the Unlock Bypass mode. The system may then write the two-cycle Unlock Bypass program command sequence. The device uses the higher voltage on the ACC pin to accelerate the operation. Note that the ACC pin must not be at VHH for operations other than accelerated programming, or device damage may result. Figure 3 illustrates the algorithm for the program operation. Refer to the “Erase and Program Operations” on January 22, 2007 22366C6 Data Poll from System Embedded Program algorithm in progress Verify Data? No Yes Increment Address No Last Address? Yes Programming Completed Note: See Table 10 on page 28, for program command sequence. Figure 3. Program Operation Chip Erase Command Sequence Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. Table 10 on page 28 shows the address and data requirements for the chip erase command sequence. Am29LV640D/Am29LV641D 25 D A T A When the Embedded Erase algorithm is complete, the device returns to the read mode and addresses are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or RY/BY#. Refer to “Write Operation Status” on page 29 for information on these status bits. Any commands written during the chip erase operation are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity. Figure 4, on page 27 illustrates the algorithm for the erase operation. Refer to the table “Erase and Program Operations” on page 39 in the AC Characteristics section for parameters, and Figure 17, on page 41 for timing diagrams. Sector Erase Command Sequence Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and the sector erase command. Table 10 on page 28 shows the address and data requirements for the sector erase command sequence. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. After the command sequence is written, a sector erase time-out of 50 µs occurs. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50 µs, otherwise erasure may begin. Any sector erase address and command following the exceeded time-out may or may not be accepted. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. Any command other than Sector Erase or Erase Suspend during the time-out period resets the device to the read mode. The system must rewrite the command sequence and any additional addresses and commands. The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section “DQ3: Sector Erase Timer” on page 31.). The time-out be- 26 S H E E T gins from the rising edge of the final WE# pulse in the command sequence. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. The system can determine the status of the erase operation by reading DQ7, DQ6, DQ2, or RY/BY#. Refer to “Write Operation Status” on page 29 for information on these status bits. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should be reinitiated once the device returns to reading array data, to ensure data integrity. Figure 4, on page 27 illustrates the algorithm for the erase operation. Refer to the table “Erase and Program Operations” on page 39 in the AC Characteristics section for parameters, and Figure 17, on page 41 for timing diagrams. Erase Suspend/Erase Resume Commands The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation, including the 50 µs time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. When the Erase Suspend command is written during the sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After the erase operation is suspended, the device enters the erase-suspend-read mode. The system can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is actively erasing or is erase-suspended. Refer to “Write Operation Status” on page 29 for information on these status bits. After an erase-suspended program operation is complete, the device returns to the erase-suspend-read mode. The system determines the status of the program operation using the DQ7 or DQ6 status bits, just Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T as in the standard word program operation. Refer to “Write Operation Status” on page 29 for more information. START In the erase-suspend-read mode, the system can also issue the autoselect command sequence. Refer to “Autoselect Mode” on page 16 and “Autoselect Command Sequence” on page 24 for details. Write Erase Command Sequence (Notes 1, 2) To resume the sector erase operation, the system must write the Erase Resume command. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip resumes erasing. Data Poll to Erasing Bank from System No Embedded Erase algorithm in progress Data = FFh? Yes Erasure Completed Notes: 1. See Table 10 for erase command sequence. 2. See the section on DQ3 for information on the sector erase timer. Figure 4. January 22, 2007 22366C6 Am29LV640D/Am29LV641D Erase Operation 27 D A T A S H E E T Command Definitions Table 10. Read (Note 5) Autoselect (Note 7) Reset (Note 6) Bus Cycles (Notes 1–4) Cycles Command Sequence Command Definitions Addr Data 1 RA RD First Second Addr Data Third Addr Fourth Data Addr Fifth Data 1 XXX F0 Manufacturer ID 4 555 AA 2AA 55 555 90 X00 0001 Device ID 4 555 AA 2AA 55 555 90 X01 22D7 SecSi™ Sector Factory Protect (Note 8) 6 555 AA 2AA 55 555 88 X02 60 Sector Group Protect Verify (Note 9) 4 555 AA 2AA 55 555 90 (SA)X02 XX00/ XX01 Sixth Addr Data Addr Data X02 40 X02 see (Note 9) Enter SecSi Sector Region 3 555 AA 2AA 55 555 88 Exit SecSi Sector Region 4 555 AA 2AA 55 555 90 XXX 00 Program 4 555 AA 2AA 55 555 A0 PA PD Unlock Bypass 555 AA 2AA 55 555 20 XXX A0 PA PD Unlock Bypass Reset (Note 11) 3 2 2 XXX 90 XXX 00 Chip Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10 Sector Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 SA 30 Erase Suspend (Note 12) 1 XXX B0 Erase Resume (Note 13) 1 XXX 30 CFI Query (Note 14) 1 55 98 Unlock Bypass Program (Note 10) Legend: X = Don’t care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE# pulse, whichever happens later. Notes: 1. See Table 1 on page 10 for a description of bus operations. 2. All values are in hexadecimal. 3. Except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 4. During unlock cycles, (when lower address bits are 555 or 2AAh as shown in table) address bits higher than A11 (except where BA is required) and data bits higher than DQ7 are don’t cares. 5. No unlock or command cycles required when device is in read mode. 6. The Reset command is required to return to the read mode (or to the erase-suspend-read mode if previously in Erase Suspend) when the device is in the autoselect mode, or if DQ5 goes high (while the device is providing status information). 7. The fourth cycle of the autoselect command sequence is a read cycle. Data bits DQ15–DQ8 are don’t care. See the “Autoselect Command Sequence” on page 24 section for more information. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE# pulse, whichever happens first. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A21–A15 uniquely select any sector. 8. If WP# protects the highest address sector (or if WP# is not available), the data is 98h for factory locked and 18h for not factory locked. If WP# protects the lowest address sector, the data is 88h for factory locked and 08h for not factor locked. 9. The data is 00h for an unprotected sector group and 01h for a protected sector group. 10. The Unlock Bypass command is required prior to the Unlock Bypass Program command. 11. The Unlock Bypass Reset command is required to return to the read mode when the device is in the unlock bypass mode. 12. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation. 13. The Erase Resume command is valid only during the Erase Suspend mode. 14. Command is valid when device is ready to read array data or when device is in autoselect mode. 28 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T WRITE OPERATION STATUS The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5, DQ6, and DQ7. Table 11 on page 32 and the following subsections describe the function of these bits. DQ7 and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether an Embedded Program or Erase operation is in progress or was completed. invalid. Valid data on DQ0–DQ7 appears on successive read cycles. Table 11 on page 32 shows the outputs for Data# Polling on DQ7. Figure 5, on page 29 shows the Data# Polling algorithm. Figure 18, on page 42 in the AC Characteristics section shows the Data# Polling timing diagram. DQ7: Data# Polling START The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or completed, or whether the device is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command sequence. During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, at thai time the device returns to the read mode. Read DQ7–DQ0 Addr = VA DQ7 = Data? No No DQ5 = 1? During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data# Polling produces a “1” on DQ7. The system must provide an address within any of the sectors selected for erasure to read valid status information on DQ7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then the device returns to the read mode. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the status may not be valid. Just prior to the completion of an Embedded Program or Erase operation, DQ7 may change asynchronously with DQ0–DQ6 while Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the program or erase operation and DQ7 has valid data, the data outputs on DQ0–DQ6 may be still January 22, 2007 22366C6 Yes Yes Read DQ7–DQ0 Addr = VA DQ7 = Data? Yes No FAIL PASS Notes: 1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid address is any non-protected sector address. 2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. Figure 5. Am29LV640D/Am29LV641D Data# Polling Algorithm 29 D A T A RY/BY#: Ready/Busy# The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC. S H E E T Table 11 on page 32 shows the outputs for Toggle Bit I on DQ6. Figure 6, on page 30 shows the toggle bit algorithm. Figure 19, on page 43 in the “AC Characteristics” section shows the toggle bit timing diagrams. Figure 20, on page 43 shows the differences between DQ2 and DQ6 in graphical form. See also the subsection “DQ2: Toggle Bit II” on page 31. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is in the read mode, the standby mode, or the device is in the erase-suspend-read mode. START Read DQ7–DQ0 Table 11 on page 32 shows the outputs for RY/BY#. DQ6: Toggle Bit I Read DQ7–DQ0 Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause DQ6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is complete, DQ6 stops toggling. Toggle Bit = Toggle? Yes No DQ5 = 1? Yes After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. Read DQ7–DQ0 Twice Toggle Bit = Toggle? The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use DQ7 (see the subsection “DQ7: Data# Polling” on page 29). If a program address falls within a protected sector, DQ6 toggles for approximately 1 μs after the program command sequence is written, then returns to reading array data. DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. 30 No No Yes Program/Erase Operation Not Complete, Write Reset Command Program/Erase Operation Complete Note: The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1.” See the subsections on DQ6 and DQ2 for more information. Figure 6. Am29LV640D/Am29LV641D Toggle Bit Algorithm 22366C6 January 22, 2007 D A T A DQ2: Toggle Bit II The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# pulse in the command sequence. DQ2 toggles when the system reads at addresses within those sectors that were selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But DQ2 cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 11 on page 32 to compare outputs for DQ2 and DQ6. Figure 6, on page 30 shows the toggle bit algorithm in flowchart form, and the section “DQ2: Toggle Bit II” explains the algorithm. See also the “DQ6: Toggle Bit I” on page 30 subsection. Figure 19, on page 43 shows the toggle bit timing diagram. Figure 20, on page 43 shows the differences between DQ2 and DQ6 in graphical form. Reading Toggle Bits DQ6/DQ2 Refer to Figure 6, on page 30 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high (see the sub-section on DQ5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system may continue to monitor January 22, 2007 22366C6 S H E E T the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 6, on page 30). DQ5: Exceeded Timing Limits DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5 produces a “1,” indicating that the program or erase cycle was not successfully completed. The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously programmed to “0.” Only an erase operation can change a “0” back to a “1.” Under this condition, the device halts the operation, and when the timing limit is exceeded, DQ5 produces a “1.” Under both these conditions, the system must write the reset command to return to the read mode (or to the erase-suspend-read mode if the device was previously in the erase-suspend-program mode). DQ3: Sector Erase Timer After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be assumed to be less than 50 µs, the system need not monitor DQ3. See also “Sector Erase Command Sequence” on page 26. After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device accepts additional sector erase commands. To ensure the command was accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 is high on the second status check, the last command might not have been accepted. Table 11 on page 32 shows the status of DQ3 relative to the other status bits. Am29LV640D/Am29LV641D 31 D A T A Table 11. Standard Mode Erase Suspend Mode Status Embedded Program Algorithm Embedded Erase Algorithm Erase Erase-Suspend- Suspended Sector Read Non-Erase Suspended Sector Erase-Suspend-Program S H E E T Write Operation Status DQ7 (Note 2) DQ7# 0 DQ6 Toggle Toggle DQ5 (Note 1) 0 0 DQ3 N/A 1 DQ2 (Note 2) No toggle Toggle RY/BY# (Note 3) 0 0 1 No toggle 0 N/A Toggle 1 Data Data Data Data Data 1 DQ7# Toggle 0 N/A N/A 0 Notes: 1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to the section on DQ5 for more information. 2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 3. RY/BY# is only available on the FBGA package. 32 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . . . –65°C to +150°C Ambient Temperature with Power Applied. . . . . . . . . . . . . . –65°C to +125°C Voltage with Respect to Ground 20 ns 20 ns +0.8 V –0.5 V –2.0 V VCC (Note 1) . . . . . . . . . . . . . . . . . –0.5 V to +4.0 V 20 ns VIO . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +5.5 V Figure 7. Maximum Negative Overshoot Waveform A9, OE#, ACC, and RESET# (Note 2) . . . . . . . . . . . . . . . . . . . . –0.5 V to +12.5 V All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V Output Short Circuit Current (Note 3) . . . . . . 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. Dur ing voltage transitions, input or I/O pins may overshoot V SS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. See Figure 7. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8. 2. Minimum DC input voltage on pins A9, OE#, ACC, and RESET# is –0.5 V. During voltage transitions, A9, OE#, ACC, and RESET# may overshoot V SS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9, OE#, ACC, and RESET# is +12.5 V which may overshoot to +14.0 V for periods up to 20 ns. 20 ns VCC +2.0 V VCC +0.5 V 2.0 V 20 ns 20 ns Figure 8. Maximum Positive Overshoot Waveform 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. OPERATING RANGES Industrial (I) Devices Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C Supply Voltages VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0–3.6 V VIO . . . . . . . . . . . . . . . . .either 1.8–2.9 V or 3.0–5.0 V (see “Ordering Information” on page 9) Operating ranges define those limits between which the functionality of the device is guaranteed. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 33 D A T A S H E E T DC CHARACTERISTICS CMOS Compatible Parameter Symbol Parameter Description Test Conditions Min ILI Input Load Current (Note 1) VIN = VSS to VCC, VCC = VCC max ILIT A9, ACC Input Load Current VCC = VCC max; A9 = 12.5 V ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC max ICC1 VCC Active Read Current (Notes 2, 3) CE# = VIL, OE# = VIH Typ Max Unit ±1.0 µA 35 µA ±1.0 µA 5 MHz 9 16 1 MHz 2 4 ICC2 VCC Active Write Current (Notes 3, 4) CE# = VIL, OE# = VIH, WE# = VIL 26 30 mA ICC3 VCC Standby Current (Note 3) CE#, RESET# = VCC ± 0.3 V, WP# = VIH 0.2 5 µA ICC4 VCC Reset Current (Note 3) RESET# = VSS ± 0.3 V, WP# = VIH 0.2 5 µA ICC5 Automatic Sleep Mode (Notes 3, 5) VIH = VCC ± 0.3 V; VIL = VSS ± 0.3 V, WP# = VIH 0.2 5 µA IACC ACC Accelerated Program Current CE# = VIL, OE# = VIH ACC pin 5 10 mA VCC pin 15 30 mA VIL Input Low Voltage (Note 6) –0.5 0.8 V VIH Input High Voltage (Note 6) 0.7 x VCC VCC + 0.3 V VHH Voltage for ACC Program Acceleration VCC = 3.0 V ± 10% 11.5 12.5 V VID Voltage for Autoselect and Temporary VCC = 3.0 V ± 10% Sector Unprotect 8.5 12.5 V VOL Output Low Voltage 0.45 V VOH1 VOH2 VLKO IOL = 4.0 mA, VCC = VCC min Output High Voltage mA IOH = –2.0 mA, VCC = VCC min 0.8 VIO V IOH = –100 µA, VCC = VCC min VIO–0.4 V Low VCC Lock-Out Voltage (Note 7) 2.3 2.5 V Notes: 1. On the WP# pin only, the maximum input load current when WP# = VIL is ± 5.0 µA. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. Maximum ICC specifications are tested with VCC = VCCmax. ICC active while Embedded Erase or Embedded Program is in progress. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 200 nA. 6. If VIO < VCC, maximum VIL for CE# and DQ I/Os is 0.3 VIO. If VIO < VCC, minimum VIH for CE# and DQ I/Os is 0.7 VIO. Maximum VIH for these connections is VIO + 0.3 V 7. Not 100% tested. 2. 3. 4. 5. 34 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T DC CHARACTERISTICS Zero-Power Flash Supply Current in mA 25 20 15 10 5 0 0 500 1000 1500 2500 3000 3500 4000 Time in ns Note: Addresses are switching at 1 MHz Figure 9. 2000 ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) 12 3.6 V 10 Supply Current in mA 8 3.0 V 6 4 2 0 1 2 3 5 Frequency in MHz Note: T = 25 °C Figure 10. January 22, 2007 22366C6 4 Typical ICC1 vs. Frequency Am29LV640D/Am29LV641D 35 D A T A S H E E T TEST CONDITIONS Table 12. Test Specifications 3.3 V Test Condition 2.7 kΩ Device Under Test Output Load 6.2 kΩ 30 Test Setup pF 5 ns 0.0–3.0 V Input timing measurement reference levels (See Note) 1.5 V Output timing measurement reference levels 0.5 VIO V Input Pulse Levels Figure 11. 100 Input Rise and Fall Times Note: Diodes are IN3064 or equivalent Unit 1 TTL gate Output Load Capacitance, CL (including jig capacitance) CL 120R, 121R 90R Note: If VIO < VCC, the reference level is 0.5 VIO. KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS Steady Changing from H to L Changing from L to H 3.0 V Input Don’t Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is High Impedance State (High Z) 1.5 V Measurement Level 0.5 VIO V Output 0.0 V Note: If VIO < VCC, the input measurement reference level is 0.5 VIO. Figure 12. Input Waveforms and Measurement Levels 36 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS Read-Only Operations Parameter Speed Options 90R 120R, 121R Unit Min 90 120 ns CE#, OE# = VIL Max 90 120 ns OE# = VIL Max 90 120 ns Output Enable to Output Delay Max 35 50 ns tDF Chip Enable to Output High Z (Note 1) Max 30 30 ns tGHQZ tDF Output Enable to Output High Z (Note 1) Max 30 30 ns tAXQX tOH Output Hold Time From Addresses, CE# or OE#, Whichever Occurs First Min 0 ns Read Min 0 ns tOEH Output Enable Hold Time (Note 1) Toggle and Data# Polling Min 10 ns JEDEC Std. Description Test Setup tAVAV tRC Read Cycle Time (Note 1) tAVQV tACC Address to Output Delay tELQV tCE Chip Enable to Output Delay tGLQV tOE tEHQZ Notes: 1. Not 100% tested. 2. See Figure 11 and Table 12 for test specifications. tRC Addresses Stable Addresses tACC CE# tRH tRH tDF tOE OE# tOEH WE# tCE tOH HIGH Z HIGH Z Output Valid Outputs RESET# RY/BY# 0V Figure 13. January 22, 2007 22366C6 Read Operation Timings Am29LV640D/Am29LV641D 37 D A T A S H E E T AC CHARACTERISTICS Hardware Reset (RESET#) Parameter JEDEC Std Description All Speed Options Unit tReady RESET# Pin Low (During Embedded Algorithms) to Read Mode (See Note) Max 20 μs tReady RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode (See Note) Max 500 ns tRP RESET# Pulse Width Min 500 ns tRH Reset High Time Before Read (See Note) Min 50 ns tRPD RESET# Low to Standby Mode Min 20 μs tRB RY/BY# Recovery Time Min 0 ns Note: Not 100% tested. RY/BY# CE#, OE# tRH RESET# tRP tReady Reset Timings NOT during Embedded Algorithms Reset Timings during Embedded Algorithms tReady RY/BY# tRB CE#, OE# tRH RESET# tRP Figure 14. 38 Reset Timings Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS Erase and Program Operations Parameter Speed Options 90R 120R, 121R Unit 90 120 ns JEDEC Std. Description tAVAV tWC Write Cycle Time (Note 1) Min tAVWL tAS Address Setup Time Min 0 ns tASO Address Setup Time to OE# low during toggle bit polling Min 15 ns tAH Address Hold Time Min tAHT Address Hold Time From CE# or OE# high during toggle bit polling Min tDVWH tDS Data Setup Time Min tWHDX tDH Data Hold Time Min 0 ns tOEPH Output Enable High during toggle bit polling Min 20 ns tGHWL tGHWL Read Recovery Time Before Write (OE# High to WE# Low) Min 0 ns tELWL tCS CE# Setup Time Min 0 ns tWHEH tCH CE# Hold Time Min 0 ns tWLWH tWP Write Pulse Width Min tWHDL tWPH Write Pulse Width High Min 30 ns tWHWH1 tWHWH1 Word Programming Operation (Note 2) Typ 11 µs tWHWH1 tWHWH1 Accelerated Word Programming Operation (Note 2) Typ 7 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.9 sec tVHH VHH Rise and Fall Time (Note 1) Min 250 ns tVCS VCC Setup Time (Note 1) Min 50 µs tRB Write Recovery Time from RY/BY# Min 0 ns Program/Erase Valid to RY/BY# Delay Max 90 ns tWLAX tBUSY 45 50 0 45 ns 50 35 ns 50 ns ns Notes: 1. Not 100% tested. 2. See the “Erase And Programming Performance” section for more information. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 39 D A T A S H E E T AC CHARACTERISTICS Program Command Sequence (last two cycles) tAS tWC Addresses Read Status Data (last two cycles) 555h PA PA PA tAH CE# tCH OE# tWHWH1 tWP WE# tWPH tCS tDS tDH PD A0h Data Status tBUSY DOUT tRB RY/BY# VCC tVCS Notes: 1. PA = program address, PD = program data, DOUT is the true data at the program address. 2. Illustration shows device in word mode. Figure 15. Program Operation Timings VHH ACC VIL or VIH VIL or VIH tVHH Figure 16. 40 tVHH Accelerated Program Timing Diagram Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS Erase Command Sequence (last two cycles) tAS tWC 2AAh Addresses Read Status Data VA SA VA 555h for chip erase tAH CE# tCH OE# tWP WE# tWPH tCS tWHWH2 tDS tDH Data 55h In Progress 30h Complete 10 for Chip Erase tBUSY tRB RY/BY# tVCS VCC Notes: 1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”. 2. These waveforms are for the word mode. Figure 17. January 22, 2007 22366C6 Chip/Sector Erase Operation Timings Am29LV640D/Am29LV641D 41 D A T A S H E E T AC CHARACTERISTICS tRC Addresses VA VA VA tACC tCE CE# tCH tOE OE# tOEH tDF WE# tOH High Z DQ7 Complement Complement DQ0–DQ6 Status Data Status Data True Valid Data High Z True Valid Data tBUSY RY/BY# Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle. Figure 18. Data# Polling Timings (During Embedded Algorithms) 42 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS tAHT tAS Addresses tAHT tASO CE# tCEPH tOEH WE# tOEPH OE# tDH DQ6/DQ2 tOE Valid Data Valid Status Valid Status Valid Status (first read) (second read) (stops toggling) Valid Data RY/BY# Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle Figure 19. Toggle Bit Timings (During Embedded Algorithms) Enter Embedded Erasing WE# Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Read Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete DQ6 DQ2 Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6. Figure 20. DQ2 vs. DQ6 January 22, 2007 22366C6 Am29LV640D/Am29LV641D 43 D A T A S H E E T AC CHARACTERISTICS Temporary Sector Unprotect Parameter JEDEC Std Description All Speed Options Unit tVIDR VID Rise and Fall Time (See Note) Min 500 ns tRSP RESET# Setup Time for Temporary Sector Unprotect Min 4 µs tRRB RESET# Hold Time from RY/BY# High for Temporary Sector Group Unprotect Min 4 µs Note: Not 100% tested. VID RESET# VID VSS, VIL, or VIH VSS, VIL, or VIH tVIDR tVIDR Program or Erase Command Sequence CE# WE# tRRB tRSP RY/BY# Figure 21. 44 Temporary Sector Group Unprotect Timing Diagram Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS VID VIH RESET# SA, A6, A1, A0 Valid* Valid* Sector Group Protect or Unprotect Data 60h 60h Valid* Verify 40h Status Sector Group Protect: 150 µs, Sector Group Unprotect: 15 ms 1 µs CE# WE# OE# * For sector group protect, A6 = 0, A1 = 1, A0 = 0. For sector group unprotect, A6 = 1, A1 = 1, A0 = 0. Figure 22. January 22, 2007 22366C6 Sector Group Protect and Unprotect Timing Diagram Am29LV640D/Am29LV641D 45 D A T A S H E E T AC CHARACTERISTICS Alternate CE# Controlled Erase and Program Operations Parameter Speed Options 90R 120R, 121R Unit 90 120 ns JEDEC Std Description tAVAV tWC Write Cycle Time (Note 1) Min tAVWL tAS Address Setup Time Min tELAX tAH Address Hold Time Min 45 50 ns tDVEH tDS Data Setup Time Min 45 50 ns tEHDX tDH Data Hold Time Min 0 ns tGHEL tGHEL Read Recovery Time Before Write (OE# High to WE# Low) Min 0 ns tWLEL tWS WE# Setup Time Min 0 ns tEHWH tWH WE# Hold Time Min 0 ns tELEH tCP CE# Pulse Width Min tEHEL tCPH CE# Pulse Width High Min 30 ns tWHWH1 tWHWH1 Word Programming Operation (Note 2) Typ 11 µs tWHWH1 tWHWH1 Accelerated Word Programming Operation (Note 2) Typ 7 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.9 sec 0 45 ns 50 ns Notes: 1. Not 100% tested. 2. See the “Erase And Programming Performance” section for more information. 46 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T AC CHARACTERISTICS 555 for program 2AA for erase PA for program SA for sector erase 555 for chip erase Data# Polling Addresses PA tWC tAS tAH tWH WE# tGHEL OE# tCP CE# tWS tWHWH1 or 2 tCPH tBUSY tDS tDH DQ7# Data tRH A0 for program 55 for erase DOUT PD for program 30 for sector erase 10 for chip erase RESET# RY/BY# Notes: 1. Figure indicates last two bus cycles of a program or erase operation. 2. PA = program address, SA = sector address, PD = program data. 3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device. 4. Waveforms are for the word mode. Figure 23. January 22, 2007 22366C6 Alternate CE# Controlled Write (Erase/Program) Operation Timings Am29LV640D/Am29LV641D 47 D A T A S H E E T ERASE AND PROGRAMMING PERFORMANCE Parameter Typ (Note 1) Max (Note 2) Unit Comments Sector Erase Time 0.9 15 sec Chip Erase Time 115 Excludes 00h programming prior to erasure (Note 4) Word Program Time 11 300 µs Accelerated Word Program Time 7 210 µs Chip Program Time (Note 3) 48 144 sec sec Excludes system level overhead (Note 5) Notes: 1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally, programming typicals assume checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 3.0 V, 1,000,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most words program faster than the maximum program times listed. 4. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 10 for further information on command definitions. 6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles. LATCHUP CHARACTERISTICS Description Min Max Input voltage with respect to VSS on all pins except I/O pins (including A9, OE#, and RESET#) –1.0 V 12.5 V Input voltage with respect to VSS on all I/O pins –1.0 V VCC + 1.0 V –100 mA +100 mA VCC Current Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time. TSOP PIN CAPACITANCE Parameter Symbol Parameter Description Test Setup Typ Max Unit CIN Input Capacitance VIN = 0 6 7.5 pF COUT Output Capacitance VOUT = 0 8.5 12 pF CIN2 Control Pin Capacitance VIN = 0 7.5 9 pF Test Conditions Min Unit 150°C 10 Years 125°C 20 Years Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0 MHz. DATA RETENTION Parameter Description Minimum Pattern Data Retention Time 48 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T PHYSICAL DIMENSIONS SSO056—56-Pin Shrink Small Outline Package (SSOP) Dwg rev AB; 10/99 January 22, 2007 22366C6 Am29LV640D/Am29LV641D 49 D A T A S H E E T PHYSICAL DIMENSIONS FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 12 x 11 mm package Dwg rev AF; 10/99 50 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T PHYSICAL DIMENSIONS LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm package January 22, 2007 22366C6 Am29LV640D/Am29LV641D 51 D A T A S H E E T PHYSICAL DIMENSIONS TS 048—48-Pin Standard TSOP Dwg rev AA; 10/99 Note: For reference only. BSC is an ANSI standard for Basic Space Centering. * For reference only. BSC is an ANSI standard for Basic Space Centering. 52 Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T REVISION SUMMARY Revision A (April 26, 1999) Ordering Information Initial release. Added the valid combinations for the SSOP package. Revision A+1 (May 4, 1999) Revision A+6 (September 28, 1999) Global Connection Diagrams Deleted references to the 4-word unique ESN. Replaced references to VCCQ with VIO. Clarified which packages are available for a particular part number. Connection Diagrams Device Bus Operations 63-ball FBGA: Corrected signal for ball H7 to VIO. VersatileIO Control: Added comment to contact AMD for more information on this feature. Ordering Information DC Characteristics Added “U” designator description. SecSi (Secured Silicon) Sector Flash Memory Region In the third paragraph, replaced references to boot sectors with SA0. Added table to show SecSi sector contents. DC Characteristics table Added VIO = VCC as a test condition for ICC1 and ICC2. Changed V HH minimum specification from 8.5 V to 11.5 V. CMOS Compatible table: Added notes (1 and 2) for ILI and test conditions column. Test Conditions In Test Specifications table and Input Waveforms and Measurement Levels figure, changed the output measurement level to VIO/2. AC Characteristics Read-only Operations table: Added note for test setup column. Revision A+2 (May 14, 1999) Revision B (June 20, 2000) Ordering Information Global Clarified the differences between the H, L, and U designators. Deleted references to 150 ns speed option. Added more information and specifications on VIO feature, including part number distinctions. At V IO < V CC, the available speed options are 100 ns and 120 ns. At VIO ≥ VCC, the available speed options are 90 ns and 120 ns. Changed data sheet status to “Preliminary.” Revision A+3 (June 7, 1999) Product Selector Guide Added note under table. Distinctive Characteristics Ordering Information Deleted the “0” from the 120 and 150 ns part numbers. Corrected the FBGA package marking for the 150 ns speed option. Clarified on which devices RY/BY# and WP# are available. Clarified package options for devices. Ordering Information Clarified on which devices RY/BY# and WP# are available. Clarified package options for devices. Reinstated “0” into the 120 ns speed part number for VIO = 3.0 V to 5.0 V; added part numbers for VIO = 1.8 V to 2.9 V. Revision A+4 (June 25, 1999) Global Information on the 56-pin SSOP package has been added: pinout information and physical dimension drawings. Device Bus Operations table In the legend, corrected the VHH voltage range. Command Definitions SecSi Sector Contents table Corrected the data for SecSi Sector protection in Note 9. Added device ID data to the table. Corrected ending address in second row to 7Fh. Revision A+5 (August 2, 1999) Redefined VOH1 and VOH2 in terms of VIO. Added note relative to VIO for VIH and VIL. Deleted note regarding test condition assumption of VIO = VCC. Block Diagram DC Characteristics table Separated WP# and ACC. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 53 D A T A S H E E T Test Conditions Revision B+5 (October 11, 2001) Test Conditions table: Redefined output timing measurement reference level as 0.5 VIO. Connection Diagrams, Ordering Information, Physical Dimensions Added note to table and figure. Added 64-ball Fortified BGA package information. Erase and Program Operations table, Alternate CE# Controlled Erase and Program Operations table, Erase and Programming Performance table Changed the typical sector erase time to 1.6 s. AC Characteristics—Figure 15. Program Operations Timing and Figure 17. Chip/Sector Erase Operations Revision B+6 (January 10, 2002) Global Clarified description of VersatileIO (VIO) in the following sections: Distinctive Characteristics; General Description; VersatileIO (VIO) Control; Operating Ranges; DC Characteristics; CMOS compatible. Deleted tGHWL and changed OE# waveform to start at high. Reduced typical sector erase time from 1.6 s to 0.9 s. Physical Dimensions Changed minimum VOH1 from 0.85VIO to 0.8VIO. Deleted reference to Note 6 for both VOH1 and VOH2. Replaced figures with more detailed illustrations. DC Characteristics Erase and Program Performance table Revision B+1 (August 4, 2000) Reduced typical sector erase time from 1.6 s to 0.9 s. Changed typical chip program time from 90 s to 115 s. Global Added trademarks for SecSi Sector. Accelerated Program Operation (page 11), Unlock Bypass Command Sequence (page 25) Revision B+7 (April 15, 2002) Ordering Information Added N designator for Fortified BGA package markings. Added caution note regarding ACC pin. Absolute Maximum Ratings Corrected the maximum voltage on VIO to +5.5V. Common Flash Interface (CFI) DC Characteristics table Revised data value at address 44h. Clarified description of data for addresses 45–47h, 49, 4A, 4D–4Fh. Added WP# = VIH to test conditions for standby currents ICC3, ICC4, ICC5. Table 10, Command Definitions Revision B+2 (October 18, 2000) Clarified and combined Notes 4 and 5 into Note 4. Revision B+8 (September 20, 2002) Distinctive Characteristics Corrected package options for 56-pin SSOP as being available on Am29LV640DH/DL only. Sector Erase Command Sequence Changed sentence arrangement in fourth paragraph. Revision B+3 (January 18, 2001) Revision B+9 (March 3, 2004) Global Table 10, Command Definitions Deleted “Preliminary” status from document. Revised SecSi Sector Factory Protect (note 8) command definitions. General Description In the second paragraph, corrected references to VIO voltage ranges. The 90 and 120 speeds are available where VIO ≥ VCC, and 100 and 120 ns speeds are available where VIO < VCC. Revision B+4 (March 8, 2001) Table 4, Sector Group Protection/Unprotection Address Table Corrected the sector group address bits for sectors 64–127. 54 Revision B+10 (April 5, 2004) Command Definitions Changed first Address data for Erase Suspend/Resume from BA to XXX. Revision C (June 4, 2004) Ordering Information Added Pb-free OPNs. Am29LV640D/Am29LV641D 22366C6 January 22, 2007 D A T A S H E E T Revision C + 1 (October 14, 2004) Global Ordering Information Removed references to byte mode. Added tRH reference line to Figure 14. Revision C + 4 (September 13, 2005) Corrected description of Sector Erase Command Sequence on page 30. Valid Combinations Added Colophon Revision C5 (December 23, 2005) Revision C + 2 (January 7, 2005) Global Valid Combinations Updated table to include a note regarding product offerings for new designs. Revision C + 3 (February 9, 2005) Pin Description Added RFU to the list of pins. New option FF added on TSOP and SSOP packages. Deleted reverse TSOP package option and 100 ns speed option. Revision C6 (January 22, 2007) AC Characteristics Erase and Program Operations table: Changed tBUSY to a maximum specification. Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks Copyright © 1999–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. Copyright © 2006–2007 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners. January 22, 2007 22366C6 Am29LV640D/Am29LV641D 55