PRELIMINARY Am42DL32x4G Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features SOFTWARE FEATURES ■ Power supply voltage of 2.7 to 3.3 volt ■ Data Management Software (DMS) — AMD-supplied software manages data programming and erasing, enabling EEPROM emulation — Eases sector erase limitations ■ High performance — Flash Access time as fast as 70 ns — SRAM access time as fast as 55 ns ■ Package ■ Supports Common Flash Memory Interface (CFI) ■ Erase Suspend/Erase Resume — 73-Ball FBGA — Suspends erase operations to allow programming in same bank ■ Operating Temperature — –40°C to +85°C ■ Data# Polling and Toggle Bits — Provides a software method of detecting the status of program or erase cycles Flash Memory Features ARCHITECTURAL ADVANTAGES ■ Unlock Bypass Program command — Reduces overall programming time when issuing multiple program command sequences ■ Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in other bank — Zero latency between read and write operations ■ Secured Silicon (SecSi) Sector: Extra 256 Byte sector — Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. — Customer lockable: Sector is one-time programmable. Once locked, data cannot be changed HARDWARE FEATURES ■ Any combination of sectors can be erased ■ Ready/Busy# output (RY/BY#) — Hardware method for detecting program or erase cycle completion ■ Hardware reset pin (RESET#) — Hardware method of resetting the internal state machine to reading array data ■ Zero Power Operation — Sophisticated power management circuits reduce power consumed during inactive periods to nearly zero ■ WP#/ACC input pin — Write protect (WP#) function allows protection of two outermost boot sectors, regardless of sector protect status — Acceleration (ACC) function accelerates program timing ■ Top or bottom boot block ■ Manufactured on 0.17 µm process technology ■ Compatible with JEDEC standards ■ Sector protection — Hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector — Temporary Sector Unprotect allows changing data in protected sectors in-system — Pinout and software compatible with single-power-supply flash standard PERFORMANCE CHARACTERISTICS ■ High performance — Access time as fast as 70 ns — Program time: 4 µs/word typical utilizing Accelerate function ■ Ultra low power consumption (typical values) — 2 mA active read current at 1 MHz — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode ■ Minimum 1 million write cycles guaranteed per sector ■ 20 Year data retention at 125°C — Reliable operation for the life of the system SRAM Features ■ Power dissipation — Operating: 22 mA maximum for 70 ns, 30 mA maximum for 55 ns — Standby: 10 µA maximum ■ ■ ■ ■ CE1s# and CE2s Chip Select Power down features using CE1s# and CE2s Data retention supply voltage: 1.5 to 3.3 volt Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8) This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. Publication# 25822 Rev: B Amendment/0 Issue Date: May 19, 2003 Refer to AMD’s Website (www.amd.com) for the latest information. P R E L I M I N A R Y GENERAL DESCRIPTION Am29DL32xG Features The Am29DL322G/323G/324G consists of 32 megabit, 3.0 volt-only flash memory devices, organized as 2,097,152 words of 16 bits each or 4,194,304 bytes of 8 bits each. Word mode data appears on DQ15–DQ0; byte mode data appears on DQ7–DQ0. The device is designed to be programmed in-system with the standard 3.0 volt VCC supply, and can also be programmed in standard EPROM programmers. The devices are available with access times of 85 and 70 ns. The device is offered in a 73-ball FBGA package. Standard control pins—chip enable (CE#f), write enable (WE#), and output enable (OE#)—control normal read and write operations, and avoid bus contention issues. The devices requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. Simultaneous Read/Write Operations with Zero Latency The Simultaneous Read/Write architecture provides simultaneous operation by dividing the memory space into two banks. The device can improve overall system performance by allowing a host system to program or erase in one bank, then immediately and simultaneously read from the other bank, with zero latency. This releases the system from waiting for the completion of program or erase operations. The Am29DL32xG device family uses multiple bank architectures to provide flexibility for different applications. Three devices are available with the following bank sizes: Device DL322 DL323 DL324 Bank 1 4 8 16 Bank 2 28 24 16 The Secured Silicon (SecSi) Sector is an extra 256 byte sector capable of being permanently locked by AMD or customers. The SecSi Sector Indicator Bit (DQ7) is permanently set to a 1 if the part is factory locked, and set to a 0 if customer lockable. This way, customer lockable parts can never be used to replace a factory locked part. Factory locked parts provide several options. The SecSi Sector may store a secure, random 16 byte ESN (Electronic Serial Number). Customer Lockable devices are one-time programmable and one-time lockable. 2 DMS (Data Management Software) allows systems to easily take advantage of the advanced architecture of the simultaneous read/write product line by allowing removal of EEPROM devices. DMS will also allow the system software to be simplified, as it will perform all functions necessary to modify data in file structures, as opposed to single-byte modifications. To write or update a particular piece of data (a phone number or configuration data, for example), the user only needs to state which piece of data is to be updated, and where the updated data is located in the system. This is a n a d va n t a g e co m p a r e d t o sys t e ms w h e r e user-written software must keep track of the old data location, status, logical to physical translation of the data onto the Flash memory device (or memory devices), and more. Using DMS, user-written software does not need to interface with the Flash memory directly. Instead, the user's software accesses the Flash memory by calling one of only six functions. AMD provides this software to simplify system design and software integration efforts. The device offers complete compatibility with the JEDEC single-power-supply Flash command set standard. Commands are written to the command register using standard microprocessor write timings. Reading data out of the device is similar to reading from other Flash or EPROM devices. The host system can detect whether a program or erase operation is complete by using the device status bits: RY/BY# pin, DQ7 (Data# Polling) and DQ6/DQ2 (toggle bits). After a program or erase cycle has been completed, the device automatically returns to reading array data. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory. Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memo r y. T h i s c a n b e a c h i e v e d i n - s y s t e m o r v i a programming equipment. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both modes. Am42DL32x4G May 19, 2003 P R E L I M I N A R Y TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5 MCP Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . 5 Flash Memory Block Diagram. . . . . . . . . . . . . . . . 6 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . 7 Special Handling Instructions for FBGA Package .................... 7 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9 Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10 Table 2. Device Bus Operations—Flash Byte Mode, CIOf = VSS ....12 Requirements for Reading Array Data ................................... 13 Writing Commands/Command Sequences ............................ 13 Accelerated Program Operation ............................................. 13 Autoselect Functions .............................................................. 13 Simultaneous Read/Write Operations with Zero Latency ....... 13 Automatic Sleep Mode ........................................................... 14 RESET#: Hardware Reset Pin ............................................... 14 Output Disable Mode .............................................................. 14 Table 3. Device Bank Division ........................................................14 Table 4. Top Boot Sector Addresses .............................................15 Sector/Sector Block Protection and Unprotection .................. 19 Figure 6. Toggle Bit Algorithm........................................................ 34 DQ2: Toggle Bit II ................................................................... 35 Reading Toggle Bits DQ6/DQ2 ............................................... 35 DQ5: Exceeded Timing Limits ................................................ 35 DQ3: Sector Erase Timer ....................................................... 35 Table 18. Write Operation Status ................................................... 36 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 37 Industrial (I) Devices ............................................................... 37 VCCf/VCCs Supply Voltage ....................................................... 37 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38 CMOS Compatible .................................................................. 38 SRAM DC and Operating Characteristics. . . . . . 39 Zero-Power Flash ................................................................. 40 Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ........................................................................................ 40 Figure 10. Typical ICC1 vs. Frequency............................................ 40 Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 11. Test Setup.................................................................... 41 Table 19. Test Specifications ......................................................... 41 Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection .............................................................19 Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection .............................................................20 Key To Switching Waveforms . . . . . . . . . . . . . . . 41 Write Protect (WP#) ................................................................ 20 Temporary Sector/Sector Block Unprotect ............................. 20 Figure 13. Timing Diagram for Alternating Between SRAM to Flash .. 42 Figure 1. Temporary Sector Unprotect Operation........................... 21 Figure 1. In-System Sector/Sector Block Protect and Unprotect Algorithms ....................................................................................... 22 SecSi (Secured Silicon) Sector Flash Memory Region .......... 23 Factory Locked: SecSi Sector Programmed and Protected At the Factory .................................................................................... 23 Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory ......................................................... 23 Figure 2. SecSi Sector Protect Verify.............................................. 23 Hardware Data Protection ...................................................... 24 Low VCC Write Inhibit .............................................................. 24 Write Pulse “Glitch” Protection ............................................... 24 Logical Inhibit .......................................................................... 24 Power-Up Write Inhibit ............................................................ 24 Common Flash Memory Interface (CFI) . . . . . . . 24 Command Definitions . . . . . . . . . . . . . . . . . . . . . 27 Reading Array Data ................................................................ 27 Reset Command ..................................................................... 27 Autoselect Command Sequence ............................................ 27 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 28 Byte/Word Program Command Sequence ............................. 28 Unlock Bypass Command Sequence ..................................... 28 Figure 3. Program Operation .......................................................... 29 Chip Erase Command Sequence ........................................... 29 Sector Erase Command Sequence ........................................ 29 Erase Suspend/Erase Resume Commands ........................... 30 Figure 4. Erase Operation............................................................... 30 Table 15. Autoselect Device IDs (Word Mode) ...............................31 Table 17. Autoselect Device IDs (Byte Mode) ................................32 Write Operation Status . . . . . . . . . . . . . . . . . . . . 33 DQ7: Data# Polling ................................................................. 33 Figure 5. Data# Polling Algorithm ................................................... 33 DQ6: Toggle Bit I .................................................................... 34 May 19, 2003 Figure 12. Input Waveforms and Measurement Levels ................. 41 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42 SRAM CE#s Timing ................................................................ 42 Flash Read-Only Operations ................................................. 43 Figure 14. Read Operation Timings............................................... 43 Hardware Reset (RESET#) .................................................... 44 Figure 15. Reset Timings ............................................................... 44 Flash Word/Byte Configuration (CIOf) .................................... 45 Figure 16. CIOf Timings for Read Operations................................ 45 Figure 17. CIOf Timings for Write Operations................................ 45 Flash Erase and Program Operations .................................... 46 Figure 18. Program Operation Timings.......................................... Figure 19. Accelerated Program Timing Diagram.......................... Figure 20. Chip/Sector Erase Operation Timings .......................... Figure 21. Back-to-back Read/Write Cycle Timings ...................... Figure 22. Data# Polling Timings (During Embedded Algorithms). Figure 23. Toggle Bit Timings (During Embedded Algorithms)...... Figure 24. DQ2 vs. DQ6................................................................. 47 47 48 49 49 50 50 Temporary Sector/Sector Block Unprotect ............................. 51 Figure 25. Temporary Sector/Sector Block Unprotect Timing Diagram.............................................................................. 51 Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram.............................................................................. 52 Alternate CE#f Controlled Erase and Program Operations .... 53 Figure 27. Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings.......................................................................... 54 SRAM Read Cycle .................................................................. 55 Figure 28. SRAM Read Cycle—Address Controlled...................... 55 Figure 29. SRAM Read Cycle ........................................................ 56 SRAM Write Cycle .................................................................. 57 Figure 30. SRAM Write Cycle—WE# Control ................................ 57 Figure 31. SRAM Write Cycle—CE1#s Control ............................. 58 Figure 32. SRAM Write Cycle—UB#s and LB#s Control............... 59 Flash Latchup Characteristics. . . . . . . . . . . . . . . Package Pin Capacitance . . . . . . . . . . . . . . . . . . Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . SRAM Data Retention . . . . . . . . . . . . . . . . . . . . . . Am42DL32x4G 60 60 60 61 3 P R E L I M I N A R Y Figure 33. CE1#s Controlled Data Retention Mode........................ 61 Figure 34. CE2s Controlled Data Retention Mode.......................... 61 FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ............. 62 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 63 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 62 4 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y PRODUCT SELECTOR GUIDE Part Number Am42DL32x4G Standard Voltage Speed Range: VCC = Options 2.7–3.3 V 71 70 85 71 70 85 Max Access Time (ns) 70 70 85 55 70 85 CE# Access (ns) 70 70 85 55 70 85 OE# Access (ns) 30 30 40 25 35 35 Flash Memory SRAM MCP BLOCK DIAGRAM VCCf VSS A20 to A0 RY/BY# A20 to A0 A–1 WP#/ACC RESET# CE#f CIOf 32 M Bit Flash Memory DQ15/A-1 to DQ0 DQ15/A-1 to DQ0 VCCs/VCCQ VSS/VSSQ A0 toto A19 A17 A0 LB#s UB#s WE# OE# CE1#s CE2s May 19, 2003 4 M Bit Static RAM DQ15/A-1 to DQ0 Am42DL32x4G 5 P R E L I M I N A R Y FLASH MEMORY BLOCK DIAGRAM RY/BY# X-Decoder A20–A0 WE# CE# CIOf STATE CONTROL & COMMAND REGISTER Status DQ15–DQ0 Control WP#/ACC DQ15–DQ0 Lower Bank Address Lower Bank Latches and Control Logic A20–A0 Y-Decoder A20–A0 X-Decoder OE# 6 Am42DL32x4G DQ15–DQ0 RESET# Upper Bank DQ15–DQ0 A20–A0 Y-Decoder Upper Bank Address A20–A0 Latches and Control Logic OE# CIOf VCC VSS CIOf May 19, 2003 P R E L I M I N A R Y CONNECTION DIAGRAM 73-Ball FBGA Top View A1 A10 NC NC B1 B5 B6 B10 NC NC NC NC C5 C3 C4 C6 C7 C8 NC A7 LB# WP#/ACC WE# A8 A11 D2 D3 D4 D7 D8 D9 A3 A6 UB# A19 A12 A15 E2 E3 E4 E5 E6 E7 E8 E9 A2 A5 A18 RY/BY# A20 A9 A13 NC F1 F2 F3 F4 F7 F8 F9 F10 NC A1 A4 A17 A10 A14 NC NC G1 G2 G3 G4 G7 G8 G9 G10 NC A0 VSS DQ1 DQ6 NC A16 NC H2 H3 H4 H5 H6 H7 H8 H9 CE#f OE# DQ9 DQ3 DQ4 J2 J3 J4 J5 J6 J7 J8 J9 CE1#s DQ0 DQ10 VCCf VCCs DQ12 DQ7 VSS K3 K4 K5 K6 K7 K8 DQ8 DQ2 DQ11 NC DQ5 DQ14 L1 L5 L6 L10 NC NC NC NC D6 RESET# CE2s DQ13 DQ15/A-1 CIOf M1 M10 NC NC Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. May 19, 2003 SRAM only Shared C1 D5 Flash only Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. Am42DL32x4G 7 P R E L I M I N A R Y PIN DESCRIPTION A17–A0 LOGIC SYMBOL = 18 Address Inputs (Common) 18 A-1, A20–A18 = 4 Address Inputs (Flash) A17–A0 DQ15–DQ0 = 16 Data Inputs/Outputs (Common) CE#f = Chip Enable (Flash) A-1, A20–A18 CE#s = Chip Enable (SRAM) CE#f OE# = Output Enable (Common) CE1#s WE# = Write Enable (Common) CE2s RY/BY# = Ready/Busy Output OE# UB#s = Upper Byte Control (SRAM) WE# LB#s = Lower Byte Control (SRAM) WP#/ACC CIOf = I/O Configuration (Flash) CIOf = VIH = Word mode (x16), CIOf = VIL = Byte mode (x8) RESET# RESET# = Hardware Reset Pin, Active Low LB#s WP#/ACC = Hardware Write Protect/ Acceleration Pin (Flash) CIOf VCCf = Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VCCs = SRAM Power Supply VSS = Device Ground (Common) NC = Pin Not Connected Internally 8 Am42DL32x4G 16 or 8 DQ15–DQ0 RY/BY# UB#s May 19, 2003 P R E L I M I N A R Y ORDERING INFORMATION The order number (Valid Combination) is formed by the following: Am42DL32x 4 G T 70 I T TAPE AND REEL T = 7 inches TEMPERATURE RANGE I = Industrial (–40°C to +85°C) SPEED OPTION See Product Selector Guide and Valid Combinations BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector PROCESS TECHNOLOGY G = 0.17 µm SRAM DEVICE DENSITY 4 = 4 Mbits AMD DEVICE NUMBER/DESCRIPTION Am42DL32x4G Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am29DL32xG 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM Valid Combinations Valid Combinations Order Number Package Marking Am42DL3224GT71I Am42DL3224GB71I M42000005W M42000005X Am42DL3234GT71I Am42DL3234GB71I M42000005Y M42000005Z Am42DL3244GT71I Am42DL3244GB71I M420000060 M420000061 Am42DL3224GT70I Am42DL3224GB70I M420000022 M420000023 Am42DL3224GT85I Am42DL3224GB85I T M420000024 M420000025 Am42DL3234GT70I Am42DL3234GB70I M420000026 M420000027 Am42DL3234GT85I Am42DL3234GB85I M420000028 M420000029 Am42DL3244GT70I Am42DL3244GB70I M42000002A M42000002B Am42DL3244GT85I Am42DL3244GB85I M42000002C M42000002D May 19, 2003 Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations Am42DL32x4G 9 P R E L I M I N A R Y DEVICE BUS OPERATIONS This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory locat ion. The reg ister is a lat ch used t o store th e commands, along with the address and data information needed to execute the command. The contents of 10 the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. Tables 1 through 2 list the device bus operations, the inputs and control levels they require, and the resulting output. The following subsections describe each of these operations in further detail. Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Table 1. Operation (Notes 1, 2) CE#f Device Bus Operations—Flash Word Mode, CIOf = VIH CE1#s CE2s OE# WE# H X X L H X X L VCC ± 0.3 V H X X L Output Disable L L H Flash Hardware Reset X H X X L H X X L H X Read from Flash L Write to Flash L Standby Sector Protect (Note 5) L Sector Unprotect (Note 5) L Temporary Sector Unprotect X Read from SRAM Write to SRAM H H X L H X X L L L H H Addr. LB#s UB#s RESET# WP#/ACC (Note 4) DQ7– DQ0 DQ15– DQ8 L H AIN X X H L/H DOUT DOUT H L AIN X X H (Note 4) DIN DIN X X X X X VCC ± 0.3 V H High-Z High-Z H H X L X H H X X L H L/H High-Z High-Z X X X X X L L/H High-Z High-Z H L SADD, A6 = L, A1 = H, A0 = L X X VID L/H DIN X H L SADD, A6 = H, A1 = H, A0 = L X X VID (Note 6) DIN X X X X X X VID (Note 6) DIN High-Z L L DOUT DOUT L X H L AIN AIN H X H L High-Z DOUT L H DOUT High-Z L L DIN DIN H L High-Z DIN L H DIN High-Z H X Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SADD = Flash Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out Notes: 1. Other operations except for those indicated in this column are inhibited. 2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time. 3. Don’t care or open LB#s or UB#s. 4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed. If WP#/ACC = VACC (9V), the program time will be reduced by 40%. 5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector Block Protection and Unprotection” section. 6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected. May 19, 2003 Am42DL32x4G 11 P R E L I M I N A R Y Table 2. Operation (Notes 1, 2) CE#f Device Bus Operations—Flash Byte Mode, CIOf = VSS CE1#s CE2s OE# WE# H X X L H X X L VCC ± 0.3 V H X X L Output Disable L L H Flash Hardware Reset X H X X L H X X L H X Read from Flash L Write to Flash L Standby Sector Protect (Note 5) L Sector Unprotect (Note 5) L Temporary Sector Unprotect X Read from SRAM Write to SRAM H H X L H x X L L L H H Addr. LB#s UB#s WP#/ACC RESET# (Note 3) (Note 3) (Note 4) DQ7– DQ0 DQ15– DQ8 L H AIN X X H L/H DOUT High-Z H L AIN X X H (Note 3) DIN High-Z X X X X X VCC ± 0.3 V H High-Z High-Z H H X H L/H High-Z High-Z X X H L X X L X X X L L/H High-Z High-Z L SADD, A6 = L, A1 = H, A0 = L X X VID L/H DIN X H L SADD, A6 = L, A1 = H, A0 = L X X VID (Note 6) DIN X X X AIN X X VID (Note 6) DIN High-Z L L DOUT DOUT L X H L AIN AIN H X H L High-Z DOUT L H DOUT High-Z L L DIN DIN H L High-Z DIN L H DIN High-Z H X Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SADD = Flash Sector Address, AIN = Address In (for Flash Byte Mode, DQ15 = A-1), DIN = Data In, DOUT = Data Out Notes: 1. Other operations except for those indicated in this column are inhibited. 2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time. 3. Don’t care or open LB#s or UB#s. 4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed. If WP#/ACC = VACC (9V), the program time will be reduced by 40%. 5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector Block Protection and Unprotection” section. 6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected. 12 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Word/Byte Configuration The CIOf pin controls whether the device data I/O pins operate in the byte or word configuration. If the CIOf pin is set at logic ‘1’, the device is in word configuration, DQ15–DQ0 are active and controlled by CE# and OE#. If the CIOf pin is set at logic ‘0’, the device is in byte configuration, and only data I/O pins DQ7–DQ0 are active and controlled by CE# and OE#. The data I/O pins DQ14–DQ8 are tri-stated, and the DQ15 pin is used as an input for the LSB (A-1) address function. Requirements for Reading Array Data To read array data from the outputs, the system must drive the CE#f and OE# pins to VIL. CE#f is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at V I H . The CIOf pin determines whether the device outputs array data in words or bytes. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. Each bank remains enabled for read access until the command register contents are altered. See “Requirements for Reading Array Data” for more information. Refer to the AC Flash Read-Only Operations table for timing specifications and to Figure 14 for the timing diagram. I CC1 in the DC Characteristics table represents the active current specification for reading array data. Writing Commands/Command Sequences To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE# and CE#f to VIL, and OE# to VIH. For program operations, the CIOf pin determines whether the device accepts program data in bytes or words. Refer to “Word/Byte Configuration” for more information. The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the Unlock Bypass mode, only two write cycles are required to program a word or byte, instead of four. The “Word/Byte Configuration” section has details on programming data to the device using both standard and Unlock Bypass command sequences. May 19, 2003 An erase operation can erase one sector, multiple sectors, or the entire device. Tables 4–7 indicate the address space that each sector occupies. The device address space is divided into two banks: Bank 1 contains the boot/parameter sectors, and Bank 2 contains the larger, code sectors of uniform size. A “bank address” is the address bits required to uniquely select a bank. Similarly, a “sector address” is the address bits required to uniquely select a sector. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC Characteristics section contains timing specification tables and timing diagrams for write operations. Accelerated Program Operation The device offers accelerated program operations through the ACC function. This is one of two functions provided by the WP#/ACC pin. This function is primarily intended to allow faster manufacturing throughput at the factory. If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time required for program operations. The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the WP#/ACC pin returns the device to normal operation. Note that the WP#/ACC pin must not be at VHH for operations other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. Autoselect Functions If the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the Autoselect Mode and Autoselect Command Sequence sections for more information. Simultaneous Read/Write Operations with Zero Latency This device is capable of reading data from one bank of memory while programming or erasing in the other bank of memory. An erase operation may also be suspended to read from or program to another location within the same bank (except the sector being erased). Figure 21 shows how read and write cycles may be initiated for simultaneous operation with zero latency. ICC6 and ICC7 in the DC Characteristics table represent the current specifications for read-while-program and read-while-erase, respectively. Am42DL32x4G 13 P R E L I M I N A R Y Standby Mode When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE# input. The device enters the CMOS standby mode when the CE#f and RESET# pins are both held at VCC ± 0.3 V. (Note that this is a more restricted voltage range than V IH .) If CE#f and RESET# are held at V IH , but not within VCC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device requires standard access time (t CE ) for read access when the device is in either of these standby modes, before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3 in the DC Characteristics table represents the standby current specification. Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the CE#f, WE#, and OE# control signals. Standard add r e ss a cce ss t im in g s pro vi de n ew d at a wh e n addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC4 in the DC Characteristics table represents the automatic sleep mode current specification. RESET#: Hardware Reset Pin The RESET# pin provides a hardware method of resetting the device to reading array data. When the Table 3. Device Part Number RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS ± 0.3 V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS ± 0.3 V, the standby current will be greater. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of t READY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data t RH after the RESET# pin returns to VIH. Refer to the AC Characteristics tables for RESET# parameters and to Figure 15 for the timing diagram. Output Disable Mode When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state. Device Bank Division Bank 1 Bank 2 Megabits Sector Sizes Megabits Sector Sizes Am29DL322G 4 Mbit Eight 8 Kbyte/4 Kword, seven 64 Kbyte/32 Kword 28 Mbit Fifty-six 64 Kbyte/32 Kword Am29DL323G 8 Mbit Eight 8 Kbyte/4 Kword, fifteen 64 Kbyte/32 Kword 24 Mbit Forty-eight 64 Kbyte/32 Kword Am29DL324G 16 Mbit Eight 8 Kbyte/4 Kword, thirty-one 64 Kbyte/32 Kword 16 Mbit Thirty-two 64 Kbyte/32 Kword 14 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Am29DL322GT Am29DL323GT Bank 2 Bank 1 Bank 2 Bank 2 Am29DL324GT Table 4. May 19, 2003 Top Boot Sector Addresses Sector Sector Address A20–A12 Sector Size (Kbytes/Kwords) (x8) Address Range SA0 000000xxx 64/32 000000h–00FFFFh 000000h–07FFFh SA1 000001xxx 64/32 010000h–01FFFFh 008000h–0FFFFh SA2 000010xxx 64/32 020000h–02FFFFh 010000h–17FFFh SA3 000011xxx 64/32 030000h–03FFFFh 018000h–01FFFFh SA4 000100xxx 64/32 040000h–04FFFFh 020000h–027FFFh SA5 000101xxx 64/32 050000h–05FFFFh 028000h–02FFFFh SA6 000110xxx 64/32 060000h–06FFFFh 030000h–037FFFh SA7 000111xxx 64/32 070000h–07FFFFh 038000h–03FFFFh SA8 001000xxx 64/32 080000h–08FFFFh 040000h–047FFFh SA9 001001xxx 64/32 090000h–09FFFFh 048000h–04FFFFh SA10 001010xxx 64/32 0A0000h–0AFFFFh 050000h–057FFFh SA11 001011xxx 64/32 0B0000h–0BFFFFh 058000h–05FFFFh SA12 001100xxx 64/32 0C0000h–0CFFFFh 060000h–067FFFh SA13 001101xxx 64/32 0D0000h–0DFFFFh 068000h–06FFFFh SA14 001110xxx 64/32 0E0000h–0EFFFFh 070000h–077FFFh SA15 001111xxx 64/32 0F0000h–0FFFFFh 078000h–07FFFFh SA16 010000xxx 64/32 100000h–10FFFFh 080000h–087FFFh SA17 010001xxx 64/32 110000h–11FFFFh 088000h–08FFFFh SA18 010010xxx 64/32 120000h–12FFFFh 090000h–097FFFh SA19 010011xxx 64/32 130000h–13FFFFh 098000h–09FFFFh SA20 010100xxx 64/32 140000h–14FFFFh 0A0000h–0A7FFFh SA21 010101xxx 64/32 150000h–15FFFFh 0A8000h–0AFFFFh SA22 010110xxx 64/32 160000h–16FFFFh 0B0000h–0B7FFFh SA23 010111xxx 64/32 170000h–17FFFFh 0B8000h–0BFFFFh SA24 011000xxx 64/32 180000h–18FFFFh 0C0000h–0C7FFFh SA25 011001xxx 64/32 190000h–19FFFFh 0C8000h–0CFFFFh SA26 011010xxx 64/32 1A0000h–1AFFFFh 0D0000h–0D7FFFh SA27 011011xxx 64/32 1B0000h–1BFFFFh 0D8000h–0DFFFFh SA28 011100xxx 64/32 1C0000h–1CFFFFh 0E0000h–0E7FFFh SA29 011101xxx 64/32 1D0000h–1DFFFFh 0E8000h–0EFFFFh SA30 011110xxx 64/32 1E0000h–1EFFFFh 0F0000h–0F7FFFh SA31 011111xxx 64/32 1F0000h–1FFFFFh 0F8000h–0FFFFFh SA32 100000xxx 64/32 200000h–20FFFFh 100000h–107FFFh SA33 100001xxx 64/32 210000h–21FFFFh 108000h–10FFFFh SA34 100010xxx 64/32 220000h–22FFFFh 110000h–117FFFh SA35 100011xxx 64/32 230000h–23FFFFh 118000h–11FFFFh SA36 100100xxx 64/32 240000h–24FFFFh 120000h–127FFFh SA37 100101xxx 64/32 250000h–25FFFFh 128000h–12FFFFh SA38 100110xxx 64/32 260000h–26FFFFh 130000h–137FFFh SA39 100111xxx 64/32 270000h–27FFFFh 138000h–13FFFFh SA40 101000xxx 64/32 280000h–28FFFFh 140000h–147FFFh SA41 101001xxx 64/32 290000h–29FFFFh 148000h–14FFFFh SA42 101010xxx 64/32 2A0000h–2AFFFFh 150000h–157FFFh SA43 101011xxx 64/32 2B0000h–2BFFFFh 158000h–15FFFFh SA44 101100xxx 64/32 2C0000h–2CFFFFh 160000h–167FFFh SA45 101101xxx 64/32 2D0000h–2DFFFFh 168000h–16FFFFh SA46 101110xxx 64/32 2E0000h–2EFFFFh 170000h–177FFFh SA47 101111xxx 64/32 2F0000h–2FFFFFh 178000h–17FFFFh Am42DL32x4G (x16) Address Range 15 P R E L I M I N A R Y Am29DL322GT Bank 1 Bank 1 Bank 1 Bank 2 Am29DL323GT Am29DL324GT Table 4. Top Boot Sector Addresses (Continued) Sector Sector Address A20–A12 Sector Size (Kbytes/Kwords) (x8) Address Range (x16) Address Range SA48 110000xxx 64/32 300000h–30FFFFh 180000h–187FFFh SA49 110001xxx 64/32 310000h–31FFFFh 188000h–18FFFFh SA50 110010xxx 64/32 320000h–32FFFFh 190000h–197FFFh SA51 110011xxx 64/32 330000h–33FFFFh 198000h–19FFFFh SA52 110100xxx 64/32 340000h–34FFFFh 1A0000h–1A7FFFh SA53 110101xxx 64/32 350000h–35FFFFh 1A8000h–1AFFFFh SA54 110110xxx 64/32 360000h–36FFFFh 1B0000h–1B7FFFh SA55 110111xxx 64/32 370000h–37FFFFh 1B8000h–1BFFFFh SA56 111000xxx 64/32 380000h–38FFFFh 1C0000h–1C7FFFh SA57 111001xxx 64/32 390000h–39FFFFh 1C8000h–1CFFFFh SA58 111010xxx 64/32 3A0000h–3AFFFFh 1D0000h–1D7FFFh SA59 111011xxx 64/32 3B0000h–3BFFFFh 1D8000h–1DFFFFh SA60 111100xxx 64/32 3C0000h–3CFFFFh 1E0000h–1E7FFFh SA61 111101xxx 64/32 3D0000h–3DFFFFh 1E8000h–1EFFFFh SA62 111110xxx 64/32 3E0000h–3EFFFFh 1F0000h–1F7FFFh SA63 111111000 8/4 3F0000h–3F1FFFh 1F8000h–1F8FFFh SA64 111111001 8/4 3F2000h–3F3FFFh 1F9000h–1F9FFFh SA65 111111010 8/4 3F4000h–3F5FFFh 1FA000h–1FAFFFh SA66 111111011 8/4 3F6000h–3F7FFFh 1FB000h–1FBFFFh SA67 111111100 8/4 3F8000h–3F9FFFh 1FC000h–1FCFFFh SA68 111111101 8/4 3FA000h–3FBFFFh 1FD000h–1FDFFFh SA69 111111110 8/4 3FC000h–3FDFFFh 1FE000h–1FEFFFh SA70 111111111 8/4 3FE000h–3FFFFFh 1FF000h–1FFFFFh Note: The address range is A20:A-1 in byte mode (BYTE#=VIL) or A20:A0 in word mode (BYTE#=VIH). The bank address bits are A20–A18 for Am29DL322GT, A20 and A19 for Am29DL323GT, and A20 for Am29DL324GT. Table 5. Device Am29DL322GT, Am29DL323GT, Am29DL324GT 16 Top Boot SecSi Sector Addresses Sector Address A20–A12 Sector Size (bytes/words) (x8) Address Range (x16) Address Range 111111xxx 256/128 3FE000h–3FE0FFh 1FF000h–1FF07Fh Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Am29DL322GB Bank 2 Bank 2 Bank 1 Bank 1 Bank 1 Am29DL323GB Am29DL324GB Table 6. May 19, 2003 Bottom Boot Sector Addresses Sector Sector Address A20–A12 Sector Size (Kbytes/Kwords) (x8) Address Range (x16) Address Range SA0 000000000 8/4 000000h-001FFFh 000000h–000FFFh SA1 000000001 8/4 002000h-003FFFh 001000h–001FFFh SA2 000000010 8/4 004000h-005FFFh 002000h–002FFFh SA3 000000011 8/4 006000h-007FFFh 003000h–003FFFh SA4 000000100 8/4 008000h-009FFFh 004000h–004FFFh SA5 000000101 8/4 00A000h-00BFFFh 005000h–005FFFh SA6 000000110 8/4 00C000h-00DFFFh 006000h–006FFFh SA7 000000111 8/4 00E000h-00FFFFh 007000h–007FFFh SA8 000001xxx 64/32 010000h-01FFFFh 008000h–00FFFFh SA9 000010xxx 64/32 020000h-02FFFFh 010000h–017FFFh SA10 000011xxx 64/32 030000h-03FFFFh 018000h–01FFFFh SA11 000100xxx 64/32 040000h-04FFFFh 020000h–027FFFh SA12 000101xxx 64/32 050000h-05FFFFh 028000h–02FFFFh SA13 000110xxx 64/32 060000h-06FFFFh 030000h–037FFFh SA14 000111xxx 64/32 070000h-07FFFFh 038000h–03FFFFh SA15 001000xxx 64/32 080000h-08FFFFh 040000h–047FFFh SA16 001001xxx 64/32 090000h-09FFFFh 048000h–04FFFFh SA17 001010xxx 64/32 0A0000h-0AFFFFh 050000h–057FFFh SA18 001011xxx 64/32 0B0000h-0BFFFFh 058000h–05FFFFh SA19 001100xxx 64/32 0C0000h-0CFFFFh 060000h–067FFFh SA20 001101xxx 64/32 0D0000h-0DFFFFh 068000h–06FFFFh SA21 001110xxx 64/32 0E0000h-0EFFFFh 070000h–077FFFh SA22 001111xxx 64/32 0F0000h-0FFFFFh 078000h–07FFFFh SA23 010000xxx 64/32 100000h-10FFFFh 080000h–087FFFh SA24 010001xxx 64/32 110000h-11FFFFh 088000h–08FFFFh SA25 010010xxx 64/32 120000h-12FFFFh 090000h–097FFFh SA26 010011xxx 64/32 130000h-13FFFFh 098000h–09FFFFh SA27 010100xxx 64/32 140000h-14FFFFh 0A0000h–0A7FFFh SA28 010101xxx 64/32 150000h-15FFFFh 0A8000h–0AFFFFh SA29 010110xxx 64/32 160000h-16FFFFh 0B0000h–0B7FFFh SA30 010111xxx 64/32 170000h-17FFFFh 0B8000h–0BFFFFh SA31 011000xxx 64/32 180000h-18FFFFh 0C0000h–0C7FFFh SA32 011001xxx 64/32 190000h-19FFFFh 0C8000h–0CFFFFh SA33 011010xxx 64/32 1A0000h-1AFFFFh 0D0000h–0D7FFFh SA34 011011xxx 64/32 1B0000h-1BFFFFh 0D8000h–0DFFFFh SA35 011100xxx 64/32 1C0000h-1CFFFFh 0E0000h–0E7FFFh SA36 011101xxx 64/32 1D0000h-1DFFFFh 0E8000h–0EFFFFh SA37 011110xxx 64/32 1E0000h-1EFFFFh 0F0000h–0F7FFFh SA38 011111xxx 64/32 1F0000h-1FFFFFh 0F8000h–0FFFFFh Am42DL32x4G 17 P R E L I M I N A R Y Am29DL322GB Bank 2 Am29DL323GB Bank 2 Bank 2 Am29DL324GB Table 6. Bottom Boot Sector Addresses (Continued) Sector Sector Address A20–A12 Sector Size (Kbytes/Kwords) (x8) Address Range (x16) Address Range SA39 100000xxx 64/32 200000h-20FFFFh 100000h–107FFFh SA40 100001xxx 64/32 210000h-21FFFFh 108000h–10FFFFh SA41 100010xxx 64/32 220000h-22FFFFh 110000h–117FFFh SA42 100011xxx 64/32 230000h-23FFFFh 118000h–11FFFFh SA43 100100xxx 64/32 240000h-24FFFFh 120000h–127FFFh SA44 100101xxx 64/32 250000h-25FFFFh 128000h–12FFFFh SA45 100110xxx 64/32 260000h-26FFFFh 130000h–137FFFh SA46 100111xxx 64/32 270000h-27FFFFh 138000h–13FFFFh SA47 101000xxx 64/32 280000h-28FFFFh 140000h–147FFFh SA48 101001xxx 64/32 290000h-29FFFFh 148000h–14FFFFh SA49 101010xxx 64/32 2A0000h-2AFFFFh 150000h–157FFFh SA50 101011xxx 64/32 2B0000h-2BFFFFh 158000h–15FFFFh SA51 101100xxx 64/32 2C0000h-2CFFFFh 160000h–167FFFh SA52 101101xxx 64/32 2D0000h-2DFFFFh 168000h–16FFFFh SA53 101110xxx 64/32 2E0000h-2EFFFFh 170000h–177FFFh SA54 101111xxx 64/32 2F0000h-2FFFFFh 178000h–17FFFFh SA55 111000xxx 64/32 300000h-30FFFFh 180000h–187FFFh SA56 110001xxx 64/32 310000h-31FFFFh 188000h–18FFFFh SA57 110010xxx 64/32 320000h-32FFFFh 190000h–197FFFh SA58 110011xxx 64/32 330000h-33FFFFh 198000h–19FFFFh SA59 110100xxx 64/32 340000h-34FFFFh 1A0000h–1A7FFFh SA60 110101xxx 64/32 350000h-35FFFFh 1A8000h–1AFFFFh SA61 110110xxx 64/32 360000h-36FFFFh 1B0000h–1B7FFFh SA62 110111xxx 64/32 370000h-37FFFFh 1B8000h–1BFFFFh SA63 111000xxx 64/32 380000h-38FFFFh 1C0000h–1C7FFFh SA64 111001xxx 64/32 390000h-39FFFFh 1C8000h–1CFFFFh SA65 111010xxx 64/32 3A0000h-3AFFFFh 1D0000h–1D7FFFh SA66 111011xxx 64/32 3B0000h-3BFFFFh 1D8000h–1DFFFFh SA67 111100xxx 64/32 3C0000h-3CFFFFh 1E0000h–1E7FFFh SA68 111101xxx 64/32 3D0000h-3DFFFFh 1E8000h–1EFFFFh SA69 111110xxx 64/32 3E0000h-3EFFFFh 1F0000h–1F7FFFh SA70 111111xxx 64/32 3F0000h-3FFFFFh 1F8000h–1FFFFFh Note: The address range is A20:A-1 in byte mode (BYTE#=VIL) or A20:A0 in word mode (BYTE#=VIH). The bank address bits are A20–A18 for Am29DL322GB, A20 and A19 for Am29DL323GB, and A20 for Am29DL324GB. Table 7. Device Am29DL322GB, Am29DL323GB, Am29DL324GB 18 Bottom Boot SecSi Sector Addresses Sector Address A20–A12 Sector Size (bytes/words) (x8) Address Range (x16) Address Range 000000xxx 256/128 000000h-0000FFh 00000h-0007Fh Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Autoselect Mode Table 8. The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. The autoselect codes can also be accessed in-system through the command register. The host system can issue the autoselect command via the command register, as shown in Tables 14 and 16. This method does not require VID. Refer to the Autoselect Command Sequence section for more information. Sector/Sector Block Protection and Unprotection (Note: For the following discussion, the term “sector” applies to both sectors and sector blocks. A sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (see Table 8). May 19, 2003 Top Boot Sector/Sector Block Addresses for Protection/Unprotection A20–A12 Sector/ Sector Block Size SA0 000000XXX 64 Kbytes SA1-SA3 000001XXX, 000010XXX 000011XXX 192 (3x64) Kbytes SA4-SA7 0001XXXXX 256 (4x64) Kbytes SA8-SA11 0010XXXXX 256 (4x64) Kbytes Sector SA12-SA15 0011XXXXX 256 (4x64) Kbytes SA16-SA19 0100XXXXX 256 (4x64) Kbytes SA20-SA23 0101XXXXX 256 (4x64) Kbytes SA24-SA27 0110XXXXX 256 (4x64) Kbytes SA28-SA31 0111XXXXX 256 (4x64) Kbytes SA32-SA35 1000XXXXX 256 (4x64) Kbytes SA36-SA39 1001XXXXX 256 (4x64) Kbytes SA40-SA43 1010XXXXX 256 (4x64) Kbytes SA44-SA47 1011XXXXX 256 (4x64) Kbytes SA48-SA51 1100XXXXX 256 (4x64) Kbytes SA52-SA55 1101XXXXX 256 (4x64) Kbytes SA56-SA59 1110XXXXX 256 (4x64) Kbytes SA60-SA62 111100XXX, 111101XXX, 111110XXX 192 (4x64) Kbytes Am42DL32x4G SA63 111111000 8 Kbytes SA64 111111001 8 Kbytes SA65 111111010 8 Kbytes SA66 111111011 8 Kbytes SA67 111111100 8 Kbytes SA68 111111101 8 Kbytes SA69 111111110 8 Kbytes SA70 111111111 8 Kbytes 19 P R E L I M I N A R Y Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection shows the algorithms and Figure 26 shows the timing diagram. This method uses standard microprocessor bus cycle timing. For sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. A20–A12 Sector/Sector Block Size SA70 111111XXX 64 Kbytes SA69-SA67 111110XXX, 111101XXX, 111100XXX 192 (3x64) Kbytes SA66-SA63 1110XXXXX 256 (4x64) Kbytes SA62-SA59 1101XXXXX 256 (4x64) Kbytes SA58-SA55 1100XXXXX 256 (4x64) Kbytes Write Protect (WP#) SA54-SA51 1011XXXXX 256 (4x64) Kbytes SA50-SA47 1010XXXXX 256 (4x64) Kbytes SA46-SA43 1001XXXXX 256 (4x64) Kbytes SA42-SA39 1000XXXXX 256 (4x64) Kbytes The Write Protect function provides a hardware method of protecting certain boot sectors without using VID. This function is one of two provided by the WP#/ACC pin. SA38-SA35 0111XXXXX 256 (4x64) Kbytes SA34-SA31 0110XXXXX 256 (4x64) Kbytes SA30-SA27 0101XXXXX 256 (4x64) Kbytes SA26-SA23 0100XXXXX 256 (4x64) Kbytes SA22–SA19 0011XXXXX 256 (4x64) Kbytes SA18-SA15 0010XXXXX 256 (4x64) Kbytes SA14-SA11 0001XXXXX 256 (4x64) Kbytes SA10-SA8 000011XXX, 000010XXX, 000001XXX 192 (3x64) Kbytes SA7 000000111 8 Kbytes SA6 000000110 8 Kbytes SA5 000000101 8 Kbytes SA4 000000100 8 Kbytes SA3 000000011 8 Kbytes SA2 000000010 8 Kbytes SA1 000000001 8 Kbytes SA0 000000000 8 Kbytes Sector The device is shipped with all sectors unprotected. It is possible to determine whether a sector is protected or unprotected. See the Autoselect Mode section for details. If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the two “outermost” 8 Kbyte boot sectors independently of whether those sectors were protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. The two outermost 8 Kbyte boot sectors are the two sectors containing the lowest addresses in a top-boot-configured device, or the two sectors containing the highest addresses in a top-boot-configured device. If the system asserts VIH on the WP#/ACC pin, the device reverts to whether the two outermost 8 Kbyte boot sectors were last set to be protected or unprotected. That is, sector protection or unprotection for these two sectors depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and Unprotection”. Note that the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. Temporary Sector/Sector Block Unprotect The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors. Note that the sector unprotect algorithm unprotects all sectors in parallel. All previously protected sectors must be individually re-protected. To change data in protected sectors efficiently, the temporary sector un protect function is available. See “Temporary Sector/Sector Block Unprotect”. Sector protection and unprotection can be implemented as follows. Sector protection and unprotection requires VID on the RESET# pin only, and can be implemented either in-system or via programming equipment. Figure 1 20 (Note: For the following discussion, the term “sector” applies to both sectors and sector blocks. A sector block consists of two or more adjacent sectors that are protected or unprotected at the same time (see Table 8). This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to VID (11.5 V – 12.5 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are protected again. Figure 1 shows the algorithm, and Figure 25 shows the timing diagrams, for this feature. Am42DL32x4G May 19, 2003 P R E L I M I N A R Y START RESET# = VID (Note 1) Perform Erase or Program Operations RESET# = VIH Temporary Sector Unprotect Completed (Note 2) Notes: 1. All protected sectors unprotected (If WP#/ACC = VIL, outermost boot sectors will remain protected). 2. All previously protected sectors are protected once again. Figure 1. Temporary Sector Unprotect Operation May 19, 2003 Am42DL32x4G 21 P R E L I M I N A R Y START START Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address PLSCNT = 1 RESET# = VID Wait 1 µs No Temporary Sector Unprotect Mode PLSCNT = 1 RESET# = VID Wait 1 µs No First Write Cycle = 60h? First Write Cycle = 60h? Yes Yes Set up sector address No All sectors protected? Sector Protect: Write 60h to sector address with A6 = 0, A1 = 1, A0 = 0 Yes Set up first sector address Sector Unprotect: Write 60h to sector address with A6 = 1, A1 = 1, A0 = 0 Wait 150 µs Verify Sector Protect: Write 40h to sector address with A6 = 0, A1 = 1, A0 = 0 Increment PLSCNT Temporary Sector Unprotect Mode Reset PLSCNT = 1 Read from sector address with A6 = 0, A1 = 1, A0 = 0 Wait 15 ms Verify Sector Unprotect: Write 40h to sector address with A6 = 1, A1 = 1, A0 = 0 Increment PLSCNT No No PLSCNT = 25? Read from sector address with A6 = 1, A1 = 1, A0 = 0 Data = 01h? Yes Yes No Yes Protect another sector? Device failed PLSCNT = 1000? No Yes Remove VID from RESET# Device failed Write reset command Sector Protect Algorithm Sector Protect complete Set up next sector address No Data = 00h? Yes Last sector verified? No Yes Sector Unprotect Algorithm Remove VID from RESET# Write reset command Sector Unprotect complete Note: The term “sector” in the figure applies to both sectors and sector blocks. Figure 1. 22 In-System Sector/Sector Block Protect and Unprotect Algorithms Am42DL32x4G May 19, 2003 P R E L I M I N A R Y SecSi (Secured Silicon) Sector Flash Memory Region The SecSi (Secured Silicon) Sector feature provides a Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN). The SecSi Sector uses a SecSi Sector Indicator Bit to indicate whether or not the SecSi Sector is locked when shipped from the factory. This bit is permanently set at the factory and cannot be changed, which prevents cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field. AMD offers the device with the SecSi Sector either f actory locke d o r cu st omer lockable. Th e f actory-locked version is always protected when shipped from the factory, and has the SecSi Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the unprotected, allowing customers to utilize the that sector in any manner they choose. The customer-lockable version has the SecSi Sector Indicator Bit permanently set to a “0.” Thus, the SecSi Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked. The system accesses the SecSi Sector through a command sequence (see “Enter SecSi Sector/Exit SecSi Sector Command Sequence”). After the system has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by using the addresses normally occupied by the boot sectors. This mode of operation continues until the system issues the Exit SecSi Sector command sequence, or until power is removed from the device. On power-up, or following a hardware reset, the device reverts to sending commands to the boot sectors. expanding the size of the available Flash array. The SecSi Sector can be read any number of times, but can be programmed and locked only once, and cannot be erased. Note that the accelerated programming (ACC) and unlock bypass functions are not available when programming the SecSi Sector. The SecSi Sector area can be protected using one of the following procedures: ■ Write the three-cycle Enter SecSi Sector Region command sequence, and then follow the in-system sector protect algorithm as shown in Figure 1, except that RESET# may be at either VIH or VID. This allows in-system protection of the without raising any device pin to a high voltage. Note that this method is only applicable to the SecSi Sector. ■ To verify the protect/unprotect status of the SecSi Sector, follow the algorithm shown in Figure 2.. Once the SecSi Sector is locked and verified, the syste m mu st w ri te t he E xit Se cSi Se ct or Re gio n command sequence to return to reading and writing the remainder of the array. The SecSi Sector protection must be used with caution since, once protected, there is no procedure available for unprotecting the SecSi Sector area and none of the bits in the SecSi Sector memory space can be modified in any way. Factory Locked: SecSi Sector Programmed and Protected At the Factory In a factory locked device, the SecSi Sector is protected when the device is shipped from the factory. The SecSi Sector cannot be modified in any way. The device is available preprogrammed with a random, secure ESN only. In the Top Boot device the ESN is located at addresses 1FF000h–1FF007h in word mode (or addresses 3FE000h–3FE00Fh in byte mode). In the Bottom Boot device the ESN is located at addresses 00000h–00007Fh in word mode (or 000000h–0000FFh in byte mode). START RESET# = VIH or VID Wait 1 µs Write 60h to any address Write 40h to SecSi Sector address with A6 = 0, A1 = 1, A0 = 0 Read from SecSi Sector address with A6 = 0, A1 = 1, A0 = 0 If data = 00h, SecSi Sector is unprotected. If data = 01h, SecSi Sector is protected. Remove VIH or VID from RESET# Write reset command SecSi Sector Protect Verify complete Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory If the security feature is not required, the SecSi Sector can be treated as an additional Flash memory space, May 19, 2003 Am42DL32x4G Figure 2. SecSi Sector Protect Verify 23 P R E L I M I N A R Y Hardware Data Protection The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to Tables 14 and 16 for command definitions). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up and power-down transitions, or from system noise. Low VCC Write Inhibit When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets to reading array data. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional writes when VCC is greater than VLKO. Write Pulse “Glitch” Protection Noise pulses of less than 5 ns (typical) on OE#, CE#f or WE# do not initiate a write cycle. Logical Inhibit Write cycles are inhibited by holding any one of OE# = VIL, CE#f = VIH or WE# = VIH. To initiate a write cycle, CE#f and WE# must be a logical zero while OE# is a logical one. Power-Up Write Inhibit If WE# = CE#f = VIL and OE# = VIH during power up, the device does not accept commands on the rising Table 10. edge of WE#. The internal state machine is automatically reset to reading array data on power-up. COMMON FLASH MEMORY INTERFACE (CFI) The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors can standardize their existing interfaces for long-term compatibility. This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h in word mode (or address AAh in byte mode), any time the device is ready to read array data. The system can read CFI information at the addresses given in Tables 10–13. To terminate reading CFI data, the system must write the reset command. The CFI Query mode is not accessible when the device is executing an Embedded Program or embedded erase algorithm. The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query mode, and the system can read CFI data at the addresses given in Tables 10–13. The system must write the reset command to return the device to reading array data. For further information, please refer to the CFI Specification and CFI Publication 100, available via the World Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies of these documents. CFI Query Identification String Addresses (Word Mode) Addresses (Byte Mode) Data 10h 11h 12h 20h 22h 24h 0051h 0052h 0059h Query Unique ASCII string “QRY” 13h 14h 26h 28h 0002h 0000h Primary OEM Command Set 15h 16h 2Ah 2Ch 0040h 0000h Address for Primary Extended Table 17h 18h 2Eh 30h 0000h 0000h Alternate OEM Command Set (00h = none exists) 19h 1Ah 32h 34h 0000h 0000h Address for Alternate OEM Extended Table (00h = none exists) 24 Description Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Table 11. System Interface String Addresses (Word Mode) Addresses (Byte Mode) Data 1Bh 36h 0027h VCC Min. (write/erase) D7–D4: volt, D3–D0: 100 millivolt 1Ch 38h 0036h VCC Max. (write/erase) D7–D4: volt, D3–D0: 100 millivolt 1Dh 3Ah 0000h VPP Min. voltage (00h = no VPP pin present) 1Eh 3Ch 0000h VPP Max. voltage (00h = no VPP pin present) 1Fh 3Eh 0004h Typical timeout per single byte/word write 2N µs 20h 40h 0000h Typical timeout for Min. size buffer write 2N µs (00h = not supported) 21h 42h 000Ah Typical timeout per individual block erase 2N ms 22h 44h 0000h Typical timeout for full chip erase 2N ms (00h = not supported) 23h 46h 0005h Max. timeout for byte/word write 2N times typical 24h 48h 0000h Max. timeout for buffer write 2N times typical 25h 4Ah 0004h Max. timeout per individual block erase 2N times typical 26h 4Ch 0000h Max. timeout for full chip erase 2N times typical (00h = not supported) Table 12. Description Device Geometry Definition Addresses (Word Mode) Addresses (Byte Mode) Data 27h 4Eh 0016h Device Size = 2N byte 28h 29h 50h 52h 0002h 0000h Flash Device Interface description (refer to CFI publication 100) 2Ah 2Bh 54h 56h 0000h 0000h Max. number of byte in multi-byte write = 2N (00h = not supported) 2Ch 58h 0002h Number of Erase Block Regions within device 2Dh 2Eh 2Fh 30h 5Ah 5Ch 5Eh 60h 0007h 0000h 0020h 0000h Erase Block Region 1 Information (refer to the CFI specification or CFI publication 100) 31h 32h 33h 34h 62h 64h 66h 68h 003Eh 0000h 0000h 0001h Erase Block Region 2 Information 35h 36h 37h 38h 6Ah 6Ch 6Eh 70h 0000h 0000h 0000h 0000h Erase Block Region 3 Information 39h 3Ah 3Bh 3Ch 72h 74h 76h 78h 0000h 0000h 0000h 0000h Erase Block Region 4 Information May 19, 2003 Description Am42DL32x4G 25 P R E L I M I N A R Y Table 13. Primary Vendor-Specific Extended Query Addresses (Word Mode) Addresses (Byte Mode) Data 40h 41h 42h 80h 82h 84h 0050h 0052h 0049h Query-unique ASCII string “PRI” 43h 86h 0031h Major version number, ASCII 44h 88h 0033h Minor version number, ASCII 45h 8Ah 0004h Address Sensitive Unlock (Bits 1-0) 0 = Required, 1 = Not Required Description Silicon Revision Number (Bits 7-2) 46h 8Ch 0002h Erase Suspend 0 = Not Supported, 1 = To Read Only, 2 = To Read & Write 47h 8Eh 0001h Sector Protect 0 = Not Supported, X = Number of sectors in per group 48h 90h 0001h Sector Temporary Unprotect 00 = Not Supported, 01 = Supported 49h 92h 0004h Sector Protect/Unprotect scheme 04 = 29LV800 mode 4Ah 94h 00XXh (See Note) 4Bh 96h 0000h Burst Mode Type 00 = Not Supported, 01 = Supported 4Ch 98h 0000h Page Mode Type 00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page 4Dh 9Ah 0085h 4Eh 9Ch 0095h 4Fh 9Eh 000Xh Simultaneous Operation 00 = Not Supported, X= Number of Sectors in Bank 2 (Uniform Bank) ACC (Acceleration) Supply Minimum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV ACC (Acceleration) Supply Maximum 00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV Top/Bottom Boot Sector Flag 02h = Bottom Boot Device, 03h = Top Boot Device Note: The number of sectors in Bank 2 is device dependent. Am29DL322 = 38h, Am29DL323 = 30h, Am29DL324 = 20h. 26 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y COMMAND DEFINITIONS Writing specific address and data commands or sequences into the command register initiates device operations. Tables 14 and 16 define the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. A reset command is then required to return the device to reading array data. before programming begins. This resets the bank to which the system was writing to reading array data. If the program command sequence is written to a bank that is in the Erase Suspend mode, writing the reset comm an d ret urns t hat ba nk to t he e rase -s uspe n d - r e a d m o d e . On c e p r o g r a mm i n g b e g in s , however, the device ignores reset commands until the operation is complete. All addresses are latched on the falling edge of WE# or CE#f, whichever happens later. All data is latched on the rising edge of WE# or CE#f, whichever happens first. Refer to the AC Characteristics section for timing diagrams. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data. If a bank entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that bank to the erase-suspend-read mode. Reading Array Data The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. Each bank is ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the corresponding bank enters the erase-suspend-read mode, after which the system can read data from any non-erase-suspended sector within the same bank. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for more information. The system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if DQ5 goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the next section, Reset Command, for more information. See also Requirements for Reading Array Data in the “Device Bus Operations” section for more information. The Flash Read-Only Operations table provides the read parameters, and Figure 14 shows the timing diagram. Reset Command Writing the reset command resets the banks to the read or erase-suspend-read mode. Address bits are don’t cares for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the bank to which the system was writing to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence May 19, 2003 If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to reading array data (or erase-suspend-read mode if that bank was in Erase Suspend). Autoselect Command Sequence The autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected. Tables 14 and 16 show the address and data requirements. The autoselect command sequence may be written to an address within a bank that is either in the read or erase-suspend-read mode. The autoselect command may not be written while the device is actively programming or erasing in the other bank. The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains the bank address and the auto se l ec t co mm a n d. T h e b an k th e n en t e r s t h e autoselect mode. The system may read at any address within the same bank any number of times without initiating another autoselect command sequence: ■ A read cycle at address (BA)XX00h (where BA is the bank address) returns the manufacturer code. ■ A read cycle at address (BA)XX01h in word mode (or (BA)XX02h in byte mode) returns the device code. ■ A read cycle to an address containing a sector address (SA) within the same bank, and the address 02h on A7–A0 in word mode (or the address 04h on A6–A-1 in byte mode) returns 01h if the sector is protected, or 00h if it is unprotected. (Refer to Tables 4–7 for valid sector addresses). The system must write the reset command to return to reading array data (or erase-suspend-read mode if the bank was previously in Erase Suspend). Am42DL32x4G 27 P R E L I M I N A R Y Enter SecSi Sector/Exit SecSi Sector Command Sequence The system can access the SecSi Sector region by issuing the three-cycle Enter SecSi Sector command sequence. The device continues to access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence returns the device to normal operation. Tables 14 and 16 show the address and data requirements for both command sequences. See also “SecSi (Secured Silicon) Sector Flash Memory Region” for further information. Note that a hardware reset (RESET#=VIL) will reset the device to reading array data. Note that the ACC function and unlock bypass modes are not available when the SecSi Sector is enabled. Byte/Word Program Command Sequence The system may program the device by word or byte, depending on the state of the CIOf pin. Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verifies the programmed cell margin. Tables 14 and 16 show the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, that bank then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or RY/BY#. Refer to the Write Operation Status section for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the program operation. The program command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. Note that the SecSi Sector, autoselect, and CFI functions are unavailable when a program operation is in progress. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from “0” back to a “1.” Attempting to do so may 28 cause that bank to set DQ5 = 1, or cause the DQ7 and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the data is still “0.” Only erase operations can convert a “0” to a “1.” Unlock Bypass Command Sequence The unlock bypass feature allows the system to program bytes or words to a bank faster than using the standard program command sequence. The unlock bypass command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. That bank then enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total programming time. Tables 14 and 16 show the requirements for the command sequence. During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command sequence. The first cycle must contain the bank address and the data 90h. The second cycle need only contain the data 00h. The bank then returns to the reading array data. The device offers accelerated program operations through the WP#/ACC pin. When the system asserts VHH on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then write the two-cycle Unlock Bypass program command sequence. The device uses the higher voltage on the WP#/ACC pin to accelerate the operation. Note that the WP#/ACC pin must not be at VHH any operation other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result. Figure 3 illustrates the algorithm for the program operat io n . R e fe r t o t he F la sh Era se an d Pro g r am Operations table in the AC Characteristics section for parameters, and Figure 18 for timing diagrams. Am42DL32x4G May 19, 2003 P R E L I M I N A R Y Any commands written during the chip erase operation are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. START Write Program Command Sequence Figure 4 illustrates the algorithm for the erase operation. Refer to the Flash Erase and Program Operations tables in the AC Characteristics section for param et ers, and Figu re 20 sect ion fo r tim ing diagrams. Data Poll from System Embedded Program algorithm in progress Sector Erase Command Sequence Verify Data? No Yes Increment Address No Last Address? The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. Yes Programming Completed Note: See Tables 14 and 16 for program command sequence. Figure 3. Program Operation Chip Erase Command Sequence Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. Tables 14 and 16 show the address and data requirements for the chip erase command sequence. When the Embedded Erase algorithm is complete, that bank returns to reading array data and addresses are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or RY/BY#. Refer to the Write Operation Status section for information on these status bits. Note that the SecSi Sector, autoselect, and CFI functions are unavailable when an erase operation in is progress. May 19, 2003 Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and the sector erase command. Tables 14 and 16 show the address and data requirements for the sector erase command sequence. After the command sequence is written, a sector erase time-out of 50 µs occurs. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50 µs, otherwise erasure may begin. Any sector erase address and command following the exceeded time-out may or may not be accepted. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. Any command other than Se ctor E rase or E rase Suspend dur ing the time-out period resets that bank to reading array data. The system must rewrite the command sequence and any additional addresses and commands. Note that the SecSi Sector, autoselect, and CFI functions are unavailable when an erase operation in is progress. The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3: Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command sequence. When the Embedded Erase algorithm is complete, the bank returns to reading array data and addresses are Am42DL32x4G 29 P R E L I M I N A R Y no longer latched. Note that while the Embedded Erase operation is in progress, the system can read data from the non-erasing bank. The system can determine the status of the erase operation by reading DQ7, DQ6, DQ2, or RY/BY# in the erasing bank. Refer to the Write Operation Status section for information on these status bits. After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read mode. The system can determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard Byte Program operation. Refer to the Write Operation Status section for more information. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. In the erase-suspend-read mode, the system can also issue the autoselect command sequence. Refer to the Autoselect Mode and Autoselect Command Sequence sections for details. Figure 4 illustrates the algorithm for the erase operation. Refer to the Flash Erase and Program Operations tables in the AC Characteristics section for p ar am ete rs, a nd F igu re 2 0 sectio n fo r tim ing diagrams. To resume the sector erase operation, the system must write the Erase Resume command. The bank address of the erase-suspended bank is required when writing this command. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip has resumed erasing. Erase Suspend/Erase Resume Commands The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. The bank address is required when writing this command. This command is valid only during the sector erase operation, including the 50 µs time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. START Write Erase Command Sequence (Notes 1, 2) Data Poll to Erasing Bank from System When the Erase Suspend command is written during the sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. No Embedded Erase algorithm in progress Data = FFh? Yes After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is actively erasing or is erase-suspended. Refer to the Write Operation Status section for information on these status bits. 30 Erasure Completed Notes: 1. See Tables 14 and 16 for erase command sequence. 2. See the section on DQ3 for information on the sector erase timer. Am42DL32x4G Figure 4. Erase Operation May 19, 2003 P R E L I M I N A R Y Table 14. Read (Note 6) Autoselect (Note 8) Reset (Note 7) Bus Cycles (Notes 2–5) Cycles Command Sequence (Note 1) Command Definitions (Flash Word Mode) Addr Data 1 RA RD First Second Third Fourth Fifth Addr Data Addr Data Addr Data 0001 Addr 1 XXX F0 Manufacturer ID 4 555 AA 2AA 55 (BA)555 90 (BA)X00 Device ID 4 555 AA 2AA 55 (BA)555 90 (BA)X01 see Table 15 SecSi Sector Factory Protect (Note 9) 4 555 AA 2AA 55 (BA)555 90 (BA)X03 0082/0002 Sector Protect Verify (Note 10) 4 555 AA 2AA 55 (BA)555 90 (SADD) X02 0000/0001 Enter SecSi Sector Region 3 555 AA 2AA 55 555 88 Exit SecSi Sector Region 4 555 AA 2AA 55 555 90 XXX 00 Program 4 555 AA 2AA 55 555 A0 PA PD Unlock Bypass 3 555 AA 2AA 55 555 20 Unlock Bypass Program (Note 11) 2 XXX A0 PA PD Sixth Data Addr Data Unlock Bypass Reset (Note 12) 2 BA 90 XXX 00 Chip Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10 Sector Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 SADD 30 Erase Suspend (Note 13) 1 BA B0 Erase Resume (Note 14) 1 BA 30 CFI Query (Note 15) 1 55 98 Legend: X = Don’t care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE#f pulse, whichever happens later. Notes: 1. See Table 1 for description of bus operations. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE#f pulse, whichever happens first. SADD = Address of the sector to be verified (in autoselect mode) or erased. Address bits A20–A12 uniquely select any sector. BA = Address of the bank that is being switched to autoselect mode, is in bypass mode, or is being erased. 2. All values are in hexadecimal. 11. The Unlock Bypass command is required prior to the Unlock Bypass Program command. 3. Except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 12. The Unlock Bypass Reset command is required to return to reading array data when the bank is in the unlock bypass mode. 4. Data bits DQ15–DQ8 are don’t care in command sequences, except for RD and PD. 5. Unless otherwise noted, address bits A20–A12 are don’t cares. 13. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation, and requires the bank address. 6. No unlock or command cycles required when bank is in read mode. 7. The Reset command is required to return to reading array data (or to the erase-suspend-read mode if previously in Erase Suspend) when a bank is in the autoselect mode, or if DQ5 goes high (while the bank is providing status information). 8. The fourth cycle of the autoselect command sequence is a read cycle. The system must provide the bank address to obtain the manufacturer ID, device ID, or SecSi Sector factory protect information. See the Autoselect Command Sequence section for more information. 9. The data is 80h for factory locked and 00h for not factory locked. 10. The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. May 19, 2003 14. The Erase Resume command is valid only during the Erase Suspend mode, and requires the bank address. 15. Command is valid when device is ready to read array data or when device is in autoselect mode. Table 15. Autoselect Device IDs (Word Mode) Device Autoselect Device ID Am29DL322G 2255h (T), 2256h (B) Am29DL323G 2250h (T), 2253h (B) Am29DL324G 225Ch (T), 225Fh (B) T = Top Boot Sector, B = Bottom Boot Sector Am42DL32x4G 31 P R E L I M I N A R Y Command Sequence (Note 1) Cycles Table 16. Command Definitions (Flash Byte Mode) First Addr Data Second Addr Data Bus Cycles (Notes 2–5) Third Fourth Addr Data Addr Data 1 RA RD Reset (Note 7) 1 XXX F0 Manufacturer ID 4 AAA AA 555 55 (BA) AAA 90 (BA) 00 01 Device ID 6 AAA AA 555 55 (BA) AAA 90 (BA) 02 see Table 17 SecSi Sector Factory Protect (Note 9) 4 AAA AA 555 55 (BA) AAA 90 (BA) X06 82/02 Sector Protect Verify (Note 10) 4 AAA AA 555 55 (BA) AAA 90 (SADD) X04 Enter SecSi Sector Region 3 AAA AA 555 55 AAA 88 Exit SecSi Sector Region 4 AAA AA 555 55 AAA 90 XXX 00 Program 4 AAA AA 555 55 AAA A0 PA PD Unlock Bypass 3 AAA AA 555 55 AAA 20 Unlock Bypass Program (Note 11) 2 XXX A0 PA PD Autoselect (Note 8) Read (Note 6) Fifth Sixth Addr Data Addr Data 00 01 Unlock Bypass Reset (Note 12) 2 XXX 90 XXX 00 Chip Erase 6 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10 Sector Erase 6 AAA AA 555 55 AAA 80 AAA AA 555 55 SADD 30 Erase Suspend (Note 13) 1 BA B0 Erase Resume (Note 14) 1 BA 30 CFI Query (Note 15) 1 55 98 Legend: X = Don’t care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE#f pulse, whichever happens later. Notes: 1. See Table 1 for description of bus operations. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE#f pulse, whichever happens first. SADD = Address of the sector to be verified (in autoselect mode) or erased. Address bits A20–A12 uniquely select any sector. BA = Address of the bank that is being switched to autoselect mode, is in bypass mode, or is being erased. 2. All values are in hexadecimal. 11. The Unlock Bypass command is required prior to the Unlock Bypass Program command. 3. Except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 12. The Unlock Bypass Reset command is required to return to reading array data when the bank is in the unlock bypass mode. 4. Data bits DQ15–DQ8 are don’t care in command sequences, except for RD and PD. 5. Unless otherwise noted, address bits A20–A12 are don’t cares. 13. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation, and requires the bank address. 6. No unlock or command cycles required when bank is in read mode. 7. The Reset command is required to return to reading array data (or to the erase-suspend-read mode if previously in Erase Suspend) when a bank is in the autoselect mode, or if DQ5 goes high (while the bank is providing status information). 8. The fourth cycle of the autoselect command sequence is a read cycle. The system must provide the bank address to obtain the manufacturer ID, device ID, or SecSi Sector factory protect information. Data bits DQ15–DQ8 are don’t care. See the Autoselect Command Sequence section for more information. 9. The data is 80h for factory locked and 00h for not factory locked. 10. The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. 32 14. The Erase Resume command is valid only during the Erase Suspend mode, and requires the bank address. 15. Command is valid when device is ready to read array data or when device is in autoselect mode. Table 17. Autoselect Device IDs (Byte Mode) Device Autoselect Device ID Am29DL322G 55h (T), 56h (B) Am29DL323G 50h (T), 53h (B) Am29DL324G 5Ch (T), 5Fh (B) T = Top Boot Sector, B = Bottom Boot Sector Am42DL32x4G May 19, 2003 P R E L I M I N A R Y WRITE OPERATION STATUS The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5, DQ6, and DQ7. Table 18 and the following subsections describe the function of these bits. DQ7 and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether an Embedded Program or Erase operation is in progress or has been completed. pleted the program or erase operation and DQ7 has valid data, the data outputs on DQ6–DQ0 may be still invalid. Valid data on DQ7–DQ0 will appear on successive read cycles. Table 18 shows the outputs for Data# Polling on DQ7. Figure 5 shows the Data# Polling algorithm. Figure 22 in the AC Characteristics section shows the Data# Polling timing diagram. DQ7: Data# Polling START The Data# Polling bit, DQ7, indicates to the host syst em w het he r an E mbe dde d Prog ra m or E ra se algorithm is in progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command sequence. During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to reading array data. Read DQ7–DQ0 Addr = VA DQ7 = Data? No No Just prior to the completion of an Embedded Program or Erase operation, DQ7 may change asynchronously with DQ0–DQ6 while Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has com- May 19, 2003 DQ5 = 1? Yes During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase algorithm is complete, or if the bank enters the Erase Suspend mode, Data# Polling produces a “1” on DQ7. The system must provide an address within any of the sectors selected for erasure to read valid status information on DQ7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then the bank returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the status may not be valid. Yes Read DQ7–DQ0 Addr = VA DQ7 = Data? Yes No FAIL PASS Notes: 1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid address is any non-protected sector address. 2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. Am42DL32x4G Figure 5. Data# Polling Algorithm 33 P R E L I M I N A R Y RY/BY#: Ready/Busy# The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is reading array data, the standby mode, or one of the banks is in the erase-suspend-read mode. DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. Table 18 shows the outputs for Toggle Bit I on DQ6. Figure 6 shows the toggle bit algorithm. Figure 23 in the “AC Characteristics” section shows the toggle bit timing diagrams. Figure 24 shows the differences between DQ2 and DQ6 in graphical form. See also the subsection on DQ2: Toggle Bit II. START Table 18 shows the outputs for RY/BY#. Read DQ7–DQ0 DQ6: Toggle Bit I Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause DQ6 to toggle. The system may use either OE# or CE#f to control the read cycles. When the operation is complete, DQ6 stops toggling. Read DQ7–DQ0 Toggle Bit = Toggle? Yes No After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. DQ5 = 1? Yes Read DQ7–DQ0 Twice The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use DQ7 (see the subsection on DQ7: Data# Polling). If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is written, then returns to reading array data. Toggle Bit = Toggle? No Yes Program/Erase Operation Not Complete, Write Reset Command Program/Erase Operation Complete Note: The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1.” See the subsections on DQ6 and DQ2 for more information. Figure 6. 34 No Am42DL32x4G Toggle Bit Algorithm May 19, 2003 P R E L I M I N A R Y DQ2: Toggle Bit II The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# pulse in the command sequence. DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE#f to control the read cycles.) But DQ2 cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 18 to compare outputs for DQ2 and DQ6. Figure 6 shows the toggle bit algorithm in flowchart form, and the section “DQ2: Toggle Bit II” explains the algorithm. See also the DQ6: Toggle Bit I subsection. Figure 23 shows the toggle bit timing diagram. Figure 24 shows the differences between DQ2 and DQ6 in graphical form. Reading Toggle Bits DQ6/DQ2 Refer to Figure 6 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cy- May 19, 2003 cles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 6). DQ5: Exceeded Timing Limits DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5 produces a “1,” indicating that the program or erase cycle was not successfully completed. The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously programmed to “0.” Only an erase operation can change a “0” back to a “1.” Under this condition, the device halts the operation, and when the timing limit has been exceeded, DQ5 produces a “1.” Under both these conditions, the system must write the reset command to return to reading array data (or to the erase-suspend-read mode if a bank was previously in the erase-suspend-program mode). DQ3: Sector Erase Timer After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be assumed to be less than 50 µs, the system need not monitor DQ3. See also the Sector Erase Command Sequence section. After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 is high on the second status check, the last command might not have been accepted. Table 18 shows the status of DQ3 relative to the other status bits. Am42DL32x4G 35 P R E L I M I N A R Y Table 18. Status Standard Mode Erase Suspend Mode Embedded Program Algorithm Embedded Erase Algorithm Erase Erase-Suspend- Suspended Sector Read Non-Erase Suspended Sector Erase-Suspend-Program Write Operation Status DQ7 (Note 2) DQ7# 0 Toggle Toggle DQ5 (Note 1) 0 0 N/A 1 DQ2 (Note 2) No toggle Toggle 1 No toggle 0 N/A Toggle 1 Data Data Data Data Data 1 DQ7# Toggle 0 N/A N/A 0 DQ6 DQ3 RY/BY# 0 0 Notes: 1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to the section on DQ5 for more information. 2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm is in progress. The device outputs array data if the system addresses a non-busy bank. 36 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . . . –55°C to +125°C Ambient Temperature with Power Applied . . . . . . . . . . . . . . –40°C to +85°C Voltage with Respect to Ground 20 ns 20 ns +0.8 V VCCf/VCCs (Note 1) . . . . . . . . . . . . –0.3 V to +4.0 V –0.5 V RESET# (Note 2) . . . . . . . . . . . . –0.5 V to +12.5 V –2.0 V WP#/ACC . . . . . . . . . . . . . . . . . . –0.5 V to +10.5 V 20 ns All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V Output Short Circuit Current (Note 3) . . . . . . 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot V SS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. See Figure 7. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8. 2. Minimum DC input voltage on pins OE#, RESET#, and WP#/ACC is –0.5 V. During voltage transitions, OE#, WP#/ACC, and RESET# may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin RESET# is +12.5 V which may overshoot to +14.0 V for periods up to 20 ns. Maximum DC input voltage on WP#/ACC is +9.5 V which may overshoot to +12.0 V for periods up to 20 ns. Figure 7. Maximum Negative Overshoot Waveform 20 ns VCC +2.0 V VCC +0.5 V 2.0 V 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. 20 ns 20 ns Figure 8. Maximum Positive Overshoot Waveform OPERATING RANGES Industrial (I) Devices Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C VCCf/VCCs Supply Voltage VCCf/VCCs for standard voltage range . . 2.7 V to 3.3 V Operating ranges define those limits between which the functionality of the device is guaranteed. May 19, 2003 Am42DL32x4G 37 P R E L I M I N A R Y DC CHARACTERISTICS CMOS Compatible Parameter Symbol Parameter Description Test Conditions Min ILI Input Load Current VIN = VSS to VCC, VCC = VCC max ILIT RESET# Input Load Current VCC = VCC max; RESET# = 12.5 V ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC max ILIA ACC Input Leakage Current VCC = VCC max, WP#/ACC = VACC max Typ Max Unit ±1.0 µA 35 µA ±1.0 µA 35 µA CE#f = VIL, OE# = VIH, Byte Mode 5 MHz 10 1 MHz 2 16 4 CE#f = VIL, OE# = VIH, Word Mode 5 MHz 10 16 1 MHz 2 4 ICC1f Flash VCC Active Read Current (Notes 1, 2) ICC2f Flash VCC Active Write Current (Notes 2, 3) CE#f = VIL, OE# = VIH, WE# = VIL 15 30 mA ICC3f Flash VCC Standby Current (Note 2) VCCf = VCC max, CE#f, RESET#, WP#/ACC = VCCf ± 0.3 V 0.2 5 µA ICC4f Flash VCC Reset Current (Note 2) VCCf = VCC max, RESET# = VSS ± 0.3 V, WP#/ACC = VCCf ± 0.3 V 0.2 5 µA ICC5f Flash VCC Current Automatic Sleep Mode (Notes 2, 4) VCCf = VCC max, VIH = VCC ± 0.3 V; VIL = VSS ± 0.3 V 0.2 5 µA Flash VCC Active Read-While-Program Current (Notes CE#f = VIL, OE# = VIH 1, 2) Byte 21 45 ICC6f Word 21 45 ICC7f Flash VCC Active Read-While-Erase Current (Notes 1, 2) CE#f = VIL, OE# = VIH Byte 21 45 Word 21 45 ICC8f Flash VCC Active Program-While-Erase-Suspended Current (Notes 2, 5) CE#f = VIL, OE#f = VIH 17 35 mA mA mA mA VIL Input Low Voltage –0.2 0.6 V VIH Input High Voltage 2.4 VCC + 0.2 V VHH Voltage for WP#/ACC Program Acceleration and Sector Protection/Unprotection 8.5 9.5 V VID Voltage for Sector Protection, Autoselect and Temporary Sector Unprotect 11.5 12.5 V VOL Output Low Voltage 0.45 V VOH1 Output High Voltage VOH2 VLKO IOL = 4.0 mA, VCCf = VCCs = VCC min IOH = –2.0 mA, VCCf = VCCs = VCC min 0.85 x VCC IOH = –100 µA, VCC = VCC min VCC–0.4 Flash Low VCC Lock-Out Voltage (Note 5) 2.3 V 2.5 V Notes: 1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. 2. Maximum ICC specifications are tested with VCC = VCCmax. 3. ICC active while Embedded Erase or Embedded Program is in progress. 4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 200 nA. 5. Not 100% tested. 38 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y SRAM DC AND OPERATING CHARACTERISTICS Parameter Symbol Parameter Description Test Conditions Min Typ Max Unit ILI Input Leakage Current VIN = VSS to VCC –1.0 1.0 µA ILO Output Leakage Current CE1#s = VIH, CE2s = VIL or OE# = VIH or WE# = VIL, VIO= VSS to VCC –1.0 1.0 µA 5 Operating Power Supply Current IIO = 0 mA, CE1#s = VIL, CE2s = WE# = VIH, VIN = VIH or VIL 55 ICC 70 3 55 30 ICC1s Average Operating Current Cycle time = 1 µs, 100% duty, IIO = 0 mA, CE1#s ≤ 0.2 V, CE2 ≥ VCC – 0.2 V, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 70 22 5 Average Operating Current Cycle time = Min., IIO = 0 mA, 100% duty, CE1#s = VIL, CE2s = VIH, VIN = VIL = or VIH 55 ICC2s 70 3 VIL Input Low Voltage VIH Input High Voltage mA mA –0.2 (Note 1) 2.2 0.4 VCC+0.2 (Note 2) V V VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = –1.0 mA ISB Standby Current (TTL) CE1#s = VIH, CE2 = VIL, Other inputs = VIH or VIL 0.3 mA Standby Current (CMOS) CE1#s ≥ VCC – 0.2 V, CE2 ≥ VCC – 0.2 V (CE1#s controlled) or CE2 ≤ 0.2 V (CE2s controlled), CIOs = VSS or VCC, Other input = 0 ~ VCC 10 µA ISB1 0.4 mA 2.4 V V Notes: 1. Undershoot: –1.0V if pulse width ≤ 20 ns. 2. Overshoot: VCC+1.0V if pulse width ≤ 20 ns. May 19, 2003 Am42DL32x4G 39 P R E L I M I N A R Y DC CHARACTERISTICS Zero-Power Flash 25 Supply Current in mA 20 15 10 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 Time in ns Note: Addresses are switching at 1 MHz Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) 12 3.3 V 10 2.7 V Supply Current in mA 8 6 4 2 0 1 2 3 4 5 Frequency in MHz Note: T = 25 °C Figure 10. 40 Typical ICC1 vs. Frequency Am42DL32x4G May 19, 2003 P R E L I M I N A R Y TEST CONDITIONS Table 19. 3.3 V Test Condition 2.7 kΩ Device Under Test CL Test Specifications 6.2 kΩ All Speeds Output Load 1 TTL gate Output Load Capacitance, CL (including jig capacitance) 30 pF Input Rise and Fall Times 5 ns 0.0–3.0 V Input timing measurement reference levels 1.5 V Output timing measurement reference levels 1.5 V Input Pulse Levels Note: Diodes are IN3064 or equivalent Figure 11. Unit Test Setup KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS Steady Changing from H to L Changing from L to H Don’t Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is High Impedance State (High Z) KS000010-PAL 2.0 V Input 1.0 V Measurement Level 1.0 V Output 0.0 V Figure 12. May 19, 2003 Input Waveforms and Measurement Levels Am42DL32x4G 41 P R E L I M I N A R Y AC CHARACTERISTICS SRAM CE#s Timing Parameter Test Setup JEDEC Std Description — tCCR CE#s Recover Time — Min All Speeds Unit 0 ns CE#f tCCR tCCR tCCR tCCR CE1#s CE2s Figure 13. 42 Timing Diagram for Alternating Between SRAM to Flash Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Flash Read-Only Operations Parameter Speed Options Test Setup JEDEC Std Description tAVAV tRC Read Cycle Time (Note 1) tAVQV tACC Address to Output Delay tELQV tCE Chip Enable to Output Delay tGLQV tOE tEHQZ Unit 70, 71 85 Min 70 85 ns CE#f, OE# = VIL Max 70 85 ns OE# = VIL Max 70 85 ns Output Enable to Output Delay Max 30 40 ns tDF Chip Enable to Output High Z (Note 1) Max 16 ns tGHQZ tDF Output Enable to Output High Z (Note 1) Max 16 ns tAXQX tOH Output Hold Time From Addresses, CE#f or OE#, Whichever Occurs First Min 0 ns Read Output Enable Hold Time Toggle and (Note 1) Data# Polling Min 0 ns tOEH Min 10 ns Notes: 1. Not 100% tested. 2. See Figure 11 and Table 19 for test specifications. tRC Addresses Stable Addresses tACC CE#f tRH tRH tDF tOE OE# tOEH WE# tCE tOH HIGH Z HIGH Z Output Valid Outputs RESET# RY/BY# 0V Figure 14. May 19, 2003 Read Operation Timings Am42DL32x4G 43 P R E L I M I N A R Y AC CHARACTERISTICS Hardware Reset (RESET#) Parameter Description JEDEC All Speeds Unit Std tReady RESET# Pin Low (During Embedded Algorithms) to Read Mode (See Note) Max 20 µs tReady RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode (See Note) Max 500 ns tRP RESET# Pulse Width Min 500 ns tRH Reset High Time Before Read (See Note) Min 50 ns tRPD RESET# Low to Standby Mode Min 20 µs tRB RY/BY# Recovery Time Min 0 ns Note: Not 100% tested. RY/BY# CE#f, OE# tRH RESET# tRP tReady Reset Timings NOT during Embedded Algorithms Reset Timings during Embedded Algorithms tReady RY/BY# tRB CE#f, OE# RESET# tRP Figure 15. 44 Reset Timings Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Flash Word/Byte Configuration (CIOf) Parameter Speed Options Unit JEDEC Std Description 70, 71 85 tELFL/tELFH CE#f to CIOf Switching Low or High Max 5 ns tFLQZ CIOf Switching Low to Output HIGH Z Max 16 ns tFHQV CIOf Switching High to Output Active Min 70 85 ns CE#f OE# CIOf CIOf Switching from word to byte mode tELFL Data Output (DQ14–DQ0) DQ14–DQ0 Address Input DQ15 Output DQ15/A-1 Data Output (DQ7–DQ0) tFLQZ tELFH CIOf CIOf Switching from byte to word mode Data Output (DQ7–DQ0) DQ14–DQ0 Address Input DQ15/A-1 Data Output (DQ14–DQ0) DQ15 Output tFHQV Figure 16. CIOf Timings for Read Operations CE#f The falling edge of the last WE# signal WE# CIOf tSET (tAS) tHOLD (tAH) Note: Refer to the Erase/Program Operations table for tAS and tAH specifications. Figure 17. May 19, 2003 CIOf Timings for Write Operations Am42DL32x4G 45 P R E L I M I N A R Y AC CHARACTERISTICS Flash Erase and Program Operations Parameter Speed Options Unit JEDEC Std Description tAVAV tWC Write Cycle Time (Note 1) Min tAVWL tAS Address Setup Time (WE# to Address) Min 0 ns tASO Address Setup Time to OE# or CE#f Low During Toggle Bit Polling Min 15 ns tAH Address Hold Time (WE# to Address) Min 45 ns tAHT Address Hold Time From CE#f or OE# High During Toggle Bit Polling Min 0 ns tDVWH tDS Data Setup Time Min tWHDX tDH Data Hold Time Min 0 ns Read Min 0 ns tOEH OE# Hold Time Toggle and Data# Polling Min 10 ns tOEPH Output Enable High During Toggle Bit Polling Min 20 ns tGHEL tGHEL Read Recovery Time Before Write (OE# High to CE#f Low) Min 0 ns tGHWL tGHWL Read Recovery Time Before Write (OE# High to WE# Low) Min 0 ns tWLEL tWS WE# Setup Time (CE#f to WE#) Min 0 ns tELWL tCS CE#f Setup Time (WE# to CE#f) Min 0 ns tEHWH tWH WE# Hold Time (CE#f to WE#) Min 0 ns tWHEH tCH CE#f Hold Time (CE#f to WE#) Min 0 ns tWLWH tWP Write Pulse Width Min 30 35 ns tELEH tCP CE#f Pulse Width Min 30 35 ns tWHDL tWPH Write Pulse Width High Min 30 ns tSR/W Latency Between Read and Write Operations Min 0 ns Byte Typ 5 Word Typ 7 tWLAX 70, 71 85 70 85 35 45 ns ns tWHWH1 tWHWH1 Programming Operation (Note 2) tWHWH1 tWHWH1 Accelerated Programming Operation, Word or Byte (Note 2) Typ 4 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.4 sec tVCS VCCf Setup Time (Note 1) Min 50 µs tRB Write Recovery Time From RY/BY# Min 0 ns Program/Erase Valid To RY/BY# Delay Max 90 ns tBUSY µs Notes: 1. Not 100% tested. 2. See the “Flash Erase And Programming Performance” section for more information. 46 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Program Command Sequence (last two cycles) tAS tWC Addresses Read Status Data (last two cycles) 555h PA PA PA tAH CE#f tCH tGHWL OE# tWHWH1 tWP WE# tWPH tCS tDS tDH PD A0h Data Status tBUSY DOUT tRB RY/BY# VCCf tVCS Notes: 1. PA = program address, PD = program data, DOUT is the true data at the program address. 2. Illustration shows device in word mode. Figure 18. Program Operation Timings VHH WP#/ACC VIL or VIH VIL or VIH tVHH Figure 19. May 19, 2003 tVHH Accelerated Program Timing Diagram Am42DL32x4G 47 P R E L I M I N A R Y AC CHARACTERISTICS Erase Command Sequence (last two cycles) tAS tWC 2AAh Addresses Read Status Data VA SADD VA 555h for chip erase tAH CE#f tGHWL tCH OE# tWP WE# tWPH tCS tWHWH2 tDS tDH Data 55h In Progress 30h Complete 10 for Chip Erase tBUSY tRB RY/BY# tVCS VCCf Notes: 1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”). 2. These waveforms are for the word mode. Figure 20. 48 Chip/Sector Erase Operation Timings Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Addresses tWC tWC tRC Valid PA Valid RA tWC Valid PA Valid PA tAH tCPH tACC tCE CE#f tCP tOE OE# tOEH tGHWL tWP WE# tDF tWPH tDS tOH tDH Valid Out Valid In Data Valid In Valid In tSR/W WE# Controlled Write Cycle Read Cycle Figure 21. CE#f Controlled Write Cycles Back-to-back Read/Write Cycle Timings tRC Addresses VA VA VA tACC tCE CE#f tCH tOE OE# tOEH tDF WE# tOH High Z DQ7 Complement Complement DQ0–DQ6 Status Data Status Data True Valid Data High Z True Valid Data tBUSY RY/BY# Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle. Figure 22. May 19, 2003 Data# Polling Timings (During Embedded Algorithms) Am42DL32x4G 49 P R E L I M I N A R Y AC CHARACTERISTICS tAHT tAS Addresses tAHT tASO CE#f tCEPH tOEH WE# tOEPH OE# tDH DQ6/DQ2 tOE Valid Status Valid Status Valid Status (first read) (second read) (stops toggling) Valid Data Valid Data RY/BY# Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle Figure 23. Enter Embedded Erasing WE# Erase Suspend Erase Toggle Bit Timings (During Embedded Algorithms) Enter Erase Suspend Program Erase Suspend Program Erase Suspend Read Erase Resume Erase Suspend Read Erase Erase Complete DQ6 DQ2 Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE#f to toggle DQ2 and DQ6. Figure 24. 50 DQ2 vs. DQ6 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Temporary Sector/Sector Block Unprotect Parameter JEDEC All Speed Options Unit Min 500 ns VHH Rise and Fall Time (See Note) Min 250 ns tRSP RESET# Setup Time for Temporary Sector/Sector Block Unprotect Min 4 µs tRRB RESET# Hold Time from RY/BY# High for Temporary Sector/Sector Block Unprotect Min 4 µs Std Description tVIDR VID Rise and Fall Time (See Note) tVHH Note: Not 100% tested. VID RESET# VID VSS, VIL, or VIH VSS, VIL, or VIH tVIDR tVIDR Program or Erase Command Sequence CE#f WE# tRRB tRSP RY/BY# Figure 25. May 19, 2003 Temporary Sector/Sector Block Unprotect Timing Diagram Am42DL32x4G 51 P R E L I M I N A R Y AC CHARACTERISTICS VID VIH RESET# SADD, A6, A1, A0 Valid* Valid* Sector/Sector Block Protect or Unprotect Data 60h 60h Valid* Verify 40h Status Sector/Sector Block Protect: 150 µs, Sector/Sector Block Unprotect: 15 ms 1 µs CE#f WE# OE# * For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0. Figure 26. 52 Sector/Sector Block Protect and Unprotect Timing Diagram Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS Alternate CE#f Controlled Erase and Program Operations Parameter Speed Options Unit JEDEC Std Description tAVAV tWC Write Cycle Time (Note 1) Min tAVWL tAS Address Setup Time (WE# to Address) Min 0 ns tASO Address Setup Time to CE#f Low During Toggle Bit Polling Min 15 ns tAH Address Hold Time Min 45 ns tAHT Address Hold time from CE#f or OE# High During Toggle Bit Polling Min 0 ns tDVEH tDS Data Setup Time Min tEHDX tDH Data Hold Time Min 0 ns tGHEL tGHEL Read Recovery Time Before Write (OE# High to WE# Low) Min 0 ns tWLEL tWS WE# Setup Time Min 0 ns tEHWH tWH WE# Hold Time Min 0 ns tELEH tCP CE#f Pulse Width Min tEHEL tCPH CE#f Pulse Width High Min 30 Typ 5 tWHWH1 Programming Operation (Note 2) Byte tWHWH1 Word Typ 7 tWHWH1 tWHWH1 Accelerated Programming Operation, Word or Byte (Note 2) Typ 4 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.4 sec tELAX 70, 71 85 70 85 35 45 30 35 ns ns ns ns µs Notes: 1. Not 100% tested. 2. See the “Flash Erase And Programming Performance” section for more information. May 19, 2003 Am42DL32x4G 53 P R E L I M I N A R Y AC CHARACTERISTICS 555 for program 2AA for erase PA for program SADD for sector erase 555 for chip erase Data# Polling Addresses PA tWC tAS tAH tWH WE# tGHEL OE# tWHWH1 or 2 tCP CE#f tWS tCPH tBUSY tDS tDH DQ7# Data tRH A0 for program 55 for erase DOUT PD for program 30 for sector erase 10 for chip erase RESET# RY/BY# Notes: 1. Figure indicates last two bus cycles of a program or erase operation. 2. PA = program address, SA = sector address, PD = program data. 3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device. 4. Waveforms are for the word mode. Figure 27. 54 Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS SRAM Read Cycle Parameter Symbol Speed Options Description Unit 70, 85 71 tRC Read Cycle Time Min 70 55 ns tAA Address Access Time Max 70 55 ns tCO1, tCO2 Chip Enable to Output Max 70 55 ns tOE Output Enable Access Time Max 35 25 ns tBA LB#s, UB#s to Access Time Max 70 55 ns Chip Enable (CE1#s Low and CE2s High) to Low-Z Output Min 10 ns tBLZ UB#, LB# Enable to Low-Z Output Min 10 ns tOLZ Output Enable to Low-Z Output Min 5 ns tHZ1, tHZ2 Chip Disable to High-Z Output Max 25 20 ns tBHZ UB#s, LB#s Disable to High-Z Output Max 25 20 ns tOHZ Output Disable to High-Z Output Max 25 20 ns tOH Output Data Hold from Address Change Min tLZ1, tLZ2 10 ns tRC Address tOH Data Out tAA Data Valid Previous Data Valid Note: CE1#s = OE# = VIL, CE2s = WE# = VIH, UB#s and/or LB#s = VIL Figure 28. May 19, 2003 SRAM Read Cycle—Address Controlled Am42DL32x4G 55 P R E L I M I N A R Y AC CHARACTERISTICS tRC Address tAA tCO1 CE#1s CE2s tCO2 tHZ tOE OE# Data Out tOH High-Z tOLZ tBLZ tLZ Figure 29. tOHZ Data Valid SRAM Read Cycle Notes: 1. WE# = VIH. WE# remains high for the read cycle. 2. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. 3. At any given temperature and voltage condition, tHZ (Max.) is less than tLZ (Min.) both for a given device and from device to device interconnection. 56 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS SRAM Write Cycle Parameter Symbol Speed Options Description 70, 85 71 Unit tWC Write Cycle Time Min 70 55 ns tCw Chip Enable to End of Write Min 60 45 ns tAS Address Setup Time Min tAW Address Valid to End of Write Min 60 0 45 ns tBW UB#s, LB#s to End of Write Min 60 45 ns tWP Write Pulse Time Min 50 40 ns tWR Write Recovery Time Min ns 0 ns Min 0 0 Max 20 20 30 tWHZ Write to Output High-Z tDW Data to Write Time Overlap Min tDH Data Hold from Write Time Min 0 ns tOW End Write to Output Low-Z min 5 ns 25 ns ns tWC Address tCW (See Note 2) CS1#s tWR (See Note 3) tAW CS2s tCW (See Note 2) tBW UB#s, LB#s tWP (See Note 5) WE# Data In tAS (See Note 4) tDW (See Note 9) High-Z Data Valid tWHZ Data Out tDH (See Note 6) (See Note 9) High-Z tOW (See Note 7) Notes: 1. WE# controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. 6. If CE1# goes low (or CE2 goes high) at the same time or after WE# goes low, the outputs will remain at high impedance. 7. If CE1# goes high (or CE2 goes low) at the same time or before WE# goes high, the outputs will remain at high impedance. 8. If OE# is high during the write cycle, the outputs will remain at high impedance. 9. Output data may be present on the bus at this time; input signals should not be applied. Figure 30. May 19, 2003 SRAM Write Cycle—WE# Control Am42DL32x4G 57 P R E L I M I N A R Y AC CHARACTERISTICS tWC Address tAS (See Note 2) t CW (See Note 3) tWR (See Note 4) CE1#s tAW CE2s tBW UB#s, LB#s tWP (See Note 5) WE# tDW Data In Data Out (See Note 6) tDH Data Valid High-Z High-Z Notes: 1. CE1#s controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. 6. Output data may be present on the bus at this time; input signals should not be applied. 7. If OE# is high during the write cycle, the outputs will remain at high impedance. Figure 31. 58 SRAM Write Cycle—CE1#s Control Am42DL32x4G May 19, 2003 P R E L I M I N A R Y AC CHARACTERISTICS tWC Address tCW (See Note 2) CE1#s tWR (See Note 3) tAW tCW (See Note 2) CE2s tBW UB#s, LB#s tAS (See Note 4) WE# tWP (See Note 5) tDW Data In Data Out (See Note 6) tDH Data Valid High-Z High-Z Notes: 1. UB#s and LB#s controlled. 2. tCW is measured from CE1#s going low to the end of write. 3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high. 4. tAS is measured from the address valid to the beginning of write. 5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write to the end of write. 6. Output data may be present on the bus at this time; input signals should not be applied. 7. If OE# is high during the write cycle, the outputs will remain at high impedance. Figure 32. May 19, 2003 SRAM Write Cycle—UB#s and LB#s Control Am42DL32x4G 59 P R E L I M I N A R Y Flash Erase And Programming Performance Parameter Typ (Note 1) Max (Note 2) Unit Comments Sector Erase Time 0.4 5 sec Chip Erase Time 28 Excludes 00h programming prior to erasure (Note 4) Byte Program Time 5 150 µs Word Program Time 7 210 µs Accelerated Byte/Word Program Time 4 120 µs Byte Mode 21 63 Word Mode 14 42 Chip Program Time (Note 3) sec Excludes system level overhead (Note 5) sec Notes: 1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally, programming typicals assume checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Tables 14 and 16 or further information on command definitions. 6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles. FLASH LATCHUP CHARACTERISTICS Description Min Max Input voltage with respect to VSS on all pins except I/O pins (including OE#, and RESET#) –1.0 V 12.5 V Input voltage with respect to VSS on all I/O pins –1.0 V VCC + 1.0 V –100 mA +100 mA VCC Current Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time. PACKAGE PIN CAPACITANCE Parameter Symbol CIN Description Input Capacitance Test Setup Typ Max Unit VIN = 0 11 14 pF VOUT = 0 12 16 pF COUT Output Capacitance CIN2 Control Pin Capacitance VIN = 0 14 16 pF CIN3 WP#/ACC Pin Capacitance VIN = 0 17 20 pF Note: 7.Test conditions TA = 25°C, f = 1.0 MHz. FLASH DATA RETENTION Parameter Description Minimum Pattern Data Retention Time 60 Am42DL32x4G Test Conditions Min Unit 150°C 10 Years 125°C 20 Years May 19, 2003 P R E L I M I N A R Y SRAM DATA RETENTION Parameter Symbol Parameter Description VDR VCC for Data Retention CS1#s ≥ VCC – 0.2 V (Note 1) IDR Data Retention Current VCC = 3.0 V, CE1#s ≥ VCC – 0.2 V (Note 1) tSDR Data Retention Set-Up Time tRDR Recovery Time Test Setup See data retention waveforms Min Typ 1.5 1.0 (Note 2) Max Unit 3.3 V 10 µA 0 ns tRC ns Notes: 1. CE1#s ≥ VCC – 0.2 V, CE2s ≥ VCC – 0.2 V (CE1#s controlled) or CE2s ≤ 0.2 V (CE2s controlled). 2. Typical values are not 100% tested. VCC Data Retention Mode tSDR tRDR 2.7V 2.2V VDR CE1#s ≥ VCC - 0.2 V CE1#s GND Figure 33. CE1#s Controlled Data Retention Mode Data Retention Mode VCC 2.7 V CE2s tSDR tRDR VDR CE2s < 0.2 V 0.4 V GND Figure 34. May 19, 2003 CE2s Controlled Data Retention Mode Am42DL32x4G 61 P R E L I M I N A R Y PHYSICAL DIMENSIONS FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm 62 Am42DL32x4G May 19, 2003 P R E L I M I N A R Y REVISION SUMMARY Revision A (January 9, 2002) Changed CFI website address. Initial release. Revision A + 1 (September 30, 2002) Customer Lockable: SecSi Sector NOT Programmed or Protected at the factory. Connection Diagram Added second bullet, SecSi sector-protect verify text and figure 3. Changed H7 from NC to DQ13. Logic Symbol Changed from 19 to 18 address inputs for A17 to A0. Sector/Sector Block Protection and Unprotection Added bottom boot sector protection table. SecSi Sector Flash Memory Region, and Enter SecSi Sector/Exit SecSi Sector Command Sequence Noted that the ACC function and unlock bypass modes are not available when the SecSi sector is enabled. Byte/Word Program Command Sequence, Sector Erase Command Sequence, and Chip Erase Command Sequence Common Flash Memory Interface (CFI) Changed third paragraph to indicate that the system must write reset command to return to reading array data, not the autoselect mode. Changed URL for CFI documents. Noted that the SecSi Sector, autoselect, and CFI functions are unavailable when a program or erase operation is in progress. Revision A + 3 (February 7, 2003) DC Characteristics, CMOS Compatible Product Selector Guide Removed IACC from table. Corrected typo in Speed Option. SRAM DC and Operating Characteristics Revision A + 4 (March 14, 2003) Added VIL and VIH to table. Product Selector Guide Revision A + 2 (February 5, 2003) Corrected typo in SRAM Speed Option and updated tables in datasheet to reflect correction. Global Added the 75 speed option to Flash memory and SRAM throughout the datasheet. Revision B (May 19, 2003) Removed the 85 ns speed option in SRAM. Global Removed “Pseudo” from data sheet. Ordering Information Added order numbers to reflect the new speed option. Common Flash Memory Interface (CFI) Removed 75 ns speed option and added 71 ns speed option. Then, corrected ordering information to reflect change. Trademarks Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. May 19, 2003 Am42DL32x4G 63 Representatives in U.S. and Canada Sales Offices and Representatives North America ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 5 6 ) 8 3 0 - 9 1 9 2 ARIZONA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 2 ) 24 2 - 4 4 0 0 CALIFORNIA, Irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 4 5 0 - 7 5 0 0 Sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 7 3 2 - 24 0 0 COLORADO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 74 1 - 2 9 0 0 CONNECTICUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 0 3 ) 2 6 4 - 7 8 0 0 FLORIDA, Clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 2 7 ) 7 9 3 - 0 0 5 5 Miami (Lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 5 ) 8 2 0 - 1 1 1 3 GEORGIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 7 0 ) 8 1 4 - 0 2 2 4 ILLINOIS, Chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 3 0 ) 7 7 3 - 4 4 2 2 MASSACHUSETTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 1 3 - 6 4 0 0 MICHIGAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 4 8 ) 4 7 1 - 6 2 9 4 MINNESOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 1 2 ) 74 5 - 0 0 0 5 NEW JERSEY, Chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 3 ) 7 0 1 - 1 7 7 7 NEW YORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 4 2 5 - 8 0 5 0 NORTH CAROLINA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 0 - 8 0 8 0 OREGON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 24 5 - 0 0 8 0 PENNSYLVANIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 1 5 ) 3 4 0 - 1 1 8 7 SOUTH DAKOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 5 ) 69 2 - 5 7 7 7 TEXAS, Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 1 2 ) 3 4 6 - 7 8 3 0 Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 2 ) 9 8 5 - 1 3 4 4 Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 8 1 ) 3 76 - 8 0 8 4 VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 0 3 ) 7 3 6 - 9 5 6 8 International AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . . T E L ( 6 1 ) 2 - 8 8 - 7 7 7 - 2 2 2 BELGIUM, Antwerpen . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 2 ) 3 - 2 4 8 - 4 3 - 0 0 BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 5 5 ) 1 1 - 5 5 0 1 - 2 1 0 5 CHINA, Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 1 0 - 6 5 1 0 - 2 1 8 8 Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 2 1 - 6 3 5 - 0 0 8 3 8 Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 7 5 5 - 24 6 - 1 5 5 0 FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7 FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 9 7 5 1 0 1 0 GERMANY, Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 6 1 7 2 - 9 2 6 7 0 Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0 HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . . T E L ( 8 5 ) 2 - 2 9 5 6 - 0 3 8 8 ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1 INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 6 2 3 - 8 6 2 0 JAPAN, Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 6 - 6 2 4 3 - 3 2 5 0 Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 3 - 3 3 4 6 - 7 6 0 0 KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 2 ) 2 - 3 4 6 8 - 2 6 0 0 RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22 SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 6 ) 8 - 5 62 - 5 4 0 - 0 0 TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 8 6 ) 2 - 8 7 7 3 - 1 5 5 5 UNITED KINGDOM, Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 2 76 - 8 0 3 1 0 0 Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 9 4 2 - 2 7 2 8 8 8 Advanced Micro Devices reserves the right to make changes in its product without notice in order to improve design or performance characteristics.The performance characteristics listed in this document are guaranteed by specific tests, guard banding, design and other practices common to the industry. For specific testing details, contact your local AMD sales representative.The company assumes no responsibility for the use of any circuits described herein. © Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combination thereof, are trademarks of Advanced Micro Devices, Inc. Other product names are for informational purposes only and may be trademarks of their respective companies. es ARIZONA, Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 8 0 ) 8 3 9 - 2 3 2 0 CALIFORNIA, Calabasas - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 8 ) 8 7 8 - 5 8 0 0 Irvine - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 2 6 1 - 2 1 2 3 San Diego - Centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 8 ) 2 7 8 - 4 9 5 0 Santa Clara - Fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 3 5 0 - 4 8 0 0 CANADA, Burnaby, B.C. - Davetek Marketing. . . . . . . . . . . . . . . . . . . . ( 6 0 4 ) 4 3 0 - 3 6 8 0 Calgary, Alberta - Davetek Marketing. . . . . . . . . . . . . . . . . ( 4 0 3 ) 2 8 3 - 3 5 7 7 Kanata, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . . . ( 6 1 3 ) 5 9 2 - 9 5 4 0 Mississauga, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . ( 9 0 5 ) 6 7 2 - 2 0 3 0 St Laurent, Quebec - J-Squared Tech. . . . . . . . . . . . . . . . ( 5 1 4 ) 7 4 7 - 1 2 1 1 COLORADO, Golden - Compass Marketing . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 2 7 7 - 0 4 5 6 FLORIDA, Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . . ( 3 2 1 ) 7 2 8 - 7 7 0 6 Ft. Lauderdale - Marathon Technical Sales . . . . . . . . . . . . . . ( 9 5 4 ) 5 2 7 - 4 9 4 9 Orlando - Marathon Technical Sales . . . . . . . . . . . . . . . . . . ( 4 0 7 ) 8 7 2 - 5 7 7 5 St. Petersburg - Marathon Technical Sales . . . . . . . . . . . . . . ( 7 2 7 ) 8 9 4 - 3 6 0 3 GEORGIA, Duluth - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . ( 6 7 8 ) 5 8 4 - 1 1 2 8 ILLINOIS, Skokie - Industrial Reps, Inc. . . . . . . . . . . . . . . . . . . . . . . . . ( 8 4 7 ) 9 6 7 - 8 4 3 0 INDIANA, Kokomo - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 6 5 ) 4 5 7 - 7 2 4 1 IOWA, Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . ( 3 1 9 ) 2 9 4 - 1 0 0 0 KANSAS, Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 6 9 - 1 3 1 2 MASSACHUSETTS, Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 3 8 - 0 8 7 0 MICHIGAN, Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 0 ) 2 2 7 - 0 0 0 7 MINNESOTA, St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . . ( 6 5 1 ) 69 9 - 0 2 0 0 MISSOURI, St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 1 4 ) 9 9 7 - 4 5 5 8 NEW JERSEY, Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 6 ) 8 6 6 - 1 2 3 4 NEW YORK, Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 7 4 1 - 7 1 1 6 East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 3 1 5 ) 4 3 7 - 8 3 4 3 Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 5 8 6 - 3 6 6 0 Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . ( 5 1 6 ) 5 3 6 - 4 2 4 2 NORTH CAROLINA, Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 6 - 5 7 2 8 OHIO, Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . ( 4 4 0 ) 8 1 6 - 1 6 6 0 Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 7 8 1 - 0 7 2 5 Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . ( 9 3 7 ) 8 9 8 - 9 6 1 0 Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 5 2 3 - 1 9 9 0 OREGON, Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 6 7 0 - 0 5 5 7 UTAH, Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . . ( 8 0 1 ) 2 8 8 - 2 5 0 0 VIRGINIA, Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 7 6 1 - 2 2 5 5 WASHINGTON, Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 2 5 ) 8 2 2 - 9 2 2 0 WISCONSIN, Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . . ( 2 6 2 ) 5 74 - 9 3 9 3 Representatives in Latin America ARGENTINA, Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655 CHILE, Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993 COLUMBIA, Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2 MEXICO, Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 3 ) 8 1 7 - 3 9 0 0 Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 5 ) 7 5 2 - 2 7 2 7 Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . . ( 5 2 8 ) 3 69 - 6 8 2 8 PUERTO RICO, Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 7 ) 8 5 1 - 6 0 0 0 One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400 TWX 910-339-9280 TELEX 34-6306 800-538-8450 http://www.amd.com ©2003 Advanced Micro Devices, Inc. 01/03 Printed in USA