AOSMD AOWF7S60 600v 7a a mos tm power transistor Datasheet

AOW7S60/AOWF7S60
600V 7A α MOS TM Power Transistor
General Description
Product Summary
The AOW7S60 & AOWF7S60 have been fabricated using
the advanced αMOSTM high voltage process that is
designed to deliver high levels of performance and
robustness in switching applications.
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
VDS @ Tj,max
700V
IDM
33A
RDS(ON),max
0.6Ω
Qg,typ
8.2nC
Eoss @ 400V
1.9µJ
100% UIS Tested
100% Rg Tested
TO-262
Top View
TO-262F
Bottom View
G
D
S
Top View
S
D
G
G
S
G
AOW7S60
TC=100°C
C
G
AOW7S60
S
AOWF7S60
600
VGS
TC=25°C
Continuous Drain
Current
Pulsed Drain Current
S
D
D
AOWF7S60
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
D
Bottom View
V
±30
7
ID
Units
V
7*
5
5*
A
IDM
33
Avalanche Current C
IAR
1.7
A
Repetitive avalanche energy C
EAR
43
mJ
Single pulsed avalanche energy G
TC=25°C
Power Dissipation B Derate above 25oC
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt H
Junction and Storage Temperature Range
EAS
86
PD
W
0.8
0.2
W/ oC
100
20
-55 to 150
TJ, TSTG
TL
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Symbol
RθJA
V/ns
°C
300
°C
AOW7S60
AOWF7S60
Units
65
65
°C/W
0.5
1.2
-5
°C/W
°C/W
RθCS
Maximum Case-to-sink A
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
Rev0: Aug 2011
25
dv/dt
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds J
mJ
104
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Page 1 of 6
AOW7S60/AOWF7S60
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ID=250µA, VGS=0V, TJ=25°C
600
-
-
ID=250µA, VGS=0V, TJ=150°C
650
700
-
V
µA
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VDS=600V, VGS=0V
-
-
1
VDS=480V, TJ=150°C
-
10
-
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
-
-
±100
VGS(th)
Gate Threshold Voltage
VDS=5V, ID=250µA
2.7
3.3
3.9
nΑ
V
RDS(ON)
Static Drain-Source On-Resistance
VSD
Diode Forward Voltage
IS
ISM
VGS=10V, ID=3.5A, TJ=25°C
-
0.54
0.60
Ω
VGS=10V, ID=3.5A, TJ=150°C
-
1.48
1.64
Ω
IS=3.5A,VGS=0V, TJ=25°C
-
0.82
-
V
Maximum Body-Diode Continuous Current
-
-
7
A
Maximum Body-Diode Pulsed CurrentC
-
-
33
A
-
372
-
pF
-
28
-
pF
-
22
-
pF
-
65
-
pF
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related H
Crss
Effective output capacitance, time
related I
Reverse Transfer Capacitance
Rg
Gate resistance
Co(tr)
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
VGS=0V, VDS=100V, f=1MHz
-
1.2
-
pF
VGS=0V, VDS=0V, f=1MHz
-
17.5
-
Ω
-
8.2
-
nC
-
2.0
-
nC
SWITCHING PARAMETERS
Total Gate Charge
Qg
VGS=10V, VDS=480V, ID=3.5A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
-
2.8
-
nC
tD(on)
Turn-On DelayTime
-
19
-
ns
tr
Turn-On Rise Time
-
13
-
ns
tD(off)
Turn-Off DelayTime
-
50
-
ns
tf
trr
Turn-Off Fall Time
-
15
-
ns
IF=3.5A,dI/dt=100A/µs,VDS=400V
VGS=10V, VDS=400V, ID=3.5A,
RG=25Ω
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
-
198
-
ns
Irm
IF=3.5A,dI/dt=100A/µs,VDS=400V
-
18
-
Qrr
Body Diode Reverse Recovery Charge IF=3.5A,dI/dt=100A/µs,VDS=400V
-
2.4
-
A
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ
=25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
G. L=60mH, IAS=1.7A, VDD=150V, Starting TJ=25°C
H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS.
I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS.
J. Wavesoldering only allowed at leads.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev0: Aug 2011
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Page 2 of 6
AOW7S60/AOWF7S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
12
14
10V
12
6V
10
10V
6V
8
8
ID (A)
ID (A)
10
5.5V
6
5.5V
6
5V
4
4
5V
2
VGS=4.5V
VGS=4.5V
2
0
0
0
5
10
15
0
20
5
10
15
20
VDS (Volts)
Figure 2: On-Region Characteristics@125°C
VDS (Volts)
Figure 1: On-Region Characteristics@25°C
100
1.5
VDS=20V
-55°C
1.2
10
RDS(ON) (Ω )
ID(A)
125°C
1
0.9
VGS=10V
0.6
25°C
0.1
0.3
0.0
0.01
2
4
6
8
0
10
VGS(Volts)
Figure 3: Transfer Characteristics
6
9
12
15
ID (A)
Figure 4: On-Resistance vs. Drain Current and
Gate Voltage
1.2
3
2.5
VGS=10V
ID=3.5A
BVDSS (Normalized)
Normalized On-Resistance
3
2
1.5
1
1.1
1
0.9
0.5
0
-100
-50
0
50
100
150
200
0.8
-100
Temperature (°C)
Figure 5: On-Resistance vs. Junction Temperature
Rev0: Aug 2011
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-50
0
50
100
150
200
TJ (oC)
Figure 6: Break Down vs. Junction Temperature
Page 3 of 6
AOW7S60/AOWF7S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
1.0E+02
1.0E+01
125°C
12
VDS=480V
ID=3.5A
9
25°C
1.0E-01
VGS (Volts)
IS (A)
1.0E+00
1.0E-02
1.0E-03
6
3
1.0E-04
0
1.0E-05
0.0
0.2
0.4
0.6
0.8
0
1.0
6
8
10
12
5
10000
1000
4
Ciss
Eoss(uJ)
Capacitance (pF)
4
Qg (nC)
Figure 8: Gate-Charge Characteristics
VSD (Volts)
Figure 7: Body-Diode Characteristics (Note E)
100
Coss
10
3
Eoss
2
Crss
1
1
0
0
0
100
200
300
400
500
VDS (Volts)
Figure 9: Capacitance Characteristics
600
0
100
200
300
400
VDS (Volts)
Figure 10: Coss stroed Energy
500
600
100
100
10µs
10µs
RDS(ON)
limited
100µs
1
1ms
DC
10
ID (Amps)
10
ID (Amps)
2
RDS(ON)
limited
100µs
1
1ms
10ms
0.1
10ms
0.1s
1s
DC
0.1
TJ(Max)=150°C
TC=25°C
TJ(Max)=150°C
TC=25°C
0.01
0.01
1
10
100
1000
VDS (Volts)
Figure 11: Maximum Forward Biased Safe
Operating Area for AOW7S60 (Note F)
Rev0: Aug 2011
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1
10
100
1000
VDS (Volts)
Figure 12: Maximum Forward Biased Safe
Operating Area for AOWF7S60(Note F)
Page 4 of 6
AOW7S60/AOWF7S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
8
Current rating ID(A)
EAS(mJ)
80
60
40
20
0
6
4
2
0
25
50
75
100
125
TCASE (°C)
Figure 13: Avalanche energy
150
175
0
25
50
75
100
125
TCASE (°C)
Figure 14: Current De-rating (Note B)
150
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=1.2°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
0.01
Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance for AOW7S60 (Note F)
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
0.01
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance for AOWF7S60 (Note F)
Rev0: Aug 2011
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Page 5 of 6
AOW7S60/AOWF7S60
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Tes t Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
Rev0: Aug 2011
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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Page 6 of 6
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