Anpec APA2031RI-TYL Stereo 2.6w audio amplifier(with gain control) Datasheet

APA2030/2031
Stereo 2.6W Audio Amplifier(With Gain Control)
Features
General Description
• Low operating current with 6mA
APA2030/1 is a monolithic integrated circuit, which
provides internal gain control, and a stereo bridged
audio power amplifiers capable of producing 2.6W
(1.9W) into 3Ω with less than 10% (1.0%) THD+N.
By control the two gain setting pins, Gain0 and Gain1,
The amplifier can provide 6dB, 10dB, 15.6dB, and
21.6dB gain settings. The advantage of internal gain
setting can be less components and PCB area. Both
• Improved depop circuitry to eliminate turn-on
transients in outputs
• High PSRR
• Internal gain control, eliminate external components.
• 2.6W per channel output power into 3Ω load at 5V,
BTL mode
• Multiple input modes allowable selected by HP
of the depop circuitry and the thermal shutdown protection circuitry are integrated in APA2030/1, that
reduces pops and clicks noise during power up or
shutdown mode operation. It also improved the power
off pop noise and protects the chip from being de-
/LINE pin (APA2030)
• Two output modes allowable with BTL and SE
modes selected by SE/BTL pin (for APA2030 only)
• Low current consumption in shutdown mode (50µ
stroyed by over temperature and short current failure.
A)
•
NoteBook PC
To simplify the audio system design APA2030 combines a stereo bridge-tied loads (BTL) mode for
speaker drive and a stereo single-end (SE) mode for
headphone drive into a single chip, where both modes
are easily switched by the SE/BTL input control pin
signal. Besides the multiple input selections is used
for portable audio system. APA2031 eliminates both
input selection and single-end (SE) mode function to
•
LCD Monitor
simplifying the design and save the PCB space.
• Short Circuit Protection
• TSSOP-24-P (APA2030) and TSSOP-20-P
(APA2031) with thermal pad package.
Applications
Ordering and Marking Information
P ackage C ode
R : TS S O P-P *
Tem p. R ange
I : - 40 to 85 ° C
H andling C ode
TU : Tube
TR : Tape & R eel
TY : Tray
Lead Free C ode
L : Lead Free D evice
B lank : O riginal D evice
APA2030/1
Lead Free C ode
H andling C ode
Tem p. R ange
P ackage C ode
A P A 2030/1 R :
A P A 2030/1
XXXXX
XXXXX - D ate C ode
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 -Apr., 2004
1
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APA2030/2031
Pin Assignment
24 GND
GND 1
GA IN0 2
23 RLINEIN
GA IN1 3
22 SHUTDOWN
LOUT+ 4
LLINEIN 5
LHPIN 6
20 RHPIN
T OP V ie w
(A PA 2030)
GA IN0 2
19 SHUTDOWN
GA IN1 3
18 ROUT+
LOUT+ 4
19 V D D
17 HP/LINE
PV D D 6
LOUT- 9
16 ROUT-
RIN+ 7
LIN+ 10
15 SE/BTL
RIN+ 8
GND 12
13 GND
16 V D D
T OP V ie w
(A PA 2031)
15 PV D D
14 ROUT13 GND
LOUT- 8
LIN+ 9
14 PCBEEP
BY PA SS 11
17 RIN-
LIN- 5
18 PV D D
PV D D 7
20 GND
GND 1
21 ROUT+
12 NC
BY PA SS 10
11 GND
A P A 2030_P inOut
Block Diagram
LLINEIN
LHPIN
LOUT+
MUX
LIN+
BY PA SS
Vb ias
LOUTGA IN0
GIA N1
G ain
select ab le
RLINEIN
RHPIN
ROUT+
MUX
RIN+
HP/LINE
H P/L IN E
SE/BTL
SHUTDOW N
PCBEEP
Vb ias
SE /B T L
ROUT-
Sh u t d o w n
ckt
PC - B EEP
ckt
A P A 2030_B lock
APA2030
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Block Diagram
LIN-
LOUT+
LIN+
BY PA SS
Vb ias
SHUTDOWN
Sh u td o w n
ckt
LOUT-
GA IN0
GA IN1
G ain
select ab le
RIN-
ROUT+
RIN+
Vb ias
ROUTAPA2031_Block
APA2031
Absolute Maximum Ratings
(Over operating free-air temperature range unless otherwise noted.)
Parameter
Supply voltage range, VDD, PVDD
Input voltage range at SE/BTL, HP/LINE, SHUTDOWN,
Operating ambient temperature range, TA
Maximum junction temperature, T J
Storage temperature range, TSTG
Soldering Temperature, 10 seconds, TS
Electrostatic Discharge, VESD
Power dissipation, PD
Note:
Rating
-0.3V to 6V
-0.3V to VDD
-40°C to 85°C
Internal Limited
-65°C to 150°C
260°C
-3000 to 3000*1
-200 to 200*2
Internal Limited
*1. Human body model: C=100pF, R=1500Ω, 3 positives pulse plus 3 negative pulses
*2. Machine model: C=200pF, L=0.5mH, 3 positive pulses plus 3 negative pulses
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Recommended Operating Conditions
Supply Voltage, VDD………………………………………………………………………….…………..4.5V to 5.5V
Thermal Characteristics
Symbol
RTHJA
Parameter
Thermal Resistance from Junction to Ambient in Free Air
TSSOP-P24*
TSSOP-P20*
Value
Unit
45
48
°C/W
* 5 in2 printed circuit board with 2oz trace and copper pad through 9 25mil diameter vias.
The thermal pad on the TSSOP_P package with solder on the printed circuit board.
Electrical Characteristics
(VDD=5V,-20°C<TA<85°C, unless otherwise noted.)
Symbol
Parameter
VDD
Supply Voltage
IDD
Supply current
ISD
Supply current in shutdown
mode
VIH
High level threshold Voltage
VIL
Low level threshold Voltage
II
Input current
Test Condition
Min.
Typ.
3.3
Max.
Unit
5.5
V
SE/BTL = 0V
6
12
mA
SE/BTL = 5V
4
8
mA
SHUTDOWN = 0V
50
300
µA
SHUTDOWN, GAIN0, GAIN1
2
V
SE/BTL, HP/LINE
SHUTDOWN, GAIN0, GAIN1
4
V
SE/BTL, HP/LINE
SHUTDOWN, SE/BTL,
HP/LINE, GAIN0, GAIN1
5
V
3
V
nA
VICM
Common mode Input voltage
VOS
Output differential voltage
5
mV
PC_beep trigger level
1
Vp.p
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
VDD-1.0
0.8
4
V
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APA2030/2031
Electical Characteristics (Cont.)
Operating Characteristics, BTL mode
Vdd=5V, TA=25°C, Rl=4Ω, Gain=6dB, (Unless otherwise noted)
Symbol
PO
Parameter
Maximum output power
Test Condition
PSRR
xtalk
S/N
Total harmonic distortion plus
noise
Typ.
Max.
Unit
THD=10%, Fin=1khz, RL=3Ω
2.6
W
THD=10%, Fin=1khz, RL=4Ω
2.3
W
THD=10%, Fin=1khz, RL=8Ω
1.5
W
THD=1%, Fin=1khz, RL=3Ω
1.9
W
THD=1%, Fin=1khz, RL=4Ω
1.7
W
1.1
W
Po=1.1W, RL=4Ω Fin=1khz
0.05
%
Po=0.7W, RL=8Ω, Fin=1khz
0.04
%
THD=1%, Fin=1khz, RL=8Ω
THD+N
Min.
1
85
dB
Channel separation
Vin=0.2Vrms, Rl=8Ω,
Cb=0.47µf, f=120Hz
f=1khz, Cb=0.47µf,
95
dB
HP/LINE input separation
f=1khz, Cb=0.47µf,
80
dB
Signal to noise ratio
Po=1.1W, Rl=8Ω , A_weight
105
dB
Power ripple rejection ratio
Operating Characteristics, SE mode ( for APA2030 only)
Vdd=5V, TA=25°C, Rl=32Ω, Gain=4, 1dB, (Unless otherwise noted)
Symbol
PO
THD+N
PSRR
xtalk
S/N
Parameter
Maximum output power
Test Condition
Typ.
Max. Unit
THD=10%, Fin=1khz, RL=32Ω
110
mW
THD=1%, Fin=1khz, RL=32Ω
90
mW
0.03
%
55
dB
80
dB
Total harmonic distortion plus
Po=75mW, RL=32Ω .Fin=1khz
noise
Vin=0.2Vrms, Rl=32Ω,
Power ripple rejection ratio
Cb=0.47µf, f=120,
SE/BTL attenuation
Min.
Channel separation
f=1khz, Cb=0.47µf,
65
dB
HP/LINE input separation
f=1khz, Cb=0.47µf, BTL
80
dB
Signal to noise ratio
Po=75mW, Rl=32Ω, A_weight,
100
dB
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Pin Descriptions
APA2030
Pin
Config.
Function Description
no.
1,
12,
G ND
G round connection, Connected to therm al pad.
13,
24
G AIN0
2
I/P
Input signal for internal gain setting
G AIN1
3
I/P
Input signal for internal gain setting
LOUT+
4
O /P
Left channel positive output in BTL m ode and SE m ode
LLINEIN
5
I/P
Left channel line input term inal, selected when HP/LINE is held low.
RLINEIN
23
I/P
Right channel line input term inal, selected when HP/LINE is held low.
LHPIN
6
O /P
Left channel headphone input term inal, selected when HP/LINE is held high.
7,
PV DD
Supply voltage only for power am plifier
18
RIN+
8
I/P
Right channel positive signal input, when differential signal is accepted.
LOUT9
O /P
Left channel negative output in BTL m ode and high im pedance in SE m ode
LIN+
10
I/P
Left channel positive signal input, when differential signal is accepted.
BYPASS
11
Bypass voltage
PCBEEP
14
I/P
PC-beep signal input
O utput m ode control input pin, high for SE output m ode and low for BTL
15
I/P
SE/BTL
m ode
Right channel negative output in BTL m ode and high im pedance in SE
ROUT16
O /P
m ode
Multi-input selection input, headphone m ode when held high, line-in m ode
HP/LINE
17
I/P
when held low
V DD
19
Supply voltage for internal circuit excepting power am plifier.
Right channel headphone input term inal, selected when HP/LINE is held
RHPIN
20
I/P
high.
ROUT+
21
O /P
Right channel positive output in BTL m ode and SE m ode
22
I/P
SHUTDOW N
It will be into shutdown m ode when pull low
23
I/P
RLINEIN
Right channel line input term inal, selected when HP/LINE is held low
Pin name
APA2031
Pin name
GND
GAIN0
GAIN1
LOUT+
LINPVDD
RIN+
LOUTLIN+
BYPASS
NC
ROUTVDD
Pin
Config.
Function Description
no.
1, 11,
Ground connection, Connected to thermal pad.
13, 20
2
I/P
Input signal for internal gain setting
3
I/P
Input signal for internal gain setting
4
O/P Left channel positive output
5
I/P
Left channel negative audio signal input
6,15
Supply voltage only for power amplifier
7
I/P
Right channel positive audio signal input
8
O/P Left channel negative output
9
I/P
Left channel positive audio signal input
10
Bypass voltage
12
No connection
14
O/P Right channel negative output
16
Supply voltage for internal circuit excepting power amplifier
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Pin Description
APA2031
Pin name
RIN+
ROUT+
Pin
Config.
Function Description
no.
17
I/P
Right channel negative audio signal input
18
O/P Right channel positive output
SHUTDOWN 19
I/P
It will be into shutdown mode when pull low
Control Input Table ( for APA2030 only)
SE/BTL
X
L
L
H
H
X
HP/ LINE
X
L
H
L
H
X
SHUTDOWN
L
H
H
H
H
X
PCBEEP
Operating mode
Disable
Disable
Disable
Disable
Disable
Enable
Shutdown mode
Line input, BTL out
HP input, BTL out
Line input, SE out
HP input, SE out
PCBEEP input, BTL out
Gain Setting Table (for both APA2030 and APA2031)
GAIN0
GAIN1
Ri
Rf
Av
0
0
90KΩ
90KΩ
6dB
0
1
69KΩ
111KΩ
10dB
1
0
42KΩ
138KΩ
15.6dB
1
1
25.7KΩ
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
154.3KΩ 21.6dB
7
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APA2030/2031
Typical Application Circuit
(f
(for APA2030 using SE input signal)
VDD
0.1µF
VDD
0.47µF
L-LINE
L-HP
0.47µF
0.47µF
0.47µF
LLINEIN
LHPIN
0Ω
100µF
GND
PVDD
LOUT+
MUX
220µF
LIN+
1kΩ
BYPASS
Vbias
4Ω
GAIN0
GAIN1
0.47µF
RLINEIN
RHPIN
R-LINE
R-HP
0.47µF
0.47µF
100kΩ
Shutdown Signal
100kΩ SE/BTL
SHUTDOWN
PCBEEP
BEEP Signal
LOUT-
Sleeve
Tip
Headphone
Jack
ROUT+
MUX
220µF
VDD
SE/BTL Signal
SE/BTL
Signal
Gain
selectable
RIN+
HP/LINE
HP/LINE
Control Signal
Control
Pin Ring
1kΩ
HP/LINE
Vbias
4Ω
SE/BTL
ROUT-
Shutdown
ckt
PC-BEEP
ckt
0.47µF
APA2030AppCkt
APA 2030
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Typical Application Circuit
(for APA2031 using SE input signal)
V DD
0Ω
0 .1 µ F
V DD
L -INP UT
0 .4 7 µ F
100 µ F
G ND
P V DD
L IN-
0 .4 7µ F
L O UT +
L IN+
BYPASS
Vbias
0 .4 7 µ F
4Ω
G A IN0
G A IN1
R-INP UT
0 .4 7µ F
0 .4 7 µ F
L O UT Gain
se l e cta b l e
RIN-
RO UT +
RIN+
Vbias
4Ω
S h u td o wn
S ig na l
S HUT DO WN
RO UT -
S h u td o wn
ckt
APA 2031
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
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APA2030/2031
Typical Characteristics
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD=5V
AV=4.1dB
f=1kHz
COUT=330µF
SE
RL=8Ω
1
RL=3Ω
RL=4Ω
THD+N (%)
THD+N (%)
VDD=5V
AV=6dB
f=1kHz
BTL
0.1
0.01
0
0.5
1
1.5
2.5
2
1
RL=32Ω
0.1
0.01
3
0
50
Output Power (W)
150
200
250
THD+N vs. Output Power
10
10
VDD=5V
AV=6dB
RL=3Ω
BTL
f=15kHz
f=15kHz
1
1
THD+N (%)
THD+N (%)
100
Output Power (mW)
THD+N vs. Output Power
f=1kHz
0.1
f=1kHz
0.1
f=30Hz
0.01
10m
RL=16Ω
0.01
100m
1
5
10m
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
f=30Hz
VDD=5V
AV=15.6dB
RL=3Ω
BTL
100m
1
2
5
Output Power (W)
10
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APA2030/2031
Typical Characteristics (Cont.)
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD=5V
AV=6dB
RL=4Ω
BTL
f=15kHz
f=15kHz
1
THD+N (%)
THD+N (%)
1
f=1kHz
0.1
f=1kHz
0.1
f=30Hz
0.0
1 10m
100m
1
2
0.01
10m
5
Output Power (W)
10
5
VDD=5V
AV=15.6dB
RL=8Ω
BTL
1
THD+N (%)
THD+N (%)
2
f=15kHz
f=15kHz
0.1
1
THD+N vs. Frequency
VDD=5V
AV=6dB
RL=8Ω
BTL
1
100m
Output Power (W)
THD+N vs. Output Power
10
f=30Hz
VDD=5V
AV=15.6dB
RL=4Ω
BTL
f=1kHz
f=30Hz
0.1
f=1kHz
f=30Hz
0.01
10m
100m
1
2
0.01
10m
5
1
2
5
Output Power (W)
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
100m
11
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APA2030/2031
Typical Characteristics (Cont.)
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD=5V
AV=4dB
RL=16Ω
COUT=1000µF
SE
f=30Hz
1
THD+N (%)
1
THD+N (%)
VDD=5V
AV=4.1dB
RL=32Ω
COUT=1000µF
SE
f=15kHz
0.1
f=15kHz
0.1
f=30Hz
f=1kHz
0.01
10m
10
50m
100m
f=1kHz
0.01
10m
200m 300m
100m
200m 300m
Output Power (W)
Output Power (W)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD=5V
PO=1.75W
RL=3Ω
BTL
VDD=5V
AV=6dB
RL=3Ω
BTL
1
THD+N (%)
1
THD+N (%)
50m
PO=1.75W
0.1
0.01
20
AV=15.6dB
AV=6dB
0.1
PO=1W
100
1k
0.01
20
10k 20k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
100
1k
10k
20k
Frequency (Hz)
12
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APA2030/2031
Typical Characteristics (Cont.)
THD+N vs. Frequency
THD+N vs. Frequency
10
10
VDD=5V
PO=1.5W
RL=4Ω
BTL
VDD=5V
AV=6dB
RL=4Ω
BTL
1
THD+N (%)
THD+N (%)
1
PO=1.5W
0.1
AV=15.6dB
0.1
AV=6dB
PO=0.75W
0.01
0.01
20
100
1k
10k
20
20k
100
Frequency (Hz)
THD+N vs. Frequency
10
VDD=5V
AV=6dB
RL=8Ω
BTL
VDD=5V
PO=1W
RL=8Ω
BTL
THD+N (%)
THD+N (%)
1
PO=1W
0.1
1
AV=6dB
0.1
PO=0.5W
0.01
20
10k 20k
Frequency (Hz)
THD+N vs. Frequency
10
1k
100
AV=15.6dB
1k
10k
0.01
20k
20
1k
10k 20k
Frequency (Hz)
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
100
13
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APA2030/2031
Typical Characteristics (Cont.)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD=5V
AV=4.1dB
RL=16Ω
COUT=1000µF
SE
1
THD+N (%)
0.1
VDD=5V
AV=4.1dB
RL=32Ω
COUT=1000µF
SE
1
0.1
PO=75mW
PO=25mW
PO=150mW
0.01
20
100
PO=75mW
1k
10k
0.01
20
20k
100
Frequency (Hz)
Gain
+4
+240
+20
+230
+18
+260
+250
+16
+190
+180
Phase
+170
-4
+160
VDD=5V
RL=4Ω
AV=6dB
PO=1W
BTL
-6
-8
10
100
+150
Gain (dB)
-0
10k
+220
+210
+200
+10
+190
+180
+8
+130
+2
+120
100k 200k
-0
+170
Phase
V DD=5V
RL=4Ω
AV=15.6dB
PO=1W
BTL
+4
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
+230
+12
+6
+140
1k
+240
Gain
+14
Phase (Degress)
Gain (dB)
+200
-10
+270
+210
-2
20k
Frequency Response
+220
+2
10k
Frequency (Hz)
Frequency Response
+6
1k
10
100
Phase (Degress)
THD+N (%)
10
+160
+150
+140
+130
1k
10k
+120
100k 200k
Frequency (Hz)
14
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APA2030/2031
Typical Characteristics (Cont.)
Frequency Response
Frequency Response
+260
Gain
+9
+8
+220
+210
+6
+200
+5
+190
+180
+4
Phase
+170
+160
VDD=5V
RL=8Ω
AV=10dB
PO=0.5W
BTL
+1
+240
+1
+220
+0
+200
+180
-1
Phase
-3
+140
-4
+130
100
1k
10k
10
Crosstalk (dB)
-40
100
+100
100k 200k
10k
+0
6
VDD=5V
RL=4Ω
AV=6dB
PO=1.5W
SE
-80
-10
-20
-30
Left to Right
-100
VDD=5V
RL=32Ω
AV=4.1dB
V IN =1V
COUT=330µF
SE
-40
-50
-60
Left to Right
-70
-80
-120
Right to Left
20
1k
Crosstalk vs. Frequency
-60
-140
+120
Frequency (Hz)
Crosstalk (dB)
-20
+140
-5
+120
100k 200k
Crosstalk vs. Frequency
6
+160
VDD=5V
RL=32Ω
AV=4.1dB
V IN =1V
SE
Frequency (Hz)
+0
+260
+2
-2
+150
-0
10
Gain (dB)
Gain (dB)
+7
Phase (Degress)
+230
+2
Gain
+3
+240
+3
+280
+4
+250
Phase (Degress)
+270
+10
+300
+5
100
1k
-100
20
10k 20k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
Right to Left
-90
100
1k
10k
20k
Frequency (Hz)
15
www.anpec.com.tw
APA2030/2031
Typical Characteristics (Cont.)
PSRR vs. Frequency
PSRR vs. Frequency
+0
+0
-20
-30
-30
-40
-40
-50
-60
-70
-50
-60
-70
-80
-80
-90
-90
-100
20
100
VDD=5V
RL=32Ω
CB=0.47µF
SE
-10
PSRR (dB)
PSRR (dB)
VDD=5V
-10 RL=4Ω
CB=0.47µF
-20 BTL
1k
-100
20
10k 20k
100
100
100
50
50
Filter BW < 22kHz
20
10
A-Weight
5
VDD=5V
RL=4Ω
2 AV=6dB
BTL
100
1k
10k
Filter BW < 22kHz
20
A-Weight
10
5
VDD=5V
RL=32Ω
AV=4.1dB
SE
2
1
20k
20
100
1k
10k
20k
Frequency (Hz)
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
10k 20k
Output Noise Voltage vs. Frequency
Output Noise Voltage (µV)
Output Noise Voltage (µV)
Output Noise Voltage vs. Frequency
1
20
1k
Frequency (Hz)
Frequency (Hz)
16
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APA2030/2031
Typical Characteristics (Cont.)
Power Dissipation vs. Output Power
Supply Current vs. Supply Voltage
2.0
7
No Load
1.8
BTL
6
VDD=5V
BTL
RL=3Ω
Power Dissipation (W)
Supply Current (mA)
1.6
5
4
SE
3
2
1
1.4
1.2
RL=4Ω
1.0
0.8
0.6
RL=8Ω
0.4
0.2
0.0
0
3.0
3.5
4.0
4.5
5.0
5.5
0.0
6.0
Supply Voltage (V)
0.5
1.0
1.5
2.0
2.5
Output Power (W)
Power Dissipation vs. Output Power
200
VDD =5V
SE
Power Dissipation (mW)
180
160
RL=8Ω
140
120
100
80
RL=16Ω
60
40
RL=32Ω
20
0
0
50
100
150
200
250
300
Output Power (mW)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
17
www.anpec.com.tw
APA2030/2031
Application Descriptions
BTL Operation
Single-Ended Operation (for APA2030 only)
The APA2030/1 has two pairs of operational amplifiers internally, allowed for different amplifier
configurations.
Consider the single-supply SE configuration shown
Application Circuit. A coupling capacitor is required
to block the DC offset voltage from reaching the load.
These capacitors can be quite large (approximately
33µF to 1000µF) so they tend to be expensive, occupy valuable PCB area, and have the additional
drawback of limiting low-frequency performance of
the system (refer to the Output Coupling Capacitor).
IN PU T-
-
IN PU T+
+
OUT+
OP1
V bias
The rules described should be following relationship:
1
Cbypass ×125k Ω
-
DIF F _AM P _CONF IG
OUTOP2
Output SE/BTL Operation (for APA2030 only)
The ability of the APA2030 to easily switch between
BTL and SE modes is one of its most important costs
saving features. This feature eliminates the requirement for an additional headphone amplifier in applications where internal stereo speakers are driven in
BTL mode but external headphone or speakers must
be accommodated.
+
Figure 1: APA2030 internal configuration (each
channel)
The OP1 and OP2 are all differential drive
configuration, The differential drive configuration doubling the voltage swing on the load compare to the
single-ending configuration, the differential gain for
each channel is 2X(Gain of SE mode).
Internal to the APA2030, two separate amplifiers drive
OUT+ and OUT- (see Figure 1). The SE/BTL input
controls the operation of the follower amplifier that
drives LOUT- and ROUT-.
By driving the load differentially through outputs OUT+
and OUT-, an amplifier configuration commonly referred to as bridged mode is established. BTL mode
operation is different from the classical single-ended
SE amplifier configuration where one side of its load
is connected to ground.
•
•
A BTL amplifier design has a few distinct advantages
over the SE configuration, as it provides differential
drive to the load, thus doubling the output swing for a
specified supply voltage. Four times the output power
is possible as compared to a SE amplifier under the
same conditions. A BTL configuration, such as the
one used in APA2030/1, also creates a second advantage over SE amplifiers. Since the differential
outputs, ROUT+, ROUT-, LOUT+, and LOUT-, are biased at half-supply, no need DC voltage exists across
the load. This eliminates the need for an output coupling capacitor which is required in a single supply,
SE configuration.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
≤ R1iCi << R 1C
L C
When SE/BTL is held low, the OP2 is actived
and the APA2030 is in the BTL mode.
When SE/BTL is held high, the OP2 is in a high
output impedance state, which configures the
APA2030 as SE driver from OUT+. IDD is reduced by approximately one-half in SE mode.
Control of the SE/BTL input can be a logic-level TTL
source or a resistor divider network or the stereo headphone jack with switch pin as shown in Application
Circuit.
18
www.anpec.com.tw
(1)
APA2030/2031
Application Descriptions
Vdd
SE/BTL
100K Ω
Control
Pin
1K Ω
the HP/LINE pin, enabling the headphone input
function.
Ring
100K Ω
Differential Input Operation
SE/BTL_Switc h
Tip
APA2030/1 can accepted the differential input signal,
and it’s can improve the CMRR (Common Mode Rejection ratio). For example: when apply differential input signals to APA2031, connect positive input signals to the IN+ (LIN+ and RIN+) of APA2031 and negative input signals to the IN- (LIN- and RIN-) of APA2031.
When input signals are single-end, just connect IN+
(LIN+ and RIN+) to ground via a capacitor.
Sleeve
Headphone Jack
Figure 2: SE/BTL input selection by phonejack plug
In Figure 2, input SE/BTL operates as follows:
When the phonejack plug is inserted, the 1kΩ resistor is disconnected and the SE/BTL input is pulled
high and enables the SE mode. When the input goes
high level, the OUT- amplifier is shutdown causing
the speaker to mute. The OUT+ amplifier then drives
through the output capacitor (CO) into the headphone
jack.
Input Resistance, Ri
The APA2030/1 provides four gain setting decided by
GAIN0 and GAIN1 input ins in Differential mode and it
become 4.1dB fixed gain when SE mode is selected
(for APA2030). In table 1,internal resistors Ri and Rf
according to BTL operation set the gain for each audio input of the APA2030/1.
When there is no headphone plugged into the system,
the contact pin of the headphone jack is connected
from the signal pin, the voltage divider set up by resistors 100kΩ and 1kΩ. Resistor 1kΩ then pulls low
the SE/BTL pin, enabling the BTL function.
Input HP/LINE Operation (for APA2030 only)
APA2030 amplifier has two separate inputs for each of
the left and right stereo channels. An internal multiplexer selects which input will be connected to the
amplifier based on the state of the HP/LINE pin on
the IC.
•
•
To select the line inputs, set HP/LINE pin tied to
low level
To enable the headphone inputs, set HP/ LINE
pin tied to high level
GAIN1
Ri
Rf
SE/BTL
Av
0
0
90KΩ
90KΩ
0
6dB
0
1
69KΩ
111KΩ
0
10dB
1
0
42KΩ
138KΩ
0
15.6dB
1
1
0
21.6dB
X
X
1
4.1dB
25.7KΩ 154.3KΩ
69KΩ
111KΩ
Table 1: The close loop gain setting resistance Ri/Rf
BTL mode operation brings about the factor 2 in the
gain equation due to the inverting amplifier mirroring
the voltage swing across the load. The input resistance has wide variation (+/-10%) caused by
manufacture.
Refer to the application circuit, the voltage divider of
100kΩ and 1kΩ sets the voltage at the HP/LINE pin
to be approximately 50mV when there are no headphones plugged into the system. This logic low voltage at the HP/LINE pin enables the APA2030 and
places it LINE input mode operation.
When a set of headphones is plugged into the system,
the contact pin of the headphone jack is disconnected
from the signal pin, interrupting the voltage divider set
up by resistors 100kΩ. Resistor 100kΩ then pulls-up
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
GAIN0
Input Capacitor, Ci
In the typical application an input capacitor, Ci, is
required to allow the amplifier to bias the input signal
to the proper DC level for optimum operation. In this
case, Ci and the minimum input impedance Ri form a
high-pass filter with the corner frequency determined
in the follow equation:
19
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APA2030/2031
Application Descriptions
fC (highpass)=
1
2πRimin× Ci
To avoid start-up pop noise occurred, the bypass voltage should be rise slower then the input bias voltage
and the relationship shown in equation should be
maintained.
(2)
The value of Ci is important to consider as it directly
affects the low frequency performance of the circuit.
Consider the example where Ri is 90kΩ when 6dB
gain is setting and the specification calls for a flat
bass response down to 40Hz . Equation is reconfigured
as follow:
Ci=
1
2πRifc
1
Cbypass × 125kȍ
<<
1
Ci × 180k ȍ
The capacitor is fed from a 125kΩ source inside the
amplifier. Bypass capacitor, Cb, values of 3.3µF to
10µF ceramic or tantalum low-ESR capacitors are
recommended for the best THD and noise performance.
(3)
Consider to input resistance variation, the Ci is 0.04µF
so one would likely choose a value in the range of
0.1µF to 1.0µF.
The bypass capacitance also effect to the start up
time. It is determined in the follow equation:
Tstart up =5x(Cbypassx125kΩ)
A further consideration for this capacitor is the leakage path from the input source through the input network (Ri+Rf, Ci) to the load. This leakage current
creates a DC offset voltage at the input to the amplifier that reduces useful headroom, especially in high
gain applications. For this reason a low-leakage tantalum or ceramic capacitor is the best choice. When
polarized capacitors are used, the positive side of
the capacitor should face the amplifier input in most
applications as the DC level there is held at VDD/2,
which is likely higher that the source DC level. Please
note that it is important to confirm the capacitor polarity in the application.
(5)
Output Coupling Capacitor, Cc (for APA2030
only)
In the typical single-supply SE configuration, an output coupling capacitor (Cc) is required to block the
DC bias at the output of the amplifier thus preventing
DC currents in the load. As with the input coupling
capacitor, the output coupling capacitor and impedance of the load form a high-pass filter governed by
equation.
fc(highpass)=
Effective Bypass Capacitor, Cbypass
As with any power amplifier, proper supply bypassing is critical for low noise performance and high
power supply rejection.
1
2 πRLCC
(6)
For example, a 330µF capacitor with an 8Ω speaker
would attenuate low frequencies below 60.6Hz. The
main disadvantage, from a performance standpoint,
is the load impedance is typically small, which drives
the low-frequency corner higher degrading the bass
response. Large values of CC are required to pass
low frequencies into the load.
The capacitor location on both the bypass and power
supply pins should be as close to the device as
possible. The effect of a larger half supply bypass
capacitor is improved PSRR due to increased halfsupply stability. Typical applications employ a 5V regulator with 1.0µF and a 0.1µF bypass capacitors which
aid in supply filtering. This does not eliminate the need
for bypassing the supply nodes of the APA2030/1.
The selection of bypass capacitors, especially Cb, is
thus dependent upon desired PSRR requirements,
click and pop performance.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
(4)
Power Supply Decoupling, Cs
The APA2030/1 is a high-performance CMOS audio
amplifier that requires adequate power supply
decoupling to ensure the output total harmonic distortion (THD) is as low as possible.
20
www.anpec.com.tw
APA2030/2031
Application Descriptions
Power supply decoupling also prevents the oscillations causing by long lead length between the amplifier and the speaker.
The optimum decoupling is achieved by using two different type capacitors that target on different type of
noise on the power supply leads. For higher frequency
transients, spikes, or digital hash on the line, a good
low equivalent-series-resistance(ESR) ceramic
capacitor, typically 0.1µF placed as close as possible
to the device VDD lead works best. For filtering lowerfrequency noise signals, a large aluminum electrolytic
capacitor of 10µF or greater placed near the audio
power amplifier is recommended.
Optimizing Depop Circuitry
Circuitry has been included in the APA2030/1 to minimize the amount of popping noise at power-up and
when coming out of shutdown mode. Popping occurs
whenever a voltage step is applied to the speaker. In
order to eliminate clicks and pops, all capacitors must
be fully discharged before turn-on. Rapid on/off
switching of the device or the shutdown function will
cause the click and pop circuitry. The value of Ci will
also affect turn-on pops. (Refer to Effective Bypass
Capacitance) The bypass voltage rise up should be
slower than input bias voltage. Although the bypass
pin current source cannot be modified, the size of
Cb can be changed to alter the device turn-on time
and the amount of clicks and pops. By increasing the
value of Cb, turn-on pop can be reduced. However,
the tradeoff for using a larger bypass capacitor is to
increase the turn-on time for this device. There is a
linear relationship between the size of Cb and the
turn-on time.
Shutdown Function
In order to reduce power consumption while not in use,
the APA2030/1 contains a shutdown pin to externally
turn off the amplifier bias circuitry. This shutdown feature turns the amplifier off when a logic low is placed
on the SHUTDOWN pin. The trigger point between a
logic high and logic low level is typically 2.0V. It is
best to switch between ground and the supply VDD to
provide maximum device performance.
In a SE(for APA2030) configuration, the output coupling capacitor, CC, is of particular concern. This capacitor discharges through the internal 10kΩ resistors.
Depending on the size of CC, the time constant can
be relatively large. To reduce transients in SE mode,
an external 1kΩ resistor can be placed in parallel
with the internal 10kΩ resistor. The tradeoff for using
this resistor is an increase in quiescent current.
By switching the SHUTDOWN pin to low, the amplifier
enters a low-current state, IDD<50µA. APA2030 is in
shutdown mode, except PC-BEEP detect circuit. On
normal operating, SHUTDOWN pin pull to high level to
keeping the IC out of the shutdown mode. The SHUTDOWN pin should be tied to a definite voltage to avoid
unwanted state changes.
In the most cases, choosing a small value of Ci in the
range of 0.33µF to 1µF, Cb being equal to 0.47µF and
an external 1kΩ resistor should be placed in parallel
with the internal 10kΩ resistor should produce a virtually clickless and popless turn-on.
PC-BEEP Detection ( for APA2030 only)
APA2030 integrates a PCBEEP detect circuit for
NOTEBOOK PC used. When PC-BEEP signal drive
to PCBEEP input pin, and PCBEEP mode is active.
APA2030 will force to BTL mode and the internal gain
fixed as -10dB. The PCBEEP signal becomes the
amplifier input signal and play on the speaker without
coupling capacitor. If the amplifier in the shutdown
mode, it will out of shutdown mode whenever PCBEEP
mode enable. The APA2030 will return to previous
setting when it is out of PC-BEEP mode.
A high gain amplifier intensifies the problem as the
small delta in voltage is multiplied by the gain. So it
is advantageous to use low-gain configurations.
BTL Amplifier Efficiency
An easy-to-use equation to calculate efficiency starts
out as being equal to the ratio of power from the power
supply to the power delivered to the load. The following equations are the basis for calculating amplifier
efficiency.
The input impedance is 100kΩ on PCBEEP input
pin.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
21
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APA2030/2031
Application Descriptions
Efficiency =
PO
A final point to remember about linear amplifiers (either
SE or BTL) is how to manipulate the terms in the efficiency equation to utmost advantage whenpossible.
Note that in equation, VDD is in the dominator. This
indicates that as VDD goes down,efficiency goes up. In
other words, use the efficiency analysis to choose the
correct supply voltage and speaker impedance for the
application.
(7)
PSUP
Where:
PO =
VOrms× VOrms
VOrms =
RL
VP
=
VP × VP
2RL
(8)
2
Power Dissipation
Psup = VDD * IDDAVG =
2VP
Whether the power amplifier is operated in BTL or SE
modes, power dissipation is a major concern. In equation11 states the maximum power dissipation point
for a SE mode operating at a given supply voltage and
driving a specified load.
πRL
Efficiency of a BTL configuration:
PO
PSUP
=(
VP × VP
2RL
) / (VDD x
2VP
πRL
)=
πVP
2
(10)
4VDD
SE mode : PD,MAX =
Table 2 calculates efficiencies for four different output
power levels. Note that the efficiency of the amplifier
is quite low for lower power levels and rises sharply as
power to the load is increased resulting in a nearly flat
internal power dissipation over the normal operating
range. Note that the internal dissipation at full output
power is less than in the half power range. Calculating
the efficiency for a specific system is the key to proper
power supply design. For a stereo 1W audio system
with 8Ω loads and a 5V supply, the maximum draw
on the power supply is almost 3W.
Po (W)
Efficiency (%)
IDD(A)
VPP(V)
PD (W)
0.25
31.25
0.16
2.00
0.55
0.50
47.62
0.21
2.83
0.55
1.00
66.67
0.30
4.00
0.5
1.25
78.13
0.32
4.47
0.35
2π 2RL
(11)
In BTL mode operation, the output voltage swing is
doubled as in SE mode. Thus the maximum power
dissipation point for a BTL mode operating at the same
given conditions is 4 times as in SE mode.
2
4V DD
BTL mode : PD,MAX =
2ʌ2 RL
(12)
Since the APA2030/1 is a dual channel power
amplifier, the maximum internal power dissipation is
2 times that both of equations depending on the mode
of operation. Even with this substantial increase in
power dissipation, the APA2030/1 does not require
extra heatsink. The power dissipation from equation12,
assuming a 5V-power supply and an 8Ω load, must
not be greater than the power dissipation that results
from the equation13:
PD,MAX =
TJ.MAX − TA
θJA
(13)
For TSSOP-24 (APA2030) and TSSOP-20 (APA2031)
package with and without thermal pad, the thermal
resistance (θJA ) is equal to 45 oC/W and 48oC/W,
respectively.
**High peak voltages cause the THD to increase.
Since the maximum junction temperature (TJ,MAX) of
APA2030/1 is 150oC and the ambient temperature (TA)
is defined by the power system design, the maximum
Table 2. Efficiency Vs Output Power in 5V/8Ω BTL
Systems
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
VDD
22
www.anpec.com.tw
APA2030/2031
Application Descriptions
To calculate maximum ambient temperatures, first
consideration is that the numbers from the Power
Dissipation vs. Output Power graphs (page17) are
per channel values, so the dissipation of the IC heat
needs to be doubled for two-channel operation. Given
θJA, the maximum allowable junction temperature (TJ,
), and the total internal dissipation (PD), the maxiMAX
mum ambient temperature can be calculated with the
following equation. The maximum recommended junction temperature for the APA2030/1 is 150°C. The internal dissipation figures are taken from the Power
Dissipation vs. Output Power graphs. (Page17)
power dissipation which the IC package is able to
handle can be obtained from equation13. Once the
power dissipation is greater than the maximum limit
(P D,MAX ), either the supply voltage (V DD ) must
bedecreased, the load impedance (RL) must be increased or the ambient temperature should be
reduced.
Thermal Pad Considerations
The thermal pad must be connected to ground. The
package with thermal pad of the APA2030/1 requires
special attention on thermal design. If the thermal
design issues are not properly addressed, the
APA2030/1 4Ω will go into thermal shutdown when
driving a 4Ω load.
TA,Max = TJ,Max -θϑAPD
(14)
150 - 45(0.8*2) = 78°C (TSSOP-P24)
The thermal pad on the bottom of the APA2030/1
should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the
thermal pad through the copper plane to ambient. If
the copper plane is not on the top surface of the
circuit board, 8 to 10 vias of 13 mil or smaller in
diameter should be used to thermally couple the thermal pad to the bottom plane. For good thermal
conduction, the vias must be plated through and solder filled. The copper plane used to conduct heat
away from the thermal pad should be as large as
practical.
150 - 48(0.8*2) = 73.2°C (TSSOP-P20)
The APA2030/1 is designed with a thermal shutdown
protection that turns the device off when the junction
temperature surpasses 150°C to prevent damaging the
IC.
If the ambient temperature is higher than 25°C, a
larger copper plane or forced-air cooling will be required to keep the APA2030/1 junction temperature
below the thermal shutdown temperature (150°C).
In higher ambient temperature, higher airflow rate and/
or larger copper area will be required to keep the IC
out of thermal shutdown.
Thermal Considerations
Linear power amplifiers dissipate a significant amount
of heat in the package under normal operating
conditions.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
23
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APA2030/2031
Packaging Information
T S S O P / T S S O P -P ( R eference JE D E C R egistration M O -153)
e
N
2x E/2
E1
1
2
3
E
e/2
D
A2
A
(
A1
b
D1
2)
GAUGE
PLANE
S
EXPOSED THERMAL
PAD =ONE
E2
0.25
L
1
(L1)
( 3)
BOTTOM VIEW
(THERMALLY ENHANCED VARIATIONDS ONLY)
D im
A
A1
A2
D
D1
e
E
E1
E2
L
L1
R
R1
S
φ1
φ2
φ3
M illim eters
Inches
M in.
M ax.
1.2
0.00
0.15
0.80
1.05
6.4 (N =20P IN )
6.6 (N =20P IN )
7.7 (N =24P IN )
7.9 (N =24P IN )
9.6 (N =28P IN )
9.8 (N =28P IN )
4.2 B S C (N =20P IN )
4.7 B S C (N =24P IN )
3.8 B S C (N =28P IN )
0.65 B S C
6.40 B S C
4.30
4.50
3.0 B S C (N =20P IN )
3.2 B S C (N =24P IN )
2.8 B S C (N =28P IN )
0.45
0.75
1.0 R E F
0.09
0.09
0.2
0°
8°
12° R E F
12° R E F
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
24
M in.
M ax.
0.047
0.000
0.006
0.031
0.041
0.252 (N =20P IN ) 0.260 (N =20P IN )
0.303 (N =24P IN ) 0.311 (N =24P IN )
0.378 (N =28P IN ) 0.386 (N =28P IN )
0.165 B S C (N =20P IN )
0.188 B S C (N =24P IN )
0.150 B S C (N =28P IN )
0.026 B S C
0.252 B S C
0.169
0.177
0.118 B S C (N =20P IN )
0.127 B S C (N =24P IN )
0.110 B S C (N =28P IN )
0.018
0.030
0.039R E F
0.004
0.00 4
0.008
0°
8°
12° R E F
12° R E F
www.anpec.com.tw
APA2030/2031
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical =one
T L to T P
Temperature
Ram p-up
TL
tL
Tsm ax
Tsm in
Ram p-down
ts
Preheat
25
t 25 °C to Peak
Tim e
Classificatin Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Average ramp-up rate
3°C/second max.
(TL to TP)
Preheat
Temperature Min (Tsmin)
100°C
Temperature Mix (Tsmax)
150°C
Time (min to max)(ts)
60-120 seconds
Tsmax to TL
- Ramp-up Rate
Tsmax to TL
Temperature(TL)
183°C
Time (tL)
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
240 +0/-5°C
Time within 5°C of actual Peak
10-30 seconds
10-30 seconds
Temperature(tp)
Ramp-down Rate
6°C/second max.
6 minutes max.
Time 25°C to Peak Temperature
Pb-Free Assembly
Large Body
Small Body
3°C/second max.
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
250 +0/-5°C
10-30 seconds
20-40 seconds
6°C/second max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
25
www.anpec.com.tw
APA2030/2031
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias #125°C
168 Hrs, 100%RH, 121°C
-65°Ca150°C, 200 Cycles
VHBM ! 2KV, VMM ! 200V
10ms, 1tr ! 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
W
Bo
F
Ao
D1
Ko
T2
J
C
A
B
T1
Application
TSSOP- 24
A
B
C
J
T1
T2
W
P
E
330 ±1
100 ref
13 ±0.5
2 ±0.5
16.4 ±0.2
2 ±0.2
16 ±0.3
12 ±0.1
1.75±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
7.5 ±0.1
1.5 +0.1
1.5 min
4.0 ±0.1
2.0 ±0.1
6.9 ±0.1
8.3 ±0.1
1.5 ±0.1
0.3±0.05
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
26
www.anpec.com.tw
APA2030/2031
Cover Tape Dimensions
Application
TSSOP- 24
Carrier Width
16
Cover Tape Width
21.3
Devices Per Reel
2000
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Apr., 2004
27
www.anpec.com.tw