ANPEC APL108533FCTR

APL1085
3A Low Dropout Fast Response Positive Adjustable Regulator and Fixed 3.3V
Features
General Description
•
•
The APL1085 is a low dropout three-terminal adjustable regulator with 3A output current capability. In
order to obtain lower dropout voltage and faster transient response, which is critical for low voltage
applications, the APL1085 has been optimized. The
output available voltage range of adjustable version
is from 1.25~5.75V with an input supply below 7V ,
and the fixed 3.3V output voltage device is also
available.
Fast Transient Response
Guaranteed Dropout Voltage at Multiple Currents
•
•
•
•
•
•
Load Regulation : 0.05% Typ.
Line Regulation : 0.03% Typ.
Low Dropout Voltage : 1.2V Typ. at IOUT =3A
Trimmed Current Limit : 3A Typ. at TJ=125 °C
Current limit is trimmed to ensure specified output
current and controlled short-circuit current. On-chip
thermal limiting provides protection against any combination of overload that would create excessive junction temperatures.
On-Chip Thermal Limiting : 150 °C Typ.
Standard 3-pin TO-220 , TO-252 and TO-263
Power Package
The APL1085 is available in both the through-hole
and surface mount versions of the industry standard
Applications
•
•
•
•
•
Pin Description
PentiumTM Processor Supplies
PowerPC
TM
Supplies
Low Voltage Logic Supplies
TAB is VOUT
Battery-Powered Circuitry
Post Regulator for Switching Power Supply
3
VIN
2
VOUT
1
ADJ
Front View APL1085 TO-220 Package
TA B is V OU T
3
V IN
2
V OUT
1
AD J
Front View APL1085 TO-252 Package
TA B is V OU T
3
V IN
2
V OUT
1
AD J
Front View APL1085 TO-263 Package
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun., 2003
1
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APL1085
Ordering Information
Package C ode
F : T O -2 2 0
U : T O -2 5 2
Tem p. R ange
C : 0 t o 7 0 °C
H a n d li n g C o d e
TU : Tube
V o lt a g e C o d e :
3 3 : 3 .3 V
L e a d F re e C o d e
L : L e a d F r e e D e v ic e
APL1085 L e a d F re e C o d e
H a n d li n g C o d e
Tem p. R ange
Package C ode
V o lt a g e C o d e
AP L1085:
AP L1085
XXXXX
XXXXX
- D a te C o d e
A P L 1 0 8 5 -3 3 :
G : T O -2 6 3
TR : Tape & Reel
B la n k : A d ju s t a b l e V e r s io n
B l a n k : O r ig i n a l D e v ic e
33
AP L1085
XXXXX
XXXXX
- D a te C o d e
Absolute Maximum Ratings
Symbol
VI
TJ
TSTG
TL
Parameter
Input Voltage
Operating Junction Temperature Range
Control Section
Power Transistor
Storage Temperature Range
Lead Temperature (Soldering, 10 second)
Rating
7
0 to 125
0 to 150
-65 to +150
260
Unit
V
°C
°C
°C
Electrical Characteristics
Symbol
VREF
VOUT
REGLINE
REGLOAD
VD
ILIMIT
IADJ
Parameter
Test Conditions
APL1085
Unit
Min.
Typ.
Max.
1.225(-2%) 1.250 1.275(+2%) V
Reference Voltage 1.5V≤(VIN -VOUT) ≤5.75V,
10mA≤ IOUT ≤3A, TJ =0~125°C
Output Voltage
10mA≤ IOUT ≤ 3A, 4.75V≤VIN ≤7V, 3.235(-2%) 3.300 3.365(+2%)
APL1085-3.3 TJ =0~125°C
0.03
0.2
Line Regulation
TJ =0~125°C, (Notes 1)
APL1085 2.75V≤VIN ≤7V, IOUT=10mA,
APL1085-3.3 4.75V≤VIN ≤7V, IOUT=0mA ,
Load Regulation
TJ=25°C, (Notes 1)
APL1085 (VIN -VOUT)=3V, 10mA≤ IOUT ≤ 3A
0.05
0.3
APL1085-3.3 VI N=5V, 0mA≤ IOUT ≤ 3A
0.05
0.5
Dropout Voltage
1.3
1.4
∆VREF=1% ,IOUT=3A ,TJ =0~125°C
Current Limit
4.5
6.0
(VIN -VOUT)=1.7V,
TJ=25°C
3.5
5.0
TJ=125°C
5.0
6.5
TJ=25°C
(VIN -VOUT)=3V,
4.0
5.5
TJ=125°C
60
120
Adjust Pin Current (VIN -VOUT)=3V, IOUT=10mA,
TJ=0∼125°C
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
2
V
%
%
V
A
µA
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APL1085
Electrical Characteristics Cont.
Symbol
Parameter
Test Conditions
Min.
Adjust Pin Current 1.5V≤( VIN -VOUT)≤5.75V,
Change APL1085 10mA≤ IOUT≤ 3A
ILMIN
Minimum Load
1.5V≤( VIN -VOUT)≤5.75V,
Current APL1085 TJ=0∼125°C
IQ
Quiescent Current VI N=5V
APL1085-3.3
PSRR Ripple Rejection
F=120Hz, Cout=22µF, Tant. ,
(VIN -VOUT)=3V, IOUT=3A
LS
Long -Term
TJ =125°C,1000Hrs.
Stability
VN
RMS Output
TJ=25°C,10Hz? F? 10kHz
Noise(% of VOUT)
Control Circuitry/Power
Thermal
θJC
Transistor
Resistance
Junction to Case
∆IADJ
APL1085
Typ.
0.2
Max.
5
Unit
µA
2
10
mA
8
13
mA
60
dB
0.03
1.0
0.003
%
%
0.7/3.0
°C/
W
NOTE 1: See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulations are
measured at a constant junction temperature by low duty cycle pulse testing.
Application Circuits
Typical Regulator
APL1085
VIN (2.75V~7V)
VOUT (1.250V/ 3A)
+
10µ F +
C1
Solid Tantalum
C2*
5V to 3.3V Regulator
APL1085
VIN (5V)
10µ F
C1
+
+
R1
VOUT (3.3V/ 3A)
Solid Tantalum
C2*
R2
*Required for stability
APL1085:C2=10µF
* R1 is typically in range of 100Ω to 120Ω
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
R1/(R1+R2)=1.250V/3.3V
3
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APL1085
Typical Characteristics
Short-Circuit Current vs Temperature
1.5
14
1.4
13
1.3
Shout- Circuit Current (A)
Dropout Voltage (V)
Dropout Voltage vs Output Current
TJ= -50°C
1.2
1.1
1.0
TJ= 25°C
0.9
TJ=0°C
0.8
TJ=125°C
0.7
0.6
0.5
12
11
10
9
8
7
6
VIN-VOUT(SHORT CIRCUIT) =3.3V
5
0
0.10
0.5
1
1.5
2
2.5
4
-50
3
50
100
150
Temperature (°C)
Load Regulation vs Temperature
Reference Voltage vs Temperature
1.275
∆ I =3A
1.270
0.05
1.265
0.0
-0.05
-0.10
-0.15
-0.20
-50
0
Output Current (A)
Reference Voltage (V)
Output Voltage Deviation (%)
VIN-VOUT (SHORT CIRCUIT) =5V
0
50
100
1.255
1.250
1.245
1.240
1.235
1.230
1.225
-50
150
Temperature (°C)
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
1.260
0
50
100
150
Temperature (°C)
4
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APL1085
Typical Characteristics (Cont.)
Minimum Load Current vs Temperature
Adjust Pin Current vs Temperature
100
90
Adjust Pin Current (µA)
Minimum Load Current (mA)
5
4
3
2
1
80
70
60
50
40
30
20
10
0
-50
0
50
100
0
-50
150
0
Temperature (°C)
20
80
18
70
16
14
60
12
50
Power (W)
Ripple Rejection (dB)
150
Maximum Power Dissipation*
90
40
VIN-VOUT = 3V
10
8
6
20
VRIPPLE(p-p) = 1V
4
10
IOUT = 3A
2
0
100
Temperature (°C)
Ripple Rejection vs Frequency
30
50
10
100
1k
10k
100k
0
50
70
90
110
130
150
Case Temperature (°C)
Frequency (Hz)
* as Limited by Maximum Jcnction Temperature
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
5
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APL1085
Package Information
TO-220 ( Reference JEDEC Registration TO-220)
D
R
Q
b
E
e
b1
e1
L1
L
H1
A
c
F
Dim
A
b1
b
c
D
e
e1
E
F
H1
J1
L
L1
R
Q
Millimeters
Min.
3.56
1.14
0.51
0.31
14.23
2.29
4.83
9.65
0.51
5.84
2.03
12.7
3.65
3.53
2.54
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
J1
Inches
Max.
4.83
1.78
1.14
1.14
16.51
2.79
5.33
10.67
1.40
6.86
2.92
14.73
6.35
4.09
3.43
6
Min.
0.140
0.045
0.020
0.012
0.560
0.090
0.190
0.380
0.020
0.230
0.080
0.500
0.143
0.139
0.100
Max.
0.190
0.070
0.045
0.045
0.650
0.110
0.210
0.420
0.055
0.270
0.115
0.580
0.250
0.161
0.135
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APL1085
Package Information
TO-252( Reference JEDEC Registration TO-252)
E
A
b2
C1
L2
D
H
L1
L
b
C
e1
D1
A1
E1
Dim
M illim et er s
Inc he s
M in.
M ax.
M in.
M ax.
A
2. 1 8
2. 3 9
0. 0 86
0. 0 94
A1
0. 8 9
1. 2 7
0. 0 35
0. 0 50
b
0. 5 08
0. 8 9
0. 0 20
0. 0 35
b2
5. 2 07
5. 4 61
0. 2 05
0. 2 15
C
0. 4 6
0. 5 8
0. 0 18
0. 0 23
C1
0. 4 6
0. 5 8
0. 0 18
0. 0 23
D
5. 3 34
6. 2 2
0. 2 10
0. 2 45
D1
E
5. 2 R EF
6. 3 5
E1
0. 2 05 R EF
6. 7 3
0. 2 50
5. 3 R EF
0. 2 65
0. 2 09 R EF
e1
3. 9 6
5. 1 8
0. 1 56
0. 2 04
H
9. 3 98
10 . 41
0. 3 70
0. 4 10
L
0. 5 1
L1
0. 6 4
1. 0 2
0. 0 25
0. 0 40
L2
0. 8 9
2. 0 32
0. 0 35
0. 0 80
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
0. 0 20
7
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APL1085
Package Information
TO-263
E
A
L2
c2
D
L
L1
L3
b2
b
e
c
M illimeters
Dim
A
b
b2
c
c2
D
E
e
L
L1
L2
L3
M in.
4.06
0.51
1.14
1.14
8.64
9.66
14.60
2.24
1.20
0.38 TYP.
2.543 BSC.
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
Inches
M ax.
4.83
0.992
1.399
M in.
0.160
0.02
0.045
1.40
9.65
10.299
0.045
0.340
0.380
15.88
2.84
2.92
1.78
0.575
0.090
0.050
8
0.015 TYP.
0.100 BSC.
M ax.
0.190
0.039
0.055
0.055
0.380
0.405
0.625
0.110
0.115
0.070
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APL1085
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
T L to T P
Temperature
Ram p-up
TL
tL
Tsm ax
Tsm in
Ram p-down
ts
Preheat
25
t 25 °C to Peak
Tim e
Classificatin Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
9
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APL1085
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
3
3
Package Thickness
Volum e m m
Volum e m m
<350
≥ 350
<2.5 m m
240 +0/-5°C
225 +0/-5°C
≥2.5 m m
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
3
3
3
Package Thickness
Volum e mm
Volum e mm
Volum e mm
<350
350-2000
>2000
<1.6 m m
260 +0°C*
260 +0°C*
260 +0°C*
1.6 m m – 2.5 m m
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 m m
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and
including the stated classification tem perature (this m eans Peak reflow tem perature +0°C.
For exam ple 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1 tr > 100mA
Carrier Tape & Reel Dimension
t
E
D
P
Po
P1
W
Bo
F
Ao
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
D1
10
Ko
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APL1085
Carrier Tape & Reel Dimension(Cont.)
T2
J
C
A
B
T1
Application
TO-252
Application
TO-263
A
B
C
J
T1
T2
16.4 + 0.3 2.5± 0.5
-0.2
330 ±3
100 ± 2
13 ± 0. 5
2 ± 0.5
F
D
D1
Po
P1
7.5 ± 0.1
1.5 +0.1
1.5± 0.25
4.0 ± 0.1
2.0 ± 0.1
A
B
C
J
T1
T2
380±3
80 ± 2
13 ± 0. 5
2 ± 0.5
24 ± 4
F
D
D1
Po
P1
11.5 ± 0.1
1.5 +0.1
1.5± 0.25
4.0 ± 0.1
Ao
W
16+ 0.3
- 0.1
P
E
8 ± 0.1
1.75± 0.1
Bo
Ko
t
6.8 ± 0.1 10.4± 0.1 2.5± 0.1
0.3±0.05
P
E
2± 0.3
W
24 + 0.3
- 0.1
16 ± 0.1
1.75± 0.1
Ao
Bo
Ko
t
2.0 ± 0.1 10.8 ± 0.1 16.1± 0.1 5.2± 0.1 0.35±0.013
(mm)
Cover Tape Dimensions
Application
TO- 252
TO- 263
Carrier Width
16
24
Cover Tape Width
13.3
21.3
Devices Per Reel
2500
1000
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. B.5 - Jun, 2003
11
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