APL3518/9 USB Power-Distribution Switches General Description Features • • • • • • • • The APL3518/9 series of power switches are designed for USB applications. The 62mΩ N-channel MOSFET 62mΩ High Side MOSFET Wide Supply Voltage Range: 2.7V to 5.5V power switch satisfies the voltage drop requirements of USB specification. Current-Limit and Short-Circuit Protections Over-Temperature Protection The protection features include current-limit protection, short-circuit protection, and over-temperature protection. Fault Indication Output Enable Input The device limits the output current at current limit threshold level. When VOUT drops below 1.5V, the devices limit UL Approved-File No. E328191 Nemko IEC 60950-1:2005(2nd Edition); Am 1:2009 the current to a lower and safe level. The over-temperature protection limits the junction temperature below CB Scheme Certified, No.62377 • TUV IEC 60950-1:2005+A1:2009 and 140oC in case of short circuit or over load conditions. Other features include a deglitched OCB output to indi- EN 60950-1:2006+A11:2009+A1:2010 Certified, No.44 780 11 393954 • cate the fault condition and an enable input to enable or disable the device. Lead Free and Green Devices Available (RoHS Compliant) Simplified Application Circuit 5V Applications • • • USB Port VIN VOUT APL3518A/B/C/D APL3519A/B/C/D USB Controller Notebook and Desktop Computers USB Ports High-Side Power Protection Switches OCB EN/ENB GND ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 1 www.anpec.com.tw APL3518/9 Pin Configurations GND 1 8 VOUT VIN 2 7 VOUT VIN 3 6 VOUT EN 4 5 OCB VOUT 1 OCB 1 OCB 3 EN 3 4 EN SOT-23-5 APL3518A/C (Top View) GND 1 8 VOUT VIN 2 7 VOUT VIN 3 6 VOUT 5 OCB SOP-8/MSOP-8 APL3518B/D (Top View) 5 VOUT GND 2 GND 2 SOP-8/MSOP-8 APL3518A/C (Top View) ENB 4 5 VIN VOUT 1 4 VIN SOT-23-5 APL3519A/C (Top View) 5 VIN GND 2 OCB 1 5 VOUT GND 2 OCB 3 4 ENB ENB 3 SOT-23-5 APL3518B/D (Top View) 4 VIN SOT-23-5 APL3519B/D (Top View) Ordering and Marking Information Package Code K : SOP-8 X : MSOP-8 B : SOT-23-5 Operating Ambient Temperature Range Assembly Material I : -40 to 85 oC Handling Code Handling Code TR : Tape & Reel Temperature Range Output Current/EN Function Package Code A : 2A/Active High B : 2A/Active Low C : 1A/Active High Output Current/EN Function D : 1A/Active Low Assembly Material G : Halogen and Lead Free Device APL3518 APL3519 APL3518A K: APL3518A XXXXX XXXXX - Date Code APL3518A X: L518A XXX XX XXXXX - Date Code APL3518A B: L8AX X - Date Code APL3519A B: L9AX X - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 2 www.anpec.com.tw APL3518/9 Absolute Maximum Ratings Symbol VIN VOUT VENB, VEN VOCB TJ (Note 1) Parameter Rating Unit VIN Input Voltage (VIN to GND) -0.3 ~ 7 V VOUT to GND Voltage -0.3 ~ 7 V EN, ENB to GND Voltage -0.3 ~ 7 V OCB to GND Voltage -0.3 ~ 7 Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds V 150 o -65 ~ 150 o 260 o C C C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Junction-to-Ambient Resistance in Free Air Typical Value Unit (Note 2) SOP-8 MSOP-8 SOT-23-5 θJA 160 160 235 o C/W Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions (Note 3) Symbol VIN IOUT TA TJ Parameter VIN Input Voltage Range Unit 2.7 ~ 5.5 V OUT Output Current (APL3518A/B, APL3519A/B) 0 ~2 OUT Output Current (APL3518C/D, APL3519C/D) 0 ~1 Ambient Temperature Junction Temperature A -40 ~ 85 o -40 ~ 125 o C C Note 3 : Refer to the typical application circuit Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 3 www.anpec.com.tw APL3518/9 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. Symbol Parameter APL3518/9 Test Conditions Unit Min. Typ. Max. No load, VEN=0V or VENB=5V - - 1 µA SUPPLY CURRENT VIN Supply Current No load, VEN=5V or VENB=0V - 60 100 µA Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 µA Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V or VENB=5V - - 1 µA APL3518A/B/C/D, APL3519A/B/C/D, IOUT=1A, TA= 25 oC - 62 78 mΩ 1.7 - 2.65 V - 0.2 - V APL3518A/B, APL3519A/B, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC 2.1 2.5 3.6 A APL3518C/D, APL3519C/D, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC 1.1 1.5 2.1 A APL3518A/B, APL3519A/B, VIN=2.7V to 5.5V - 1.5 - A APL3518C/D, APL3519C/D, VIN=2.7V to 5.5V - 0.8 - A V POWER SWITCH RDS(ON) Power Switch On Resistance UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN rising, TA= -40 ~ 85 oC VIN UVLO Hysteresis CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM ISHORT Current Limit Threshold Short-Circuit Output Current OCB OUTPUT PIN IOCB=5mA - 0.2 0.4 OCB Leakage Current VOCB=5V - - 1 µA OCB Deglitch Time OCB assertion, TA= -40 ~ 85 oC 5 12 20 ms OCB Output Low Voltage tD(OCB) EN OR ENB INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 2 - - V VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V - - 1 µA Input Current - 40 - Ω tD(ON) Turn On Delay Time - 30 - µs tD(OFF) Turn Off Delay Time - 30 - µs No load, COUT=1µF, VIN=5V - 400 - µs TJ rising - 140 - °C - 20 - °C VOUT Discharge Resistance tSS Soft-Start Time VEN=0V or VENB=5V, VOUT=1V OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 4 www.anpec.com.tw APL3518/9 Typical Operating Characteristics Switch On Resistance vs. Ambient Temperature 120 Switch On Resistance , RDS(on) (mΩ) Switch On Resistance , RDS(on) (mΩ) 120 110 100 90 80 70 60 50 40 VIN =5V, IOUT =1A 0 50 Ambient Temperature 90 80 70 60 50 40 2.5 3.0 4.0 4.5 5.0 5.5 Supply Current vs. Input Voltage 60 55 Supply Current, ICC (µA) 60 40 20 0 50 45 40 35 30 25 VIN =5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic -50 50 100 20 150 RLOAD = Open, CIN =COUT =33µF/Electrolytic, TA=25oC 2.5 3.0 Junction Temperature (oC) Junction Temperature 2.0 1.5 APL3518C/D, APL3519C/D 1.0 0.5 VIN =5V 0.0 -50 50 100 Junction Temperature Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 5.0 5.5 2.6 APL3518A/B, APL3519A/B 2.4 2.2 2.0 1.8 1.6 APL3518C/D, APL3519C/D 1.4 1.2 TA =25oC 1.0 0 4.5 Input Voltage 2.8 APL3518A/B, APL3519A/B 2.5 4.0 Current Limit Threshold vs. Current Limit Threshold, ILIM (Α) 3.0 3.5 Input Voltage (V) Current Limit Threshold vs. Current Limit Threshold, ILIM (A) 3.5 Input Voltage (V) ( oC) 80 0 100 150 Supply Current vs. Junction Temperature 100 Supply Current, ICC (µA) 100 IOUT =1A, TA=25oC 110 30 30 -50 Switch On Resistance vs. Input Voltage 150 2.5 (oC) 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) 5 www.anpec.com.tw APL3518/9 Typical Operating Characteristics (Cont.) Current-Limit Response vs. Output Peak Current 500 350 300 250 200 150 100 50 0 0 1 2 3 4 5 6 7 8 APL3518C/D, APL3519C/D, VIN = 5V, TA=25oC 450 Current-Limit Response (µs) 400 Output Peak Current 500 APL3518A/B, APL3519A/B, VIN = 5V, TA=25oC 450 Current-Limit Response (µs) Current-Limit Response vs. 400 350 300 250 200 150 100 50 0 9 10 0 1 EN pin Threshold Voltage, VEN (V) 1.2 1.0 APL3518C/D, APL3519C/D 0.6 0.4 0.2 VIN = 5V,RLOAD =0.5Ω, TA=25℃ 0 2.5 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 3.0 3.5 4.0 4.5 5.0 6 7 8 9 2.0 EN Rising 1.5 EN Falling 1.0 -50 0 50 100 Input Voltage (V) EN pin Threshold Voltage vs. Input Voltage Turn-Off Leakage Current vs. 4.0 EN Falling VIN =5V, RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic, TA=25oC 3.0 3.5 4.0 4.5 5.0 3.5 150 Junction Temperature VIN =5V, Shutdown mode, RLOAD =0Ω, CIN = COUT =33µF/Elctrolytic 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 5.5 0 50 100 150 Junction Temperature ( C) o Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 10 RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic Junction Temperature ( oC) EN Rising 2.5 5 2.5 0.5 5.5 Turn-Off Leakage Current, ILEAK (µA) Short-Circuit Output Current, ISHORT (A) EN pin Threshold Voltage, VEN (V) APL3518A/B, APL3519A/B 0.8 4 EN pin Threshold Voltage vs. Junction Temperature 3.0 1.6 1.4 3 Output Peak Current (A) Output Peak Current (A) Short-Circuit Output Current vs. Input Voltage 1.8 2 6 www.anpec.com.tw APL3518/9 Typical Operating Characteristics (Cont.) 18 18 17 17 OCB Deglitch Time , TD(OCB) (ms) OCB Deglitch Time , TD(OCB) (ms) OCB Deglitch Time vs. Junction Temperature 16 15 14 13 12 11 RLOAD =1Ω, CIN = COUT =33µF/Elctrolytic 10 16 15 14 13 12 11 0 9 50 100 Junction Temperature RLOAD =1Ω, CIN = COUT =33µF/Elctrolytic 10 9 -50 OCB Deglitch Time vs. Input Voltage 150 2.5 Turn-Off Falling Time, tF (µs) UVLO Threshold Voltage, VUVLO (V) UVLO Rising 2.4 UVLO Falling 1.6 0.8 ILOAD =15mA, CIN = COUT =33µF/Elctrolytic -50 0 50 100 100 50 -50 Turn-On Rising Time vs. Junction Temperature 300 200 100 0 50 Junction Temperature Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 100 50 100 150 Switch Off Supply Current vs. Junction Temperature 4.0 VIN = 5V, RLOAD =30Ω, CIN = 33µF/Elctrolytic, COUT =1µF/X7R 400 -50 0 Junction Temperature (oC) 500 0 5.5 150 0 150 Switch Off Supply Current, ICC(off)(µA) Turn-On Rising Time, tR (µs) 600 5.0 VIN = 5V, RLOAD =30Ω, CIN = 33µF/Elctrolytic, COUT =1µF/X7R Junction Temperature ( oC) 700 4.5 Junction Temperature 200 2.8 1.2 4.0 Turn-Off Falling Time vs. Junction Temperature 2.0 3.5 Input Voltage (V) UVLO Threshold Voltage vs. 3.2 3.0 (oC) 150 (oC) VIN = 5V, RLOAD = Open, CIN = COUT =33µF/Elctrolytic 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 0 50 100 Junction Temperature 7 150 ( oC) www.anpec.com.tw APL3518/9 Typical Operating Characteristics (Cont.) Output Voltage vs. Output Current 6 6 5 5 Output Voltage, VOUT (V) Output Voltage, VOUT (V) Output Voltage vs. Output Current 4 3 APL3518A/B, APL3519A/B, VIN = 5V, TA=25oC 2 1 0 4 3 APL3518C/D, APL3519C/D, VIN = 5V, TA=25oC 2 1 0 0.5 1 1.5 2 2.5 3 0 3.5 0.5 1 1.5 2 2.5 Output Current (A) Output Current (A) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 0 8 www.anpec.com.tw APL3518/9 Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. Turn On Response Turn Off Response VENB 1 1 V ENB V OUT VOUT 2 2 VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 200µs/Div CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 100µs/Div UVLO at Rising UVLO at Falling VIN V OUT VIN 1 1 VOUT 2 2 VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic VIN =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME:2ms/Div CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME:5ms/Div Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 9 www.anpec.com.tw APL3518/9 Operating Waveforms (Cont.) The test condition is VIN=5V, TA= 25oC unless otherwise specified. OCB Response during Short Circuit OCB Response with Ramped Load VOCB 1 VE N VOUT 1 VOCB 2 2 IOUT 3 I OUT 3 APL3518C, VIN =5V, OUT short to GND, CIN =COUT=33µF/Electrolytic CH1: VEN, 5V/Div, DC CH2: VOCB, 5V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div APL3518C, VIN =5V, C IN =COUT=33µF/Electrolytic CH1: VOCB, 5V/Div, DC CH2: V OUT, 2V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div Short Circuit Response Load Transient Response VOUT VIN VOUT 1 2 1 I OUT 3 IOUT 2 APL3518A, VIN =5V, RLOAD =1kΩ to 2.2Ω, CIN =COUT=33µF/Electrolytic CH1: VOUT, 1V/Div, DC CH2: IOUT, 1A/Div, DC TIME: 1ms/Div APL3518C, VIN =5V, OUT Short to GND, CIN =33µF/Electrolytic, No COUT CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 5A/Div, DC TIME: 50µs/Div Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 10 www.anpec.com.tw APL3518/9 Pin Description PIN NO. FUNCTION NAME SOT-23-5 SOP-8/ MSOP-8 APL3518 APL3519 1 2 2 GND Ground. 5 4 VIN Power Supply Input. Connect this pin to external DC supply. 2 3 4 5 4 3 EN (A/C) Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be left floating. ENB (B/D) Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB pin cannot be left floating. 3 1 OCB Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is detected after a 12ms deglitch time. 1 5 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor. 6 7 8 Block Diagram VIN VOUT UVLO Charge Pump EN/ ENB Short-Circuit Protection Current Limit Gate Driver and Control Logic OCB GND OTP Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 11 www.anpec.com.tw APL3518/9 Typical Application Circuit 3.3V USB Port 5V CIN 50kΩ 1µF USB Controller VIN VOUT APL3518A/B/C/D APL3519A/B/C/D OCB CBYP COUT 0.1µF 150µF VBUS D+ DGND EN/ENB GND Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 12 www.anpec.com.tw APL3518/9 Function Description VIN Under-Voltage Lockout (UVLO) compatible with both TTL and CMOS logic levels. The The APL3518/9 series of power switches have a built-in EN/ENB pin cannot be left floating. under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. The UVLO Over-Temperature Protection When the junction temperature exceeds 140oC, the inter- circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When nal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junc- input voltage exceeds the UVLO threshold, the output tion temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed voltage starts a soft-start to reduce the inrush current. Power Switch The power switch is an N-channel MOSFET with a low output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a cur- over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC. rent flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection The APL3518/9 series of power switches provide the current-limit protection function. During current-limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current-limit for extended period. Short-Circuit Protection When the output voltage drops below 1.5V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will enter the thermal shutdown. OCB Output The APL3158/9 series of power switches provide an open-drain output to indicate that a fault has occurred. When any of current-limit or over-temperature protection occurs for a deglitch time of tD(OCB), the OCB goes low. Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB above 2V or EN below 0.8V will disable the device, and pull ENB pin below 0.8V or EN above 2V will enable the device. When the IC is disabled, the supply current is reduced to less than 1µA. The enable input is Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 13 www.anpec.com.tw APL3518/9 Application Information Input Capacitor A 1µF ceramic bypass capacitor from VIN to GND, located near the APL3518/9, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Output Capacitor A low-ESR 150µF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to reduce the voltage drop during hot-attachment of downstream peripheral. (Per USB 2.0, output ports must have a minimum 120µF of low-ESR bulk capacitance per hub). Higher-value output capacitor is better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves the immunity of the device to short-circuit transients. Layout Consideration The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling highfrequency ripples. 3. Locate APL3518/9 and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUT traces as wide and short as possible. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 14 www.anpec.com.tw APL3518/9 Package Information SOP-8 D E E1 SEE VIEW A h X 45 ° c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 INCHES MILLIMETERS MIN. MAX. MIN. MAX. 1.75 A 0.069 0.010 0.004 0.25 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0° 8° 0° 8° Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 15 www.anpec.com.tw APL3518/9 Package Information MSOP-8 D b 0.25 A A1 A2 c L GAUGE PLANE SEATING PLANE 0 e E E1 SEE VIEW A VIEW A S Y M B O L MSOP-8 MILLIMETERS MIN. INCHES MIN. MAX. A MAX. 0.043 1.10 0.00 0.15 0.000 0.006 A2 0.75 0.95 0.030 0.037 b 0.22 0.38 0.009 0.015 c 0.08 0.23 0.003 0.009 A1 D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 e 0.65 BSC 0.122 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 16 www.anpec.com.tw APL3518/9 Package Information SOT-23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. MAX. 0.057 1.45 0.000 0.006 1.30 0.035 0.051 0.50 0.012 0.020 0.22 0.003 0.009 0.122 0.118 0.00 0.15 A2 0.90 b 0.30 c 0.08 A1 MIN. MAX. A D 2.70 3.10 0.106 E 2.60 3.00 0.102 E1 1.40 1.80 0.055 e 0.95 BSC e1 0.071 0.037 BSC 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 17 www.anpec.com.tw APL3518/9 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOP-8 Application MSOP-8 Application SOT-23-5 A H T1 C d D 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.40±0.20 5.20±0.20 2.10±0.20 T1 C d D W E1 F 1.5 MIN. 20.2 MIN. 4.0±0.10 8.0±0.10 A H 330.0±2.00 50 MIN. P0 P1 12.4+2.00 13.0+0.50 -0.00 -0.20 W E1 12.0±0.30 1.75±0.10 12.0±0.30 1.75±0.10 F 5.5±0.05 5.5±0.05 P2 D0 D1 T A0 B0 K0 2.00±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 5.30±0.20 3.30±0.20 1.40±0.20 4.00±0.10 8.00±0.10 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 4.0±0.10 4.0±0.10 (mm) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 18 www.anpec.com.tw APL3518/9 Devices Per Unit Package Type Unit Quantity SOP-8 Tape & Reel 2500 MSOP-8 Tape & Reel 3000 SOT-23-5 Tape & Reel 3000 Taping Direction Information SOP-8 USER DIRECTION OF FEED MSOP-8 USER DIRECTION OF FEED SOT-23-5 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 19 www.anpec.com.tw APL3518/9 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3 °C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 20 www.anpec.com.tw APL3518/9 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2011 21 www.anpec.com.tw