APT10M09B2VFR APT10M09LVFR 100V POWER MOS V® FREDFET 100A 0.009Ω B2VFR T-MAX™ Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V® also achieves faster switching speeds through optimized gate layout. TO-264 LVFR • T-MAX™ or TO-264 Package • Avalanche Energy Rated • Faster Switching • FAST RECOVERY BODY DIODE D G • Lower Leakage S MAXIMUM RATINGS Symbol VDSS ID All Ratings: TC = 25°C unless otherwise specified. Parameter APT10M09B2VFR_LVFR UNIT 100 Volts Drain-Source Voltage Continuous Drain Current 6 100 @ TC = 25°C Amps IDM Pulsed Drain Current VGS Gate-Source Voltage Continuous ±30 VGSM Gate-Source Voltage Transient ±40 Total Power Dissipation @ TC = 25°C 625 Watts Linear Derating Factor 5.00 W/°C PD TJ,TSTG 1 400 Operating and Storage Junction Temperature Range TL Lead Temperature: 0.063" from Case for 10 Sec. IAR Avalanche Current EAR EAS 1 -55 to 150 Amps 100 1 Single Pulse Avalanche Energy °C 300 (Repetitive and Non-Repetitive) Repetitive Avalanche Energy Volts 50 4 mJ 3000 STATIC ELECTRICAL CHARACTERISTICS MIN BVDSS Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA) 100 RDS(on) Drain-Source On-State Resistance IDSS IGSS VGS(th) 2 (VGS = 10V, ID = 50A) TYP MAX Volts 0.009 Zero Gate Voltage Drain Current (VDS = 100V, VGS = 0V) 100 Zero Gate Voltage Drain Current (VDS = 80V, VGS = 0V, TC = 125°C) 500 Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) Gate Threshold Voltage (VDS = VGS, ID = 2.5mA) 2 Ohms µA ±100 nA 4 Volts CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com UNIT 5-2004 Characteristic / Test Conditions 050-5905 Rev A Symbol APT10M09B2VFR_LVFR DYNAMIC CHARACTERISTICS Symbol Characteristic Test Conditions MIN TYP Ciss Input Capacitance Coss VGS = 0V Output Capacitance VDS = 25V 3940 Reverse Transfer Capacitance f = 1 MHz 1470 3 VGS = 10V 350 Gate-Source Charge VDD = 50V 60 ID = 100A @ 25°C 180 VGS = 15V 18 Crss Qg Total Gate Charge Qgs Qgd Gate-Drain ("Miller") Charge td(on) Turn-on Delay Time tr Rise Time td(off) Turn-off Delay Time tf Fall Time MAX UNIT 9875 VDD = 50V 36 ID = 100A @ 25°C 50 RG = 0.6Ω 9 pF nC ns SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol IS ISM Characteristic / Test Conditions MIN TYP MAX 100 Continuous Source Current (Body Diode) UNIT Amps Pulsed Source Current 1 (Body Diode) 400 VSD Diode Forward Voltage 2 (VGS = 0V, IS = -100A) 1.3 Volts dv/ Peak Diode Recovery 8 V/ns dt dv/ dt 5 t rr Reverse Recovery Time (IS = -100A, di/dt = 100A/µs) Tj = 25°C 190 Tj = 125°C 370 Q rr Reverse Recovery Charge (IS = -100A, di/dt = 100A/µs) Tj = 25°C 0.4 Tj = 125°C 1.7 IRRM Peak Recovery Current (IS = -100A, di/dt = 100A/µs) Tj = 25°C 9 Tj = 125°C 15 ns µC Amps THERMAL CHARACTERISTICS Symbol Characteristic MIN TYP MAX 0.20 RθJC Junction to Case RθJA Junction to Ambient 40 1 Repetitive Rating: Pulse width limited by maximum junction temperature 2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471 0.9 0.7 0.5 0.10 Note: PDM Z JC, THERMAL IMPEDANCE (°C/W) θ 050-5905 Rev A 5-2004 0.25 0.15 0.3 0.1 0 t1 t2 0.05 10-5 Duty Factor D = t1/t2 SINGLE PULSE 0.05 10-4 10-3 °C/W 4 Starting T = +25°C, L = 0.60mH, R = 25Ω, Peak I = 100A j G L 5 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS ≤ -ID100A di/dt ≤ 200A/µs VR ≤100V TJ ≤ 150°C 6 The maximum current is limited by lead temperature. APT Reserves the right to change, without notice, the specifications and information contained herein. 0.20 UNIT Peak TJ = PDM x ZθJC + TC 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 1.0 Typical Performance Curves VGS =15V, 10V, & 9V 0.0302 Power (watts) 0.0729 0.0955 0.00809F 0.0182F 0.264F ID, DRAIN CURRENT (AMPERES) RC MODEL Junction temp. (°C) APT10M09B2VFR_LVFR 350 300 8V 250 200 7V 150 6V 100 50 5V Case temperature. (°C) 0 120 1.40 80 60 TJ = -55°C 40 TJ = +25°C 20 0 1 2 3 4 5 6 7 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) FIGURE 4, TRANSFER CHARACTERISTICS BVDSS, DRAIN-TO-SOURCE BREAKDOWN VOLTAGE (NORMALIZED) ID, DRAIN CURRENT (AMPERES) 80 60 40 20 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE 1.10 1.00 VGS=10V VGS=20V 0.90 0.80 0 40 80 120 160 200 ID, DRAIN CURRENT (AMPERES) FIGURE 5, RDS(ON) vs DRAIN CURRENT 1.10 1.05 1.00 0.95 0.90 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE 1.2 2.00 I V D = 50A GS = 10V VGS(TH), THRESHOLD VOLTAGE (NORMALIZED) RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE (NORMALIZED) 1.20 1.15 100 1.75 GS 1.30 1.50 1.25 1.00 0.75 0.50 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 8, ON-RESISTANCE vs. TEMPERATURE 1.1 1.0 0.9 0.8 5-2004 0 TJ = +125°C NORMALIZED TO = 10V @ 50A V 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE 050-5905 Rev A ID, DRAIN CURRENT (AMPERES) 100 RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS VDS> ID (ON) x RDS (ON)MAX. 250 µSEC. PULSE TEST @ <0.5 % DUTY CYCLE 0 APT10M09B2VFR_LVFR 30,000 400 50 1mS 10 10mS 5 Crss 1,000 100 1 10 100 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 10, MAXIMUM SAFE OPERATING AREA 0 10 20 30 40 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE 16 I D IDR, REVERSE DRAIN CURRENT (AMPERES) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) Coss TC =+25°C TJ =+150°C SINGLE PULSE 1 = 100A 12 VDS = 20V 8 VDS = 50V VDS = 80V 4 0 Ciss 10,000 100µS 100 C, CAPACITANCE (pF) ID, DRAIN CURRENT (AMPERES) OPERATION HERE LIMITED BY RDS (ON) 0 100 200 300 400 500 Qg, TOTAL GATE CHARGE (nC) FIGURE 12, GATE CHARGE vs GATE-TO-SOURCE VOLTAGE T-MAXTM (B2) Package Outline (B2VFR) 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 200 100 TJ =+150°C TJ =+25°C 10 1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE TO-264 (L) Package Outline (LVFR) 4.60 (.181) 5.21 (.205) 1.80 (.071) 2.01 (.079) 15.49 (.610) 16.26 (.640) 19.51 (.768) 20.50 (.807) 3.10 (.122) 3.48 (.137) 5.38 (.212) 6.20 (.244) 5.79 (.228) 6.20 (.244) Drain Drain 20.80 (.819) 21.46 (.845) 050-5905 Rev A 5-2004 4.50 (.177) Max. 0.40 (.016) 0.79 (.031) 19.81 (.780) 20.32 (.800) 25.48 (1.003) 26.49 (1.043) 2.87 (.113) 3.12 (.123) 2.29 (.090) 2.69 (.106) 1.65 (.065) 2.13 (.084) 1.01 (.040) 1.40 (.055) 19.81 (.780) 21.39 (.842) Gate Drain 5.45 (.215) BSC 2-Plcs. These dimensions are equal to the TO-247 without the mounting hole. Dimensions in Millimeters and (Inches) Gate Drain Source Source 2.21 (.087) 2.59 (.102) 2.29 (.090) 2.69 (.106) 0.48 (.019) 0.84 (.033) 2.59 (.102) 3.00 (.118) 0.76 (.030) 1.30 (.051) 2.79 (.110) 3.18 (.125) 5.45 (.215) BSC 2-Plcs. Dimensions in Millimeters and (Inches) APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.