Features • Fast Read Access Time – 70 ns • Low Power CMOS Operation • • • • • • • – 100 µA Max Standby – 30 mA Max Active at 5 MHz JEDEC Standard Packages – 32-lead PDIP – 32-lead PLCC – 32-lead TSOP 5V ± 10% Supply High Reliability CMOS Technology – 2000V ESD Protection – 200 mA Latchup Immunity Rapid Programming Algorithm – 100 µs/Byte (Typical) CMOS and TTL Compatible Inputs and Outputs Industrial Temperature Range Green (Pb/Halide-free) Packaging Option 4-Megabit (512K x 8) OTP EPROM AT27C040 1. Description The AT27C040 chip is a low-power, high-performance, 4,194,304-bit one-time programmable read-only memory (OTP EPROM) organized as 512K by 8 bits. The AT27C040 requires only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 70 ns, eliminating the need for speed reducing WAIT states on high-performance microprocessor systems. Atmel’s scaled CMOS technology provides low active power consumption, and fast programming. Power consumption is typically 8 mA in active mode and less than 10 µA in standby mode. The AT27C040 is available in a choice of industry-standard JEDEC-approved onetime programmable (OTP) plastic PDIP, PLCC and TSOP packages. The device features two-line control (CE, OE) to eliminate bus contention in high-speed systems. Atmel’s AT27C040 has additional features to ensure high quality and efficient production use. The Rapid Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry-standard programming equipment to select the proper programming algorithms and voltages. 0189H–EPROM–12/07 2. Pin Configurations Pin Name Function A0 - A18 Addresses O0 - O7 Outputs CE Chip Enable OE Output Enable 32-lead PDIP Top View 2.2 A12 A15 A16 VPP VCC A18 A17 VCC A18 A17 A14 A13 A8 A9 A11 OE A10 CE 07 06 05 04 03 A7 A6 A5 A4 A3 A2 A1 A0 O0 4 3 2 1 32 31 30 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 A14 A13 A8 A9 A11 OE A10 CE 07 32-lead TSOP Top View A11 A9 A8 A13 A14 A17 A18 VCC VPP A16 A15 A12 A7 A6 A5 A4 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32-lead PLCC Top View 14 15 16 17 18 19 20 VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 2.3 01 02 GND 03 04 05 06 2.1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE 07 06 05 04 03 GND 02 01 O0 A0 A1 A2 A3 AT27C040 0189H–EPROM–12/07 AT27C040 3. Switching Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. 4. Block Diagram 5. Absolute Maximum Ratings* Temperature Under Bias................................ -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground ............................................-2.0V to +7.0V Voltage on A9 with Respect to Ground .........................................-2.0V to +14.0V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VPP Supply Voltage with Respect to Ground ..........................................-2.0V to +14.0V 3 0189H–EPROM–12/07 6. Operating Modes Mode/Pin CE OE Ai VPP Outputs (1) Read VIL VIL Ai X DOUT Output Disable X VIH X X High Z VIH X X X High Z VIL VIH Ai VPP DIN PGM Verify X VIL Ai VPP DOUT PGM Inhibit VIH VIH X VPP High Z X Identification Code Standby Rapid Program (2) (3) Product Identification(4) Notes: VIL VIL A9 = VH A0 = VIH or VIL A1 - A18 = VIL 1. X can be VIL or VIH. 2. Refer to Programming Characteristics 3. VH = 12.0 ± 0.5V. 4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte. 7. DC and AC Operating Conditions for Read Operation Industrial Operating Temperature (Case) VCC Power Supply AT27C040-70 AT27C040-90 -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 8. DC and Operating Characteristics for Read Operation Symbol Parameter Condition ILI Input Load Current ILO IPP1 (2) Max Units VIN = 0V to VCC ±1 µA Output Leakage Current VOUT = 0V to VCC ±5 µA VPP(1) VPP = VCC 10 µA ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 30 mA Read/Standby Current Min ISB VCC1(1) Standby Current ICC VCC Active Current VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V Output High Voltage IOH = -400 µA VOH Notes: 2.4 V 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP. 4 AT27C040 0189H–EPROM–12/07 AT27C040 9. AC Characteristics for Read Operation AT27C040 -70 Symbol Parameter Condition tACC(1) Address to Output Delay CE = OE = VIL tCE(1) CE to Output Delay tOE(1) OE to Output Delay tDF(1) OE or CE High to Output Float, Whichever Occurred First tOH Output Hold from Address, CE or OE, Whichever Occurred First Note: Min -90 Max Max Units 70 90 ns OE = VIL 70 90 ns CE = VIL 30 35 ns 20 20 ns 0 Min 0 ns 1. See AC Waveforms for Read Operation 10. AC Waveforms for Read Operation(1) Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 5 0189H–EPROM–12/07 11. Input Test Waveforms and Measurement Levels 12. Output Test Load 1.3V (1N914) OUTPUT PIN 3.3K CL 13. Pin Capacitance f = 1 MHz, T = 25° C (1) Symbol Typ Max Units Conditions CIN 4 8 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. AT27C040 0189H–EPROM–12/07 AT27C040 14. Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the AT27C040 a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage transients. 7 0189H–EPROM–12/07 15. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Supply Current VID A9 Product Identification Voltage Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 0.7 V 0.4 V 2.4 V CE = VIL 11.5 40 mA 20 mA 12.5 V Max Units 16. AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Test Conditions(1) Symbol Parameter tAS Address Setup Time tOES OE Setup Time Input Rise and Fall Times: (10% to 90%) 20 ns tDS Data Setup Time tAH Address Hold Time tDH Data Hold Time Input Pulse Levels: tDFP OE High to Output Float Delay tVPS VPP Setup Time tVCS VCC Setup Time tPW CE Program Pulse Width(3) tOE Data Valid from OE(2) tPRT VPP Pulse Rise Time During Programming Notes: Min 2 µs 2 µs 2 µs 0 µs 2 µs 0.45V to 2.4V (2) 0 Input Timing Reference Level: 0.8V to 2.0V 130 2 µs 2 µs 95 Output Timing Reference Level: 0.8V to 2.0V ns 105 µs 150 ns 50 ns 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven – see timing diagram. 3. Program Pulse width tolerance is 100 µsec ± 5%. 17. Atmel’s AT27C040 Integrated Product Identification Code Pins Codes 8 A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E Device Type 1 0 0 0 0 1 0 1 1 0B AT27C040 0189H–EPROM–12/07 AT27C040 18. Rapid Programming Algorithm A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes are read again and compared with the original data to determine if the device passes or fails. 9 0189H–EPROM–12/07 19. Ordering Information 19.1 Standard Package ICC (mA) tACC (ns) Standby Ordering Code Package 32J 32P6 32T Industrial (-40° C to 85° C) 32J 32P6 32T Industrial (-40° C to 85° C) 70 30 0.1 AT27C040-70JI AT27C040-70PI AT27C040-70TI 90 30 0.1 AT27C040-90JI AT27C040-90PI AT27C040-90TI Note: 19.2 Active Operation Range Not recommended for new designs. Use Green package option. Green Package Option (Pb/Halide-free) ICC (mA) tACC (ns) Active Standby Ordering Code Package 32J 32P6 32T Industrial (-40° C to 85° C) 32J 32P6 32T Industrial (-40° C to 85° C) 70 30 0.1 AT27C040-70JU AT27C040-70PU AT27C040-70TU 90 30 0.1 AT27C040-90JU AT27C040-90PU AT27C040-90TU Operation Range Package Type 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32P6 32-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32-lead, Plastic Thin Small Outline Package (TSOP) 10 AT27C040 0189H–EPROM–12/07 AT27C040 20. Package Information 20.1 32J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 E2 B1 E B e A2 D1 A1 D A 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) D2 Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 32J B 11 0189H–EPROM–12/07 20.2 32P6 – PDIP D PIN 1 E1 A SEATING PLANE A1 L B B1 e E 0º ~ 15º C COMMON DIMENSIONS (Unit of Measure = mm) REF MIN NOM MAX A – – 4.826 A1 0.381 – – D 41.783 – 42.291 E 15.240 – 15.875 E1 13.462 – 13.970 B 0.356 – 0.559 B1 1.041 – 1.651 L 3.048 – 3.556 C 0.203 – 0.381 eB 15.494 – 17.526 SYMBOL eB Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). e NOTE Note 1 Note 1 2.540 TYP 09/28/01 R 12 2325 Orchard Parkway San Jose, CA 95131 TITLE 32P6, 32-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP) DRAWING NO. 32P6 REV. B AT27C040 0189H–EPROM–12/07 AT27C040 20.3 32T – TSOP PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 32T B 13 0189H–EPROM–12/07 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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