ATMEL AT28C256E-15PI

Features
• Fast Read Access Time – 150 ns
• Automatic Page Write Operation
•
•
•
•
•
•
•
•
•
•
– Internal Address and Data Latches for 64 Bytes
– Internal Control Timer
Fast Write Cycle Times
– Page Write Cycle Time: 3 ms or 10 ms Maximum
– 1 to 64-byte Page Write Operation
Low Power Dissipation
– 50 mA Active Current
– 200 µA CMOS Standby Current
Hardware and Software Data Protection
DATA Polling for End of Write Detection
High Reliability CMOS Technology
– Endurance: 104 or 105 Cycles
– Data Retention: 10 Years
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-wide Pinout
Full Military and Industrial Temperature Ranges
Green (Pb/Halide-free) Packaging Option
256K (32K x 8)
Paged Parallel
EEPROM
AT28C256
1. Description
The AT28C256 is a high-performance electrically erasable and programmable readonly memory. Its 256K of memory is organized as 32,768 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access
times to 150 ns with power dissipation of just 440 mW. When the device is deselected,
the CMOS standby current is less than 200 µA.
The AT28C256 is accessed like a Static RAM for the read or write cycle without the
need for external components. The device contains a 64-byte page register to allow
writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to
64 bytes of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will automatically write
the latched data using an internal control timer. The end of a write cycle can be
detected by DATA Polling of I/O7. Once the end of a write cycle has been detected a
new access for a read or write can begin.
Atmel’s AT28C256 has additional features to ensure high quality and manufacturability. The device utilizes internal error correction for extended endurance and improved
data retention characteristics. An optional software data protection mechanism is
available to guard against inadvertent writes. The device also includes an extra
64 bytes of EEPROM for device identification or tracking.
0006K–PEEPR–01/08
2. Pin Configurations
Pin Name
Function
A0 - A14
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
DC
Don’t Connect
28-lead PGA Top View
A7
A12
A14
DC
VCC
WE
A13
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A6
A5
A4
A3
A2
A1
A0
NC
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A8
A9
A11
NC
OE
A10
CE
I/O7
I/O6
Note:
PLCC package pins 1 and 17 are Don’t Connect.
2.4
28-lead Cerdip/PDIP/Flatpack/SOIC –
Top View
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
2
4
3
2
1
32
31
30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
32-pad LCC, 28-lead PLCC Top View
14
15
16
17
18
19
20
OE
A11
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
A4
A3
2.2
2.3
28-lead TSOP Top View
I/O1
I/O2
GND
DC
I/O3
I/O4
I/O5
2.1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
AT28C256
0006K–PEEPR–01/08
AT28C256
3. Block Diagram
4. Device Operation
4.1
Read
The AT28C256 is accessed like a Static RAM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the address pins is asserted on the outputs.
The outputs are put in the high impedance state when either CE or OE is high. This dual-line
control gives designers flexibility in preventing bus contention in their system.
4.2
Byte Write
A low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write
cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is
latched by the first rising edge of CE or WE. Once a byte write has been started it will automatically time itself to completion. Once a programming operation has been initiated and for the
duration of tWC, a read operation will effectively be a polling operation.
4.3
Page Write
The page write operation of the AT28C256 allows 1 to 64 bytes of data to be written into the
device during a single internal programming period. A page write operation is initiated in the
same manner as a byte write; the first byte written can then be followed by 1 to 63 additional
bytes. Each successive byte must be written within 150 µs (tBLC) of the previous byte. If the tBLC
limit is exceeded the AT28C256 will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as
defined by the state of the A6 - A14 inputs. For each WE high to low transition during the page
write operation, A6 - A14 must be the same.
The A0 to A5 inputs are used to specify which bytes within the page are to be written. The bytes
may be loaded in any order and may be altered within the same load period. Only bytes which
are specified for writing will be written; unnecessary cycling of other bytes within the page does
not occur.
4.4
DATA Polling
The AT28C256 features DATA Polling to indicate the end of a write cycle. During a byte or page
write cycle an attempted read of the last byte written will result in the complement of the written
data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all
outputs, and the next write cycle may begin. DATA Polling may begin at anytime during the write
cycle.
3
0006K–PEEPR–01/08
4.5
Toggle Bit
In addition to DATA Polling the AT28C256 provides another method for determining the end of a
write cycle. During the write operation, successive attempts to read data from the device will
result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write
cycle.
4.6
Data Protection
If precautions are not taken, inadvertent writes may occur during transitions of the host system
power supply. Atmel has incorporated both hardware and software features that will protect the
memory against inadvertent writes.
4.6.1
Hardware Protection
Hardware features protect against inadvertent writes to the AT28C256 in the following ways: (a)
VCC sense – if VCC is below 3.8V (typical) the write function is inhibited; (b) VCC power-on delay –
once VCC has reached 3.8V the device will automatically time out 5 ms (typical) before allowing
a write; (c) write inhibit – holding any one of OE low, CE high or WE high inhibits write cycles;
and (d) noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a
write cycle.
4.6.2
Software Data Protection
A software controlled data protection feature has been implemented on the AT28C256. When
enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature
may be enabled or disabled by the user; the AT28C256 is shipped from Atmel with SDP
disabled.
SDP is enabled by the host system issuing a series of three write commands; three specific
bytes of data are written to three specific addresses (refer to “Software Data Protection” algorithm). After writing the 3-byte command sequence and after tWC the entire AT28C256 will be
protected against inadvertent write operations. It should be noted, that once protected the host
may still perform a byte or page write to the AT28C256. This is done by preceding the data to be
written by the same 3-byte command sequence used to enable SDP.
Once set, SDP will remain active unless the disable command sequence is issued. Power transitions do not disable SDP and SDP will protect the AT28C256 during power-up and power-down
conditions. All command sequences must conform to the page write timing specifications. The
data in the enable and disable command sequences is not written to the device and the memory
addresses used in the sequence may be written with data in either a byte or page write
operation.
After setting SDP, any attempt to write to the device without the 3-byte command sequence will
start the internal write timers. No data will be written to the device; however, for the duration of
tWC, read operations will effectively be polling operations.
4.7
Device Identification
An extra 64 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12V ± 0.5V and using address locations 7FC0H to 7FFFH the additional bytes may be
written to or read from in the same manner as the regular memory array.
4.8
Optional Chip Erase Mode
The entire device can be erased using a 6-byte software code. Please see “Software Chip
Erase” application note for details.
4
AT28C256
0006K–PEEPR–01/08
AT28C256
5. DC and AC Operating Range
AT28C256-15
AT28C256-20
AT28C256-25
AT28C256-35
Ind.
-40°C - 85°C
Mil.
-55°C - 125°C
-55°C - 125°C
-55°C - 125°C
-55°C - 125°C
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
Operating Temperature
(Case)
VCC Power Supply
6. Operating Modes
Write
(2)
VIL
VIH
VIL
DIN
VIH
X(1)
X
High Z
Write Inhibit
X
X
VIH
Write Inhibit
X
VIL
X
Output Disable
X
VIH
X
High Z
VIL
High Z
Standby/Write Inhibit
Chip Erase
Notes: 1. X can be VIL or VIH.
VIL
VH
(3)
2. Refer to AC programming waveforms.
3. VH = 12.0V ± 0.5V.
7. Absolute Maximum Ratings*
Temperature under Bias ................................ -55°C to +125°C
*NOTICE:
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
Voltage on OE and A9
with Respect to Ground ...................................-0.6V to +13.5V
8. DC Characteristics
Symbol
Parameter
Condition
Max
Units
ILI
Input Load Current
VIN = 0V to VCC + 1V
Min
10
µA
ILO
Output Leakage Current
VI/O = 0V to VCC
10
µA
ISB1
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC + 1V
Ind.
200
µA
Mil.
300
µA
ISB2
VCC Standby Current TTL
CE = 2.0V to VCC + 1V
3
mA
ICC
VCC Active Current
f = 5 MHz; IOUT = 0 mA
50
mA
VIL
Input Low Voltage
0.8
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
VOH
Output High Voltage
IOH = -400 µA
2.0
V
0.45
2.4
V
V
5
0006K–PEEPR–01/08
9. AC Read Characteristics
AT28C256-15
AT28C256-20
AT28C256-25
AT28C256-35
Min
Min
Min
Min
Symbol
Parameter
Max
tACC
Address to Output Delay
150
200
tCE(1)
CE to Output Delay
150
200
tOE(2)
OE to Output Delay
0
70
0
80
0
100
tDF(3)(4)
CE or OE to Output Float
0
50
0
55
0
60
tOH
Output Hold from OE, CE or
Address, whichever occurred first
0
0
Max
0
Max
Max
Units
250
350
ns
250
350
ns
0
100
ns
0
70
ns
0
ns
10. AC Read Waveforms(1)(2)(3)(4)
Notes:
1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
6
AT28C256
0006K–PEEPR–01/08
AT28C256
11. Input Test Waveforms and Measurement Level
tR, tF < 5 ns
12. Output Test Load
13. Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
Typ
Max
Units
CIN
4
6
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
Conditions
1. This parameter is characterized and is not 100% tested.
7
0006K–PEEPR–01/08
14. AC Write Characteristics
Symbol
Parameter
tAS, tOES
Address, OE Setup Time
0
ns
tAH
Address Hold Time
50
ns
tCS
Chip Select Setup Time
0
ns
tCH
Chip Select Hold Time
0
ns
tWP
Write Pulse Width (WE or CE)
100
ns
tDS
Data Setup Time
50
ns
tDH, tOEH
Data, OE Hold Time
0
ns
tDV
Time to Data Valid
Note:
Min
Max
Units
NR(1)
1. NR = No Restriction
15. AC Write Waveforms
15.1
WE Controlled
15.2
CE Controlled
8
AT28C256
0006K–PEEPR–01/08
AT28C256
16. Page Mode Characteristics
Symbol
Parameter
Min
Max
Units
tWC
Write Cycle Time (option available)
AT28C256
10
ms
AT28C256F
3
ms
tAS
Address Setup Time
0
ns
tAH
Address Hold Time
50
ns
tDS
Data Setup Time
50
ns
tDH
Data Hold Time
0
ns
tWP
Write Pulse Width
100
ns
tBLC
Byte Load Cycle Time
tWPH
Write Pulse Width High
150
50
µs
ns
17. Page Mode Write Waveforms(1)(2)
Notes:
1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE).
2. OE must be high only when WE and CE are both low.
18. Chip Erase Waveforms
tS = tH = 5 µsec (min.)
tW = 10 msec (min.)
VH = 12.0V ± 0.5V
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0006K–PEEPR–01/08
19. Software Data Protection
Enable Algorithm(1)
Notes:
20. Software Data Protection
Disable Algorithm(1)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA 80
TO
ADDRESS 5555
WRITES ENABLED(2)
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD DATA AA
TO
ADDRESS 5555
LOAD LAST BYTE
TO
LAST ADDRESS
LOAD DATA 55
TO
ADDRESS 2AAA
ENTER DATA
PROTECT STATE
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write
even if no other data is loaded.
3. Write Protect state will be deactivated at end of write
period even if no other data is loaded.
LOAD DATA 20
TO
ADDRESS 5555
EXIT DATA
PROTECT STATE(3)
LOAD DATA XX
TO
ANY ADDRESS(4)
4. 1 to 64 bytes of data are loaded.
LOAD LAST BYTE
TO
LAST ADDRESS
21. Software Protected Write Cycle Waveforms(1)(2)
Notes:
1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE) after the software
code has been entered.
2. OE must be high only when WE and CE are both low.
10
AT28C256
0006K–PEEPR–01/08
AT28C256
22. Data Polling Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
tOEH
OE Hold Time
Typ
Max
ns
0
ns
OE to Output Delay
tWR
Write Recovery Time
Units
0
(2)
tOE
Notes:
Min
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See“AC Read Characteristics” on page 6.
23. Data Polling Waveforms
24. Toggle Bit Characteristics(1)
Symbol
Parameter
Min
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
tOE
OE to Output Delay(2)
tOEHP
OE High Pulse
tWR
Notes:
Write Recovery Time
Typ
Max
Units
ns
150
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See “AC Read Characteristics” on page 6.
25. Toggle Bit Waveforms(1)(2)(3)
Notes:
1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
11
0006K–PEEPR–01/08
26. Normalized ICC Graphs
12
AT28C256
0006K–PEEPR–01/08
AT28C256
27. Ordering Information(2)
27.1
Standard Package
ICC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
150
50
0.2
AT28C256(E,F)-15JI
AT28C256(E,F)-15PI
AT28C256(E,F)-15SI
AT28C256(E,F)-15TI
32J
28P6
28S
28T
0.3
AT28C256(E,F)-15DM/883
AT28C256(E,F)-15FM/883
AT28C256(E,F)-15LM/883
AT28C256(E,F)-15UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Operation Range
Industrial
(-40° C to 85° C)
200
50
0.3
AT28C256(E,F)-20DM/883
AT28C256(E,F)-20FM/883
AT28C256(E,F)-20LM/883
AT28C256(E,F)-20UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
250
50
0.3
AT28C256(E,F)-25DM/883
AT28C256(E,F)-25FM/883
AT28C256(E,F)-25LM/883
AT28C256(E,F)-25UM/883
AT28C256(E,F)-35UM/883
28D6
28F
32L
28U
28U
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Package Type
28D6
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32L
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28P6
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S
28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28-lead, Plastic Thin Small Outline Package (TSOP)
28U
28-pin, Ceramic Pin Grid Array (PGA)
W
Die
Options
Blank
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E
High Endurance Option: Endurance = 100K Write Cycles
F
Fast Write Option: Write Time = 3 ms
13
0006K–PEEPR–01/08
27.1
Standard Package (Continued)
ICC (mA)
tACC
(ns)
(3)
150
Active
Standby
50
0.3
Ordering Code
Package
Operation Range
5962-88525 16 UX
5962-88525 16 XX
5962-88525 16 YX
5962-88525 16 ZX
28U
28D6
32L
28F
5962-88525 15 UX
5962-88525 15 XX
5962-88525 15 YX
5962-88525 15 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
5962-88525 14 UX
5962-88525 14 XX
5962-88525 14 YX
5962-88525 14 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Package Type
28D6
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32L
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28P6
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28U
28-pin, Ceramic Pin Grid Array (PGA)
W
Die
Options
Blank
14
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E
High Endurance Option: Endurance = 100K Write Cycles
F
Fast Write Option: Write Time = 3 ms
AT28C256
0006K–PEEPR–01/08
AT28C256
27.1
Standard Package (Continued)
tACC
(ns)
ICC (mA)
Active
Standby
50
0.3
(3)
150
200(3)
250(3)
Ordering Code
Package
Operation Range
5962-88525 08 UX
5962-88525 08 XX
5962-88525 08 YX
5962-88525 08 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
5962-88525 07 UX
5962-88525 07 XX
5962-88525 07 YX
5962-88525 07 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
5962-88525 06 UX
5962-88525 06 XX
5962-88525 06 YX
5962-88525 06 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 12 UX
5962-88525 12 XX
5962-88525 12 YX
5962-88525 12 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 04 UX
5962-88525 04 XX
5962-88525 04 YX
5962-88525 04 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 13 UX
5962-88525 13 XX
5962-88525 13 YX
5962-88525 13 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
5962-88525 11 UX
5962-88525 11 XX
5962-88525 11 YX
5962-88525 11 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Package Type
28D6
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32L
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28U
28-pin, Ceramic Pin Grid Array (PGA)
W
Die
Options
Blank
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E
High Endurance Option: Endurance = 100K Write Cycles
F
Fast Write Option: Write Time = 3 ms
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0006K–PEEPR–01/08
27.1
Standard Package (Continued)
ICC (mA)
tACC
(ns)
Active
Standby
250
50
0.3
300
350
Notes:
Ordering Code
Package
Operation Range
5962-88525 05 UX
5962-88525 05 XX
5962-88525 05 YX
5962-88525 05 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
5962-88525 03 UX
5962-88525 03 XX
5962-88525 03 YX
5962-88525 03 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 10 UX
5962-88525 10 XX
5962-88525 10 YX
5962-88525 10 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 02 UX
5962-88525 02 XX
5962-88525 02 YX
5962-88525 02 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 09 UX
5962-88525 09 XX
5962-88525 09 YX
5962-88525 09 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
50
0.3
5962-88525 01 UX
5962-88525 01 XX
5962-88525 01 YX
5962-88525 01 ZX
28U
28D6
32L
28F
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
1. Electrical specifications for these speeds are defined by Standard Microcircuit Drawing 5962-88525.
2. See “Valid Part Numbers” on page 18.
3. SMD specifies Software Data Protection feature for device type, although Atmel product supplied to every device type in the
SMD is 100% tested for this feature.
Package Type
28D6
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32L
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28U
28-pin, Ceramic Pin Grid Array (PGA)
W
Die
Options
Blank
16
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E
High Endurance Option: Endurance = 100K Write Cycles
F
Fast Write Option: Write Time = 3 ms
AT28C256
0006K–PEEPR–01/08
AT28C256
27.2
Green Package Option (Pb/Halide-free)
ICC (mA)
tACC
(ns)
Active
Standby
150
50
0.2
Ordering Code
Package
AT28C256(E, F)-15JU
AT28C256(E, F)-15PU
AT28C256(E, F)-15SU
AT28C256(E, F)-15TU
32J
28P6
28S
28T
Operation Range
Industrial
(-40° C to 85° C)
Package Type
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
28P6
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S
28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28-lead, Plastic Thin Small Outline Package (TSOP)
Options
Blank
F
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
Fast Write Option: Write Time = 3 ms
17
0006K–PEEPR–01/08
28. Valid Part Numbers
The following table lists standard and green Atmel products that can be ordered.
Device Numbers
Speed
Package and Temperature Combinations
AT28C256
15
JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883
AT28C256E
15
JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883
AT28C256F
15
JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883
AT28C256
20
DM/883, FM/883, LM/883, UM/883
AT28C256E
20
DM/883, FM/883, LM/883, UM/883
AT28C256F
20
DM/883, FM/883, LM/883, UM/883
AT28C256
25
DM/883, FM/883, LM/883, UM/883
AT28C256E
25
DM/883, FM/883, LM/883, UM/883
AT28C256F
25
DM/883, FM/883, LM/883, UM/883
29. Die Products
Reference Section: Parallel EEPROM Die Products
18
AT28C256
0006K–PEEPR–01/08
AT28C256
Packaging Information
29.1
28D6 – Cerdip
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
MIL-STD 1835 D-10 Config A (Glass Sealed)
37.85(1.490)
36.58(1.440)
PIN
1
15.49(0.610)
12.95(0.510)
33.02(1.300) REF
5.72(0.225)
MAX
0.127(0.005)MIN
SEATING
PLANE
5.08(0.200)
3.18(0.125)
2.54(0.100)BSC
1.65(0.065)
1.14(0.045)
1.52(0.060)
0.38(0.015)
0.66(0.026)
0.36(0.014)
15.70(0.620)
15.00(0.590)
0.46(0.018)
0.20(0.008)
0º~ 15º REF
17.80(0.700) MAX
10/23/03
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28D6, 28-lead, 0.600" Wide, Non-windowed,
Ceramic Dual Inline Package (Cerdip)
DRAWING NO.
28D6
REV.
B
19
0006K–PEEPR–01/08
29.2
28F – Flatpack
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
MIL-STD 1835 F-12 Config B
PIN #1 ID
9.40(0.370)
6.35(0.250)
0.56(0.022)
0.38(0.015)
1.27(0.050) BSC
18.49(0.728)
18.08(0.712)
1.14(0.045) MAX
10.57(0.416)
9.75(0.384)
0.23(0.009)
0.10(0.004)
3.02(0.119)
2.29(0.090)
1.96(0.077)
1.09(0.043)
7.26(0.286)
6.96(0.274)
1.14(0.045)
0.660(0.026)
10/21/03
R
20
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28F, 28-lead, Non-windowed, Ceramic Bottom-brazed
Flat Package (FlatPack)
DRAWING NO.
REV.
28F
B
AT28C256
0006K–PEEPR–01/08
AT28C256
29.3
32J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
E1
E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
Notes:
1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
3.175
–
3.556
A1
1.524
–
2.413
A2
0.381
–
–
D
12.319
–
12.573
D1
11.354
–
11.506
D2
9.906
–
10.922
E
14.859
–
15.113
E1
13.894
–
14.046
E2
12.471
–
13.487
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
32J
B
21
0006K–PEEPR–01/08
29.4
32L – LCC
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
MIL-STD 1835 C-12
11.63(0.458)
11.23(0.442)
2.54(0.100)
2.16(0.085)
14.22(0.560)
13.72(0.540)
1.91(0.075)
1.40(0.055)
PIN 1
2.41(0.095)
1.91(0.075)
1.40(0.055)
1.14(0.045)
INDEX CORNER
0.635(0.025)
X 45˚
0.381(0.015)
0.305(0.012)
RADIUS
0.178(0.007)
10.16(0.400) BSC
0.737(0.029)
0.533(0.021)
1.27(0.050) TYP
1.02(0.040) X 45˚
7.62(0.300) BSC
2.16(0.085)
1.65(0.065)
10/21/03
R
22
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32L, 32-pad, Non-windowed, Ceramic Lid, Leadless Chip
Carrier (LCC)
DRAWING NO.
REV.
32L
B
AT28C256
0006K–PEEPR–01/08
AT28C256
29.5
28P6 – PDIP
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
MIN
NOM
MAX
A
–
–
4.826
A1
0.381
–
–
D
36.703
–
37.338
E
15.240
–
15.875
E1
13.462
–
13.970
B
0.356
–
0.559
B1
1.041
–
1.651
L
3.048
–
3.556
C
0.203
–
0.381
eB
15.494
–
17.526
SYMBOL
eB
Notes:
1. This package conforms to JEDEC reference MS-011, Variation AB.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
e
NOTE
Note 2
Note 2
2.540 TYP
09/28/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28P6, 28-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
DRAWING NO.
28P6
REV.
B
23
0006K–PEEPR–01/08
29.6
28S – SOIC
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
0.51(0.020)
0.33(0.013)
7.60(0.2992) 10.65(0.419)
7.40(0.2914) 10.00(0.394)
PIN 1
1.27(0.50) BSC
TOP VIEW
18.10(0.7125)
17.70(0.6969)
2.65(0.1043)
2.35(0.0926)
0.30(0.0118)
0.10(0.0040)
SIDE VIEWS
0.32(0.0125)
0.23(0.0091)
0º ~ 8º
1.27(0.050)
0.40(0.016)
8/4/03
R
24
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28S, 28-lead, 0.300" Body, Plastic Gull Wing Small Outline (SOIC)
JEDEC Standard MS-013
DRAWING NO.
REV.
28S
B
AT28C256
0006K–PEEPR–01/08
AT28C256
29.7
28T – TSOP
PIN 1
0º ~ 5º
c
Pin 1 Identifier Area
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.90
1.00
1.05
D
13.20
13.40
13.60
D1
11.70
11.80
11.90
Note 2
E
7.90
8.00
8.10
Note 2
L
0.50
0.60
0.70
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-183.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
L1
NOTE
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
0.55 BASIC
12/06/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
28T
C
25
0006K–PEEPR–01/08
29.8
28U – PGA
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
7.26(0.286)
6.50(0.256)
13.74(0.540)
13.36(0.526)
2.57(0.101)
2.06(0.081)
15.24(0.600)
14.88(0.586)
1.40(0.055)
1.14(0.045)
0.58(0.023)
0.43(0.017)
3.12(0.123)
2.62(0.103)
1.83(0.072)
1.57(0.062)
14.17(0.558)
13.77(0.542)
2.54(0.100) TYP
16.71(0.658)
16.31(0.642)
12.70(0.500) TYP
2.54(0.100) TYP
10.41(0.410)
9.91(0.390)
10/21/03
R
26
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28U, 28-pin, Ceramic Pin Grid Array (PGA)
DRAWING NO.
REV.
28U
B
AT28C256
0006K–PEEPR–01/08
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
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Japan
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Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
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Literature Requests
www.atmel.com/literature
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0006K–PEEPR–01/08