AT49F040 Features • • • • • • • • • • Single Voltage Operation - 5V Read - 5V Reprogramming Fast Read Access Time - 90 ns Internal Program Control and Timer 16K bytes Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Byte By Byte Programming - 50 µs/Byte Hardware Data Protection DATA Polling For End Of Program Detection Low Power Dissipation - 50 mA Active Current - 100 µA CMOS Standby Current Typical 10,000 Write Cycles Description The AT49F040 is a 5-volt-only in-system Flash Memory. Its 4 megabits of memory is organized as 524,288 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 90 ns with power dissipation of just 275 mW over the commercial temperature range. When the device is deselected, the CMOS standby current is less than 100 µA. To allow for simple in-system reprogrammability, the AT49F040 does not require high input voltages for programming. Five-volt-only commands determine the read and programming operation of the device. Reading data out of the device is similar to reading from an EPROM. Reprogramming the AT49F040 is performed by erasing the entire 4 megabits of memory and then programming on a byte by byte basis. The byte programming time is a fast 50 µs. The end of a program cycle can be optionally detected by the DATA polling feature. Once the end of a byte program cycle has been detected, a new access for a read or program can begin. The typical number of program and erase cycles is in excess of 10,000 cycles. (continued) DIP Top View 4 Megabit (512K x 8) 5-volt Only CMOS Flash Memory Preliminary AT49F040 Pin Configurations Pin Name Function A0 - A18 Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs PLCC Top View TSOP Top View Type 1 0359C 4-209 Description (Continued) The optional 16K bytes boot block section includes a reprogramming write lock out feature to provide data integrity. The boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is permanently protected from being reprogrammed. Block Diagram Device Operation READ: The AT49F040 is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dualline control gives designers flexibility in preventing bus contention. ERASURE: Before a byte can be reprogrammed, the 512K bytes memory array (or 496K bytes if the boot block featured is used) must be erased. The erased state of the memory bits is a logical “1". The entire device can be erased at one time by using a 6-byte software code. The software chip erase code consists of 6-byte load commands to specific address locations with a specific data pattern (please refer to the Chip Erase Cycle Waveforms). After the software chip erase has been initiated, the device will internally time the erase operation so that no external clocks are required. The maximum time needed to erase the whole chip is tEC. If the boot block lockout feature has been enabled, the data in the boot sector will not be erased. BYTE PROGRAMMING: Once the memory array is erased, the device is programmed (to a logical “0") on a byte-by-byte basis. Please note that a data ”0" cannot be programmed back to a “1"; only erase operations can convert ”0"s to “1"s. Programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the Command Definitions table). The device will automatically generate the required internal program pulses. The program cycle has addresses latched on the falling edge of WE or CE, whichever occurs last, and the data latched on the rising edge of WE or CE, whichever occurs first. Programming is completed after the specified tBP cy4-210 AT49F040 cle time. The DATA polling feature may also be used to indicate the end of a program cycle. BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. The size of the block is 16K bytes. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be activated; the boot block’s usage as a write protected region is optional to the user. The address range of the boot block is 00000H to 03FFFH. Once the feature is enabled, the data in the boot block can no longer be erased or programmed. Data in the main memory block can still be changed through the regular programming method. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H will show if programming the boot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been activated and the block cannot be programmed. The software product identification code should be used to return to standard operation. (continued) AT49F040 Device Operation (Continued) PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. TOGGLE BIT: In addition to DATA polling the AT49F040 provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes. HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49F040 in the following ways: (a) VCC sense: if VCC is below 3.8V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE low, CE high or WE high inhibits program cycles. (c) Noise filter: pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. DATA POLLING: The AT49F040 features DATA polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle. Command Definition (in Hex) Command Bus Sequence Cycles 1st Bus Cycle Addr Data 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 6th Bus Cycle Addr Data Addr Data Addr Data Addr Data Addr Data 2AAA 55 5555 10 2AAA 55 5555 40 Read 1 Addr DOUT Chip Erase 6 5555 AA 2AAA 55 5555 80 5555 AA Byte Program 4 5555 AA 2AAA 55 5555 A0 Addr DIN Boot Block (1) Lockout 6 5555 AA 2AAA 55 5555 80 5555 AA Product ID Entry 3 5555 AA 2AAA 55 5555 90 Product ID (2) Exit 3 5555 AA 2AAA 55 5555 F0 Product ID (2) Exit 1 XXXX F0 Note: 5th Bus Cycle 1. The 16K byte boot sector has the address range 00000H to 03FFFH. 2. Either one of the Product ID exit commands can be used. Absolute Maximum Ratings* Temperature Under Bias................. -55°C to +125°C Storage Temperature...................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ................... -0.6V to +6.25V All Output Voltages with Respect to Ground .............-0.6V to VCC + 0.6V Voltage on OE with Respect to Ground .................. -0.6V to + 13.5V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4-211 DC and AC Operating Range AT49F040-90 AT49F040-12 AT49F040-15 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 5V ± 10% Com. Operating Temperature (Case) Ind. VCC Power Supply Operating Modes Mode CE OE WE Ai I/O Read VIL VIL VIH Ai DOUT Program (2) VIL VIH VIL Ai DIN VIH (1) X X High Z Standby/Write Inhibit X Program Inhibit X X VIH Program Inhibit X VIL X Output Disable X VIH X High Z Product Identification Hardware VIL VIL VIH A1 - A18 = VIL, A9 = VH, (3) A0 = VIL A1 - A18 = VIL, A9 = VH, (3) A0 = VIH Software (5) Notes: 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V ± 0.5V. Manufacturer Code (4) Device Code (4) A0 = VIL, A1 - A18 = VIL Manufacturer Code (4) A0 = VIH, A1 - A18 = VIL Device Code (4) 4. Manufacturer Code: 1FH, Device Code: 13H 5. See details under Software Product Identification Entry/Exit. DC Characteristics Symbol Parameter Condition Min Max Units ILI Input Load Current VIN = 0V to VCC 10 µA ILO Output Leakage Current VI/O = 0V to VCC 10 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC Com. 100 µA Ind. 300 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3 mA VCC Active Current f = 5 MHz; IOUT = 0 mA 50 mA 0.8 V ICC (1) VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH1 Output High Voltage IOH = -400 µA 2.4 V VOH2 Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V Note: 4-212 1. In the erase mode, ICC is 90 mA. AT49F040 2.0 V .45 V AT49F040 AC Read Characteristics AT49F040-90 AT49F040-12 AT49F040-15 Min Min Max Units 120 150 ns 120 150 ns 0 70 ns 0 40 ns Symbol Parameter tACC Address to Output Delay 90 tCE (1) CE to Output Delay 90 tOE (2) OE to Output Delay 0 40 0 50 tDF (3, 4) CE or OE to Output Float 0 25 0 30 tOH Output Hold from OE, CE or Address, whichever occurred first 0 Min Max Max 0 0 ns AC Read Waveforms (1, 2, 3, 4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC . 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC . 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. Input Test Waveforms and Measurement Level Output Test Load tR, tF < 5 ns Pin Capacitance (f = 1 MHz, T = 25°C) (1) Typ Max Units CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: Conditions 1. This parameter is characterized and is not 100% tested. 4-213 AC Byte Load Characteristics Symbol Parameter tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 90 ns tDS Data Set-up Time 50 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 90 ns AC Byte Load Waveforms WE Controlled CE Controlled 4-214 AT49F040 Min Max Units AT49F040 Program Cycle Characteristics Symbol Parameter Min Typ Max Units tBP Byte Programming Time 10 50 µs tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 50 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 90 ns tWPH Write Pulse Width High 90 ns tEC Erase Cycle Time 10 seconds Program Cycle Waveforms Chip Erase Cycle Waveforms Note: OE must be high only when WE and CE are both low. 4-215 Data Polling Characteristics Symbol Parameter tDH Data Hold Time tOEH OE Hold Time (1) Min Typ Max Units 10 ns 10 ns (2) tOE OE to Output Delay tWR Write Recovery Time ns 0 ns Notes: 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Data Polling Waveforms Toggle Bit Characteristics (1) Symbol Parameter Min Typ Max Units tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns Delay (2) tOE OE to Output tOEHP OE High Pulse tWR Write Recovery Time ns 150 ns 0 ns Notes: 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Toggle Bit Waveforms (1, 2, 3) Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling input(s). 4-216 AT49F040 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. AT49F040 Software Product (1) Identification Entry Boot Block Lockout (1) Feature Enable Algorithm LOAD DATA AA TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 LOAD DATA 80 TO ADDRESS 5555 ENTER PRODUCT IDENTIFICATION MODE (2, 3, 5) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA Software Product (1) Identification Exit LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA OR LOAD DATA 40 TO ADDRESS 5555 LOAD DATA F0 TO ANY ADDRESS EXIT PRODUCT IDENTIFICATION MODE (4) LOAD DATA F0 TO ADDRESS 5555 PAUSE 1 second (2) Notes for boot block lockout feature enable: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Boot block lockout feature enabled. EXIT PRODUCT IDENTIFICATION MODE (4) Notes for software product identification: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. A1 - A18 = VIL. Manufacture Code is read for A0 = VIL; Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code: 1FH Device Code: 13H 4-217 Ordering Information (1) ICC (mA) tACC (ns) Active Standby 90 50 120 150 Note: Ordering Code Package 0.1 AT49F040-90JC AT49F040-90PC AT49F040-90TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F040-90JI AT49F040-90PI AT49F040-90TI 32J 32P6 32T Industrial (-40° to 85°C) 50 0.1 AT49F040-12JC AT49F040-12PC AT49F040-12TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F040-12JI AT49F040-12PI AT49F040-12TI 32J 32P6 32T Industrial (-40° to 85°C) 50 0.1 AT49F040-15JC AT49F040-15PC AT49F040-15TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F040-15JI AT49F040-15PI AT49F040-15TI 32J 32P6 32T Industrial (-40° to 85°C) 1. The AT49F040 has as optional boot block feature. The part number shown in the Ordering Information table is for devices with the boot block in the lower address range (i.e., 00000H to 03FFFH). Users requiring the boot block to be in the higher address range should contact Atmel. Package Type 32J 32 Lead, Plastic, J-Leaded Chip Carrier Package (PLCC) 32P6 32 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32 Lead, Thin Small Outline Package (TSOP) 4-218 Operation Range AT49F040