Features • Single Voltage Operation • • • • • • • • • – 5V Read – 5V Reprogramming Fast Read Access Time - 45 ns Internal Program Control and Timer 8K word Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Word By Word Programming - 10 µs/Word Typical Hardware Data Protection DATA Polling For End Of Program Detection Small 10 x 14 mm VSOP Package Typical 10,000 Write Cycles Description The AT49F1024 and the AT49F1025 are 5-volt-only in-system Flash Memories. Their 1 megabit of memory is organized as 65,536 words by 16 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the devices offer access times to 45 ns with power dissipation of just 275 mW over the commercial temperature range. When the device is deselected, the CMOS standby current is less than 100 µA. The only difference between the AT49F1024 and the AT49F1025 is the pinout. The AT49F1024 is pin compatable with the AT27C1024, and the AT49F1025 is pin compatable with the AT29C1024. (continued) Pin Configurations Chip Enable OE Output Enable WE Write Enable I/O0 - I/O15 Data Inputs/Outputs NC No Connect A9 A10 A11 A12 A13 A14 A15 NC WE VCC NC CE I/O15 I/O14 I/O13 I/O12 I/O11 I/O10 I/O9 I/O8 AT49F1025 VSOP Top View Type 1 10 x 14 mm 10 x 14 mm 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 OE I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/07 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 NC CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 GND A8 A7 A6 A5 A4 A3 A2 A1 A0 OE I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND PLCC Top View I/O13 I/O14 I/O15 CE NC NC VCC WE NC A15 A14 CE I/O12 I/O11 I/O10 I/O9 I/O8 GND NC I/O7 I/O6 I/O5 I/O4 6 5 4 3 2 1 44 43 42 41 40 Addresses 7 8 9 10 11 12 13 14 15 16 17 39 38 37 36 35 34 33 32 31 30 29 18 19 20 21 22 23 24 25 26 27 28 A0 - A15 A13 A12 A11 A10 A9 GND NC A8 A7 A6 A5 Rev. 0765D–09/98 I/O3 I/O2 I/O1 I/O0 OE DC A0 A1 A2 A3 A4 Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 AT49F1024 AT49F1025 AT49F1024 VSOP Top View Type 1 10 x 14 mm Pin Name A0 A1 A2 A3 A4 A5 A6 A7 A8 GND A9 A10 A11 A12 A13 A14 A15 NC WE VCC 1-Megabit (64K x 16) 5-volt Only Flash Memory 1 To allow for simple in-system reprogrammability, the AT49F1024/1025 does not require high input voltages for programming. Five-volt-only commands determine the read and programming operation of the device. Reading data out of the device is similar to reading from an EPROM. Reprogramming the AT49F1024/1025 is performed by erasing a block of data (entire chip or main memory block) and then programming on a word by word basis. The typical word programming time is a fast 10 µs. The end of a program cycle can be optionally detected by the DATA poll- ing feature. Once the end of a byte program cycle has been detected, a new access for a read or program can begin. The typical number of program and erase cycles is in excess of 10,000 cycles. The optional 8K words boot block section includes a reprogramming write lock out feature to provide data integrity. The boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is permanently protected from being erased or reprogrammed. Block Diagram DATA INPUTS/OUTPUTS I/O15 - I/O0 VCC GND OE WE CE 16 OE, CE, AND WE LOGIC ADDRESS INPUTS DATA LATCH INPUT/OUTPUT BUFFERS Y DECODER Y-GATING X DECODER MAIN MEMORY (56K WORDS) 1FFFH OPTIONAL BOOT BLOCK (8K WORDS) 0000H Device Operation READ: The AT49F1024/1025 is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention. CHIP ERASE: When the boot block programming lockout feature is not enabled, the boot block and the main memory block will erase together from the same chip erase command (See command definitions table). If the boot block lockout function has been enabled, data in the boot section will not be erased. However, data in the main memory section will be erased. After a chip erase, the device will return to the read mode. MAIN MEMORY ERASE: As an alternative to the chip erase, a main memory block erase can be performed which will erase all bytes not located in the boot block region to an FFH. Data located in the boot region will not be changed during a main memory block erase. The Main Memory Erase command is a six bus cycle operation. The address (5555H) is latched on the falling edge of the sixth cycle while the 30H data input is latched on the rising edge of 2 AT49F1024/1025 WE. The main memory erase starts after the rising edge of WE of the sixth cycle. Please see Main Memory Erase cycle waveforms. The Main Memory Erase operation is internally controlled; it will automatically time to completion. WORD PROGRAMMING: Once the memory array is erased, the device is programmed (to a logical “0”) on a word-by-word basis. Please note that a data “0” cannot be programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the Command Definitions table). The device will automatically generate the required internal program pulses. The program cycle has addresses latched on the falling edge of WE or CE, whichever occurs last, and the data latched on the rising edge of WE or CE, whichever occurs first. Programming is completed after the specified tBP cycle time. The DATA polling feature may also be used to indicate the end of a program cycle. BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. The AT49F1024/1025 size of the block is 8K words. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be activated; the boot block’s usage as a write protected region is optional to the user. The address range of the boot block is 0000H to 1FFFH. Once the feature is enabled, the data in the boot block can no longer be erased or programmed. Data in the main memory block can still be changed through the regular programming method and can be erased using either the chip erase or the main memory block erase command. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 0002H will show if programming the boot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been activated and the block cannot be programmed. The software product identification exit code should be used to return to standard operation. PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external pro- grammer to identify the correct programming algorithm for the Atmel product. For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes. DATA POLLING: The AT49F1024/1025 features DATA polling to indicate the end of a program or erase cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle. TOGGLE BIT: In addition to DATA polling the AT49F1024/1025 provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49F1024/1025 in the following ways: (a) V CC sense: if VCC is below 3.8V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE low, CE high or WE high inhibits program cycles. (c) Noise filter: Pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. 3 Command Definition (in Hex) Command Sequence 1st Bus Cycle Bus Cycles Addr Data Read 1 Addr DOUT Chip Erase 6 5555 Main Memory Erase 6 Word Program 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 5th Bus Cycle 6th Bus Cycle Addr Data Addr Data Addr Data Addr Data Addr Data AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 30 4 5555 AA 2AAA 55 5555 A0 Addr DIN 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 40 Product ID Entry 3 5555 AA 2AAA 55 5555 90 (3) 3 5555 AA 2AAA 55 5555 F0 Boot Block Lockout Product ID Exit (2) Product ID Exit(3) 1 xxxx F0 Notes: 1. The DATA FORMAT in each bus cycle is as follows: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex). 2. The 8K word boot sector has the address range 00000H to 1FFFH. 3. Either one of the Product ID Exit commands can be used. Absolute Maximum Ratings* Temperature Under Bias ................................ -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V Voltage on OE with Respect to Ground ...................................-0.6V to +13.5V 4 AT49F1024/1025 *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AT49F1024/1025 DCand AC Operating Range Operating Temperature (Case) AT49F1024/1025-45 AT49F1024/1025-55 AT49F1024/1025-70 AT49F1024/1025-90 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 5V ± 10% Com. Ind. VCC Power Supply 5V ± 10% Operating Modes Mode Read Program (2) Standby/Write Inhibit CE OE WE Ai I/O VIL VIL VIH Ai DOUT VIL VIH VIL Ai DIN X X High Z (1) VIH X Program Inhibit X X VIH Program Inhibit X VIL X Output Disable X VIH X High Z Product Identification Hardware VIL VIL VIH A1 - A15 = VIL, A9 = VH,(3) A0 = VIL Manufacturer Code(4) A1 - A15 = VIL, A9 = VH,(3) A0 = VIH Device Code(4) Software(5) Notes: A0 = VIL, A1 - A15 = VIL Manufacturer Code(4) A0 = VIH, A1 - A15 = VIL Device Code(4) 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V ± 0.5V. 4. Manufacturer Code: 1FH, Device Code: 87H. 5. See details under Software Product Identification Entry/Exit. DC Characteristics Symbol Parameter Condition ILI Input Load Current ILO Max Units VIN = 0V to VCC 10 µA Output Leakage Current VI/O = 0V to VCC 10 µA Com. 100 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC Ind. 300 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3 mA VCC Active Current f = 5 MHz; IOUT = 0 mA 50 mA 0.8 V ICC (1) Min VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH1 Output High Voltage IOH = -400 µA 2.4 V Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V VOH2 Note: 2.0 V 0.45 V 1. In the erase mode, ICC is 90 mA. 5 AC Read Characteristics AT49F1024-45 AT49F1024-55 AT49F1024-70 AT49F1024-90 AT49F1025-45 AT49F1025-55 AT49F1025-70 AT49F1025-90 Min Min Min Min Symbol Parameter Max Max tACC Address to Output Delay 45 55 tCE(1) CE to Output Delay 45 tOE(2) OE to Output Delay 0 30 tDF(3)(4) CE or OE to Output Float 0 25 tOH Output Hold from OE, CE or Address, whichever occurred first 0 0 Max Units 70 90 ns 55 70 90 ns 30 35 0 40 ns 25 0 25 ns 25 0 0 Max 0 0 ns AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. Input Test Waveforms and Measurement Level Output Test Load 45/55/70 ns 90/120 ns 5.0V 5.0V 1.8K 1.8K OUTPUT PIN 1.3K tR, tF < 5 ns 30 pF OUTPUT PIN 1.3K 100 pF Pin Capacitance f = 1 MHz, T = 25°C(1) Typ Max Units Conditions CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. This parameter is characterized and is not 100% tested. AT49F1024/1025 AT49F1024/1025 AC Word Load Characteristics Symbol Parameter Min Max Units tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 90 ns tDS Data Set-up Time 50 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 90 ns AC Word Load Waveforms WE Controlled OE tOES tOEH ADDRESS CE WE tAS tAH tCH tCS tWPH tWP tDH tDS DATA IN CE Controlled OE tOES tOEH ADDRESS tAS tAH tCH WE tCS CE tWPH tWP tDS DATA tDH IN 7 Program Cycle Characteristics Symbol Parameter Min Typ Max Units tBP Word Programming Time 10 50 µs tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 50 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 90 ns tWPH Write Pulse Width High 90 ns tEC Erase Cycle Time 10 Program Cycle Waveforms A0-A15 Main Memory or Chip Erase Cycle Waveforms OE CE t WP t WPH WE t AS A0-A15 t AH t DH 5555 5555 5555 2AAA 5555 2AAA t EC t DS DATA AA WORD 0 Notes: 8 55 WORD 1 80 WORD 2 AA 55 NOTE 3 WORD 3 WORD 4 WORD 5 1. OE must be high only when WE and CE are both low. 2. For chip erase, the address should be 10H. For a main memory erase the data should be 30H. AT49F1024/1025 seconds AT49F1024/1025 Data Polling Characteristics(1) Symbol Parameter tDH Data Hold Time tOEH OE Hold Time Min Max OE to Output Delay tWR Write Recovery Time Units 10 ns 10 ns (2) tOE Notes: Typ ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Data Polling Waveforms Toggle Bit Characteristics(1) Symbol Parameter tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) tOEHP OE High Pulse tWR Write Recovery Time Notes: Min Typ Max Units ns 150 ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Toggle Bit Waveforms(1)(2)(3) Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling input(s). 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. 9 Software Product Identification Entry(1) Boot Block Lockout Enable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 LOAD DATA 80 TO ADDRESS 5555 ENTER PRODUCT IDENTIFICATION MODE (2)(3)(5) LOAD DATA AA TO ADDRESS 5555 Software Product Identifcation Exit(1) LOAD DATA AA TO ADDRESS 5555 O R LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA F0 TO ANY ADDRESS LOAD DATA 40 TO ADDRESS 5555 EXIT PRODUCT IDENTIFICATION MODE(4) PAUSE 1 second(2) LOAD DATA F0 TO ADDRESS 5555 Notes: 1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Boot block lockout feature enabled. EXIT PRODUCT IDENTIFICATION MODE(4) Notes: 1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. A1 - A15 = VIL. Manufacture Code is read for A0 = VIL; Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code: 1FH Device Code: 87H 10 AT49F1024/1025 AT49F1024/1025 AT49F1024 Ordering Information(1) ICC (mA) tACC (ns) Active Standby Ordering Code Package 45 50 0.1 AT49F1024-45VC 40V Commercial (0° to 70°C) 55 50 0.1 AT49F1024-55VC 40V Commercial (0° to 70°C) 50 0.3 AT49F1024-55VI 40V Industrial (-40° to 85°C) 50 0.1 AT49F1024-70VC 40V Commercial (0° to 70°C) 50 0.3 AT49F1024-70VI 40V Industrial (-40° to 85°C) 50 0.1 AT49F1024-90VC 40V Commercial (0° to 70°C) 50 0.3 AT49F1024-90VI 40V Industrial (-40° to 85°C) 70 90 Note: Operation Range 1. The AT49F1024 has as optional boot block feature. The part number shown in the Ordering Information table is for devices with the boot block in the lower address range (i.e., 0000H to 1FFFH). Users requiring the boot block to be in the higher address range should contact Atmel. Package Type 40V 40-Lead, Thin Small Outline Package (VSOP) (10 mm x 14 mm) 11 AT49F1025 Ordering Information(1) ICC (mA) tACC (ns) Active Standby Ordering Code Package 45 50 0.1 AT49F1025-45JC AT49F1025-45VC 44J 40V Commercial (0° to 70°C) 55 50 0.1 AT49F1025-55JC AT49F1025-55VC 44J 40V Commercial (0° to 70°C) 50 0.3 AT49F1025-55JI AT49F1025-55VI 44J 40V Industrial (-40° to 85°C) 50 0.1 AT49F1025-70JC AT49F1025-70VC 44J 40V Commercial (0° to 70°C) 50 0.3 AT49F1025-70JI AT49F1025-70VI 44J 40V Industrial (-40° to 85°C) 50 0.1 AT49F1025-90JC AT49F1025-90VC 44J 40V Commercial (0° to 70°C) 50 0.3 AT49F1025-90JI AT49F1025-90VI 44J 40V Industrial (-40° to 85°C) 70 90 Note: 1. The AT49F1025 has as optional boot block feature. The part number shown in the Ordering Information table is for devices with the boot block in the lower address range (i.e., 0000H to 1FFFH). Users requiring the boot block to be in the higher address range should contact Atmel. Package Type 44J 44-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC) 40V 40-Lead, Thin Small Outline Package (VSOP) (10 mm x 14 mm) 12 Operation Range AT49F1024/1025 AT49F1024/1025 Packaging Information 44J, 44-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AC .045(1.14) X 45° PIN NO. 1 IDENTIFY .045(1.14) X 30° - 45° .012(.305) .008(.203) .630(16.0) .590(15.0) .656(16.7) SQ .650(16.5) .032(.813) .026(.660) .695(17.7) SQ .685(17.4) .050(1.27) TYP .500(12.7) REF SQ 40V, 40-Lead, Plastic Thin Small Outline Package (VSOP) Dimensions in Millimeters and (Inches)* .021(.533) .013(.330) .043(1.09) .020(.508) .120(3.05) .090(2.29) .180(4.57) .165(4.19) .022(.559) X 45° MAX (3X) *Controlling dimension: millimeters 13