Features • High-performance, Low-power 8/16-bit AVR XMEGA Microcontroller • Non-volatile Program and Data Memories • • • • • – 16 KB - 128 KB of In-System Self-Programmable Flash – 4 KB - 8 KB Boot Code Section with Independent Lock Bits – 1 KB - 2 KB EEPROM – 2 KB - 8 KB Internal SRAM Peripheral Features – Four-channel Event System – Four 16-bit Timer/Counters Three Timer/Counters with 4 Output Compare or Input Capture channels One Timer/Counter with 2 Output Compare or Input Capture channels High-Resolution Extensions on two Timer/Counters Advanced Waveform Extension on one Timer/Counter – Two USARTs IrDA Extension on one USART – Two Two-Wire Interfaces with dual address match (I2C and SMBus compatible) – Two SPIs (Serial Peripheral Interfaces) peripherals – 16-bit Real Time Counter with Separate Oscillator – One Twelve-channel, 12-bit, 200 ksps Analog to Digital Converter – Two Analog Comparators with Window compare function – External Interrupts on all General Purpose I/O pins – Programmable Watchdog Timer with Separate On-chip Ultra Low Power Oscillator Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal and External Clock Options with PLL – Programmable Multi-level Interrupt Controller – Sleep Modes: Idle, Power-down, Standby, Power-save, Extended Standby – Advanced Programming, Test and Debugging Interface PDI (Program and Debug Interface) for programming, test and debugging I/O and Packages – 34 Programmable I/O Lines – 44-lead TQFP – 44-pad VQFN/QFN – 49-ball VFBGA Operating Voltage – 1.6 – 3.6V Speed performance – 0 – 12 MHz @ 1.6 – 3.6V – 0 – 32 MHz @ 2.7 – 3.6V 8/16-bit XMEGA D4 Microcontroller ATxmega128D4 ATxmega64D4 ATxmega32D4 ATxmega16D4 Preliminary Typical Applications • • • • • Industrial control Factory automation Building control Board control White Goods • • • • • Climate control ZigBee Motor control Networking Optical • • • • • Hand-held battery applications Power tools HVAC Metering Medical Applications 8135G–AVR–08/10 XMEGA D4 1. Ordering Information Flash E2 SRAM Speed (MHz) Power Supply ATxmega128D4- AU 128 KB + 8 KB 2 KB 8 KB 32 1.6 - 3.6V ATxmega64D4-AU 64 KB + 4 KB 2 KB 4 KB 32 1.6 - 3.6V ATxmega32D4-AU 32 KB + 4 KB 1 KB 4 KB 32 1.6 - 3.6V ATxmega16D4-AU 16 KB + 4 KB 1 KB 2 KB 32 1.6 - 3.6V ATxmega128D4- MH 128 KB + 8 KB 2 KB 8 KB 32 1.6 - 3.6V ATxmega64D4-MH 64 KB + 4 KB 2 KB 4 KB 32 1.6 - 3.6V ATxmega32D4-MH 32 KB + 4 KB 1 KB 4 KB 32 1.6 - 3.6V ATxmega16D4-MH 16 KB + 4 KB 1 KB 2 KB 32 1.6 - 3.6V ATxmega32D4-CU 32 KB + 4 KB 1 KB 4 KB 32 1.6 - 3.6V ATxmega16D4-CU 16 KB + 4 KB 1 KB 2 KB 32 1.6 - 3.6V Ordering Code Notes: Package(1)(2)(3) Temp 44A -40°C - 85°C 44M1 49C2 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For packaging information see ”Packaging information” on page 55. Package Type 44A 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 44M1 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally Enhanced Plastic Very Thin Quad No Lead Package (VQFN) 49C2 49-ball (7 x 7 Array), 0.65 mm Pitch, 5.0 x 5.0 x 1.0 mm, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) 2 8135G–AVR–08/10 XMEGA D4 2. Pinout/Block Diagram PA5 1 PA6 2 PA7 3 PB0 4 PB1 5 AVCC GND PR1 PR0 RESET/PDI PDI 39 38 37 36 35 34 PA1 41 PA0 PA2 42 40 PA3 43 Port R DATA BU S OSC/CLK Control ADC A A Port A INDEX CORNER PA4 Bock Diagram and TQFP/QFN pinout 44 Figure 2-1. BOD VREF POR TEMP RTC OCD AC A0 Power Control AC A1 FLASH 33 PE3 32 PE2 31 VCC 30 GND 29 PE1 28 PE0 27 PD7 26 PD6 25 PD5 24 PD4 23 PD3 RAM PC1 11 Notes: 13 14 15 16 17 18 19 20 21 22 PC3 PC4 PC5 PC6 PC7 GND VCC PD0 PD1 PD2 Port E 12 Port D PC2 Port C TWI 10 T/C0 PC0 EVENT ROUTING NETWORK SPI 9 DATA BU S USART0 VCC Event System ctrl T/C0 8 E2PROM Interrupt Controller SPI GND CPU Watchdog TWI 7 T/C0:1 PB3 Reset Control USART0 6 Port B PB2 1. For full details on pinout and pin functions refer to ”Pinout and Pin Functions” on page 46. 2. The large center pad underneath the QFN/MLF package should be soldered to ground on the board to ensure good mechanical stability. 3 8135G–AVR–08/10 XMEGA D4 Figure 2-2. VFBGA pinout Top view 1 Table 2-1. 2 3 4 5 Bottom view 6 7 7 6 5 4 3 2 1 A A B B C C D D E E F F G G VFBGA pinout 1 2 3 4 5 6 PA3 AVCC GND PR1 PR0 PDI PE3 PA4 PA1 PA0 GND RESET/ PDI PE2 VCC C PA5 PA2 PA6 PA7 GND PE1 GND D PB1 PB2 PB3 PB0 GND PD7 PE0 E GND GND PC3 GND PD4 PD5 PD6 F VCC PC0 PC4 PC6 PD0 PD1 PD3 G PC1 PC2 PC5 PC7 GND VCC PD2 A B 4 8135G–AVR–08/10 XMEGA D4 3. Overview The XMEGA D4 is a family of low power, high performance and peripheral rich CMOS 8/16-bit microcontrollers based on the AVR ® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the XMEGA D4 achieves throughputs approaching 1 Million Instructions Per Second (MIPS) per MHz allowing the system designer to optimize power consumption versus processing speed. The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers. The XMEGA D4 devices provide the following features: In-System Programmable Flash with Read-While-Write capabilities, Internal EEPROM and SRAM, four-channel Event System, Programmable Multi-level Interrupt Controller, 34 general purpose I/O lines, 16-bit Real Time Counter (RTC), four flexible 16-bit Timer/Counters with compare modes and PWM, two USARTs, two Two-Wire Interfaces (TWIs), two Serial Peripheral Interfaces (SPIs), one Twelvechannel 12-bit ADC with optional differential input with programmable gain, two analog comparators with window mode, programmable Watchdog Timer with separate Internal Oscillator, accurate internal oscillators with PLL and prescaler and programmable Brown-Out Detection. The Program and Debug Interface (PDI), a fast 2-pin interface for programming and debugging, is available. The XMEGA D4 devices have five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Event System, Interrupt Controller and all peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from external crystal combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in Active mode and in Idle sleep mode. The device is manufactured using Atmel's high-density nonvolatile memory technology. The program Flash memory can be reprogrammed in-system through the PDI. A Bootloader running in the device can use any interface to download the application program to the Flash memory. The Bootloader software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8/16-bit RISC CPU with In-System Self-Programmable Flash, the Atmel XMEGA D4 is a powerful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications. The XMEGA D4 devices are supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits. 5 8135G–AVR–08/10 XMEGA D4 3.1 Block Diagram Figure 3-1. XMEGA D4 Block Diagram PR[0..1] XTAL1/ TOSC1 XTAL2/ TOSC2 Oscillator Circuits/ Clock Generation PORT R (2) W atchdog Oscillator Real Time Counter W atchdog Timer DATA BUS A[0..7] PORT A (8) Event System Controller Power Supervision POR/BOD & RESET Oscillator Control SRAM GND Sleep Controller ACA ADCA AREFA VCC BUS Controller RESET/ PDI_CLK Prog/Debug Controller PDI PDI_DATA VCC/10 Int. Refs. Tempref OCD AREFB CPU Interrupt Controller B[0..7] PORT B (8) NVM Controller Flash EEPROM IRCOM DATA BUS PORT C (8) PC[0..7] PORT D (8) PORT E (4) PD[0..7] PE[0..3] TWIE USARTE0 TCE0 SPID TCD0 USARTD0 TWIC SPIC TCC0:1 USARTC0:1 EVENT ROUTING NETW ORK 6 8135G–AVR–08/10 XMEGA D4 4. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. 4.1 Recommended reading • XMEGA D Manual • XMEGA Application Notes This device datasheet only contains part specific information and a short description of each peripheral and module. The XMEGA D Manual describes the modules and peripherals in depth. The XMEGA application notes contain example code and show applied use of the modules and peripherals. The XMEGA Manual and Application Notes are available from http://www.atmel.com/avr. 5. Disclaimer For devices that are not available yet, typical values contained in this datasheet are based on simulations and characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max values will be available after the device is characterized. 7 8135G–AVR–08/10 XMEGA D4 6. AVR CPU 6.1 Features • 8/16-bit high performance AVR RISC Architecture • • • • • • • 6.2 – 138 instructions – Hardware multiplier 32x8-bit registers directly connected to the ALU Stack in RAM Stack Pointer accessible in I/O memory space Direct addressing of up to 16M Bytes of program and data memory True 16/24-bit access to 16/24-bit I/O registers Support for for both 8-, 16- and 32-bit Arithmetic Configuration Change Protection of system critical features Overview The XMEGA D4 uses the 8/16-bit AVR CPU. The main function of the CPU is program execution. The CPU must therefore be able to access memories, perform calculations and control peripherals. Interrupt handling is described in a separate section. Figure 6-1 on page 8 shows the CPU block diagram. Figure 6-1. CPU block diagram DATA BUS Flash Program Memory Program Counter OCD Instruction Register STATUS/ CONTROL Instruction Decode 32 x 8 General Purpose Registers ALU Multiplier DATA BUS Peripheral Module 1 Peripheral Module 2 SRAM EEPROM PMIC The AVR uses a Harvard architecture - with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipeline. While one instruction is being executed, the next instruction is pre-fetched from the program memory. 8 8135G–AVR–08/10 XMEGA D4 This concept enables instructions to be executed in every clock cycle. The program memory is In-System Re-programmable Flash memory. 6.3 Register File The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File - in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing - enabling efficient address calculations. One of these address pointers can also be used as an address pointer for look up tables in Flash program memory. 6.4 ALU - Arithmetic Logic Unit The high performance Arithmetic Logic Unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. After an arithmetic or logic operation, the Status Register is updated to reflect information about the result of the operation. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for easy implementation of 32-bit arithmetic. The ALU also provides a powerful multiplier supporting both signed and unsigned multiplication and fractional format. 6.5 Program Flow When the device is powered on, the CPU starts to execute instructions from the lowest address in the Flash Program Memory ‘0’. The Program Counter (PC) addresses the next instruction to be fetched. After a reset, the PC is set to location ‘0’. Program flow is provided by conditional and unconditional jump and call instructions, capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number uses a 32-bit format. During interrupts and subroutine calls, the return address PC is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. After reset the Stack Pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU. 9 8135G–AVR–08/10 XMEGA D4 7. Memories 7.1 Features • Flash Program Memory – One linear address space – In-System Programmable – Self-Programming and Bootloader support – Application Section for application code – Application Table Section for application code or data storage – Boot Section for application code or bootloader code – Separate lock bits and protection for all sections • Data Memory – One linear address space – Single cycle access from CPU – SRAM – EEPROM Byte and page accessible Optional memory mapping for direct load and store – I/O Memory Configuration and Status registers for all peripherals and modules Four bit-accessible General Purpose Register for global variables or flags • Production Signature Row Memory for factory programmed data Device ID for each microcontroller device type Serial number for each device Oscillator calibration bytes ADC and temperature sensor calibration data • User Signature Row One flash page in size Can be read and written from software Content is kept after chip erase 7.2 Overview The AVR architecture has two main memory spaces, the Program Memory and the Data Memory. In addition, the XMEGA D4 features an EEPROM Memory for non-volatile data storage. All three memory spaces are linear and require no paging. The available memory size configurations are shown in ”Ordering Information” on page 2. In addition each device has a Flash memory signature row for calibration data, device identification, serial number etc. Non-volatile memory spaces can be locked for further write or read/write operations. This prevents unrestricted access to the application software. 10 8135G–AVR–08/10 XMEGA D4 7.3 In-System Programmable Flash Program Memory The XMEGA D4 devices contain On-chip In-System Programmable Flash memory for program storage, see Figure 7-1 on page 11. Since all AVR instructions are 16- or 32-bits wide, each Flash address location is 16 bits. The Program Flash memory space is divided into Application and Boot sections. Both sections have dedicated Lock Bits for setting restrictions on write or read/write operations. The Store Program Memory (SPM) instruction must reside in the Boot Section when used to write to the Flash memory. A third section inside the Application section is referred to as the Application Table section which has separate Lock bits for storage of write or read/write protection. The Application Table section can be used for storing non-volatile data or application software. Figure 7-1. Flash Program Memory (Hexadecimal address) Word Address 0 Application Section (128K/64 KB/32 KB/16 KB) ... EFFF / 77FF / 37FF / 17FF F000 / 7800 / 3800 / 1800 FFFF / 7FFF / 3FFF / 1FFF 10000 / 8000 / 4000 / 2000 10FFF / 87FF / 47FF / 27FF Application Table Section (4 KB/4 KB/4 KB/4 KB) Boot Section (8 KB/4 KB/4 KB/4 KB) The Application Table Section and Boot Section can also be used for general application software. 11 8135G–AVR–08/10 XMEGA D4 7.4 Data Memory The Data Memory containts the I/O Memory, EEPROM and SRAM memories, all within one linear address space, see Figure 7-2 on page 12. To simplify development, the memory map for all devices in the family is identical and with empty, reserved memory space for smaller devices. Figure 7-2. Data Memory Map (Hexadecimal address) Byte Address 0 FFF ATxmega64D4 I/O Registers (4KB) 1000 EEPROM (2K) 17FF Byte Address 0 FFF 1000 13FF RESERVED 2000 2FFF Internal SRAM (4 KB) ATxmega32D4 I/O Registers (4KB) EEPROM (1 KB) Byte Address 0 FFF 1000 13FF RESERVED 2000 2FFF Internal SRAM (4 KB) ATxmega16D4 I/O Registers (4KB) EEPROM (1 KB) RESERVED 2000 27FF Byte Address 0 FFF 1000 17FF Internal SRAM (2 KB) ATxmega128D4 I/O Registers (4 KB) EEPROM (2K) RESERVED 2000 3FFF 7.4.1 Internal SRAM (8K) I/O Memory All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the CPU and the I/O Memory. The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly. I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instructions on these registers. The I/O memory address for all peripherals and modules in XMEGA D4 is shown in the ”Peripheral Module Address Map” on page 50. 7.4.2 SRAM Data Memory The XMEGA D4 devices have internal SRAM memory for data storage. 12 8135G–AVR–08/10 XMEGA D4 7.4.3 EEPROM Data Memory The XMEGA D4 devices have internal EEPROM memory for non-volatile data storage. It is addressable either in a separate data space or it can be memory mapped into the normal data memory space. The EEPROM memory supports both byte and page access. 7.5 Production Signature Row The Production Signature Row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. The production signature row also contains a device ID that identify each microcontroller device type, and a serial number that is unique for each manufactured device. The device ID for the available XMEGA A4 devices is shown in Table 7-1 on page 13. The serial number consist of the production LOT number, wafer number, and wafer coordinates for the device. The production signature row can not be written or erased, but it can be read from both application software and external programming. Table 7-1. Device ID bytes for XMEGA D4 devices. Device 7.6 Device ID bytes Byte 2 Byte 1 Byte 0 ATxmega16D4 42 94 1E ATxmega32D4 42 95 1E ATxmega64D4 47 96 1E ATxmega128D4 47 97 1E User Signature Row The User Signature Row is a separate memory section that is fully accessible (read and write) from application software and external programming. The user signature row is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial numbers or identification numbers, random number seeds etc. This section is not erased by Chip Erase commands that erase the Flash, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase session and on-chip debug sessions. 7.7 Flash and EEPROM Page Size The Flash Program Memory and EEPROM data memory are organized in pages. The pages are word accessible for the Flash and byte accessible for the EEPROM. Table 7-2 on page 14 shows the Flash Program Memory organization. Flash write and erase operations are performed on one page at the time, while reading the Flash is done one byte at the time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) give the page number and the least significant address bits (FWORD) give the word in the page. 13 8135G–AVR–08/10 XMEGA D4 Table 7-2. Devices Number of words and Pages in the Flash. Flash Page Size Size (words) FWORD FPAGE ATxmega16D4 16 KB + 4 KB 128 Z[6:0] Z[13:7] ATxmega32D4 32 KB + 4 KB 128 Z[6:0] Z[14:7] Application Size Boot No of Pages Size No of Pages 16 KB 64 4 KB 16 32 KB 128 4 KB 16 ATxmega64D4 64 KB + 4 KB 128 Z[6:0] Z[15:7] 64 KB 256 4 KB 16 ATxmega128D4 128 KB + 8 KB 256 Z[7:0] Z[16:8] 128 KB 256 8 KB 16 Table 7-3 on page 14 shows EEPROM memory organization for the XMEGA D4 devices. EEPROM write and erase operations can be performed one page or one byte at the time, while reading the EEPROM is done one byte at the time. For EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page. Table 7-3. Devices Number of Bytes and Pages in the EEPROM. EEPROM Page Size Size (Bytes) E2BYTE E2PAGE No of Pages ATxmega16D4 1 KB ATxmega32D4 1 KB 32 ADDR[4:0] ADDR[10:5] 32 32 ADDR[4:0] ADDR[10:5] 32 ATxmega64D4 ATxmega128D4 2 KB 32 ADDR[4:0] ADDR[10:5] 64 2 KB 32 ADDR[4:0] ADDR[10:5] 64 14 8135G–AVR–08/10 XMEGA D4 8. Event System 8.1 Features • • • • • • • • • 8.2 Inter-peripheral communication and signalling with minimum latency CPU independent operation 4 Event Channels allow for up to 4 signals to be routed at the same time 100% predictable timing between peripherals Events can be generated by – TImer/Counters (TCxn) – Real Time Counter (RTC) – Analog to Digital Converter (ADCx) – Analog Comparator (ACx) – Ports (PORTx) – System Clock (ClkSYS) – Software (CPU) Events can be used by – TImer/Counters (TCxn) – Analog to Digital Converter (ADCx) – Ports (PORTx) – IR Communication Module (IRCOM) The same event can be used by multiple peripherals for synchronized timing Advanced Features – Manual Event Generation from software (CPU) – Quadrature Decoding – Digital Filtering Functiond in Active and Idle mode Overview The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state in one peripheral to automatically trigger actions in other peripherals. The change of state in a peripheral that will trigger actions in other peripherals is configurable in software. It is a simple, but powerful system as it allows for autonomous control of peripherals without any use of interrupt, CPU resource. The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing Network. Figure 8-1 on page 16 shows a basic block diagram of the Event System with the Event Routing Network and the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin functions or for sequencing of events. The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are triggered in one or more other peripherals. The Event System is functional in both Active and Idle modes. 15 8135G–AVR–08/10 XMEGA D4 Figure 8-1. Event System Block Diagram ClkSYS CPU PORTx RTC Event Routing Network ACx ADCx IRCOM T/Cxn The Event Routing Network can directly connect together ADCs, Analog Comparators (ACx), I/O ports (PORTx), the Real-time Counter (RTC), Timer/Counters (T/C) and the IR Communication Module (IRCOM). Events can also be generated from software (CPU). All events from all peripherals are always routed into the Event Routing Network. This consist of eight multiplexers where each can be configured in software to select which event to be routed into that event channel. All eight event channels are connected to the peripherals that can use events, and each of these peripherals can be configured to use events from one or more event channels to automatically trigger a software selectable action. 16 8135G–AVR–08/10 XMEGA D4 9. System Clock and Clock options 9.1 Features • Fast start-up time • Safe run-time clock switching • Internal Oscillators: • • • • • • 9.2 – 32 MHz run-time calibrated RC oscillator – 2 MHz run-time calibrated RC oscillator – 32.768 kHz calibrated RC oscillator – 32 kHz Ultra Low Power (ULP) oscillator with 1 kHz output External clock options – 0.4 - 16 MHz Crystal Oscillator – 32.768 kHz Crystal Oscillator – External clock PLL with internal and external clock options with 1 to 31x multiplication Clock Prescalers with 1 to 2048x division Fast peripheral clock running at time the CPU clock speed Automatic Run-Time Calibration of internal oscillators Crystal Oscillator failure detection Overview XMEGA D4 has an advanced clock system, supporting a large number of clock sources. It incorporates both accurate integrated oscillators, external crystal oscillators and resonators. A high frequency Phase Locked Loop (PLL) and clock prescalers can be used to generate a wide range of clock frequencies. A calibration feature (DFLL) is available, and can be used for automatic run-time calibration of the internal oscillators. A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and switch to internal oscillator if the external oscillator fails. After reset, the device will always start up running from the 2 MHz internal oscillator. During normal operation, the System Clock source and prescalers can be changed from software at any time. A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and switch to internal oscillator if the external oscillator fails. Figure 9-1 on page 18 shows the principal clock system in XMEGA D4. 17 8135G–AVR–08/10 XMEGA D4 Figure 9-1. Clock system overview clkULP WDT/BOD 32 kHz ULP Internal Oscillator clkRTC RTC 32.768 kHz Calibrated Internal Oscillator PERIPHERALS ADC 2 MHz Run-Time Calibrated Internal Oscillator 32 MHz Run-time Calibrated Internal Oscillator CLOCK CONTROL clkPER UNIT with PLL and Prescaler PORTS ... INTERRUPT 32.768 KHz Crystal Oscillator EVSYS RAM 0.4 - 16 MHz Crystal Oscillator CPU clkCPU NVM MEMORY External Clock Input FLASH EEPROM Each clock source is briefly described in the following sub-sections. 9.3 9.3.1 Clock Options 32 kHz Ultra Low Power Internal Oscillator The 32 kHz Ultra Low Power (ULP) Internal Oscillator is a very low power consumption clock source. It is used for the Watchdog Timer, Brown-Out Detection and as an asynchronous clock source for the Real Time Counter. This oscillator cannot be used as the system clock source, and it cannot be directly controlled from software. 9.3.2 32.768 kHz Calibrated Internal Oscillator The 32.768 kHz Calibrated Internal Oscillator is a high accuracy clock source that can be used as the system clock source or as an asynchronous clock source for the Real Time Counter. It is calibrated during production to provide a default frequency which is close to its nominal frequency. 18 8135G–AVR–08/10 XMEGA D4 9.3.3 32.768 kHz Crystal Oscillator The 32.768 kHz Crystal Oscillator is a low power driver for an external watch crystal. It can be used as system clock source or as asynchronous clock source for the Real Time Counter. 9.3.4 0.4 - 16 MHz Crystal Oscillator The 0.4 - 16 MHz Crystal Oscillator is a driver intended for driving both external resonators and crystals ranging from 400 kHz to 16 MHz. 9.3.5 2 MHz Run-time Calibrated Internal Oscillator The 2 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 9.3.6 32 MHz Run-time Calibrated Internal Oscillator The 32 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32.768 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator. 9.3.7 External Clock input The external clock input gives the possibility to connect a clock from an external source. 9.3.8 PLL with Multiplication factor 1 - 31x The PLL provides the possibility of multiplying a frequency by any number from 1 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources. 19 8135G–AVR–08/10 XMEGA D4 10. Power Management and Sleep Modes 10.1 Features • 5 sleep modes – Idle – Power-down – Power-save – Standby – Extended standby • Power Reduction registers to disable clocks to unused peripherals 10.2 Overview XMEGA provides various sleep modes and software controlled clock gating in order to tailor power consumption to the application's requirement. Sleep modes enables the microcontroller to shut down unused modules to save power. When the device enters sleep mode, program execution is stopped and interrupts or reset is used to wake the device again. The individual clock to unused peripherals can be stopped during normal operation or in sleep, enabling a much more fine tuned power management than sleep modes alone 10.3 Sleep Modes Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA has five different sleep modes. A dedicated Sleep instruction (SLEEP) is available to enter sleep. Before executing SLEEP, the selected sleep mode to enter must be configured. The available interrupt wake-up sources is dependent on the selected sleep mode. When an enabled interrupt occurs the device will wake up and execute the interrupt service routine before continuing normal program execution from the first instruction after the SLEEP instruction. If other higher priority interrupts are pending when the wake-up occurs, their interrupt service routines will be executed according to their priority before the interrupt service routine for the wake-up interrupt is executed. After wake-up the CPU is halted for four cycles before execution starts. 10.3.1 Idle Mode In Idle mode the CPU and Non-Volatile Memory are stopped, but all peripherals including the Interrupt Controller and Event System are kept running. Interrupt requests from all enabled interrupts will wake the device. 10.3.2 Power-down Mode In Power-down mode all system clock sources, and the asynchronous Real Time Counter (RTC) clock source, are stopped. This allows operation of asynchronous modules only. The only interrupts that can wake up the MCU are the Two Wire Interface address match interrupts, and asynchronous port interrupts. 10.3.3 Power-save Mode Power-save mode is identical to Power-down, with one exception: If the Real Time Counter (RTC) is enabled, it will keep running during sleep and the device can also wake up from either RTC Overflow or Compare Match interrupt. 20 8135G–AVR–08/10 XMEGA D4 10.3.4 Standby Mode Standby mode is identical to Power-down with the exception that all enabled system clock sources are kept running, while the CPU, Peripheral and RTC clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 10.3.5 Extended Standby Mode Extended Standby mode is identical to Power-save mode with the exception that all enabled system clock sources are kept running while the CPU and Peripheral clocks are stopped. This reduces the wake-up time when external crystals or resonators are used. 21 8135G–AVR–08/10 XMEGA D4 11. System Control and Reset 11.1 Features • Multiple reset sources for safe operation and device reset – Power-On Reset – External Reset – Watchdog Reset The Watchdog Timer runs from separate, dedicated oscillator – Brown-Out Reset Accurate, programmable Brown-Out levels – PDI reset – Software reset • Asynchronous reset – No running clock in the device is required for reset • Reset status register 11.2 Resetting the AVR During reset, all I/O registers are set to their initial values. The SRAM content is not reset. Application execution starts from the Reset Vector. The instruction placed at the Reset Vector should be an Absolute Jump (JMP) instruction to the reset handling routine. By default the Reset Vector address is the lowest Flash program memory address, ‘0’, but it is possible to move the Reset Vector to the first address in the Boot Section. The I/O ports of the AVR are immediately tri-stated when a reset source goes active. The reset functionality is asynchronous, so no running clock is required to reset the device. After the device is reset, the reset source can be determined by the application by reading the Reset Status Register. 11.3 11.3.1 Reset Sources Power-On Reset The MCU is reset when the supply voltage VCC is below the Power-on Reset threshold voltage. 11.3.2 External Reset The MCU is reset when a low level is present on the RESET pin. 11.3.3 Watchdog Reset The MCU is reset when the Watchdog Timer period expires and the Watchdog Reset is enabled. The Watchdog Timer runs from a dedicated oscillator independent of the System Clock. For more details see ”WDT - Watchdog Timer” on page 23. 11.3.4 Brown-Out Reset The MCU is reset when the supply voltage VCC is below the Brown-Out Reset threshold voltage and the Brown-out Detector is enabled. The Brown-out threshold voltage is programmable. 22 8135G–AVR–08/10 XMEGA D4 11.3.5 PDI reset The MCU can be reset through the Program and Debug Interface (PDI). 11.3.6 Software reset The MCU can be reset by the CPU writing to a special I/O register through a timed sequence. 12. WDT - Watchdog Timer 12.1 Features • 11 selectable timeout periods, from 8 ms to 8s. • Two operation modes – Standard mode – Window mode • Runs from the 1 kHz output of the 32 kHz Ultra Low Power oscillator • Configuration lock to prevent unwanted changes 12.2 Overview The XMEGA D4 has a Watchdog Timer (WDT). The WDT will run continuously when turned on and if the Watchdog Timer is not reset within a software configurable time-out period, the microcontroller will be reset. The Watchdog Reset (WDR) instruction must be run by software to reset the WDT, and prevent microcontroller reset. The WDT has a Window mode. In this mode the WDR instruction must be run within a specified period called a window. Application software can set the minimum and maximum limits for this window. If the WDR instruction is not executed inside the window limits, the microcontroller will be reset. A protection mechanism using a timed write sequence is implemented in order to prevent unwanted enabling, disabling or change of WDT settings. For maximum safety, the WDT also has an Always-on mode. This mode is enabled by programming a fuse. In Always-on mode, application software can not disable the WDT. 23 8135G–AVR–08/10 XMEGA D4 13. PMIC - Programmable Multi-level Interrupt Controller 13.1 Features • Separate interrupt vector for each interrupt • Short, predictable interrupt response time • Programmable Multi-level Interrupt Controller – 3 programmable interrupt levels – Selectable priority scheme within low level interrupts (round-robin or fixed) – Non-Maskable Interrupts (NMI) • Interrupt vectors can be moved to the start of the Boot Section 13.2 Overview XMEGA D4 has a Programmable Multi-level Interrupt Controller (PMIC). All peripherals can define three different priority levels for interrupts; high, medium or low. Medium level interrupts may interrupt low level interrupt service routines. High level interrupts may interrupt both lowand medium level interrupt service routines. Low level interrupts have an optional round robin scheme to make sure all interrupts are serviced within a certain amount of time. The built in oscillator failure detection mechanism can issue a Non-Maskable Interrupt (NMI). 13.3 Interrupt vectors When an interrupt is serviced, the program counter will jump to the interrupt vector address. The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the XMEGA D4 devices are shown in Table 13-1. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA A manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 13-1. The program address is the word address. Table 13-1. Reset and Interrupt Vectors Program Address (Base Address) Source 0x000 RESET 0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI) 0x004 PORTC_INT_base Port C Interrupt base 0x008 PORTR_INT_base Port R Interrupt base 0x014 RTC_INT_base Real Time Counter Interrupt base 0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base 0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base 0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base 0x030 SPIC_INT_vect SPI on port C Interrupt vector 0x032 USARTC0_INT_base USART 0 on port C Interrupt base 0x040 NVM_INT_base Non-Volatile Memory Interrupt base 0x044 PORTB_INT_base Port B Interrupt base 0x056 PORTE_INT_base Port E Interrupt base Interrupt Description 24 8135G–AVR–08/10 XMEGA D4 Table 13-1. Reset and Interrupt Vectors (Continued) Program Address (Base Address) Source Interrupt Description 0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base 0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base 0x080 PORTD_INT_base Port D Interrupt base 0x084 PORTA_INT_base Port A Interrupt base 0x088 ACA_INT_base Analog Comparator on Port A Interrupt base 0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base 0x09A TCD0_INT_base Timer/Counter 0 on port D Interrupt base 0x0AE SPID_INT_vector SPI on port D Interrupt vector 0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base 25 8135G–AVR–08/10 XMEGA D4 14. I/O Ports 14.1 Features • Selectable input and output configuration for each pin individually • Flexible pin configuration through dedicated Pin Configuration Register • Synchronous and/or asynchronous input sensing with port interrupts and events • • • • • • • • • 14.2 – Sense both edges – Sense rising edges – Sense falling edges – Sense low level Asynchronous wake-up from all input sensing configurations Highly configurable output driver and pull settings: – Totem-pole – Pull-up/-down – Wired-AND – Wired-OR – Bus keeper – Inverted I/O Flexible pin masking Configuration of multiple pins in a single operation Read-Modify-Write (RMW) support Toggle/clear/set registers for Output and Direction registers Clock output on port pin Event Channel 0 output on port pin 7 Mapping of port registers (virtual ports) into bit accessible I/O memory space Overview The XMEGA D4 devices have flexible General Purpose I/O Ports. A port consists of up to 8 pins, ranging from pin 0 to pin 7. The ports implement several functions, including synchronous/asynchronous input sensing, pin change interrupts and configurable output settings. All functions are individual per pin, but several pins may be configured in a single operation. 14.3 I/O configuration All port pins (Pn) have programmable output configuration. In addition, all port pins have an inverted I/O function. For an input, this means inverting the signal between the port pin and the pin register. For an output, this means inverting the output signal between the port register and the port pin. The inverted I/O function can be used also when the pin is used for alternate functions. 26 8135G–AVR–08/10 XMEGA D4 14.3.1 Push-pull Figure 14-1. I/O configuration - Totem-pole DIRn OUTn Pn INn 14.3.2 Pull-down Figure 14-2. I/O configuration - Totem-pole with pull-down (on input) DIRn OUTn Pn INn 14.3.3 Pull-up Figure 14-3. I/O configuration - Totem-pole with pull-up (on input) DIRn OUTn Pn INn 14.3.4 Bus-keeper The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’. 27 8135G–AVR–08/10 XMEGA D4 Figure 14-4. I/O configuration - Totem-pole with bus-keeper DIRn OUTn Pn INn 14.3.5 Others Figure 14-5. Output configuration - Wired-OR with optional pull-down OUTn Pn INn Figure 14-6. I/O configuration - Wired-AND with optional pull-up INn Pn OUTn 28 8135G–AVR–08/10 XMEGA D4 14.4 Input sensing • • • • Sense both edges Sense rising edges Sense falling edges Sense low level Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 14-7 on page 29. Figure 14-7. Input sensing system overview Asynchronous sensing EDGE DETECT Interrupt Control IREQ Synchronous sensing Pn Synchronizer INn Q D D INVERTED I/O R Q EDGE DETECT Event R When a pin is configured with inverted I/O, the pin value is inverted before the input sensing. 14.5 Port Interrupt Each port has two interrupts with separate priority and interrupt vector. All pins on the port can be individually selected as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each pin configured as source for the interrupt. 14.6 Alternate Port Functions In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulse-width modulation. ”Pinout and Pin Functions” on page 46 shows which modules on peripherals that enable alternate functions on a pin, and which alternate function is available on a pin. 29 8135G–AVR–08/10 XMEGA D4 15. T/C - 16-bit Timer/Counter 15.1 Features • Four 16-bit Timer/Counters • • • • • • • • • • • 15.2 – Three Timer/Counters of type 0 – One Timer/Counters of type 1 Three Compare or Capture (CC) Channels in Timer/Counter 0 Two Compare or Capture (CC) Channels in Timer/Counter 1 Double Buffered Timer Period Setting Double Buffered Compare or Capture Channels Waveform Generation: – Single Slope Pulse Width Modulation – Dual Slope Pulse Width Modulation – Frequency Generation Input Capture: – Input Capture with Noise Cancelling – Frequency capture – Pulse width capture – 32-bit input capture Event Counter with Direction Control Timer Overflow and Timer Error Interrupts and Events One Compare Match or Capture Interrupt and Event per CC Channel Hi-Resolution Extension (Hi-Res) Advanced Waveform Extension (AWEX) Overview XMEGA D4 has four Timer/Counters, three Timer/Counter 0 and one Timer/Counter 1. The difference between them is that Timer/Counter 0 has four Compare/Capture channels, while Timer/Counter 1 has two Compare/Capture channels. The Timer/Counters (T/C) are 16-bit and can count any clock, event or external input in the microcontroller. A programmable prescaler is available to get a useful T/C resolution. Updates of Timer and Compare registers are double buffered to ensure glitch free operation. Single slope PWM, dual slope PWM and frequency generation waveforms can be generated using the Compare Channels. Through the Event System, any input pin or event in the microcontroller can be used to trigger input capture, hence no dedicated pins are required for this. The input capture has a noise canceller to avoid incorrect capture of the T/C, and can be used to do frequency and pulse width measurements. A wide range of interrupt or event sources are available, including T/C Overflow, Compare match and Capture for each Compare/Capture channel in the T/C. PORTC has one Timer/Counter 0 and one Timer/Counter1. PORTD and PORTE each have one Timer/Conter0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0 and TCE0, respectively. 30 8135G–AVR–08/10 XMEGA D4 Figure 15-1. Overview of a Timer/Counter and closely related peripherals Timer/Counter Base Counter Prescaler clkPER Timer Period Control Logic Counter Event System clkPER4 Buffer Capture Control Waveform Generation DTI Dead-Time Insertion Pattern Generation Fault Protection PORT Comparator AWeX Hi-Res Compare/Capture Channel D Compare/Capture Channel C Compare/Capture Channel B Compare/Capture Channel A The Hi-Resolution Extension can be enabled to increase the waveform generation resolution by 2 bits (4x). This is available for all Timer/Counters. See ”Hi-Res - High Resolution Extension” on page 33 for more details. The Advanced Waveform Extension can be enabled to provide extra and more advanced feature for the Timer/Counter. This is only available for Timer/Counter 0. See ”AWEX - Advanced Waveform Extension” on page 32 for more details. 31 8135G–AVR–08/10 XMEGA D4 16. AWEX - Advanced Waveform Extension 16.1 Features • • • • • • • • 16.2 Output with complementary output from each Capture channel Four Dead Time Insertion (DTI) Units, one for each Capture channel 8-bit DTI Resolution Separate High and Low Side Dead-Time Setting Double Buffered Dead-Time Event Controlled Fault Protection Single Channel Multiple Output Operation (for BLDC motor control) Double Buffered Pattern Generation Overview The Advanced Waveform Extension (AWEX) provides extra features to the Timer/Counter in Waveform Generation (WG) modes. The AWEX enables easy and safe implementation of for example, advanced motor control (AC, BLDC, SR, and Stepper) and power control applications. Any WG output from a Timer/Counter 0 is split into a complimentary pair of outputs when any AWEX feature is enabled. These output pairs go through a Dead-Time Insertion (DTI) unit that enables generation of the non-inverted Low Side (LS) and inverted High Side (HS) of the WG output with dead time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. Optionally the final output can be inverted by using the invert I/O setting for the port pin. The Pattern Generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the waveform generator output from Compare Channel A can be distributed to, and override all port pins. When the Pattern Generator unit is enabled, the DTI unit is bypassed. The Fault Protection unit is connected to the Event System. This enables any event to trigger a fault condition that will disable the AWEX output. Several event channels can be used to trigger fault on several different conditions. The AWEX is available for TCC0. The notation of this is AWEXC. 32 8135G–AVR–08/10 XMEGA D4 17. Hi-Res - High Resolution Extension 17.1 Features • Increases Waveform Generator resolution by 2-bits (4x) • Supports Frequency, single- and dual-slope PWM operation • Supports the AWEX when this is enabled and used for the same Timer/Counter 17.2 Overview The Hi-Resolution (Hi-Res) Extension is able to increase the resolution of the waveform generation output by a factor of 4. When enabled for a Timer/Counter, the Fast Peripheral clock running at four times the CPU clock speed will be as input to the Timer/Counter. The High Resolution Extension can also be used when an AWEX is enabled and used with a Timer/Counter. XMEGA D4 devices have one Hi-Res Extension that can be enabled for each Timer/Counter on PORTC. The notation of this is HIRESC. 33 8135G–AVR–08/10 XMEGA D4 18. RTC - 16-bit Real-Time Counter 18.1 Features • • • • • • 18.2 16-bit Timer Flexible Tick resolution ranging from 1 Hz to 32.768 kHz One Compare register One Period register Clear timer on Overflow or Compare Match Overflow or Compare Match event and interrupt generation Overview The XMEGA D4 includes a 16-bit Real-time Counter (RTC). The RTC can be clocked from an accurate 32.768 kHz Crystal Oscillator, the 32.768 kHz Calibrated Internal Oscillator, or from the 32 kHz Ultra Low Power Internal Oscillator. The RTC includes both a Period and a Compare register. For details, see Figure 18-1. A wide range of Resolution and Time-out periods can be configured using the RTC. With a maximum resolution of 30.5 µs, time-out periods range up to 2000 seconds. With a resolution of 1 second, the maximum time-out period is over 18 hours (65536 seconds). Figure 18-1. Real Time Counter overview Period Overflow 32.768 kHz = 10-bit prescaler 1.024 kHz Counter = Compare Match Compare 34 8135G–AVR–08/10 XMEGA D4 19. TWI - Two-Wire Interface 19.1 Features • • • • • • • • • • • • 19.2 Two identical TWI peripherals Simple yet Powerful and Flexible Communication Interface Both Master and Slave Operation Supported Device can Operate as Transmitter or Receiver 7-bit Address Space Allows up to 128 Different Slave Addresses Multi-master Arbitration Support Up to 400 kHz Data Transfer Speed Slew-rate Limited Output Drivers Noise Suppression Circuitry Rejects Spikes on Bus Lines Fully Programmable Slave Address with General Call Support Address Recognition Causes Wake-up when in Sleep Mode I2C and System Management Bus (SMBus) compatible Overview The Two-Wire Interface (TWI) is a bi-directional wired-AND bus with only two lines, the clock (SCL) line and the data (SDA) line. The protocol makes it possible to interconnect up to 128 individually addressable devices. Since it is a multi-master bus, one or more devices capable of taking control of the bus can be connected. The only external hardware needed to implement the bus is a single pull-up resistor for each of the TWI bus lines. Mechanisms for resolving bus contention are inherent in the TWI protocol. PORTC and PORTE each has one TWI. Notation of these peripherals are TWIC and TWIE, respectively. 35 8135G–AVR–08/10 XMEGA D4 20. SPI - Serial Peripheral Interface 20.1 Features • • • • • • • • • 20.2 Two Identical SPI peripherals Full-duplex, Three-wire Synchronous Data Transfer Master or Slave Operation LSB First or MSB First Data Transfer Seven Programmable Bit Rates End of Transmission Interrupt Flag Write Collision Flag Protection Wake-up from Idle Mode Double Speed (CK/2) Master SPI Mode Overview The Serial Peripheral Interface (SPI) allows high-speed full-duplex, synchronous data transfer between different devices. Devices can communicate using a master-slave scheme, and data is transferred both to and from the devices simultaneously. PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID, respectively. 36 8135G–AVR–08/10 XMEGA D4 21. USART 21.1 Features • • • • • • • • • • • • • • • 21.2 Two Identical USART peripherals Full Duplex Operation (Independent Serial Receive and Transmit Registers) Asynchronous or Synchronous Operation Master or Slave Clocked Synchronous Operation High-resolution Arithmetic Baud Rate Generator Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits Odd or Even Parity Generation and Parity Check Supported by Hardware Data OverRun Detection Framing Error Detection Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete Multi-processor Communication Mode Double Speed Asynchronous Communication Mode Master SPI mode for SPI communication IrDA support through the IRCOM module Overview The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a highly flexible serial communication module. The USART supports full duplex communication, and both asynchronous and clocked synchronous operation. The USART can also be set in Master SPI mode to be used for SPI communication. Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both direction, enabling continued data transmission without any delay between frames. There are separate interrupt vectors for receive and transmit complete, enabling fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled. One USART can use the IRCOM module to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2 kbps. PORTC and PORTD each has one USART. Notation of these peripherals are USARTC0, and USARTD0, respectively. 37 8135G–AVR–08/10 XMEGA D4 22. IRCOM - IR Communication Module 22.1 Features • Pulse modulation/demodulation for infrared communication • Compatible to IrDA 1.4 physical for baud rates up to 115.2 kbps • Selectable pulse modulation scheme – 3/16 of baud rate period – Fixed pulse period, 8-bit programmable – Pulse modulation disabled • Built in filtering • Can be connected to and used by one USART at a time 22.2 Overview XMEGA contains an Infrared Communication Module (IRCOM) for IrDA communication with baud rates up to 115.2 kbps. This supports three modulation schemes: 3/16 of baud rate period, fixed programmable pulse time based on the Peripheral Clock speed, or pulse modulation disabled. There is one IRCOM available which can be connected to any USART to enable infrared pulse coding/decoding for that USART. 38 8135G–AVR–08/10 XMEGA D4 23. ADC - 12-bit Analog to Digital Converter 23.1 Features • • • • • • • • • • • 23.2 One ADC with 12-bit resolution 200 ksps sample rate Signed and Unsigned conversions 12 single ended inputs 8x4 differential inputs 3 internal inputs: – Integrated Temperature Sensor – VCC voltage divided by 10 – Bandgap voltage Software selectable gain of 2, 4, 8, 16, 32 or 64 Software Selectable accuracy of 8- or 12-bit. Internal or External Reference selection Event triggered conversion for accurate timing Interrupt/Event on compare result Overview XMEGA D4 devices have one Analog to Digital Converter (ADC), see Figure 23-1 on page 40. The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 200K samples per second. The input selection is flexible, and both singleended and differential measurements can be done. For differential measurements an optional gain stage is available to increase the dynamic range. In addition several internal signal inputs are available. The ADC can provide both signed and unsigned results. ADC measurements can either be started by application software or an incoming event from another peripheral in the device. The latter ensure the ADC measurements can be started with predictable timing, and without software intervention. The ADC has one channel, meaning there is one input selection (MUX selection) and one result register available. Both internal and external analog reference voltages can be used. A very accurate internal 1.00V reference is available. An integrated temperature sensor is available and the output from this can be measured with the ADC. A VCC/10 signal and the Bandgap voltage can also be measured by the ADC. 39 8135G–AVR–08/10 XMEGA D4 Figure 23-1. ADC overview Internal inputs C hannel A M U X selection Pin inputs Pin inputs C onfiguration R eference selection ADC 1-64 X C hannel A R egister E vent Trigger The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 0.5 µs for 12-bit to 3.7 µs for 8-bit result. ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number). PORTA has one ADC. Notation of this peripheral is ADCA. 40 8135G–AVR–08/10 XMEGA D4 24. AC - Analog Comparator 24.1 Features • Two Analog Comparators • Selectable hysteresis • • • • 24.2 – No, Small or Large Analog Comparator output available on pin Flexible Input Selection – All pins on the port – Bandgap reference voltage. – Voltage scaler that can perform a 64-level scaling of the internal VCC voltage. Interrupt and event generation on – Rising edge – Falling edge – Toggle Window function interrupt and event generation on – Signal above window – Signal inside window – Signal below window Overview XMEGA D4 features two Analog Comparators (AC). An Analog Comparator compares two voltages, and the output indicates which input is largest. The Analog Comparator may be configured to give interrupt requests and/or events upon several different combinations of input change. Hysteresis can be adjusted in order to find the optimal operation for each application. A wide range of input selection is available, both external pins and several internal signals can be used. The Analog Comparators are always grouped in pairs (AC0 and AC1) on each analog port. They have identical behavior but separate control registers. Optionally, the state of the comparator is directly available on a pin. PORTA and has one AC pair. Notations of this peripheral is ACA. 41 8135G–AVR–08/10 XMEGA D4 Figure 24-1. Analog comparator overview Pin inputs Internal inputs + Pin 0 output AC0 Pin inputs - Internal inputs VCC scaled Interrupt sensitivity control Pin inputs Interrupts Events Internal inputs + AC1 Pin inputs - Internal inputs VCC scaled 42 8135G–AVR–08/10 XMEGA D4 24.3 Input Selection The Analog comparators have a very flexible input selection and the two comparators grouped in a pair may be used to realize a window function. One pair of analog comparators is shown in Figure 24-1 on page 42. • Input selection from pin – Pin 0, 1, 2, 3, 4, 5, 6 selectable to positive input of analog comparator – Pin 0, 1, 3, 5, 7 selectable to negative input of analog comparator • Internal signals available on positive analog comparator inputs • Internal signals available on negative analog comparator inputs – 64-level scaler of the VCC, available on negative analog comparator input – Bandgap voltage reference 24.4 Window Function The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 24-2. Figure 24-2. Analog comparator window function + AC0 Upper limit of window Interrupt sensitivity control Input signal Interrupts Events + AC1 Lower limit of window - 43 8135G–AVR–08/10 XMEGA D4 25. OCD - On-chip Debug 25.1 Features • Complete Program Flow Control – Go, Stop, Reset, Step into, Step over, Step out, Run-to-Cursor Debugging on C and high-level language source code level Debugging on Assembler and disassembler level 1 dedicated program address or source level breakpoint for AVR Studio / debugger 4 Hardware Breakpoints Unlimited Number of User Program Breakpoints Unlimited Number of User Data Breakpoints, with break on: – Data location read, write or both read and write – Data location content equal or not equal to a value – Data location content is greater or less than a value – Data location content is within or outside a range – Bits of a data location are equal or not equal to a value • Non-Intrusive Operation – No hardware or software resources in the device are used • High Speed Operation – No limitation on debug/programming clock frequency versus system clock frequency • • • • • • 25.2 Overview The XMEGA D4 has a powerful On-Chip Debug (OCD) system that - in combination with Atmel’s development tools - provides all the necessary functions to debug an application. It has support for program and data breakpoints, and can debug an application from C and high level language source code level, as well as assembler and disassembler level. It has full Non-Intrusive Operation and no hardware or software resources in the device are used. The ODC system is accessed through an external debugging tool which connects to the PDI physical interface. Refer to ”PDI - Program and Debug Interface” on page 45. 44 8135G–AVR–08/10 XMEGA D4 26. PDI - Program and Debug Interface 26.1 Features • PDI - Program and Debug Interface (Atmel proprietary 2-pin interface) • Access to the OCD system • Programming of Flash, EEPROM, Fuses and Lock Bits 26.2 Overview The programming and debug facilities are accessed through PDI physical interface. The PDI physical interface uses one dedicated pin together with the Reset pin, and no general purpose pins are used. 26.3 PDI - Program and Debug Interface The PDI is an Atmel proprietary protocol for communication between the microcontroller and Atmel’s development tools. 45 8135G–AVR–08/10 XMEGA D4 27. Pinout and Pin Functions The pinout of XMEGA D4 is shown in ”Pinout/Block Diagram” on page 3. In addition to general I/O functionality, each pin may have several functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the alternate pin functions can be used at time. 27.1 Alternate Pin Functions Description The tables below shows the notation for all pin functions available and describe their functions. 27.1.1 27.1.2 27.1.3 27.1.4 Operation/Power Supply VCC Digital supply voltage AVCC Analog supply voltage GND Ground Port Interrupt functions SYNC Port pin with full synchronous and limited asynchronous interrupt function ASYNC Port pin with full synchronous and full asynchronous interrupt function Analog functions ACn Analog Comparator input pin n AC0OUT Analog Comparator 0 Output ADCn Analog to Digital Converter input pin n AREF Analog Reference input pin Timer/Counter and AWEX functions OCnx Output Compare Channel x for Timer/Counter n OCnx Inverted Output Compare Channel x for Timer/Counter n OCnxLS Output Compare Channel x Low Side for Timer/Counter n OCnxHS Output Compare Channel x High Side for Timer/Counter n 46 8135G–AVR–08/10 XMEGA D4 27.1.5 27.1.6 27.1.7 Communication functions SCL Serial Clock for TWI SDA Serial Data for TWI XCKn Transfer Clock for USART n RXDn Receiver Data for USART n TXDn Transmitter Data for USART n SS Slave Select for SPI MOSI Master Out Slave In for SPI MISO Master In Slave Out for SPI SCK Serial Clock for SPI Oscillators, Clock and Event TOSCn Timer Oscillator pin n XTALn Input/Output for inverting Oscillator pin n Debug/System functions RESET Reset pin PDI_CLK Program and Debug Interface Clock pin PDI_DATA Program and Debug Interface Data pin 47 8135G–AVR–08/10 XMEGA D4 27.2 Alternate Pin Functions The tables below shows the main and alternate pin functions for all pins on each port. It also shows which peripheral which make use of or enable the alternate pin function. Table 27-1. PORTA Port A - Alternate functions PIN # INTERRUPT ADCA POS ADCA NEG ADCA GAINPOS ADCA GAINNEG ACA POS ACA NEG GND 38 AVCC 39 PA0 40 SYNC ADC0 ADC0 ADC0 AC0 AC0 PA1 41 SYNC ADC1 ADC1 ADC1 AC1 AC1 PA2 42 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 PA3 43 SYNC ADC3 ADC3 ADC3 AC3 PA4 44 SYNC ADC4 ADC4 ADC4 AC4 PA5 1 SYNC ADC5 ADC5 ADC5 AC5 PA6 2 SYNC ADC6 ADC6 ADC6 AC6 PA7 3 SYNC ADC7 ADC7 ADC7 Table 27-2. PORTB PIN # INTERRUPT ADCA POS REF AREF 4 SYNC ADC8 PB1 5 SYNC ADC9 PB2 6 SYNC/ASYNC ADC10 PB3 7 SYNC ADC11 PORTC GND REF AREF AC3 AC5 AC7 AC0 OUT TWIC CLOCKOUT EVENTOUT CLKOUT EVOUT Port B - Alternate functions PB0 Table 27-3. ACA OUT Port C - Alternate functions PIN # INTERRUPT TCC0 AWEXC SYNC OC0A OC0ALS TCC1 USARTC0 SPI 8 VCC 9 PC0 10 PC1 11 SYNC OC0B OC0AHS XCK0 PC2 12 SYNC/ASYNC OC0C OC0BLS RXD0 PC3 13 SYNC OC0D OC0BHS TXD0 PC4 14 SYNC OC0CLS OC1A PC5 15 SYNC OC0CHS OC1B PC6 16 SYNC OC0DLS MISO PC7 17 SYNC OC0DHS SCK SDA SCL SS MOSI 48 8135G–AVR–08/10 XMEGA D4 Table 27-4. Port D - Alternate functions PORTD PIN # INTERRUPT TCD0 SYNC OC0A USARTD0 SPID GND 18 VCC 19 PD0 20 PD1 21 SYNC OC0B XCK0 PD2 22 SYNC/ASYNC OC0C RXD0 PD3 23 SYNC OC0D TXD0 PD4 24 SYNC SS PD5 25 SYNC MOSI PD6 26 SYNC MISO PD7 27 SYNC SCK Table 27-5. PORT E CLOCKOUT EVENTOUT CLKOUT EVOUT Port E - Alternate functions PIN # INTERRUPT TCE0 TWIE PE0 28 SYNC OC0A SDA PE1 29 SYNC OC0B SCL GND 30 VCC 31 PE2 32 SYNC/ASYNC OC0C PE3 33 SYNC OC0D Table 27-6. PORTR Port R - Alternate functions PIN # XTAL PDI TOSC PDI 34 PDI_DATA RESET 35 PDI_CLK PR0 36 XTAL2 TOSC2 PR1 37 XTAL1 TOSC1 49 8135G–AVR–08/10 XMEGA D4 28. Peripheral Module Address Map The address maps show the base address for each peripheral and module in XMEGA D4. For complete register description and summary for each peripheral module, refer to the XMEGA A Manual. Table 28-1. Base Address 0x0000 0x0010 0x0014 0x0018 0x001C 0x0030 0x0040 0x0048 0x0050 0x0060 0x0068 0x0070 0x0078 0x0080 0x0090 0x00A0 0x00B0 0x0180 0x01C0 0x0200 0x0380 0x0400 0x0480 0x04A0 0x0600 0x0620 0x0640 0x0660 0x0680 0x07E0 0x0800 0x0840 0x0880 0x0890 0x08A0 0x08C0 0x08F8 0x0900 0x09A0 0x09C0 0x0A00 Peripheral Module Address Map Name Description GPIO VPORT0 VPORT1 VPORT2 VPORT3 CPU CLK SLEEP OSC DFLLRC32M DFLLRC2M PR RST WDT MCU PMIC PORTCFG EVSYS NVM ADCA ACA RTC TWIC TWIE PORTA PORTB PORTC PORTD PORTE PORTR TCC0 TCC1 AWEXC HIRESC USARTC0 SPIC IRCOM TCD0 USARTD0 SPID TCE0 General Purpose IO Registers Virtual Port 0 Virtual Port 1 Virtual Port 2 Virtual Port 2 CPU Clock Control Sleep Controller Oscillator Control DFLL for the 32 MHz Internal RC Oscillator DFLL for the 2 MHz RC Oscillator Power Reduction Reset Controller Watch-Dog Timer MCU Control Programmable MUltilevel Interrupt Controller Port Configuration Event System Non Volatile Memory (NVM) Controller Analog to Digital Converter on port A Analog Comparator pair on port A Real Time Counter Two Wire Interface on port C Two Wire Interface on port E Port A Port B Port C Port D Port E Port R Timer/Counter 0 on port C Timer/Counter 1 on port C Advanced Waveform Extension on port C High Resolution Extension on port C USART 0 on port C Serial Peripheral Interface on port C Infrared Communication Module Timer/Counter 0 on port D USART 0 on port D Serial Peripheral Interface on port D Timer/Counter 0 on port E 50 8135G–AVR–08/10 XMEGA D4 29. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks Arithmetic and Logic Instructions Add without Carry Rd ← Rd + Rr Z,C,N,V,S,H 1 Rd, Rr Add with Carry Rd ← Rd + Rr + C Z,C,N,V,S,H 1 Rd, K Add Immediate to Word Rd ← Rd + 1:Rd + K Z,C,N,V,S 2 SUB Rd, Rr Subtract without Carry Rd ← Rd - Rr Z,C,N,V,S,H 1 SUBI Rd, K Subtract Immediate Rd ← Rd - K Z,C,N,V,S,H 1 SBC Rd, Rr Subtract with Carry Rd ← Rd - Rr - C Z,C,N,V,S,H 1 SBCI Rd, K Subtract Immediate with Carry Rd ← Rd - K - C Z,C,N,V,S,H 1 SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd ← Rd + 1:Rd - K Z,C,N,V,S 2 ADD Rd, Rr ADC ADIW AND Rd, Rr Logical AND Rd ← Rd • Rr Z,N,V,S 1 ANDI Rd, K Logical AND with Immediate Rd ← Rd • K Z,N,V,S 1 OR Rd, Rr Logical OR Rd ← Rd v Rr Z,N,V,S 1 ORI Rd, K Logical OR with Immediate Rd ← Rd v K Z,N,V,S 1 EOR Rd, Rr Exclusive OR Rd ← Rd ⊕ Rr Z,N,V,S 1 COM Rd One’s Complement Rd ← $FF - Rd Z,C,N,V,S 1 NEG Rd Two’s Complement Rd ← $00 - Rd Z,C,N,V,S,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V,S 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • ($FFh - K) Z,N,V,S 1 INC Rd Increment Rd ← Rd + 1 Z,N,V,S 1 DEC Rd Decrement Rd ← Rd - 1 Z,N,V,S 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V,S 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V,S 1 SER Rd Set Register Rd ← $FF None 1 MUL Rd,Rr Multiply Unsigned R1:R0 ← Rd x Rr (UU) Z,C 2 MULS Rd,Rr Multiply Signed R1:R0 ← Rd x Rr (SS) Z,C 2 MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr (SU) Z,C 2 FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 ← Rd x Rr<<1 (UU) Z,C 2 FMULS Rd,Rr Fractional Multiply Signed R1:R0 ← Rd x Rr<<1 (SS) Z,C 2 FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 ← Rd x Rr<<1 (SU) Z,C 2 RJMP k Relative Jump PC ← PC + k + 1 None 2 Branch Instructions IJMP Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 EIJMP Extended Indirect Jump to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 2 JMP k Jump PC ← k None 3 RCALL k Relative Call Subroutine PC ← PC + k + 1 None 2 / 3(1) ICALL Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, 0 None 2 / 3(1) EICALL Extended Indirect Call to (Z) PC(15:0) PC(21:16) ← ← Z, EIND None 3(1) PC ← k None 3 / 4(1) CALL k call Subroutine 51 8135G–AVR–08/10 XMEGA D4 Mnemonics Operands Description Operation Flags #Clocks RET Subroutine Return PC ← STACK None 4 / 5(1) RETI Interrupt Return PC ← STACK I 4 / 5(1) if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CPSE Rd,Rr Compare, Skip if Equal CP Rd,Rr Compare CPC Rd,Rr Compare with Carry CPI Rd,K Compare with Immediate SBRC Rr, b Skip if Bit in Register Cleared SBRS Rr, b Skip if Bit in Register Set SBIC A, b Skip if Bit in I/O Register Cleared SBIS A, b Skip if Bit in I/O Register Set BRBS s, k BRBC BREQ Rd - Rr Z,C,N,V,S,H 1 Rd - Rr - C Z,C,N,V,S,H 1 Rd - K Z,C,N,V,S,H 1 if (Rr(b) = 0) PC ← PC + 2 or 3 None 1/2/3 if (Rr(b) = 1) PC ← PC + 2 or 3 None 1/2/3 if (I/O(A,b) = 0) PC ← PC + 2 or 3 None 2/3/4 If (I/O(A,b) =1) PC ← PC + 2 or 3 None 2/3/4 Branch if Status Flag Set if (SREG(s) = 1) then PC ← PC + k + 1 None 1/2 s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC ← PC + k + 1 None 1/2 k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if (I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if (I = 0) then PC ← PC + k + 1 None 1/2 Data Transfer Instructions MOV Rd, Rr Copy Register MOVW Rd, Rr Copy Register Pair LDI Rd, K Load Immediate Rd ← Rr None 1 Rd+1:Rd ← Rr+1:Rr None 1 Rd ← K None 1 LDS Rd, k Load Direct from data space Rd ← (k) None 2 LD Rd, X Load Indirect Rd ← (X) None 1(1)(2) LD Rd, X+ Load Indirect and Post-Increment Rd X ← ← (X) X+1 None 1(1)(2) LD Rd, -X Load Indirect and Pre-Decrement X ← X - 1, Rd ← (X) ← ← X-1 (X) None 2(1)(2) LD Rd, Y Load Indirect Rd ← (Y) ← (Y) None 1(1)(2) LD Rd, Y+ Load Indirect and Post-Increment Rd Y ← ← (Y) Y+1 None 1(1)(2) (1)(2) 52 8135G–AVR–08/10 XMEGA D4 Mnemonics Operands Description Flags #Clocks LD Rd, -Y Load Indirect and Pre-Decrement Y Rd ← ← Y-1 (Y) None 2(1)(2) LDD Rd, Y+q Load Indirect with Displacement Rd ← (Y + q) None 2(1)(2) LD Rd, Z Load Indirect Rd ← (Z) None 1(1)(2) LD Rd, Z+ Load Indirect and Post-Increment Rd Z ← ← (Z), Z+1 None 1(1)(2) LD Rd, -Z Load Indirect and Pre-Decrement Z Rd ← ← Z - 1, (Z) None 2(1)(2) LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2(1)(2) STS k, Rr Store Direct to Data Space (k) ← Rd None 2(1) ST X, Rr Store Indirect (X) ← Rr None 1(1) ST X+, Rr Store Indirect and Post-Increment (X) X ← ← Rr, X+1 None 1(1) ST -X, Rr Store Indirect and Pre-Decrement X (X) ← ← X - 1, Rr None 2(1) ST Y, Rr Store Indirect (Y) ← Rr None 1(1) ST Y+, Rr Store Indirect and Post-Increment (Y) Y ← ← Rr, Y+1 None 1(1) ST -Y, Rr Store Indirect and Pre-Decrement Y (Y) ← ← Y - 1, Rr None 2(1) STD Y+q, Rr Store Indirect with Displacement (Y + q) ← Rr None 2(1) ST Z, Rr Store Indirect (Z) ← Rr None 1(1) ST Z+, Rr Store Indirect and Post-Increment (Z) Z ← ← Rr Z+1 None 1(1) ST -Z, Rr Store Indirect and Pre-Decrement Z ← Z-1 None 2(1) STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2(1) Load Program Memory R0 ← (Z) None 3 LPM Operation LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Increment Rd Z ← ← (Z), Z+1 None 3 Extended Load Program Memory R0 ← (RAMPZ:Z) None 3 ELPM ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3 ELPM Rd, Z+ Extended Load Program Memory and PostIncrement Rd Z ← ← (RAMPZ:Z), Z+1 None 3 Store Program Memory (RAMPZ:Z) ← R1:R0 None - (RAMPZ:Z) Z ← ← R1:R0, Z+2 None - Rd ← I/O(A) None 1 I/O(A) ← Rr None 1 STACK ← Rr None 1(1) Rd ← STACK None 2(1) Rd(n+1) Rd(0) C ← ← ← Rd(n), 0, Rd(7) Z,C,N,V,H 1 Rd(n) Rd(7) C ← ← ← Rd(n+1), 0, Rd(0) Z,C,N,V 1 SPM SPM Z+ Store Program Memory and Post-Increment by 2 IN Rd, A In From I/O Location OUT A, Rr Out To I/O Location PUSH Rr Push Register on Stack POP Rd Pop Register from Stack Bit and Bit-test Instructions LSL Rd Logical Shift Left LSR Rd Logical Shift Right 53 8135G–AVR–08/10 XMEGA D4 Mnemonics Operands Description Operation ROL Rd Rotate Left Through Carry ROR Rd ASR Flags #Clocks Rd(0) Rd(n+1) C ← ← ← C, Rd(n), Rd(7) Z,C,N,V,H 1 Rotate Right Through Carry Rd(7) Rd(n) C ← ← ← C, Rd(n+1), Rd(0) Z,C,N,V 1 Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0) ↔ Rd(7..4) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 SBI A, b Set Bit in I/O Register I/O(A, b) ← 1 None 1 CBI A, b Clear Bit in I/O Register I/O(A, b) ← 0 None 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C 1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z 1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I 1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S 1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Two’s Complement Overflow V ← 1 V 1 CLV Clear Two’s Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T 1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H 1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 MCU Control Instructions BREAK Break NOP No Operation SLEEP Sleep WDR Watchdog Reset Notes: (See specific descr. for BREAK) None 1 None 1 (see specific descr. for Sleep) None 1 (see specific descr. for WDR) None 1 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface. 2. One extra cycle must be added when accessing Internal SRAM. 54 8135G–AVR–08/10 XMEGA D4 30. Packaging information 30.1 44A PIN 1 B PIN 1 IDENTIFIER E1 e E D1 D C 0˚~7˚ A1 A2 A L COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 SYMBOL Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. A2 0.95 1.00 1.05 D 11.75 12.00 12.25 D1 9.90 10.00 10.10 E 11.75 12.00 12.25 E1 9.90 10.00 10.10 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e NOTE Note 2 Note 2 0.80 TYP 10/5/2001 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. REV. 44A B 55 8135G–AVR–08/10 XMEGA D4 30.2 44M1 D Marked Pin# 1 ID E SEATING PLANE A1 TOP VIEW A3 A K L Pin #1 Corner D2 1 2 3 Option A SIDE VIEW Pin #1 Triangle E2 Option B K Option C b e Pin #1 Chamfer (C 0.30) Pin #1 Notch (0.20 R) BOTTOM VIEW COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A 0.80 0.90 1.00 A1 – 0.02 0.05 A3 0.20 REF b 0.18 0.23 0.30 D 6.90 7.00 7.10 D2 5.00 5.20 5.40 E 6.90 7.00 7.10 E2 5.00 5.20 5.40 e Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3. NOTE 0.50 BSC L 0.59 0.64 0.69 K 0.20 0.26 0.41 9/26/08 Package Drawing Contact: [email protected] TITLE 44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally Enhanced Plastic Very Thin Quad Flat No Lead Package (VQFN) GPC ZWS DRAWING NO. REV. 44M1 H 56 8135G–AVR–08/10 XMEGA D4 30.3 49C2 E A1 BALL ID 0.10 D A1 TOP VIEW A A2 SIDE VIEW E1 G e F E D D1 COMMON DIMENSIONS (Unit of Measure = mm) C B 1 A1 BALL CORNER MIN NOM MAX A – – 1.00 A1 0.20 – – A2 0.65 – – D 4.90 5.00 5.10 SYMBOL A 2 3 4 5 b 6 7 e BOTTOM VIEW 49 - Ø0.35 ± 0.05 D1 E 3.90 BSC 4.90 5.00 E1 b NOTE 5.10 3.90 BSC 0.30 0.35 e 0.40 0.65 BSC 3/14/08 Package Drawing Contact: [email protected] TITLE 49C2, 49-ball (7 x 7 Array), 0.65 mm Pitch, 5.0 x 5.0 x 1.0 mm, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GPC CBD DRAWING NO. REV. 49C2 A 57 8135G–AVR–08/10 XMEGA D4 31. Electrical Characteristics 31.1 Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin with respect to Ground..-0.5V to VCC+0.5V Maximum Operating Voltage ............................................ 3.6V DC Current per I/O Pin ............................................... 20.0 mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Current VCC and GND Pins................................ 200.0 mA 31.2 DC Characteristics Table 31-1. Symbol Current Consumption Parameter Condition VCC = 3.0V 75 VCC = 1.8V 260 VCC = 3.0V 570 VCC = 1.8V 510 690 VCC = 3.0V 1.1 1.49 VCC = 3.0V 11.4 13 VCC = 1.8V 2.8 VCC = 3.0V 4.8 VCC = 1.8V 80 VCC = 3.0V 150 VCC = 1.8V 160 225 VCC = 3.0V 295 390 VCC = 3.0V 4.8 6 All Functions Disabled VCC = 3.0V 0.1 All Functions Disabled, T = 85°C VCC = 3.0V 1.5 VCC = 1.8V 1.1 VCC = 3.0V 1.1 ULP, WDT, Sampled BOD, T=85°C VCC = 3.0V 2.6 RTC 1 kHz from Low Power 32 kHz TOSC VCC = 1.8V 0.52 VCC = 3.0V 0.61 RTC from Low Power 32 kHz TOSC VCC = 3.0V 1.16 without Reset pull-up resistor current VCC = 3.0V 505 Active 2 MHz, Ext. Clk 32 MHz, Ext. Clk (1) 32 kHz, Ext. Clk 1 MHz, Ext. Clk Idle 2 MHz, Ext. Clk 32 MHz, Ext. Clk Power-down mode ULP, WDT, Sampled BOD Power-save mode Reset Current Consumption Max. 30 1 MHz, Ext. Clk ICC Typ. VCC = 1.8V 32 kHz, Ext. Clk Power Supply Current Min. Units µA mA µA mA 5 10 µA 58 8135G–AVR–08/10 XMEGA D4 Table 31-1. Symbol Current Consumption (Continued) Parameter Condition Min. Typ. Max. Units (2) Module current consumption RC32M RC32M w/DFLL 470 Internal 32.768 kHz oscillator as DFLL source RC2M RC2M w/DFLL 112 Internal 32.768 kHz oscillator as DFLL source RC32K PLL ICC 145 30 Multiplication factor = 10x 225 Watchdog normal mode 0.9 BOD Continuous mode 120 BOD Sampled mode 1 Internal 1.00 V ref 80 Temperature reference 80 RTC with int. 32 kHz RC as source No prescaling 30 RTC with ULP as source No prescaling 0.9 AC Notes: 600 µA 110 USART Rx and Tx enabled, 9600 BAUD 5.3 Timer/Counter Prescaler DIV1 19 Flash/EEPROM Programming Vcc = 2V 13 Vcc = 3V 18 mA 1. All Power Reduction Registers set. T = 25°C if not specified. 2. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC = 3.0V, ClkSYS = 1 MHz External clock with no prescaling, T = 25°C. 59 8135G–AVR–08/10 XMEGA D4 31.3 Speed Table 31-2. Symbol ClkCPU Operating voltage and frequency Parameter Condition CPU clock frequency Min Typ Max VCC = 1.6V 0 12 VCC = 1.8V 0 12 VCC = 2.7V 0 32 VCC = 3.6V 0 32 Units MHz The maximum CPU clock frequency of the XMEGA D4 devices is depending on VCC. As shown in Figure 31-1 on page 60 the Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V. Figure 31-1. Operating Frequency vs.Vcc MHz 32 Safe Operating Area 12 1.6 1.8 2.7 3.6 V 60 8135G–AVR–08/10 XMEGA D4 31.4 Flash and EEPROM Memory Characteristics Table 31-3. Symbol Endurance and Data Retention Parameter Condition Min 25°C 10K 85°C 10K 25°C 100 55°C 25 25°C 80K 85°C 30K 25°C 100 55°C 25 Typ Max Write/Erase cycles Units Cycle Flash Data retention Year Write/Erase cycles Cycle EEPROM Data retention Table 31-4. Symbol Programming time Parameter Chip Erase Flash EEPROM Notes: Year Condition Flash, EEPROM (2) and SRAM Erase Min Typ(1) Max Units 40 Page Erase 6 Page Write 6 Page WriteAutomatic Page Erase and Write 12 Page Erase 6 Page Write 6 Page WriteAutomatic Page Erase and Write 12 ms 1. Programming is timed from the internal 2 MHz oscillator. 2. EEPROM is not erased if the EESAVE fuse is programmed. 61 8135G–AVR–08/10 XMEGA D4 31.5 ADC Characteristics Table 31-5. ADC Characteristics Symbol Parameter Condition Min Typ Max Units RES Resolution Programmable: 8/12 8 12 12 Bits INL Integral Non-Linearity 100 ksps ±2 DNL Differential Non-Linearity 100 ksps < ±1 LSB Gain Error < ±10 Offset Error < ±2 mV ADCclk ADC Clock frequency Max is 1/4 of Peripheral Clock Conversion rate Conversion time (propagation delay) (RES+2)/2+GAIN RES = 8 or 12, GAIN = 0, 1, 2 or 3 Sampling Time 1/2 ADCclk cycle Conversion range AVCC Analog Supply Voltage VREF Reference voltage 5 7 1400 kHz 200 ksps 10 ADCclk cycles 0.36 uS 0 VREF Vcc-0.3 Vcc+0.3 1.0 Vcc-0.6V Input bandwidth INT1V kHz Internal 1.00V reference 1.00 INTVCC Internal VCC/1.6 VCC/1.6 SCALEDVCC Scaled internal VCC/10 input VCC/10 Reference input resistance > 10 RAREF Start-up time Internal input sampling speed Table 31-6. Symbol 12 Temp. sensor, VCC/10, Bandgap V MΩ 24 ADCclk cycles 100 ksps ADC Gain Stage Characteristics Parameter Gain error Condition 1 to 64 gain Noise level at input Clock rate Min Typ Max < ±1 Offset error Vrms V Units % < ±1 VREF = Int. 1V 0.12 VREF = Ext. 2V 0.06 mV 64x gain Same as ADC 200 kHz 62 8135G–AVR–08/10 XMEGA D4 31.6 Analog Comparator Characteristics Table 31-7. Symbol Analog Comparator Characteristics Parameter Condition Input Offset Voltage VCC = 1.6 - 3.6V < ±10 mV Input Leakage Current VCC = 1.6 - 3.6V < 1000 pA Vhys1 Hysteresis, No VCC = 1.6 - 3.6V 0 Vhys2 Hysteresis, Small VCC = 1.6 - 3.6V 20 Vhys3 Hysteresis, Large VCC = 1.6 - 3.6V 40 tdelay Propagation delay VCC = 1.6 - 3.6V 175 Voff Ilk 31.7 Min Typ Max Units mV ns Bandgap Characteristics Table 31-8. Symbol Bandgap Voltage Characteristics Parameter Condition Min Typ Max As reference for ADC 1 Clk_PER + 2.5µs As input to AC or ADC 1.5 Bandgap Startup Time Units µs Bandgap voltage 1.1 T= 85°C, After calibration 0.99 1 1.01 V ADC ref 1 Variation over voltage and temperature 31.8 VCC = 1.6 - 3.6V, TA = -40°C to 85°C ±5 % Brownout Detection Characteristics Brownout Detection Characteristics(1) Table 31-9. Symbol Parameter Condition Min Typ BOD level 0 falling Vcc 1.62 BOD level 1 falling Vcc 1.9 BOD level 2 falling Vcc 2.17 BOD level 3 falling Vcc 2.43 BOD level 4 falling Vcc 2.68 BOD level 5 falling Vcc 2.96 BOD level 6 falling Vcc 3.22 BOD level 7 falling Vcc 3.49 Max Units V Hysteresis Note: BOD level 0-5 1 % 1. BOD is calibrated to BOD level 0 at 85°C, and BOD level 0 is the default level. 63 8135G–AVR–08/10 XMEGA D4 31.9 PAD Characteristics Table 31-10. PAD Characteristics Symbol Parameter VIH Input High Voltage VIL Input Low Voltage VOL VOH Output Low Voltage GPIO Output High Voltage GPIO Condition Min Typ Max VCC = 2.4 - 3.6V 0.7*VCC VCC+0.5 VCC = 1.6 - 2.4V 0.8*VCC VCC+0.5 VCC = 2.4 - 3.6V -0.5 0.3*VCC VCC = 1.6 - 2.4V -0.5 0.2*VCC IOH = 8 mA, VCC = 3.3V 0.4 0.76 IOH = 5 mA, VCC = 3.0V 0.3 0.64 IOH = 3 mA, VCC = 1.8V 0.2 0.46 V IOH = -4 mA, VCC = 3.3V 2.6 3.0 IOH = -3 mA, VCC = 3.0V 2.1 2.7 IOH = -1 mA, VCC = 1.8V 1.4 1.6 IIL Input Leakage Current I/O pin <0.001 1 IIH Input Leakage Current I/O pin <0.001 1 RP I/O pin Pull/Buss keeper Resistor T= -40°C to 85°C 20 Reset pin Pull-up Resistor T= -40°C to 85°C 20 Input hysteresis VCC = 1.6 V - 3.6 V, T= -40°C to 85°C 0.5 RRST Units µA kΩ V 31.10 POR Characteristics Table 31-11. Power-on Reset Characteristics Symbol Parameter Condition Min Typ VPOT- POR threshold voltage falling Vcc 1 VPOT+ POR threshold voltage rising Vcc 1.3 Max Units V 31.11 Reset Characteristics Table 31-12. Reset Characteristics Symbol Parameter Condition Minimum reset pulse width Reset threshold voltage Min Typ 90 VCC = 2.7 - 3.6V 0.45*VCC VCC = 1.6 - 2.7V 0.42*VCC Max Units ns V 64 8135G–AVR–08/10 XMEGA D4 31.12 Oscillator Characteristics Table 31-13. Internal 32.768 kHz Oscillator Characteristics Symbol Parameter Condition T = 85°C, VCC = 3V, After production calibration Accuracy Min Typ -0.5 Max Units 0.5 % Max Units Table 31-14. Internal 2 MHz Oscillator Characteristics Symbol Parameter Condition Accuracy T = 85°C, VCC = 3V, After production calibration DFLL Calibration step size T = 25°C, VCC = 3V Min Typ -1.5 1.5 % 0.15 Table 31-15. Internal 32 MHz Oscillator Characteristics Symbol Parameter Condition T = 85°C, VCC = 3V, After production calibration Accuracy DFLL Calibration stepsize Min Typ -1.5 Max Units 1.5 % T = 25°C, VCC = 3V 0.2 Table 31-16. Internal 32 kHz, ULP Oscillator Characteristics Symbol Parameter Condition Output frequency 32 kHz ULP OSC Min Typ T = 85°C, VCC = 3.0V 26 Max Units kHz Table 31-17. Maximum load capacitance (CL) and ESR recommendation for 32.768 kHz Crystal Crystal CL [pF] Max ESR [kΩ] 6.5 60 9 35 65 8135G–AVR–08/10 XMEGA D4 Table 31-18. Device wake-up time from sleep Symbol Condition(1) Parameter Int. 32.768 kHz RC Idle Sleep, Standby and Extended Standby sleep mode Min Typ() Max Units 130 Int. 2 MHz RC 2 Ext. 2 MHz Clock 2 Int. 32 MHz RC 0.17 Int. 32.768 kHz RC 320 Int. 2 MHz RC 10.3 Ext. 2 MHz Clock 4.5 Int. 32 MHz RC 5.8 µS Power-save and Power-down Sleep mode Notes: 1. Non-prescaled System Clock source. Time from pin change on external interrupt pin to first available clock cycle. Additional interrupt response time is minimum 5 system clock source cycles. 66 8135G–AVR–08/10 XMEGA D4 32. Typical Characteristics 32.1 Active Supply Current Figure 32-1. Active Supply Current vs. Frequency fSYS = 0 - 1.0 MHz External clock, T = 25°C. 700 3.3 V 600 3.0 V ICC [uA] 500 2.7 V 400 2.2 V 300 1.8 V 200 100 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency [MHz] Figure 32-2. Active Supply Current vs. Frequency fSYS = 1 - 32 MHz External clock, T = 25°C. 14 ICC [mA] 3.3 V 12 3.0 V 10 2.7 V 8 6 2.2 V 4 1.8 V 2 0 0 4 8 12 16 20 24 28 32 Frequency [MHz] 67 8135G–AVR–08/10 XMEGA D4 Figure 32-3. Active Supply Current vs. Vcc fSYS = 1.0 MHz External Clock. 800 85 °C 25 °C -40 °C 700 600 ICC [uA] 500 400 300 200 100 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-4. Active Supply Current vs. VCC fSYS = 32.768 kHz internal RC. 160 -40 °C 85 °C 25 °C 140 120 ICC [uA] 100 80 60 40 20 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 68 8135G–AVR–08/10 XMEGA D4 Figure 32-5. Active Supply Current vs. Vcc fSYS = 2.0 MHz internal RC. 1600 85 °C 25 °C -40 °C 1400 1200 ICC [uA] 1000 800 600 400 200 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-6. Active Supply Current vs. Vcc fSYS = 32 MHz internal RC prescaled to 8 MHz. 7 -40 °C 25 °C 85 °C 6 ICC [mA] 5 4 3 2 1 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 69 8135G–AVR–08/10 XMEGA D4 Figure 32-7. Active Supply Current vs. Vcc fSYS = 32 MHz internal RC. 16 -40 °C 25 °C 85 °C 14 12 ICC [mA] 10 8 6 4 2 0 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC [V] 32.2 Idle Supply Current Figure 32-8. Idle Supply Current vs. Frequency fSYS = 0 - 1.0 MHz, T = 25°C. 180 3.3 V 160 3.0 V 140 2.7 V ICC [uA] 120 100 2.2 V 80 1.8 V 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency [MHz] 70 8135G–AVR–08/10 XMEGA D4 Figure 32-9. Idle Supply Current vs. Frequency fSYS = 1 - 32 MHz, T = 25°C. 6 3.3 V 5 3.0 V 2.7 V ICC [mA] 4 3 2.2 V 2 1 1.8 V 0 0 4 8 12 16 20 24 28 32 Frequency [MHz] Figure 32-10. Idle Supply Current vs. Vcc fSYS = 1.0 MHz External Clock. 200 85 °C 25 °C -40 °C ICC [uA] 160 120 80 40 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 71 8135G–AVR–08/10 XMEGA D4 Figure 32-11. Idle Supply Current vs. Vcc fSYS = 32.768 kHz internal RC. 40 85 °C -40 °C 25 °C 35 30 ICC [uA] 25 20 15 10 5 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-12. : Idle Supply Current vs. Vcc fSYS = 2.0 MHz internal RC. 500 -40 °C 25 °C 85 °C ICC [uA] 400 300 200 100 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 72 8135G–AVR–08/10 XMEGA D4 Figure 32-13. Idle Supply Current vs. Vcc fSYS = 32 MHz internal RC prescaled to 8 MHz. 3000 -40 °C 25 °C 85 °C 2500 ICC [uA] 2000 1500 1000 500 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-14. : Idle Supply Current vs. Vcc fSYS = 32 MHz internal RC. 7 -40 °C 25 °C 85 °C 6 ICC [mA] 5 4 3 2 1 0 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC [V] 73 8135G–AVR–08/10 XMEGA D4 32.3 Power-down Supply Current Figure 32-15. Power-down Supply Current vs. Temperature 1.8 3.3 V 3.0 V 2.7 V 2.2 V 1.8 V 1.6 1.4 ICC [uA] 1.2 1 0.8 0.6 0.4 0.2 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] Figure 32-16. Power-down Supply Current vs. Temperature With WDT and sampled BOD enabled. 3 3.3 V 3.0 V 2.7 V 2.2 V 1.8 V 2.5 ICC [uA] 2 1.5 1 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 74 8135G–AVR–08/10 XMEGA D4 32.4 Power-save Supply Current Figure 32-17. Power-save Supply Current vs. Temperature With WDT, sampled BOD and RTC from ULP enabled. 3 3.3 V 3.0 V 2.7 V 2.2 V 1.8 V 2.5 ICC [uA] 2 1.5 1 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 32.5 Pin Pull-up Figure 32-18. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 1.8V. 100 IRESET [uA] 80 60 40 20 -40 °C 25 °C 85 °C 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VRESET [V] 75 8135G–AVR–08/10 XMEGA D4 Figure 32-19. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.0V. 160 140 IRESET [uA] 120 100 80 60 40 -40 °C 25 °C 85 °C 20 0 0 0.5 1 1.5 2 2.5 3 VRESET [V] Figure 32-20. Reset Pull-up Resistor Current vs. Reset Pin Voltage VCC = 3.3V. 180 160 140 IRESET [uA] 120 100 80 60 40 -40 °C 25 °C 85 °C 20 0 0 0.5 1 1.5 2 2.5 3 VRESET [V] 76 8135G–AVR–08/10 XMEGA D4 32.6 Pin Output Voltage vs. Sink/Source Current Figure 32-21. I/O Pin Output Voltage vs. Source Current Vcc = 1.8V. 2 -40 °C 25 °C 85 °C 1.8 1.6 VPIN [V] 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -6 -5 -4 -3 -2 -1 0 IPIN [mA] Figure 32-22. I/O Pin Output Voltage vs. Source Current Vcc = 3.0V. 3.5 -40 °C 25 °C 85 °C 3 VPIN [V] 2.5 2 1.5 1 0.5 0 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 IPIN [mA] 77 8135G–AVR–08/10 XMEGA D4 Figure 32-23. I/O Pin Output Voltage vs. Source Current Vcc = 3.3V. 3.5 -40 °C 25 °C 85 °C 3 VPIN [V] 2.5 2 1.5 1 0.5 0 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 IPIN [mA] Figure 32-24. I/O Pin Output Voltage vs. Sink Current Vcc = 1.8V. 85°C 25°C 1.8 1.6 1.4 VPIN [V] 1.2 -40 °C 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 7 8 9 10 IPIN [mA] 78 8135G–AVR–08/10 XMEGA D4 Figure 32-25. I/O Pin Output Voltage vs. Sink Current Vcc = 3.0V. 0.7 85 °C 0.6 25 °C -40 °C VPIN [V] 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 IPIN [mA] 6 7 8 9 10 Figure 32-26. I/O Pin Output Voltage vs. Sink Current Vcc = 3.3V. VPIN [V] 0.7 0.6 85 °C 0.5 25 °C -40 °C 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 6 7 8 9 10 IPIN [mA] 79 8135G–AVR–08/10 XMEGA D4 32.7 Pin Thresholds and Hysteresis Figure 32-27. I/O Pin Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1”. 2.5 -40 °C 25 °C 85 °C Vthreshold [V] 2 1.5 1 0.5 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-28. I/O Pin Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0”. 1.8 85 °C 25 °C -40 °C 1.6 1.4 Vthreshold [V] 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 80 8135G–AVR–08/10 XMEGA D4 Figure 32-29. I/O Pin Input Hysteresis vs. VCC. 0.7 0.6 Vthreshold [V] 0.5 85 °C 25 °C -40 °C 0.4 0.3 0.2 0.1 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-30. Reset Input Threshold Voltage vs. VCC VIH - I/O Pin Read as “1”. 1.8 -40 °C 25 °C 85 °C 1.6 VTHRESHOLD [V] 1.4 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 81 8135G–AVR–08/10 XMEGA D4 Figure 32-31. Reset Input Threshold Voltage vs. VCC VIL - I/O Pin Read as “0”. 1.8 -40 °C 25 °C 85 °C 1.6 VTHRESHOLD [V] 1.4 1.2 1 0.8 0.6 0.4 0.2 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 32.8 Bod Thresholds Figure 32-32. BOD Thresholds vs. Temperature BOD Level = 1.6V. 1.645 1.64 VBOT [V] 1.635 1.63 Rising Vcc 1.625 1.62 Falling Vcc 1.615 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 82 8135G–AVR–08/10 XMEGA D4 Figure 32-33. BOD Thresholds vs. Temperature BOD Level = 2.9V. 3.03 3.02 3.01 Rising Vcc VBOT [V] 3 2.99 2.98 2.97 2.96 Falling Vcc 2.95 2.94 2.93 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 32.9 Analog Comparator Figure 32-34. Analog Comparator Hysteresis vs. VCC High-speed, Small hysteresis. 20 85 °C 16 VHYST [mV] 25 °C -40 °C 12 8 4 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 83 8135G–AVR–08/10 XMEGA D4 Figure 32-35. Analog Comparator Hysteresis vs. VCC High-speed, Large hysteresis. 60 50 85 °C 25 °C -40 °C VHYST [mV] 40 30 20 10 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] Figure 32-36. Analog Comparator Propagation Delay vs. VCC High-speed. 180 162 144 126 tPD [ns] 108 85 °C 25 °C -40 °C 90 72 54 36 18 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 84 8135G–AVR–08/10 XMEGA D4 32.10 Oscillators and Wake-up Time 32.10.1 Internal 32.768 kHz Oscillator Figure 32-37. Internal 32.768 kHz Oscillator Calibration Step Size T = -40 to 85°C, VCC = 3V. 0.80 % Step size: f [kHz] 0.65 % 0.50 % 0.35 % 0.20 % 0.05 % 0 32 64 96 128 160 192 224 256 RC32KCAL[7..0] 32.10.2 Internal 2 MHz Oscillator Figure 32-38. Internal 2 MHz Oscillator CALA Calibration Step Size T = -40 to 85°C, VCC = 3V. 0.50 % 0.40 % Step size: f [MHz] 0.30 % 0.20 % 0.10 % 0.00 % -0.10 % -0.20 % -0.30 % 0 16 32 48 64 80 96 112 128 DFLLRC2MCALA 85 8135G–AVR–08/10 XMEGA D4 Figure 32-39. Internal 2 MHz Oscillator CALB Calibration Step Size T = -40 to 85°C, VCC = 3V. 3.00 % Step size: f [MHz] 2.50 % 2.00 % 1.50 % 1.00 % 0.50 % 0.00 % 0 8 16 24 32 40 48 56 64 112 128 DFLLRC2MCALB 32.10.3 Internal 32 MHZ Oscillator Figure 32-40. Internal 32 MHz Oscillator CALA Calibration Step Size T = -40 to 85°C, VCC = 3V. 0.60 % 0.50 % Step size: f [MHz] 0.40 % 0.30 % 0.20 % 0.10 % 0.00 % -0.10 % -0.20 % 0 16 32 48 64 80 96 DFLLRC32MCALA 86 8135G–AVR–08/10 XMEGA D4 Figure 32-41. Internal 32 MHz Oscillator CALB Calibration Step Size T = -40 to 85°C, VCC = 3V. 3.00 % Step size: f [MHz] 2.50 % 2.00 % 1.50 % 1.00 % 0.50 % 0.00 % 0 8 16 24 32 40 48 56 64 DFLLRC32MCALB 32.11 Module current consumption Figure 32-42. AC current consumption vs. Vcc Low-power Mode. Module current consumption [uA] 140 85 °C 25 °C -40 °C 120 100 80 60 40 20 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 87 8135G–AVR–08/10 XMEGA D4 Figure 32-43. Power-up current consumption vs. Vcc 25 °C 600 -40 °C 85 °C 500 ICC [uA] 400 300 200 100 0 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VCC [V] 32.12 Reset Pulsewidth Figure 32-44. Minimum Reset Pulse Width vs. Vcc 100 tRST [ns] 80 85 °C 25 °C -40 °C 60 40 20 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 88 8135G–AVR–08/10 XMEGA D4 32.13 PDI Speed Figure 32-45. PDI Speed vs. Vcc 35 25 °C 30 fMAX [MHz] 25 20 15 10 5 0 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC [V] 89 8135G–AVR–08/10 XMEGA D4 33. Errata 33.1 ATxmega32D4, ATxmega16D4 rev. A • • • • • • • • • • • Flash Power Reduction Mode can not be enabled when entering sleep mode Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously Bandgap measurement with the ADC is non-functional when VCC is below 2.7V ADC gain stage cannot be used for single conversions ADC gain stage output range is limited to 2.4V ADC has increased INL error for some operating conditions ADC propagation delay is not correct when 8x-64x gain is used BOD will be enabled after any reset VCC voltage scaler for AC is non-linear TWIE is not available Inverted I/O enable does not affect Analog Comparator Output 1. Flash Power Reduction Mode can not be enabled when entering sleep mode If Flash Power Reduction Mode is enabled when a deep sleep mode, the device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles. Problem fix/Workaround Disable Flash Power Reduction mode before entering sleep mode. 2. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously If the bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong comparison result. Problem fix/Workaround If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling any of them. 3. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V The ADC cannot be used to do bandgap measurements when VCC is below 2.7V. Problem fix/Workaround If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of the bandgap. 4. ADC gain stage cannot be used for single conversion The ADC gain stage will not output correct result for single conversions that is triggered and started from software or the event system. Problem fix/Workaround When the gain stage is used, the ADC must be set in free running mode for correct results. 90 8135G–AVR–08/10 XMEGA D4 5. ADC gain stage output range is limited to 2.4 V The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give correct output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of: – 1x gain: 2.4 V – 2x gain: 1.2 V – 4x gain: 0.6 V – 8x gain: 300 mV – 16x gain: 150 mV – 32x gain: 75 mV – 64x gain: 38 mV Problem fix/Workaround Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep ADC voltage reference below 2.4 V. 6. ADC has increased INL error for some operating conditions Some ADC configurations or operating condition will result in increased INL error. In signed mode INL is increased to: – 6 LSB for sample rates above 130 kSPS, and up to 8 LSB for 200 kSPS sample rate. – 6 LSB for reference voltage below 1.1V when VCC is above 3.0V. – 20 LSB for ambient temperature below 0 degree C and reference voltage below 1.3V. In unsigned mode, the INL is increased up to a factor of 3 for the conditions above. Problem fix/Workaround None, avoid using the ADC in the above configurations in order to prevent increased INL error. 7. ADC propagation delay is not correct when 8x-64x gain is used The propagation delay will increase by only one ADC clock cycle for the 8x and 16x gain setting, and 32x and 64x gain settings. Problem fix/Workaround None. 8. BOD will be enabled after any reset If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the programmed BOD level even if the BOD is disabled. Problem fix/Workaround Do not set the BOD level higher than VCC even if the BOD is not used. 91 8135G–AVR–08/10 XMEGA D4 9. VCC voltage scaler for AC is non-linear The 6-bit VCC voltage scaler in the Analog Comparators is non-linear. Problem fix/Workaround Use external voltage input for the analog comparator if accurate voltage levels are needed. 10. TWIE is not available The TWI module on PORTE, TWIE is not available. Problem fix/Workaround Use the identical TWI module on PORTC, TWIC instead. 11. Inverted I/O enable does not affect Analog Comparator Output The inverted I/O pin function does not affect the Analog Comparator output function. Problem fix/Workarund Configure the analog comparator setup to give a inverted result (i.e. connect positive input to the negative AC input and vice versa), or use and externel inverter to change polarity of Analog Comparator Output. 92 8135G–AVR–08/10 XMEGA D4 34. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revisions in this section are referring to the document revision. 34.1 34.2 34.3 8135G – 08/10 1. Updated the Footnote 3 of ”Ordering Information” on page 2. 2. All references to CRC removed. Updated Figure 3-1 on page 6. 3. Updated ”Features” on page 26. Event Channel 0 output on port pin 7. 4. Updated ”DC Characteristics” on page 58 by adding Icc for Flash/EEPROM Programming. 5. Added AVCC in ”ADC Characteristics” on page 62. 6. Updated Start up time in ”ADC Characteristics” on page 62. 7. Updated and fixed typo in “Errata” section. 1. Added ”PDI Speed” on page 89. 1. Updated the device pin-out Figure 2-1 on page 3. PDI_CLK and PDI_DATA renamed only PDI. 2. Updated Table 7-3 on page 14. No of Pages for ATxmega32D4: 32 3. Updated ”Alternate Port Functions” on page 29. 4. Updated ”ADC - 12-bit Analog to Digital Converter” on page 39. 5. Updated Figure 23-1 on page 40. 6. Updated ”Alternate Pin Functions” on page 48. 7. Updated ”Timer/Counter and AWEX functions” on page 46. 8. Added Table 31-17 on page 65. 9. Added Table 31-18 on page 66. 10. Changed Internal Oscillator Speed to ”Oscillators and Wake-up Time” on page 85. 11. Updated ”Errata” on page 90. 8135F – 02/10 8135E – 02/10 93 8135G–AVR–08/10 XMEGA D4 34.4 34.5 34.6 34.7 8135D – 12/09 1. Added ATxmega128D4 device and updated the datasheet accordingly. 2. Updated ”Electrical Characteristics” on page 58 with Max/Min numbers. 3. Added ”Flash and EEPROM Memory Characteristics” on page 61. 4. Updated Table 31-10 on page 64, Input hysteresis is in V and not in mV. 5. Added ”Errata” on page 90. 1. Updated ”Features” on page 1 with Two Two-Wire Interfaces. 2. Updated ”Bock Diagram and TQFP/QFN pinout” on page 3. 3. Updated ”Overview” on page 5. 4. Updated ”XMEGA D4 Block Diagram” on page 6. 5. Updated Table 13-1 on page 24. 6. Updated ”Overview” on page 35. 7. Updated Table 27-5 on page 49. 8. Updated ”Peripheral Module Address Map” on page 50. 1. Added ”Electrical Characteristics” on page 58. 2. Added ”Typical Characteristics” on page 67. 1. Initial revision. 8135C – 10/09 8135B – 09/09 8135A – 03/09 94 8135G–AVR–08/10 XMEGA D4 Table of Contents Features ..................................................................................................... 1 Typical Applications ................................................................................ 1 1 Ordering Information ............................................................................... 2 2 Pinout/Block Diagram .............................................................................. 3 3 Overview ................................................................................................... 5 3.1 4 Block Diagram ...................................................................................................6 Resources ................................................................................................. 7 4.1 Recommended reading .....................................................................................7 5 Disclaimer ................................................................................................. 7 6 AVR CPU ................................................................................................... 8 7 8 9 6.1 Features ............................................................................................................8 6.2 Overview ............................................................................................................8 6.3 Register File ......................................................................................................9 6.4 ALU - Arithmetic Logic Unit ...............................................................................9 6.5 Program Flow ....................................................................................................9 Memories ................................................................................................ 10 7.1 Features ..........................................................................................................10 7.2 Overview ..........................................................................................................10 7.3 In-System Programmable Flash Program Memory .........................................11 7.4 Data Memory ...................................................................................................12 7.5 Production Signature Row ...............................................................................13 7.6 User Signature Row ........................................................................................13 7.7 Flash and EEPROM Page Size .......................................................................13 Event System ......................................................................................... 15 8.1 Features ..........................................................................................................15 8.2 Overview ..........................................................................................................15 System Clock and Clock options ......................................................... 17 9.1 Features ..........................................................................................................17 9.2 Overview ..........................................................................................................17 9.3 Clock Options ..................................................................................................18 10 Power Management and Sleep Modes ................................................. 20 i 8135G–AVR–08/10 XMEGA D4 10.1 Features ..........................................................................................................20 10.2 Overview ..........................................................................................................20 10.3 Sleep Modes ....................................................................................................20 11 System Control and Reset .................................................................... 22 11.1 Features ..........................................................................................................22 11.2 Resetting the AVR ...........................................................................................22 11.3 Reset Sources .................................................................................................22 12 WDT - Watchdog Timer ......................................................................... 23 12.1 Features ..........................................................................................................23 12.2 Overview ..........................................................................................................23 13 PMIC - Programmable Multi-level Interrupt Controller ....................... 24 13.1 Features ..........................................................................................................24 13.2 Overview ..........................................................................................................24 13.3 Interrupt vectors ...............................................................................................24 14 I/O Ports .................................................................................................. 26 14.1 Features ..........................................................................................................26 14.2 Overview ..........................................................................................................26 14.3 I/O configuration ..............................................................................................26 14.4 Input sensing ...................................................................................................29 14.5 Port Interrupt ....................................................................................................29 14.6 Alternate Port Functions ..................................................................................29 15 T/C - 16-bit Timer/Counter ..................................................................... 30 15.1 Features ..........................................................................................................30 15.2 Overview ..........................................................................................................30 16 AWEX - Advanced Waveform Extension ............................................. 32 16.1 Features ..........................................................................................................32 16.2 Overview ..........................................................................................................32 17 Hi-Res - High Resolution Extension ..................................................... 33 17.1 Features ..........................................................................................................33 17.2 Overview ..........................................................................................................33 18 RTC - 16-bit Real-Time Counter ............................................................ 34 18.1 Features ..........................................................................................................34 18.2 Overview ..........................................................................................................34 ii 8135G–AVR–08/10 XMEGA D4 19 TWI - Two-Wire Interface ....................................................................... 35 19.1 Features ..........................................................................................................35 19.2 Overview ..........................................................................................................35 20 SPI - Serial Peripheral Interface ............................................................ 36 20.1 Features ..........................................................................................................36 20.2 Overview ..........................................................................................................36 21 USART ..................................................................................................... 37 21.1 Features ..........................................................................................................37 21.2 Overview ..........................................................................................................37 22 IRCOM - IR Communication Module .................................................... 38 22.1 Features ..........................................................................................................38 22.2 Overview ..........................................................................................................38 23 ADC - 12-bit Analog to Digital Converter ............................................. 39 23.1 Features ..........................................................................................................39 23.2 Overview ..........................................................................................................39 24 AC - Analog Comparator ....................................................................... 41 24.1 Features ..........................................................................................................41 24.2 Overview ..........................................................................................................41 24.3 Input Selection .................................................................................................43 24.4 Window Function .............................................................................................43 25 OCD - On-chip Debug ............................................................................ 44 25.1 Features ..........................................................................................................44 25.2 Overview ..........................................................................................................44 26 PDI - Program and Debug Interface ..................................................... 45 26.1 Features ..........................................................................................................45 26.2 Overview ..........................................................................................................45 26.3 PDI - Program and Debug Interface ................................................................45 27 Pinout and Pin Functions ...................................................................... 46 27.1 Alternate Pin Functions Description ................................................................46 27.2 Alternate Pin Functions ...................................................................................48 28 Peripheral Module Address Map .......................................................... 50 29 Instruction Set Summary ...................................................................... 51 iii 8135G–AVR–08/10 XMEGA D4 30 Packaging information .......................................................................... 55 30.1 44A ..................................................................................................................55 30.2 44M1 ................................................................................................................56 30.3 49C2 ................................................................................................................57 31 Electrical Characteristics ...................................................................... 58 31.1 Absolute Maximum Ratings* ...........................................................................58 31.2 DC Characteristics ..........................................................................................58 31.3 Speed ..............................................................................................................60 31.4 Flash and EEPROM Memory Characteristics .................................................61 31.5 ADC Characteristics ........................................................................................62 31.6 Analog Comparator Characteristics .................................................................63 31.7 Bandgap Characteristics .................................................................................63 31.8 Brownout Detection Characteristics ................................................................63 31.9 PAD Characteristics ........................................................................................64 31.10 POR Characteristics ........................................................................................64 31.11 Reset Characteristics ......................................................................................64 31.12 Oscillator Characteristics .................................................................................65 32 Typical Characteristics .......................................................................... 67 32.1 Active Supply Current ......................................................................................67 32.2 Idle Supply Current ..........................................................................................70 32.3 Power-down Supply Current ............................................................................74 32.4 Power-save Supply Current .............................................................................75 32.5 Pin Pull-up .......................................................................................................75 32.6 Pin Output Voltage vs. Sink/Source Current ...................................................77 32.7 Pin Thresholds and Hysteresis ........................................................................80 32.8 Bod Thresholds ...............................................................................................82 32.9 Analog Comparator .........................................................................................83 32.10 Oscillators and Wake-up Time ........................................................................85 32.11 Module current consumption ...........................................................................87 32.12 Reset Pulsewidth .............................................................................................88 32.13 PDI Speed .......................................................................................................89 33 Errata ....................................................................................................... 90 33.1 ATxmega32D4, ATxmega16D4 rev. A ............................................................90 34 Datasheet Revision History .................................................................. 93 34.1 8135G – 08/10 .................................................................................................93 iv 8135G–AVR–08/10 34.2 8135F – 02/10 .................................................................................................93 34.3 8135E – 02/10 .................................................................................................93 34.4 8135D – 12/09 .................................................................................................94 34.5 8135C – 10/09 .................................................................................................94 34.6 8135B – 09/09 .................................................................................................94 34.7 8135A – 03/09 .................................................................................................94 Table of Contents....................................................................................... i Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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