AXK7, 8
For board-to-board For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
P4 Series
FEATURES
• Without soldering terminals
96
3.
m
m
m
1m
5.
Socket
Header
RoHS compliant
1. 0.4 mm pitch and mated heights of
1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and
3.5 mm.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Constructed with impact dispersion
keys inside the body to disperse
shocks when dropped.
Socket
Impact dispersion key
2) Guides are provided to take up any
position shift and facilitate insertion.
Insertion guide
3) Simple lock structure provides tactile
feedback to ensure excellent mating/
unmating operation feel.
Header side
contact
Header
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket
indentations and header protrusions are
mated together.
Note: The following number of pins are not supported
due to suction surface factors.
• Without soldering terminals:
18 pin contacts or less
4. Construction makes designing
devices easier.
1) The lower connector bottom surface
construction prevents contact and shorts
between the PCB and metal terminals.
This enables freedom in pattern wiring,
helping to make PCB’s smaller.
<Socket>
<Header>
Simple lock
mechanism
Socket side
contact
5. Design facilitates efficient
mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that allows visual inspection
of the soldered part.
6. Connectors for inspection available
APPLICATIONS
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
Connector bottom: Create any thru-hole and pattern wiring.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB3E 201212-T
AXK7, 8
ORDERING INFORMATION
AXK
4
G
7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket
8: Narrow Pitch Connector P4 (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
1: For mated height 1.5 mm
2: For mated height 2.0 mm
3: For mated height 2.5 mm and 3.0 mm
4: For mated height 3.5 mm
<Header>
1: For mated height 1.5 mm, 2.0 mm and 2.5 mm
2: For mated height 3.0 mm and 3.5 mm
Functions
4: Without soldering terminals, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
5: Ni plating on base, Au plating on surface
Other specifications
<Header>
W: V notch and post edge horseshoe bend type product
Packing
G: 3,000 pieces embossed tape and plastic reel × 2∗
Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.
2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)
are shaped differently and are not compatible.
ACCTB3E 201212-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AXK7, 8
PRODUCT TYPES
Without soldering terminals
Part number
Mated height
1.5 mm
2.0 mm
2.5 mm
3.0 mm
3.5 mm
Packing
Number of pins
Socket
Header
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
14
20
24
26
30
40
50
60
70
80
14
20
24
30
40
50
60
70
80
20
24
30
40
50
60
80
20
30
40
AXK714147G
AXK720147G
AXK722147G
AXK724147G
AXK726147G
AXK730147G
AXK734147G
AXK740147G
AXK744147G
AXK750147G
AXK754147G
AXK760147G
AXK764147G
AXK770147G
AXK780147G
AXK700147G
AXK714247G
AXK720247G
AXK724247G
AXK726247G
AXK730247G
AXK740247G
AXK750247G
AXK760247G
AXK770247G
AXK780247G
AXK714347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK770347G
AXK780347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK780347G
AXK720447G
AXK730447G
AXK740447G
AXK814145WG
AXK820145WG
AXK822145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK834145WG
AXK840145WG
AXK844145WG
AXK850145WG
AXK854145WG
AXK860145WG
AXK864145WG
AXK870145WG
AXK880145WG
AXK800145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK820245WG
AXK824245WG
AXK830245WG
AXK840245WG
AXK850245WG
AXK860245WG
AXK880245WG
AXK820245WG
AXK830245WG
AXK840245WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
Samples for mounting confi mation: Available in units of 50 pieces. Please consult us. (See “Regarding sample orders to confi m proper mounting” on page 169.)
Samples: Small lot orders are possible.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales offic .
3. Different number of pins are available on-demand production only. Please contact us for more details.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB3E 201212-T
AXK7, 8
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Specification
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Contact resistance
Max. 70mΩ
Composite insertion force
Max. 0.981N {100gf}/pin contacts × pin contacts (initial)
Min. 0.0588N {6gf}/pin contacts × pin contacts
(Mated height 1.5 mm without soldering terminals type)
Min. 0.118N {12gf}/pin contacts × pin contacts
All the other types except the above
(Mated height 1.5 mm without soldering terminals type)
Composite removal force
Post holding force
Conditions
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified y JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Min. 0.981N {100gf}/pin contacts
Ambient temperature
–55°C to +85°C
Soldering heat resistance
Storage temperature
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared refl w soldering
Soldering iron
No freezing at low temperatures.
No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 70mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Soldering terminals portion
Copper alloy
ACCTB3E 201212-T
Panasonic Corporation
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AXK7, 8
DIMENSIONS (Unit: mm)
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
CAD Data
Without Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Dimension table (mm)
B±0.1
0.40±0.05
3.75
5.10
E
4.10
0.15±0.03
0.80
C
(0.675)
0.80
(0.675)
0.08
1.11
(Suction face)
0.40±0.05
Max. 18 pin contacts
D
Number of pins/
dimension
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
A
B
C
D
5.1
2.4
—
2.8
6.3
6.7
7.1
7.5
8.3
9.1
10.3
11.1
12.3
13.1
14.3
15.1
16.3
18.3
22.3
3.6
4.0
4.4
4.8
5.6
6.4
7.6
8.4
9.6
10.4
11.6
12.4
13.6
15.6
19.6
1.6
2.0
2.4
2.8
3.6
4.4
5.6
6.4
7.6
8.4
9.6
10.4
11.6
13.6
17.6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
C
D
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
E
1.50
1.92
2.42
2.92
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
B±0.1
Dimension table (mm)
0.08
0.40±0.05
(0.42)
3.12
0.10±0.03
(0.42)
0.76
0.76
C
F
(Suction face)
3.96
2.66
0.15±0.03
3.96
E
2.19
0.40±0.05
Max. 18 pin contacts
D
General tolerance: ±0.2
Number of pins/
dimension
14
3.9
2.4
—
3.04
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
5.1
5.5
5.9
6.3
7.1
7.9
9.1
9.9
11.1
11.9
13.1
13.9
15.1
17.1
21.1
3.6
4.0
4.4
4.8
5.6
6.4
7.6
8.4
9.6
10.4
11.6
12.4
13.6
15.6
19.6
1.6
2.0
2.4
2.8
3.6
4.4
5.6
6.4
7.6
8.4
9.6
10.4
11.6
13.6
17.6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
E
1.31
F
1.20
3.0mm, 3.5mm
2.26
1.26
A
Panasonic Corporation
Automation Controls Business Unit
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated
industrial.panasonic.com/ac/e/
ACCTB3E 201212-T
AXK7, 8
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806-1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
C
Pull out direction
Pull out direction
4
2
8.0
1.5+0.1
0 dia.
1.75
Top cover tape
380 dia.
B
1.75
Taping reel
D±1
A±0.3
C
4
2
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
Dimension table (mm)
Without soldering terminals
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Max. 18
Max. 18
20 to 70
20 to 70
80 to 100
80 to 100
20 to 40
Tape I
Tape I
Tape II
Tape I
16.0
24.0
32.0
24.0
—
—
28.4
—
7.5
11.5
14.2
11.5
17.4
25.4
33.4
25.4
3,000
3,000
3,000
2,000
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Socket: 3.5 mm
Connector orientation with respect to direction of progress of embossed tape
Without soldering terminals
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
ACCTB3E 201212-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AXK7, 8
For board-to-board For board-to-FPC
P4 Series
Connectors for
inspection usage
(0.4mm pitch)
m
m
96
3.
m
1m
5.
Socket
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Note: Mating retention force cannot be
warranted.
Ideal for module unit inspection and
equipment assembly inspection
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P4 for inspection
without soldering terminals
14
20
22
24
26
30
34
✩
✩
✩
✩
✩
✩
✩
Number of pins
40
44
✩
✩
50
54
60
64
70
80
100
✩
✩
✩
✩
✩
✩
✩
Notes: 1. You can use with each mated height in common.
2. Please inquire about number of pins other than those shown above.
3. Please inquire with us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Socket
Specification
Without soldering
Without positioning bosses
terminals
Part No.
AXK7E∗∗46G
Specification
Header
Without soldering
terminals
Without positioning bosses
Part No.
AXK8E∗∗46WG
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connecto .
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
local sales offic .
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB3E 201212-T
AXK7, 8
NOTES
Without soldering terminals
Socket
Recommended PC board pattern (TOP VIEW)
0.40±0.05
Header
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.23±0.03
0.40±0.05
0.23±0.03
0.40±0.05
0.115±0.05
0.40±0.05
0.115±0.05
0.40±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 40%)
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.30)
4.10±0.01
Max. 0.03 mm
(0.30)
(0.51)
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 40%)
Metal mask thickness: Here, 120 µm
(Opening area ratio: 50%)
0.40±0.01
0.20±0.01
0.35±0.01
0.40±0.01
0.10±0.01
0.20±0.01
(0.37)
3.36±0.01
4.10±0.01
(0.63)
5.50±0.01
4.24±0.01
0.35±0.01
0.10±0.01
(0.37)
(0.63)
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.40±0.01
0.10±0.01
5.50±0.01
4.48±0.01
Max. 0.03 mm
0.35±0.01
(0.51)
0.20±0.01
Metal mask thickness: Here, 150 µm
(Opening area ratio: 32%)
3.50±0.01
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
2.96±0.05
4.56±0.05
3.50±0.05
5.70±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
Please refer to the latest product
specifications when designing our
product.
ACCTB3E 201212-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Notes on Using Narrow-pitch Connectors (Common)
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
Panasonic Corporation
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Automation Controls Business Unit
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
industrial.panasonic.com/ac/e/
ACCTB48E 201204-T
Notes on Using Narrow-pitch Connectors (Common)
Regarding soldering
Terminal
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
220°C
200°C
Preheating
25 sec.
70 sec.
Time
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
• Narrow-pitch connector (P8)
Apply the solder
wire here
Temperature
245°C max.
Peak temperature
200°C
Paste
solder
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Peak temperature
60 to 120 sec.
155 to 165°C
PC board
foot pattern
ACCTB48E 201204-T
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
(except P8 type)
Terminal
Small angle as
possible up to
45 degrees
Preheating
60 to 120 sec.
Within 30 sec.
PC board
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder creeping. Solder
and flux characteristics should be taken
into consideration when setting the reflow
soldering conditions.
Panasonic Corporation
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1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Automation Controls Business Unit
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB48E 201204-T
Notes on Using Narrow-pitch Connectors (Common)
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
ACCTB48E 201204-T
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/