Panasonic AXT570224 Narrow pitch connectors (0.4mm pitch) space-saving (3.6 mm widthwise) Datasheet

AXT5, 6
For board-to-FPC
F4S Series
Narrow pitch connectors
(0.4mm pitch)
FEATURES
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
1. Space-saving (3.6 mm widthwise)
Smaller compared to F4 series (40 pin
contacts):
Socket — 27% smaller,
Header — 38% smaller
m
6m
2.
m
6m
3.
Socket
Header
Socket
ts)
tac
on
RoHS compliant
.50
(40
c
pin
Simple lock structure
10
3.6
0
4. Gull-wing-shaped terminals to
facilitate visual inspections.
5. Connectors for inspection available
Pickup width: 0.8mm
Soldering terminals
at each corner
Soldering terminals
at each corner
Header
APPLICATIONS
ts)
tac
on
40
0(
2.6
0
9.8
c
pin
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
ORDERING INFORMATION
AXT
2
4
5: Narrow Pitch Connector F4S (0.4 mm pitch) Socket
6: Narrow Pitch Connector F4S (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
1: For mated height 1.0 mm
2: For mated height 1.2 mm
<Header>
1: For mated height 1.0 mm
2: For mated height 1.2 mm
Functions
<Socket, Header>
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating Surface: Au plating
Note: Please note that models with a mated height of 1.0 mm (7th digit of part number is “1”) and 1.2 mm (7th digit of part number is “2”) are not compatible.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB29E 201303-T
AXT5, 6
PRODUCT TYPES
Mated height
1.0mm
1.2mm
Number of pins
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
10
30
40
50
70
80
Part number
Socket
AXT510124
AXT512124
AXT514124
AXT516124
AXT520124
AXT522124
AXT524124
AXT526124
AXT528124
AXT530124
AXT532124
AXT534124
AXT536124
AXT540124
AXT542124
AXT544124
AXT548124
AXT550124
AXT554124
AXT560124
AXT564124
AXT570124
AXT580124
AXT510224
AXT530224
AXT540224
AXT550224
AXT570224
AXT580224
Packing
Header
AXT610124
AXT612124
AXT614124
AXT616124
AXT620124
AXT622124
AXT624124
AXT626124
AXT628124
AXT630124
AXT632124
AXT634124
AXT636124
AXT640124
AXT642124
AXT644124
AXT648124
AXT650124
AXT654124
AXT660124
AXT664124
AXT670124
AXT680124
AXT610224
AXT630224
AXT640224
AXT650224
AXT670224
AXT680224
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Notes: 1. Order unit: For volume production: 1-inner-box (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
ACCTB29E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXT5, 6
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.165N/pin contacts × pin contacts
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Min. 0.49N/pin contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Soldering heat resistance
Storage temperature
Conditions
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
H2S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
50 times
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
20 pin contact type: Socket: 0.03 g Header: 0.01 g
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB29E 201303-T
AXT5, 6
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 1.0 mm and 1.2 mm)
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
D
(Contact and
soldering terminals*)
(0.62)
3.60
2.36
(0.62)
0.08
3.00
0.80 (Suction face)
CAD Data
C0.15
2.00
3.60
Y note
General tolerance: ±0.2
0.45
0.30±0.03
C±0.1
(0.80)
Z note
Mated height/
dimension
1.0mm
1.2mm
Note: Since the soldering terminals* has a single-piece construction,
sections Y and Z are electrically connected.
D
0.97
1.17
Dimension table (mm)
Number of pins/
dimension
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
A
B
C
4.50
4.90
5.30
5.70
6.50
6.90
7.30
7.70
8.10
8.50
8.90
9.30
9.70
10.50
10.90
11.30
12.10
12.50
13.30
14.50
15.30
16.50
18.50
1.60
2.00
2.40
2.80
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.00
8.40
9.20
9.60
10.40
11.60
12.40
13.60
15.60
3.40
3.80
4.20
4.60
5.40
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.40
9.80
10.20
11.00
11.40
12.20
13.40
14.20
15.40
17.40
Header (Mated height: 1.0 mm and 1.2 mm)
A
B±0.1
0.40±0.05
0.15±0.03
D
Terminal coplanarity
0.08
Dimension table (mm)
(0.46)
C
0.
1.86
13
1.68
R0
.1
5
(Post and
soldering terminals*)
2.60
0.80 (Suction face)
CAD Data
3
1
0.
C
Soldering terminals*
1.90
0.15±0.03
C±0.1
0.94
(0.48)
Soldering terminals*
General tolerance: ±0.2
Mated height/
dimension
1.0mm
1.2mm
D
0.83
1.01
Number of pins/
dimension
10
12
14
16
20
22
24
26
28
30
32
34
36
40
42
44
48
50
54
60
64
70
80
A
B
C
3.80
4.20
4.60
5.00
5.80
6.20
6.60
7.00
7.40
7.80
8.20
8.60
9.00
9.80
10.20
10.60
11.40
11.80
12.60
13.80
14.60
15.80
17.80
1.60
2.00
2.40
2.80
3.60
4.00
4.40
4.80
5.20
5.60
6.00
6.40
6.80
7.60
8.00
8.40
9.20
9.60
10.40
11.60
12.40
13.60
15.60
3.20
3.60
4.00
4.40
5.20
5.60
6.00
6.40
6.80
7.20
7.60
8.00
8.40
9.20
9.60
10.00
10.80
11.20
12.00
13.20
14.00
15.20
17.20
Mated height: 1.0 mm
ACCTB29E 201303-T
Header
Socket
1.20±0.15
Header
Socket
1.00±0.15
• Socket and Header are mated
Mated height: 1.2 mm
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXT5, 6
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers)
• Specifications for the plastic reel
(In accordance with EIAJET-7200B.)
• Specifications for taping
(In accordance with JIS C 0806:1990. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
Tape II
A±0.3
D±1
A±0.3
C
Label
4
2
8.0
1.5+0.1
0 dia.
Leading direction after packaging
C
Top cover tape
1.75
380 dia.
1.75
Leading direction after packaging
Taping reel
B
4
2
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
• Dimension table (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for
sockets and headers:
1.0mm, 1.2mm
24 or less
26 to 70
80
Tape I
Tape I
Tape II
16.00
24.00
32.00
—
—
28.40
7.50
11.50
14.20
17.40
25.40
33.40
3,000
3,000
3,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for F4S
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB29E 201303-T
AXT5, 6
For board-to-FPC
F4S Series
Connectors for
inspection usage
(0.4mm pitch)
m
6m
2.
m
6m
3.
Socket
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Note: Mating retention force cannot be
warranted.
Ideal for module unit inspection and
equipment assembly inspection
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
10
✩
F4S
for inspection
12
✩
14
✩
16
✩
20
✩
22
✩
24
✩
26
✩
28
✩
30
✩
Number of pins
32
34
36
✩
✩
✩
40
✩
42
✩
44
✩
48
✩
50
✩
54
✩
60
✩
64
✩
70
✩
80
✩
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
5. Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5∗∗224 and AXT6∗∗224).
Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm.
PRODUCT TYPES
Socket
Specifications
Without positioning bosses
Part No.
AXT5E∗∗26
Header
Specifications
Without positioning bosses
Part No.
AXT6E∗∗26
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
local sales office.
ACCTB29E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXT5, 6
NOTES
Recommended PC board pattern (TOP VIEW)
0.23±0.03
0.40±0.03
: Insulation area
0.80±0.03
0.45±0.03
2.06±0.03
0.75±0.03
(0.655)
0.90±0.03
0.70±0.03
0.23±0.03
0.40±0.03
Max. 1.00
(0.75)
1.70±0.03
3.20±0.03
• Header (Mated height: 1.0 mm)
Recommended PC board pattern (TOP VIEW)
(0.92)
2.36±0.03
4.20±0.03
• Socket (Mated height: 1.0 mm)
1.80±0.03
(1.20)
: Insulation area
Metal mask thickness: When 150µm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
4.20±0.01
1.80±0.01
(1.20)
0.90±0.01
0.70±0.01
0.20±0.01
0.40±0.01
(0.41)
2.18±0.01
3.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 150µm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
(0.51)
2.98±0.01
4.00±0.01
Recommended metal mask pattern
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
Metal mask thickness: When 120µm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
0.20±0.01
0.40±0.01
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
4.20±0.01
1.80±0.01
(1.20)
0.90±0.01
0.70±0.01
(0.52)
1.96±0.01
3.00±0.01
Recommended metal mask pattern
(0.63)
2.74±0.01
4.00±0.01
1. For high resistance to drop impact
the F4 series is recommended.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.20±0.01
0.40±0.01
Please note that this inspection
connector cannot be connected to
standard models with a stacking
height of 1.2 mm (AXT5∗∗224 and
AXT6∗∗224).
Please contact our sales office for a
type connectable to models with a
stacking height of 1.2 mm.
Please refer to the latest product
specifications when designing your
product.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB29E 201303-T
Notes on Using Narrow pitch Connectors
Notes on Using Narrow pitch Connectors
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
ACCTB48E 201303-T
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Panasonic Corporation
Automation Controls Business Division
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Regarding soldering
Terminal
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Panasonic Corporation
25 sec.
70 sec.
Time
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
245°C max.
Apply the solder
wire here
Peak temperature
200°C
Preheating
Terminal
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
60 to 120 sec.
155 to 165°C
Paste
solder
Peak temperature
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
Automation Controls Business Division
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
ACCTB48E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T