Multilayer Ceramic Capacitors Chip HQF Ordering code system B37923 K 5 100 J 0 60 Packaging 60 ^ cardboard tape, 180-mm reel 70 ^ cardboard tape, 330-mm reel Decimal place for cap. values < 10 pF, otherwise not used Capacitance tolerance CR < 10 pF: B ^ ± 0,1 pF (standard for capacitance values ≤ 3,9 pF) C ^ ± 0,25 pF (standard for capacitance values ≤ 8,2 pF) D ^ ± 0,5 pF CR ³ 10 pF: F G J K Capacitance, coded (example) Rated voltage Termination ^ ^ ^ ^ ± 1% ± 2% ± 5 % (standard) ± 10 % 100 ^ 10 · 100 pF = 10 pF Rated voltage [VDC] Code Standard: 50 5 K ^ nickel barrier for all case sizes Type and size Chip size (inch / mm) Temperature characteristic HQF 0402 / 1005 0603 / 1608 B37923 B37933 118 10/02 Multilayer Ceramic Capacitors Chip HQF Features ■ Ultra-low ESR and high Q factor ■ Tight capacitance tolerances ■ High stability with respect to time, ■ ■ ■ ■ ■ temperature (TCC: 0 ± 60 ppm/°C), frequency and voltage Class 1 characteristic with copper inner electrodes Excellent attenuation High self-resonant frequency Lower power dissipation Less energy absorption Applications ■ ■ ■ ■ ■ High-frequency applications Matching circuits Cellular communication, Bluetooth, DECT Cable TV, satellite TV (LNB), GPS Filters, RF amplifiers, VCOs Termination ■ For soldering: Nickel-barrier terminations (Ni) Options ■ Alternative capacitance tolerances available on request Delivery mode ■ Cardboard tape, 180-mm and 330-mm reel available Electrical data Temperature characteristic Climatic category (IEC 60068-1) Standard Dielectric Rated voltage Test voltage Capacitance range Temperature coefficient Dissipation factor (limit value) Insulation resistance1) at + 25 °C Insulation resistance1) at +125 °C Time constant1) at + 25 °C Time constant1) at +125 °C Operating temperature range Ageing VR Vtest CR tan d Rins Rins t t Top 1) For CR > 10 nF the time constant t = C · Rins is given. 119 10/02 C0H 55/125/56 EIA Class 1 50 2,5 · VR/5 s 0,3 pF … 82 pF 0 ± 60 · 10 –6/K < 1,0 · 10 –3 > 105 > 104 > 1000 > 100 –55 … +125 none VDC VDC MW MW s s °C Multilayer Ceramic Capacitors HQF HQF Capacitance tolerances CR CR £ 3,9 pF Code letter B (standard) C 4,7 pF £ CR £ 8,2 pF B C (standard) D Tolerance ± 0,1 pF ± 0,25 pF ± 0,1 pF ± 0,25 pF ± 0,5 pF CR CR ³ 10 pF Code letter F G J (standard) K Tolerance ±1 % ±2 % ±5 % ± 10 % Dimensional drawing ss b k k k KKE0272-V k KKE0329-N Dimensions (mm) Case size (inch) (mm) 0402 1005 0603 1608 l 1,0 ± 0,1 1,6 ± 0,15 b 0,5 ± 0,05 0,8 ± 0,1 s 0,5 ± 0,05 0,8 ± 0,1 k 0,1 – 0,4 0,1 – 0,4 Tolerances to CECC 32101-801 120 10/02 Multilayer Ceramic Capacitors HQF HQF Recommended solder pad C A D KKE0308-1 Maximum dimensions (mm) Case size (inch/mm) Type A C D 0402/1005 single chip 0,6 1,7 0,6 0603/1608 single chip 1,0 3,0 1,0 Termination Termination (nickel barrier) Ceramic body Inner electrode Cu Substrate electrode Intermediate electrode External electrode Cu Ni Sn KKE0486-D 121 10/02 Multilayer Ceramic Capacitors HQF HQF Product range chip capacitors HQF Size1) inch mm Type VR (VDC) CR 0402 1005 0603 1608 B37923 B37933 50 50 0,3 pF 0,4 pF 0,5 pF 0,6 pF 0,7 pF 0,8 pF 0,9 pF 1,0 pF 1,2 pF 1,5 pF 1,8 pF 2,2 pF 2,7 pF 3,3 pF 3,9 pF 4,7 pF 5,6 pF 6,8 pF 8,2 pF 10, pF 12, pF 15, pF 18, pF 22, pF 27, pF 82, pF 1) l ´ b (inch) / l ´ b (mm) 122 10/02 Multilayer Ceramic Capacitors HQF HQF; 0402 Ordering codes and packing for HQF capacitors, 50 VDC, nickel-barrier terminations Case size 0402, 50 VDC Chip thickness CR 0,3 pF 0,4 pF 0,5 pF 0,6 pF 0,7 pF 0,8 pF 0,9 pF 1,0 pF 1,2 pF 1,5 pF 1,8 pF 2,2 pF 2,7 pF 3,3 pF 3,9 pF 4,7 pF 5,6 pF 6,8 pF 8,2 pF 10, pF 12, pF 15, pF 18, pF 22, pF Ordering code1) B37923K5000B3** B37923K5000B4** B37923K5000B5** B37923K5000B6** B37923K5000B7** B37923K5000B8** B37923K5000B9** B37923K5010B0** B37923K5010B2** B37923K5010B5** B37923K5010B8** B37923K5020B2** B37923K5020B7** B37923K5030B3** B37923K5030B9** B37923K5040C7** B37923K5050C6** B37923K5060C8** B37923K5080C2** B37923K5100J0** B37923K5120J0** B37923K5150J0** B37923K5180J0** B37923K5220J0** mm 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 0,5 ± 0,05 Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 1) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 120. 123 10/02 Cardboard tape, Æ 330-mm reel ** ^ 70 pcs/reel 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 Multilayer Ceramic Capacitors HQF HQF; 0603 Ordering codes and packing for HQF capacitors, 50 VDC, nickel-barrier terminations Case size 0603, 50 VDC Chip thickness CR 0,4 pF 0,5 pF 0,6 pF 0,7 pF 0,8 pF 0,9 pF 1,0 pF 1,2 pF 1,5 pF 1,8 pF 2,2 pF 2,7 pF 3,3 pF 3,9 pF 4,7 pF 5,6 pF 6,8 pF 8,2 pF 10, pF 12, pF 15, pF 18, pF 22, pF 27, pF 82, pF Ordering code1) B37933K5000B4** B37933K5000B5** B37933K5000B6** B37933K5000B7** B37933K5000B8** B37933K5000B9** B37933K5010B0** B37933K5010B2** B37933K5010B5** B37933K5010B8** B37933K5020B2** B37933K5020B7** B37933K5030B3** B37933K5030B9** B37933K5040C7** B37933K5050C6** B37933K5060C8** B37933K5080C2** B37933K5100J0** B37933K5120J0** B37933K5150J0** B37933K5180J0** B37933K5220J0** B37933K5270J0** B37933K5820J0** mm 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 0,8 ± 0,1 Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 1) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 120. 124 10/02 Cardboard tape, Æ 330-mm reel ** ^ 70 pcs/reel 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 Multilayer Ceramic Capacitors HQF HQF; 0402 Typical RF performance for HQF capacitors, case size 0402, 50 VDC fres1) MHz ESR @ 1 GHz2) mW Q @ 1 GHz2) ESR @ fres 2) mW 0,3 23400 560 920 710 0,4 20350 490 805 605 0,5 19700 440 720 535 0,6 17400 405 650 485 0,7 15100 375 600 445 0,8 14450 355 560 415 0,9 12600 335 520 385 1,0 12000 320 490 365 1,2 10600 295 440 330 1,5 8900 265 390 290 1,8 7100 245 350 265 2,2 6400 225 310 235 2,7 6000 205 275 210 3,3 5500 185 245 190 3,9 5350 170 225 175 4,7 4650 155 200 155 5,6 3950 145 175 140 6,8 4100 130 155 125 8,2 3650 120 140 115 10 3350 110 120 105 12 3350 102 104 94 15 2600 92 88 82 18 2300 84 70 74 22 2200 78 56 66 Capacitance pF 1) Measured with impedance analyser E 4991A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered. 125 10/02 Multilayer Ceramic Capacitors HQF HQF; 0603 Typical RF performance for HQF capacitors, case size 0603, 50 VDC fres1) MHz ESR @ 1 GHz 2) mW Q @ 1 GHz 2) ESR @ fres2) mW 0,4 17800 445 860 595 0,5 17100 400 805 540 0,6 13600 385 755 510 0,7 12200 345 635 440 0,8 11400 325 595 410 0,9 10600 315 560 390 1,0 9600 300 525 365 1,2 8800 275 455 335 1,5 7900 250 395 300 1,8 6900 240 360 285 2,2 5750 215 305 250 2,7 5100 200 270 235 3,3 4700 185 235 210 3,9 4150 175 210 200 4,7 3550 165 185 185 5,6 3130 150 160 170 6,8 2850 140 135 155 8,2 2730 130 115 140 10 2580 120 96 130 12 2400 110 76 118 15 2150 102 62 108 18 2050 96 50 100 22 1870 88 34 90 27 1780 80 26 82 Capacitance pF Capacitance pF fres1) MHz ESR @ 300 MHz 2) mW Q @ 300 MHz 2) ESR @ fres2) mW 82 930 52 105 1) Measured with impedance analyser E 4991A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered. 126 10/02 52 Multilayer Ceramic Capacitors HQF HQF; 0402 Typical characteristics for chip size 0402 ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) KKE0480-Y 10 0 KKE0477-E 10 0 Ω Ω ESR ESR 3 GHz 1 GHz 10 _1 10 _1 100 MHz 10 _2 10 _1 10 0 10 1 10 pF 10 2 _2 10 _1 10 0 10 1 pF 10 2 C C Self-resonant frequency fres versus capacitance C ESR versus frequency f KKE0481-7 10 1 Ω KKE0479-V 10 5 MHz fres ESR 10 0 10 4 0,4 pF 10 10 3,3 pF 12 pF 22 pF _1 _2 10 2 10 3 MHz 10 4 10 3 10 2 _ 1 10 10 0 10 1 pF C f 127 10/02 10 2 Multilayer Ceramic Capacitors HQF HQF; 0402 Typical characteristics for chip size 0402 Q factor versus capacitance C Q factor versus frequency f KKE0478-M 10 4 Q KKE0482-F 10 4 Q 10 3 100 MHz 10 3 0,4 pF 10 2 3,3 pF 12 pF 10 1 10 2 1 GHz 3 GHz 10 1 _ 1 10 10 0 10 1 pF 22 pF 10 0 10 2 10 _1 10 2 C 10 3 MHz 10 4 f 128 10/02 Multilayer Ceramic Capacitors HQF HQF; 0603 Typical characteristics for chip size 0603 ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) KKE0471-Z 10 0 KKE0474-P 10 0 Ω Ω ESR ESR 3 GHz 1 GHz 10 _1 10 300 MHz _1 100 MHz 10 _2 10 _1 10 0 10 1 10 10 2 pF _2 10 _1 10 0 10 1 C pF 10 2 C Self-resonant frequency fres versus capacitance C ESR versus frequency f KKE0475-X 10 1 Ω KKE0473-G 10 5 MHz fres ESR 0,4 pF 10 4 10 0 3,3 pF 10 _1 10 3 12 pF 27 pF 10 _2 10 2 10 3 MHz 10 4 10 2 _ 1 10 10 0 10 1 10 2 pF 10 3 C f 129 10/02 Multilayer Ceramic Capacitors HQF HQF; 0603 Typical characteristics for chip size 0603 Q factor versus capacitance C Q factor versus frequency f KKE0472-8 10 4 KKE0476-6 10 4 Q Q 10 3 100 MHz 10 3 0,4 pF 10 2 1 GHz 300 MHz 10 10 1 3 GHz 2 3,3 pF 12 pF 27 pF 10 0 10 1 _ 1 10 10 0 10 1 pF 10 2 10 _1 10 2 C 10 3 MHz 10 4 f 130 10/02 Herausgegeben von EPCOS AG Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND ++49 89 636 09, FAX (0 89) 636-2 26 89 ( EPCOS AG 2002. Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne ausdrückliche Genehmigung der EPCOS AG nicht gestattet. Bestellungen unterliegen den vom ZVEI empfohlenen Allgemeinen Lieferbedingungen für Erzeugnisse und Leistungen der Elektroindustrie, soweit nichts anderes vereinbart wird. Diese Broschüre ersetzt die vorige Ausgabe. Fragen über Technik, Preise und Liefermöglichkeiten richten Sie bitte an den Ihnen nächstgelegenen Vertrieb der EPCOS AG oder an unsere Vertriebsgesellschaften im Ausland. Bauelemente können aufgrund technischer Erfordernisse Gefahrstoffe enthalten. Auskünfte darüber bitten wir unter Angabe des betreffenden Typs ebenfalls über die zuständige Vertriebsgesellschaft einzuholen. Published by EPCOS AG Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY ++49 89 636 09, FAX (0 89) 636-2 26 89 ( EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without EPCOS’ prior express consent is prohibited. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers’ Association), unless otherwise agreed. This brochure replaces the previous edition. For questions on technology, prices and delivery please contact the Sales Offices of EPCOS AG or the international Representatives. Due to technical requirements components may contain dangerous substances. For information on the type in question please also contact one of our Sales Offices.