SMT inductors SIMID series, SIMID 2220-H Series/Type: B82442H Date: March 2008 Data Sheet EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited. SMT inductors, SIMID series B82442H SIMID 2220-H Size 2220 (EIA) or 5650 (IEC) Rated inductance 1 µH to 10000 µH Rated current 35 mA to 2500 mA Construction ■ Upright ferrite drum core ■ Laser-welded winding ■ Flame-retardant molding Features ■ ■ ■ ■ ■ Temperature range up to 150 °C Current handling capability up to 2.5 A High L values Qualified to AEC-Q200 Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020C ■ RoHS-compatible Applications ■ ■ ■ ■ ■ ■ Filtering of supply voltages, coupling, decoupling DC/DC converters Automotive electronics Telecommunications Consumer electronics Industrial electronics Terminals ■ Base material CuSn6 ■ Layer composition Cu, Ag, Sn (lead-free)1) ■ Electro-plated Marking ■ Marking on component: Manufacturer, L value (in nH), tolerance of L value (coded), date of manufacture (YWWD) ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 12-mm blister tape, wound on 330-mm ∅ reel ■ Packing unit: 1500 pcs./reel 1) Ni-barrier-plated terminals on request (B82442H*50). Please read Cautions and warnings and Important notes at the end of this document. 2 03/08 SMT inductors, SIMID series B82442H SIMID 2220-H Dimensional drawing and layout recommendation 3.5±0.11) A 0.7±0.2 1) B C D B 0.7 min.1) 5+0.3 0.15 max. IND0053-6 5.6+0.3 A B C D 4.5 2.0 4.0 8.0 5+0.3 Marking 1) Soldering area Dimensions in mm IND0088-3-E Taping and packing Reel 12±0.3 2±0.05 _0 12.4 +1.5 <_ 6.0 1.6±0.1 8±0.1 62±1.5 IND0350-S Direction of unreeling IND0564-H-E Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. 13±0.2 _2 330 +0 1.5+0.1 <_ 7.2 Component 18.4 max. 5.5±0.1 4±0.1 1.75±0.1 Blister tape 3 03/08 SMT inductors, SIMID series B82442H SIMID 2220-H Technical data and measuring conditions Rated inductance LR Measured with impedance analyzer Agilent 4294A at frequency fL, 0.1 V, 20 °C Q factor Qmin Measured with impedance analyzer Agilent 4294A at frequency fQ, 20 °C Rated temperature TR 85 °C Rated current IR Maximum permissible DC with inductance decrease L/L0 ≤ 10% and temperature increase of ≤ 40 K at rated temperature Self-resonance frequency fres,min Measured with network analyzer Agilent 8753D, 20 °C DC resistance Rmax Measured at 20 °C Solderability (lead-free) Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (5 ±0.3) s Wetting of soldering area ≥ 90% (based on IEC 60068-2-58) Resistance to soldering heat 260 °C, 40 s (as referenced in JEDEC J-STD 020C) Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +150 °C Packaged: –25 °C … +40 °C, ≤ 75% RH Weight Approx. 0.4 g Please read Cautions and warnings and Important notes at the end of this document. 4 03/08 SMT inductors, SIMID series B82442H SIMID 2220-H Characteristics and ordering codes LR Ordering code1)2) f L; f Q IR Rmax fres,min MHz mA Ω MHz 10 7.96 2500 0.024 95 B82442H1102K000 1.2 10 7.96 2350 0.028 70 B82442H1122K000 1.5 10 7.96 2200 0.032 55 B82442H1152K000 1.8 10 7.96 2000 0.040 47 B82442H1182K000 2.2 10 7.96 1800 0.048 42 B82442H1222K000 2.7 10 7.96 1700 0.056 37 B82442H1272K000 3.3 10 7.96 1550 0.064 34 B82442H1332K000 3.9 10 7.96 1450 0.072 32 B82442H1392K000 4.7 10 7.96 1350 0.088 29 B82442H1472K000 5.6 10 7.96 1250 0.104 26 B82442H1562K000 6.8 10 7.96 1130 0.120 24 B82442H1682K000 8.2 10 7.96 1050 0.144 22 B82442H1822K000 10 10 2.52 1000 0.168 19 B82442H1103K000 12 10 2.52 880 0.20 17 B82442H1123K000 15 10 2.52 810 0.24 16 B82442H1153K000 18 10 2.52 740 0.29 14 B82442H1183K000 22 10 2.52 670 0.35 13 B82442H1223K000 27 10 2.52 620 0.42 11.5 B82442H1273K000 10 2.52 560 0.50 10.5 B82442H1333+000 10 2.52 520 0.58 9.5 B82442H1393+000 47 10 2.52 480 0.68 8.5 B82442H1473+000 56 10 2.52 430 0.80 7.8 B82442H1563+000 68 10 2.52 400 0.96 7.0 B82442H1683+000 82 10 2.52 380 1.12 6.4 B82442H1823+000 100 20 0.796 350 1.28 6.0 B82442H1104+000 120 20 0.796 320 1.52 5.4 B82442H1124+000 150 20 0.796 290 1.76 4.8 B82442H1154+000 Tolerance Qmin µH 1.0 ±10% 33 ±5% 39 ±10% ^ ^ K J ^ K Closer tolerances on request. Higher currents possible at temperatures <TR on request. Sample kit available. Ordering code: B82442X001 For more information refer to chapter “Sample kits”. 1) Replace the + by the code letter for the required inductance tolerance. 2) For Ni-barrier-plated terminals replace the last two digits “00” by “50”. Please read Cautions and warnings and Important notes at the end of this document. 5 03/08 SMT inductors, SIMID series B82442H SIMID 2220-H Characteristics and ordering code LR Ordering code1)2) f L; f Q IR Rmax fres,min MHz mA Ω MHz 20 0.796 270 2.24 4.4 B82442H1184+000 20 0.796 240 2.72 3.9 B82442H1224+000 270 20 0.796 220 3.36 3.6 B82442H1274+000 330 20 0.796 200 3.92 3.2 B82442H1334+000 390 20 0.796 180 4.64 2.9 B82442H1394+000 470 20 0.796 170 5.60 2.6 B82442H1474+000 560 20 0.796 150 6.80 2.4 B82442H1564+000 680 20 0.796 140 8.00 2.2 B82442H1684+000 820 20 0.796 130 10.4 2.0 B82442H1824+000 1000 30 0.252 120 12.0 1.8 B82442H1105+000 1200 30 0.252 105 13.6 1.5 B82442H1125+000 1500 30 0.252 100 16.0 1.4 B82442H1155+000 1800 30 0.252 85 24.0 1.3 B82442H1185+000 2200 30 0.252 75 28.0 1.2 B82442H1225+000 2700 30 0.252 65 44.0 1.1 B82442H1275+000 3300 30 0.252 55 48.0 1.0 B82442H1335+000 3900 30 0.252 53 56.0 1.0 B82442H1395+000 4700 30 0.252 50 62.4 0.9 B82442H1475+000 5600 30 0.252 46 68.0 0.8 B82442H1565+000 6800 30 0.252 42 88.0 0.7 B82442H1685+000 8200 30 0.252 39 100 0.6 B82442H1825+000 10000 30 0.0796 35 120 0.5 B82442H1106+000 Tolerance Qmin µH 180 ±5% 220 ±10% ^ J ^ K Closer tolerances on request. Higher currents possible at temperatures <TR on request. Sample kit available. Ordering code: B82442X001 For more information refer to chapter “Sample kits”. 1) Replace the + by the code letter for the required inductance tolerance. 2) For Ni-barrier-plated terminals replace the last two digits “00” by “50”. Please read Cautions and warnings and Important notes at the end of this document. 6 03/08 SMT inductors, SIMID series B82442H SIMID 2220-H Impedance |Z| versus frequency f measured with impedance analyzer Agilent 4191A/A4194A, typical values at 20 °C Inductance L versus DC load current IDC measured with LCR meter Agilent 4275A, typical values at 20 °C IND0094-8 10 6 Ω B82442H L | Z | 10 5 10 3 10 3 10 2 10 2 10 1 1 µH 10 µH 100 µH 1000 µH 10000 µH 10 0 5 10 10 6 10 7 10 B82442H 10000 µH 10 4 10 4 10 1 IND0095-W 10 5 µH 1000 µH 100 µH 10 µH 1 µH 10 0 8 Hz 10 f 10 9 10 _2 10 _1 10 0 A 10 1 I DC Current derating Iop/IR versus ambient temperature TA (rated temperature TR = 85 °C) Q factor versus frequency f measured with impedance analyzer Agilent 4191A, typical values at 20 °C IND0096-9 80 _1 IND0097-H-E 1.2 B82442H Iop IR Q B82442H 1.0 60 0.8 40 0.6 0.4 20 0 10 4 1 µH 10 µH 100 µH 1000 µH 10000 µH 10 5 0.2 10 6 10 7 0 Hz 10 8 f 7 0 03/08 20 40 60 80 100 120 C 160 TA Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Please read Cautions and warnings and Important notes at the end of this document. 8 03/08 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 9 03/08