BAS16 Taiwan Semiconductor Small Signal Product 225mW SMD Switching Diode FEATURES - Low power loss, high current capability, low VF - Surface mount device type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOT-23 MECHANICAL DATA - Case: Bend lead SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Weight: 8 ± 0.5 mg - Marking Code: A6 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Power dissipation Repetitive peak reverse voltage Mean forward current Non-repetitive peak forward surge current @ t = 0.001 s Thermal resistance (Junction to Ambient) (Note 1) Junction and storage temperature range PARAMETER Reverse breakdown voltage IR = 100 μA SYMBOL VALUE UNIT PD 225 mW VRRM 75 V IO 150 mA IFSM 2 RθJA 375 TJ , TSTG -65 to +150 IF = 10 mA IF = 50 mA Junction capacitance Reverse recovery time o C MIN MAX UNIT V(BR) 75 - V 0.715 VF - IF = 150 mA Reverse leakage current C/W SYMBOL IF = 1.0 mA Forward voltage A o 0.855 1.000 V 1.250 VR = 75 V IR - 1 μA VR = 0 V , f = 1.0 MHz CJ - 2.0 pF (Note 2) trr - 3.0 ns Note 1: Valid provided that electrodes are kept at ambient temperature Note 2: Reverse recovery test conditions: IF=10mA , IR=10mA , RL=100 Ω, IRR= 1mA Document Number: DS_S1312001 Version: D14 BAS16 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Reverse Current VS. Reverse Voltage Fig. 1 Typical Forward Characteristics 1000 10 Reverse Current (μA) Instantaneous Forward Current (mA) 100 1 0.1 100 10 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1.6 0 Instantaneous Forward Voltage (V) 40 60 80 Reverse Voltage (V) 100 120 Fig. 4 Typical Junction Capacitance Fig. 3 Admissible Power Fig. 3 Dissipation Curve 1.4 300 1.3 Junction Capacitance (pF) 250 Power Dissipation (mW) 20 200 150 100 50 1.2 1.1 1.0 0.9 0.8 0 0 25 50 75 100 125 Ambient Temperature (oC) Document Number: DS_S1312001 150 175 0 8 16 24 32 40 Reverse Voltage (V) Version: D14 BAS16 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 1) CODE SUFFIX PART NO. BAS16 -xx RF G R5 PACKAGE PACKING 3K / 7" Reel SOT-23 10K / 13" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. PART NO. SUFFIX BAS16 RF BAS16 RF BAS16 RFG BAS16 RF BAS16-B0 RFG BAS16 -B0 PACKING CODE PACKING CODE SUFFIX DESCRIPTION Multiple manufacture source RF G Multiple manufacture source Green compound G Defined manufacture source Green compound PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit (mm) Unit (inch) Typ. Typ. Z 2.8 0.110 X 0.7 0.028 Y 0.9 0.035 C 1.9 0.075 E 1.0 0.039 SUGGEST PAD LAYOUT DIM. Document Number: DS_S1312001 Version: D14 BAS16 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1312001 Version: D14