Datasheet Voltage Detector IC Series Free Delay Time Setting CMOS Voltage Detector IC Series BD52Exxx-M series BD53Exxx-M series (for Automotive Accessories) ●General Description Rohm's BD52Exxx and BD53Exxx series are highly accurate, low current consumption Voltage Detector ICs with a capacitor controlled time delay. The line up includes BD52Exxx devices with N-channel open drain output and BD53Exxx devices with CMOS output. The devices are available for specific detection voltages ranging from 2.3V to 6.0V in increments of 0.1V. ●Features Delay Time Controlled by external Capacitor Two output types (N-channel open drain and CMOS output) Ultra-low current consumption Very small, lightweight and thin package Package SSOP5 is similar to SOT-23-5(JEDEC) ●Typical Application Circuit VDD1 ●Key Specifications Detection voltage: 2.3V to 6.0V (Typ.) 0.1V steps High accuracy detection voltage: ±1.0% Ultra-low current consumption: 0.95µA (Typ.) ●Package SSOP5: 2.90mm x 2.80mm x 1.25mm ●Applications Circuits using microcontrollers or logic circuits that require a reset. VDD2 VDD1 RL RST BD52Exxx-M CT CT CL GND Open Drain Output type BD52Exxx-M Series CT GND CMOS Output type BD53Exxx-M Series N.C. Lot. No Marking ●Pin Descriptions CL (Capacitor for noise filtering) (Capacitor for noise filtering) ●Connection Diagram SSOP5 TOP VIEW Micro RST controller BD53Exxx-M Micro controller VOUT VDD GND SSOP5 PIN No. 1 2 3 4 Symbol VOUT VDD GND N.C. 5 CT Function Reset Output Power Supply Voltage GND Unconnected Terminal Capacitor connection terminal for output delay time ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays .www.rohm.com TSZ02201-0R7R0G300090-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/12 TSZ22111・14・001 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Ordering Information B D x Part Number x E Output Type 52 : Open Drain 53 : CMOS x x x M - Reset Voltage Value Package 23 : 2.3V G : SSOP5 0.1V step 60 : 6.0V T R Automotive Accessories Packaging and forming specification TR : Embossed tape and reel SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6 ° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 0.05±0.05 1.1±0.05 1.25Max. ) +0.05 0.42 −0.04 0.95 0.1 Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Lineup Output Type Open Drain Detection Voltage Marking Part Number 6.0V Ph BD52E60 5.9V Pg BD52E59 5.8V Pf BD52E58 5.7V Pe BD52E57 5.6V Pd BD52E56 5.5V Pc BD52E55 5.4V Pb BD52E54 5.3V Pa BD52E53 5.2V Ny BD52E52 5.1V Nr BD52E51 5.0V Np BD52E50 4.9V Nn BD52E49 4.8V Nm BD52E48 4.7V Nk BD52E47 4.6V Nh BD52E46 4.5V Ng BD52E45 4.4V Nf BD52E44 4.3V Ne BD52E43 4.2V Nd BD52E42 4.1V Nc BD52E41 4.0V Nb BD52E40 3.9V Na BD52E39 3.8V My BD52E38 3.7V Mr BD52E37 3.6V Mp BD52E36 3.5V Mn BD52E35 3.4V Mm BD52E34 3.3V Mk BD52E33 3.2V Mh BD52E32 3.1V Mg BD52E31 3.0V Mf BD52E30 2.9V Me BD52E29 2.8V Md BD52E28 2.7V Mc BD52E27 2.6V Mb BD52E26 2.5V Ma BD52E25 2.4V Ly BD52E24 2.3V Lr BD52E23 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/12 Marking Ud Uc Ub Ua Ry Rr Rp Rn Rm Rk Rh Rg Rf Re Rd Rc Rb Ra Qy Qr Qp Qn Qm Qk Qh Qg Qf Qe Qd Qc Qb Qa Py Pr Pp Pn Pm Pk CMOS Part Number BD53E60 BD53E59 BD53E58 BD53E57 BD53E56 BD53E55 BD53E54 BD53E53 BD53E52 BD53E51 BD53E50 BD53E49 BD53E48 BD53E47 BD53E46 BD53E45 BD53E44 BD53E43 BD53E42 BD53E41 BD53E40 BD53E39 BD53E38 BD53E37 BD53E36 BD53E35 BD53E34 BD53E33 BD53E32 BD53E31 BD53E30 BD53E29 BD53E28 BD53E27 BD53E26 BD53E25 BD53E24 BD53E23 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Absolute maximum ratings Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current Power *1*2 SSOP5 Dissipation Operating Temperature Ambient Storage Temperature Symbol VDD-GND Unit V Io Limits -0.3 to +10 GND-0.3 to +10 GND-0.3 to VDD+0.3 80 Pd 540 mW Topr Tstg -40 to +105 -55 to +125 °C °C VOUT V V *1 Reduced by 5.4mW/°C when used over 25°C. *2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Condition Symbol VDET=2.5V Ta=+25°C Ta=-40°C to 85°C Min. VDET(T) ×0.99 2.475 2.418 VDET=3.0V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 2.5 - Max. VDET(T) ×1.01 2.525 2.584 2.404 2.970 2.901 3.0 - 2.597 3.030 3.100 VDET=3.3V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 2.885 3.267 3.191 3.3 - 3.117 3.333 3.410 VDET=4.2V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 3.173 4.158 4.061 4.2 - 3.428 4.242 4.341 VDET=4.8V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 4.039 4.752 4.641 4.8 - 4.364 4.848 4.961 0.80 0.85 0.90 0.95 0.75 0.80 0.85 0.90 - 4.987 2.40 2.55 2.70 2.85 2.25 2.40 2.55 2.70 0.5 0.5 - *1 VDD=H L, RL=470kΩ Detection Voltage VDET Ta=85°C to 105°C 4.616 VDET =2.3-3.1V VDET =3.2-4.2V Circuit Current when ON IDD1 VDD=VDET-0.2V VDET =4.3-5.2V VDET =5.3-6.0V VDET =2.3-3.1V VDET =3.2-4.2V Circuit Current when OFF IDD2 VDD=VDET+2.0V VDET =4.3-5.2V VDET =5.3-6.0V 0.95 VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ Operating Voltage Range VOPL VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ 1.20 VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V ‘Low’ Output Voltage (Nch) VOL VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5 ‘High’ Output Voltage (Pch) VOH VDD=6.0V, ISOURCE=0.9 mA, VDET(4.3V to 5.2V) VDD-0.5 VDD=8.0V, ISOURCE=1.1 mA, VDET(5.3V to 6.0V) VDD-0.5 VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Design Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is at Ta=25°C. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Limit Typ. 3/12 VDET(T) Unit V µA µA V V V TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued Parameter Leak Current when OFF Symbol Ileak Limit Condition *1 VDD=VDS=10V VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ CT pin Threshold Voltage VCTH VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Hysteresis Voltage RCT ICT VDD=VDET×1.1 VCT=0.5V VCT=0.1V VDD=0.95V VCT=0.5V VDD=1.5V VDET/∆T Ta=-40°C to 105°C ∆ VDET VDD=L H L, RL=470kΩ *1 *1 Unit Min. VDD ×0.30 VDD ×0.30 VDD ×0.35 VDD ×0.40 5.5 15 150 Typ. VDD ×0.40 VDD ×0.45 VDD ×0.50 VDD ×0.50 9 40 240 Max. 0.1 VDD ×0.60 VDD ×0.60 VDD ×0.60 VDD ×0.60 12.5 - - ±100 ±360 ppm/°C VDET ×0.03 VDET ×0.05 VDET ×0.08 V µA V MΩ µA VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Design Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is at Ta=25°C. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Block Diagrams VDD VOUT Vref CT GND Figure.1 BD52Exxx-M Series VDD VOUT Vref CT GND Figure.2 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD53Exxx-M Series 5/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL [mA] CIRCUIT CURRENT ： IDD [µA] 2.0 【BD5242G/FVE】 【BD52E42G-M】 【BD53E42G-M】 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 18 【BD5242G/FVE】 【BD52E42G-M】 15 【BD53E42G-M】 12 9 6 3 VDD =1.2V 0 0.0 0.5 1.0 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V] Figure.4 “Low” Output Current Figure.3 Circuit Current 9 45 【BD5342G/FVE】 【BD53E42G-M】 40 OUTPUT VOLTAGE ： VOUT [V] "HIGH" OUTPUT CURRENT ： IOH [mA] VDD =2.4V 35 30 25 20 VDD =8.0V 15 VDD =6.0V 10 5 VDD =4.8V 【BD5242G/FVE】 【BD52E42G-M】 8 7 【BD53E42G-M】 6 5 4 3 Ta=25℃ 2 1 Ta=25℃ 0 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VD D [V] Figure.5 “High” Output Current Figure.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Typical Performance Curves – continued 450 CT OUTPUT CURRENT ： ICT [µA] OUTPUT VOLTAGE： VOUT [V] 1.0 【BD52E42G-M】 【BD5242G/FVE】 0.8 【BD53E42G-M】 0.6 0.4 0.2 0.0 0.0 400 【BD5242G/FVE】 【BD52E42G-M】 350 【BD53E42G-M】 300 250 200 150 100 50 0 0.5 1.0 1.5 2.0 0 2.5 CIRCUIT CURRENT WHEN ON ： IDD1 [µA] DETECTION VOLTAGE ： V DET[V] 5.6 【BD52E42G-M】 【BD5242G/FVE】 5.2 【BD53E42G-M】 Low to high(VDET+ ΔVDET) 4.4 4.0 High to low(VDET) 3.6 0 40 80 4 5 1.5 【BD52E42G-M】 【BD5242G/FVE】 【BD53E42G-M】 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Figure.10 Circuit Current when ON Figure.9 Detection Voltage Release Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3 Figure.8 CT Terminal Current Figure.7 Operating Limit Voltage ～ ～ 3.2 -40 2 VDD SUPPLY VOLTAGE ： VDD [V] VDD SUPPLY VOLTAGE ： VDD [V] 4.8 1 7/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Typical Performance Curves – continued 1.5 MINIMUM OPERATING VOLTAGE ： V OPL[V] CIRCUIT CURRENT WHEN OFF ： I DD2 [µA] 1.5 【BD52E42G-M】 【BD5242G/FVE】 【BD53E42G-M】 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 【BD52E42G-M】 【BD5242G/FVE】 【BD53E42G-M】 1.0 0.5 0.0 -40 -20 Figure.11 Circuit Current when OFF 【BD53E42G-M】 60 80 100 10000 【BD5242G/FVE】 【BD52E42G-M】 DELAY TIME ： tPLH [ms] RESISTANCE OF C T ： RCT[MΩ] 11 40 Figure.12 Operating Limit Voltage 13 【BD52E42G-M】 【BD5242G/FVE】 20 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] 12 0 10 9 8 7 6 1000 【BD53E42G-M】 100 10 1 5 4 -40 -20 0 20 40 60 80 0.1 0.0001 100 0.01 0.1 CAPACITANCE OF C T ： C CT[µF] TEMPERATURE ： Ta[℃] Figure.14 Delay Time (tPLH) and CT Terminal External Capacitance Figure.13 CT Terminal Circuit Resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.001 8/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Application Information Explanation of Operation For both the open drain type (Figure.15) and the CMOS output type (Figure.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical Characteristics for information on hysteresis. Because the BD52Exxx-M series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD RL R1 Q2 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 Q3 VOUT Q1 Q3 R3 R3 GND GND CT CT Figure.15 (BD52Exxx-MType Internal Block Diagram) Figure.16 (BD53Exxx-MType Internal Block Diagram) Setting of Detector Delay Time It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal. Delay time at the rise of VDD tPLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+∆VDET) tPLH = -CCT×RCT×ln VDD-VCTH VDD CCT: CT pin Externally Attached Capacitance RCT: CT pin Internal Impedance（Please refer to Electrical Characteristics.） VCTH: CT pin Threshold Voltage（Please refer to Electrical Characteristics.） ln : Natural Logarithm Reference Data of Falling Time (tPHL) Output Examples of Falling Time (tPHL) Output Part Number BD52E27G-M tPHL[µs] -40°C 30.8 tPHL[µs] ,+25°C 30 tPHL[µs],+105°C 28.8 BD53E27G-M 26.8 26 24.8 *This data is for reference only. The figures will vary with the application, so confirm actual operating conditions before use. Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Figure.15 and 16). 1 When the power supply is turned on, the output is unstable VDD from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when VDET+ΔVDET ⑤ VDET the rise time of VDD is faster than tPHL. 2 When VDD is greater than VOPL but less than the reset release VOPL 0V voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. VCT 3 If VDD exceeds the reset release voltage (VDET+∆VDET), then 1/2 VDD VOUT switches from L to H (with a delay due to the CT terminal). 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). VOUT tPLH tPHL tPLH 5 The potential difference between the detection voltage and the tPHL release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with ① ② ③ ④ power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. Figure.17 Timing Waveform www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Circuit Applications 1) Examples of a common power supply detection reset circuit VDD1 VDD2 RL RST BD52Exxx-M Micro controller CT CL （Noise-filtering Capacitor） GND Figure.18 Open Drain Output Type CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output type (BD52Exxx) with a load resistance RL attached as shown Figure.18. CASE2: Power supply of the microcontroller (VDD1) is the same as the power supply of the reset detection (VDD1). Use a CMOS output type (BD53Exxx) device or open drain output type (BD52Exxx) device with a pull up resistor attached between the output and VDD1. VDD1 Micro RST controller BD53Exxx-M Application examples of BD52Exxx series (Open Drain output type) and BD53Exxx series (CMOS output type) are shown below. CT CL （Noise-filtering Capacitor） When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). Please refer to Operational Notes for recommendations on resistor and capacitor values. GND Figure.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BD52Exxx-M NO.1 BD52Exxx-M NO.2 RST microcontroller CT CT GND Fig.20 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BD52Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series 3) Examples of the power supply with resistor dividers In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. Figure.21 V1 IDD R2 I1 R1 CIN Through Current VDD BD52Exxx-M BD53Exxx-M VOUT CL GND VDD VDET 0 When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. VDD - IDD Peak Current Ta=25℃ 10 BD52Exxx-M BD53Exxx-M IDD-peak[mA] 1 0.1 0.01 0.001 3 4 5 6 7 8 9 10 VDD[V] Figure.22 IDD Peak Current vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet BD52Exxx-M series BD53Exxx-M series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) External parameters The recommended value of RL Resistor is 50kΩ to 1MΩ. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 11) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 12) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 14) CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/12 TSZ02201-0R7R0G300090-1-2 22.May.2013 Rev.004 Datasheet Notice General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet Other Precaution 1. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.