Rohm BD99A41F Voltage detector ics with watchdog timer Datasheet

Power Management ICs for Automotive Body Control
Voltage Detector ICs
with Watchdog Timer
BD37A19FVM,BD37A41FVM,BD87A28FVM,BD87A29FVM
BD87A34FVM,BD87A41FVM,BD99A41F
No.10039EAT12
●Description
The BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM, BD87A34FVM, BD87A41FVM and BD99A41F are
watchdog timer reset ICs. It delivers a high precision detection voltage of 1.5% and a super-low current consumption of 5
µA (Typ.). It can be used in a wide range of electronic devices to monitor power supply voltages and in system operation to
prevent runaway operation.
●Features
1) High precision detection voltage: 1.5%, 2.5% (Ta = −40℃ to 105℃)
2) Super-low current consumption: 5 µA (Typ.)
3) Built-in watchdog timer
4) Reset delay time can be set with the CT pin's external capacitance.
5) Watchdog timer monitor time and reset time can be set with the CTW pin's external capacitance.
6) Output circuit type: N-channel open drain
7) Package: MSOP8 (BD37A□□FVM, BD87A□□FVM) / SOP8 (BD99A41F)
●Applications
All devices using microcontrollers or DSP, including vehicle equipment, displays, servers, DVD players,
and telephone systems.
●Product line
INH logic
H: Active
L: Active
Model
BD37A□□FVM
BD99A41F
BD87A□□FVM
Detection voltage
1.9 V/4.1V
4.1 V
2.8V/2.9V/3.4 V/4.1V
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© 2010 ROHM Co., Ltd. All rights reserved.
1/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Absolute maximum ratings (Ta = 25℃)
Parameter
Symbol
Ratings
Unit
Power supply voltage
VDD
−0.3 to 10
V
CT pin voltage
VCT
−0.3 to VDD + 0.3
V
VCTW
−0.3 to VDD + 0.3
V
VRESET
−0.3 to VDD + 0.3
V
INH pin voltage
VINH
−0.3 to VDD + 0.3
V
CLK pin voltage
VCLK
−0.3 to VDD + 0.3
V
CTW pin voltage
RESET pin voltage
Power dissipation
470*1
Pd
mW
550*2
Operating ambient temperature
Topr
−40 to + 105
℃
Storage temperature
Tstg
−55 to + 125
℃
Tjmax
125
℃
Maximum junction temperature
*1 MSOP8 : Reduced by 4.70 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*2 SOP8 : Reduced by 5.50 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
●Recommended operating ranges (Ta = −40℃ to 105℃)
Parameter
RESET power supply voltage
WDT power supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
Symbol
Min.
Max.
Unit
VDD RESET
1.0
10
V
VDD WDT
2.5
10
V
2/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Electrical characteristics (Unless otherwise specified, Ta = −40℃ to 105℃, VDD = 5 V)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Conditions
[Overall]
Total supply current 1
(during WDT operation)
Total supply current 2
(when WDT stopped)
IDD1
—
5
14
µA
INH : WDT ON Logic Input
CTW = 0.1 µF
IDD2
—
5
14
µA
INH : WDT OFF Logic Input
Output leak current
Ileak
—
—
1
µA
VDD = VDS = 10 V
Output current capacity
IOL
0.7
—
—
mA
VDD = 1.2 V, VDS = 0.5 V
1.9V Detect
VDET1
1.871
1.900
1.929
V
Ta = 25℃
2.8V Detect
VDET1
2.758
2.800
2.842
V
Ta = 25℃
2.9V Detect
VDET1
2.886
2.930
2.974
V
Ta = 25℃
3.4V Detect
VDET1
3.349
3.400
3.451
V
Ta = 25℃
4.1V Detect
VDET1
4.039
4.100
4.162
V
Ta = 25℃
1.9V Detect
VDET2
1.852
1.900
1.948
V
Ta = −40 to 105℃
2.8V Detect
VDET2
2.730
2.800
2.870
V
Ta = −40 to 105℃
2.9V Detect
VDET2
2.857
2.930
3.003
V
Ta = −40 to 105℃
3.4V Detect
VDET2
3.315
3.400
3.485
V
Ta = −40 to 105℃
4.1V Detect
VDET2
4.007
4.100
4.202
V
Ta = −40 to 105℃
1.9V Detect
Vrhys
VDET × 0.03 VDET × 0.13 VDET × 0.19
V
Ta = −40 to 105℃
2.8V Detect
Vrhys
VDET × 0.018 VDET × 0.045 VDET × 0.060
V
Ta = −40 to 105℃
2.9V Detect
Vrhys
VDET × 0.02 VDET × 0.05 VDET × 0.06
V
Ta = −40 to 105℃
3.4V Detect
Vrhys
VDET × 0.02 VDET × 0.05 VDET × 0.07
V
Ta = −40 to 105℃
4.1V Detect
Vrhys
VDET × 0.018 VDET × 0.035 VDET × 0.050
V
Ta = −40 to 105℃
[RESET]
Detection
voltage 1
Detection
voltage 2
Hysteresis
width
RESET transmission
delay time: low  high
TPLH
3.9
6.9
10.1
ms
CT = 0.001 µF*1
When VDD = VDET 0.5 V
Delay circuit resistance
Rrst
5.8
10.0
14.5
MΩ
VCT = GND
VCTH
VDD × 0.3
VDD × 0.45
VDD × 0.6
V
RL = 470 KΩ
ICT
150
—
—
µA
VDD = 1.50 V, VCT = 0.5 V
VOPL
1.0
—
—
V
VOL ≤ 0.4 V, RL = 470 KΩ
WDT monitor time
TwH
7.0
10.0
20.0
ms
CTW = 0.01 µF*2
WDT reset time
TwL
2.4
3.3
7.0
ms
CTW = 0.01 µF*3
Clock input pulse width
TWCLK
500
—
—
ns
CLK high threshold voltage
VCLKH
VDD × 0.8
—
VDD
V
CLK low threshold voltage
VCLKL
0
—
VDD × 0.3
V
CLK high threshold voltage
VINHH
VDD × 0.8
—
VDD
V
CLK low threshold voltage
VINHL
0
—
VDD × 0.3
V
CTW charge current
ICTWC
0.25
0.50
0.75
µA
VCTW = 0.2 V
CTW discharge current
ICTWO
0.75
1.50
2.00
µA
VCTW = 0.8 V
Delay pin threshold voltage
Delay pin output current
Min. operating voltage
[WDT]
*1
*2
*3
○
TPLH can be varied by changing the CT capacitance value.
TPLH (s)  0.69 × Rrst (MΩ) × CT (µF) Rrst = 10 MΩ
TwH can be varied by changing the CT capacitance value.
TwH (s)  (0.5 × CTW (µF))/ICTWC (µA) ICTWC = 0.5 µA
TwL can be varied by changing the CTW capacitance value.
TwL (s)  (0.5 × CTW (µF))/ICTWO (µA) ICTWO = 1.5 µA
Note: This IC is not designed to be radiation-resistant.
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© 2010 ROHM Co., Ltd. All rights reserved.
(Typ.)
(Typ.)
(Typ.)
3/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Reference data (Unless otherwise specified, Ta = 25℃) : 4.1V Detection
10
8
6
4
2
0
1400
Ta=105℃
8
6
Ta=25℃
4
Ta=-40℃
2
2
4
6
8
10
Fig.1
800
600
400
200
2
4
6
8
0
10
Detection Voltage
Fig.2
Total Supply Current
Fig.3
2
1
0.5
0
-0.5
Ta=105℃
1.5
Ta=25℃
Ta=-40℃
1
0.5
1
2
3
4
0
5
2
CTW PIN VOLTAGE: VCTW [V]
6
8
1
0.0001
10
Output Current
10
Reset Time
1
0.1
0.001
0.01
0.1
1
4.5
L→H
4.25
4
H→L
3.75
3.5
-40
CTW PIN CAPACITY: CTW [V]
Fig.7
0
Fig.8
13
40
0.5
0.25
0
-40
80
Detection Voltage
vs Temperature
OUTPUT DELAY TIME: TPLH [ms]
11
10
9
8
-40
0
40
80
8
7
6
Fig.10 CT Pin Circuit Resistance
vs Temperature
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© 2010 ROHM Co., Ltd. All rights reserved.
0
40
80
AMBIENT TEMPERATURE: Ta [℃]
AMBIENT TEMPERATURE: Ta [℃]
Fig.11
40
80
Fig.9
Operating Marginal Voltage
vs Temperature
15
9
5
-40
0
AMBIENT TEMPERATURE: Ta [℃]
10
12
0.1
0.75
AMBIENT TEMPERATURE: Ta [℃]
WDT Time vs Capacitance
0.01
1
4.75
10
0.001
Fig.6 RESET Transmission
Delay Time vs Capacitance
OPERATING VOLTAGE: VOPL [V]
DETECTION VOLTAGE: VDET [V]
Moniter Time
Delay Pin Current
vs Power Supply Voltage
CT PIN CAPACITY: CT [µF]
5
1000
100
4
Fig.5
10000
5
10
RESET VOLTAGE: VRESET [V]
CTW Charge Discharge Current
4
100
WDT RESET TIME: Tw [ms]
Fig.4
3
1000
0
-1
2
10000
OUTPUT DELAY TIME: TPLH [ms]
RESET CURRENT: IRESET [mA]
1.5
0
1
SUPPLY VOLTAGE: VDD [V]
SUPPLY VOLTAGE: VDD [V]
2
CTW PIN CURRENT: ICTW [µA]
1000
0
0
SUPPLY VOLTAGE: VDD [V]
WDT RESET TIME: Tw [ms]
1200
0
0
OUTPUT DELAY RESISTANCE: Rrst [MΩ]
CT PIN CURRENT: ICT [µA]
10
CIRCUIT CURRENT: IDD [µA]
OUTPUT VOLTAGE: VOUT [V]
12
RESET Transmission Delay
Time vs Temperature
4/10
12
Moniter Time
9
6
Reset Time
3
0
-40
0
40
80
AMBIENT TEMPERATURE: Ta [℃]
Fig.12 WDT Time vs Temperature
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Block diagram
BD37A□□FVM
BD87A□□FVM / BD99A41F
VDD
VDD
RESET
RESET
8
CLK
8
CTW
1
1
R
R
+
S
Q
+
Vref
S
Q
Vref
2
N.C.
CT
INH
CT
7
2
7
VDD
CTW
3
Pulse
generation
circuit
+
R
+
VthH
VDD
VDD
+
CLK
GND
Q
S
Pulse
generation
circuit
VthL
+
VthH
INH
Q
6
S
VthL
GND
N.C.
4
R
3
6
VDD
4
5
5
CT pin capacitor: 470 pF to 3.3 µF
CTW pin capacitor: 0.001 µF to 10 µF
Fig.13
●Pin assignments
8 7 6 5
1 2 3 4
Fig.14
BD87A□□FVM / BD99A41F
BD37A□□FVM
No.
Pin
name
No.
Pin
name
Function
1
CLK
Clock input from microcontroller
1
CTW
WDT time setting capacitor connection pin
2
CT
Reset delay time setting capacitor
connection pin
2
CT
3
CTW
WDT time setting capacitor connection pin
3
CLK
Clock input from microcontroller
4
VDD
Power supply pin
4
GND
GND pin
5
N.C.
NC pin
5
VDD
Power supply pin
6
GND
GND pin
6
INH
WDT on/off setting pin
INH=H/L:WDT=OFF/ON(BD87A□□FVM)
INH=H/L:WDT=ON/OFF(BD99A41F)
7
INH
WDT on/off setting pin
INH=H/L:WDT=ON/OFF
7
N.C.
NC pin
8
Function
RESET Reset output pin
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© 2010 ROHM Co., Ltd. All rights reserved.
Reset delay time setting capacitor
connection pin
8 RESET Reset output pin
5/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●I/O Circuit diagram
CT
INH
CT
VDD
VDD
VDD
VDD
10Ω(Typ.)
INH
CLK
CTW
VDD
CT
RESET
VDD
RESET
CTW
Fig.15
●Timing chart
V DETH
VDD
V DET
WDT circuit turns off
when INH is low.
0
V DETH = VDET + Vrhys
INH
(BD37A□□FVM／BD99A41F)
0
WDT circuit turns off
when INH is high.
INH
(BD87A□□FVM)
0
CLK
0
*4 TWCLK TWCLK
VCT V CTH
0
VthH
V CTW
0
VthL
*2
*1
T PLH
TWH
*3
TWL
R ESET
0
(1)(2) (3)
(4) (5)
(4) (5)
(6) (7)
(7)
(4) (5)(8)
(9)
(4) (5) (10) (2)(3)
(4) (5) (10) (2) (3)
(4) (5) (10)(11)
Fig.16
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© 2010 ROHM Co., Ltd. All rights reserved.
6/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Explanation
1) The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V.
2)
The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage
(VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches
or exceeds the VDETH voltage. The RESET transmission delay time TPLH allowed to elapse before RESET switches
from low to high is given by the following equation:
TPLH (s)  0.69 × Rrst × CT (µF)   [1]
Rrst denotes the IC's built-in resistance and is designed to be 10 MΩ (Typ.). CT denotes the external capacitor
connected to the CT pin.
3)
The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer.
4)
The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW) reaches VthH, and RESET
switches from high to low. The watchdog timer monitor time TWH is given by the following equation:
TWH (s)  (0.5 × CTW (µF))/(ICTWC)   [2]
ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ.). CTW denotes the external capacitor
connected to the CTW pin.
5) The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to high.
The watchdog timer reset time TWL is given by the following equation:
TWL (s)  (0.5 × CTW (µF))/(ICTWO)   [3]
ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ.).
6)
The CTW pin state may not switch from charge to discharge when the CLK input pulse width TWCLK is short. Use a
TWCLK input pulse width of at least 500 ns.
TWCLK ≥ 500 ns (Min.)
7)
When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW
state switches from charge to discharge. Once it discharges to VthL, it will charge again.
8)
Watchdog timer operation is forced off when the INH pin switches to low:BD37A □□FVM (Switches to high:
BD87A□□FVM, BD97A41F). At that time, only the watchdog timer is turned off. Reset detection is performed normally.
9)
The watchdog timer function turns on when the INH pin switches to high. The external capacitor connected to the CTW
pin begins to charge at that time.
10) RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower.
11) When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V.
●Heat reduction curve
MSOP8
SOP8
800
800
When mounted on a glass epoxy board
(70 mm  70 mm  1.6mm) ja = 181.8 (°C /W)
POWER DISSIPATION: Pd [mW]
POWER DISSIPATION: Pd [mW]
When mounted on a glass epoxy board
(70 mm  70 mm  1.6mm) ja = 212.8 (°C /W)
600
470mW
400
200
105℃
0
600
550mW
400
200
105℃
0
0
25
50
75
100
125
0
AMBIENT TEMPERATURE: Ta [℃]
25
50
75
100
125
AMBIENT TEMPERATURE: Ta [℃]
Fig.17
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© 2010 ROHM Co., Ltd. All rights reserved.
7/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●External settings for pins and precautions
1) Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high. Use
of the IC when the power line impedance is high may result in oscillation.
2) External capacitance
A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a CTW
discharge time of at least 2 ms. The power-on reset time is given by equation [1] on page 5. The WDT time is given by
equations [2] and [3] on page 5, 6. The setting times are proportional to the capacitance value from the equations, so the
maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance.
Note however that the electrical characteristics do not include the external capacitor's temperature characteristics.
●Notes for use
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
6) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
7) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
○When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
○When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Transistor (NPN)
B
Resistor
(Pin A)
(Pin B)
C
(Pin B)
E
B
C
E
P
P+
P+
P
P+
N
N
N
N
P
Parasitic element
or transistor
Parasitic element or
transistor
N
P substrate
Parasitic element
GND
GND
P+
N
GND
(Pin A)
Parasitic element
Fig. 18 Example of IC structure
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© 2010 ROHM Co., Ltd. All rights reserved.
8/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the
GND wiring pattern of any external components, either.
9) Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed from
their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance of 1000 µF
or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a
diode for preventing back current flow in series with VDD or bypass diodes between Vcc and each pin.
Back current prevention diode
Bypass diode
VDD
Pin
Fig.19
10) When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input, output
will be equivalent to VDD.
11) Input pin
The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or
down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input the
trigger to the CLK pin within the TWH time.
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9/10
2010.12 - Rev.A
BD37A19FVM, BD37A41FVM, BD87A28FVM, BD87A29FVM,
BD87A34FVM, BD87A41FVM, BD99A41F
Technical Note
●Ordering part number
B
D
3
Part No.
BD
7
A
1
9
F
Part No.
37A19, 37A41, 87A28,
87A29, 87A34, 87A41
99A41
V
M
Package
FVM
: MSOP8
F
: SOP8
-
T
R
Packaging and forming specification
TR: Embossed tape and reel
(MSOP8)
E2: Embossed tape and reel
(SOP8)
MSOP8
<Tape and Reel information>
4.0±0.2
2.8±0.1
8 7 6 5
0.29±0.15
+6°
4° −4°
0.6±0.2
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
+0.05
0.22 −0.04
0.08±0.05
0.75±0.05
0.9MAX
S
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SOP8
<Tape and Reel information>
6
5
+6°
4° −4°
0.3MIN
7
4.4±0.2
6.2±0.3
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
10/10
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.12 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2010 ROHM Co., Ltd. All rights reserved.
R1010A