ｓ DIODE Type : 10EDB10 OUTLINE DRAWING 1A 100V Tj =150 °C FEATURES * Miniature Size * Low Forward Voltage drop * Low Reverse Leakage Current * High Surge Capability * 26mm and 52mm Inside Tape Spacing Package Available Maximum Ratings Approx Net Weight:0.17g Rating Symbol Repetitive Peak Reverse Voltage Average Rectified Output Current RMS Forward Current VRRM IO 50Hz Half Sine Wave Resistive Load 10EDB10 Unit 100 V Ta=39°C *1 1.0 Ta=26°C *2 0.9 IF(RMS) Surge Forward Current IFSM Operating JunctionTemperature Range Storage Temperature Range Tjw Tstg 50Hz Half Sine Wave,1cycle, Non-repetitive - 40 to + 150 - 40 to + 150 A 1.57 A 45 A °C °C Electrical • Thermal Characteristics Characteristics Peak Reverse Current Peak Forward Voltage Symbol IRM VFM Conditions Tj= 25°C, VRM= VRRM Tj= 25°C, IFM= 1.0A Junction to P.C. Board mounted*1 Thermal Resistance Rth(j-a) Ambient Without Fin *2 *1: P.C. Board mounted (L=3mm, Print Land=5 x 5mm, Both Sides) *2: Without Fin or P.C. Board mounted Min. Typ. Max. Unit - - 10 1.0 110 140 µA V °C/W ｓ 10EDB OUTLINE DRAWING (Dmensions in mm) FORWARD CURRENT VS. VOLTAGE 10EDB10 INSTANTANEOUS FORWARD CURRENT (A) 10 5 2 Tj=25°C Tj=150°C 1 0.5 0.2 0.1 0 0.4 0.8 1.2 1.6 INSTANTANEOUS FORWARD VOLTAGE (V) AVERAGE FORWARD POWER DISSIPATION (W) AVERAGE FORWARD POWER DISSIPATION 10EDB10 1.6 D.C. 1.4 1.2 HALF SINE WAVE 1.0 0.8 0.6 0.4 0.2 0 0 0.4 0.8 AVERAGE FORWARD CURRENT (A) 1.2 1.6 AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE Without Fin or P.C. Board 10EDB10 AVERAGE FORWARD CURRENT (A) 1.4 D.C. 1.2 HALF SINE WAVE 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (°C) AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE P.C. Board mounted (L=3mm,Print Land=5×5mm,Both Sides)) 10EDB10 1.6 AVERAGE FORWARD CURRENT (A) D.C. 1.4 1.2 HALF SINE WAVE 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 125 150 SURGE CURRENT RATINGS f=50Hz,Harf Sine Wave,Non-Repetitive,No Load 10EDB10 SURGE FORWARD CURRENT (A) 50 40 30 20 10 I FSM 0.02s 0 0.02 0.05 0.1 0.2 TIME (s) 0.5 1 2