SEMICONDUCTOR TECHNICAL DATA The MC10E/100E337 is a 3-bit registered bus transceiver with scan. The bus outputs (BUS0–BUS2) are specified for driving a 25Ω bus; the receive outputs (Q0 – Q2) are specified for 50Ω. The bus outputs feature a normal HIGH level (VOH) and a cutoff LOW level — when LOW, the outputs go to – 2.0V and the output emitter-follower is “off”, presenting a high impedance to the bus. The bus outputs also feature edge slow-down capacitors. • • • • • • • • • • • • 3-BIT SCANNABLE REGISTERED BUS TRANSCEIVER Scannable Version of E336 25Ω Cutoff Bus Outputs 50Ω Receiver Outputs Scannable Registers Sync. and Async. Bus Enables Non-inverting Data Path 1500ps Max. Clock to Bus (Data Transmit) 1000ps Max. Clock to Q (Data Receive) FN SUFFIX PLASTIC PACKAGE CASE 776-02 Bus Outputs Feature Internal Edge Slow-Down Capacitors Additional Package Ground Pins Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Both drive and receive sides feature the same logic, including a loopback path to hold data. The HOLD/LOAD function is controlled by Transmit Enable (TEN) and Receive Enable (REN) on the transmit and receive sides respectively, with a HIGH selecting LOAD. Note that the implementation of the E337 Receive Enable differs from that of the E336. A synchronous bus enable (SBUSEN) is provided for normal, non-scan operation. The asynchronous bus disable (ABUSDIS) disables the bus immediately for scan mode. The SYNCEN input is provided for flexibility when re-enabling the bus after disabling with ABUSDIS, allowing either synchronous or asynchronous re-enabling. An alternative use is asynchronous-only operation with ABUSDIS, in which case SYNCEN is tied LOW, or left open. SYNCEN is implemented as an overriding SET control (active-LOW) to the enable flip-flop. Scan mode is selected by a HIGH at the SCAN input. Scan input data is shifted in through S_IN and output data appears at the Q2 output. All registers are clocked on the positive transition of CLK. Additional lead-frame grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins are not electrically connected to the chip. PIN NAMES Pin A0 – A2 B0 – B2 S-IN TEN, REN SCAN ABUSDIS SBUSEN SYNCEN CLK BUS0 – BUS2 Q0 – Q2 Function Data Inputs A Data Inputs B Serial (Scan) Data Input HOLD/LOAD Controls Scan Control Asynchronous Bus Disable Synchronous Bus Enable Synchronous Enable Control Clock 25Ω Cutoff Bus Outputs Receive Data Outputs (Q2 serves as SCAN_OUT in scan mode) 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E337 MC100E337 Pinout: 28-Lead PLCC (Top View) SBUSEN SYNCEN B0 25 24 23 A0 ABUSDIS VCCO Q0 22 21 20 19 SCAN 26 18 GND S-IN 27 17 BUS0 TEN 28 16 VCC VEE 1 15 Q1 REN 2 14 VCCO CLK 3 13 BUS1 A1 4 12 GND 5 6 7 B1 A2 B2 8 9 10 VCCO BUS2 GND 11 Q2 * All VCC and VCCO pins are tied together on the die. LOGIC DIAGRAM BUS2 A2 B2 D Q D Q Q2/ SCAN_OUT BUS1 A1 B1 D Q D Q Q1 BUS0 A0 B0 S_IN TEN REN SCAN ABUSDIS SBUSEN SYNCEN CLK MOTOROLA D Q D Q Q0 D Q SET 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E337 MC100E337 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic VCUT Cut-off Output Voltage1 IIH Input HIGH Current All Other Inputs IEE min typ – 2.10 25°C max min – 2.03 – 2.10 typ 85°C max min – 2.03 – 2.10 typ max Unit – 2.03 V Condition µA 150 Power Supply Current 10E 100E 150 150 mA 145 145 174 174 145 145 174 174 145 167 174 200 1. measured with VTT = –2.10V AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol min tPLH tPHL Propagation Delay to Output Clk to Q Clk to BUS ABUSDIS SYNCEN 450 800 500 800 ts Setup Time BUS SBUSEN Data, S-IN TEN, REN, SCAN 350 100 400 550 350 100 400 550 350 100 400 550 Hold TIme BUS SBUSEN Data, S-IN TEN, REN, SCAN 350 500 350 200 350 500 350 200 350 500 350 200 Minimum Pulse Width CLk 400 400 400 Rise/Fall Times 20 - 80% (Qn) 20 - 80% (BUSn Rise) 20 - 80% (BUSn Fall) 300 500 300 tPW tr tf ECLinPS and ECLinPS Lite DL140 — Rev 4 max min 1000 1800 1500 1800 450 800 500 800 typ 85°C Characteristic th typ 25°C max min 1000 1800 1500 1800 450 800 500 800 typ max Unit Condition ps 1000 1800 1500 1800 ps ps ps ps 800 1000 800 300 500 300 2–3 800 1000 800 300 500 300 800 1000 800 MOTOROLA MC10E337 MC100E337 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E337 MC100E337 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ ECLinPS and ECLinPS Lite DL140 — Rev 4 2–5 *MC10E337/D* MC10E337/D MOTOROLA