Application Notes on EM55M450 V.S EM55200~EM55400 Document Number : Date of Issue : Issue Version : Supported Chips : Applicable Software : AP-EM55-0007C 24 October 2002 1.0 EM55200~ Em55400 1.0 Electrical Characteristics: Item Operating Voltage Operating current Operating current Reset voltage level R osc F osc I/P pull low impedance Output current of Vo (Current DAC) 55M450 2 6V 1.775 mA 2.522 mA 1.5V 100KΩ 1.2MHz 10.353uA (≅435KΩ) 3.934uA (≅763KΩ) 11.3uA (≅44KΩ) 6.328uA (≅79KΩ) 2.2V 1.4V 21.2mA 10.25mA 16.87mA 7.653mA 4.51mA 4.2 5.8mA 55200 55400 1.5 6.2 V 0.25 mA 1.50 mA 1.5V 100KΩ 1.2MHz 10uA (≅450 KΩ) 3.889uA (≅771KΩ) 11.5uA (≅43KΩ) 6.98uA (≅75KΩ) 2.5V 1.8V 18.35mA 7.7mA 17.2mA 7.4mA 5.4mA typ 4 6mA Output current of Vo1, Vo (Direct drive) 147.8mA typ 140 160mA 150 mA typ 146 156mA I/P pull low impedance I/P Trans Voltage ViH O/P Sink current O/P Drive current 1 of 5 memo Tradition D/A Push-pull @Vcc=3V @4.5Vcc,Vi=Vcc @3Vcc,Vi=Vcc @4.5Vcc,Vi=0.5V @3Vcc,Vi=0.5V @4.5Vcc @3Vcc @4.5Vcc,Vo=Vcc @3Vcc,Vo=Vcc @4.5Vcc,Vo=0V @3Vcc,Vo=0V @3Vcc Full-silence, Vo=0 @3Vcc Sink current of Vo,Vo1=1/2VCC 2.0 Pin Assignment: Item Pad number Must Bounding Pads Die diagram 55M450 27 Pads VDD、VPP、GND、VSS、OSC P1.0 P1.3、P3.0 P3.3 55200 55400 22 Pads Used pads Test pin Open (0,0) VDD 7 VO 8 27 VO 28 VSSC 29 VO1 30 CIN 31 13 OSCI 12 OSCO VSS 9 VO1 10 11 32 34 35 36 37 38 39 40 1 2 3 4 5 6 7 8 9 10 2920x3020 Substrate Vss 13 14 15 16 17 18 19 20 VSS 25 TEST 24 RESET 23 P1.0 22 P1.1 21 VDD P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 U 形排列 Die size 12 OSCI OSCO 11 VSSD P1.0 TEST/VPP P1.1 RESET P2.0 P2.1 P1.2 P1.3 P2.3 P2.2 P3.2 P3.0 P3.1 P4.2 P4.1 P3.3 P4.3 P4.0 VDD Pad location 33 28 27 26 (0,0) EM55M450 VCC meno U 形排列 55200= 55250= 55300= 55350= 55400= 1600x1700 1600x2000 1600x2000 1600x2500 1600x2500 Vss Pin’s sequence is same as um*um PCB layout notes: 1. 由於 EM55M450 的 Die size 較大, 因此應採用 EM55M450 的 Die size 為 layout 依據. 才能放的下 EM55400 2. 為執行燒錄動作, 因此 EM55M450 的 Vpp, 必須打線出來, 其他相關燒 錄 Pad 亦需打線出來以便燒錄. 3. 由於 EM55200~EM55400 沒有 Port4, 因此以 EM55M450 替代時, 應 考慮 Port4 的 Level 給予適當的 Pull Low or Pull High, 以避免 Tri-status 而增加 Standby 電流. 2 of 5 PCB layout examples: 1. Bounding Pad diagram : Vcc Vo Vssc Vo1 CIN OSCI OSCO Vss Vdd P4 3 P4 2 P4 1 P4 0 VPP/Test RST P1 0 P1 1 P1 2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 2. Bounding for EM55M450 : EM55M450 Vcc Vo Vssc Vo1 CIN OSCI OSCO Vss Vdd P4.3 P4.2 P4.1 P4.0 VPP/Test RSTP P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 3 of 5 3. Bounding for EM55200/EM55250/EM55300/EM55350/EM55400 : EM55400 EM55350 EM55300 EM55250 EM55200 Vcc Vo Vssc Vo1 CIN OSCI OSCO Vss Vdd P4.3 P4.2 P4.1 P4.0 Test RST P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 4 of 5 3.0 Program interface : MTP WRITER #1 D0 #2 D1 #3 D2 #4 D3 #5 D4 #6 D5 #7 D6 #8 D7 #9 VDD #10 OEB #11 VPP #12 ACLK #13 VNN #14 PGMB #15 GND #16 DCLK #17 RDY #18 R1 #19 R2 #20 R3 EM55M450 P2.0 P2.1 P2.2 P2.3 N.C N.C N.C N.C VDD P3.2 VPP P3.3 N.C P3.1 GND OSC P3.0 N.C N.C N.C *Vo,Vo1 P1.0 ~P1.3 P4.0~P4..3 These Pins must keep open at programming . NOTE The EM55M450 can Not connect to other component except MTP WRITER with any pins at programming! 5 of 5