CYPRESS CY7C401-25PC

1CY 7C40 2
CY7C401/CY7C403
CY7C402/CY7C404
64 x 4 Cascadable FIFO
64 x 5 Cascadable FIFO
Features
words. Both the CY7C403 and CY7C404 have an output enable (OE) function.
• 64 x 4 (CY7C401 and CY7C403)
64 x 5 (CY7C402 and CY7C404)
High-speed first-in first-out memory (FIFO)
• Processed with high-speed CMOS for optimum
speed/power
• 25-MHz data rates
• 50-ns bubble-through time—25 MHz
• Expandable in word width and/or length
• 5-volt power supply ± 10% tolerance, both commercial
and military
• Independent asynchronous inputs and outputs
• TTL-compatible interface
• Output enable function available on CY7C403 and
CY7C404
• Capable of withstanding greater than 2001V electrostatic discharge
• Pin compatible with MMI 67401A/67402A
The devices accept 4- or 5-bit words at the data input (DI0 –
DIn) under the control of the shift in (SI) input. The stored
words stack up at the output (DO0 – DOn) in the order they
were entered. A read command on the shift out (SO) input
causes the next to last word to move to the output and all data
shifts down once in the stack. The input ready (IR) signal acts
as a flag to indicate when the input is ready to accept new data
(HIGH), to indicate when the FIFO is full (LOW), and to provide
a signal for a cascading. The output ready (OR) signal is a flag
to indicate the output contains valid data (HIGH), to indicate
the FIFO is empty (LOW), and to provide a signal for cascading.
Parallel expansion for wider words is accomplished by logically ANDing the IR and OR signals to form composite signals.
Serial expansion is accomplished by tying the data inputs of
one device to the data outputs of the previous device. The IR
pin of the receiving device is connected to the SO pin of the
sending device, and the OR pin of the sending device is connected to the SI pin of the receiving device.
Functional Description
Reading and writing operations are completely asynchronous,
allowing the FIFO to be used as a buffer between two digital
machines of widely differing operating frequencies. The
25-MHz operation makes these FIFOs ideal for high-speed
communication and controller applications.
The CY7C401 and CY7C403 are asynchronous first-in
first-out (FIFOs) organized as 64 four-bit words. The CY7C402
and CY7C404 are similar FIFOs organized as 64 five-bit
Logic Block Diagram
Pin Configurations
DIP
SI
IR
INPUT
CONTROL
LOGIC
WRITE POINTER
OUTPUT
ENABLE
WRITE MULTIPLEXER
OE
DI 0
DI 1
DI 2
DATAIN
DIP
1
16
2
15
3
14
CY7C401
4
13
CY7C403
5
12
6
11
10
7
9
8
DO0
DO1
MEMORY
ARRAY
DI 3
(CY7C401) NC
(CY7C403) OE
IR
SI
DI 0
DI 1
DI 2
DI 3
GND
DATAIN
(DI 4)
VCC
SO
OR
DO 0
DO 1
DO 2
DO 3
MR
(CY7C402) NC
(CY7C404) OE
IR
SI
DI 0
DI 1
DI 2
DI 3
DI 4
GND
1
18
2
17
3
16
CY7C402
4
15
CY7C404
5
14
6
13
12
7
11
8
10
9
C401–2
DO2
DO3
VCC
SO
OR
DO 0
DO 1
DO 2
DO 3
DO 4
MR
C401–4
LCC
LCC
(DO 4)
MR
MASTER
RESET
READ MULTIPLEXER
OUTPUT
CONTROL
LOGIC
READ POINTER
SI
DI 0
DI 1
DI 2
NC
SO
OR
3 2 1 2019
4
18 NC
5
17 OR
CY7C401
6 CY7C403 16 DO
7
15 DO
8
14 DO
910111213
SI
0
1
2
DI
DI
DI
DI
0
1
2
3
3 2 1 2019
4
18 OR
5
17 DO 0
6 CY7C402 16 DO 1
CY7C404
7
15 DO 2
8
14 DO 3
910111213
C401–1
C401–3
C401–5
Selection Guide
Operating Frequency (MHz)
Maximum Operating
Current (mA)
Commercial
7C401/2–5
7C40X–10
7C40X–15
7C40X–25
5
10
15
25
75
75
75
75
90
90
90
Military
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134 •
408-943-2600
March 1986 – Revised April 1995
CY7C401/CY7C403
CY7C402/CY7C404
Maximum Ratings
Output Current, into Outputs (LOW)............................ 20 mA
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-Up Current ..................................................... >200 mA
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Operating Range
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
Range
Ambient
Temperature
VCC
DC Voltage Applied to Outputs
in High Z State ............................................... –0.5V to +7.0V
Commercial
0°C to +70°C
5V ±10%
DC Input Voltage............................................ –3.0V to +7.0V
Military
–55°C to +125°C
5V ±10%
[1]
Power Dissipation ..........................................................1.0W
Electrical Characteristics Over the Operating Range (Unless Otherwise Noted) [2]
7C40X–10, 15, 25
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIX
Input Leakage Current
VCD[3]
Input Diode Clamp Voltage[3]
IOZ
Min.
Max.
Unit
2.4
V
0.4
V
2.0
6.0
V
–3.0
0.8
V
GND ≤ VI ≤ VCC
–10
+10
µA
Output Leakage Current
GND ≤ VOUT ≤ VCC, VCC = 5.5V
Output Disabled (CY7C403 and CY7C404)
–50
+50
µA
IOS
Output Short Circuit Current[4]
VCC = Max., VOUT = GND
–90
mA
ICC
Power Supply Current
VCC = Max., IOUT = 0 mA
Commercial
75
mA
Military
90
mA
Capacitance[5]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 4.5V
Max.
Unit
5
pF
7
pF
Notes:
1. TA is the “instant on” case temperature.
2. See the last page of this specification for Group A subgroup testing information.
3. The CMOS process does not provide a clamp diode. However, the FIFO is insensitive to –3V dc input levels and –5V undershoot pulses of less than 10 ns
(measured at 50% output).
4. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds.
5. Tested initially and after any design or process changes that may affect these parameters.
2
CY7C401/CY7C403
CY7C402/CY7C404
AC Test Loads and Waveforms
R1 437Ω
5V
OUTPUT
OUTPUT
R2
272Ω
30 pF
ALL INPUT PULSES
R1 437Ω
5V
3.0V
R2
272Ω
5 pF
INCLUDING
JIG AND
SCOPE
GND
(b)
90%
10%
≤ 5 ns
INCLUDING
JIG AND
SCOPE
(a)
90%
10%
≤ 5 ns
C401–6
C401–7
Equivalent to: THÉVENIN EQUIVALENT
OUTPUT
167Ω
1.73V
C401–8
Switching Characteristics Over the Operating Range[2, 6]
Parameter
Description
7C401–5
7C402–5
Test
Conditions
Min.
Note 8
Max.
7C40X–10
7C40X–15
7C40X–25[7]
Min.
Min.
Min.
5
Max.
10
Max.
Unit
25
MHz
fO
Operating Frequency
tPHSI
SI HIGH Time
tPLSI
SO LOW Time
tSSI
Data Set-Up to SI
Note 9
tHSI
Data Hold from SI
Note 9
60
tDLIR
Delay, SI HIGH to IR LOW
tDHIR
Delay, SI LOW to IR HIGH
tPHSO
SO HIGH Time
20
tPLSO
SO LOW Time
45
tDLOR
Delay, SO HIGH to OR LOW
tDHOR
Delay, SO LOW to OR HIGH
tSOR
Data Set-Up to OR HIGH
0
tHSO
Data Hold from SO LOW
5
tBT
Bubble-Through Time
tSIR
Data Set-Up to IR
Note 10
5
5
5
5
ns
tHIR
Data Hold from IR
Note 10
30
30
30
20
ns
tPIR
Input Ready Pulse HIGH
20
20
20
15
ns
tPOR
Output Ready Pulse HIGH
20
20
20
15
ns
tPMR
MR Pulse Width
40
30
25
25
ns
tDSI
MR HIGH to SI HIGH
40
35
25
10
ns
tDOR
MR LOW to OR LOW
85
40
35
35
ns
tDIR
MR LOW to IR HIGH
85
40
35
35
ns
tLZMR
MR LOW to Output LOW
50
40
35
25
ns
tOOE
Output Valid from OE LOW
—
35
30
20
ns
tHZOE
Output High Z from OE HIGH
—
30
25
15
ns
20
20
20
11
ns
45
30
25
20
ns
0
0
0
0
ns
40
75
40
0
5
10
10
28/30
ns
ns
ns
19/21
ns
34/37
ns
0
5
95
ns
20
35
55
ns
21/22
11
25
40
0
200
40
20
25
80
20
35
45
20
75
Note 12
30
40
75
Note 11
15
Max.
ns
5
65
10
ns
50/60
ns
Notes:
6. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V and output loading of the specified IOL/IOH and 30-pF load
capacitance, as in part (a) of AC Test Loads and Waveforms.
7. Commercial/Military
8. I/fO > t PHSI + t DHIR, I/f O > tPHSO + t DHOR
9. tSSI and tHSI apply when memory is not full.
10. tSIR and t HIR apply when memory is full, SI is high and minimum bubble-through (tBT ) conditions exist.
11. All data outputs will be at LOW level after reset goes HIGH until data is entered into the FIFO.
12. HIGH-Z transitions are referenced to the steady-state VOH –500 mV and VOL +500 mV levels on the output. tHZOE is tested with 5-pF load capacitance as
in part (b) of AC Test Loads and Waveforms.
3
CY7C401/CY7C403
CY7C402/CY7C404
Operational Description
Application of the 7C403–25/7C404–25 at 25 MHz
Application of the CY7C403 or CY7C404 Cypress CMOS
FIFOs requires knowledge of characteristics that are not easily
specified in a datasheet, but which are necessary for reliable
operation under all conditions, so we will specify them here.
Concept
Unlike traditional FIFOs, these devices are designed using a
dual-port memory, read and write pointer, and control logic.
The read and write pointers are incremented by the SO and SI
respectively. The availability of an empty space to shift in data
is indicated by the IR signal, while the presence of data at the
output is indicated by the OR signal. The conventional concept
of bubble-through is absent. Instead, the delay for input data
to appear at the output is the time required to move a pointer
and propagate an OR signal. The output enable (OE) signal
provides the capability to OR tie multiple FIFOs together on
a common bus.
When an empty FIFO is filled with initial information at maximum “shift in” SI frequency, followed by immediate shifting out
of the data also at maximum “shift out” SO frequency, the designer must be aware of a window of time which follows the
initial rising edge of the OR signal, during which time the SO
signal is not recognized. This condition exists only at
high-speed operation where more than one SO may be generated inside the prohibited window. This condition does not
inhibit the operation of the FIFO at full-frequency operation,
but rather delays the full 25-MHz operation until after the window has passed.
Resetting the FIFO
Upon power-up, the FIFO must be reset with a master reset
(MR) signal. This causes the FIFO to enter an empty condition
signified by the OR signal being LOW at the same time the IR
signal is HIGH. In this condition, the data outputs (DO0 – DO n)
will be in a LOW state.
There are several implementation techniques for managing
the window so that all SO signals are recognized:
1. The first involves delaying SO operation such that it does
not occur in the critical window. This can be accomplished
by causing a fixed delay of 40 ns “initiated by the SI signal
only when the FIFO is empty” to inhibit or gate the SO activity. However, this requires that the SO operation be at
least temporarily synchronized with the input SI operation.
In synchronous applications this may well be possible and
a valid solution.
Shifting Data In
Data is shifted in on the rising edge of the SI signal. This loads
input data into the first word location of the FIFO. On the falling
edge of the SI signal, the write pointer is moved to the next
word position and the IR signal goes HIGH, indicating the
readiness to accept new data. If the FIFO is full, the IR will
remain LOW until a word of data is shifted out.
2. Another solution not uncommon in synchronous applications is to only begin shifting data out of the FIFO when it is
more than half full. This is a common method of FIFO application, as earlier FIFOs could not be operated at maximum frequency when near full or empty. Although Cypress
FIFOs do not have this limitation, any system designed in
this manner will not encounter the window condition described above.
Shifting Data Out
Data is shifted out of the FIFO on the falling edge of the SO
signal. This causes the internal read pointer to be advanced to
the next word location. If data is present, valid data will appear
on the outputs and the OR signal will go HIGH. If data is not
present, the OR signal will stay LOW indicating the FIFO is
empty. Upon the rising edge of SO, the OR signal goes LOW.
The data outputs of the FIFO should be sampled with
edge-sensitive type D flip-flops (or equivalent), using the SO
signal as the clock input to the flip-flop.
3. The window may also be managed by not allowing the first
SO signal to occur until the window in question has passed.
This can be accomplished by delaying the SO 40 ns from
the rising edge of the initial OR signal. This however involves the requirement that this only occurs on the first occurrence of data being loaded into the FIFO from an empty
condition and therefore requires the knowledge of IR and
SI conditions as well as SO.
Bubble-Through
Two bubble-through conditions exist. The first is when the device is empty. After a word is shifted into an empty device, the
data propagates to the output. After a delay, the OR flag goes
HIGH, indicating valid data at the output.
4. Handshaking with the OR signal is a third method of avoiding the window in question. With this technique the rising
edge of SO, or the fact that SO signal is HIGH, will cause
the OR signal to go LOW. The SO signal is not taken LOW
again, advancing the internal pointer to the next data, until
the OR signal goes LOW. This ensures that the SO pulse
that is initiated in the window will be automatically extended
long enough to be recognized.
The second bubble-through condition occurs when the device
is full. Shifting data out creates an empty location that propagates to the input. After a delay, the IR flag goes HIGH. If the
SI signal is HIGH at this time, data on the input will be shifted
in.
5. There remains the decision as to what signal will be used
to latch the data from the output of the FIFO into the receiving source. The leading edge of the SO signal is most appropriate because data is guaranteed to be stable prior to
and after the SO leading edge for each FIFO. This is a
solution for any number of FIFOs in parallel.
Possible Minimum Pulse Width Violation at the Boundary
Conditions
If the handshaking signals IR and OR are not properly used to
generate the SI and SO signals, it is possible to violate the
minimum (effective) SI and SO positive pulse widths at the full
and empty boundaries.
Any of the above solutions will ensure the correct operation of
a Cypress FIFO at 25 MHz. The specific implementation is left
to the designer and is dependent on the specific application
needs.
When this violation occurs, the operation of the FIFO is unpredictable. It must then be reset, and all data is lost.
4
CY7C401/CY7C403
CY7C402/CY7C404
Switching Waveforms
Data In Timing Diagram
I/fO
I/fO
SHIFT IN
tPHSI
tPLSI
tDHIR
INPUT READY
tHSI
tDLIR
DATA IN
tSSI
C401–9
Data Out Timing Diagram
I/fO
I/fO
SHIFT OUT
tPHSO
tPLSO
tDHOR
OUTPUT READY
tDLOR
tHSO
tSOR
DATA OUT
C401–10
Bubble Through, Data Out To Data In Diagram
SHIFT OUT
SHIFT IN
tBT
INPUT READY
tPIR
DATA IN
tSIR
tHIR
C401–11
5
CY7C401/CY7C403
CY7C402/CY7C404
Switching Waveforms (continued)
Bubble Through, Data In To Data Out Diagram
SHIFT IN
SHIFT OUT
tBT
tPOR
OUTPUT READY
tSOR
DATA OUT
C401–12
Master Reset Timing Diagram
tPMR
MASTER RESET
tDIR
INPUT READY
tDOR
OUTPUT READY
tDSI
SHIFT IN
tLZMR
DATA OUT
C401–13
Output Enable Timing Diagram
OUTPUT ENABLE
tHZOE
tOOE
DATA OUT
NOTE 10
C401–14
6
CY7C401/CY7C403
CY7C402/CY7C404
Typical DC and AC Characteristics
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
1.2
1.4
1.0
1.2
60
50
40
0.8
1.0
0.6
4.5
5.0
20
0.8
VIN =5.0V
TA =25°C
0.4
4.0
30
5.5
6.0
VCC =5.5V
VIN =5.0V
0.0
–55
25
0
0.0
125
1.0
AMBIENTTEMPERATURE (°C)
SUPPLY VOLTAGE (V)
1.3
1.6
1.2
1.4
2.0
3.0
4.0
OUTPUT VOLTAGE (V)
OUTPUT SINK CURRENT
vs. OUTPUT VOLTAGE
NORMALIZED FREQUENCY
vs. AMBIENT TEMPERATURE
NORMALIZED FREQUENCY
vs. SUPPLY VOLTAGE
140
120
100
1.1
1.2
80
1.0
60
1.0
0.9
40
0.8
0.8
0.7
4.0
VCC =5.0V
TA =25°C
10
4.5
5.0
5.5
6.0
VCC =5.0V
TA =25°C
20
0.6
–55
25
0
0.0
125
1.0
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
TYPICAL FREQUENCY CHANGE
vs. OUTPUT LOADING
2.0
3.0
4.0
OUTPUT VOLTAGE (V)
NORMALIZED I CC
vs. FREQUENCY
1.6
1.1
1.5
1.0
1.4
0.9
1.3
0.8
1.2
0.7
1.1
1.0
0.0
0
200
400
600
0
800 1000
5
10
15
20
25
30
35
C401–15
FREQUENCY (MHz)
CAPACITANCE (pF)
7
CY7C401/CY7C403
CY7C402/CY7C404
FIFO Expansion[13, 14, 15, 16, 17]
128 x 4 Application[18]
SHIFT IN
INPUT READY
DATA IN
SI
IR
OR
SO
DO0
DI0
DO0
DO1
DI1
DO1
DO2
DI2
DO2
DO3
DI3
SI
IR
OR
SO
DI0
DI1
DI2
DI3
MR
MR
MR
OUTPUT READY
SHIFT OUT
DATA OUT
DO3
C401–16
192 x 12 Application[19]
SHIFT OUT
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
IR
SI
DI0
DI1
DI2
DI3 MR
SO
OR
DO0
DO1
DO2
DO3
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
COMPOSITE
INPUT READY
SHIFT IN
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
IR
SI
DI0
DI1
DI2
DI3 MR
SO
OR
DO0
DO1
DO2
DO3
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
IR
SI
DI0
DI1
DI2
DI3 MR
SO
OR
DO0
DO1
DO2
DO3
IR
SO
SI
OR
DI0
DO0
DI1
DO1
DO2
DI2
DI3 MR DO3
COMPOSITE
OUTPUT READY
MR
C401–17
Notes:
13. When the memory is empty, the last word read will remain on the outputs until the master reset is strobed or a new data word bubbles through to the output.
However, OR will remain LOW, indicating data at the output is not valid.
14. When the output data changes as a result of a pulse on SO, the OR signal always goes LOW before there is any change in output data, and stays LOW
until the new data has appeared on the outputs. Anytime OR is HIGH, there is valid, stable data on the outputs.
15. If SO is held HIGH while the memory is empty and a word is written into the input, that word will ripple through the memory to the output. OR will go HIGH
for one internal cycle (at least tORL ) and then go back LOW again. The stored word will remain on the outputs. If more words are written into the FIFO,
they will line up behind the first word and will not appear on the outputs until SO has been brought LOW.
16. When the master reset is brought LOW, the outputs are cleared to LOW, IR goes HIGH and OR goes LOW. If SI is HIGH when the master reset goes HIGH,
then the data on the inputs will be written into the memory and IR will return to the LOW state until SI is brought LOW. If SI is LOW when the master reset
is ended, then IR will go HIGH, but the data on the inputs will not enter the memory until SI goes HIGH.
17. All Cypress FIFOs will cascade with other Cypress FIFOs. However, hey may not cascade with pin-compatible FIFOs from other manufacturers.
18. FIFOs can be easily cascaded to any desired depth. The handshaking and associated timing between the FIFOs are handled by the inherent timing of the
devices.
19. FIFOs are expandable in depth and width. However, in forming wider words two external gates are required to generate composite input and output ready
flags. This need is due to the variation of delays of the FIFOs.
8
CY7C401/CY7C403
CY7C402/CY7C404
Ordering Information
Speed
(MHz)
Ordering Code
Package
Name
Package Type
Operating
Range
5
CY7C401–5PC
P1
16-Lead (300-Mil) Molded DIP
Commercial
10
CY7C401–10DC
D2
16-Lead (300-Mil) CerDIP
Commercial
CY7C401–10PC
P1
16-Lead (300-Mil) Molded DIP
CY7C401–10DMB
D2
16-Lead (300-Mil) CerDIP
CY7C401–10LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C401–15DC
D2
16-Lead (300-Mil) CerDIP
CY7C401–15PC
P1
16-Lead (300-Mil) Molded DIP
CY7C401–15DMB
D2
16-Lead (300-Mil) CerDIP
CY7C401–15LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C401–25DC
D2
16-Lead (300-Mil) CerDIP
CY7C401–25PC
P1
16-Lead (300-Mil) Molded DIP
CY7C401–25DMB
D2
16-Lead (300-Mil) CerDIP
CY7C401–25LMB
L61
20-Pin Square Leadless Chip Carrier
15
25
Speed
(MHz)
Ordering Code
Package
Name
Package Type
Military
Commercial
Military
Commercial
Military
Operating
Range
5
CY7C402–5PC
P3
18-Lead (300-Mil) Molded DIP
Commercial
10
CY7C402–10DC
D4
18-Lead (300-Mil) CerDIP
Commercial
CY7C402–10PC
P3
20-Pin Square Leadless Chip Carrier
CY7C402–10DMB
D4
18-Lead (300-Mil) CerDIP
CY7C402–10LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C402–15DC
D4
18-Lead (300-Mil) CerDIP
CY7C402–15PC
P3
18-Lead (300-Mil) Molded DIP
CY7C402–15DMB
D4
18-Lead (300-Mil) CerDIP
CY7C402–15LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C402–25DC
D4
18-Lead (300-Mil) CerDIP
CY7C402–25PC
P3
18-Lead (300-Mil) Molded DIP
CY7C402–25DMB
D4
18-Lead (300-Mil) CerDIP
CY7C402–25LMB
L61
20-Pin Square Leadless Chip Carrier
15
25
9
Military
Commercial
Military
Commercial
Military
CY7C401/CY7C403
CY7C402/CY7C404
Ordering Information (continued)
Speed
(MHz)
10
15
25
Speed
(MHz)
10
15
25
Ordering Code
Package
Name
Package Type
CY7C403–10DC
D2
16-Lead (300-Mil) CerDIP
CY7C403–10PC
P1
16-Lead (300-Mil) Molded DIP
CY7C403–10DMB
D2
16-Lead (300-Mil) CerDIP
CY7C403–10LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C403–15DC
D2
16-Lead (300-Mil) CerDIP
CY7C403–15PC
P1
16-Lead (300-Mil) Molded DIP
CY7C403–15DMB
D2
16-Lead (300-Mil) CerDIP
CY7C403–15LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C403–25DC
D2
16-Lead (300-Mil) CerDIP
CY7C403–25PC
P1
16-Lead (300-Mil) Molded DIP
CY7C403–25DMB
D2
16-Lead (300-Mil) CerDIP
CY7C403–25LMB
L61
20-Pin Square Leadless Chip Carrier
Ordering Code
Package
Name
Package Type
CY7C404–10DC
D4
18-Lead (300-Mil) CerDIP
CY7C404–10PC
P3
18-Lead (300-Mil) Molded DIP
CY7C404–10DMB
D4
18-Lead (300-Mil) CerDIP
CY7C404–10LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C404–15DC
D4
18-Lead (300-Mil) CerDIP
CY7C404–15PC
P3
18-Lead (300-Mil) Molded DIP
CY7C404–15DMB
D4
18-Lead (300-Mil) CerDIP
CY7C404–15LMB
L61
20-Pin Square Leadless Chip Carrier
CY7C404–25DC
D4
18-Lead (300-Mil) CerDIP
CY7C404–25PC
P3
18-Lead (300-Mil) Molded DIP
CY7C404–25DMB
D4
18-Lead (300-Mil) CerDIP
CY7C404–25LMB
L61
20-Pin Square Leadless Chip Carrier
10
Operating
Range
Commercial
Military
Commercial
Military
Commercial
Military
Operating
Range
Commercial
Military
Commercial
Military
Commercial
Military
CY7C401/CY7C403
CY7C402/CY7C404
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameters
Switching Characteristics
Subgroups
Parameters
Subgroups
VOH
1, 2, 3
fO
7, 8, 9, 10, 11
VOL
1, 2, 3
tPHSI
7, 8, 9, 10, 11
VIH
1, 2, 3
tPLSI
7, 8, 9, 10, 11
VIL Max.
1, 2, 3
tSSI
7, 8, 9, 10, 11
IIX
1, 2, 3
tHSI
7, 8, 9, 10, 11
IOZ
1, 2, 3
tDLIR
7, 8, 9, 10, 11
IOS
1, 2, 3
tDHIR
7, 8, 9, 10, 11
ICC
1, 2, 3
tPHSO
7, 8, 9, 10, 11
tPLSO
7, 8, 9, 10, 11
tDLOR
7, 8, 9, 10, 11
tDHOR
7, 8, 9, 10, 11
tSOR
7, 8, 9, 10, 11
tHSO
7, 8, 9, 10, 11
tBT
7, 8, 9, 10, 11
tSIR
7, 8, 9, 10, 11
tHIR
7, 8, 9, 10, 11
tPIR
7, 8, 9, 10, 11
tPOR
7, 8, 9, 10, 11
tPMR
7, 8, 9, 10, 11
tDSI
7, 8, 9, 10, 11
tDOR
7, 8, 9, 10, 11
tDIR
7, 8, 9, 10, 11
tLZMR
7, 8, 9, 10, 11
tOOE
7, 8, 9, 10, 11
tHZOE
7, 8, 9, 10, 11
Document #: 38–00040–H
11
CY7C401/CY7C403
CY7C402/CY7C404
Package Diagrams
16-Lead (300-Mil) CerDIP D2
MIL-STD-1835
18-Lead (300-Mil) CerDIP D4
D- 2 Config.A
MIL-STD-1835
20-Pin Square Leadless Chip Carrier L61
MIL-STD-1835 C–2A
12
D-8 Config.A
CY7C401/CY7C403
CY7C402/CY7C404
Package Diagrams (continued)
16-Lead (300-Mil) Molded DIP P1
18-Lead (300-Mil) Molded DIP P3
© Cypress Semiconductor Corporation, 1995. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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