DIODES SBR3M30P1-7

SBR3M30P1
3.0A SBR®
Surface Mount Super Barrier Rectifier
PowerDI™123
Features
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Mechanical Data
Ultra Low Leakage Current
Excellent High Temperature Stability
Superior Reverse Avalanche Capability
Patented Interlocking Clip Design for
High Surge Current Capacity
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
175ºC Operating Junction Temperature
±16KV ESD Protection (HBM, 3B)
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Qualified to AEC-Q 101 Standards for High Reliability
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Case: PowerDI™123
Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity Indicator: Cathode Band
Terminals: Matte Tin Finish annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Maximum Ratings @ TA = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Non-Repetitive Avalanche Energy
(TJ = 25°C, IAS = 5A, L = 8.5 mH)
Repetitive Peak Avalanche Energy
(1µs, 25°C)
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range
Notes:
Symbol
VRRM
VRWM
VRM
VR(RMS)
IO
Value
Unit
30
V
21
3.0
V
A
IFSM
75
A
EAS
105
mJ
PARM
1100
W
RӨJS
RӨJA
5
183
125
-65 to +175
TJ, TSTG
°C/W
ºC
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
__________
SBR is a registered trademark of Diodes Incorporated.
PowerDI is a trademark of Diodes Incorporated.
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© Diodes Incorporated
.
SBR3M30P1
Electrical Characteristics @ TA = 25ºC unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note
5)
Forward Voltage Drop
Leakage Current (Note 5)
Notes:
Symbol
Min
Typ
Max
Unit
V(BR)R
30
-
-
V
IR = 250 µA
VF
-
0.26
0.37
0.46
0.16
0.29
0.42
0.30
0.41
0.50
0.19
0.32
0.45
V
IF = 0.1A, TJ = 25ºC
IF = 1.0A,TJ = 25ºC
IF = 3.0A,TJ = 25ºC
IF = 0.1A, TJ = 125ºC
IF = 1.0A,TJ = 125ºC
IF = 3.0A,TJ = 125ºC
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8.5
19
1.7
3.1
100
200
15
20
µA
µA
mA
mA
VR = 5V, TJ = 25 ºC
VR = 30V, TJ = 25 ºC
VR = 5V, TJ = 125 ºC
VR = 30V, TJ = 125 ºC
IR
Test Condition
5. Short duration pulse test used to minimize self-heating effect.
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SBR3M30P1
Package Outline Drawings
PowerDI™123
PowerDI™123
Dim
Min
Max
Typ
A
3.65
3.75
3.70
B
2.775 2.825
2.80
C
1.750 1.800 1.775
D
0.955 1.000
0.98
E
0.95
1.05
1.00
H
0.15
0.25
0.20
L
0.60
0.70
0.65
L1
—
—
1.36
L2
—
—
1.10
L3
—
—
0.20
L4
0.95
1.25
1.05
All Dimensions in mm
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© Diodes Incorporated
SBR3M30P1
Marking, Polarity, Weight & Ordering Information
SBR3M30P1
Case Style
Marking
Weight
3M3
0.096g (approx.)
Back View
Top View
Ordering Information
Date Code
SBR3M30P1-7
3000/Tape & Reel
3M3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
Date Code Key
2006
Year
T
Code
2007
U
2008
V
2009
W
2010
X
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Code
1
2
3
4
5
6
7
Aug
8
2011
Y
Sep
9
Oct
O
2012
Z
Nov
N
Dec
D
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
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January 2007
© Diodes Incorporated