STMICROELECTRONICS VS6555

VS6555
Ultra small reflowable VGA camera module
Data Brief
Features
■
VGA resolution sensor (640 x 480)
■
Electrical and logical interface fully SMIA
compliant
■
Video data interface - CCP2.0
■
Command interface - CCI
■
2.8 V/1.8 V operation
■
On-board 10-bit ADC
■
Small physical size (2.5mm height)
■
Integral EMC shielding
■
Ultra low power standby mode
■
On-chip PLL
■
Lead free reflowable module
As different phone platforms have different
baseband processors with varying capabilities, it
may not be possible for all phones to support the
associated image processing algorithms. Where
the baseband cannot support this processing
load, a separate hardware accelerator (STV0984
or STV0986) device can be incorporated in the
phone system to run the algorithms in hardware.
The STV0984 and STV0986 processors can
support 2 cameras.
Applications
■
Mobile phone
■
PDA
■
Videophone
The module design is optimized to provide an ultra
small footprint and height, and is designed to be
reflowable at lead-free solder profiles. The product
is lead free.
Description
The VS6555 is an ultra small reflowable VGA
camera module for use across a range of mobile
phone handsets and accessories. It is primarily
designed to be used as a secondary camera for
video conferencing applications, but could equally
be used as a primary camera. The camera silicon
device is SMIA class 0 profile 0 compliant and is
capable of generating raw bayer VGA images up
to 30 fps. The VS6555 supports the CCI control
and CCP2.0 data interfaces
January 2007
The lens design is optimized for video
conferencing and maintains its performance even
after the high temperatures of lead-free reflow.
VS6555 offers an ultra low power consumption
hardware standby mode consuming less than
30 µW.
Rev 1
For further information contact your local STMicroelectronics sales office.
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VS6555
I2C
CCP2.0
or
ITU
CCP2.0
CLK
PDN
VS6555
VGA
Camera
module
CCI
CCP2.0
Table 1.
Baseband
or
Application
Processor
VS6555
EXTCLK
XSHUTDOWN
SCL
SDA
Baseband
or
Application
Processor
CLKP
CLKN
DATAP
DATAN
SMIA
receiver
PLL and Clock Management
Power Mgmt
SMIA
profile 0
frame
formatter
VGA
Pixel array
1152 x 864
Column ADC
X Decoder
Line SRAM
Technical specifications
Parameter
2/7
Sensor
Control
Registers
Power-On Reset
Y Decoder
CLK
PDN
Block diagram
Readout
STV0984
CLK or
PDN STV0986
processor
CCI
VS6555
VGA
Camera
module
Figure 2.
CCI
Receiver
Application diagram
CCP2.0
Transmitter
Figure 1.
Values
Pixel array
VGA (640 x 480)
Sensor technology
0.13 µm HCMOS9i
Pixel size
2.2 µm x 2.2 µm
Exposure control
+8 dB
Analogue gain
+24 dB (max)
Dynamic range
61 dB
Signal to noise
34 dB (@ 100 lux)
Minimum illumination
< 7lux
Supply voltage
Analogue: 2.4V to 2.9V
Digital: 1.8V ± 0.1V
Average power consumption @ 30fps
<60 mW
Module size (XYZ) max
4.5 mm x 4.5 mm x 2.5 mm
Lens HFOV (typical)
66°
Lens DFOV (typical)
78°
F number
3.2
Lens SFR
On axis 45% (typ)
Horizontal field (70%) 25% (typical)
Lens TV distortion
< |1%|
Relative illumination
> 45% (typ)
System connectivity
Lead free reflowable BGA
Storage temperature
[-40; +85]°C
Functional operating temperature
[-30; +70]°C
Normal operating temperature
[-25; +55]°C
Optimal operating temperature
[+5; +30]°C
VDIG
DGND
VANA
AGND
E
CO
1
MP
Y
AN
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
Tolerances, unless otherwise stated
E
3.9
Y
05
+0. 2
.0
0
9-
PLATING SPECIFICATION
1 micron Cu +0.1 micron st.st.
2
3
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
All dimensions in mm
Finish
4
Z HEIGHT
2.50±0.10
E
AL
I
NT
SEE TABLE
N/A
5
0.10
SEE NOTE 3
M
CO
Z
(AFTER RE-FLOW)
D
FI
N
CO
PIN 1
IDENTIFICATION
Interpret drawing per BS8888, 3RD Angle Projection Material
I
NF
3
AN
P
OM
LC
A
TI
N
DE
SECTION E-E
PART CODE SENSOR RESOLUTION
VS6555R0H9
VGA 640X 480
CO
F
E
D
C
B
1.96
SEE NOTE 2
4.50 ±0.10
2
6
6
7
8
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Part No.
Scale
20 : 1
7
8
Title 555 CAMERA MODULE Sheet
1 OF 3
OUTLINE DRAWING
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
Do Not Scale
06/12/2006
All dimensions
in mm
A6
19 APR 06
Date
Drawn
22/11/2006
ON SHT 3 IN TOP L.H.VIEW EXTERNAL SHIELD
CONNECTIONS WERE IN 8 OR 16 POSITIONS.
2.0 DIMENSION WAS 1.95;1.0 WAS 0.98
A5
07/11/2006
03/11/2006
SHT 2 IN TABLE VALUE 'D' WAS 0.94.VALUE 'E'
WAS 0.75.VALUE 'F' WAS 0.56.
A4
SHT 1 REMARK AT GRID REF A2:-'MOUNT AND
SUBSTRATE'FROM DIMENSION.
SHT 3 AT GRID REF E6:-'LAND
PATTERN..'DELETED
ON SHT 3. IN TABLE .PIN OUT REF 18 WAS 'NC'
25/10/2006
ON SHT1 VALUE ADDED TO CLASS 'A'
DIAMETER.ON SHT 2 ALL VALUES REVISED IN
CONE VIEWING CONE TABLE.ON SHT 3
EMC CONNECTIONS REVIEWED.ON ALL SHTS
'SUBJECT TO APPROVAL REMOVED.
A3
21 S E P T 06
U P D A TE D E X TE N S IV E L Y
A2
DATE
18/04/2006
A1
DESCRIPTION
First Release for Comment
A
REV.
REVISIONS
Notes:
1. Mass of module 0.09 Grammes.
2. Class A surface inside this diameter.
3. Flatness of BGA.
F
E
D
C
B
A
Figure 3.
A
1
VS6555
Module outline drawing (1/3)
3/7
4/7
F
E
D
C
B
A
CONE DIA
AT 'A'
1
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
VERTICAL
FOV AT 'A'
F
0.77mm
2
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
All dimensions in mm
3
4
PYRAMID
SEE TABLE DIM 'B'
HORIZONTAL
FOV AT 'A'
E
1.02mm
3
Finish
Interpret drawing per BS8888, 3RD Angle Projection Material
D
C
1.28mm
'F' AT DATUM 'A'
VERTICAL
FULL
ANGLE
56.6
Tolerances, unless otherwise stated
CONE FULL HORIZONTAL
FULL ANGLE
ANGLE
71.6
84.4
2
'E' AT DATUM 'A'
DIA 'D'
MEASURED
AT DATUM 'A'
5
6
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Part No.
19 APR 06
Date
Drawn
PYRAMID
SEE TABLE DIM'C'
CONE
SEE TABLE DIM 'A'
TOP OF
SCENE
6
A
8
Do Not Scale
A
7
8
Title 555 CAMERA MODULE Sheet
2 OF 3
OUTLINE DRAWING
Scale
10 : 1
REV
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
All dimensions
in mm
7
F
E
D
C
B
A
Figure 4.
B
A
1
VS6555
Module outline drawing (2/3)
F
E
D
C
B
A
1.95
1.00
DATAP
VDIG
NC
GND
PIN 8
PIN 9
PIN 10
PIN 11
PIN 12
1
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
Tolerances, unless otherwise stated
GND
VANA
PIN 7
CLKN
EMC GND
PIN 6
CLKP
PIN 4
PIN 5
GND
DATAN
PIN 2
PIN 3
EMC GND
PIN 1
EMC GND
PIN 24
2
3
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
All dimensions in mm
Finish
4
0.80
0.40
19
1
1.075
6
7981529
Part No.
19 APR 06
Date
Drawn
1.475
Do Not Scale
7
8
Title 555 CAMERA MODULE Sheet
3 OF 3
OUTLINE DRAWING
Scale
15 : 1
A
8
REV
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
All dimensions
in mm
REFERENCE PWB PAD LAYOUT
VIEWED FROM ABOVE PWB.
0.50 TYP.
0.15 TYP.
24
6
1.375
0.55 TYP.
3.60
4.90
7
3.60
6
TOP OF
SCENE
PIN 1
MARKER
0.25
IN 24 POSITIONS
5
4.90
3
Interpret drawing per BS8888, 3RD Angle Projection Material
DGND
EXTCLK
GND
VCAP
EMC GND
CAP1V2
NC
SDA
SCL
XSHUTDOWN
PIN 23
PIN 22
PIN 21
PIN 20
PIN 19
PIN 18
PIN 17
PIN 16
PIN 15
PIN 14
PIN 13
AGND
0.45 TYP.
0.90 TYP.
CONNECTION TABLE
VIEW ON REAR
OF MODULE
PIN OUT
1.00
1.95
2.00
2.00
PIN 1
3.90
EXTERNAL EMC SHIELD
CONNECTIONS
IN 16 OR 24 POSITIONS
T.B.D.
0.40
2
0.80
1.20 TYP.
3.90
0.975
F
E
D
C
B
A
Figure 5.
0.65 TYP.
1
VS6555
Module outline drawing (3/3)
5/7
Ordering information
VS6555
Ordering information
Table 2.
Order codes
Part number
VS6555R0H9/TR
Package
Packing
Lead-free reflowable module. Tape and Reel
Revision history
Table 3.
6/7
Document revision history
Date
Revision
18-Jan-2007
1
Changes
Initial release.
VS6555
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