VS6451 Ultra small reflowable CIF+ camera module Data Brief ■ CIF+ resolution sensor (384x320 or 320x384) ■ Electrical and logical interface fully SMIA compliant ■ Video data interface - CCP2.0 ■ Command interface - CCI ■ 2.8 V/1.8 V operation ■ On-board 10-bit ADC ■ Small physical size ■ Integral EMC shielding ■ Ultra low power standby mode ■ On-chip PLL ■ Lead free reflowable module Z Height - See table 1 Features OMB C L A I NT E D FI Y N O C AN P M The module design is optimized to provide an ultra small footprint and height, and is designed to be reflowable at lead-free solder profiles. The product is lead free. The lens design is optimized for video conferencing and maintains its performance even after the high temperatures of lead-free reflow. Description This VS6451 is an ultra small reflowable CIF+ camera module for use across a range of mobile phone handsets and accessories. It is primarily designed to be used as a second camera in video conferencing applications, but it may also be used as a primary camera. The camera sensor is SMIA class 2 profile 0 compliant and is capable of generating raw bayer CIF+ images up to 30 fps. The VS6451 supports the CCI control and CCP2.0 data interfaces. VS6451 offers an ultra low power consumption hardware standby mode consuming less than 30 µW. Applications As different phone platforms have different baseband processors with varying capabilities, it may not be possible for all phones to support the associated image processing algorithms. Where the baseband cannot support this processing load, a separate hardware accelerator (STV0976 or STV0984) device can be incorporated in the phone system to run the algorithms in hardware. ■ Mobile phone ■ PDA ■ Videophone Order code Part number VS6451R0BA/T2 Package Lead-free reflowable module The STV0984 processor can support 2 cameras. The specifications of these devices are contained in a separate document. April 2006 Rev 1 For further information contact your local STMicroelectronics sales office. 1/5 www.st.com 5 VS6451 I2C Baseband or Application Processor CCP2.0 or ITU CCP2.0 CLK PDN VS6451 CIF+ Mobile Camera Module Table 1. CLK PDN CCI CCP2.0 VS6451 EXTCLK XSHUTDOWN SCL SDA Baseband or Application Processor CLKP CLKN DATAP DATAN SMIA Rx’er PLL and Clock Management Power Mgmt SMIA profile 0 frame formatter CIF+ Pixel array 1152 x 864 Column ADC X Decoder Line SRAM Technical specifications Parameter 2/5 Sensor Control Registers Power-On Reset Y Decoder STV0984 CLK or PDN STV0976 Processor CCI Block diagram Readout VS6451 CIF+ Mobile Camera Module Figure 2. CCI Receiver Application diagram CCP2.0 Transmitter Figure 1. Values Pixel array CIF+ portrait and landscape Sensor technology 0.18 µm HCMOS8i shrink Pixel size 3.6µm x 3.6µm Exposure control +8 dB Analogue gain +24 dB (max) Dynamic range 61 dB Signal to noise 34 dB (@ 100 lux) Minimum illumination < 7lux Supply voltage Analogue: 2.4V to 2.9V Digital: 1.8V ± 0.1V Average power consumption @ 30fps <60 mW Module size (XYZ) max 4.5 mm x 4.5 mm x 3.6 mm Lens HFOV 45°+/- 2° (CIF+, CIF equiv. 45°) F number 2.8 Lens SFR On axis 45% (typ) Horizontal field (70%) 25% (typical) Lens TV distortion <|5%| Relative illumination 60% (typ) System connectivity Lead free reflowable BGA Storage temperature [-40; +85]°C Functional operating temperature [-30; +70]°C Normal operating temperature [-25; +55]°C Optimal operating temperature [+5; +30]°C VDIG DGND VANA AGND VS6451 Figure 3. Mechanical data 3.12 ±0.10 4.50 0.10 2.00, note 2 3° 4.50 0.10 OMB C L C Z Height - See table 1 B A I NT E D FI Y N O C N PA M A O LC PART CODE SENSOR RESOLUTION VS6451ROBA DE FI N O CIF+ (384 X 320) I NT TABLE 1 PLATING SPECIFICATION 2.54 - 5.08 microns tin over Nickel strike (shield can) Z HEIGHT 3.60 +/-0.10 after soldering (0.10 paste thickness) 3/5 Revision history VS6451 Revision history Table 2. 4/5 Document revision history Date Revision 26-Apr-2006 1 Changes Initial release. VS6451 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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