Microwave Ceramics and Modules 3-Pole Filter for SIRIUS Filter B69813N2327A414 Data Sheet Features z SMD filter consisting of coupled resonators with stepped impedances z (NdBa)TiO3 (εr = 88 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm) z Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 • Component drawing • Recommended footprint Page 3 • Characteristics • Maximum ratings • Typical passband characteristic Page 4 • Processing information • Soldering requirements • Delivery mode ISSUE DATE 12.03.04 ISSUE B PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 3-Pole Filter for SIRIUS Filter B69813N2327A414 Data Sheet Component drawing View from below onto the solder terminals and view from beside Recommended footprint 2.4 1.5 1 I/O G I/O 1.35 0.9 0.45 4.1 1.45 1 1 G G G 1.7 0.3 0.3 1.2 1.4 0.5 4.8 ISSUE DATE 12.03.04 ISSUE B PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 3-Pole Filter for SIRIUS Filter B69813N2327A414 Data Sheet Characteristics min. Center frequency fc αIL Insertion loss Passband typ. max. 2326 - MHz 2.7 3.0 dB B 14 ∆α Amplitude ripple (peak - peak) Standing wave ratio 0.3 Z α at DC to 2175 MHz at 2227 MHz at 2400 MHz at 2426 MHz at 2500 MHz at 2526 to 2700 MHz 0.5 dB 2.0 SWR Impedance Attenuation MHz 40 30 15 20 30 35 50 Ω 43 37 dB dB dB dB dB dB 23 37 Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -40 / +85 °C 1.95 1.99 2.03 2.06 2.1 2.14 2.18 2.21 2.25 2.29 2.33 2.36 2.4 2.44 2.48 2.51 2.55 2.59 2.63 2.66 2.7 Typical passband characteristic 0 attenuation [dB] -10 -20 -30 DB[S11] DB[S21] -40 -50 -60 -70 frequency [GHz] ISSUE DATE 12.03.04 ISSUE B PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 3-Pole Filter for SIRIUS Filter B69813N2327A414 Data Sheet Processing information z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. 2-3 min. Time [sec.] > - 5 °C/s Delivery mode z Blister tape acc. to IEC 286-3, polyester, grey z Pieces/tape: 3000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 12.03.04 ISSUE B PUBLISHER SAW MWC PD PAGE 4/4