ONSEMI MC10E167FNR2G

MC10E167, MC100E167
5VECL 6-Bit 2:1
MUX-Register
Description
The MC10E/100E167 contains six 2:1 multiplexers followed by D
flip-flops with single-ended outputs. Input data are selected by the
Select control, SEL. The selected data are transferred to the flip-flop
outputs by a positive edge on CLK1 or CLK2 (or both). A HIGH on
the Master Reset (MR) pin asynchronously forces all Q outputs LOW.
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Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
The 100 Series contains temperature compensation.
1000 MHz Min. Operating Frequency
800 ps Max. Clock to Output
Single-Ended Outputs
Asynchronous Master Resets
Dual Clocks
PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −4.2 V to −5.7 V
Internal Input 50 kW Pulldown Resistors
ESD Protection: Human Body Model; > 2 kV,
Machine Model; > 200 V
Charged Device Model; > 2 kV
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level:
Pb = 1
Pb−Free = 3
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 323 devices
Pb−Free Packages are Available*
PLCC−28
FN SUFFIX
CASE 776
MARKING DIAGRAM*
1
MCxxxE167FNG
AWLYYWW
xxx
A
WL
YY
WW
G
= 10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 8
1
Publication Order Number:
MC10E167/D
MC10E167, MC100E167
D5a
25
D4b D4a
24
23
D3b
D3a
NC
VCCO
22
21
20
19
D0a
MUX
D0b
SEL
D5b
26
18
Q5
D1a
MUX
CLK1
27
17
Q4
D1b
SEL
CLK2
28
16
VCC
D2a
MUX
SEL
1
15
Q3
D2b
VEE
D3a
MUX
Pinout: 28-Lead PLCC
(Top View)
MR
2
14
Q2
D3b
SEL
SEL
3
13
VCCO
D4a
MUX
D0a
4
12
Q1
D4b
SEL
5
D0b
6
7
8
9
D1a
D1b
D2a
10
D5a
11
D5b
D2b VCCO Q0
SEL
Q
Q0
Q
Q1
Q
Q2
Q
Q3
Q
Q4
Q
Q5
R
D
R
D
R
D
R
D
R
D
R
SEL
* All VCC and VCCO pins are tied together on the die.
CLK1
CLK2
MR
Warning: All VCC, VCCO, and VEE pins must be externally
connected to Power Supply to guarantee proper operation.
Figure 2. Logic Diagram
Figure 1. 28−Lead Pinout Assignment
Table 1. PIN DESCRIPTION
PIN
D0a − D5a
D0b − D5b
SEL
CLK1, CLK2
MR
Q0 − Q5
VCC, VCCO
VEE
NC
MUX
D
FUNCTION
ECL Input Data a
ECL Input Data b
ECL Select Input
ECL Clock Inputs
ECL Master Reset
ECL Data Outputs
Positive Supply
Negative Supply
No Connect
Table 2. FUNCTION TABLE
SEL
Data
H
L
a
b
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2
MC10E167, MC100E167
Table 3. MAXIMUM RATINGS
Symbol
Rating
Unit
VCC
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
0 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
PLCC−28
PLCC−28
63.5
43.5
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
PLCC−28
22 to 26
°C/W
VEE
PECL Operating Range
NECL Operating Range
4.2 to 5.7
−5.7 to −4.2
V
V
Tsol
Wave Solder
265
265
°C
Pb
Pb−Free
Condition 2
VI v VCC
VI w VEE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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MC10E167, MC100E167
Table 4. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V, VEE = 0.0 V (Note 1)
0°C
Symbol
Min
Characteristic
25°C
Typ
Max
94
113
Min
85°C
Typ
Max
94
113
Min
Typ
Max
Unit
94
113
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
3980
4070
4160
4020
4105
4190
4090
4185
4280
mV
VOL
Output LOW Voltage (Note 2)
3050
3210
3370
3050
3210
3370
3050
3227
3405
mV
VIH
Input HIGH Voltage
3830
3995
4160
3870
4030
4190
3940
4110
4280
mV
VIL
Input LOW Voltage
3050
3285
3520
3050
3285
3520
3050
3302
3555
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
0.5
0.3
0.5
0.25
0.3
0.2
150
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V.
2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 5. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 3)
0°C
Symbol
Characteristic
Min
25°C
Typ
Max
94
113
Min
85°C
Typ
Max
94
113
Min
Typ
Max
Unit
94
113
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 4)
−1020
−930
−840
−980
−895
−810
−910
−815
−720
mV
VOL
Output LOW Voltage (Note 4)
−1950
−1790
−1630
−1950
−1790
−1630
−1950
−1773
−1595
mV
VIH
Input HIGH Voltage
−1170
−1005
−840
−1130
−970
−810
−1060
−890
−720
mV
VIL
Input LOW Voltage
−1950
−1715
−1480
−1950
−1715
−1480
−1950
−1698
−1445
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
0.5
0.3
0.5
0.065
0.3
0.2
150
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V.
4. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 6. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 5)
0°C
Symbol
Characteristic
Min
25°C
Typ
Max
94
113
Min
85°C
Typ
Max
94
113
Min
Typ
Max
Unit
108
130
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 6)
3975
4050
4120
3975
4050
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 6)
3190
3295
3380
3190
3255
3380
3190
3260
3380
mV
VIH
Input HIGH Voltage
3835
3975
4120
3835
3975
4120
3835
3975
4120
mV
VIL
Input LOW Voltage
3190
3355
3525
3190
3355
3525
3190
3355
3525
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
0.5
0.3
0.5
0.25
0.5
0.2
150
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
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MC10E167, MC100E167
Table 7. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0 V; VEE = −5.0 V (Note 7)
0°C
Symbol
Min
Characteristic
25°C
Typ
Max
94
113
Min
85°C
Typ
Max
94
113
Min
Typ
Max
Unit
108
130
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 8)
−1025
−950
−880
−1025
−950
−880
−1025
−950
−880
mV
VOL
Output LOW Voltage (Note 8)
−1810
−1705
−1620
−1810
−1745
−1620
−1810
−1740
−1620
mV
VIH
Input HIGH Voltage
−1165
−1025
−880
−1165
−1025
−880
−1165
−1025
−880
mV
VIL
Input LOW Voltage
−1810
−1645
−1475
−1810
−1645
−1475
−1810
−1645
−1475
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
0.5
0.3
0.5
0.25
0.5
0.2
150
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
Characteristic
Min
Typ
fMAX
Maximum Toggle Frequency
1000
1400
tPLH
tPHL
Propagation Delay to Output
650
850
ts
Setup Time
Symbol
th
25°C
Max
Min
Typ
1000
1400
650
850
85°C
Max
Min
Typ
1000
1400
650
850
Max
ps
Clk, MR
1050
1050
1050
ps
D
100
− 50
100
− 50
100
− 50
SEL
275
125
275
125
275
125
D
300
50
300
50
300
50
SEL
75
−125
75
−125
75
−125
750
550
750
550
750
550
ps
Hold Time
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
Unit
MHz
ps
ps
Clk, MR
400
400
400
tSKEW
Within-Device Skew (Note 10)
75
75
75
ps
tJITTER
Random Clock Jitter (RMS)
<1
<1
<1
ps
tr
tf
Rise/Fall Times
(20 - 80%)
ps
300
450
800
300
450
800
300
450
800
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
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5
MC10E167, MC100E167
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping †
MC10E167FN
PLCC−28
37 Units / Rail
MC10E167FNG
PLCC−28
(Pb−Free)
37 Units / Rail
MC10E167FNR2
PLCC−28
500 / Tape & Reel
MC10E167FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
MC100E167FN
PLCC−28
37 Units / Rail
MC100E167FNR2
PLCC−28
500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC10E167, MC100E167
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
−N−
0.007 (0.180)
B
Y BRK
T L−M
M
0.007 (0.180)
U
M
N
S
T L−M
S
S
N
S
D
Z
−M−
−L−
W
28
D
X
V
1
A
0.007 (0.180)
R
0.007 (0.180)
C
M
M
T L−M
T L−M
S
S
N
S
N
S
0.007 (0.180)
H
N
S
S
G
J
0.004 (0.100)
−T− SEATING
T L−M
S
N
T L−M
S
N
S
K
PLANE
F
VIEW S
G1
M
K1
E
S
T L−M
S
VIEW D−D
Z
0.010 (0.250)
0.010 (0.250)
G1
VIEW S
S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10_
0.410
0.430
0.040
−−−
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7
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10_
10.42
10.92
1.02
−−−
0.007 (0.180)
M
T L−M
S
N
S
MC10E167, MC100E167
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC10E167/D