ONSEMI NCP9001SNT1G

NCP9001
1.5 MHz, 600 mA,
High−Efficiency, Low
Quiescent Current,
Adjustable Output Voltage
Step−Down Converter
The NCP9001 step−down PWM DC−DC converter is optimized for
portable applications powered from one cell Li−ion or three cell
Alkaline/NiCd/NiMH batteries. The device is available in an adjustable
output voltage from 0.9 V to 3.3 V. It uses synchronous rectification to
increase efficiency and reduce external part count. The device also has a
built−in 1.5 MHz (nominal) oscillator which reduces component size by
allowing a small inductor and capacitors. Automatic switching
PWM/PFM mode offers improved system efficiency.
Finally, it includes an integrated soft−start, cycle−by−cycle current
limiting, and thermal shutdown protection. The NCP9001 is
available in the space saving, low profile TSOP5 package.
Features
• 95.3% of Efficiency for 3.3 V Output and 4.2 V Input and 80 mA
•
•
•
•
•
•
•
•
•
•
Load−Current
Sources up to 600 mA
1.5 MHz Switching Frequency
Adjustable Output Voltage from 0.9 V to 3.3 V
30 mA Quiescent Current
Synchronous Rectification for Higher Efficiency
2.7 V to 5.5 V Input Voltage Range
Thermal Limit Protection
Shutdown Current Consumption of 0.3 mA
Short Circuit Protection
This is a Pb−Free Device
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MARKING
DIAGRAM
5
TSOP−5
SN SUFFIX
CASE 483
5
1
DBPAYWG
G
1
DBP
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NCP9001SNT1G
Package
Shipping
TSOP−5 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Typical Applications
•
•
•
•
•
•
Cellular Phones, Smart Phones and PDAs
Digital Still/Video Cameras
MP3 Players and Portable Audio Systems
Wireless and DSL Modems
Portable Equipment
USB Powered Devices
VIN
1
VIN
2
GND
3
EN
LX
5
CIN
OFF ON
L
VOUT
COUT
R1
FB
Cff
4
R2
Figure 1. Typical Application
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 2
1
Publication Order Number:
NCP9001/D
NCP9001
100
Eff (%)
90
80
70
Vout = 3.3 V
Vin = 4.2 V
TA = 25°C
60
50
0
100
200
300
Iout (mA)
400
500
600
Figure 2. Efficiency vs. Output Current
Q1
Vbattery
Q2
VIN
1
LX
5
PWM/PFM
CONTROL
2.2 mH
10 mF
4.7 mF
GND
2
Enable
EN
3
R1
ILIMIT
LOGIC
CONTROL
& THERMAL
SHUTDOWN
FB
4
REFERENCE
VOLTAGE
R2
Figure 3. Simplified Block Diagram
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2
18 pF
NCP9001
PIN FUNCTION DESCRIPTION
Pin No.
TSOP5
Pin No.
UDFN6
Symbol
Function
1
3
VIN
Analog Input
2
2, 4
GND
Analog/Power
Ground
Ground connection for the NFET Power Stage and the Analog Sections of
the IC.
3
1
EN
Digital Input
Enable for Switching Regulator. This pin is active high. Do not float this pin.
4
6
FB
Analog Input
Feedback voltage from the output of the power supply. This is the input to
the error amplifier.
5
5
LX
Analog Output
Description
Power Supply Input for Analog VCC.
Connection from Power MOSFETs to the Inductor. For one option, an output
discharge circuit sinks current from this pin.
PIN CONNECTIONS
VIN
1
GND
2
EN
3
5
LX
4
FB
(Top View)
Figure 4. Pin Connections
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Minimum Voltage All Pins
Vmin
−0.3
V
Maximum Voltage All Pins (Note 2)
Vmax
7.0
V
Maximum Voltage Enable, FB, LX
Vmax
VIN + 0.3
V
Thermal Resistance, Junction −to−Air
RqJA
200
_C/W
Operating Ambient Temperature Range
TA
−40 to 85
_C
Storage Temperature Range
Tstg
−55 to 150
_C
Junction Operating Temperature
Tj
−40 to 125
_C
Latch−up Current Maximum Rating (TA = 85°C) (Note 4)
Lu
+/−100
mA
2.0
200
kV
V
ESD Withstand Voltage (Note 3)
Human Body Model
Machine Model
Vesd
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) per JEDEC standard: JESD22−A114.
Machine Model (MM) per JEDEC standard: JESD22−A115.
4. Latchup current maximum rating per JEDEC standard: JESD78.
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3
NCP9001
ELECTRICAL CHARACTERISTICS (Typical values are referenced to TA = +25°C, Min and Max values are referenced −40°C to
+85°C ambient temperature, unless otherwise noted, operating conditions VIN = 3.6 V, VOUT = 1.8 V, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
VIN
2.7
−
5.5
V
VUVLO
2.3
2.5
2.6
V
Iq
−
30
45
mA
Standby Current, EN Low
Istb
−
0.3
1.2
mA
Oscillator Frequency
Fosc
1.3
1.5
1.8
MHz
Peak Inductor Current
ILIM
−
1200
−
mA
Feedback Reference Voltage
Vref
−
0.6
−
V
FB Pin Tolerance Overtemp @ Iout = 100 mA
VFBtol
−3.0
−
3.0
%
Reference Voltage Line Regulation
DVFB
−
0.1
−
%
Output Voltage Accuracy @ Iout = 100 mA (Note 5)
VOUT
−3%
Vnom
+3%
V
Minimum Output Voltage
VOUT
−
0.9
−
V
VOUT
−
3.3
−
V
DVOUT
−
0.1
−
%
−
−
0.0005
0.001
−
−
%/mA
%/mA
VOUT
−
50
−
mV
Input Voltage Range
Undervoltage Lockout (VIN Falling)
Quiescent Current
PFM No Load
Maximum Output Voltage
Output Voltage Line Regulation (Vin = 2.7–5.5)
Io = 100 mA
Voltage Load Regulation
(IO = 100 mA to 300 mA)
(IO = 100 mA to 600 mA)
VLOADREG
Load Transient Response (300 mA to 600 mA Load Step, Trise 10 ms)
Duty Cycle
−
−
−
100
%
P−Ch On−Resistance
RLxH
−
300
−
mW
N−Ch On−Resistance
RLxL
−
300
−
mW
P−Ch Leakage Current
ILeakH
−
0.05
−
mA
N−Ch Leakage Current
ILeakL
−
0.01
−
mA
Enable Pin High
VENH
1.2
−
−
V
Enable Pin Low
VENL
−
−
0.4
V
EN << H >> Input Current, EN = 3.6 V
IENH
−
2.0
−
mA
Soft−Start Time
Tstart
−
350
500
ms
Thermal Shutdown Threshold
TSD
−
160
−
°C
Thermal Shutdown Hysteresis
TSDH
−
25
−
°C
5. The overall output voltage tolerance depends upon the accuracy of the external resistor (R1, R2).
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100
100
90
90
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
NCP9001
80
70
60
50
40
30
20
EN = VIN
10
3.2
3.7
4.2
4.7
5.2
70
60
50
VIN = 5.5 V
40
30
VIN = 2.7 V
20
10
IOUT = 0 mA
0
2.7
80
0
−40
5.7
−20
VIN, INPUT VOLTAGE (V)
100
95
TA = −40°C
EFFICIENCY (%)
SHUTDOWN CURRENT (mA)
80
100
IOUT = 0 mA
0.6
0.4
0.2
TA = 25°C
90
85
80
TA = 85°C
75
0
2.7
3.2
4.2
3.7
70
4.7
0
100
VIN, INPUT VOLTAGE (V)
200
300
400
500
600
IOUT, OUTPUT CURRENT (mA)
Figure 8. Efficiency vs. Output Current
(VOUT = 1.8 V, VIN = 3.6 V)
Figure 7. Shutdown Current vs. Supply Voltage
100
100
TA = −40°C
95
TA = −40°C
TA = 25°C
EFFICIENCY (%)
90
EFFICIENCY (%)
60
40
Figure 6. Quiescent Current vs. Temperature
EN = VIN
0.8
20
TEMPERATURE (°C)
Figure 5. Quiescent Current vs. Supply Voltage
1.0
0
80
70
TA = 85°C
60
90
TA = 25°C
85
TA = 85°C
80
75
70
50
0
100
200
300
400
500
600
0
IOUT, OUTPUT CURRENT (mA)
100
200
300
400
500
IOUT, OUTPUT CURRENT (mA)
Figure 10. Efficiency vs. Output Current
(VOUT = 3.3 V, VIN = 4.5 V)
Figure 9. Efficiency vs. Output Current
(VOUT = 0.9 V, VIN = 3.6 V)
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5
600
NCP9001
1.8
FREQUENCY (MHz)
EN
2 V/Div
VOUT
500 mV/Div
1.7
1.6
IOUT = 600 mA
1.5
IOUT = 300 mA
1.4
100 ms/Div
1.3
2.7
3.2
3.7
4.2
4.7
5.2
5.7
VIN, INPUT VOLTAGE (V)
Figure 11. Soft Start Time (VIN = 3.6 V)
Figure 12. Frequency vs. Input Voltage
1.8
1.6
LOAD REGULATION (%)
FREQUENCY (MHz)
1.7
VIN = 5.5 V
1.5
1.4
VIN = 3.6 V
1.3
IOUT = 300 mA
1.2
−40
−20
0
20
40
60
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
−2.5
−3.0
VOUT = 0.9 V
VOUT = 1.8 V
VOUT = 3.3 V
0
100
TEMPERATURE (°C)
300
400
500
600
700
IOUT, OUTPUT CURRENT (mA)
Figure 14. Load Regulation
Figure 13. Frequency vs. Temperature
100
OUTPUT CURRENT (mA)
2.0
OUTPUT VOLTAGE (V)
200
1.5
1.0
0.5
90
VOUT = 1.8 V
80
TA = 25°C
70
60
50
40
30
20
10
0.0
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2.7
1.4
VIN, ENABLE INPUT VOLTAGE (V)
3.2
3.7
4.2
4.7
5.2
VIN, INPUT VOLTAGE (V)
Figure 15. Output Voltage vs. Enable Input Pin
Voltage
Figure 16. PFM/PWM Threshold vs. Input
Voltage
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6
5.7
NCP9001
2.0
2.0
1.5
IOUT = 100 mA
1.0
OUTPUT VOLTAGE (%)
OUTPUT VOLTAGE (%)
1.5
0.5
IOUT = 300 mA
0.0
−0.5
IOUT = 600 mA
−1.0
−1.5
−2.0
−50
1.0
IOUT = 100 mA
0.5
IOUT = 300 mA
0.0
−0.5
IOUT = 600 mA
−1.0
−1.5
VIN = 3.6 V
0
50
100
−2.0
−50
150
VIN = 3.6 V
0
TEMPERATURE (°C)
50
100
TEMPERATURE (°C)
Figure 18. Output Voltage Accuracy
(VOUT = 1.8 V)
Figure 17. Output Voltage Accuracy
(VOUT = 0.9 V)
2.0
OUTPUT VOLTAGE (%)
1.5
1.0
0.5
0.0
VOUT
IOUT = 300 mA
IOUT = 100 mA
50 mV/Div
IOUT = 600 mA
−0.5
IOUT
−1.0
200 mA/Div
10 ms/Div
−1.5
−2.0
−50
VIN = 4.0 V
0
50
100
150
TEMPERATURE (°C)
Figure 19. Output Voltage Accuracy
(VOUT = 3.3 V)
Figure 20. Load Transient Response in PWM
Operation (VIN = 3.6 V)
VOUT
2.5 ms/Div
50 mV/Div
ILX
500 mA/Div
IOUT
200 mA/Div
VOUT
500 mV/Div
10 ms/Div
Figure 22. Short Circuit Protection (VIN = 3.6 V)
Figure 21. Load Transient Response in PWM
Operation (VIN = 3.6 V)
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150
NCP9001
OPERATION DESCRIPTION
Overview
The NCP9001 uses a constant frequency, current mode
step−down architecture. Both the main (P−Channel
MOSFET) and synchronous (N−Channel MOSFET)
switches are internal.
It delivers a constant voltage from either a single Li−Ion
or three cell NiMH/NiCd battery to portable devices such
as cell phones and PDA. The output voltage is set by the
external resistor divider. The NCP9001 sources at least
600 mA, depending on external components chosen.
The NCP9001 works with two modes of operation;
PWM/PFM depending on the current required. The device
operates in PWM mode at load currents of approximately
40 mA or higher, having voltage tolerance of "3% with
90% efficiency or better. Lighter load currents cause the
device to automatically switch into PFM mode for reduced
current consumption (IQ = 30 mA typ) and extended battery
life.
Additional features include soft−start, undervoltage
protection, current overload protection, and thermal
shutdown protection. As shown in Figure 1, only six
external components are required for implementation. The
part uses an internal reference voltage of 0.6 V. It is
recommended to keep the part in shutdown until the input
voltage is 2.7 V or higher.
125 ns/div
Figure 23. PWM Switching Waveform
(Vin = 3.6 V, Vout = 1.8 V, Iout = 300 mA)
PFM Operating Mode
Under light load conditions (<40 mA), the NCP9001
enters in low current PFM mode operation to reduce power
consumption. The output regulation is implemented by
pulse frequency modulation. If the output voltage drops
below the threshold of PFM comparator (typically
Vnom−2%), a new cycle will be initiated by the PFM
comparator to turn on the switch Q1. Q1 remains ON until
the peak inductor current reaches 200 mA (nom). Then
ILIM comparator goes high to switch off Q1. After a short
dead time delay, switch rectifier Q2 is turned ON. The
negative current detector (NCD) will detect when the
inductor current drops below zero and sends the signal to
turn off Q2. The output voltage continues to decrease
through discharging the output capacitor. When the output
voltage falls below the threshold of the PFM comparator,
a new cycle starts immediately.
PWM Operating Mode
In this mode, the output voltage of the NCP9001 is
regulated by modulating the on−time pulse width of the
main switch Q1 at a fixed frequency of 1.5 MHz. The
switching of the PMOS Q1 is controlled by a flip−flop
driven by the internal oscillator and a comparator that
compares the error signal from an error amplifier with the
sum of the sensed current signal and compensation ramp.
At the beginning of each cycle, the main switch Q1 is
turned ON by the rising edge of the internal oscillator
clock. The inductor current ramps up until the sum of the
current sense signal and compensation ramp becomes
higher than the error voltage amplifier. Once this has
occurred, the PWM comparator resets the flip−flop, Q1 is
turned OFF and the synchronous switch Q2 is turned ON.
Q2 replaces the external Schottky diode to reduce the
conduction loss and improve the efficiency. To avoid
overall power loss, a certain amount of dead time is
introduced to ensure Q1 is completely turned OFF before
Q2 is being turned ON.
2.5 ms/div
Figure 24. PFM Mode Switching Waveform
(Vin = 3.6 V, Vout = 1.8 V, Iout = 30 mA)
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NCP9001
Cycle−by−Cycle Current Limitation
consumption will be 0.3 mA (typical value). Applying a
voltage above 1.2 V to EN pin will enable the device for
normal operation. The typical threshold is around 0.7 V.
The device will go through soft−start to normal operation,
however, the EN pin should be tied low while the input
voltage on VIN pin is rising up.
From the block diagram (Figure 3), an ILIM comparator
is used to realize cycle−by−cycle current limit protection.
The comparator compares the LX pin voltage with the
reference voltage, which is biased by a constant current. If
the inductor current reaches the limit, the ILIM comparator
detects the LX voltage falling below the reference voltage
and releases the signal to turn off the switch Q1. The
cycle−by−cycle current limit is set at 1200 mA (nom).
Thermal Shutdown
Internal Thermal Shutdown circuitry is provided to
protect the integrated circuit in the event that the maximum
junction temperature is exceeded. If the junction
temperature exceeds 160_C, the device shuts down. In this
mode switch Q1 and Q2 and the control circuits are all
turned off. The device restarts in soft−start after the
temperature drops below 135_C. This feature is provided
to prevent catastrophic failures from accidental device
overheating, and it is not intended as a substitute for proper
heatsinking.
Short Circuit Protection
When the output is shorted to ground, the device limits
the inductor current. The duty−cycle is minimum and the
consumption on the input line is 300 mA (Typ). When the
short circuit condition is removed, the device returns to the
normal mode of operation.
Soft−Start
The NCP9001 uses soft−start (300 ms Typ) to limit the
inrush current when the device is initially enabled.
Soft−start is implemented by gradually increasing the
reference voltage until it reaches the full reference voltage.
During startup, a pulsed current source charges the internal
soft−start capacitor to provide gradually increasing
reference voltage. When the voltage across the capacitor
ramps up to the nominal reference voltage, the pulsed
current source will be switched off and the reference
voltage will switch to the regular reference voltage.
Low Dropout Operation
The NCP9001 offers a low input to output voltage
difference. The NCP9001 can operate at 100% duty cycle.
In this mode the PMOS (Q1) switches completely on.
The minimum input voltage to maintain regulation can
be calculated as:
VIN(min) + VOUT(max)
) (IOUT (RDS(on) ) RINDUCTOR))
(eq. 1)
•
•
•
•
Shutdown Mode
When the EN pin has a voltage applied of less than 0.4 V,
the NCP9001 will be disabled. In shutdown mode, the
internal reference, oscillator and most of the control
circuitries are turned off. Therefore, the typical current
VOUT: Output Voltage (Volts)
IOUT: Max Output Current
RDS(on): P−Channel Switch RDS(on)
RINDUCTOR: Inductor Resistance (DCR)
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NCP9001
APPLICATION INFORMATION
Output Voltage Selection
The corner frequency is given by:
The output voltage is programmed through an external
resistor divider connected from VOUT to FB then to GND.
For low power consumption and noise immunity, the
resistor from FB to GND (R2) should be in the
[100 k−600 k] range. If R2 is 200 k given the VFB is 0.6 V,
the current through the divider will be 3.0 mA.
The formula below gives the value of VOUT, given the
desired R1 and the R1 value:
(1 ) R1)
R2
VOUT + VFB
•
•
•
•
fc +
1
COUT
+
1
2p Ǹ2.2 mH
10 mF
+ 34 kHz
(eq. 3)
The device is intended to operate with inductance values
between 1.0 mH and maximum of 4.7 mH.
If the corner frequency is moved, it is recommended to
check the loop stability depending on the output ripple
voltage accepted and output current required. For lower
frequency, the stability will be increased; a larger output
capacitor value could be chosen without critical effect on
the system. On the other hand, a smaller capacitor value
increases the corner frequency and it should be critical for
the system stability. Take care to check the loop stability.
The phase margin is usually higher than 45°.
(eq. 2)
VOUT: Output Voltage (Volts)
VFB: Feedback Voltage = 0.6 V
R1: Feedback Resistor from VOUT to FB
R2: Feedback Resistor from FB to GND
Table 2. L−C Filter Example
Input Capacitor Selection
In PWM operating mode, the input current is pulsating
with large switching noise. Using an input bypass capacitor
can reduce the peak current transients drawn from the
input supply source, thereby reducing switching noise
significantly. The capacitance needed for the input bypass
capacitor depends on the source impedance of the input
supply.
The maximum RMS current occurs at 50% duty cycle
with maximum output current, which is IO, max/2.
For NCP9001, a low profile, low ESR ceramic capacitor
of 4.7 mF should be used for most of the cases. For effective
bypass results, the input capacitor should be placed as close
as possible to the VIN pin.
Inductance (L)
TDK
C2012X5ROJ475KB
mH
22
mF
2.2
mH
10
mF
4.7
mH
4.7
mF
ǒ
V
V
DIL + OUT 1− OUT
L fSW
VIN
Ǔ
(eq. 4)
DIL peak to peak inductor ripple current
L inductor value
fSW switching frequency
GRM21BR71C475KA
JMK212BY475MG
1.0
The inductor parameters directly related to device
performances are saturation current and DC resistance and
inductance value. The inductor ripple current (ÄIL)
decreases with higher inductance:
GRM188R60J475KE
Taiyo Yuden
Output Capacitor (Cout)
Inductor Selection
Table 1. List of Input Capacitor
Murata
2p ǸL
The saturation current of the inductor should be rated
higher than the maximum load current plus half the ripple
current:
C1632X5ROJ475KT
DI
IL(MAX) + IO(MAX) ) L
2
Output L−C Filter Design Considerations
The NCP9001 is built in 1.5 MHz frequency and uses
current mode architecture. The correct selection of the
output filter ensures good stability and fast transient
response.
Due to the nature of the buck converter, the output L−C
filter must be selected to work with internal compensation.
For NCP9001, the internal compensation is internally fixed
and it is optimized for an output filter of L = 2.2 mH and
COUT = 10 mF.
(eq. 5)
DIL(MAX) Maximum inductor current
DIO(MAX) Maximum Output current
The inductor’s resistance will factor into the overall
efficiency of the converter. For best performances, the DC
resistance should be less than 0.3 W for good efficiency.
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NCP9001
Table 3. List of Inductor
Table 4. List of Output Capacitor
FDK
MIPW3226 Series
TDK
Murata
GRM188R60J475KE
4.7 mF
VLF3010AT Series
GRM21BR60J106ME19L
10 mF
Taiyo Yuden
LQ CBL2012
GRM188R60OJ106ME
10 mF
Coil craft
DO1605−T Series
JMK212BY475MG
4.7 mF
JMK212BJ106MG
10 mF
C2012X5ROJ475KB
4.7 mF
C2012X5ROJ226M
22 mF
C2012X5ROJ106K
10 mF
Taiyo Yuden
LPO3010
TDK
Output Capacitor Selection
Selecting the proper output capacitor is based on the
desired output ripple voltage. Ceramic capacitors with low
ESR values will have the lowest output ripple voltage and
are strongly recommended. The output capacitor requires
either an X7R or X5R dielectric.
The output ripple voltage in PWM mode is given by:
DVOUT + DIL
ǒ4
1
fSW−3
COUT
Feed−Forward Capacitor Selection
The feed−forward capacitor sets the feedback loop
response and is critical to obtain good loop stability.
Given that the compensation is internally fixed, a fixed
18 pF or higher ceramic capacitor is needed. Choose a
small ceramic capacitor X7R or X5R or COG dielectric.
Ǔ
) ESR (eq. 6)
In PFM mode (at light load), the output voltage is
regulated by pulse frequency modulation. The output
voltage ripple is independent of the output capacitor value.
It is set by the threshold of PFM comparator.
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11
NCP9001
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE F
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
5
1
4
2
L
3
M
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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