NSC LM25085AMYX

LM25085A
42V Constant On-Time PFET Buck Switching Controller
with 0.9V Reference
General Description
Features
The LM25085A is a functional variant of the LM25085 COT
PFET Buck Switching Controller. The functional differences
of the LM25085A are: The feedback reference voltage is
0.9V, the forced off-time after current limit detection is longer,
and the soft-start time is shorter (1.8 ms).
The LM25085A is a high efficiency PFET switching regulator
controller that can be used to quickly and easily develop a
small, efficient buck regulator for a wide range of applications.
This high voltage controller contains a PFET gate driver and
a high voltage bias regulator which operates over a wide 4.5V
to 42V input range. The constant on-time regulation principle
requires no loop compensation, simplifies circuit implementation, and results in ultra-fast load transient response. The
operating frequency remains nearly constant with line and
load variations due to the inverse relationship between the
input voltage and the on-time. The PFET architecture allows
100% duty cycle operation for a low dropout voltage. Either
the RDS(ON) of the PFET or an external sense resistor can be
used to sense current for over-current detection.
■ Wide 4.5V to 42V input voltage range
■ Adjustable current limit using RDS(ON) or a current sense
■
■
■
■
■
■
■
■
■
■
resistor
Programmable switching frequency to 1MHz
No loop compensation required
Ultra-Fast transient response
Nearly constant operating frequency with line and load
variations
Adjustable output voltage from 0.9V
Precision ±2% feedback reference
Capable of 100% duty cycle operation
Internal soft-start timer
Integrated high voltage bias regulator
Thermal shutdown
Package
■ MSOP-8EP
■ MSOP-8
■ LLP-8 (3 mm x 3 mm)
Typical Application, Basic Step Down Controller
30085201
© 2009 National Semiconductor Corporation
300852
www.national.com
LM25085A 42V Constant On-Time PFET Buck Switching Controller
March 16, 2009
LM25085A
Connection Diagrams
30085202
Top View
8-Lead MSOP-EP
30085204
Top View
8-Lead LLP
30085203
Top View
8-Lead MSOP
Ordering Information
Order Number
Package Type
NSC Package Drawing
LM25085AMYE
MSOP-8EP
MUY08A
250 units on tape and reel
LM25085AMY
MSOP-8EP
MUY08A
1000 units on tape and reel
LM25085AMYX
MSOP-8EP
MUY08A
3500 units on tape and reel
LM25085AMME
MSOP-8
MUA08A
LM25085AMM
MSOP-8
MUA08A
LM25085AMMX
MSOP-8
MUA08A
LM25085ASDE
LLP-8
SDA08A
250 units on tape and reel
LM25085ASD
LLP-8
SDA08A
1000 units on tape and reel
LM25085ASDX
LLP-8
SDA08A
4500 units on tape and reel
www.national.com
Junction Temperature
Range
Supplied As
250 units on tape and reel
-40°C to +125°C
1000 units on tape and reel
3500 units on tape and reel
2
LM25085A
Pin Descriptions
Pin
No.
Name
Description
Application Information
1
ADJ
Current Limit Adjust
The current limit threshold is set by an external resistor from VIN to ADJ in
conjunction with the external sense resistor or the PFET’s RDS(ON).
2
RT
On-time control and shutdown
An external resistor from VIN to RT sets the buck switch on-time and switching
frequency. Grounding this pin shuts down the controller.
3
FB
Voltage Feedback from the
regulated output
Input to the regulation and over-voltage comparators. The regulation level is 0.9V.
4
GND
Circuit Ground
Ground reference for all internal circuitry
5
ISEN
Current sense input for current
limit detection.
Connect to the PFET drain when using RDS(ON) current sense. Connect to the
PFET source and the sense resistor when using a current sense resistor.
6
PGATE Gate Driver Output
Connect to the gate of the external PFET.
7
VCC
Output of the gate driver bias
regulator
Output of the negative voltage regulator (relative to VIN) that biases the PFET
gate driver. A low ESR capacitor is required from VIN to VCC, located as close
as possible to the pins.
8
VIN
Input supply voltage
The operating input range is from 4.5V to 42V. A low ESR bypass capacitor must
be located as close as possible to the VIN and GND pins.
EP
Exposed Pad
Exposed pad on the underside of the package (MSOP-8EP and LLP only). This
pad is to be soldered to the PC board ground plane to aid in heat dissipation.
3
www.national.com
LM25085A
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN to VCC, VIN to PGATE
ESD Rating (Note 2)
Human Body Model
Storage Temperature Range
VIN to GND
ISEN to GND
ADJ to GND
RT, FB to GND
VIN Voltage
Junction Temperature
Absolute Maximum Ratings (Note 1)
-0.3V to 45V
-0.3V to VIN + 0.3V
-0.3V to VIN + 0.3V
-0.3V to 7V
-0.3V to 10V
2kV
-65°C to +150°C
Operating Ratings
(Note 1)
4.5V to 42V
−40°C to + 125°C
Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the
junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Unless otherwise stated the following conditions apply: VIN = 24V, RT = 100 kΩ.
Symbol
Parameter
Conditions
IIN
Operating current
IQ
Shutdown current
Min
Typ
Max
Units
Non-switching, FB = 1.05V (Note 6)
1.25
1.75
mA
RT = 0V (Note 6)
175
300
µA
7.7
8.5
V
VIN Pin
VCC Regulator (Note 3)
VCC(reg)
VIN - VCC
Vin = 9V, FB = 1.05V, ICC = 0 mA
6.9
Vin = 9V, FB = 1.05V, ICC = 20 mA
7.7
V
Vin = 42V, FB = 1.05V, ICC = 0 mA
7.7
V
VCC under-voltage lock-out
threshold
VCC increasing
3.8
V
UVLOVcc hysteresis
VCC decreasing
260
mV
VCC Current Limit
FB = 1.05V
40
mA
VPGATE(HI)
PGATE High voltage
PGATE Pin = Open
VPGATE(LO)
PGATE Low voltage
PGATE Pin = Open
UVLOVcc
VCC(CL)
20
PGATE Pin
VIN -0.1
VIN
VCC
V
VCC+0.1
VPGATE(HI)4.5
PGATE High Voltage at Vin = 4.5V PGATE Pin = Open
VPGATE(LO)4.5
PGATE Low Voltage at Vin = 4.5V PGATE Pin = Open
VCC
Driver Output Source Current
VIN = 12V, PGATE = VIN - 3.5V
1.75
Driver Output Sink Current
VIN = 12V, PGATE = VIN - 3.5V
1.5
A
Driver Output Resistance
Source current = 500 mA
2.3
Ω
Sink current = 500 mA
2.3
Ω
IPGATE
RPGATE
VIN -0.1
VIN
V
V
VCC+0.1
V
A
Current Limit Detection
IADJ
ADJUST pin current source
VADJ = 22.5V
32
40
48
µA
Current limit comparator offset
VADJ = 22.5V, VADJ - VISEN
-9
0
9
mV
RTSD
Shutdown threshold
RT Pin voltage rising
RTHYS
Shutdown threshold hysteresis
VCL OFFSET
RT Pin
0.73
V
50
mV
On-Time
tON – 1
VIN = 4.5V, RT = 100 kΩ
3.5
5
7.15
µs
tON – 2
VIN = 24V, RT = 100 kΩ
560
720
870
ns
tON - 3
VIN = 42V, RT = 100 kΩ
329
415
500
ns
VIN = 24V, 25 mV overdrive at ISEN
55
140
235
ns
tON - 4
www.national.com
On-time
Minimum on-time in current limit
(Note 7)
4
Parameter
Conditions
Min
Typ
Max
Units
Off-time (current limit) (Note 7)
VIN = 12V, VFB = 0V
5.56
8
10.96
µs
tOFF(CL2)
VIN = 12V, VFB = 0.75V
2.59
3.7
5.16
µs
tOFF(CL3)
VIN = 24V, VFB = 0V
9.03
13.2
18.1
µs
tOFF(CL4)
VIN = 24V, VFB = 0.75V
4.29
6
8.54
µs
0.882
0.9
0.918
V
Off-Time
tOFF(CL1)
Regulation and Over-Voltage Comparators (FB Pin)
VREF
FB regulation threshold
VOV
FB over-voltage threshold
IFB
FB bias current
Measured with respect to VREF
350
mV
10
nA
Soft-Start Function
tSS
Soft-start time
1.16
1.8
3.15
ms
Thermal Shutdown
TSD
Junction shutdown temperature
THYS
Junction shutdown hysteresis
Junction temperature rising
170
°C
20
°C
MSOP-8 package
126
°C/W
MSOP-8EP package
46
LLP-8 package
54
Thermal Resistance
θJA
θJC
Junction to ambient, 0 LFPM air
flow (Note 5)
Junction to case, 0 LFPM air flow
(Note 5)
MSOP-8 package
29
MSOP-8EP package
5.5
LLP-8 package
9.1
°C/W
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3: VCC provides self bias for the internal gate drive.
Note 4: For detailed information on soldering plastic MSOP and LLP packages refer to the Packaging Data Book available from National Semiconductor
Corporation.
Note 5: Tested on a 4 layer JEDEC board. Four vias provided under the exposed pad. See JEDEC standards JESD51-5 and JESD51-7.
Note 6: Operating current and shutdown current do not include the current in the RT resistor.
Note 7: The tolerance of the minimum on-time (tON-4) and the current limit off-times (tOFF(CL1) through (tOFF(CL4)) track each other over process and temperature
variations. A device which has an on-time at the high end of the range will have an off-time that is at the high end of its range.
5
www.national.com
LM25085A
Symbol
LM25085A
Typical Performance Characteristics
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 24V.
Efficiency (Circuit of Figure 4)
Input Operating Current vs. VIN
30085205
30085206
Shutdown Current vs. VIN
VCC vs. VIN
30085207
30085208
VCC vs. ICC
On-Time vs. RT and VIN
30085209
www.national.com
30085211
6
LM25085A
Off-Time vs. VIN and VFB
Voltage at the RT Pin
30085213
30085212
ADJ Pin Current vs. VIN
Input Operating Current vs. Temperature
30085218
30085217
Shutdown Current vs. Temperature
VCC vs. Temperature
30085253
30085252
7
www.national.com
LM25085A
On-Time vs. Temperature
Minimum On-Time vs. Temperature
30085254
30085255
Off-Time vs. Temperature
Current Limit Comparator Offset vs. Temperature
30085257
30085256
ADJ Pin Current vs. Temperature
PGATE Driver Output Resistance vs. Temperature
30085214
www.national.com
30085210
8
LM25085A
Feedback Reference Voltage vs. Temperature
Soft-Start Time vs. Temperature
30085215
30085216
RT Pin Shutdown Threshold vs. Temperature
30085258
9
www.national.com
LM25085A
Block Diagram
30085219
Sense resistor method shown for current limit detection.
Minimum output ripple configuration shown.
www.national.com
10
OVERVIEW
The LM25085A is a PFET buck (step-down) DC-DC controller
using the constant on-time (COT) control principle. The input
operating voltage range of the LM25085A is 4.5V to 42V. The
use of a PFET in a buck regulator greatly simplifies the gate
drive requirements and allows for 100% duty cycle operation
to extend the regulation range when operating at low input
voltage. However, PFET transistors typically have higher onresistance and gate charge when compared to similarly rated
NFET transistors. Consideration of available PFETs, input
voltage range, gate drive capability of the LM25085A, and
thermal resistances indicate an upper limit of 10A for the load
current for LM25085A applications. Constant on-time control
is implemented using an on-time one-shot that is triggered by
the feedback signal. During the off-time, when the PFET (Q1)
is off, the load current is supplied by the inductor and the output capacitor. As the output voltage falls, the voltage at the
feedback comparator input (FB) falls below the regulation
threshold. When this occurs Q1 is turned on for the one-shot
period which is determined by the input voltage (VIN) and the
RT resistor. During the on-time the increasing inductor current
increases the voltage at FB above the feedback comparator
threshold. For a buck regulator the basic relationship between
the on-time, off-time, input voltage and output voltage is:
ON-TIME TIMER
The on-time of the PFET gate drive output (PGATE pin) is
determined by the resistor (RT) and the input voltage (VIN),
and is calculated from:
(1)
where Fs is the switching frequency. Equation 1 is valid only
in continuous conduction mode (inductor current does not
reach zero). Since the LM25085A controls the on-time inversely proportional to VIN, the switching frequency remains
relatively constant as VIN is varied. If the input voltage falls to
a level that is equal to or less than the regulated output voltage
Q1 is held on continuously (100% duty cycle) and VOUT is approximately equal to VIN.
The COT control scheme, with the feedback signal applied to
a comparator rather than an error amplifier, requires no loop
compensation, resulting in very fast load transient response.
The LM25085A is available in both an 8 pin MSOP package
and an 8 pin LLP package with an exposed pad to aid in heat
dissipation. An 8 pin MSOP package without an exposed pad
is also available.
(3)
where RT is in kΩ.
The minimum on-time, which occurs at maximum VIN, should
not be set less than 150 ns (see Current Limiting section). The
buck regulator effective on-time, measured at the SW node
(junction of Q1, L1, and D1) is typically longer than that calculated in Equation 3 due to the asymmetric delay of the
PFET. The on-time difference caused by the PFET switching
delay can be estimated as the difference of the turn-off and
turn-on delays listed in the PFET data sheet. Measuring the
difference between the on-time at the PGATE pin versus the
SW node in the actual application circuit is also recommended.
In continuous conduction mode, the inverse relationship of
tON with VIN results in a nearly constant switching frequency
as VIN is varied. The operating frequency can be calculated
from:
REGULATION CONTROL CIRCUIT
The LM25085A buck DC-DC controller employs a control
scheme based on a comparator and a one-shot on-timer, with
the output voltage feedback compared to an internal reference voltage (0.9V). When the FB pin voltage falls below the
feedback reference, Q1 is switched on for a time period determined by the input voltage and a programming resistor
(RT). Following the on-time Q1 remains off until the FB voltage
falls below the reference. Q1 is then switched on for another
on-time period. The output voltage is set by the feedback resistors (RFB1, RFB2 in the Block Diagram). The regulated
output voltage is calculated as follows:
VOUT = 0.9V x (RFB2+ RFB1)/ RFB1
(4)
where RT is in kΩ, and tD is equal to 50 ns plus the PFET’s
delay difference. To set a specific continuous conduction
mode switching frequency (FS), the RT resistor is determined
from the following:
(2)
(5)
The feedback voltage supplied to the FB pin is applied to a
comparator rather than a linear amplifier. For proper operation sufficient ripple amplitude is necessary at the FB pin to
switch the comparator at regular intervals with minimum delay
and noise susceptibility. This ripple is normally obtained from
the output voltage ripple attenuated through the feedback re-
where RT is in kΩ. A simplified version of Equation 5 at VIN =
12V, and tD = 100 ns, is:
11
www.national.com
LM25085A
sistors. The output voltage ripple is a result of the inductor’s
ripple current passing through the output capacitor’s ESR, or
through a resistor in series with the output capacitor. Multiple
methods are available to ensure sufficient ripple is supplied
to the FB pin, and three different configurations are discussed
in the Applications Information section.
When in regulation, the LM25085A operates in continuous
conduction mode at medium to heavy load currents and discontinuous conduction mode at light load currents. In continuous conduction mode the inductor’s current is always
greater than zero, and the operating frequency remains relatively constant with load and line variations. The minimum
load current for continuous conduction mode is one-half the
inductor’s ripple current amplitude. In discontinuous conduction mode, where the inductor’s current reaches zero during
the off-time, the operating frequency is lower than in continuous conduction mode and varies with load current. Conversion efficiency is maintained at light loads since the switching
losses are reduced with the reduction in load and frequency.
If the voltage at the FB pin exceeds 1.25V due to a transient
overshoot or excessive ripple at VOUT the internal over-voltage comparator immediately switches off Q1. The next ontime period starts when the voltage at FB falls below the
feedback reference voltage.
Functional Description
LM25085A
For VIN = 42V and tD = 100 ns, the simplified equation is:
When using equation 6 or 7, the tolerances for the ADJ pin
current sink and the offset of the current limit comparator
should be included to ensure the resulting minimum current
limit is not less than the required maximum switch current.
Simultaneously increasing the values of RADJ and RSEN decreases the effects of the current limit comparator offset, but
at the expense of higher power dissipation. When using a
sense resistor, the RSEN resistor value should be chosen within the practical limitations of power dissipation and physical
size. For example, for a 10A current limit, setting RSEN =
0.005Ω results in a power dissipation as high as 0.5W. Current sense connections to the RSEN resistor, or to Q1, must
be Kelvin connections to ensure accuracy.
The CADJ capacitor filters noise from the ADJ pin, and helps
prevent unintended switching of the current limit comparator
due to input voltage transients. The recommended value for
CADJ is 1000 pF.
SHUTDOWN
The LM25085A can be shutdown by grounding the RT pin
(see Figure 1). In this mode the PFET is held off, and the VCC
regulator is disabled. The internal operating current is reduced to the value shown in the graph “Shutdown current vs.
VIN”. The shutdown threshold at the RT pin is ≊0.73V, with
≊50 mV of hysteresis. Releasing the pin enables normal operation. The RT pin must not be forced high during normal
operation.
CURRENT LIMIT OFF-TIME
When the current through Q1 exceeds the current limit threshold, the LM25085A forces an off-time longer than the normal
off-time defined by Equation 1. See the graph “Off-Time vs.
VIN and VFB”, or calculate the current limit off-time from the
following equation:
(8)
30085224
where VIN is the input voltage, and VFB is the voltage at the
FB pin at the time current limit was detected. This feature is
necessary to allow the inductor current to decrease sufficiently to offset the current increase which occurred during the ontime. During the on-time, the inductor current increases an
amount equal to:
FIGURE 1. Shutdown Implementation
CURRENT LIMITING
The LM25085A current limiting operates by sensing the voltage across either the RDS(ON) of Q1, or a sense resistor, during
the on-time and comparing it to the voltage across the resistor
RADJ (see Figure 2). The current limit function is much more
accurate and stable over temperature when a sense resistor
is used. The RDS(ON) of a MOSFET has a wide process variation and a large temperature coefficient.
If the voltage across RDS(ON) of Q1, or the sense resistor, is
greater than the voltage across RADJ, the current limit comparator switches to turn off Q1. Current sensing is disabled
for a blanking time of ≊100 ns at the beginning of the on-time
to prevent false triggering of the current limit comparator due
to leading edge current spikes. Because of the blanking time
and the turn-on and turn-off delays created by the PFET, the
on-time at the PGATE pin should not be set less than 150 ns.
An on-time shorter than that may prevent the current limit detection circuit from properly detecting an over-current condition. The duration of the subsequent forced off-time is a
function of the input voltage and the voltage at the FB pin, as
shown in the graph “Off-time vs. VIN and VFB”. The longerthan-normal forced off-time allows the inductor current to
decrease to a low level before the next on-time. This cycleby-cycle monitoring, followed by a forced off-time, provides
effective protection from output load faults over a wide range
of operating conditions.
The voltage across the RADJ resistor is set by an internal 40
µA current sink at the ADJ pin. When using Q1’s RDS(ON) for
sensing, the current at which the current limit comparator
switches is calculated from:
ICL = 40 µA x RADJ/RDS(ON)
(9)
During the off-time the inductor current decreases due to the
reverse voltage applied across the inductor by the output voltage, the freewheeling diode’s forward voltage (VFD), and the
voltage drop due to the inductor’s series resistance (VESR).
The current decrease is equal to:
(10)
The on-time in Equation 9 is shorter than the normal on-time
since the PFET is shut off when the current limit threshold is
crossed. If the off-time is not long enough, such that the current decrease (Equation 10) is less than the current increase
(Equation 9), the current levels are higher at the start of the
next on-time. This results in a further decrease in on-time,
since the current limit threshold is crossed sooner. A balance
is reached when the current changes in Equations 9 and 10
are equal. The worst case situation is that of a direct short
circuit at the output terminals, where VOUT = 0 volts, as that
results in the largest current increase during the on-time, and
the smallest decrease during the off-time. The sum of the
diode’s forward voltage and the inductor’s ESR voltage must
be sufficient to ensure current runaway does not occur. Using
Equations 9 and 10, this requirement can be stated as:
(6)
When using a sense resistor (RSEN) the thrshold of the current
limit comparator is calculated from:
ICL = 40 µA x RADJ/RSEN
www.national.com
(11)
(7)
12
specifications to determine worst case situations, the tolerance of the minimum on-time (tON-4) and the current limit offtimes (tOFF(CL1) through tOFF(CL4)) track each other over the
process and temperature variations. A device which has an
on-time at the high end of the range will have an off-time that
is at the high end of its range.
30085225
FIGURE 2. Current Limit Sensing
designing a PFET buck regulator the drain terminal is connected to the switching node. This situation requires a tradeoff between thermal and EMI performance since increasing
the PC board area of the switching node to aid the PFET
power dissipation also increases radiated noise, possibly disrupting the circuit operation. Typically the switching node area
is kept to a reasonable minimum and the PFET peak current
is derated to stay within the recommended temperature rating
of the PFET. The RDS(ON) of the PFET determines a portion
of the power dissipation in the PFET. However, PFETs with
very low RDS(ON) usually have large values of gate charge. A
PFET with a higher gate charge has a corresponding slower
switching speed, leading to higher switching losses and affecting the PFET power dissipation.
If the PFET RDS(ON) is used for current limit detection, note
that it typically has a positive temperature coefficient. At 100°
C the RDS(ON) may be as much as 50% higher than the value
at 25°C which could result in incorrect current limiting if not
accounted for when determining the value of the RADJ resistor.
The PFET Total Gate Charge determines most of the power
dissipation in the LM25085A due to the repetitive charge and
discharge of the PFET’s gate capacitance by the gate driver
(powered from the VCC regulator). The LM25085A’s internal
power dissipation can be calculated from the following:
VCC REGULATOR
The VCC regulator provides a regulated voltage between the
VIN and the VCC pins to provide the bias and gate current for
the PFET gate driver. The 0.47 µF capacitor at the VCC pin
must be a low ESR capacitor, preferably ceramic as it provides the high surge current for the PFET’s gate at each turnon. The capacitor must be located as close as possible to the
VIN and VCC pins to minimize inductance in the PC board
traces.
Referring to the graph “VCC vs. VIN”, the voltage across the
VCC regulator (VIN – VCC) is equal to VIN until VIN reaches
approximately 8.5V. At higher values of VIN, the voltage at
the VCC pin is regulated at approximately 7.7V below VIN.
The VCC regulator has a maximum current capability of at
least 20 mA. The regulator is disabled when the LM25085A
is shutdown using the RT pin, or when the thermal shutdown
is activated.
PGATE DRIVER OUTPUT
The PGATE pin output swings between VIN (Q1 off) and the
VCC pin voltage (Q1 on). The rise and fall times depend on
the PFET gate capacitance and the source and sink currents
provided by the internal gate driver. See the Electrical Charateristics for the current capability of the driver.
PDISS = VIN x ((QG x FS) + IIN)
P-CHANNEL MOSFET SELECTION
The PFET must be rated for the maximum input voltage, with
some margin above that to allow for transients and ringing
which can occur on the supply line and the switching node.
The gate-to-source voltage (VGS) normally provided to the
PFET is 7.7 volts for VIN greater than 8.5V. However, if the
circuit is to be operated at lower values of VIN, the selected
PFET must be able to fully turn-on with a VGS voltage equal
to VIN. The minimum input operating voltage for the
LM25085A is 4.5V.
Similar to NFETs, the case or exposed thermal pad for a
PFET is electrically connected to the drain terminal. When
(12)
where QG is the PFET's Total Gate Charge obtained from its
datasheet, FS is the switching frequency, and IIN is the
LM25085A's operating current obtained from the graph "Input
Operating Current vs. VIN". Using the Thermal Resistance
specifications in the Electrical Characteristics table, the approximate junction temperature can be determined. If the
calculated junction temperature is near the maximum operating temperature of 125°C, either the switching frequency
must be reduced, or a PFET with a smaller Total Gate Charge
must be used.
13
www.national.com
LM25085A
For tON in Equation 11 use the minimum on-time at the SW
node. To determine this time period add the “Minimum ontime in current limit” specified in the Electrical Characteristics
(tON-4) to the difference of the turn-off and turn-on delays of
the PFET. For tOFF use the value in the graph “Off-Time vs.
VIN and VFB”, or use Equation 8, where VFB is equal to zero
volts. When using the minimum or maximum limits of those
LM25085A
SOFT-START
The internal soft-start feature of the LM25085A allows the
regulator to gradually reach a steady state operating point at
power up, thereby reducing startup stresses and current
surges. Upon turn-on, when Vcc reaches its under-voltage
lockout threshold, the internal soft-start circuit ramps the feedback reference voltage from 0V to 0.9V, causing VOUT to ramp
up in a proportional manner. The soft-start ramp time is typically 1.8 ms.
In addition to controlling the initial power up cycle, the softstart circuit also activates when the LM25085A is enabled by
releasing the RT pin, and when the circuit is shutdown and
restarted by the internal Thermal Shutdown circuit.
If the voltage at FB is below the regulation threshold value
due to an over-current condition or a short circuit at Vout, the
internal reference voltage provided by the soft-start circuit to
the regulation comparator is reduced along with FB. When the
over-current or short circuit condition is removed, VOUT returns to the regulated value at a rate determined by the softstart ramp. This feature helps prevent the output voltage from
over-shooting following an overload event.
A standard value 21 kΩ resistor is selected. Using equation
3 the minimum on-time at the PGATE pin, which occurs at
maximum input voltage (24V), is calculated to be 195 ns. This
minimum one-shot period is sufficiently longer than the minimum recommended value of 150 ns. The minimum on-time
at the SW node is longer due to the delay added by the PFET
(57 ns). Therefore the minimum SW node on-time is 252 ns
at 24V. At the SW node the maximum on-time is calculated
to be 1.21 µs at 4.5V.
L1: The main parameter controlled by the inductor value is
the current ripple amplitude (IOR). See Figure 3. The minimum
load current for continuous conduction mode is used to determine the maximum allowable ripple such that the inductor
current’s lower peak does not fall below 0 mA. Continuous
conduction mode operation at minimum load current is not a
requirement of the LM25085A, but serves as a guideline for
selecting L1. For this example, the maximum ripple current is:
IOR(max) = 2 x IOUT(min) = 1.0 Amp
(13)
If an application’s minimum load current is zero, a good initial
estimate for the maximum ripple current (IOR(max)) is 20% of
the maximum load current. The ripple calculated in equation
13 is then used in the following equation to calculate L1:
THERMAL SHUTDOWN
The LM25085A should be operated such that the junction
temperature does not exceed 125°C. If the junction temperature increases above that, an internal Thermal Shutdown
circuit activates at 170°C (typical) to disable the VCC regulator and the gate driver, and discharge the soft-start capacitor.
This feature helps prevent catastrophic failures from accidental device overheating. When the junction temperature falls
below 150°C (typical hysteresis = 20°C), the gate driver is
enabled, the soft-start circuit is released, and normal operation resumes.
(14)
A standard value 6.8 µH inductor is selected. Using this inductance value, the maximum ripple current amplitude, which
occurs at maximum input voltage, calculates to 0.85 Ap-p.
The peak current (IPK) at maximum load current is 5.43A.
However, the current rating of the selected inductor must be
based on the maximum current limit value calculated below.
Applications Information
EXTERNAL COMPONENTS
The procedure for calculating the external components is illustrated with the following design example. Referring to the
Block Diagram, the circuit is to be configured for the following
specifications:
VOUT = 1.0V
VIN = 4.5V to 24V, 12V Nominal
Maximum load current (IOUT(max)) = 5A
Minimum load current (IOUT(min)) = 500 mA (for continuous
conduction mode)
Switching Frequency (FSW) = 200 kHz
Maximum allowable output ripple (VOS) = 10 mVp-p
Selected PFET: Vishay Si7465
RFB1 and RFB2: These resistors set the output voltage. The
ratio of these resistors is calculated from:
30085232
FIGURE 3. Inductor Current Waveform
RSEN, RADJ: To achieve good current limit accuracy and avoid
over designing the power stage components, the sense resistor method is used for current limiting in this example. A
standard value 10 mΩ resistor is selected for RSEN, resulting
in a 50 mV drop at maximum load current, and a maximum
0.25W power dissipation in the resistor. Since the LM25085A
uses peak current detection, the minimum value for the current limit threshold must be equal to the maximum load current (5A) plus half the maximum ripple amplitude calculated
above:
RFB2/RFB1 = (VOUT/0.9V) - 1
For this example, RFB2 / RFB1 = 0.111. Typically, RFB1 and
RFB2 should be chosen from standard value resistors in the
range of 1 kΩ to 20 kΩ which satisfy the above ratio. For this
example, RFB2 = 1.1 kΩ, and RFB1 = 10 kΩ.
RT, PFET: Before selecting the RT resistor, the PFET must be
selected as its turn-on and turn-off delays affect the calculated
value of RT. For the Vishay Si7465 PFET, the difference of its
typical turn-off and turn-on delays is 57 ns. Using equation 5
at nominal input voltage, RT calculates to be:
ICL(min) = 5A + 0.85A/2 = 5.43A
At this current level the voltage across RSEN is 54.3 mV.
Adding the current limit comparator offset of 9 mV (max) increases the required current limit threshold to 6.33A. Using
www.national.com
14
where VSW is the absolute value of the voltage at the SW node
during the off-time, typically 0.5V to 1V depending on the
diode D1. Using a typical value of 0.65V, VA calculates to
0.49V. VA is the nominal DC voltage at the R3/C1 junction,
and is used in the next equation:
A standard value 2.05 kΩ resistor is selected. The nominal
current limit threshold calculates to:
where tON is the maximum on-time (at minimum input voltage), and ΔV is the desired ripple amplitude at the R3/C1
junction, typically 30 mVp-p. For this example
Using the tolerances for the ADJ pin current and the current
limit comparator offset, the maximum current limit threshold
calculates to:
R3 and C1 are then selected from standard value components to produce the product calculated above. Typical values
for C1 are 3000 pF to 10,000 pF, and R3 is typically from 10
kΩ to 300 kΩ. C2 is then chosen large compared to C1, typically 0.1 µF. For this example, 3300 pF is chosen for C1,
requiring R3 to be 48.9 kΩ. A standard value 48.7 kΩ resistor
is selected.
CIN, CBYP: These capacitors limit the voltage ripple at VIN by
supplying most of the switch current during the on-time. At
maximum load current, when Q1 is switched on, the current
through Q1 suddenly increases to the lower peak of the
inductor’s ripple current, then ramps up to the upper peak,
and then drops to zero at turn-off. The average current during
the on-time is the load current. For a worst case calculation,
these capacitors must supply this average load current during
the maximum on-time, while limiting the voltage drop at VIN.
For this example, 0.25V is selected as the maximum allowable droop at VIN. Their minimum value is calculated from:
The minimum current limit thresholds calculate to:
The load current in each case is equal to the current limit
threshold minus half the current ripple amplitude. The recommended value of 1000 pF for CADJ is used in this example.
COUT: Since the maximum allowed output ripple voltage is
very low in this example (10 mVp-p), the minimum ripple configuration (R3, C1, and C2 in the Block Diagram) must be
used. The resulting ripple at VOUT is then due to the inductor’s
ripple current passing through COUT. This capacitor’s value
can be selected based on the maximum allowable ripple voltage at VOUT, or based on transient response requirements.
The following calculation, based on ripple voltage, provides a
first order result for the value of COUT:
A 33 µF electrolytic capacitor is selected for CIN, and a 1 µF
ceramic capacitor is selected for CBYP. Due to the ESR of
CIN, the ripple at VIN will likely be higher than the calculation
indicates, and therefore it may be desirable to increase CIN to
47 µF or 68 µF. CBYP must be located as close as possible to
the VIN and GND pins of the LM25085A. The voltage rating
for both capacitors must be at least 24V. The RMS ripple current rating for the input capacitors must also be considered.
A good approximation for the required ripple current rating is
IRMS > IOUT/2.
D1: A Schottky diode is recommended. Ultra-fast recovery
diodes are not recommended as the high speed transitions at
the SW pin may affect the regulator’s operation due to the
diode’s reverse recovery transients. The diode must be rated
for the maximum input voltage, and the worst case current
limit level. The average power dissipation in the diode is calculated from:
where IOR(max) is the maximum ripple current calculated
above, and VRIPPLE is the allowable ripple at VOUT.
A 68 µF capacitor is selected. Typically the ripple amplitude
will be higher than the calculations indicate due to the
capacitor’s ESR.
R3, C1, C2: The minimum ripple configuration uses these
three components to generate the ripple voltage required at
the FB pin since there is insufficient ripple at VOUT. A minimum
of 25 mVp-p must be applied to the FB pin to obtain stable
constant frequency operation. R3 and C1 are selected to
generate a sawtooth waveform at their junction, and that
waveform is AC coupled to the FB pin via C2. The values of
the three components are determined using the following procedure:
where VF is the diode’s forward voltage drop, and D is the ontime duty cycle. Using Equation 1, the minimum duty cycle
occurs at maximum input voltage, and is calculated to be
≊4.2% in this example. The diode power dissipation calculates to be:
Calculate VA = VOUT - (VSW x (1 – (VOUT/VIN(min))))
PD1 = 0.65V x 5A x (1- 0.042) = 3.11W
PD1 = VF x IOUT x (1-D)
15
www.national.com
LM25085A
equation 7 with the minimum value for the ADJ pin current (32
µA), the required RADJ resistor calculates to:
LM25085A
CVCC: The capacitor at the VCC pin (from VIN to VCC) provides not only noise filtering and stability for the VCC regulator, but also provides the surge current for the PFET gate
drive. The typical recommended value for CVCC is 0.47 µF. A
good quality, low ESR, ceramic capacitor is recommended.
CVCC must be located as close as possible to the VIN and
VCC pins. If the selected PFET has a Total Gate Charge
specification of 100 nC or larger, or if the circuit is required to
operate at input voltages below 7 volts, a larger capacitor may
be required. The maximum recommended value for CVCC is
1 µF.
IC Power Dissipation: The maximum power dissipated in the
LM25085A package is calculated using Equation 12 at the
maximum input voltage. The Total Gate Charge for the
Si7465 PFET is specified to be 40 nC (max) in its data sheet.
Therefore the total power dissipation within the LM25085A is
calculated to be:
PDISS = 24V x ((40 nC x 200 kHz) + 1.25 mA) = 222 mW
Using an MSOP-8EP package with a θJA of 46°C/W produces
a temperature rise of 10°C from junction to ambient.
Final Design Example Circuit
The final circuit is shown in Figure 4, and its performance is
presented in Figure 5 through Figure 8. The measured efficiencies shown in Figure 5 are typical for a buck converter
producing a low output voltage (1V).
30085242
FIGURE 4. Example Circuit
www.national.com
16
LM25085A
30085205
FIGURE 5. Efficiency vs. Load Current and VIN (Circuit of Figure 4)
30085244
FIGURE 6. Frequency vs. VIN (Circuit of Figure 4)
17
www.national.com
LM25085A
30085245
FIGURE 7. Current Limit vs. VIN (Circuit of Figure 4)
30085246
FIGURE 8. LM25085A Power Dissipation (Circuit of Figure 4)
www.national.com
18
The minimum ripple configuration, using C1, C2 and R3, used
in the example circuit Figure 4, results in a low ripple amplitude at VOUT determined mainly by the characteristics of the
output capacitor and the ripple current in L1. This configuration allows multiple ceramic capacitors to be used for VOUT if
the output voltage is provided to several places on the PC
board. However, if a slightly higher level of ripple at VOUT is
acceptable in the application, and distributed capacitance is
not used, the ripple required for the FB comparator pin can
be generated with fewer external components using the circuits shown below.
a) Reduced ripple configuration: In Figure 9, R3, C1 and
C2 are removed (compared to Figure 4). A low value resistor
(R4) is added in series with COUT, and a capacitor (Cff) is
added across RFB2. Ripple is generated at VOUT by the
inductor’s ripple current flowing through R4, and that ripple
where IOR(min) is the minimum ripple current, which occurs at
minimum input voltage. The minimum value for Cff is determined from:
where tON(max) is the maximum on-time, which occurs at minimum VIN. The next larger standard value capacitor should
be used for Cff.
30085249
FIGURE 9. Reduced Ripple Configuration
b) Lowest cost configuration: This configuration, shown in
Figure 10, is the same as Figure 9 except Cff is removed.
Since the ripple voltage at VOUT is attenuated by RFB2 and
RFB1, the minimum ripple required at VOUT is equal to:
The minimum value for R4 is calculated from:
VRIP(min) = 25 mV x (RFB2 + RFB1)/RFB1
where IOR(min) is the minimum ripple current, which occurs at
minimum input voltage.
30085251
FIGURE 10. Lowest Cost Ripple Generating Configuration
19
www.national.com
LM25085A
voltage is passed to the FB pin via Cff. The ripple at VOUT can
be set as low as 25 mVp-p since it is not attenuated by RFB2
and RFB1. The minimum value for R4 is calculated from:
Alternate Output Ripple
Configurations
LM25085A
loop is that formed by CIN, Q1, L1, COUT, and back to CIN. The
second loop is that formed by D1, L1, COUT, and back to D1.
The connection from the anode of D1 to the ground end of
CIN must be short and direct. CIN must be as close as possible
to the VIN and GND pins, and CVCC must be as close as possible to the VIN and VCC pins.
If the anticipated internal power dissipation of the LM25085A
will produce excessive junction temperatures during normal
operation, a package option with an exposed pad must be
used (MSOP-8EP or LLP-8). Effective use of the PC board
ground plane can help dissipate heat. Additionally, the use of
wide PC board traces, where possible, helps conduct heat
away from the IC. Judicious positioning of the PC board within
the end product, along with the use of any available air flow
(forced or natural convection) also helps reduce the junction
temperature.
PC Board Layout
In most applications, the heat sink pad or tab of Q1 is connected to the switch node, i.e. the junction of Q1, L1 and D1.
While it is common to extend the PC board pad from under
these devices to aid in heat dissipation, the pad size should
be limited to minimize EMI radiation from this switching node.
If the PC board layout allows, a similarly sized copper pad can
be placed on the underside of the PC board, and connected
with as many vias as possible to aid in heat dissipation.
The voltage regulation, over-voltage, and current limit comparators are very fast and can respond to short duration noise
pulses. Layout considerations are therefore critical for optimum performance. The layout must be as neat and compact
as possible with all the components as close as possible to
their associated pins. Two major current loops conduct currents which switch very fast, requiring the loops to be as small
as possible to minimize conducted and radiated EMI. The first
www.national.com
20
LM25085A
Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead MSOP-EP Package
NS Package Number MUY08A
8-Lead MSOP Package
NS Package Number MUA08A
21
www.national.com
LM25085A
8-Lead LLP Package
NS Package Number SDA08A
www.national.com
22
LM25085A
Notes
23
www.national.com
LM25085A 42V Constant On-Time PFET Buck Switching Controller
Notes
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
Products
Design Support
Amplifiers
www.national.com/amplifiers
WEBENCH® Tools
www.national.com/webench
Audio
www.national.com/audio
App Notes
www.national.com/appnotes
Clock and Timing
www.national.com/timing
Reference Designs
www.national.com/refdesigns
Data Converters
www.national.com/adc
Samples
www.national.com/samples
Interface
www.national.com/interface
Eval Boards
www.national.com/evalboards
LVDS
www.national.com/lvds
Packaging
www.national.com/packaging
Power Management
www.national.com/power
Green Compliance
www.national.com/quality/green
Switching Regulators
www.national.com/switchers
Distributors
www.national.com/contacts
LDOs
www.national.com/ldo
Quality and Reliability
www.national.com/quality
LED Lighting
www.national.com/led
Feedback/Support
www.national.com/feedback
Voltage Reference
www.national.com/vref
Design Made Easy
www.national.com/easy
PowerWise® Solutions
www.national.com/powerwise
Solutions
www.national.com/solutions
Serial Digital Interface (SDI)
www.national.com/sdi
Mil/Aero
www.national.com/milaero
Temperature Sensors
www.national.com/tempsensors
SolarMagic™
www.national.com/solarmagic
Wireless (PLL/VCO)
www.national.com/wireless
Analog University®
www.national.com/AU
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2009 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: [email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor Europe
Technical Support Center
Email: [email protected]
National Semiconductor Asia
Pacific Technical Support Center
Email: [email protected]
National Semiconductor Japan
Technical Support Center
Email: [email protected]